TWI754454B - Transfer tool and method - Google Patents

Abstract

A transfer tool includes a substrate, an active heating element array and a pickup element. The active heating element array includes a plurality of heating units. These heating units are arranged on the substrate in a matrix manner, and each heating unit includes a driving circuit and a heating element connecting to the driving circuit. The pickup element is disposed on the active heating element array and includes a pickup surface. The pickup surface has an intrinsic pickup force and a modulation pickup force weaker than the intrinsic pickup force in response to the operation of the plurality of heating elements. A transfer method is also provided.

Description

Transfer tool and transfer method

The present invention relates to a transfer tool and transfer method.

During the process, transfer technology is often required to transfer the workpiece to the target location or target substrate. For example, in the manufacturing process of the light emitting diode display device, it is necessary to transfer a large number of light emitting diodes from the source substrate to the target substrate. In some processes, polydimethylsiloxane (PDMS) is used as the carrier for transferring the light-emitting diode, and the van der Waals force between the carrier and the light-emitting diode is used to transfer the light-emitting diode to the target on the substrate. However, this method lacks selectivity, and all light-emitting diodes that come into contact with the carrier are transferred. When there are damaged LEDs or bad LEDs on the source substrate, these non-compliant LEDs will also be transferred to the target substrate, resulting in subsequent repair or replacement of the LEDs on the target substrate. body, greatly increasing the cost and time of the process. Therefore, there is an urgent need for a selective transfer tool and transfer method.

The present invention provides a transfer tool and a transfer method, which are capable of selecting a transfer tool to be transferred. The function of moving workpieces reduces the cost and time of the process.

According to an embodiment of the present invention, there is provided a transfer tool including a substrate, an array of active heating elements, and a pickup. The active heating element array includes a plurality of heating units arranged in an array on the substrate, and each heating unit includes a driving circuit and a heating element connected to the driving circuit. The pickup is disposed on the array of active heating elements and includes a pickup surface. The pickup surface has an inherent pickup force and a modulated pickup force that is less than the inherent pickup force in response to operation of the plurality of heating elements.

According to another embodiment of the present invention, there is provided a transfer method including providing a transfer tool, the transfer tool including a substrate, an array of active heating elements, and a pickup. The active heating element array includes a plurality of heating units arranged in an array on the substrate, and each heating unit includes a driving circuit and a heating element connected to the driving circuit. The pickup is disposed on the array of active heating elements and includes a pickup surface. The transfer method further includes causing at least a portion of the pickup surface to pick up at least one workpiece with an inherent pickup force, wherein at least a portion of the pickup surface corresponds to the at least one heating unit; and enabling a heating element of the at least one heating unit using a drive circuit of the at least one heating unit , so that at least a portion of the pick-up surface in contact with at least one workpiece has a modulated pick-up force that is less than the inherent pick-up force.

Based on the above, the transfer tool provided according to an embodiment of the present invention is provided with a driving circuit in each heating unit of the active heating element array. The magnitude of the pick-up force between the pick-up surface of the pick-up piece and the workpiece to be picked up and released (transferred) is controlled by each drive circuit, so that the transfer tool can choose whether to pick up or release the corresponding workpiece by the above-mentioned pick-up force. , to selectively pick up and release (transfer) workpieces the goal of. According to another embodiment of the present invention, the transfer method provided by the above-mentioned transfer tool selects the workpiece to be picked up and released (transferred), picks up the workpiece with the inherent pick-up force, and then releases the workpiece with the modulated pick-up force to achieve selectivity The purpose of picking up and releasing (transferring) a workpiece.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

100, 400, 400’, 500, 600, 700: Transfer tool

101: Substrate

102, 402, 502, 602, 702, 802, 902: Arrays of Active Heating Elements

103, 403, 403', 503, 603, 703, 803, 903: Pickup

102H, 202H, 302H, 402H: Heating unit

103S, 403S, 803S, 903S: Pick faces

200, 300: drive circuit

201: The first active element

202: Second active element

203: Capacitor

204, 304: heating element

205, 305: insulating layer

206, 306: gate insulating layer

207: First Power Cord

208: Second power cord

2011, 2021: The first electrode

2012, 2022: Second Electrode

2013, 2023: The third electrode

403T, 503T, 603T, 703T: Film

403L, 403L’, 503L, 603L, 703L: Partition wall layer

403W: Partition Wall

403H, 403H': holes

403P, 803P: bump

403S, 503S, 603S, 703S: Pick faces

4041: Protective layer

403CL, 403CL', 503H, 703HA, 703HB 703HC: closed cavity

504, 604, 605, 701A, 701B, 701C, 801, 901A, 901B: Workpiece

800, 900: Partial structure

704: First substrate

705: Second substrate

903C1, 903C2: Thermal metamorphic layer

903T1, 903T2: heat conduction layer

903A: First Pickup Unit

903B: Second Pickup Unit

903E: Spacer

S901, S902, S903, S904, S905: Steps

AS1, AS2: Active layer

DL: data line

D1: Deformation variable

H1: height

H2, H3: depth

M1: Metal layer

SL: scan line

R1: radius

r: direction

T1, T2: Thickness

W1, W2: width

z: direction

1A illustrates a top view of a transfer tool according to an embodiment of the present invention.

FIG. 1B shows a cross-sectional view of the transfer tool shown in FIG. 1A along line AA'.

FIG. 2A is a schematic diagram illustrating a configuration of a heating unit according to an embodiment of the present invention.

FIG. 2B is a top view of the driving circuit of the heating unit shown in FIG. 2A .

FIG. 2C is a top view of the heating unit shown in FIG. 2A .

FIG. 2D is a cross-sectional view of the heating unit shown in FIG. 2C along the line BB'.

FIG. 2E shows a cross-sectional view of the heating unit shown in FIG. 2C along the line CC'.

3A shows a top view of a heating unit according to an embodiment of the present invention.

FIG. 3B is a cross-sectional view of the heating unit shown in FIG. 3A along the line DD'.

4A illustrates a cross-sectional view of a transfer tool according to an embodiment of the present invention.

4B and 4C illustrate top views of some components of the transfer tool shown in FIG. 4A.

4D illustrates a cross-sectional view of a transfer tool according to an embodiment of the present invention.

Figure 5A shows the transfer tool and the workpiece it picks up in side view.

FIG. 5B is a top view showing the disposition relationship between the transfer tool and the workpiece shown in FIG. 5A .

Figure 6A shows the transfer tool and the workpiece it picks up in side view.

FIG. 6B is a top view showing the disposition relationship between the transfer tool and the workpiece shown in FIG. 6A .

7A to 7F are schematic diagrams illustrating a transfer method according to an embodiment of the present invention.

FIG. 7G is an operational schematic diagram of the partial structure of the transfer tool 700 corresponding to the workpiece 701A in FIG. 7F .

8A and 8B are schematic diagrams illustrating a transfer method according to an embodiment of the present invention.

9A and 9B are schematic diagrams illustrating a transfer method according to an embodiment of the present invention.

FIG. 9C shows a flowchart of the transfer method of the embodiment shown in FIGS. 9A and 9B .

1A and 1B, FIG. 1A illustrates a top view of a transfer tool according to an embodiment of the present invention, and FIG. 1B illustrates a cross-sectional view of the transfer tool shown in FIG. 1A along line AA'. In FIGS. 1A and 1B , a transfer tool 100 includes a substrate 101 , an array of active heating elements 102 , and a pickup 103 . The active heating element array 102 includes a plurality of heating units 102H arranged in an array on a substrate 101 , and each heating unit 102H includes a driving circuit and a heating element (not shown in FIG. 1A and FIG. 1B ) connected to the driving circuit. The pickup 103 is disposed on the active heating element array 102 and includes a pickup surface 103S. As shown in FIG. 1B , different regions of the pickup surface 103S correspond to different heating units 102H, so that different regions of the pickup surface 103S can have different pickup forces in response to the operations of the corresponding heating units 102H. When the driving circuit in the heating unit 102H corresponding to the pickup surface 103S does not enable the heating element in the heating unit 102H, the pickup surface 103S has an inherent pickup force. When the driving circuit in the heating unit 102H corresponding to the pickup surface 103S enables the heating element in the heating unit 102H, the pickup surface 103S has a modulated pickup force smaller than the inherent pickup force.

Specifically, according to an embodiment of the present invention, the transfer tool 100 shown in FIGS. 1A and 1B can contact and transfer a workpiece (not shown). In some embodiments, the pickup surface 103S may contact the workpiece to be transferred with Van der Waals forces. Through the operation of the driving circuit in the heating unit 102H and the heating element, the area of the pick-up surface 103S contacting the workpiece can be changed, thereby changing the adhesion strength between the pick-up surface 103S and the workpiece. In other embodiments, through the operation of the driving circuit and the heating element in the heating unit 102H, the area of the pick-up surface 103S contacting the workpiece may not change but the viscosity of the pick-up surface 103S may be changed, thereby changing the contact between the pick-up surface 103S and the workpiece. Adhesion strength. In this way, the transfer tool 100 can adjust the adhesion force with the workpiece to achieve picking up the workpiece, releasing the workpiece or other operations.

Referring to FIGS. 2A to 2E , FIG. 2A illustrates a schematic circuit diagram of a heating unit according to an embodiment of the present invention, and FIG. 2B illustrates a drive of the heating unit shown in FIG. 2A . 2C shows a top view of the heating unit shown in FIG. 2A, FIG. 2D shows a cross-sectional view of the heating unit shown in FIG. 2C along the line BB', and FIG. 2E shows the heating unit shown in FIG. 2C. Sectional view of the unit along line CC'.

In the embodiment shown in FIGS. 2A to 2E , the heating unit 202H includes a driving circuit 200 and a heating element 204 . The driving circuit 200 includes a first active element 201 , a second active element 202 and a capacitor 203 , and the first active element 201 is connected between the second active element 202 and the heating element 204 . In this embodiment, the driving circuit 200 has a 2T1C (two thin film transistors and one capacitor) structure, but the invention is not limited to this. In other embodiments, the driving circuit 200 may have other numbers of transistors other than two, and may also have other numbers of capacitors than one, and the driving circuit 200 may also have thin film transistors and other components other than capacitors.

The driving circuit 200 further includes a scan line SL, a data line DL, a first power line 207 and a second power line 208, wherein the first power line 207 provides the voltage VDD, and the second power line 208 provides the voltage VSS. The first active element 201 includes an active layer AS1 , a first electrode 2011 , a second electrode 2012 and a third electrode 2013 . The gate insulating layer 206 is disposed between the active layer AS1 of the first active element 201 and the first electrode 2011 to insulate the two. The second active element 202 includes an active layer AS2 , a first electrode 2021 , a second electrode 2022 and a third electrode 2023 . The gate insulating layer 206 is disposed between the active layer AS2 of the second active element 202 and the first electrode 2021 to insulate the two. The first electrode 2021 of the second active element 202 is electrically connected to the scan line SL. The second electrode 2022 of the second active element 202 is electrically connected to the data line DL. second initiative The third electrode 2023 of the element 202 is electrically connected to the first electrode 2011 of the first active element 201 through the metal layer M1. The second electrode 2012 of the first active element 201 is electrically connected to the first power line 207 . The third electrode 2013 of the first active element 201 is connected to the heating element 204 . The insulating layer 205 is disposed between the first active element 201 and the second active element 202 and the heating element 204 .

After the first electrode 2021 of the second active element 202 receives a scan signal with an enabling level from the scan line SL, the second electrode 2022 and the third electrode 2023 can be turned on through the active layer AS2 to selectively connect the data from the data line DL. The data voltage is transmitted to the first electrode 2011 of the first active element 201 . The capacitor 203 is a storage capacitor, one end of the capacitor 203 is electrically connected between the first electrode 2011 and the second electrode 2012 of the first active element 201 , and the other end is connected to the voltage VDD to relieve the first electrode of the first active element 201 2011 voltage drift. The voltage across the capacitor 203 corresponds to the degree of conduction of the first active element 201 and determines the current flowing through the first active element 201 and the heating element 204 . The heating element 204 may be a heating wire whose temperature is controlled by controlling the current flowing through the heating element 204 .

3A and 3B, FIG. 3A shows a top view of a heating unit according to an embodiment of the present invention, and FIG. 3B shows a cross-sectional view of the heating unit shown in FIG. 3A along line DD'. It must be noted here that this embodiment uses the element numbers and part of the content of the embodiment shown in FIG. 2A to FIG. 2E , wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and details are not repeated in this embodiment.

In this embodiment, the heating unit 302H includes the driving circuit 300 and the heating unit 300. Heater 304 . The driving circuit 300 includes a first active element 201 , a second active element 202 , a capacitor 203 , a scan line SL, a data line DL, a first power line 207 and a second power line 208 . The components included in the driving circuit 200 in the example are similar, and are not repeated here. The first active element 201 is connected between the second active element 202 and the heating element 304 . The gate insulating layer 306 is disposed between the active layer AS1 of the first active element 201 and the first electrode 2011 to insulate the two. The insulating layer 305 is disposed on the first active element 201 , the second active element 202 and the heating element 204 . Compared with the heating element 204 shown in FIG. 2C being disposed on the driving circuit 200 , the heating element 304 shown in FIG. 3A and the first active element 201 of the driving circuit 200 are disposed in the same layer. For example, the heating element 304 and the second electrode 2012, the third electrode 2013, the data line DL, the second power line 208 and other components can be the same film layer, and the heating element 304 can be directly connected to the third electrode 2013, but not This is limited.

According to some embodiments of the present invention, both the heating element 204 and the heating element 304 are heating wires, and are meanderingly arranged on a plane parallel to the substrate 101 , and the thickness and distribution density of the heating wires at different positions on the plane can be different.

Referring to FIGS. 4A to 4C , FIG. 4A is a cross-sectional view of a transfer tool according to an embodiment of the present invention, and FIGS. 4B and 4C are top views of some components of the transfer tool shown in FIG. 4A . Fig. 4A can be viewed as a cross-sectional view along line EE' of Fig. 4B. The transfer tool 400 includes the substrate 101 , the active heating element array 402 , the pickup 403 and the protective layer 4041 , wherein the protective layer 4041 is disposed between the active heating element array 402 and the pickup 403 . Active heating element array 402 includes a plurality of heating cells 402H. In Figure 4C, 9 heating units are schematically depicted, these The heating units 402H are arranged on the substrate 101 in a 3×3 array, and each heating unit 402H includes a driving circuit and a heating element connected to the driving circuit. However, the present invention is not limited thereto, and the active heating element array 402 of the transfer tool 400 may include m*n heating units 402H arranged on the substrate 101 in an m×n array, where m and n are positive integers.

In this embodiment, each heating unit 402H has the same components and configurations as the heating unit 202H in the above-mentioned embodiment, but the present invention is not limited thereto. In some embodiments, each heating unit 402H has the same components and configurations as the heating unit 302H described above.

The pickup 403 includes a thin film 403T and a partition wall layer 403L, wherein the partition wall layer 403L includes a plurality of partition walls 403W and a plurality of holes 403H defined by the partition walls 403W. Thin film 403T seals these cavities 403H to form closed cavities 403CL. A closed cavity 403CL formed by a hole 403H and a thin film 403T corresponds to a heating unit 402H, but not limited thereto.

The thin film 403T includes at least one bump 403P, and the surface of the bump 403P constitutes a pickup surface 403S of the pickup member 403 , as shown in FIGS. 4A and 4B . Each closed cavity 403CL formed by each hole 403H and the thin film 403T corresponds to nine bumps 403P, but the invention is not limited to this. In other embodiments, each closed cavity 403CL may correspond to only one bump 403P, or correspond to other numbers of bumps 403P. When each closed cavity 403CL corresponds to only one bump 403P, the geometric center of the vertical projection of the closed cavity 403CL on the substrate 101 can be aligned with the geometric center of the vertical projection of the bump 403P on the substrate 101 . when each closed cavity 403CL corresponds to a plurality of bumps 403P, and the vertical projections of these bumps 403P on the substrate 101 may be symmetrically distributed with respect to the vertical projection of the corresponding closed cavity 403CL on the substrate 101 . The thin film 403T may be a thermally deformable thin film or a thermally deformable thin film. According to an embodiment of the present invention, the material of the thin film 403T may include polydimethylsiloxane (PDMS).

Since each heating unit 402H has the same components and configurations as the above-mentioned heating unit 202H, the driving circuit of each heating unit 402H has the same components and configurations as the driving circuit 200 of the above-described embodiment. In other words, each heating unit 402H equipped with the driving circuit can selectively transmit the data voltage from the data line (not shown in FIG. 4C ) to the first electrode of the first active element of the driving circuit inside, so that the current flows After the heating element, the temperature of the heating element is increased. In other words, the closed cavity 403CL corresponding to each heating unit 402H can be selectively heated by the heating elements in the heating unit 402H below it. Since the thin film 403T can be a thermally deformable thin film or has thermal deterioration characteristics, when the closed cavity 403CL is heated by the heating element below it, the thin film 403T on the closed cavity 403CL will be deformed or deteriorated due to heating. The workpiece can be transferred by the surface of the thin film 403T, ie, the pickup surface 403S, by such deformation or deterioration. Specifically, when the film 403T is not deformed or deteriorated, the pickup surface 403S can provide an inherent pickup force; when the film 403T is thermally deformed or deteriorated, the pickup surface 403S can provide a modulated pickup force smaller than the inherent pickup force. The workpiece can be picked up by the inherent pick-up force and released by the modulated pick-up force to achieve the purpose of transferring the workpiece.

It should be noted that each partition wall 403W is perpendicular to the normal line of the substrate 101 The width W2 of each hole 403H in the direction may be greater than the width W1 of each hole 403H in this direction, so as to avoid the closed cavity 403CL defined by each hole 403H from being affected by the adjacent heating unit 402H. It should also be noted that the height H1 of each hole 403H in the direction normal to the substrate 101 may be greater than its width W1 in the direction perpendicular to the normal to the substrate 101, so that the membrane 403T responds to the heating of the closed cavity 403CL. The resulting deformation becomes more pronounced. That is, the holes 403H may have a large aspect ratio.

Referring to FIG. 4D, a cross-sectional view of a transfer tool according to an embodiment of the present invention is shown. The transfer tool 400' includes a substrate 101, an array of active heating elements 402, and a pick-up 403'. The pickup 403' includes a thin film 403T and a partition wall layer 403L', wherein the partition wall layer 403L' includes a plurality of holes 403H'. Thin film 403T seals these cavities 403H' to form closed cavities 403CL'. A closed cavity 403CL' formed by a hole 403H' and a thin film 403T corresponds to a heating unit 402H, but is not limited thereto.

The material of the partition wall layer 403L' is, for example, an organic insulating material, which is formed on the substrate 101 by coating to have a relatively large thickness. The larger thickness of the partition wall layer 403L' can be used to form the hole 403H' of the embodiment shown in FIG. 4D by a yellow light process. The depth H3 of the hole 403H' in the normal direction of the substrate 101 is smaller than the thickness T2 of the partition wall layer 403L' in the normal direction of the substrate 101. However, in other embodiments, the hole 403H' can selectively penetrate the entire thickness of the partition wall layer 403L', so that the depth H3 of the hole 403H' in the normal direction of the substrate 101 is equal to that of the partition wall layer 403L' on the substrate 101 The thickness T2 in the normal direction.

Referring to Figures 5A and 5B, Figure 5A illustrates the transfer tool and its For the picked up workpiece, FIG. 5B is a top view showing the disposition relationship between the transfer tool and the workpiece shown in FIG. 5A . Fig. 5A can also be viewed as a side view along line FF' of Fig. 5B. Transfer tool 500 includes substrate 101 , array 502 of active heating elements, and pick-up 503 . The active heating element array 502 includes a plurality of heating elements, and the plurality of heating elements are arranged in an array in a layer structure designated as 502 . The plurality of heating units of the transfer tool 500 may be implemented, for example, with one heating unit in the embodiment shown in FIGS. 2A-3B. The pickup 503 includes a thin film 503T and a partition wall layer 503L. The thin film 503T includes a plurality of bumps, and the surfaces of these bumps constitute the pickup surface 503S. The workpiece 504 is picked up by the transfer tool 500 by the pick-up force provided by the pick-up surface 503S. In other words, when the pick-up surface 503S contacts the workpiece 504, the workpiece 504 can be attached to the pick-up surface 503S at least temporarily without being arbitrarily separated from the pick-up surface 503S, and also not permanently attached to the pick-up surface 503S. In this embodiment, each closed cavity 503H defined by the partition wall layer 503L and the thin film 503T may correspond to one workpiece 504 respectively, but it is not limited thereto.

6A and 6B, FIG. 6A shows a side view of the transfer tool and the workpiece it picks up, and FIG. 6B shows the configuration relationship between the transfer tool and the workpiece shown in FIG. 6A from a top view. Figure 6A can also be viewed as a side view along line GG' of Figure 6B. Transfer tool 600 includes substrate 101 , array 602 of active heating elements, and pick-up 603 . Active heating element array 602 includes a plurality of heating elements arranged in an array in a layer structure designated 602 . The plurality of heating units of the transfer tool 600 may be implemented, for example, with one heating unit in the embodiment shown in FIGS. 2A-3B. The pickup 603 includes a thin film 603T and a partition wall layer 603L. The thin film 603T includes a plurality of bumps, and the surfaces of these bumps constitute the pickup surface 603S. Workpiece 604 and 605 is picked up by the transfer tool 600 due to the pick-up force provided by the pick-up surface 603S. In this embodiment, the workpiece 604 corresponds to the four closed cavities 603H defined by the partition layer 603L and the film 603T, and is picked up by the transfer tool 600; the workpiece 605 corresponds to the 1 defined by the partition layer 603L and the film 603T. The corresponding closed cavities 603H are picked up by the transfer tool 600 . In general, a single workpiece can be picked up by the pick-up surface 603S corresponding to one closed cavity 603H or multiple closed cavities 603H.

In this embodiment, each closed cavity 603H corresponds to four bumps. However, the present invention is not limited to this. In other embodiments, each cavity may correspond to only one bump, or multiple bumps, and is not limited to four bumps.

Referring to FIGS. 7A to 7F , FIGS. 7A to 7F are schematic diagrams illustrating a transfer method according to an embodiment of the present invention. Referring first to FIG. 7A , in this embodiment, the transfer method includes providing a transfer tool 700 , and the transfer tool 700 includes a substrate 101 , an array of active heating elements 702 , and a pickup 703 . Active heating element array 702 includes a plurality of heating cells arranged in an array in a layered structure designated 702 . The plurality of heating units of the transfer tool 700 may be implemented, for example, as one heating unit in the embodiment shown in FIGS. 2A-3B. The pickup 703 includes a thin film 703T and a partition wall layer 703L. The thin film 703T includes a plurality of bumps, and the surfaces of these bumps constitute the pickup surface 703S. The thin film 703T and the partition wall layer 703L constitute a plurality of closed cavities 703HA, 703HB and 703HC.

The transfer method according to the present embodiment further includes causing at least a portion of the pickup surface 703S to pick up at least one workpiece with an inherent pickup force, and enabling the heating element of the at least one heating unit using a drive circuit of the at least one heating unit, so that the pickup surface 703S contacts the At least a portion of the at least one workpiece contacting has a modulated pick-up force that is less than the inherent pick-up force. Specifically, referring to FIGS. 7A-7C , FIGS. 7A-7C illustrate a process of selectively picking up a plurality of workpieces 701A, 701B or 701C on the first substrate 704 with the transfer tool 700 . In this embodiment, the workpieces to be picked up are the workpieces 701A and 701C, and the workpiece 701B is not picked up. Specifically, the transfer tool 700 is brought close to the workpieces 701A, 701B and 701C (the process shown in FIGS. 7A-7B ), and at least one heating unit disposed in the active heating element array 702 is used to heat the enclosure corresponding to the workpiece 701B The cavity 703HB causes the air inside the closed cavity 703HB to expand due to the rise in temperature (the process shown in FIG. 7B to FIG. 7C ), causing the corresponding part of the film 703T (in FIG. 7C , the middle section of the film 703T ) deformed. Due to the above deformation, the area of the pickup surface 703S in contact with the workpiece 701B is smaller than that of the pickup surface 703S in contact with the workpiece 701A or 701C, so that the pickup force (modulation) between the pickup surface 703S of this part and the workpiece 701B is smaller. Pickup force) is smaller, so workpiece 701B cannot be picked up by transfer tool 700 like workpieces 701A and 701C. In contrast, since the contact area between the pickup surface 703S and the workpiece 701A or 701C is larger, and the pickup force (intrinsic pickup force) is larger, the workpieces 701A and 701C can be picked up by the transfer tool 700 .

The transfer method according to the present embodiment further includes using the pickup surface 703S to release at least one workpiece to a second substrate with a modulated pickup force that is less than the inherent pickup force. Specifically, referring to FIGS. 7D to 7F , the workpieces 701A and 701C picked up by the transfer tool 700 are released to the second substrate 705 through the process shown in FIGS. 7D to 7F . Specifically, the transfer tool 700 and the workpieces 701A and 701C are brought close to the second substrate 705 (The process shown in FIG. 7D to FIG. 7E ), the closed cavities 703HA and 703HC are heated by a plurality of heating units arranged in the active heating element array 702, so that the air inside the two closed cavities is heated due to the increase in temperature. The expansion causes the corresponding part of the film 703T to deform, so that the pickup force between the workpieces 701A and 701C and the film 703T changes from the inherent pickup force to a smaller pickup force (modulates the pickup force). When the transfer tool 700 moves away from The direction of the second substrate 705 is moved, and the workpieces 701A and 701C are released on the second substrate 705 (the process shown in FIGS. 7E to 7F ). It should be noted that the above-mentioned modulated pickup force for not picking up the workpiece 701B and the modulated pickup force for releasing the workpieces 701A and 701C are both smaller than the inherent pickup force, but the magnitudes of the two modulated pickup forces may be different from each other. However, in some embodiments, the modulated pickup force for not picking workpiece 701B and the modulated pickup force for releasing workpieces 701A and 701C may be approximately the same. For example, the magnitude of the modulating pickup force can be adjusted and changed by the heating degree of the heating unit to the closed cavity.

It should be noted that, as previously described, the plurality of heating units in the transfer tool 700 may be implemented, for example, as one heating unit in the embodiment shown in FIGS. 2A-3B , and in the embodiment shown in FIGS. 2A-3B Each heating unit can control the opening and closing of the first active element 201 by the second active element 202 in its internal 2T1C structure, thereby determining whether the heating element of the heating unit heats the corresponding closed cavity 703HA, 703HB and 703HC, for the purpose of selectively picking up and releasing workpieces 701A, 701B or 701C.

Referring to FIG. 7G , it is an operational schematic diagram of the partial structure of the transfer tool 700 corresponding to the workpiece 701A in FIG. 7F . Specifically, FIG. 7G is shown to illustrate the use of Conditions under which workpiece 701A is released from transfer tool 700 to second substrate 705 . In FIG. 7G, the thin film 703T has a thickness T1, the closed cavity 703HA has a radius R1 in the direction perpendicular to the substrate normal (r direction), and has a depth H2 in the direction parallel to the substrate normal (z direction) . When the closed cavity 703HA shown in FIG. 7G is heated by the corresponding heating unit, so that the thin film 703T is deformed, the deformation amount of the thin film 703T in the z direction is D1. If the deformation amount D1 of the film 703T and the radius R1 of the closed cavity 703HA satisfy the conditional formula D1/R1>20%, the workpiece 701A can be separated from the film 703T. According to an embodiment of the present invention, if the thickness T1 of the film 703T is 20 μm, the depth H2 of the closed cavity 703HA is 100 μm, and the radius R1 of the closed cavity 703HA is 50 μm, the deformation amount D1 of the film 703T in the z direction When larger than 10 microns, the workpiece 701A can be released from the film 703T.

Referring to FIGS. 8A and 8B , FIGS. 8A and 8B are schematic diagrams illustrating a transfer method according to an embodiment of the present invention. In this embodiment, the transfer method includes providing a transfer tool. In FIGS. 8A and 8B , only part of the structure 800 of the transfer tool is shown, which includes the substrate 101 , the active heating element array 802 , and the pick-up 803 . At least one heating element is provided in the active heating element array 802 . This at least one heating unit may be implemented, for example, as one of the heating units in the embodiment shown in Figures 2A-3B. The pickup 803 is a thermally deformable film, and includes a plurality of bumps 803P, and the surfaces of these bumps 803P constitute a pickup surface 803S. According to an embodiment of the present invention, the material of the pick-up member 803 includes polydimethylsiloxane (PDMS), and its thermal expansion coefficient is about 310×10 ⁻⁶ /°C.

In this embodiment, the pick-up force between the pick-up surface 803S and the workpiece 801 is Pick up the workpiece 801, and then use the drive circuit of at least one heating unit set in the active heating element array 802 to enable the heating element of the heating unit, so that the pickup element 803, which is a thermal deformation film, is deformed to release the workpiece 801, so as to achieve The purpose of picking up and releasing workpieces 801 . The heating elements of the heating unit can be centrally disposed near the symmetry axis of the partial structure 800 in the normal direction of the substrate 101 , so that when the pickup element 803 is thermally expanded, the bulging amplitude of the central portion thereof is more obvious.

Specifically, the transfer tool of this embodiment is composed of a plurality of partial structures 800 arranged in an array, and the transfer tool of this embodiment can also achieve the purpose of transferring multiple workpieces as shown in FIGS. 7A to 7F . .

Referring to FIGS. 9A and 9B , FIGS. 9A and 9B are schematic diagrams illustrating a transfer method according to an embodiment of the present invention. In this embodiment, the transfer method includes providing a transfer tool. In FIGS. 9A and 9B , only part of the structure 900 of the transfer tool is shown, which includes the substrate 101 , the array 902 of active heating elements, and the pick-up 903 . The pickup 903 includes a first pickup unit 903A, a second pickup unit 903B, and a spacer 903E between the first pickup unit 903A and the second pickup unit 903B. At least two heating units (not shown) are disposed in the active heating element array 902 for heating the first pickup unit 903A and the second pickup unit 903B respectively. Each heating unit may be implemented, for example, as one of the heating units in the embodiments shown in Figures 2A-3B. The first pickup unit 903A includes a thermally conductive layer 903T1 and a thermally altered layer 903C1 , the second pickup unit 903B includes a thermally conductive layer 903T2 and a thermally altered layer 903C2 , and the surfaces of the thermally altered layers 903C1 and 903C2 form a pickup surface 903S of the pickup 903 . The thermal conduction layers 903T1 and 903T2 are materials with good thermal conductivity and temperature resistance, and can be Therefore, it is a patterned structure formed by processes such as yellow light or etching. The first pickup unit 903A and the second pickup unit 903B are formed by coating the thermally modified layers 903C1 and 903C2 on the bumps of the thermally conductive layers 903T1 and 903T2, respectively. In some embodiments, the spacer 903E between the first pickup unit 903A and the second pickup unit 903B may have a thinner thickness to reduce heat conduction between the first pickup unit 903A and the second pickup unit 903B. In some embodiments, the spacer 903E between the first pickup unit 903A and the second pickup unit 903B may be completely removed.

Referring to FIG. 9C , a flowchart of the transfer method of the embodiment shown in FIGS. 9A and 9B is shown. In this embodiment, the workpieces 901A and 901B are picked up by the pick-up force between the pick-up surface 903S and the workpieces 901A and 901B (step S901 ), and then the drive circuits of at least two heating units provided in the active heating element array 902 are used to The heating elements of the at least two heating units can conduct thermal energy to the thermally metamorphic layers 903C1 and 903C2 through the thermally conductive layers 903T1 and 903T2, so that the thermally metamorphic layers 903C1 and 903C2 are decomposed or decomposed by heat, thereby reducing the thermally metamorphic layers 903C1 and 903C2 and the workpiece. The pickup force between 901A and 901B (step S902 ) is used to release the workpieces 901A and 901B (step S903 ) to achieve the purpose of picking up and releasing (transferring) the workpieces 901A and 901B (step S904 ). In this embodiment, after the workpieces 901A and 901B are released due to thermal deterioration or decomposition of the thermally degraded layers 903C1 and 903C2 , the thermally degraded layers 903C1 and 903C2 may be re-coated (step S905 ), and the above pickup and release (transfer) can be repeated. ) other artifacts.

Specifically, the transfer tool of this embodiment is composed of a plurality of partial structures 900 arranged in an array structure, and the transfer tool of this embodiment can also achieve For the purpose of transferring a plurality of workpieces as shown in Figures 7A-7F.

To sum up, the transfer tool provided according to an embodiment of the present invention is provided with a driving circuit in each heating unit of the active heating element array. The magnitude of the pick-up force between the pick-up surface of the pick-up piece and the workpiece to be picked up and released (transferred) is controlled by each drive circuit, so that the transfer tool can choose whether to pick up or release the corresponding workpiece by the above-mentioned pick-up force. , to achieve the purpose of selectively picking up and releasing (transferring) workpieces. According to another embodiment of the present invention, the transfer method provided by the above-mentioned transfer tool selects the workpiece to be picked up and released (transferred), picks up the workpiece with the inherent pick-up force, and then releases the workpiece with the modulated pick-up force to achieve selectivity The purpose of picking up and releasing (transferring) a workpiece.

400: Transfer Tool

101: Substrate

402: Active Heating Element Array

403: Pickup

402H: Heating unit

403T: Film

403L: Partition wall layer

403CL: closed cavity

403W: Partition Wall

403H: Hole

403P: bump

403S: Pick Face

4041: Protective layer

H1: height

W1, W2: width

Claims (18)

A transfer tool, comprising: a substrate; an active heating element array, including a plurality of heating units, the heating units are arranged on the substrate in an array form, and each heating unit includes a driving circuit and a driving circuit connected to the driving circuit. A heating element; and a pick-up element, disposed on the active heating element array, and comprising a pick-up surface, a thin film and a partition wall layer, wherein the thin film constitutes the pick-up surface, the partition wall layer is disposed on the substrate and has A plurality of holes, the film seals the holes to form a plurality of closed cavities, wherein the pickup surface has an inherent pickup force and a modulated pickup force smaller than the inherent pickup force in response to the operation of at least one of the heating elements. The transfer tool of claim 1, wherein the depth of each hole in the normal direction of the substrate is less than the thickness of the partition wall layer in the normal direction of the substrate. The transfer tool of claim 1, wherein the height of each cavity in a direction normal to the substrate is greater than its width in a direction perpendicular to the normal to the substrate. The transfer tool of claim 1, wherein the partition wall layer has a plurality of partition walls, the partition walls define the holes, and the thickness of each partition wall in a direction perpendicular to the normal of the substrate is greater than that of each partition wall The width of a hole in this direction. The transfer tool of claim 1, wherein the film includes at least one bump, and a surface of the at least one bump constitutes the pickup surface. The transfer tool of claim 1, wherein the film is a thermally deformable film. The transfer tool of claim 1, wherein the material of the film comprises polydimethylsiloxane (PDMS). The transfer tool of claim 1, wherein the pick-up member further comprises a heat conduction layer disposed on the substrate, the heat conduction layer has a plurality of holes, and the depth of each hole in the normal direction of the substrate is smaller than the heat conduction layer The thickness of the layer in the direction normal to the substrate. The transfer tool of claim 1, wherein the pickup includes a thermally degraded layer, and the thermally degraded layer constitutes the pickup surface. The transfer tool of claim 1, wherein the driving circuit comprises a first active element, a second active element and a capacitor, and the first active element is connected between the second active element and the heating element. The transfer tool of claim 10, wherein the heating element and the first active element are disposed on the same layer. The transfer tool according to claim 1, wherein the heating element is a heating wire, the heating wire is meanderingly arranged on a plane parallel to the substrate, and the thicknesses of the heating wire at different positions on the plane and The distribution density is different. The transfer tool according to claim 1, further comprising an insulating layer disposed between the driving circuit and the heating element. The transfer tool according to claim 1, further comprising a protective layer disposed between the active heating element array and the pick-up member. A transfer method, comprising: providing a transfer tool, the transfer tool comprising: a substrate; an array of active heating elements, including a plurality of heating units, the heating units are arranged in an array on the substrate, and each heating unit includes a driving circuit and a heating element connected to the driving circuit; and a pick-up element disposed on the active heating element array and comprising a pick-up surface, a thin film and a partition wall layer, wherein the thin film constitutes the pick-up surface, the The partition layer is disposed on the substrate and has a plurality of holes, the film seals the holes to form a plurality of closed cavities, the pickup surface has an inherent pickup force; and the driving circuit of at least one heating unit is used to enable the The heating element of at least one heating unit makes the inherent pickup force of at least a part of the pickup surface adjusted to a modulated pickup force smaller than the inherent pickup force. The transfer method of claim 15, further comprising: causing the at least a portion of the pickup surface to pick up at least one workpiece from a first substrate with the inherent pickup force; and causing the at least a portion of the pickup surface to use the modulation The pick-up force releases the at least one workpiece to a second substrate. The transfer method of claim 15, further comprising causing the at least one portion of the pickup surface to contact at least one workpiece with the modulated pickup force and at least another portion of the pickup surface to contact at least another workpiece with the inherent pickup force. The transfer method of claim 15, wherein the driving circuit comprises a first active element, a second active element and a capacitor, the first active element is connected between the second active element and the heating element, and The method for enabling the heating element of the at least one heating unit includes: controlling the opening and closing of the first active element with the second active element.

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