TWI757982B - Optical recognition nozzle system - Google Patents

Optical recognition nozzle system Download PDF

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TWI757982B
TWI757982B TW109140659A TW109140659A TWI757982B TW I757982 B TWI757982 B TW I757982B TW 109140659 A TW109140659 A TW 109140659A TW 109140659 A TW109140659 A TW 109140659A TW I757982 B TWI757982 B TW I757982B
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circuit board
light
suction nozzle
module
nozzle system
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TW109140659A
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Chinese (zh)
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TW202222143A (en
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李彥志
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聯策科技股份有限公司
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Abstract

An optical recognition nozzle system includes a plurality of nozzle structures, a CCD imaging module and a control processor. Each nozzle structure includes a nozzle body and a light spot marking module. The light spot marking module includes a power source, a luminous light source, a focusing module and a protective glass. The focusing module is used to adjust to make the light emission parallel or diffuse. The CCD imaging module is used to take pictures of the circuit board. The light is emitted to the circuit board through the luminous light source of the light spot marking module. After the image of the circuit board is captured by the CCD imaging module, the control processor automatically judges whether the multiple light spots on the circuit board are in the right position through the image.

Description

光學辨識吸嘴系統Optical identification nozzle system

一種吸嘴,尤指一種具有光學辨識之吸嘴系統。A nozzle, especially a nozzle system with optical recognition.

按,印刷電路板(Printed circuit board,PCB),可作為電子元件的支撐體,其利用設計好之金屬導體線路即可使複數個電子元件透過插設之方式相互連接,不但可減少實體電路的設置以節省空間,讓印刷電路板之表面積依需求縮減到最小,進而符合目前電子產品體積日趨微型化之趨勢之外,印刷電路板透過印刷製程可大量的生產,藉此可降低製作成本,以更符合電子產業的經濟效益,如此使得印刷電路板在目前電子相關產業中已成為不可或缺之必要電子部件,其應用可包含設置在電腦、智慧型手機等裝置中。Press, the printed circuit board (PCB) can be used as a support for electronic components. It can use the designed metal conductor lines to connect multiple electronic components to each other by means of insertion, which not only reduces the number of physical circuits. Set to save space, so that the surface area of the printed circuit board can be reduced to the minimum according to the demand, which is in line with the current trend of miniaturization of the volume of electronic products. It is more in line with the economic benefits of the electronic industry, so that the printed circuit board has become an indispensable and necessary electronic component in the current electronic related industry, and its application can be included in devices such as computers and smart phones.

目前電路板在進行製程作業時,大多係透過吸取裝置以負壓抽取之方式利用吸嘴組件來吸取電路板以進行移動,然而,目前習知的吸取裝置並無法自動地依據電路板之所在來微調吸嘴組件至較佳之吸附位置,並且無法自動地轉向吸嘴組件來變更其工作面,如此吸取裝置在製程中的工作效率往往不如預期。是以,如何解決上述現有技術之問題與缺失,即為相關業者所亟欲研發之課題所在。At present, when the circuit board is in the process of operation, most of the suction devices use the suction nozzle assembly to suck the circuit board for movement by means of negative pressure extraction. However, the current conventional suction device cannot automatically determine the location of the circuit board. Fine-tune the suction nozzle assembly to a better suction position, and it is impossible to automatically turn the suction nozzle assembly to change its working surface, so the working efficiency of the suction device in the process is often not as expected. Therefore, how to solve the above-mentioned problems and deficiencies of the prior art is the subject that the relevant industry is eager to develop.

本發明提出一種光學辨識吸嘴系統,能夠大幅地減少生產成本與人工成本。The present invention provides an optical identification nozzle system, which can greatly reduce production cost and labor cost.

本發明提供一種光學辨識吸嘴系統,用於辨識電路板與吸附電路板,光學辨識吸嘴系統包括多個吸嘴結構、CCD取像模組與控制處理器。每一個吸嘴結構包括吸嘴本體與光點標示模組。光點標示模組包括電源、發光光源、聚焦模組與保護玻璃。吸嘴本體具有吸氣導管,光點標示模組設置於吸嘴本體上,電源用以提供電力,發光光源連接至電源,發光光源用以發射光線。聚焦模組用以調整讓光線平行或擴散發出。聚焦模組設置於發光光源與保護玻璃之間。CCD取像模組用以對電路板進行拍照取像。控制處理器連接至吸嘴結構與CCD取像模組。透過光點標示模組之發光光源發出光線至電路板,之後由CCD取像模組對電路板進行取像後,再由控制處理器透過影像來自動化判斷電路板上之多個光點是否在合適位置上。The invention provides an optical identification suction nozzle system for identifying circuit boards and adsorbing circuit boards. The optical identification suction nozzle system includes a plurality of suction nozzle structures, a CCD image capturing module and a control processor. Each suction nozzle structure includes a suction nozzle body and a light spot marking module. The light point marking module includes a power supply, a light source, a focusing module and a protective glass. The suction nozzle body has a suction duct, the light point marking module is arranged on the suction nozzle body, the power source is used for supplying power, the light-emitting light source is connected to the power source, and the light-emitting light source is used for emitting light. The focusing module is used to adjust the light to be parallel or diffuse. The focusing module is arranged between the light-emitting light source and the protective glass. The CCD image capturing module is used to take pictures of the circuit board. The control processor is connected to the suction nozzle structure and the CCD image capturing module. The light source of the light spot marking module emits light to the circuit board, and then the CCD image capturing module captures the image of the circuit board, and then the control processor automatically judges whether the multiple light spots on the circuit board are on the circuit board through the image. in a suitable location.

在本發明之一實施例中,如果控制處理器判斷電路板上之光點在合適位置上,則吸嘴結構往下移動來對電路板進行吸附動作。In an embodiment of the present invention, if the control processor determines that the light spot on the circuit board is in a proper position, the suction nozzle structure moves downward to perform suction action on the circuit board.

在本發明之一實施例中,如果控制處理器判斷電路板上之光點不在合適的位置上,則根據光點的標示來將吸嘴結構移動到合適的位置。In an embodiment of the present invention, if the control processor determines that the light spot on the circuit board is not in a proper position, the suction nozzle structure is moved to a proper position according to the marking of the light spot.

在本發明之一實施例中,當光點標示模組發出光線至電路板後,透過人眼來辨識電路板上之該些光點是否在合適位置上。In an embodiment of the present invention, after the light spot marking module emits light to the circuit board, whether the light spots on the circuit board are in proper positions can be identified through human eyes.

在本發明之一實施例中,吸嘴結構呈矩陣式排列,並且與電路板平行。In an embodiment of the present invention, the suction nozzle structures are arranged in a matrix and parallel to the circuit board.

在本發明之一實施例中,吸嘴結構之彼此位置任意排列,並且與該電路板平行。In an embodiment of the present invention, the suction nozzle structures are arranged at random with each other and parallel to the circuit board.

在本發明之一實施例中,發光光源所發射的光線為一般強光或雷射光源。In an embodiment of the present invention, the light emitted by the light-emitting light source is a general strong light or a laser light source.

綜上所述,本發明之光學辨識吸嘴系統能夠達到以下功效: 1.        能夠快速判斷電路板是否在合適位置上。 2.        能夠更有效率且精準地定位且吸附電路板,以完成相關作業。 3.        能夠節省生產成本,與人工成本。 To sum up, the optical identification nozzle system of the present invention can achieve the following effects: 1. Can quickly determine whether the circuit board is in the proper position. 2. Can more efficiently and accurately locate and adsorb circuit boards to complete related operations. 3. It can save production costs and labor costs.

底下藉由具體實施例詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The following describes in detail with specific embodiments, when it is easier to understand the purpose, technical content, characteristics and effects of the present invention.

為能解決現有人工移動吸嘴結構來對準電路板位置的問題,發明人經過多年的研究及開發,據以改善現有產品的詬病,後續將詳細介紹本發明如何以一種光學辨識吸嘴系統來達到最有效率的功能訴求。In order to solve the problem of aligning the position of the circuit board by manually moving the suction nozzle structure, the inventor has made many years of research and development to improve the criticism of the existing products. To achieve the most efficient functional demands.

請參閱第一圖至第四圖,第一圖係為本發明的光學辨識吸嘴系統之示意圖。第二圖係為本發明的光學辨識吸嘴系統之光點照射至電路板上之示意圖。第三圖係為本發明的光學辨識吸嘴系統之吸嘴結構示意圖。第四圖係為本發明的光學辨識吸嘴系統之吸嘴結構之詳細示意圖。電路板在進行製程作業時,大多係透過吸取裝置以負壓抽取之方式利用吸嘴組件來吸取電路板以進行移動,然而,目前習知的吸取裝置並無法自動地依據電路板之所在來微調吸嘴組件至較佳之吸附位置,並且無法自動地轉向吸嘴組件來變更其工作面,如此吸取裝置在製程中的工作效率往往不如預期。因此,本發明實施例提出一光學辨識吸嘴系統能夠有效地解決上述之問題,並且能夠吸附到電路板的較佳位置。Please refer to the first figure to the fourth figure, the first figure is a schematic diagram of the optical identification nozzle system of the present invention. The second figure is a schematic diagram of the light spot of the optical recognition nozzle system of the present invention irradiating the circuit board. The third figure is a schematic diagram of the nozzle structure of the optical identification nozzle system of the present invention. The fourth figure is a detailed schematic diagram of the nozzle structure of the optical identification nozzle system of the present invention. When the circuit board is in the process of operation, most of the suction devices use the suction nozzle assembly to suck the circuit board for movement by means of negative pressure extraction. However, the conventional suction device cannot automatically adjust according to the location of the circuit board. The suction nozzle assembly is in a better suction position, and the suction nozzle assembly cannot be automatically turned to change its working surface, so the working efficiency of the suction device in the process is often not as expected. Therefore, the embodiment of the present invention provides an optical recognition nozzle system that can effectively solve the above problems and can be adsorbed to a better position on the circuit board.

如圖1~圖4所示,本發明所提供之光學辨識吸嘴系統100,用於辨識電路板140與吸附電路板140,其中每一電路板140間用會用隔紙150予以分開。光學辨識吸嘴系統100包括多個吸嘴結構110、CCD取像模組120與控制處理器130。每一個吸嘴結構110包括吸嘴本體112與光點標示模組114。光學標示模組114主要用於發射出光線來標示電路板140,以了解整個吸嘴結構110是否與電路板140完成對位,以下會有更進一步的說明。As shown in FIGS. 1-4 , the optical identification nozzle system 100 provided by the present invention is used for identifying the circuit board 140 and attracting the circuit board 140 , wherein each circuit board 140 is separated by a separator 150 . The optical identification nozzle system 100 includes a plurality of nozzle structures 110 , a CCD imaging module 120 and a control processor 130 . Each suction nozzle structure 110 includes a suction nozzle body 112 and a light spot marking module 114 . The optical marking module 114 is mainly used for emitting light to mark the circuit board 140 , so as to know whether the entire suction nozzle structure 110 is aligned with the circuit board 140 , which will be further described below.

如圖四所示,光點標示模組114包括電源1141、發光光源1142、聚焦模組1143與保護玻璃1144。吸嘴本體110具有吸氣導管1121,光點標示模組114設置於吸嘴本體112上,電源1141用以提供電力,發光光源1142連接至電源1141,發光光源1142用以發射光線LK。聚焦模組1143用以調整讓光線LK平行或擴散發出。聚焦模組1143設置於發光光源1142與保護玻璃1144之間。CCD取像模組120用以對電路板LK進行拍照取像。控制處理器130連接至吸嘴結構110與CCD取像模組120。本發明實施例透過光點標示模組114之發光光源1142發出光線LK至電路板140,之後由CCD取像模組120對電路板140進行取像後,再由控制處理器130透過CCD取像模組120所擷取的電路板140的影像來自動化判斷電路板LK上之多個光點LD是否在合適位置上。在本發明實施例中,吸嘴結構110呈矩陣式排列,並且與電路板140平行,於另一實施例中,吸嘴結構110之彼此位置任意排列,並且與電路板140平行。此外,在本發明實施中,發光光源1142所發射的光線LK為一般強光或雷射光源。As shown in FIG. 4 , the light spot marking module 114 includes a power source 1141 , a light source 1142 , a focusing module 1143 and a protective glass 1144 . The suction nozzle body 110 has a suction duct 1121 , the light point indicator module 114 is disposed on the suction nozzle body 112 , the power source 1141 is used to provide power, the light source 1142 is connected to the power source 1141 , and the light source 1142 is used to emit light LK. The focusing module 1143 is used to adjust the light LK to be emitted in parallel or diffusely. The focusing module 1143 is disposed between the light-emitting light source 1142 and the protective glass 1144 . The CCD image capturing module 120 is used for taking pictures of the circuit board LK. The control processor 130 is connected to the suction nozzle structure 110 and the CCD imaging module 120 . In the embodiment of the present invention, light LK is emitted to the circuit board 140 through the light-emitting light source 1142 of the light spot indicator module 114 , and then the circuit board 140 is imaged by the CCD imaging module 120 , and then the image is captured by the control processor 130 through the CCD The image of the circuit board 140 captured by the module 120 is used to automatically determine whether the plurality of light spots LD on the circuit board LK are in proper positions. In the embodiment of the present invention, the suction nozzle structures 110 are arranged in a matrix and parallel to the circuit board 140 . In another embodiment, the suction nozzle structures 110 are randomly arranged and parallel to the circuit board 140 . In addition, in the implementation of the present invention, the light LK emitted by the light-emitting light source 1142 is a general strong light or a laser light source.

如果控制處理器130判斷電路板140上之光點LD在合適位置上,則吸嘴結構110往下移動來對電路板140進行吸附動作,其中吸嘴本體具有一吸氣導管1121,氣流會從下往上經由吸氣導管1121而流動。如果控制處理器130判斷電路板140上之光點LD不在合適的位置上,則根據影像上光點LD的標示且透過機構調整來將吸嘴結構110移動到合適的位置,再進一步地使用CCD取像模組120對電路板140進行取像,之後由控制處理器130透過CCD取像模組120所擷取的電路板140的影像來自動化判斷電路板LK上之多個光點LD是否在合適位置上,直到位置合適,以避免吸附到隔紙150。If the control processor 130 determines that the light spot LD on the circuit board 140 is in a proper position, the suction nozzle structure 110 moves downward to perform suction action on the circuit board 140, wherein the suction nozzle body has an suction duct 1121, and the air flow will flow from It flows through the suction duct 1121 from bottom to top. If the control processor 130 judges that the light spot LD on the circuit board 140 is not in the proper position, then according to the mark of the light spot LD on the image and through the mechanism adjustment, the suction nozzle structure 110 is moved to the proper position, and then the CCD is further used. The imaging module 120 captures an image of the circuit board 140 , and then the control processor 130 automatically determines whether the plurality of light spots LD on the circuit board LK are in the circuit board 140 through the image of the circuit board 140 captured by the CCD imaging module 120 . in a suitable position until the position is suitable to avoid adsorption to the separator 150 .

也就是說,由上述可知,本發明實施例之光學辨識吸嘴系統100主要透過光點標示模組與CCD取像模組120來對位所要吸附的電路板140,以完成吸嘴結構110與電路板140之對位,以避免過去所存在的諸多問題。That is to say, as can be seen from the above, the optical recognition nozzle system 100 of the embodiment of the present invention mainly aligns the circuit board 140 to be adsorbed through the light spot marking module and the CCD imaging module 120 to complete the nozzle structure 110 and the Alignment of the circuit board 140 to avoid many problems in the past.

此外,在另一實施例中,當光點標示模組114發出光線LK至電路板140後,可透過人眼來辨識電路板140上之多個光點LD是否在合適位置上。如果人工肉眼判斷電路板140上之光點LD在合適位置上,則吸嘴結構110往下移動來對電路板140進行吸附動作。如果人工肉眼判斷電路板140上之光點LD不在合適的位置上,則會根據光點LD的標示來手動地將吸嘴結構110移動到合適的位置。In addition, in another embodiment, after the light spot indicator module 114 emits the light LK to the circuit board 140 , whether the plurality of light spots LD on the circuit board 140 are in proper positions can be identified by human eyes. If the light spot LD on the circuit board 140 is judged by human eyes to be at a proper position, the suction nozzle structure 110 moves downward to perform suction action on the circuit board 140 . If it is judged by human eyes that the light spot LD on the circuit board 140 is not in a proper position, the suction nozzle structure 110 will be manually moved to a proper position according to the indication of the light spot LD.

綜上所述,本發明之光學辨識吸嘴系統能夠達到以下功效: 1.        能夠快速判斷電路板是否在合適位置上。 2.        能夠更有效率且精準地定位且吸附電路板,以完成相關作業。 3.        能夠節省生產成本,與人工成本。 To sum up, the optical identification nozzle system of the present invention can achieve the following effects: 1. Can quickly determine whether the circuit board is in the proper position. 2. Can more efficiently and accurately locate and adsorb circuit boards to complete related operations. 3. It can save production costs and labor costs.

唯以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍。故即凡依本發明申請範圍所述之特徵及精神所為之均等變化或修飾,均應包括於本發明之申請專利範圍內。Only the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent changes or modifications made in accordance with the features and spirits described in the scope of the application of the present invention shall be included in the scope of the application for patent of the present invention.

100:光學辨識吸嘴系統 110:吸嘴結構 112:吸嘴本體 1121:吸氣導管 114:光點標示模組 1141:電源 1142:發光光源 1143:聚焦模組 1144:保護玻璃 120:CCD取像模組 130:控制處理器 140:電路板 150:隔紙 LD:光點 LK:光線 100: Optical recognition nozzle system 110: Nozzle structure 112: Nozzle body 1121: Inspiratory catheter 114: light point marking module 1141: Power 1142: Luminous light source 1143: Focus Module 1144: Protective glass 120:CCD camera module 130: Control Processor 140: circuit board 150: Separator LD: light spot LK: light

第一圖係為本發明的光學辨識吸嘴系統之示意圖。 第二圖係為本發明的光學辨識吸嘴系統之光點照射至電路板上之示意圖。 第三圖係為本發明的光學辨識吸嘴系統之吸嘴結構示意圖。 第四圖係為本發明的光學辨識吸嘴系統之吸嘴結構之詳細示意圖。 The first figure is a schematic diagram of the optical identification nozzle system of the present invention. The second figure is a schematic diagram of the light spot of the optical recognition nozzle system of the present invention irradiating the circuit board. The third figure is a schematic diagram of the nozzle structure of the optical identification nozzle system of the present invention. The fourth figure is a detailed schematic diagram of the nozzle structure of the optical identification nozzle system of the present invention.

100:光學辨識吸嘴系統 100: Optical recognition nozzle system

110:吸嘴結構 110: Nozzle structure

120:CCD取像模組 120:CCD camera module

130:控制處理器 130: Control Processor

140:電路板 140: circuit board

150:隔紙 150: Separator

Claims (7)

一種光學辨識吸嘴系統,用於辨識一電路板與吸附該電路板,該光學辨識吸嘴系統包括: 多個吸嘴結構,其中每一該吸嘴結構包括: 一吸嘴本體,具有一吸氣導管;以及 一光點標示模組,設置於吸嘴本體上,該光點標示模組包括: 一電源,用以提供電力; 一發光光源,連接至該電源,該發光光源用以發射光線; 一聚焦模組,用以調整讓光線平行或擴散發出;以及 一保護玻璃,其中聚焦模組設置於該發光光源與該保護玻璃之間; 一CCD取像模組,用以對該電路板進行拍照取像;以及 一控制處理器,連接至該些吸嘴結構與該CCD取像模組, 其中透過光點標示模組之該發光光源發出光線至該電路板,之後由該CCD取像模組對該電路板進行取像後,再由該控制處理器透過影像來自動化判斷該電路板上之多個光點是否在合適位置上。 An optical identification nozzle system for identifying a circuit board and adsorbing the circuit board, the optical identification nozzle system comprising: A plurality of suction nozzle structures, wherein each of the suction nozzle structures includes: a suction nozzle body with a suction duct; and A light spot marking module is arranged on the nozzle body, and the light spot marking module includes: a power source for providing electricity; a light-emitting light source, connected to the power supply, the light-emitting light source is used for emitting light; a focusing module for adjusting the light to be emitted in parallel or diffusely; and a protective glass, wherein the focusing module is arranged between the light-emitting light source and the protective glass; a CCD image capturing module for taking pictures of the circuit board; and a control processor, connected to the suction nozzle structures and the CCD imaging module, The light-emitting light source passing through the light spot marking module emits light to the circuit board, and then the CCD imaging module captures the image of the circuit board, and then the control processor automatically judges the circuit board through the image. Whether the multiple light spots are in the proper position. 如請求項1所述之光學辨識吸嘴系統,其中如果該控制處理器判斷該電路板上之該些光點在合適位置上,則該吸嘴結構往下移動來對該電路板進行吸附動作。The optical recognition suction nozzle system of claim 1, wherein if the control processor determines that the light spots on the circuit board are in proper positions, the suction nozzle structure moves down to perform suction action on the circuit board . 如請求項1所述之光學辨識吸嘴系統,其中如果該控制處理器判斷該電路板上之該些光點不在合適的位置上,則根據該些光點的標示來將該些吸嘴結構移動到合適的位置。The optical recognition nozzle system according to claim 1, wherein if the control processor determines that the light spots on the circuit board are not in proper positions, the nozzle structures are configured according to the marks of the light spots Move to a suitable location. 如請求項1所述之光學辨識吸嘴系統,其中當該光點標示模組發出光線至該電路板後,透過人眼來辨識該電路板上之該些光點是否在合適位置上。The optical recognition nozzle system according to claim 1, wherein after the light spot marking module emits light to the circuit board, whether the light spots on the circuit board are in proper positions can be identified through human eyes. 如請求項1所述之光學辨識吸嘴系統,其中該些吸嘴結構呈矩陣式排列,並且與該電路板平行。The optical identification suction nozzle system according to claim 1, wherein the suction nozzle structures are arranged in a matrix and parallel to the circuit board. 如請求項1所述之光學辨識吸嘴系統,其中該些吸嘴結構之彼此位置任意排列,並且與該電路板平行。The optical identification suction nozzle system according to claim 1, wherein the suction nozzle structures are arranged at random with each other and parallel to the circuit board. 如請求項1所述之光學辨識吸嘴系統,其中該發光光源所發射的光線為一般強光或雷射光源。The optical identification nozzle system according to claim 1, wherein the light emitted by the light-emitting light source is a general strong light or a laser light source.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1997266A (en) * 2006-01-05 2007-07-11 辜省三 Resetting method for bad cascaded printed circuit board and its system
TW200814873A (en) * 2006-09-08 2008-03-16 chen-xiang Yan Device and method for positioning and assembling circuit boards
TW201643408A (en) * 2015-04-12 2016-12-16 臺醫光電科技股份有限公司 Device and method for alignment
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TW201833627A (en) * 2017-03-07 2018-09-16 美商伊路米納有限公司 Systems and methods for improved focus tracking using a hybrid mode light source
TW201904377A (en) * 2017-06-01 2019-01-16 英錡科技股份有限公司 Vacuum suction chip bonding method operating a flexible plate vacuum suction platform collaboratively with an automatic optical inspection machine platform to achieve a positioning function

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1997266A (en) * 2006-01-05 2007-07-11 辜省三 Resetting method for bad cascaded printed circuit board and its system
TW200814873A (en) * 2006-09-08 2008-03-16 chen-xiang Yan Device and method for positioning and assembling circuit boards
TW201643408A (en) * 2015-04-12 2016-12-16 臺醫光電科技股份有限公司 Device and method for alignment
TW201710617A (en) * 2015-05-26 2017-03-16 皇家飛利浦有限公司 Lighting device with multiple-focus mode
TW201833627A (en) * 2017-03-07 2018-09-16 美商伊路米納有限公司 Systems and methods for improved focus tracking using a hybrid mode light source
TW201904377A (en) * 2017-06-01 2019-01-16 英錡科技股份有限公司 Vacuum suction chip bonding method operating a flexible plate vacuum suction platform collaboratively with an automatic optical inspection machine platform to achieve a positioning function

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