TWI759081B - Machinable ceramic composite and method for preparing the same - Google Patents

Machinable ceramic composite and method for preparing the same Download PDF

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TWI759081B
TWI759081B TW110102118A TW110102118A TWI759081B TW I759081 B TWI759081 B TW I759081B TW 110102118 A TW110102118 A TW 110102118A TW 110102118 A TW110102118 A TW 110102118A TW I759081 B TWI759081 B TW I759081B
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sialon
ceramic composite
machinable ceramic
zirconia
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TW202130603A (en
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梁岐德
金英鐵
林智元
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南韓商和仁科技股份有限公司
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Abstract

A machinable ceramic composite and a method for manufacturing the same are disclosed, and specifically, the machinable ceramic composite may consist of sialon (SiAlON), boron nitride (BN), zirconia (ZrO2 ), and yttria (Y2 O3 ), wherein 2 wt% to 20 wt% of the sialon, 25 wt% to 48 wt% of the boron nitride, 45 wt% to 55 wt% of the zirconia, and 2 wt% to 10 wt% of yttria are contained.

Description

可機械加工的陶瓷複合物及其製備方法Machinable ceramic composites and methods of making the same

本發明係關於一種可機械加工的陶瓷複合物及其製造方法,更具體來說,係關於一種含有具有與矽相似之熱膨脹係數並且具有改善的機械性質及微可加工性之賽隆之陶瓷複合物及其製造方法。The present invention relates to a machinable ceramic composite and a method of making the same, and more particularly, to a ceramic composite containing sialon having a coefficient of thermal expansion similar to silicon and having improved mechanical properties and micromachinability and its manufacturing method.

通常,陶瓷表現出良好的機械性質及絕緣性質以及良好的高溫性質。由於此等特性,陶瓷作為用作半導體製造設備之裝置之組件之材料而受到關注,然而大多數陶瓷難以加工。Generally, ceramics exhibit good mechanical and insulating properties as well as good high temperature properties. Because of these properties, ceramics have attracted attention as materials used as components of devices in semiconductor manufacturing equipment, but most ceramics are difficult to process.

藉由將可裂解的陶瓷組件(諸如雲母或氮化硼)分散在陶瓷或玻璃基質中,可改善脆性無機材料之可機械加工性。此類型之陶瓷通常被稱為可機械加工的陶瓷。The machinability of brittle inorganic materials can be improved by dispersing cleavable ceramic components, such as mica or boron nitride, in a ceramic or glass matrix. Ceramics of this type are often referred to as machinable ceramics.

可機械加工的陶瓷只有在具有足夠的絕緣性質、良好的機械性質及超精密機械加工性質之情況下才能用作半導體檢測裝置之部件。Machinable ceramics can only be used as components of semiconductor inspection devices if they have sufficient insulating properties, good mechanical properties, and ultra-precision machining properties.

使用探針卡檢測半導體裝置之電性質。可機械加工的陶瓷可用作探針卡之導件,探針卡為固定精細探針之主要組件。應根據溫度最佳化熱收縮及膨脹。特別地,在高溫條件下,不應產生可機械加工的陶瓷與作為半導體裝置之基板之矽之間之熱膨脹係數之差,以使半導體裝置之電極焊墊及檢測探針彼此精確對準,此可使檢測過程順利進行。Use probe cards to test electrical properties of semiconductor devices. The machinable ceramic can be used as a guide for the probe card, which is the main component that holds the fine probes. Thermal shrinkage and expansion should be optimized according to temperature. In particular, under high temperature conditions, there should not be a difference in thermal expansion coefficient between the machinable ceramic and the silicon that is the substrate of the semiconductor device, so that the electrode pads and the detection probes of the semiconductor device are precisely aligned with each other, which The detection process can be carried out smoothly.

另一方面,現有的雲母系列具有高熱膨脹係數及低強度,因此其使用受到限制。並且,氮化硼複合物陶瓷難以燒結,此使得難以製造均勻的燒結體。On the other hand, the existing mica series have high thermal expansion coefficient and low strength, so their use is limited. Also, boron nitride composite ceramics are difficult to sinter, which makes it difficult to manufacture a uniform sintered body.

另外,已知相關技術之氮化硼及氮化矽之陶瓷複合物具有優異的機械性質及微加工性,然而不能確保直徑為35 μm或小於35 μm之超細孔之機械加工性。In addition, the known related art ceramic composites of boron nitride and silicon nitride have excellent mechanical properties and micromachinability, but cannot ensure the machinability of ultrafine pores having a diameter of 35 μm or less.

於此,幾乎沒有具有與矽相似之熱膨脹係數並且具有高精確度微加工所需之高強度及優異的可機械加工性之材料,並且不可能用已知相關技術之可機械加工的陶瓷機械加工直徑為35 μm或小於35 μm之超細孔。Here, there are few materials that have a thermal expansion coefficient similar to that of silicon and have the high strength and excellent machinability required for high-precision micromachining, and it is impossible to machine with machinable ceramics known in the related art Ultrafine pores with a diameter of 35 μm or less.

本發明旨在克服該等問題及其他缺點。本發明之一個態樣為提供一種具有改善的韌性之高強度可機械加工的陶瓷複合物及其製造方法。The present invention aims to overcome these problems and other disadvantages. One aspect of the present invention provides a high strength machinable ceramic composite with improved toughness and a method of making the same.

本發明之另一個態樣為提供一種含有具有與矽相似之熱膨脹係數並且具有改善的機械性質及微可加工性之賽隆之陶瓷複合物及其製造方法。Another aspect of the present invention is to provide a ceramic composite containing sialon having a thermal expansion coefficient similar to silicon and having improved mechanical properties and micromachinability, and a method of making the same.

然而,此等技術問題僅為例示性的,本發明之範圍並不限於此。However, these technical problems are only exemplary, and the scope of the present invention is not limited thereto.

為了實現此等及其他優點,並且根據本說明書之目的,如在本文中具體體現及廣泛描述,提供一種可機械加工的陶瓷複合物,其由賽隆(SiAlON)、氮化硼(BN)、氧化鋯(ZrO2 )及氧化釔(Y2 O3 )組成,其中以可機械加工的陶瓷計,該賽隆之量可為2 wt%至20 wt%,該氮化硼之量可為25 wt%至48 wt%,該氧化鋯之量可為45 wt%至55 wt%,及該氧化釔之量可為2 wt%至10 wt%。To achieve these and other advantages, and in accordance with the purposes of this specification, as embodied and broadly described herein, there is provided a machinable ceramic composite composed of sialon (SiAlON), boron nitride (BN), Composed of zirconium oxide (ZrO 2 ) and yttrium oxide (Y 2 O 3 ), wherein based on the machinable ceramics, the amount of sialon can be 2 wt % to 20 wt %, and the amount of boron nitride can be 25 wt % % to 48 wt%, the amount of the zirconia may be 45 to 55 wt%, and the amount of the yttrium oxide may be 2 to 10 wt%.

根據本發明之一個具體實例,該賽隆可由以下化學式(1)表示,並且該賽隆可由氮化矽(Si3 N4 )、氧化鋁(Al2 O3 )及氮化鋁(AlN)組成, [化學式1] Si6-z Alz Oz N8-z (0<z≤4.2)。According to an embodiment of the present invention, the Sialon can be represented by the following chemical formula (1), and the Sialon can be composed of silicon nitride (Si 3 N 4 ), aluminum oxide (Al 2 O 3 ), and aluminum nitride (AlN) , [Chemical formula 1] Si 6-z Al z O z N 8-z (0<z≤4.2).

根據本發明之一個具體實例,該賽隆之平均粒徑可為1 μm。According to an embodiment of the present invention, the average particle size of the sialon may be 1 μm.

根據本發明之一個具體實例,可機械加工的陶瓷複合物可具有在-40℃至400℃之溫度範圍內2.0×10-6 /℃至5.6×10-6 /℃之熱膨脹係數,以及200 MPa至360 MPa之彎曲強度。According to one embodiment of the present invention, the machinable ceramic composite may have a thermal expansion coefficient of 2.0×10 −6 /°C to 5.6×10 −6 /°C in the temperature range of -40°C to 400°C, and 200 MPa Flexural strength up to 360 MPa.

為了實現此等及其他優點,並且根據本說明書之目的,如在本文中具體體現及廣泛描述,提供一種製造可機械加工的陶瓷複合物之方法,該方法可包括製備賽隆粉末,藉由混合賽隆粉末、氮化硼(BN)、氧化鋯(ZrO2 )及氧化釔(Y2 O3 )來形成第一混合粉末,製備含有第一混合粉末之漿料,將製備之漿料造粒為顆粒狀粉末,使顆粒狀粉末去黏合(debinding),以及藉由熱壓經去黏合之顆粒狀粉末來進行第一燒結。To achieve these and other advantages, and in accordance with the purposes of this specification, as embodied and broadly described herein, there is provided a method of making a machinable ceramic composite, which method may include preparing a sialon powder, by mixing Sialon powder, boron nitride (BN), zirconia (ZrO 2 ) and yttrium oxide (Y 2 O 3 ) are used to form the first mixed powder, a slurry containing the first mixed powder is prepared, and the prepared slurry is granulated For granular powder, debinding the granular powder, and performing the first sintering by hot pressing the debonded granular powder.

根據本發明之一個具體實例,製備賽隆粉末可包括藉由混合氮化矽、氧化鋁及氮化鋁來形成第二混合粉末,藉由模製第二混合粉末來形成模製體,對模製體進行第二燒結,以及研磨經燒結之模製體。According to an embodiment of the present invention, preparing the sialon powder may include forming a second mixed powder by mixing silicon nitride, aluminum oxide and aluminum nitride, forming a molded body by molding the second mixed powder, and aligning the mold The body undergoes a second sintering, and the sintered molded body is ground.

根據本發明之一個具體實例,第二混合粉末可含有56.20 wt%至96.61 wt%之氮化矽,2.42 wt%至31.24 wt%之氧化鋁,及0.97 wt%至12.56 wt%之氮化鋁。According to an embodiment of the present invention, the second mixed powder may contain 56.20 wt % to 96.61 wt % of silicon nitride, 2.42 wt % to 31.24 wt % of alumina, and 0.97 wt % to 12.56 wt % of aluminum nitride.

根據本發明之一個具體實例,第一混合粉末可含有2 wt%至20 wt%之賽隆粉末,25 wt%至48 wt%之氮化硼,45 wt%至55 wt%之氧化鋯,及2 wt%至10 wt%之氧化釔。According to an embodiment of the present invention, the first mixed powder may contain 2 wt % to 20 wt % of sialon powder, 25 wt % to 48 wt % of boron nitride, 45 wt % to 55 wt % of zirconia, and 2 wt% to 10 wt% of yttrium oxide.

根據如上所述之本發明之一個具體實例,存在提供具有改善的韌性之高強度可機械加工的陶瓷複合物及其製造方法之效果。According to one embodiment of the present invention as described above, there is the effect of providing a high strength machinable ceramic composite with improved toughness and a method of making the same.

此外,存在提供含有具有與矽相似之熱膨脹係數並且具有改善的機械性質及微可加工性之賽隆之陶瓷複合物及其製造方法之效果。In addition, there is an effect of providing a ceramic composite containing sialon having a thermal expansion coefficient similar to silicon and having improved mechanical properties and micromachinability, and a method of making the same.

亦存在提供一種可機械加工的陶瓷複合物,其能夠藉由使用碳化物工具機械加工直徑為33 μm、深度為300 μm且位置公差在±5 μm內之超細孔之效果。There is also the effect of providing a machinable ceramic composite capable of machining ultrafine pores with a diameter of 33 μm, a depth of 300 μm and a positional tolerance within ±5 μm by using carbide tools.

然而,此等技術問題僅為例示性的,本發明之範圍並不限於此。However, these technical problems are only exemplary, and the scope of the present invention is not limited thereto.

在下文中,將參考本發明之具體實例及附圖來詳細描述本發明。此等具體實例僅為例示性,以更詳細地描述本發明,並且對於所屬領域之技術人員顯而易見的是本發明之範圍不受此等具體實例之限制。Hereinafter, the present invention will be described in detail with reference to specific examples of the present invention and the accompanying drawings. These specific examples are merely illustrative to describe the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these specific examples.

此外,除非另外定義,否則本說明書中所用之所有技術及科學術語具有與本發明所屬領域之技術人員通常理解之相同的含義,如有衝突,以本說明書揭示之定義為準。Also, unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and in case of conflict, the definitions disclosed in this specification shall prevail.

為了清楚描述圖式中所提出之本發明,省略與描述無關之部件,並且在整個說明書中相似的元件符號歸屬於相似的部件。此外,當部件「包括」某一組件時,意指除非另外指明,否則可進一步包括其他組件而非排除其他組件。此外,說明書中所描述之術語「單元」意指接收特定功能之一個單元或區塊。In order to clearly describe the invention presented in the drawings, parts that are irrelevant to the description are omitted, and like reference numerals are assigned to like parts throughout the specification. Furthermore, when a component "comprises" a certain component, it means that other components may be further included, rather than excluded, unless otherwise specified. Furthermore, the term "unit" described in the specification means a unit or block that receives a specific function.

在各步驟中,為了便於說明,使用標識碼(第一、第二等)。除非上下文中另有明確定義特定順序,否則可與指定順序不同的順序實施各步驟。In each step, an identification code (first, second, etc.) is used for convenience of explanation. Unless the context clearly defines a specific order otherwise, the steps may be performed in a different order than specified.

即,可以與指定順序相同的順序執行,可實質上同時執行,或者可以相反順序執行各步驟。That is, the steps may be performed in the same order as specified, may be performed substantially concurrently, or the steps may be performed in the reverse order.

在下文中,為了使所屬領域之技術人員能夠容易地實施本發明,將參考附圖詳細描述本發明之較佳具體實例。Hereinafter, in order to enable those skilled in the art to easily implement the present invention, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

根據本發明之一個具體實例,一種可機械加工的陶瓷複合物可由賽隆(SiAlON)、氮化硼(BN)、氧化鋯(ZrO2 )及氧化釔(Y2 O3 )組成,較佳2至20wt%之賽隆,25至48 wt%之氮化硼,45至55 wt%之氧化鋯及2至10 wt%之氧化釔。According to an embodiment of the present invention, a machinable ceramic composite may be composed of sialon (SiAlON), boron nitride (BN), zirconia (ZrO 2 ) and yttrium oxide (Y 2 O 3 ), preferably 2 To 20 wt% sialon, 25 to 48 wt% boron nitride, 45 to 55 wt% zirconia and 2 to 10 wt% yttria.

此外,賽隆由以下化學式1表示,並且可由氮化矽、氧化鋁及氮化鋁組成。即,賽隆可含有56.20至96.61 wt%之氮化矽,2.42至31.24 wt%之氧化鋁及0.97至12.56 wt%之氮化鋁。 [化學式1] Si6-z Alz Oz N8-z (0<z≤4.2)In addition, Sialon is represented by the following Chemical Formula 1, and may be composed of silicon nitride, aluminum oxide, and aluminum nitride. That is, Sialon may contain 56.20 to 96.61 wt % of silicon nitride, 2.42 to 31.24 wt % of aluminum oxide, and 0.97 to 12.56 wt % of aluminum nitride. [Chemical formula 1] Si 6-z Al z O z N 8-z (0<z≤4.2)

具體地,式1之Z值可更佳在0.2至2.6範圍內。Specifically, the Z value of Formula 1 may more preferably be in the range of 0.2 to 2.6.

此外,可機械加工的陶瓷複合物可具有在-40℃至400℃之溫度範圍內2.0×10-6 /℃至5.6×10-6 /℃之熱膨脹係數以及200 MPa至360 MPa之彎曲強度。In addition, the machinable ceramic composite may have a thermal expansion coefficient of 2.0×10 −6 /°C to 5.6×10 −6 /°C and a flexural strength of 200 MPa to 360 MPa in a temperature range of -40°C to 400°C.

在下文中,將詳細描述可機械加工的陶瓷複合物以及用於製造可機械加工的陶瓷複合物之方法。Hereinafter, the machinable ceramic composite and the method for making the machinable ceramic composite will be described in detail.

圖1為說明根據本發明之一個具體實例之用於製造可機械加工的陶瓷複合物之方法(S100)之流程圖。FIG. 1 is a flow chart illustrating a method ( S100 ) for manufacturing a machinable ceramic composite according to an embodiment of the present invention.

參照圖1,用於製造可機械加工的陶瓷複合物之方法(S100)可包括:賽隆粉末製備步驟(S110),第一混合粉末形成步驟(S120),漿料製備步驟(S130),造粒步驟(S140),去黏合步驟(S150)及第一燒結步驟(S160)。1 , the method ( S100 ) for manufacturing a machinable ceramic composite may include: a sialon powder preparation step ( S110 ), a first mixed powder forming step ( S120 ), a slurry preparation step ( S130 ), a The granulation step ( S140 ), the debonding step ( S150 ) and the first sintering step ( S160 ).

賽隆粉末製備步驟(S110)之特徵在於,以粉末形式製備作為可機械加工的陶瓷複合物之主要材料之賽隆,並且由氮化矽、氧化鋁及氮化鋁組成。將參照圖2詳細描述詳細的製造方法。圖2為說明根據本發明之一個具體實例之用於製造賽隆粉末之方法之流程圖。The Sialon powder preparation step ( S110 ) is characterized in that Sialon, which is the main material of the machinable ceramic composite, is prepared in powder form, and is composed of silicon nitride, aluminum oxide, and aluminum nitride. A detailed manufacturing method will be described in detail with reference to FIG. 2 . FIG. 2 is a flow chart illustrating a method for manufacturing sialon powder according to an embodiment of the present invention.

參照圖2,賽隆粉末製備步驟(S110)可包括第二混合粉末形成步驟(S112),模製體形成步驟(S113),第二燒結步驟(S114)及研磨步驟(S115)。2 , the Sialon powder preparation step ( S110 ) may include a second mixed powder forming step ( S112 ), a molded body forming step ( S113 ), a second sintering step ( S114 ), and a grinding step ( S115 ).

首先,第二混合粉末形成步驟(S112)可為混合氮化矽、氧化鋁及氮化鋁之步驟。於此,第二混合粉末可含有56.20至96.61 wt%之氮化矽,2.42至31.24 wt%之氧化鋁及0.97至12.56 wt%之氮化鋁。First, the second mixed powder forming step ( S112 ) may be a step of mixing silicon nitride, aluminum oxide, and aluminum nitride. Here, the second mixed powder may contain 56.20 to 96.61 wt % of silicon nitride, 2.42 to 31.24 wt % of alumina, and 0.97 to 12.56 wt % of aluminum nitride.

此時,氮化矽、氧化鋁及氮化鋁可呈粉末形式。氮化矽粉末、氧化鋁粉末及氮化鋁之平均粒徑分別較佳為0.8 μm、0.5 μm及1 μm。At this time, silicon nitride, aluminum oxide, and aluminum nitride may be in powder form. The average particle sizes of the silicon nitride powder, the aluminum oxide powder and the aluminum nitride are preferably 0.8 μm, 0.5 μm and 1 μm, respectively.

之後,可較佳根據上述組成稱重氮化矽、氧化鋁及氮化鋁,使用高速混合器以乾混合之方式將其混合2小時或以上,然後對生成物進行篩分。Afterwards, silicon nitride, aluminum oxide and aluminum nitride may preferably be weighed according to the above composition, mixed in dry mixing for 2 hours or more using a high-speed mixer, and then the resultant is sieved.

模製體形成步驟(S113)可為模製第二混合粉末之步驟。詳細地,第二混合粉末可較佳地藉由使用模具以200 kgf/cm2 之壓力壓製來模製。The molded body forming step ( S113 ) may be a step of molding the second mixed powder. In detail, the second mixed powder can be preferably molded by pressing at a pressure of 200 kgf/cm 2 using a mold.

例如,為了形成模製體,可在石墨模具中填充粉末並且壓製。此時,可將石墨模具組態為燒結碳化物模具,並且可將在第二混合粉末形成步驟中所製備之第二混合粉末填充到燒結碳化物模具中,然後以單軸壓製之方式壓製。然而,本發明可不限於壓製方法。For example, to form a molded body, a graphite mold can be filled with powder and pressed. At this time, the graphite mold may be configured as a cemented carbide mold, and the second mixed powder prepared in the second mixed powder forming step may be filled into the cemented carbide mold, and then pressed in a uniaxial pressing manner. However, the present invention may not be limited to the pressing method.

第二燒結步驟(S114)可為燒結模製體之步驟。具體地,可在氮氣或氬氛圍中在1700℃至1900℃範圍內之燒結溫度下燒結模製體30分鐘至2小時之燒結時間。The second sintering step ( S114 ) may be a step of sintering the molded body. Specifically, the molded body may be sintered in a nitrogen or argon atmosphere at a sintering temperature in the range of 1700° C. to 1900° C. for a sintering time of 30 minutes to 2 hours.

研磨步驟(S115)可為研磨經燒結之模製體之步驟,即,將完全製備之賽隆模製體研磨成賽隆粉末之步驟。The grinding step ( S115 ) may be a step of grinding the sintered molded body, that is, a step of grinding the completely prepared Sialon molded body into a Sialon powder.

此時,可較佳研磨經燒結之模製體使得平均粒徑在1 μm內。本發明不限於研磨方法。此外,藉由上述製備方法所製備之賽隆粉末可較佳由下式(1)表示。 [化學式1] Si6-z Alz Oz N8-z (0<z≤4.2)At this time, the sintered molded body can preferably be ground so that the average particle size is within 1 μm. The present invention is not limited to the grinding method. In addition, the sialon powder prepared by the above-mentioned preparation method can preferably be represented by the following formula (1). [Chemical formula 1] Si 6-z Al z O z N 8-z (0<z≤4.2)

具體地,式1之Z值可更佳在0.2至2.6範圍內。Specifically, the Z value of Formula 1 may more preferably be in the range of 0.2 to 2.6.

第一混合粉末形成步驟(S120)可經組態為形成含有藉由賽隆粉末製造步驟(S110)所製備之賽隆粉末之第一混合粉末。The first mixed powder forming step ( S120 ) may be configured to form a first mixed powder containing the Sialon powder prepared by the Sialon powder manufacturing step ( S110 ).

具體地,第一混合粉末可含有賽隆粉末、氮化硼、氧化鋯及氧化釔。Specifically, the first mixed powder may contain sialon powder, boron nitride, zirconium oxide, and yttrium oxide.

賽隆粉末之量可為2 wt%至20 wt%,並且賽隆粉末之平均粒徑可較佳為1.0 μm。此時,可在可機械加工的陶瓷複合物中包括賽隆粉末以增加強度及韌性。當賽隆粉末之含量小於2 wt%時,強度可能低。此可能會致使孔壁在機械加工細孔期間破裂。此外,當賽隆粉末之含量超過20 wt%時,可能無法進行細孔機械加工。The amount of the sialon powder may be 2 wt % to 20 wt %, and the average particle size of the sialon powder may preferably be 1.0 μm. At this point, Sialon powder can be included in the machinable ceramic composite to increase strength and toughness. When the content of the sialon powder is less than 2 wt %, the strength may be low. This can cause the hole walls to crack during machining of the pores. In addition, when the content of the sialon powder exceeds 20 wt %, the fine hole machining may not be performed.

另外,與氮化矽相比,賽隆粉末具有高斷裂韌性,並且與相關技術之含有氮化矽之可機械加工的陶瓷複合物相比,賽隆粉末可改善細孔之可機械加工性。即,可藉由調整賽隆粉末之組成來調節可機械加工的陶瓷複合物之熱膨脹係數及楊氏模量,因此,可使可機械加工的陶瓷複合物之性能最大化。In addition, Sialon powder has high fracture toughness compared to silicon nitride, and Sialon powder can improve the machinability of fine pores compared to related art machinable ceramic composites containing silicon nitride. That is, the thermal expansion coefficient and Young's modulus of the machinable ceramic composite can be adjusted by adjusting the composition of the Sialon powder, and thus, the performance of the machinable ceramic composite can be maximized.

氮化硼之量可為25 wt%至48 wt%,並且氮化硼之平均粒徑可較佳為1.0 μm。此時,可在可機械加工的陶瓷複合物中含有氮化硼以調節熱膨脹係數。當氮化硼之含量小於25 wt%時,複合物之熱膨脹係數可能會高於目標值,並且當氮化硼之含量超過48 wt%時,複合物之熱膨脹係數可能會低於目標值。The amount of boron nitride may be 25 wt % to 48 wt %, and the average particle size of boron nitride may preferably be 1.0 μm. At this time, boron nitride may be included in the machinable ceramic composite to adjust the thermal expansion coefficient. When the content of boron nitride is less than 25 wt%, the thermal expansion coefficient of the composite may be higher than the target value, and when the content of boron nitride exceeds 48 wt%, the thermal expansion coefficient of the composite may be lower than the target value.

氧化鋯之量可為45 wt%至55 wt%,並且氧化鋯之平均粒徑可較佳為0.3 μm。此時,可在可機械加工的陶瓷複合物中含有氧化鋯以調節精密機械加工性及熱膨脹係數。當氧化鋯之含量小於45 wt%時,複合物之熱膨脹係數可能會低於目標,並且當氧化鋯之含量超過55 wt%時,無法進行精密機械加工。The amount of zirconia may be 45 wt % to 55 wt %, and the average particle size of the zirconia may preferably be 0.3 μm. At this time, zirconia may be contained in the machinable ceramic composite to adjust precision machinability and thermal expansion coefficient. When the content of zirconia is less than 45 wt%, the thermal expansion coefficient of the composite may be lower than the target, and when the content of zirconia exceeds 55 wt%, precision machining cannot be performed.

氧化釔之量可為2 wt%至10 wt%,並且氧化釔之平均粒徑可較佳為1.0 μm。此時,可在可機械加工的陶瓷複合物中含有氧化釔,使得複合物作為燒結助劑被緻密化。當氧化釔之含量小於2 wt%時,複合物之緻密化可能不足,並且當氧化釔之含量超過10 wt%時,由於過量的殘留液體而無法進行精密機械加工。The amount of yttrium oxide may be 2 wt % to 10 wt %, and the average particle size of yttrium oxide may preferably be 1.0 μm. At this point, yttrium oxide may be included in the machinable ceramic composite so that the composite is densified as a sintering aid. When the content of yttrium oxide is less than 2 wt %, the densification of the composite may be insufficient, and when the content of yttrium oxide exceeds 10 wt %, precision machining cannot be performed due to excess residual liquid.

漿料製備步驟(S130)可為製備含有第一混合粉末之漿料之步驟,詳細來說,為另外將溶劑及黏合劑與第二混合粉末混合之步驟。較佳可藉由將粉末、溶劑及黏合劑與氧化鋁球一起放入球磨機中,然後濕混合24小時來製備漿料。The slurry preparation step ( S130 ) may be a step of preparing a slurry containing the first mixed powder, in detail, a step of additionally mixing a solvent and a binder with the second mixed powder. Preferably, the slurry can be prepared by placing the powder, solvent and binder together with alumina balls in a ball mill, followed by wet mixing for 24 hours.

此時,溶劑可較佳含有選自乙醇、甲醇、異丙醇、蒸餾水及丙酮中之至少一者。此外,可較佳使用聚乙烯丁醛(PVB)基黏合劑來作為黏合劑。In this case, the solvent may preferably contain at least one selected from the group consisting of ethanol, methanol, isopropanol, distilled water, and acetone. In addition, polyvinyl butyraldehyde (PVB)-based adhesive may be preferably used as the adhesive.

造粒步驟(S140)可為將漿料造粒以製備顆粒狀粉末之步驟。詳細來說,可藉由噴霧乾燥漿料來製備球形顆粒狀粉末。此時,較佳將由噴霧乾燥所製備之顆粒狀粉末進行篩分,並且篩分可較佳以100目進行。The granulation step ( S140 ) may be a step of granulating the slurry to prepare granular powder. In detail, spherical granular powder can be prepared by spray drying the slurry. At this time, the granular powder prepared by spray drying is preferably sieved, and sieving may preferably be performed with 100 meshes.

去黏合步驟(S150)可為使顆粒狀粉末去黏合之步驟。詳細來說,在製備顆粒狀粉末期間所添加之黏合劑可透過去黏合製程除去。在此種情況下,去黏合溫度可較佳在600℃至700℃範圍內,並且去黏合時間可較佳為2小時至3小時。此外,去黏合步驟可在氮氣或氬氛圍中之去黏合爐中或在真空氛圍中之去黏合爐中進行。The debinding step ( S150 ) may be a step of debinding the granular powder. In detail, the binder added during the preparation of the granular powder can be removed through a debinding process. In this case, the debonding temperature may preferably be in the range of 600°C to 700°C, and the debonding time may preferably be 2 hours to 3 hours. Additionally, the debonding step can be performed in a debonding furnace in a nitrogen or argon atmosphere or in a debonding furnace in a vacuum atmosphere.

第一燒結步驟(S160)可為藉由熱壓燒結經去黏合之顆粒狀粉末之步驟。具體地,較佳地,可在石墨模具中填充經去黏合之顆粒狀粉末並且藉由在25 MPa之壓力下壓製來燒結。在燒結期間,燒結溫度可較佳在1700℃至1900℃範圍內,並且燒結時間可較佳為30分鐘至2小時。The first sintering step ( S160 ) may be a step of sintering the debonded granular powder by hot pressing. Specifically, preferably, the debonded granular powder may be filled in a graphite mold and sintered by pressing under a pressure of 25 MPa. During sintering, the sintering temperature may preferably be in the range of 1700°C to 1900°C, and the sintering time may preferably be 30 minutes to 2 hours.

在下文中,將透過實施例及實驗實施例來詳細描述本發明。然而,以下實施例及實驗實施例僅為例示性,本發明不受以下實施例及實驗實施例之限制。Hereinafter, the present invention will be described in detail through examples and experimental examples. However, the following examples and experimental examples are only illustrative, and the present invention is not limited by the following examples and experimental examples.

實施例及比較實施例Examples and Comparative Examples

<製備實施例1>賽隆粉末之製備<Preparation Example 1> Preparation of Sialon powder

為了製備賽隆粉末,藉由乾混合市售氮化矽粉末(含有1.0 wt%之氧及0.2 wt%以下之雜質金屬元素,平均粒徑為0.8 μm)來製造原料粉末,使用高速混合機透過乾混合來混合氧化鋁(純度為99%,平均粒徑為0.5 μm)及氮化鋁(純度為99%,平均粒徑為1.0 μm)2小時,篩分所得混合物。To prepare sialon powder, raw material powder was prepared by dry mixing commercially available silicon nitride powder (containing 1.0 wt% oxygen and 0.2 wt% or less impurity metal elements, with an average particle size of 0.8 μm), which was passed through a high-speed mixer. Alumina (99% purity, 0.5 μm average particle size) and aluminum nitride (99% purity, 1.0 μm average particle size) were mixed by dry mixing for 2 hours, and the resulting mixture was sieved.

之後,將經混合之賽隆原料粉末放入模具中並且在200 kgf/cm2 之壓力下壓製,然後在氮氣氛圍中在1800℃之溫度下合成2小時。使用行星式軋機將經合成之原料研磨成直徑為1 μm之粉末。After that, the mixed Sialon raw material powder was put into a mold and pressed under a pressure of 200 kgf/cm 2 , and then synthesized at a temperature of 1800° C. for 2 hours in a nitrogen atmosphere. The synthesized raw material was ground into a powder having a diameter of 1 μm using a planetary mill.

<製備實施例2至4><Preparation Examples 2 to 4>

除了在氮化矽粉末、氧化鋁粉末及氮化鋁粉末之組成上不同之外,與製備實施例1同樣方式製備賽隆粉末。Sialon powder was prepared in the same manner as in Preparation Example 1, except that the compositions of the silicon nitride powder, the alumina powder, and the aluminum nitride powder were different.

詳細組成如下表1所示。The detailed composition is shown in Table 1 below.

[表1] Z值 氮化矽(wt%) 氮化鋁(wt%) 氣化鋁(wt%) 製備實施例1 0.2 96.61 0.97 2.42 製備實施例2 1.0 83.07 4.85 12.08 製備實施例3 1.8 69.60 8.72 21.68 製備實施例4 2.6 56.20 12.56 31.24 [Table 1] Z value Silicon Nitride (wt%) Aluminum Nitride (wt%) Aluminium oxide (wt%) Preparation Example 1 0.2 96.61 0.97 2.42 Preparation Example 2 1.0 83.07 4.85 12.08 Preparation Example 3 1.8 69.60 8.72 21.68 Preparation Example 4 2.6 56.20 12.56 31.24

<實施例1>可機械加工的陶瓷複合物之製造<Example 1> Production of a machinable ceramic composite

將透過製備實施例1所製備之20 wt%之賽隆粉末與25 wt%之市售氮化硼粉末(h-BN,純度為99%,平均粒徑為1.0 μm)、50 wt%之氧化鋯粉末(平均粒徑為0.3μm)及5 wt%之氧化釔粉末(純度為99.9%,平均粒徑為1.0 μm)混合。此後,為了使混合粉末成漿,添加1 wt%之聚乙烯丁醛(PVB)黏合劑及乙醇,並且透過濕球磨製程混合。The 20 wt % sialon powder prepared in Preparation Example 1 and 25 wt % of commercially available boron nitride powder (h-BN, 99% pure, average particle size of 1.0 μm), 50 wt % oxidized Zirconium powder (average particle size: 0.3 μm) and 5 wt% yttrium oxide powder (purity: 99.9%, average particle size: 1.0 μm) were mixed. Thereafter, in order to make the mixed powder into a slurry, 1 wt% polyvinyl butyraldehyde (PVB) binder and ethanol were added, and mixed through a wet ball milling process.

此時,在球磨製程中,藉由使用聚乙烯罐使組成不均勻性問題最小化。此外,藉由使用氧化鋁球來進行球磨製程24小時。此後,進行球化操作以將經混合之原料乾燥成顆粒狀粉末。藉由使用噴霧乾燥機來進行造粒步驟,使用100目的篩子篩分經造粒之球狀粉末。At this time, in the ball milling process, the problem of compositional non-uniformity is minimized by using a polyethylene tank. In addition, the ball milling process was performed for 24 hours by using alumina balls. Thereafter, a spheroidization operation is performed to dry the mixed raw materials into granular powder. The granulation step was performed by using a spray dryer, and the granulated spherical powder was sieved using a 100-mesh sieve.

之後,在氮氣氛圍下在700℃下進行去黏合3小時,以除去所製備之粉末中所含之有機黏合劑。After that, debinding was performed at 700° C. for 3 hours under a nitrogen atmosphere to remove the organic binder contained in the prepared powder.

去黏合之後,藉由熱壓燒結來進行燒成。將去黏合後之顆粒狀粉末填充到石墨模具中,在氮氣氛圍中在25MPa之壓力下在一個方向上壓製,並且在1800℃下保持2小時,從而獲得160 mm×160 mm×10 mm之陶瓷燒結體。After debonding, firing is performed by hot pressing sintering. The debonded granular powder was filled into a graphite mold, pressed in one direction under a pressure of 25MPa in a nitrogen atmosphere, and kept at 1800°C for 2 hours, thereby obtaining a ceramic of 160 mm × 160 mm × 10 mm Sintered body.

<實施例2至24><Examples 2 to 24>

除了在賽隆粉末、氮化硼粉末、氧化鋯粉末及氧化釔粉末之組成上不同之外,以與實施例1相同之方式製備可機械加工的陶瓷複合物。A machinable ceramic composite was prepared in the same manner as in Example 1, except that the compositions of Sialon powder, boron nitride powder, zirconia powder, and yttrium oxide powder were different.

下表2顯示實施例1至24各者中之賽隆粉末之詳細組成及Z值。Table 2 below shows the detailed composition and Z value of the Sialon powder in each of Examples 1 to 24.

<比較實施例1><Comparative Example 1>

將實施例1中之25 wt%之市售氮化硼粉末、50 wt%之氧化鋯粉末及5 wt%之氧化釔與20 wt%之市售氮化矽粉末混合以製造可機械加工的陶瓷複合物。除了不包含賽隆粉末並且此等材料之組成比例不同之外,透過與實施例1相同之方法製備及評估可機械加工的陶瓷複合物。25 wt % of commercially available boron nitride powder, 50 wt % of zirconia powder, and 5 wt % of yttrium oxide from Example 1 were mixed with 20 wt % of commercially available silicon nitride powder to make machinable ceramics Complex. A machinable ceramic composite was prepared and evaluated by the same method as Example 1 except that no sialon powder was included and the composition ratios of these materials were different.

<比較實施例2><Comparative Example 2>

將實施例1中之30 wt%之市售氮化硼粉末、55 wt%之氧化鋯粉末及5 wt%之氧化釔與10 wt%之市售氮化矽粉末混合以製造可機械加工的陶瓷複合物。除了不包含賽隆粉末並且此等材料之組成比例不同之外,透過與實施例1相同之方法製備及評估可機械加工的陶瓷複合物。30 wt% of commercially available boron nitride powder, 55 wt% of zirconia powder, and 5 wt% of yttrium oxide from Example 1 were mixed with 10 wt% of commercially available silicon nitride powder to make a machinable ceramic Complex. A machinable ceramic composite was prepared and evaluated by the same method as Example 1 except that no sialon powder was included and the composition ratios of these materials were different.

<比較實施例3><Comparative Example 3>

將實施例1中之36 wt%之市售氮化硼粉末,54 wt%之氧化鋯粉末及5 wt%之氧化釔與5 wt%之市售氮化矽粉末混合以製造可機械加工的陶瓷複合物。除了不包含賽隆粉末並且此等材料之組成比例不同之外,透過與實施例1相同之方法製備及評估可機械加工的陶瓷複合物。36 wt% of commercially available boron nitride powder, 54 wt% of zirconia powder and 5 wt% of yttrium oxide from Example 1 were mixed with 5 wt% of commercially available silicon nitride powder to make machinable ceramics Complex. A machinable ceramic composite was prepared and evaluated by the same method as Example 1 except that no sialon powder was included and the composition ratios of these materials were different.

<比較實施例4><Comparative Example 4>

藉由將作為主要原料之透過製備實施例1所製備之20 wt%之賽隆粉末(平均粒徑為1 μm,Z值為0.2)、實施例1中之20 wt%之市售氮化硼粉末、55 wt%之氧化鋯及5 wt%之氧化釔混合以與實施例1相同之條件及製程製備及評估可機械加工的陶瓷複合物。詳細組成如下表2所示。By combining the 20 wt% sialon powder (average particle size of 1 μm, Z value 0.2) prepared in Example 1 through preparation as the main raw material, and 20 wt% of commercially available boron nitride in Example 1 The powder, 55 wt% zirconia, and 5 wt% yttria were mixed to prepare and evaluate a machinable ceramic composite using the same conditions and procedures as in Example 1. The detailed composition is shown in Table 2 below.

<比較實施例5><Comparative Example 5>

藉由將作為主要原料之透過製備實施例1所製備之5 wt%之賽隆粉末(平均粒徑為1 μm,Z值為0.2)及實施例1中之20 wt%之市售氮化硼粉末、70 wt%之氧化鋯及5 wt%之氧化釔混合以與實施例1相同之條件及製程製備及評估可機械加工的陶瓷複合物。詳細組成如下表2所示。By combining the 5 wt % sialon powder (average particle size of 1 μm, Z value 0.2) prepared in Example 1 and 20 wt % of commercially available boron nitride in Example 1 as the main raw materials The powder, 70 wt% zirconia, and 5 wt% yttria were mixed to prepare and evaluate a machinable ceramic composite using the same conditions and procedures as in Example 1. The detailed composition is shown in Table 2 below.

[表2] z值 主要組分(wt%) 賽隆 氮化硼 氧化鋯 氧化釔 氮化矽 實施例1 0.2 20 25 50 5 - 實施例2 0.2 10 30 55 5 - 實施例3 0.2 5 36 54 5 - 實施例4 0.2 5 42 48 5 - 實施例5 0.2 2 48 45 5 - 實施例6 0.2 5 35 50 10 - 實施例7 0.2 5 35 58 2 - 實施例8 1.0 20 25 50 5 - 實施例9 1.0 10 30 55 5 - 實施例10 1.0 5 36 54 5 - 實施例11 1.0 5 42 48 5 - 實施例12 1.0 2 48 45 5 - 實施例13 1.8 20 25 50 5 - 實施例14 1.8 10 30 55 5 - 實施例15 1.8 5 36 54 5 - 實施例16 1.8 5 42 48 5 - 實施例17 1.8 2 48 45 5 - 實施例18 2.6 20 25 50 5 - 實施例19 2.6 10 30 55 5 - 實施例20 2.6 5 36 54 5 - 實施例21 2.6 5 42 48 5 - 實施例22 2.6 2 48 45 5 - 實施例23 2.6 5 35 50 10 - 實施例24 2.6 5 35 58 2 - 比較實施例1 0 - 25 50 5 20 比較實施例2 0 - 30 55 5 10 比較實施例3 0 - 36 54 5 5 比較實施例4 0.2 20 20 55 5 - 比較實施例5 0.2 5 20 70 5 - [Table 2] z value Main component (wt%) Sialon Boron Nitride Zirconia Yttrium oxide Silicon Nitride Example 1 0.2 20 25 50 5 - Example 2 0.2 10 30 55 5 - Example 3 0.2 5 36 54 5 - Example 4 0.2 5 42 48 5 - Example 5 0.2 2 48 45 5 - Example 6 0.2 5 35 50 10 - Example 7 0.2 5 35 58 2 - Example 8 1.0 20 25 50 5 - Example 9 1.0 10 30 55 5 - Example 10 1.0 5 36 54 5 - Example 11 1.0 5 42 48 5 - Example 12 1.0 2 48 45 5 - Example 13 1.8 20 25 50 5 - Example 14 1.8 10 30 55 5 - Example 15 1.8 5 36 54 5 - Example 16 1.8 5 42 48 5 - Example 17 1.8 2 48 45 5 - Example 18 2.6 20 25 50 5 - Example 19 2.6 10 30 55 5 - Example 20 2.6 5 36 54 5 - Example 21 2.6 5 42 48 5 - Example 22 2.6 2 48 45 5 - Example 23 2.6 5 35 50 10 - Example 24 2.6 5 35 58 2 - Comparative Example 1 0 - 25 50 5 20 Comparative Example 2 0 - 30 55 5 10 Comparative Example 3 0 - 36 54 5 5 Comparative Example 4 0.2 20 20 55 5 - Comparative Example 5 0.2 5 20 70 5 -

<實驗實施例1>熱膨脹係數之測量<Experimental Example 1> Measurement of Thermal Expansion Coefficient

對於實施例1至24及比較實施例1至5之陶瓷燒結體,使用熱機械分析儀(Thermo Mechanical Analyzer;TMA)測量在-40℃至400℃之溫度範圍內之熱膨脹係數及在室溫下之比容積電阻,結果顯示於表3中。For the ceramic sintered bodies of Examples 1 to 24 and Comparative Examples 1 to 5, the thermal expansion coefficients in the temperature range of -40°C to 400°C and at room temperature were measured using a thermomechanical analyzer (Thermo Mechanical Analyzer; TMA). The specific volume resistance, the results are shown in Table 3.

<實驗實施例2>彎曲強度之測量<Experimental Example 2> Measurement of Bending Strength

自實施例1至24及比較實施例1至5之陶瓷燒結體上切下試驗片,並且透過三點彎曲試驗測量各試驗片之彎曲強度,結果顯示於表3中。Test pieces were cut out from the ceramic sintered bodies of Examples 1 to 24 and Comparative Examples 1 to 5, and the bending strength of each test piece was measured by a three-point bending test, and the results are shown in Table 3.

<實驗實施例3>可機械加工性之評估<Experimental Example 3> Evaluation of Machinability

圖3為說明根據本發明之一個具體實例之用於評估可機械加工性之機械加工位置及通孔之示意圖。3 is a schematic diagram illustrating machined locations and through holes for evaluating machinability according to an embodiment of the present invention.

具體地,為了評估可機械加工性,將160 mm×160 mm×10 mm之燒結體(可機械加工的陶瓷複合物100、100')研磨成160 mm×160 mm×1 mm之尺寸,厚度偏差在±5 μm內。如圖3之(a)所示,使用直徑28 μm之碳化物鑽頭在對角線方向之頂點110、中點120及底點130處形成厚度為300 μm之孔140。此時,透過在燒結體100、100'上鑽孔,然後在相反表面上形成凹坑來形成300個孔。Specifically, in order to evaluate machinability, a sintered body of 160 mm × 160 mm × 10 mm (machinable ceramic composites 100, 100') was ground to a size of 160 mm × 160 mm × 1 mm, thickness deviation within ±5 μm. As shown in FIG. 3( a ), a hole 140 with a thickness of 300 μm is formed at the vertex 110 , the midpoint 120 and the bottom point 130 in the diagonal direction using a carbide drill with a diameter of 28 μm. At this time, 300 holes were formed by drilling holes in the sintered bodies 100, 100' and then forming pits on the opposite surface.

各孔之直徑為33 μm,深度為300 μm。使用非接觸式3D測量機測量所獲得之各通孔之直徑及位置準確度。在表3之「位置準確度」欄中,用○表示位置準確度為±5 μm以下之情況,用△表示位置準確度為±10 μm以下之情況,並且用×表示位置準確度超過±10 μm之情況。The diameter of each hole is 33 μm and the depth is 300 μm. Use a non-contact 3D measuring machine to measure the diameter and position accuracy of the obtained through holes. In the "Position Accuracy" column of Table 3, use ○ to indicate that the position accuracy is ±5 μm or less, use △ to indicate that the position accuracy is ±10 μm or less, and use × to indicate that the position accuracy exceeds ±10 the case of μm.

此外,在表3之「孔徑」欄中,用○表示33 μm之目標直徑之機械加工公差為±1.5 μm以下之情況,用×表示機械加工公差超過±1.5 μm之情況。此外,透過用光學顯微鏡觀察來確認機械加工狀態。In addition, in the "Aperture" column of Table 3, ○ indicates the case where the machining tolerance of the target diameter of 33 μm is ±1.5 μm or less, and × indicates the case where the machining tolerance exceeds ±1.5 μm. In addition, the machining state was confirmed by observation with an optical microscope.

[表3] 熱膨脹係數 (10-6 /℃) 強度 (MPa) 比體積 (Ω·cm) 位置準確度 孔徑 機械加工狀態 X軸 Y軸 33 μm 實施例1 5.6 358 2.5×10-14 良好 實施例2 5.5 354 4.6×10-14 良好 實施例3 5.3 339 3.6×10-14 良好 實施例4 4.8 317 4.9×10-14 良好 實施例5 4.5 302 6.9×10-14 良好 實施例6 5.3 298 4.4×10-14 良好 實施例7 5.4 286 2.0×10-14 良好 實施例8 5.6 335 4.4×10-14 良好 實施例9 5.4 350 4.1×10-14 良好 實施例10 5.0 310 5.6×10-14 良好 實施例11 5.1 295 2.5×10-14 良好 實施例12 4.2 241 2.9×10-14 良好 實施例13 5.5 311 7.4×10-14 良好 實施例14 5.5 302 6.3×10-14 良好 實施例15 5.4 254 4.9×10-14 良好 實施例16 5.0 211 9.0×10-14 良好 實施例17 4.9 208 4.8×10-14 良好 實施例18 5.2 315 1.6×10-14 良好 實施例19 5.6 329 5.0×10-14 良好 實施例20 4.9 246 4.6×10-14 良好 實施例21 5.1 257 4.7×10-14 良好 實施例22 4.0 204 4.9×10-14 良好 實施例23 4.3 245 2.0×10-14 良好 實施例24 4.4 251 9.0×10-14 良好 比較實施例1 5.8 376 5.0×10-14 × × × 壁裂開 比較實施例2 5.4 381 1.0×10-14 × × × 孔移位 比較實施例3 5.6 364 1.5×10-14 孔移位 比較實施例4 6.1 404 10.5×10-14 × × × 工具損壞 比較實施例5 6.9 380 12.0×10-14 × × × 工具損壞 [table 3] Thermal expansion coefficient (10 -6 /℃) Strength(MPa) Specific volume (Ω·cm) location accuracy Aperture Machining status X axis Y axis 33 μm Example 1 5.6 358 2.5× 10-14 good Example 2 5.5 354 4.6× 10-14 good Example 3 5.3 339 3.6× 10-14 good Example 4 4.8 317 4.9× 10-14 good Example 5 4.5 302 6.9× 10-14 good Example 6 5.3 298 4.4× 10-14 good Example 7 5.4 286 2.0× 10-14 good Example 8 5.6 335 4.4× 10-14 good Example 9 5.4 350 4.1× 10-14 good Example 10 5.0 310 5.6× 10-14 good Example 11 5.1 295 2.5× 10-14 good Example 12 4.2 241 2.9× 10-14 good Example 13 5.5 311 7.4× 10-14 good Example 14 5.5 302 6.3× 10-14 good Example 15 5.4 254 4.9× 10-14 good Example 16 5.0 211 9.0× 10-14 good Example 17 4.9 208 4.8× 10-14 good Example 18 5.2 315 1.6× 10-14 good Example 19 5.6 329 5.0× 10-14 good Example 20 4.9 246 4.6× 10-14 good Example 21 5.1 257 4.7× 10-14 good Example 22 4.0 204 4.9× 10-14 good Example 23 4.3 245 2.0× 10-14 good Example 24 4.4 251 9.0× 10-14 good Comparative Example 1 5.8 376 5.0× 10-14 × × × wall split Comparative Example 2 5.4 381 1.0× 10-14 × × × hole displacement Comparative Example 3 5.6 364 1.5× 10-14 hole displacement Comparative Example 4 6.1 404 10.5× 10-14 × × × tool damage Comparative Example 5 6.9 380 12.0× 10-14 × × × tool damage

圖4為根據本發明之一個具體實例之可機械加工的陶瓷複合物之掃描電子顯微鏡(SEM)圖像。4 is a scanning electron microscope (SEM) image of a machinable ceramic composite according to an embodiment of the present invention.

圖4顯示觀察根據實施例1所製造之可機械加工的陶瓷複合物之結果,可確認將混合粉末燒結以製備陶瓷複合物。FIG. 4 shows the results of observing the machinable ceramic composite produced according to Example 1, and it was confirmed that the mixed powder was sintered to prepare the ceramic composite.

圖5為顯示測量根據本發明之一個具體實例之可機械加工的陶瓷複合物之熱膨脹係數之結果,圖6為在根據本發明之一個具體實例之可機械加工的陶瓷複合物中機械加工孔之後觀察到之圖像,圖7為測量根據本發明之一個具體實例之可機械加工的陶瓷複合物在X軸及Y軸上之位置準確度及孔之直徑之結果。5 shows the results of measuring the thermal expansion coefficient of the machinable ceramic composite according to an embodiment of the present invention, and FIG. 6 is after machining holes in the machinable ceramic composite according to an embodiment of the present invention The observed image, FIG. 7, is the result of measuring the positional accuracy on the X-axis and the Y-axis and the diameter of the hole of the machinable ceramic composite according to an embodiment of the present invention.

首先,參照圖6,在根據實施例1所製造之可機械加工的陶瓷複合物中,機械加工分別具有33 μm之直徑及300 μm之深度之300個孔。自圖6可確認孔被均勻地機械加工而不會破裂壁。First, referring to FIG. 6 , in the machinable ceramic composite manufactured according to Example 1, 300 holes having a diameter of 33 μm and a depth of 300 μm, respectively, were machined. From Figure 6 it can be confirmed that the holes are machined uniformly without breaking the walls.

此外,參照圖5、圖7及表3,可確認實施例1至24之可機械加工的陶瓷複合物之彎曲強度為200MPa以上,熱膨脹係數在-40°C至400°C之溫度範圍內為2.0×10-6 /℃至5.6×10-6 /℃,類似於矽之熱膨脹係數。5, 7 and Table 3, it can be confirmed that the flexural strength of the machinable ceramic composites of Examples 1 to 24 is 200 MPa or more, and the thermal expansion coefficient is 2.0×10 -6 /℃ to 5.6×10 -6 /℃, similar to the thermal expansion coefficient of silicon.

亦可確認,由於在X軸及Y軸上之位置準確度均在±5 μm以內,並且孔徑之公差在±1.5 μm以內,因此可機械加工的陶瓷複合物具有優異的可機械加工性。It was also confirmed that the machinable ceramic composite had excellent machinability since the positional accuracy on both the X-axis and the Y-axis was within ±5 μm, and the hole diameter tolerance was within ±1.5 μm.

反之,在比較實施例1至3中,可確認在測量可機械加工性時,位置準確度在X軸及Y軸上均超過±5 μm。特別地,可確認,當氮化矽之含量為10wt%以上時,在X軸及Y軸上之位置準確度均超過±10 μm,並且孔徑之公差亦超過±1.5 μm。In contrast, in Comparative Examples 1 to 3, it was confirmed that when measuring machinability, the positional accuracy exceeded ±5 μm in both the X-axis and the Y-axis. In particular, it was confirmed that when the content of silicon nitride was 10 wt % or more, the positional accuracy on both the X-axis and the Y-axis exceeded ±10 μm, and the hole diameter tolerance also exceeded ±1.5 μm.

在比較實施例4及5中,亦可確認當添加低含量之氮化硼並且添加高含量之賽隆時,改善了彎曲強度,但熱膨脹係數高,並且X軸及Y軸之位置準確度均超過±5 μm。In Comparative Examples 4 and 5, it was also confirmed that when a low content of boron nitride was added and a high content of sialon was added, the bending strength was improved, but the thermal expansion coefficient was high, and the positional accuracy of the X axis and the Y axis were both more than ±5 μm.

此外,在比較實施例1至5中,可確認在機械加工之後產生了壁裂紋或孔移位。可確認,相關技術之氮化矽基之可機械加工的陶瓷複合物難以確保直徑為33 μm以下之超細孔之機械加工性,並且機械加工性降低。Furthermore, in Comparative Examples 1 to 5, it was confirmed that wall cracks or hole displacements were generated after machining. It was confirmed that the machinability of the silicon nitride-based machinable ceramic composite of the related art was difficult to ensure the machinability of the ultrafine pores having a diameter of 33 μm or less, and the machinability decreased.

以此種方式,可藉由添加具有高韌性之賽隆來改善可機械加工的陶瓷複合物之韌性,從而最小化在細孔機械加工期間此種裂開或移位現象。因此,可確認可製造出具有優異的機械加工性之機械加工性陶瓷複合物。除此之外,可確認必須以預定的重量百分比以上之量混合氮化硼,以確保超細孔之機械加工性。In this way, the toughness of the machinable ceramic composite can be improved by adding sialon with high toughness, thereby minimizing such cracking or displacement during pore machining. Therefore, it was confirmed that a machinable ceramic composite having excellent machinability can be produced. In addition, it was confirmed that boron nitride must be mixed in a predetermined weight percent or more in order to ensure the machinability of the ultrafine holes.

即,根據本發明之一個具體實例,存在提供具有改善的韌性之高強度可機械加工的陶瓷複合物及其製造方法之效果,並且亦存在提供一種可機械加工的陶瓷複合物,其能夠藉由使用碳化物工具機械加工直徑為33 μm、深度為300 μm且位置公差在±5 μm內之超細孔之效果。That is, according to one embodiment of the present invention, there is an effect of providing a high-strength machinable ceramic composite with improved toughness and a method of making the same, and there is also providing a machinable ceramic composite that can be The effect of machining an ultrafine hole with a diameter of 33 μm, a depth of 300 μm and a positional tolerance within ±5 μm using a carbide tool.

在本說明書中,在發明人進行之各種具體實例中僅示出數個實施例,然而本發明之技術思想不限於此,所屬領域之技術人員將進行各種改變及修改。In this specification, only a few embodiments are shown in various specific examples performed by the inventor, however, the technical idea of the present invention is not limited thereto, and various changes and modifications will be made by those skilled in the art.

100:燒結體/可機械加工的陶瓷複合物 100':燒結體/可機械加工的陶瓷複合物 110:頂點 120:中點 130:底點 140:孔 S100:方法 S110:賽隆粉末製備步驟 S112:第二混合粉末形成步驟 S113:模製體形成步驟 S114:第二燒結步驟 S115:研磨步驟 S120:第一混合粉末形成步驟 S130:漿料製備步驟 S140:造粒步驟 S150:去黏合步驟 S160:第一燒結步驟100: Sintered body/machinable ceramic composite 100': sintered body/machinable ceramic composite 110: Vertex 120: Midpoint 130: Bottom point 140: Hole S100: Method S110: Sialon powder preparation steps S112: Second mixed powder forming step S113: Molded body forming step S114: Second sintering step S115: Grinding step S120: the first mixed powder forming step S130: Slurry preparation step S140: Granulation step S150: Debonding step S160: First sintering step

[圖1]為說明根據本發明之一個具體實例之用於製造可機械加工的陶瓷複合物之方法之流程圖。 [圖2]為說明根據本發明之一個具體實例之用於製備賽隆粉末之方法之流程圖。 [圖3]為說明根據本發明之一個具體實例之用於評估可機械加工性之機械加工位置及通孔之示意圖。 [圖4]為根據本發明之一個具體實例之可機械加工的陶瓷複合物之掃描電子顯微鏡(SEM)圖像。 [圖5]為說明根據本發明之一個具體實例之測量可機械加工的陶瓷複合物之熱膨脹係數之結果之圖。 [圖6]為在根據本發明之一個具體實例之可機械加工的陶瓷複合物中機械加工孔之後觀察到之圖像。 [圖7]為測量根據本發明之一個具體實例之可機械加工的陶瓷複合物之在X軸及Y軸上之位置準確度及孔之直徑之結果。[ FIG. 1 ] is a flowchart illustrating a method for producing a machinable ceramic composite according to an embodiment of the present invention. [ Fig. 2 ] is a flow chart illustrating a method for preparing a sialon powder according to an embodiment of the present invention. [ Fig. 3 ] is a schematic diagram illustrating machining positions and through holes for evaluating machinability according to an embodiment of the present invention. [ FIG. 4 ] is a scanning electron microscope (SEM) image of a machinable ceramic composite according to an embodiment of the present invention. [ Fig. 5 ] is a graph illustrating the results of measuring the thermal expansion coefficient of a machinable ceramic composite according to an embodiment of the present invention. [ Fig. 6 ] is an image observed after machining holes in the machinable ceramic composite according to an embodiment of the present invention. [ Fig. 7 ] is a result of measuring the positional accuracy on the X axis and the Y axis and the diameter of the hole of the machinable ceramic composite according to an embodiment of the present invention.

Claims (7)

一種可機械加工的陶瓷複合物,其由賽隆(SiAlON)、氮化硼(BN)、氧化鋯(ZrO2)及氧化釔(Y2O3)組成,其中以該可機械加工的陶瓷複合物計,該賽隆之量為2wt%至20wt%,該氮化硼之量為25wt%至48wt%,該氧化鋯之量為45wt%至55wt%,及該氧化釔之量為2wt%至10wt%,其中該賽隆由以下化學式(1)表示,[化學式1]Si6-zAlzOzN8-z(0<z
Figure 110102118-A0305-02-0019-1
4.2),其中該賽隆由氮化矽(Si3N4)、氧化鋁(Al2O3)及氮化鋁(AlN)組成,並且其中該賽隆之平均粒徑為1μm。
A machinable ceramic composite consisting of sialon (SiAlON), boron nitride (BN), zirconia (ZrO 2 ) and yttrium oxide (Y 2 O 3 ), wherein the machinable ceramic composite is The amount of the sialon is 2wt% to 20wt%, the amount of the boron nitride is 25wt% to 48wt%, the amount of the zirconia is 45wt% to 55wt%, and the amount of the yttrium oxide is 2wt% to 10wt% %, wherein the sialon is represented by the following chemical formula (1), [chemical formula 1] Si 6-z Al z O z N 8-z (0<z
Figure 110102118-A0305-02-0019-1
4.2), wherein the Sialon is composed of silicon nitride (Si 3 N 4 ), aluminum oxide (Al 2 O 3 ) and aluminum nitride (AlN), and wherein the average particle size of the Sialon is 1 μm.
如請求項1之可機械加工的陶瓷複合物,其中藉由機械加工直徑為33μm、深度為300μm之超細孔,該可機械加工的陶瓷複合物之位置準確度可控制至小於±5μm。 The machinable ceramic composite of claim 1, wherein by machining ultrafine pores with a diameter of 33 μm and a depth of 300 μm, the positional accuracy of the machinable ceramic composite can be controlled to less than ±5 μm. 如請求項1之可機械加工的陶瓷複合物,其中熱膨脹係數在-40℃至400℃範圍內之溫度下為2.0×10-6/℃至5.6×10-6/℃範圍內,並且彎曲強度為200MPa至360MPa範圍內。 The machinable ceramic composite of claim 1, wherein the coefficient of thermal expansion is in the range of 2.0×10 −6 /°C to 5.6×10 −6 /°C at a temperature in the range of -40°C to 400°C, and the flexural strength in the range of 200MPa to 360MPa. 一種製造如請求項1之可機械加工的陶瓷複合物之方法,該方法包含:製備賽隆粉末;藉由混合該賽隆粉末、氮化硼(BN)、氧化鋯(ZrO2)及氧化釔(Y2O3)來 形成第一混合粉末;製備含有該第一混合粉末之漿料;將製備之漿料造粒以製備顆粒狀粉末;使該顆粒狀粉末去黏合(debinding);及藉由熱壓經去黏合之該顆粒狀粉末來進行第一燒結,其中該製備賽隆粉末包含:藉由混合氮化矽、氧化鋁及氮化鋁來形成第二混合粉末;藉由模製該第二混合粉末來形成模製體;對該模製體進行第二燒結;及研磨經燒結之該模製體,並且其中該賽隆粉末之平均粒徑為1μm。 A method of making a machinable ceramic composite as claimed in claim 1, the method comprising: preparing a sialon powder; by mixing the sialon powder, boron nitride (BN), zirconia (ZrO 2 ) and yttrium oxide (Y 2 O 3 ) to form a first mixed powder; preparing a slurry containing the first mixed powder; granulating the prepared slurry to prepare a granular powder; debinding the granular powder; and The first sintering is performed by hot pressing the debonded granular powder, wherein the preparing the sialon powder comprises: forming a second mixed powder by mixing silicon nitride, aluminum oxide and aluminum nitride; by molding the secondly mixing powders to form a molded body; subjecting the molded body to a second sintering; and grinding the sintered molded body, and wherein the Sialon powder has an average particle size of 1 μm. 如請求項4之方法,其中藉由機械加工直徑為33μm、深度為300μm之超細孔,該可機械加工的陶瓷複合物之位置準確度可控制至小於±5μm。 The method of claim 4, wherein the positional accuracy of the machinable ceramic composite can be controlled to less than ±5 μm by machining ultra-fine pores with a diameter of 33 μm and a depth of 300 μm. 如請求項5之方法,其中該第二混合粉末含有56.20wt%至96.61wt%之該氮化矽,2.42wt%至31.24wt%之該氧化鋁,及0.97wt%至12.56wt%之該氮化鋁。 The method of claim 5, wherein the second mixed powder contains 56.20wt% to 96.61wt% of the silicon nitride, 2.42wt% to 31.24wt% of the alumina, and 0.97wt% to 12.56wt% of the nitrogen Aluminum. 如請求項4之方法,其中該第一混合粉末含有2wt%至20wt%之該賽隆粉末,25wt%至48wt%之該氮化硼,45wt%至55wt%之該氧化鋯,及2wt%至10wt%之該氧化釔。 The method of claim 4, wherein the first mixed powder contains 2wt% to 20wt% of the sialon powder, 25wt% to 48wt% of the boron nitride, 45wt% to 55wt% of the zirconia, and 2wt% to 20wt% 10 wt% of the yttrium oxide.
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