TWI758969B - LED light-emitting device and packaging method thereof - Google Patents

Abstract

The present invention relates to the technical field of light-emitting, in particular to an LED light-emitting device and a packaging method thereof. The LED light-emitting device includes a support structure, an LED chip set fixed on the support structure, and an encapsulation layer covering the LED chip set; wherein, the encapsulation layer contains metal nitride particle powder with light blocking function. Because the metal nitride particle powder has the function of blocking light and absorbing light, it can reduce the luminous efficiency of the device to meet the needs of low brightness, and the brightness of the LED light-emitting device can be adjusted by adding the mass ratio of the metal nitride particle powder to achieve different brightness. According to customer needs, it is suitable for different applications, and it is used in LED light-emitting devices, does not react with other dust, and has the characteristics of low cost and good yield.

Description

LED light-emitting device and packaging method thereof

The invention belongs to the technical field of light-emitting, and in particular relates to an LED light-emitting device and a packaging method thereof.

LED (Light Emitting Diode) is a light-emitting diode, which is a semiconductor solid-state light-emitting device, which uses a solid-state semiconductor wafer as a light-emitting material. As the LED market has higher and higher requirements for brightness, the currently used packaging chip materials are all improving to high brightness, but some markets that require low brightness applications cannot be satisfied.

General LED brightness specifications are achieved by light-emitting chips with gold wires and secondary packaging fluorescent glue after refraction. The brightness of white light products is suitable for general and high-brightness markets. For use in low-brightness white light markets, such as in-vehicle backlights and extremely low-brightness smart homes, the white light brightness requirements are weak and faint, indicating a warm and comfortable environment. At present, the low-brightness white light packaging technologies include: 1. Use a special black PPA (Polyphthalamide) support structure to block the output of white light. This method requires the use of a special support structure, which will cause a single product to be single The cost of using materials increases, and because the proportion of black PPA bracket structure can only be fixed, the range for adjusting the brightness of white light is limited, and all specifications cannot be applied; 2. Add 9~13μm toner in the white light package, black toner particles The smaller diameter is better to suppress the brightness, but when the black toner is mixed with the glue, the black toner will be unevenly stirred, so that the white light brightness distribution yield of the finished product will decrease as a whole during the mass production process; 3. The use of black carbon Powder white silicone resin glue, after adding black toner to the glue for a period of time, the toner will precipitate in the glue bottle, which will affect the viscosity of the glue, resulting in uneven brightness of the finished white light after the operation, and the distribution of the brightness of the finished white light. The yield is affected. In addition, in terms of different brightness, the black toner and glue need to be matched in different finished products, which leads to increased complexity and difficulty in the operation.

Therefore, the related technology needs to be improved.

The purpose of the present invention is to provide an LED light-emitting device and a packaging method thereof, which aims to solve the problems of cumbersome process, high cost and low yield of the existing LED light-emitting device to achieve low brightness.

For realizing the above-mentioned purpose of the invention, the technical scheme adopted in the present invention is as follows:

In a first aspect, the present invention provides an LED light-emitting device, the LED light-emitting device includes a support structure, an LED chip set fixed on the support structure, and an encapsulation layer covering the LED chip set; wherein, the encapsulation layer contains a metal nitride with light blocking effect particle powder.

In the LED light-emitting device provided by the present invention, an encapsulation layer containing metal nitride particle powder with light blocking effect is covered on the LED chip set. Because the metal nitride particle powder has the functions of blocking light and absorbing light, it can make The luminous efficiency of the device is reduced to between 5 and 90% of the original, which can meet the needs of low brightness. The present invention can adjust the brightness of the LED light-emitting device by adding the mass ratio of the metal nitride particle powder to meet the needs of different customers and adapt to different It is suitable for application occasions, and is used in LED light-emitting devices, does not react with other dust, and has the characteristics of low cost and good yield.

In a second aspect, the present invention provides a packaging method for an LED light-emitting device, comprising the following steps:

Fix the LED chip set on the bracket structure;

coating the LED chip set with a mixture comprising glue and metal nitride particle powder with light blocking effect; and

The cured mixture forms an encapsulation layer.

In the packaging method of the LED light-emitting device provided by the present invention, a packaging layer containing metal nitride particle powder with light blocking effect is sealed on the LED chip set. Because the metal nitride particle powder has the effect of blocking light and absorbing light, therefore It can reduce the luminous efficiency of the device, which can meet the needs of low brightness. The packaging method adjusts the brightness of the LED light-emitting device by adding the mass ratio of metal nitride particle powder to meet the needs of different customers. It has the advantages of simple process, low cost and good yield. Features.

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

In the present invention, the term "and/or" describes the relationship of related objects, indicating that there can be three relationships, for example, A and/or B, which can mean that A exists alone, A and B exist at the same time, and B exists alone . A and B can be singular or plural. The character "/" generally indicates that the contextual object is an "or" relationship.

A first aspect of the embodiments of the present invention provides an LED lighting device. As shown in FIG. 1 , the LED lighting device includes a bracket structure 1 , an LED chip set 2 fixed on the bracket structure 1 , and an encapsulation layer 3 covering the LED chip set 2 ; wherein , the encapsulation layer 3 contains metal nitride particle powder with light blocking function (not marked in the figure).

In the LED light-emitting device provided by the present invention, an encapsulation layer containing metal nitride particle powder with light blocking effect is covered on the LED chip set. Because the metal nitride particle powder has the functions of blocking light and absorbing light, it can make The luminous efficiency of the device is reduced to between 5 and 90% of the original, which can meet the needs of low brightness. The present invention can adjust the brightness of the LED light-emitting device by adding the mass ratio of the metal nitride particle powder to meet the needs of different customers and adapt to different It is suitable for application occasions, and is used in LED light-emitting devices, does not react with other dust, and has the characteristics of low cost and good yield.

In some embodiments, the material of the metal nitride particle powder includes aluminum nitride (AlN). In this embodiment, it is found through experiments that aluminum nitride is used in the encapsulation layer of the LED light-emitting device. Blocks and absorbs light, thereby reducing the brightness of the device. Aluminum nitride can be synthesized by aluminum powder at 800~1000℃ in ammonia or nitrogen atmosphere, and the product is white to gray-blue powder; or by the reaction of Al ₂ O ₃ -CN ₂ system at 1600~1750℃, the product is gray-white powder.

In some embodiments, the metal nitride particle powder is gray, such as gray aluminum nitride particle powder; gray has a strong light blocking effect, which can be used as reflection and refraction compared with white, and can be used as light absorption compared with black. Therefore, the gray metal nitride particle powder has better light blocking effect.

In some embodiments, the particle size of the metal nitride particle powder is 2-10 μm, such as 3-8 μm. After the metal nitride particle powder with smaller particle size is mixed with the glue in the support structure cup, the viscosity of the thinner glue will increase, but it should not be too viscous. Therefore, the particle size of the metal nitride particle powder needs to be tested. Control, so that it is more convenient for product materials to be dispensed in the operation process, thereby further improving the yield.

In some embodiments, the power of the LED lighting device is ≤ 0.1W. By reducing the brightness of LED lighting devices to meet the market demand for low power specifications.

In some embodiments, the LED chip set includes at least one of an orange chip, a red chip, a blue chip, and a green chip. Of course, it can also include LED chips of other light-emitting colors. The encapsulation layer is made of glue and metal nitride particle powder. It can be cured after mixing. For example, if the LED chip set is an orange light chip, the LED light-emitting device is an orange light device, which is mixed with glue and metal nitride particle powder and then glued and cured on the LED chip set to obtain an encapsulation layer to reduce the brightness of the orange light device; Or the LED chip set is a red light chip, and the LED light-emitting device is a red light device, which is mixed with glue and metal nitride particle powder and then glued and cured on the LED chip set to obtain an encapsulation layer to reduce the brightness of the red light device; or The LED chip set is a blue light chip, and the LED light-emitting device is a blue light device, which is mixed with glue and metal nitride particle powder and then glued and cured on the LED chip to obtain an encapsulation layer to reduce the brightness of the blue light device; or the LED chip set is green. The LED light-emitting device is a green light device, which is mixed with glue and metal nitride particle powder and then glued and cured on the LED chip set to obtain an encapsulation layer, so as to reduce the brightness of the green light device. Of course, the LED chip set may also include multiple LED chips for light mixing. Further, in the above-mentioned encapsulation layer, the mass ratio of glue, such as silicon glue, and metal nitride particle powder is 100:2~40, and the proportion of glue in the LED light-emitting device can reduce the luminous efficiency of the device. To the original 5~90%, the range can be adjusted by the brightness required by the customer.

In some embodiments, the LED chip set is a blue light chip, and the encapsulation layer is obtained by mixing glue, yellow phosphor powder and metal nitride particle powder and then curing. It enables the LED light-emitting device to achieve white light by adding yellow phosphor powder to the blue light chip. It is mixed with glue, yellow phosphor powder and metal nitride particle powder and then glued and cured on the LED chip set to obtain an encapsulation layer to reduce white light. The brightness of the device. Further, in the encapsulation layer of the white light device, the mass ratio of glue, such as silica gel, and metal nitride particle powder is 100:2~40, and the proportion of glue in the LED light-emitting device can improve the luminous efficiency of the device. It can be reduced to between 5 and 90% of the original, and the range can be adjusted by the brightness required by the customer.

A second aspect of the embodiments of the present invention provides a packaging method for an LED light-emitting device. As shown in FIG. 2 , the packaging method includes the following steps:

S01: Fix the LED chip set on the bracket structure;

S02: coating the LED chip set with a mixture comprising glue and metal nitride particle powder with light blocking effect; and

S03: Curing the mixture to form an encapsulation layer.

In the packaging method of the LED light-emitting device provided by the present invention, a packaging layer containing metal nitride particle powder with light blocking effect is sealed on the LED chip set. Because the metal nitride particle powder has the effect of blocking light and absorbing light, therefore It can reduce the luminous efficiency of the device, which can meet the needs of low brightness. The packaging method adjusts the brightness of the LED light-emitting device by adding the mass ratio of metal nitride particle powder to meet the needs of different customers, and has the advantages of simple process, low cost and good yield. specialty.

In some embodiments, the material of the metal nitride particle powder includes aluminum nitride; the metal nitride particle powder is gray; the particle size of the metal nitride particle powder is 2-10 μm. Reference is made to the above for the specific selection of metal nitride particle powders.

In some embodiments, the LED chip set includes at least one of orange light chips, red light chips, blue light chips and green light chips, and the step of preparing the mixture includes: mixing glue and metal nitride particle powder in a mass ratio of 100:2~ 40 Mix to get a mixture. After the mixture is obtained, the mixture is coated on the LED chip set, and then cured to obtain an encapsulation layer; if the LED chip set is an orange light chip, it is the packaging of the orange light device, and if the LED chip set is a red light chip, it is The package of the red light device, if the LED chip set is a blue light chip, is the package of the blue light device, and if the LED chip set is a green light chip, it is the package of the green light device; of course, the LED chip set can also include a variety of LED chips. Mixed light, it is mixed light package.

In some embodiments, the LED chip set is a blue light chip, and the step of preparing the mixture includes: mixing glue, yellow phosphor powder and metal nitride particle powder, wherein the mass ratio of glue and metal nitride particle powder is 100:2 ~40. After the mixture is obtained, the mixture is coated on the LED chip set, and then cured to obtain an encapsulation layer. That is, the packaging of the white light device is realized by adding a yellow phosphor to a blue light chip.

In the packaging method provided by the present invention, the LED chip group is fixed in the LED bracket structure cup, then gold wires are made, and the mixed metal nitride particle powder and glue (in the case of a white light device, further add yellow fluorescent powder) are added to the cup and then cured , to achieve sealed packaging. During the packaging process, the metal nitride particle powder does not react with other dust (such as phosphor powder), and the luminous efficiency of the device can be reduced to between 5 and 90% of the original; for example, no added The luminous brightness of the sealed package of the encapsulation layer of the metal nitride particle powder is 1000 MCD. After adding the metal nitride particle powder to encapsulate, the luminous brightness of the device can be reduced to a minimum of 50 MCD.

In the design of the present invention, a low-power LED light-emitting device with a power of ≤ 0.1W is preferred. Regardless of the packaging form, its product process is consistent with the existing powder preparation process. The brightness of LED light-emitting devices can be adjusted directly by adding 2%~40% by mass of metal nitride particle powder in the market such as backlight.

The following description will be given in conjunction with specific embodiments.

Example 1

An LED light-emitting device includes a bracket structure, an LED chip set fixed on the bracket structure, and an encapsulation layer covering the LED chip set; wherein, the LED chip set is an orange chip with a peak wavelength of about 602 nm, and the encapsulation layer is made of glue and aluminum nitride particles. The powders are prepared by mixing in different proportions.

Table 1 is the test data corresponding to different proportions of aluminum nitride particle powder in the LED light-emitting device of the same specification of this embodiment. The glue is calculated as 10g, and the comparison of the result data of different aluminum nitride particle powder proportions shows that 10g of glue: The LED light-emitting device with the ratio of 3g aluminum nitride powder (that is, the aluminum nitride powder accounts for 30%) reduces the brightness by 90%, and the effect is the most significant. Table 1 Glue to Aluminum Nitride Ratio 10:0 (i.e. no aluminum nitride) 10:0.3 10:0.6 10:0.9 10:1.2 10:1.5 10:3 parameter IF VF IV WL IF VF IV WL IF VF IV WL IF VF IV WL IV IV IV 1 20 2.06 241.1 602.3 20 2.06 190.8 602.5 20 2.06 148.8 602.5 20 2.06 119.0 602.5 93.9 74.1 24.5 2 20 2.06 245.9 602.3 20 2.06 195.8 602.4 20 2.06 154.8 602.5 20 2.06 112.3 602.6 88.6 69.9 23.1 3 20 2.06 247.6 602.3 20 2.06 192.7 602.4 20 2.06 150.7 602.5 20 2.06 116.0 602.5 91.5 72.2 23.9 4 20 2.06 242.0 602.3 20 2.06 191.1 602.5 20 2.06 150.2 602.5 20 2.06 129.0 602.5 101.7 80.3 26.5 5 20 2.06 249.2 602.2 20 2.06 188.1 602.4 20 2.06 155.5 602.5 20 2.06 118.3 602.5 93.3 73.6 24.3 AVG 20 2.06 245.14 602.27 20 2.06 191.7 602.43 20 2.06 152 602.48 20 2.06 118.89 602.51 93.9 74.1 24.5

In Table 1: IF is the forward current, VF is the forward voltage, IV is the luminous intensity, WL is the wavelength, and AVG is the average value.

Example 2

An LED light-emitting device includes a bracket structure, an LED chip set fixed on the bracket structure, and an encapsulation layer covering the LED chip set; wherein, the LED chip set is a blue light chip with a peak wavelength of about 461-463 nm, and the encapsulation layer is made of glue and nitride. The aluminum particle powder is prepared by mixing in different proportions.

Table 2 is the test data corresponding to different proportions of aluminum nitride particle powder in the LED light-emitting device of the same specification of this example. The glue is calculated as 10g. The comparison of the result data of different aluminum nitride particle powder proportions shows that 10g of glue: 5g aluminum nitride powder (that is, aluminum nitride powder accounts for 50%) of the LED light-emitting device, the brightness is reduced by 99%, but the aluminum nitride powder in this proportion accounts for half of the glue weight, so there is a glue dispensing process during operation. Therefore, considering the process, the upper limit of the specification can be positioned as 10:4 (that is, the weight ratio of aluminum nitride powder is 40%). Table 2 Glue to Aluminum Nitride Ratio 10:0 (i.e. no aluminum nitride) 10:1.5 10:3 10:5 IF VF IV WL IF VF IV WL IF VF IV WL IF VF IV WL 1 20 3.25 230.0 461.7 20 3.28 63.5 462.3 20 3.27 14.1 462.7 20 3.29 2.0 463.0 2 20 3.3 234.0 461.4 20 3.29 63.2 462.3 20 3.29 14.3 462.6 20 3.3 1.9 463.0 3 20 3.3 229.3 461.3 20 3.27 60.9 462.3 20 3.29 15.9 462.6 20 3.29 2.7 462.9 4 20 3.29 233.1 461.5 20 3.28 67.8 462.4 20 3.28 14.7 462.8 20 3.29 2.9 462.9 5 20 3.29 229.2 461.5 20 3.29 63.6 462.1 20 3.28 15.5 462.6 20 3.29 2.1 463.1 AVG 20 3.29 231.1 461.5 20 3.28 63.8 462.3 20 3.28 14.9 462.6 20 3.29 2.3 463

In Table 2: IF is the forward current, VF is the forward voltage, IV is the luminous intensity, WL is the wavelength, and AVG is the average value.

Example 3

An LED light-emitting device comprises a bracket structure, an LED chip fixed on the bracket structure, and an encapsulation layer covering the LED chip group; wherein, the LED chip group is a blue light chip, and the encapsulation layer is mixed with glue, yellow phosphor powder and aluminum nitride particle powder The preparation is obtained, and the mass ratio of the glue and the aluminum nitride particle powder is 10:4, and the LED light-emitting device realizes white light through the blue light chip and the yellow phosphor powder.

Table 3 shows the test data corresponding to the LED light-emitting device of the same specification in this example, and the white light LED light-emitting device without aluminum nitride powder. Because the addition of 40% aluminum nitride powder in this example can significantly reduce the luminous brightness. table 3 10:0 (i.e. no aluminum nitride) 10:4 IF VF IV X Y IF VF IV X Y 1 20 3.24 1162.96 0.2445 0.2314 1 20 3.29 267.09 0.24 0.222 2 20 3.26 1189.76 0.2465 0.2324 2 20 3.26 267.71 0.2328 0.2077 3 20 3.22 1139.56 0.2426 0.227 3 20 3.29 268.58 0.2281 0.199 4 20 3.24 1148.45 0.2413 0.2235 4 20 3.29 283.54 0.2419 0.2247 5 20 3.27 1177.74 0.2433 0.2258 5 20 3.27 270.9 0.2339 0.2104 AVG 20 3.25 1163.69 0.2436 0.228 AVG 20 3.28 271.57 0.2353 0.2128

In Table 3: IF is the forward current, VF is the forward voltage, IV is the luminous intensity, X/Y is the color coordinate, and AVG is the average value.

In addition, compared with the existing black-shell LED encapsulation bracket structure (without aluminum nitride powder), although the current black-shell LED encapsulation bracket structure can reduce the brightness by 76%, due to the different requirements for brightness specifications in different application fields, black-shell LEDs The specification and brightness of the encapsulated bracket structure cannot follow the change, and the special and unique structure of the black-shell LED encapsulated bracket structure has the defects of expensive unit price and single specification, which is difficult to promote.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

1: Bracket structure 2: LED Chipset 3: Encapsulation layer S01, S02, S03: Steps

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those with ordinary knowledge in the technical field, other drawings can also be obtained from these drawings without any creative effort. 1 is a schematic structural diagram of an LED light-emitting device provided by an embodiment of the present invention; FIG. 2 is a schematic flowchart of a packaging method for an LED light emitting device provided by an embodiment of the present invention.

1: Bracket structure

2: LED Chipset

3: Encapsulation layer

Claims (8)

An LED light-emitting device, the LED light-emitting device comprises a support structure, an LED chip set fixed on the support structure, and an encapsulation layer covering the LED chip set; wherein, the encapsulation layer contains a metal nitrogen with light blocking function Compound particle powder; wherein: the material of the metal nitride particle powder comprises aluminum nitride; and/or the metal nitride particle powder is gray; and/or the particle size of the metal nitride particle powder is 2-10 μm. The LED lighting device according to claim 1, wherein the power of the LED lighting device

0.1W. The LED light-emitting device according to claim 1, wherein the LED chip set comprises at least one of an orange chip, a red chip, a blue chip and a green chip, and the encapsulation layer is mixed with glue and the metal nitride particle powder. solidified. The LED light-emitting device according to claim 1, wherein the LED chip set is a blue light chip, and the encapsulation layer is obtained by mixing glue, yellow phosphor powder and the metal nitride particle powder and then curing. The LED light-emitting device according to claim 3 or claim 4, wherein the mass ratio of the glue and the metal nitride particle powder is 100:2-40. A packaging method for an LED light-emitting device, comprising the following steps: fixing an LED chip set on a support structure; coating a mixture comprising a glue and a metal nitride particle powder with light blocking effect on the LED chip set ;as well as The mixture is cured to form an encapsulation layer; wherein: the material of the metal nitride particle powder comprises aluminum nitride; and/or the metal nitride particle powder is gray; and/or the particle size of the metal nitride particle powder is 2~10μm. The packaging method for an LED light-emitting device as claimed in claim 6, wherein the LED chip set comprises at least one of an orange light chip, a red light chip, a blue light chip and a green light chip, and the step of preparing the mixture comprises: the glue and the The metal nitride particle powder is mixed in a mass ratio of 100:2-40. The packaging method for an LED light-emitting device according to claim 6, wherein the LED chip set is a blue light chip, and the step of preparing the mixture comprises: mixing the glue, the yellow phosphor and the metal nitride particle powder, wherein the The mass ratio of the glue and the metal nitride particle powder is 100:2~40.

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