TWI755459B - 剝離層之製造方法 - Google Patents

剝離層之製造方法 Download PDF

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Publication number
TWI755459B
TWI755459B TW106143083A TW106143083A TWI755459B TW I755459 B TWI755459 B TW I755459B TW 106143083 A TW106143083 A TW 106143083A TW 106143083 A TW106143083 A TW 106143083A TW I755459 B TWI755459 B TW I755459B
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TW
Taiwan
Prior art keywords
group
peeling layer
formula
alkali
bis
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TW106143083A
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English (en)
Chinese (zh)
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TW201842019A (zh
Inventor
江原和也
進藤和也
Original Assignee
日商日產化學工業股份有限公司
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Publication of TW201842019A publication Critical patent/TW201842019A/zh
Application granted granted Critical
Publication of TWI755459B publication Critical patent/TWI755459B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW106143083A 2016-12-08 2017-12-08 剝離層之製造方法 TWI755459B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016238635 2016-12-08
JP2016-238635 2016-12-08

Publications (2)

Publication Number Publication Date
TW201842019A TW201842019A (zh) 2018-12-01
TWI755459B true TWI755459B (zh) 2022-02-21

Family

ID=62491224

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106143083A TWI755459B (zh) 2016-12-08 2017-12-08 剝離層之製造方法

Country Status (5)

Country Link
JP (1) JP6954308B2 (ja)
KR (1) KR102481072B1 (ja)
CN (1) CN110062784B (ja)
TW (1) TWI755459B (ja)
WO (1) WO2018105676A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7230398B2 (ja) * 2018-09-26 2023-03-01 東レ株式会社 犠牲層用樹脂組成物、およびこれを用いた半導体電子部品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201609402A (zh) * 2014-07-22 2016-03-16 布魯爾科技公司 作爲三維積體電路應用的雷射釋放材料的聚醯亞胺
WO2016129546A1 (ja) * 2015-02-10 2016-08-18 日産化学工業株式会社 剥離層形成用組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809681B2 (ja) 1996-08-27 2006-08-16 セイコーエプソン株式会社 剥離方法
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法
JP4619461B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜デバイスの転写方法、及びデバイスの製造方法
GB0327093D0 (en) 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
JP5119401B2 (ja) 2007-02-01 2013-01-16 倉敷紡績株式会社 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法
TWI354854B (en) 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
WO2010047271A1 (ja) * 2008-10-20 2010-04-29 日本化薬株式会社 ポリイミド樹脂及びその組成物
CN102199290B (zh) * 2011-04-12 2013-06-12 中国科学院化学研究所 热塑性聚酰亚胺胶膜及其制备方法与应用
KR20150107765A (ko) * 2013-01-16 2015-09-23 닛산 가가쿠 고교 가부시키 가이샤 디스플레이 기판용 수지 박막의 제조방법 및 디스플레이 기판용 수지 박막 형성용 조성물
CN105612600B (zh) * 2013-10-07 2018-06-08 东丽株式会社 元件加工用层叠体、元件加工用层叠体的制造方法、及使用其的薄型元件的制造方法
KR101626587B1 (ko) * 2014-07-02 2016-06-02 주식회사 이녹스 에스테르기를 포함하는 폴리아믹산, 이의 제조방법 및 이를 포함하여 경화된 폴리이미드를 포함하는 폴리이미드 필름
CN105820338A (zh) * 2016-04-25 2016-08-03 全球能源互联网研究院 一种聚酰亚胺及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201609402A (zh) * 2014-07-22 2016-03-16 布魯爾科技公司 作爲三維積體電路應用的雷射釋放材料的聚醯亞胺
WO2016129546A1 (ja) * 2015-02-10 2016-08-18 日産化学工業株式会社 剥離層形成用組成物

Also Published As

Publication number Publication date
TW201842019A (zh) 2018-12-01
JPWO2018105676A1 (ja) 2019-10-24
KR102481072B1 (ko) 2022-12-27
JP6954308B2 (ja) 2021-10-27
CN110062784A (zh) 2019-07-26
CN110062784B (zh) 2023-01-10
WO2018105676A1 (ja) 2018-06-14
KR20190089208A (ko) 2019-07-30

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