KR102156575B1 - Machinable ceramic composite material having a low coefficient of thermal expansion and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a machinable ceramic composite having a low thermal expansion coefficient to provide increased mechanical characteristics and fine processability, and a manufacturing method thereof. More specifically, according to the present invention, the machinable ceramic composite comprises: 30-60 wt% of SiAlON; 35-60 wt% of boron nitride (BN); 0-10 wt% of zirconia (ZrO_2); and 5-10 wt% of yttria (Y_2O_3).

Description

Machinable ceramic composite material having a low coefficient of thermal expansion and manufacturing method thereof

The present invention relates to a machinable ceramic composite having a low coefficient of thermal expansion and a method for manufacturing the same, and in detail, a ceramic composite including sialon having an improved coefficient of thermal expansion and improved mechanical properties and fine workability than that of ordinary ceramics and silicon, and preparation thereof It's about how.

In general, ceramics exhibit good mechanical properties and insulating properties as well as good high temperature properties. Due to this characteristic, it is attracting attention as a material for use as a component of a device for semiconductor manufacturing equipment, but most ceramics are difficult to machine.

The workability of brittle inorganic materials can be improved by dispersing a cleavable ceramic component such as mica or boron nitride in a ceramic or glass matrix. Ceramics of this type are generally referred to as machinable ceramics.

Machinable ceramics can be used as parts of semiconductor inspection devices only when they have adequate insulation properties, good mechanical properties, and ultra-precision processing.

The electrical properties of semiconductor devices are checked using a probe card. Machinable ceramics can be used as a guide to fix the fine probe, which is the core part of the probe card. Thermal contraction and expansion according to temperature should be optimized, and especially under high temperature conditions, the difference in the coefficient of thermal expansion between the substrate of the semiconductor device and silicon should not be made so that the electrode pad of the semiconductor device and the inspection probe are accurately aligned so that the inspection process can proceed without problems. I can.

On the other hand, the existing mica series has a limitation in use due to its high coefficient of thermal expansion and low strength, and the boron nitride composite ceramic is difficult to sinter, making it difficult to manufacture a uniform sintered body.

In addition, the conventional composite ceramics of boron nitride and silicon nitride are known to have excellent mechanical properties and micro-machinability, but the micro-hole workability of 35 μm or less in diameter has not been secured.

As such, there are few materials that have similar thermal expansion coefficients to silicon and have high strength and excellent workability required for high-precision micro-machining, and it is impossible to process ultra-fine holes of 35 μm or less in diameter with conventional machinable ceramics.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a machinable ceramic composite having high strength and improved toughness, and a method of manufacturing the same.

In addition, it is an object of the present invention to provide a ceramic composite including sialon, which has a coefficient of thermal expansion much lower than that of ordinary ceramics and silicon, and has improved mechanical properties and fine workability, and a method of manufacturing the same.

However, these problems are exemplary, and the scope of the present invention is not limited thereby.

According to one aspect of the present invention for achieving the above object, in the machinable ceramic composite comprising sialon (SiAlON), boron nitride (BN), zirconia (ZrO ₂ ) and yttria (Y ₂ O ₃ ) , Based on the machinable ceramic composite, the sialon is included in an amount of 30 wt% to 60 wt%, the boron nitride is included in an amount of 35 wt% to 60 wt%, and the zirconia is included in an amount of 0 wt% to 10 wt%, and the yttria It provides a machinable ceramic composite that is contained in 5wt% to 10wt%.

According to an embodiment of the present invention, the sialon is represented by the following formula (1), and the sialon includes silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ), and aluminum nitride (AlN). I can.

[Formula 1]

Si _6-z Al _z O _z N _8-z (0<z≤1.0)

According to an embodiment of the present invention, the machinable ceramic composite has a coefficient of thermal expansion of 0.4×10 ^-6 /°C to 1.7×10 ^-6 /°C in a temperature range of -40°C to 400°C, and a bending strength of 179 MPa. To 480 MPa.

According to another aspect of the present invention, in a method of manufacturing a machinable ceramic composite, the step of preparing a sialon powder, the sialon powder, boron nitride (BN), zirconia (ZrO ₂ ), and yttria (Y ₂ O ₃ ) To form a first mixed powder, a slurry preparation step including the first mixed powder, a granulation step of preparing the prepared slurry into granular powder, a degreasing step of degreasing the granular powder, and the degreasing It provides a method for manufacturing a machinable ceramic composite comprising the step of first sintering by hot pressing one first mixed powder.

According to an embodiment of the present invention, the step of preparing the sialon powder includes forming a second mixed powder by mixing silicon nitride, alumina and aluminum nitride, forming a molded body forming the second mixed powder, the It may include the step of second sintering the molded body and pulverizing the sintered compact.

According to an embodiment of the present invention, in the second mixed powder, the silicon nitride is contained in 83.07 wt% to 96.61 wt%, the alumina is contained in 2.42 wt% to 12.08 wt%, and the aluminum nitride is 0.97 wt%. % To 4.85wt% may be included.

According to an embodiment of the present invention, in the first mixed powder, the sialon powder is included in an amount of 30 wt% to 60 wt%, the boron nitride is included in an amount of 35 wt% to 60 wt%, and the zirconia is 0 wt% to It is included in 10wt%, and the yttria may be included in 5wt% to 10wt%.

According to an embodiment of the present invention made as described above, there is an effect of providing a machinable ceramic composite having high strength and improved toughness, and a method of manufacturing the same.

In addition, there is an effect of providing a ceramic composite including sialon having a coefficient of thermal expansion much lower than that of ordinary ceramics and silicon and improved mechanical properties and fine workability, and a method of manufacturing the same.

However, these effects are exemplary, and the scope of the present invention is not limited thereby.

1 is a flowchart showing a method of manufacturing a machinable ceramic composite according to an embodiment of the present invention.
2 is a flowchart showing a method of manufacturing sialon powder according to an embodiment of the present invention.
3 is a schematic diagram showing a machining position and a through hole for evaluating machinability according to an embodiment of the present invention.
4 is an image obtained by observing a scanning electron microscope (SEM) of a machinable ceramic composite according to an embodiment of the present invention.
5 is a graph showing a result of measuring a coefficient of thermal expansion of a machinable ceramic composite according to an exemplary embodiment of the present invention.
6 is an image observed after hole processing a machinable ceramic composite according to an embodiment of the present invention.
7 is a result of measuring the positional accuracy of the X-axis and Y-axis and the diameter of a hole of a machinable ceramic composite according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to embodiments of the present invention and drawings. These examples are only illustratively indicated to describe the present invention in more detail, and it will be apparent to those of ordinary skill in the art that the scope of the present invention is not limited by these examples. will be.

In addition, unless otherwise defined, all technical and scientific terms used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs, and in case of conflict, the present specification including definitions The description of will take precedence.

In order to clearly describe the invention proposed in the drawings, parts not related to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification. And when a part "includes" a certain component, it means that other components may be further included rather than excluding other components unless specifically stated to the contrary. In addition, the "unit" described in the specification means one unit or block receiving a specific function.

In each step, the identification code (first, second, etc.) is used for convenience of description, and the identification code does not describe the order of each step, and each step does not clearly describe a specific sequence in the context. It may be implemented differently from the order specified above.

That is, each of the steps may be performed in the same order as the specified order, may be performed substantially simultaneously, or may be performed in the reverse order.

In the following. In order to enable those of ordinary skill in the art to easily implement the present invention, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

According to an embodiment of the present invention, the machinable ceramic composite includes sialon (SiAlON), boron nitride (BN), zirconia (ZrO ₂ ), and yttria (Y ₂ O ₃ ), and the sialon is 30 wt. % To 60wt%, the boron nitride is included in 35wt% to 60wt%, the zirconia is included in 0wt% to 10wt%, the yttria is preferably contained in 5wt% to 10wt%.

In addition, the sialon is represented by the following formula (1), and includes silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ) and aluminum nitride (AlN), and the silicon nitride is 83.07 wt% to 96.61 wt%. It is included, and the alumina is contained in an amount of 2.42wt% to 12.08wt%, and the aluminum nitride is characterized in that it is contained in an amount of 0.97wt% to 4.85wt%.

[Formula 1]

Si _6-z Al _z O _z N _8-z (0<z≤1.0)

Specifically, the Z value of Formula 1 is more preferably 0.2 to 1.0.

In addition, the machinable ceramic composite has a thermal expansion coefficient of 0.4×10 ^-6 /°C to 1.7×10 ^-6 /°C in a temperature range of -40°C to 400°C, and a bending strength of 179 MPa to 480 MPa.

Hereinafter, the machinable ceramic composite will be described in detail along with a method of manufacturing the machinable ceramic composite.

1 is a flow chart showing a method (S100) of manufacturing a machinable ceramic composite according to an embodiment of the present invention.

Referring to Figure 1, the manufacturing method (S100) of the machinable ceramic composite is a sialon powder manufacturing step (S110), a first mixed powder forming step (S120), a slurry manufacturing step (S130), a granulating step (S140), It characterized in that it comprises a degreasing step (S150) and a first sintering step (S160).

The sialon powder manufacturing step (S110) is characterized in that it is manufactured in a powder form as a main material of the machinable ceramic composite, and includes silicon nitride, alumina, and aluminum nitride. A detailed manufacturing method will be described with reference to FIG. 2. 2 is a flowchart showing a method of manufacturing sialon powder according to an embodiment of the present invention.

Referring to FIG. 2, the sialon powder manufacturing step (S110) includes a second mixed powder forming step (S112), a molded body forming step (S113), a second sintering step (S114), and a grinding step (S115). To do.

First, the second mixed powder forming step (S112) is a step of mixing the silicon nitride, the alumina, and the aluminum nitride, the silicon nitride is contained in 83.07wt% to 96.61wt%, the alumina is 2.42wt% to 12.08% It is included in wt%, and the aluminum nitride is characterized in that 0.97wt% to 4.85wt% are included.

At this time, the silicon nitride, the alumina and the aluminum nitride are included in a powder form, and the average particle diameter of the silicon nitride powder is preferably 0.8 μm, and the average particle diameter of the alumina powder is preferably 0.5 μm, and the aluminum nitride It is preferable that the average particle diameter of is 1 μm.

Thereafter, it is preferable to weigh the silicon nitride, the alumina, and the aluminum nitride according to the above composition, dry mixing for at least 2 hours using a high-speed mixer, and then sift through a sieve.

In the forming of the molded body (S113), the second mixed powder is molded, and in detail, it is preferable to press the second mixed powder with a press pressure of 200 kgf/cm ² using a mold to form.

For example, in order to form the molded body, it may be molded by filling and pressing powder in a graphite mold. At this time, the graphite mold may be provided as a cemented carbide mold, and the second mixed powder prepared in the second mixed powder forming step may be filled in the cemented carbide mold and then pressed in a uniaxial pressure molding method. However, there is no limit to the pressure molding method.

The second sintering step (S114) is a step of sintering the molded body, in detail, the sintering temperature is 1700°C to 1900°C, the sintering time is 00 hours to 2 hours, and it is preferable to sinter in a nitrogen or argon atmosphere. .

The pulverizing step (S115) is a step of pulverizing the sintered compact, that is, characterized in that the sialon compact is formed by pulverizing the manufactured sialon compact.

In this case, the sintered compact is preferably pulverized so that the average particle diameter is within 1 μm, and the pulverization method is not limited. In addition, the sialon powder prepared by the above production method is preferably represented by the following formula (1).

[Formula 1]

Si _6-z Al _z O _z N _8-z (0<z≤1.0)

Specifically, the Z value of Formula 1 is more preferably 0.2 to 1.0.

The first mixed powder forming step (S120) is characterized by forming the first mixed powder including the sialon powder prepared through the sialon powder manufacturing step (S110).

Specifically, the first mixed powder is characterized in that it contains the sialon powder, the boron nitride, the zirconia and the yttria.

The sialon powder is contained in an amount of 30wt% to 60wt%, and the average particle diameter of the sialon powder is preferably 1.0㎛. At this time, the sialon powder is included in the machinable ceramic composite to increase strength and toughness, and when the content of the sialon powder is less than 30wt%, the strength is low, and the hole wall may be broken during micro-hole processing. If the content of the sialon powder exceeds 60wt%, fine hole processing may become impossible.

In addition, the sialon powder has high fracture toughness compared to silicon nitride, and can improve fine hole workability compared to conventional machinable ceramic composites including silicon nitride. That is, by adjusting the composition of the sialon powder, the coefficient of thermal expansion and Young's modulus of the machinable ceramic composite can be adjusted, and accordingly, the performance of the machinable ceramic composite can be fine-tuned and maximized.

The boron nitride is contained in an amount of 35wt% to 60wt%, and the average particle diameter of the boron nitride is preferably 1.0㎛. In this case, the boron nitride is included in the machinable ceramic composite to adjust the thermal expansion coefficient, and when the content of boron nitride is less than 35 wt%, the thermal expansion coefficient of the composite may be higher than the target, and the content of boron nitride If it exceeds this 60wt%, the coefficient of thermal expansion of the composite may be lower than the target.

The zirconia is contained in an amount of 0wt% to 10wt%, and the average particle diameter of the zirconia is preferably 0.3㎛. At this time, the zirconia is included in the machinable ceramic composite to suppress grain growth during sintering. When the zirconia content exceeds 10 wt%, precision processing may become impossible due to an increase in hardness.

The yttria is contained in an amount of 5wt% to 10wt%, and the average particle diameter of the yttria is preferably 1.0㎛. At this time, the yttria is included in the machinable ceramic composite so that the composite is densified as a sintering aid. If the yttria content is less than 5wt%, the densification of the composite may be insufficient, and the yttria content is 10wt%. If it exceeds %, precision processing may become impossible due to excess residual liquid.

The slurry manufacturing step (S130) is a step of preparing a slurry including the first mixed powder, and in detail, adding and mixing a solvent and a binder to the second mixed powder, and the second mixing It is preferable to prepare a slurry by putting the powder, a solvent, and a binder together with an alumina ball into a ball mill and wet mixing for 24 hours.

In this case, the solvent preferably contains at least one selected from ethanol, methanol, isopropanol, distilled water, and acetone. In addition, it is preferable to use a polyvinyl butyral (PVB)-based binder as the binder.

The granulating step (S140) is to prepare the slurry into granular powder, and in detail, the slurry is spray-dried to produce a spherical granular powder. At this time, the granular powder prepared by spray drying is preferably sieved, and the sieving is preferably made at 100 mesh.

In the degreasing step (S150), the granular powder is degreased, and in detail, the binder contained in the granular powder is degreased and removed. In this case, the degreasing temperature is preferably 600°C to 700°C, and the degreasing time is preferably 2 to 3 hours. In addition, the degreasing step may be performed in a degreasing furnace in a nitrogen or argon atmosphere, or in a vacuum atmosphere degreasing furnace.

The first sintering step (S160) is characterized in that the degreasing granular powder is hot-pressed and sintered. Specifically, the degreased granular powder is preferably filled in a graphite mold and sintered by pressing at a pressure of 25 MPa to 00 MPa, and the sintering temperature is preferably 1700° C. to 1900° C., and the sintering time is 30 It is preferably from minutes to 2 hours.

Hereinafter, the present invention will be described in detail through examples and experimental examples. However, the following examples and experimental examples are merely illustrative of the present invention, and the present invention is not limited by the following examples and experimental examples.

Examples and Comparative Examples

<Production Example 1> Preparation of sialon powder

To prepare sialon powder, commercially available silicon nitride powder (oxygen content 1.0 mass%, impurity metal element content 0.2 mass% or less, average particle diameter 0.8 μm), alumina (purity 99%, average particle diameter 0.5 μm), and aluminum nitride (purity 99) %, average particle diameter 1.0㎛) was dry mixed with a high-speed mixer for 2 hours and then passed through a sieve to prepare a raw material powder.

Thereafter, the mixed sialon raw material powder was molded with a press pressure of 200 kgf/cm 2 using a mold, and then synthesized at 1800° C. for 2 hours in a nitrogen atmosphere. The synthesized raw material was pulverized to 1 μm using a planetary mill.

<Production Examples 2 to 4>

Sialon powder was prepared in the same manner as in Preparation Example 1, except that the composition of the silicon nitride powder, alumina powder, and aluminum nitride powder was different.

The detailed composition is shown in Table 1 below.

Z value Silicon nitride (wt%) Aluminum nitride (wt%) Alumina (wt%) Manufacturing Example 1 0.2 96.61 0.97 2.42 Manufacturing Example 2 1.0 83.07 4.85 12.08

<Example 1> Preparation of machinable ceramic composite

Sialon powder 60wt% prepared through Preparation Example 1. Commercially available boron nitride powder (h-BN, purity 99%, average particle diameter 1.0 μm) 35 wt% and yttria powder (99.9%, average particle diameter 1.0 μm) 5 wt% were mixed. Thereafter, 1 wt% of a polyvinylbutylal (PVB) binder and ethanol were added to slurry the mixed powder, and mixed using a wet ball milling process. At this time, the ball milling process minimized the composition unevenness problem by using a polyethylene pot, and in the ball milling process, an alumina ball was used as the ball, and the process was performed for 24 hours. Thereafter, the mixed raw materials were dried and spheroidized into granulated powder. The granulation step was performed through a spray dryer, and the granulated spheroid powder was sieved using a 100 mesh sieve. Thereafter, in order to remove the organic binder contained in the prepared powder by degreasing, it was degreased for 3 hours at 700°C under a nitrogen atmosphere.

The firing after the degreasing was performed by hot press sintering, and the degreased granular powder was filled in a graphite mold, pressed in one direction at a pressure of 25 MPa in a nitrogen atmosphere, and held at 1800° C. for 2 hours to 160 mm×160 mm× A 10 mm ceramic sintered body was obtained.

<Examples 2 to 12>

A machinable ceramic composite was prepared in the same manner as in Example 1, except that the composition of the sialon powder, boron nitride powder, zirconia powder, and yttria powder was different.

Table 2 below discloses the detailed composition of Examples 1 to 12 and the Z value of the sialon powder.

<Comparative Example 1>

To prepare a machinable ceramic composite by mixing 35 wt% boron nitride powder, 5 wt% yttria, and 60 wt% commercial silicon nitride powder, the same as in Example 1, except that the composition ratio of the composition was different without sialon powder. It was manufactured and evaluated through the process.

<Comparative Example 2>

A machinable ceramic composite was prepared by mixing 46 wt% of boron nitride powder, 8 wt% of yttria, and 46 wt% of commercially available silicon nitride powder, and the same as in Example 1, except that the composition ratio of the composition was different without sialon powder. It was manufactured and evaluated through the process.

<Comparative Example 3>

A machinable ceramic composite was prepared by mixing 60 wt% of boron nitride powder, 10 wt% of yttria, and 30 wt% of commercially available silicon nitride powder, and the same as in Example 1, except that the composition ratio of the composition was different without sialon powder. It was manufactured and evaluated through the process.

<Comparative Example 4>

Sialon powder prepared through Preparation Example 1 (average particle diameter 1 μm, Z value 0.2) 65 wt% and the same commercially available boron nitride powder as in Example 1 30 wt%, zirconia 55 wt%, yttria 5 wt% as main raw materials It was manufactured and evaluated through the same conditions and processes as in Example 1. The detailed composition is disclosed in Table 2 below.

z value Main ingredient (wt%) Sialon Boron nitride Zirconia Yttria Silicon nitride Example 1 0.2 60 35 0 5 0 Example 2 0.2 50 45 0 5 0 Example 3 0.2 46 46 0 8 0 Example 4 0.2 30 60 0 10 0 Example 5 0.2 44 44 4 8 0 Example 6 0.2 43 43 6 8 0 Example 7 0.2 41 41 10 8 0 Example 8 One 60 35 0 5 0 Example 9 One 46 46 0 8 0 Example 10 One 30 60 0 10 0 Example 11 One 44 44 4 8 0 Example 12 One 41 41 10 8 0 Comparative Example 1 0 0 35 0 5 60 Comparative Example 2 0 0 46 0 8 46 Comparative Example 3 0 0 60 0 10 30 Comparative Example 4 0.2 65 30 0 5 0

<Experimental Example 1> Measurement of coefficient of thermal expansion

For the ceramic sintered bodies of Examples 1 to 12 and Comparative Examples 1 to 4, the thermal expansion coefficient and the specific volume resistance at room temperature were measured in a temperature range of -40°C to 400°C using a Thermo Mechanical Analyzer (TMA) It was measured, and the results are disclosed in Table 3.

<Experimental Example 2> Measurement of bending strength

The test pieces were cut from the ceramic sintered bodies of Examples 1 to 12 and Comparative Examples 1 to 5, and the bending strength was measured using a three-fold bending test method, and the results are disclosed in Table 3.

<Experimental Example 3> Evaluation of machinability

3 is a schematic diagram showing a machining position and a through hole for evaluating machinability according to an embodiment of the present invention.

In detail, in order to evaluate the machinability, a 160 mm×160 mm×10 mm sintered body (machinable ceramic composite, 100, 100′) was ground so that 160 mm×160 mm×1 mm and a thickness variation within ±5 μm. The sintered sintered body (100, 100'), which has a thickness of 300 μm using a 28 μm diameter carbide drill, is formed in three diagonal directions as shown in FIG. 3(a). ) Was formed. At this time, 300 holes were formed in the sintered bodies 100 and 100', each drilled and then pocketed on the opposite side of the drilled to penetrate.

Each hole has a diameter of 33 μm and a depth of 300 μm. The diameter and hole position accuracy of the obtained through-hole was measured using a non-contact 3D measuring machine. Was marked.

In addition, in the “hole size” column of Table 3, if the target diameter 33μm processing tolerance is less than ±1.5μm, it is marked as O, and if it exceeds ±1.5μm, it is marked as ×.

Coefficient of thermal expansion
(10 ^-6 /℃) burglar
(MPa) Proper volume
(Ω·cm) Location map Hole size Processing
state X axis Y axis 33㎛ Example 1 1.6 480 3.6×10 ^-14 ○ ○ ○ Good Example 2 1.4 422 5.7×10 ^-14 ○ ○ ○ Good Example 3 1.4 405 4.7×10 ^-14 ○ ○ ○ Good Example 4 1.1 205 6.0×10 ^-14 ○ ○ ○ Good Example 5 1.6 368 7.0×10 ^-14 ○ ○ ○ Good Example 6 1.6 372 5.5×10 ^-14 ○ ○ ○ Good Example 7 1.8 345 3.3×10 ^-14 ○ ○ ○ Good Example 8 1.5 454 3.4×10 ^-14 ○ ○ ○ Good Example 9 1.5 401 3.0×10 ^-14 ○ ○ ○ Good Example 10 1.0 179 4.6×10 ^-14 ○ ○ ○ Good Example 11 1.6 362 1.5×10 ^-14 ○ ○ ○ Good Example 12 1.7 365 7.1×10 ^-14 ○ ○ ○ Good Comparative Example 1 1.8 477 1.9×10 ^-14 × × × Broken wall Comparative Example 2 1.2 415 9.8×10 ^-14 × × × Hole jungle Comparative Example 3 0.9 247 3.9×10 ^-14 △ × × Hole jungle Comparative Example 4 2.4 526 7.8×10 ^-14 × × × Broken tools

4 is an image obtained by observing a scanning electron microscope (SEM) of a machinable ceramic composite according to an embodiment of the present invention.

Referring to FIG. 4, the machinable ceramic composite manufactured according to Example 1 was observed, and it can be confirmed that the mixed powders were sintered to form the ceramic composite.

5 is a graph showing a result of measuring the coefficient of thermal expansion of the machinable ceramic composite according to an embodiment of the present invention, and FIG. 6 is an image observed after hole processing the machinable ceramic composite according to an embodiment of the present invention. 7 is a result of measuring the positional accuracy of the X-axis and Y-axis and the diameter of a hole of a machinable ceramic composite according to an embodiment of the present invention.

First, referring to FIG. 6, 300 holes were processed with a diameter of 33 μm and a depth of 300 μm in the machinable ceramic composite manufactured according to Example 1, and it can be confirmed that the holes were uniformly processed without breaking the wall. .

In addition, referring to FIGS. 5 and 7, Table 3, the bending strength of the machinable ceramic composites of Examples 1 to 24 is 150 MPa or more, and the coefficient of thermal expansion is 0.4×10 ^-6 at -40°C to 400°C. It can be seen that it has a very low level of thermal expansion coefficient compared to silicon and general ceramics as having a range of ℃ to 1.7×10 ^-6 /°C.

In addition, it can be confirmed that the positioning accuracy satisfies within ±5μm in both the X-axis and Y-axis, and the hole size tolerance is within ±1.5μm, which has excellent machinability.

In contrast, in the case of Comparative Examples 1 to 3, it was confirmed that the position precision exceeded ±5 μm in both the X-axis and Y-axis when measuring machinability. In particular, when the content of silicon nitride was 30wt% or more, it was confirmed that the positional accuracy exceeded ±10μm in both the X-axis and Y-axis, and the tolerance of the hole size was also found to be ±1.5μm or more.

In addition, through Comparative Examples 4 and 5, when boron nitride is added in a low content and sialon is added in a high content, the strength is improved, but the thermal expansion coefficient is high, and the positional accuracy is ±5 μm in both the X-axis and Y-axis. You can check what is exceeded

In addition, in Comparative Examples 1 to 5, a wall cracking or hole pushing phenomenon occurs after machining. In the case of the existing silicon nitride-based machinable ceramic composite, it is difficult to secure the workability of ultra-fine holes with a diameter of 33 μm or less. It could be confirmed that the machinability was poor.

Through this, it can be confirmed that the machinable ceramic composite with excellent machinability can be manufactured by minimizing the phenomenon of being pushed or cracked during micro-hole processing by improving the toughness of the machinable ceramic composite by adding a high toughness sialon. In addition, it can be confirmed that boron nitride of a certain mass or more must be mixed in order to secure ultra-fine hole workability.

That is, according to an embodiment of the present invention, there is an effect of providing a machinable ceramic composite with improved high strength and toughness and a method for manufacturing the same, and a carbide tool having a diameter of 33 μm and a depth of 300 μm, and a position tolerance of ±5 μm There is an effect of providing a machinable ceramic composite capable of processing phosphorus ultrafine holes.

In the present specification, only a few examples of various embodiments performed by the present inventors will be described, but the technical idea of the present invention is not limited or limited thereto, and may be modified and variously implemented by those skilled in the art.

100, 100': machinable ceramic composite
110: upper portion of the machinable ceramic composite
120: machinable ceramic composite middle portion
130: lower portion of the machinable ceramic composite
140: hall

Claims (10)

In the ultra-precise machinable machinable ceramic composite comprising sialon powder (SiAlON), boron nitride (BN), zirconia (ZrO ₂ ) and yttria (Y ₂ O ₃ ) prepared by synthesizing,
Based on the machinable ceramic composite,
The sialon is contained in 30wt% to 60wt%,
The boron nitride is included in 35wt% to 60wt%,
The zirconia is included in 0wt% to 10wt%,
The yttria is included in 5wt% to 10wt%,
The sialon powder is represented by the following formula (1),
The sialon powder includes silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ), and aluminum nitride (AlN),
The average particle diameter of the sialon powder is 1㎛,
Machinable ceramic composite.
[Formula 1]
Si _6-z Al _z O _z N _8-z (0<z≤1.0) The method of claim 1,
The ultra-precise machinable machinable ceramic composite,
The average grain size is 5㎛ or less,
Machinable Ceramic Composite The method of claim 1,
The ultra-precise machinable machinable ceramic composite,
By ultra-precise machining with a diameter of 33 μm and a depth of 300 μm, the positional accuracy can be controlled to ±5 μm or less.
Machinable ceramic composite. The method of claim 1,
The machinable ceramic composite,
In the temperature range of -40°C to 400°C, the coefficient of thermal expansion is 0.4×10 ^-6 /°C to 1.7×10 ^-6 /°C,
The bending strength is 179 MPa to 480 MPa,
Machinable ceramic composite. delete delete delete delete delete delete

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