TWI757314B - 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法 - Google Patents

基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法 Download PDF

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Publication number
TWI757314B
TWI757314B TW106125097A TW106125097A TWI757314B TW I757314 B TWI757314 B TW I757314B TW 106125097 A TW106125097 A TW 106125097A TW 106125097 A TW106125097 A TW 106125097A TW I757314 B TWI757314 B TW I757314B
Authority
TW
Taiwan
Prior art keywords
substrate
base plate
plate
array
droplets
Prior art date
Application number
TW106125097A
Other languages
English (en)
Chinese (zh)
Other versions
TW201812429A (zh
Inventor
保羅 依潔梅爾特 史佛爾斯
傑瑞 約翰尼斯 馬汀納斯 佩斯特
Original Assignee
荷蘭商Ａｓｍｌ荷蘭公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/222,705 external-priority patent/US9829804B1/en
Priority claimed from US15/222,708 external-priority patent/US20180033586A1/en
Application filed by 荷蘭商Ａｓｍｌ荷蘭公司 filed Critical 荷蘭商Ａｓｍｌ荷蘭公司
Publication of TW201812429A publication Critical patent/TW201812429A/zh
Application granted granted Critical
Publication of TWI757314B publication Critical patent/TWI757314B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Sampling And Sample Adjustment (AREA)
TW106125097A 2016-07-28 2017-07-26 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法 TWI757314B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15/222,705 US9829804B1 (en) 2016-07-28 2016-07-28 Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
US15/222,708 US20180033586A1 (en) 2016-07-28 2016-07-28 Apparatus and method for processing or imaging a sample
US15/222,708 2016-07-28
US15/222,705 2016-07-28

Publications (2)

Publication Number Publication Date
TW201812429A TW201812429A (zh) 2018-04-01
TWI757314B true TWI757314B (zh) 2022-03-11

Family

ID=61016195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106125097A TWI757314B (zh) 2016-07-28 2017-07-26 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法

Country Status (5)

Country Link
JP (2) JP6951415B2 (ja)
KR (2) KR102580712B1 (ja)
CN (1) CN109844927B (ja)
TW (1) TWI757314B (ja)
WO (1) WO2018021581A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114302514B (zh) * 2021-12-27 2022-09-27 哈尔滨工业大学 集成交叉式双针板热沉的电热耦合温控装置及其控温方法

Citations (7)

* Cited by examiner, † Cited by third party
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US20030161088A1 (en) * 2002-01-28 2003-08-28 Kyocera Corporation Electrostatic chuck for holding wafer
US20030228772A1 (en) * 2002-06-05 2003-12-11 Cowans Kenneth W. Lateral temperature equalizing system for large area surfaces during processing
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080024743A1 (en) * 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
JP2008311595A (ja) * 2007-06-18 2008-12-25 Canon Inc ステージ装置、露光装置およびデバイス製造方法
TWI319518B (en) * 2004-10-22 2010-01-11 Asml Netherlands Bv Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
US20140017613A1 (en) * 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

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Publication number Priority date Publication date Assignee Title
JP2000252288A (ja) 1999-03-04 2000-09-14 Komatsu Ltd 基板保持装置
KR100351049B1 (ko) 1999-07-26 2002-09-09 삼성전자 주식회사 웨이퍼 가열 방법 및 이를 적용한 장치
US6470108B1 (en) * 2000-04-26 2002-10-22 Tini Alloy Company Optical switching device and method
US7156951B1 (en) * 2002-06-21 2007-01-02 Lam Research Corporation Multiple zone gas distribution apparatus for thermal control of semiconductor wafer
US20050128449A1 (en) * 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
JP4761948B2 (ja) 2004-12-01 2011-08-31 京セラ株式会社 炭化珪素質焼結及びそれを用いた半導体製造装置用部品
JP4462143B2 (ja) 2005-07-29 2010-05-12 住友電気工業株式会社 ウェハ保持体及びウェハ保持体を備えたウェハプローバ
US7528349B1 (en) * 2006-07-25 2009-05-05 Kla-Tencor Technologies Corporation Temperature stabilization for substrate processing
WO2008013443A2 (en) * 2006-07-28 2008-01-31 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5247175B2 (ja) 2008-02-06 2013-07-24 株式会社アルバック 真空処理装置
SG156564A1 (en) * 2008-04-09 2009-11-26 Asml Holding Nv Lithographic apparatus and device manufacturing method
JP5607907B2 (ja) * 2009-09-17 2014-10-15 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置
US8529729B2 (en) * 2010-06-07 2013-09-10 Lam Research Corporation Plasma processing chamber component having adaptive thermal conductor
JP2012231046A (ja) * 2011-04-27 2012-11-22 Nikon Corp 光学装置、露光装置、及びデバイス製造方法
WO2013033315A2 (en) * 2011-09-01 2013-03-07 Veeco Instruments Inc. Wafer carrier with thermal features
US9514916B2 (en) * 2013-03-15 2016-12-06 Varian Semiconductor Equipment Associates, Inc. Wafer platen thermosyphon cooling system
JP6595313B2 (ja) * 2014-11-20 2019-10-23 永大産業株式会社 蓄熱壁パネル

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030161088A1 (en) * 2002-01-28 2003-08-28 Kyocera Corporation Electrostatic chuck for holding wafer
US20030228772A1 (en) * 2002-06-05 2003-12-11 Cowans Kenneth W. Lateral temperature equalizing system for large area surfaces during processing
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI319518B (en) * 2004-10-22 2010-01-11 Asml Netherlands Bv Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
US20080024743A1 (en) * 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
JP2008311595A (ja) * 2007-06-18 2008-12-25 Canon Inc ステージ装置、露光装置およびデバイス製造方法
US20140017613A1 (en) * 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

Also Published As

Publication number Publication date
JP7240463B2 (ja) 2023-03-15
KR102449579B1 (ko) 2022-10-04
WO2018021581A1 (en) 2018-02-01
KR20190041477A (ko) 2019-04-22
JP2022008512A (ja) 2022-01-13
KR20220137160A (ko) 2022-10-11
KR102580712B1 (ko) 2023-09-21
TW202234574A (zh) 2022-09-01
CN109844927B (zh) 2024-01-09
JP2019523561A (ja) 2019-08-22
TW201812429A (zh) 2018-04-01
JP6951415B2 (ja) 2021-10-20
CN109844927A (zh) 2019-06-04

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