CN110933841B

CN110933841B - Adapter plate, circuit board and electronic equipment

Info

Publication number: CN110933841B
Application number: CN201911346579.6A
Authority: CN
Inventors: 黎志冬
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2019-12-24
Filing date: 2019-12-24
Publication date: 2021-06-22
Anticipated expiration: 2039-12-24
Also published as: CN110933841A

Abstract

The invention provides a patch panel, a circuit board and electronic equipment, which relate to the technical field of communication, and the patch panel comprises: an annular substrate; at least one layer of conductive connecting parts is arranged around the periphery of the annular substrate, the number of the conductive connecting parts on each layer is multiple, and the conductive connecting parts are arranged in the annular substrate in a penetrating mode at intervals; and a plurality of grooves arranged between the conductive connecting parts. According to the scheme, the at least one layer of conductive connecting parts is arranged around the annular substrate, the number of each layer of conductive connecting parts is multiple, the multiple conductive connecting parts penetrate through the annular substrate at intervals, and the multiple grooves arranged between the conductive connecting parts can allow plastic packaging materials to flow in, so that the whole circuit board is further subjected to plastic packaging, and the problem that the adapter plate is easy to deform at high temperature can be solved.

Description

Adapter plate, circuit board and electronic equipment

Technical Field

The invention relates to the technical field of communication, in particular to an adapter plate, a circuit board and electronic equipment.

Background

With the increase of user demand, more and more devices and larger batteries are used in electronic equipment nowadays, and the size of the electronic equipment is limited to increase due to the requirement of portability.

At present, because the keysets is middle fretwork only, and the metal column part that is used for upper and lower two-layer mainboard electrical connection is confined loop configuration, solid plate, adopts after the structure of keysets, can't be to the further plastic envelope of whole mainboard, then can't effectively protect and dispel the heat to the device that piles up in the mainboard.

Disclosure of Invention

The embodiment of the invention provides an adapter plate, a circuit board and electronic equipment, and aims to solve the problem that devices in the circuit board cannot be effectively protected and radiated in the prior art.

In order to solve the technical problem, the invention is realized as follows:

in a first aspect, an embodiment of the present invention provides an interposer, including:

an annular substrate;

at least one layer of conductive connecting parts is arranged around the periphery of the annular substrate, the number of the conductive connecting parts on each layer is multiple, and the conductive connecting parts are arranged in the annular substrate in a penetrating mode at intervals;

and a plurality of grooves arranged between the conductive connecting parts.

In a second aspect, an embodiment of the present invention further provides a circuit board, including a plurality of circuit board bodies, and further including the interposer as described above;

and the circuit board bodies are connected in an attaching mode through the adapter plate.

In a third aspect, an embodiment of the present invention further provides an electronic device, including the circuit board as described above.

Therefore, according to the scheme of the invention, the at least one layer of conductive connecting parts is arranged around the annular substrate, the number of each layer of conductive connecting parts is multiple, the multiple conductive connecting parts penetrate through the annular substrate at intervals, and the multiple grooves arranged between the conductive connecting parts can allow a plastic packaging material to flow in so as to further carry out plastic packaging on the whole circuit board, and the problem that the adapter plate is easy to deform at high temperature can be solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.

FIG. 1 shows a cross-sectional view of an interposer of an embodiment of the present invention;

FIG. 2 illustrates one of the schematic top views of an interposer according to an embodiment of the present invention;

FIG. 3 is a second schematic top view of an interposer according to an embodiment of the present invention;

FIG. 4 is a third schematic top view of an interposer according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a process for forming an interposer according to an embodiment of the present invention;

FIG. 6 is a second schematic view of a process for forming an interposer according to an embodiment of the present invention;

FIG. 7 is a third schematic view of a process for forming an interposer according to an embodiment of the present invention;

FIG. 8 is a fourth schematic view of a process for forming an interposer according to an embodiment of the present invention;

FIG. 9 shows one of the cross-sectional views of the circuit board of an embodiment of the present invention;

fig. 10 shows a second cross-sectional view of the circuit board according to the embodiment of the invention.

Description of reference numerals:

1-annular substrate, 11-substrate connecting part, 2-conductive connecting part, 3-groove, 4-first hollowed-out region, 41-second hollowed-out region, 5-first circuit board body, 51-first electronic element, 6-second circuit board body, 61-second electronic element, 7-metal plate and 8-plastic packaging material.

Detailed Description

Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

At present, adopt among the prior art electronic equipment to pile up the mainboard, the mainboard design scheme of adoption is in the same place two circuit board bodies through keysets welded connection, makes the components and parts on two circuit board bodies can realize signal communication, because present plastic envelope technology need flow into and pile up the mainboard after melting plastic packaging material, but the enclosed construction of keysets can't allow the plastic packaging material to flow into, can't further plastic envelope to whole mainboard, and then can't effectively protect and dispel the heat to the device that piles up in the mainboard. Therefore, the embodiment of the invention provides the adapter plate, the circuit board and the electronic equipment, which can allow plastic package materials to flow in so as to further carry out plastic package on the whole circuit board and can overcome the problem that the adapter plate is easy to deform at high temperature.

Specifically, as shown in fig. 1 to 4, an embodiment of the present invention provides an interposer, including:

an annular substrate 1;

at least one layer of conductive connecting parts 2 arranged around the periphery of the annular substrate 1, wherein the number of the conductive connecting parts 2 on each layer is multiple, and the conductive connecting parts 2 are arranged in the annular substrate 1 at intervals in a penetrating manner;

a plurality of grooves 3 disposed between the conductive connection parts 2.

Specifically, the groove 3 is disposed on one surface of the ring substrate 1, that is, a plurality of positions corresponding to one side surface of the ring substrate 1 are hollowed out, and each position forms an inverted concave structure, which can be used to provide a sufficient mold flow channel for the plastic molding material to flow in.

Specifically, the annular substrate 1 may be a solid plastic package material, and the shape of the annular substrate 1 may be an annular rectangular substrate, which is not limited herein.

In the above embodiment of the present invention, the at least one layer of conductive connection portions 2 is disposed around the annular substrate 1, the number of each layer of conductive connection portions 2 is plural, the plural conductive connection portions 2 are disposed in the annular substrate 1 at intervals, and the plural grooves 3 disposed between the conductive connection portions 2 allow a plastic package material to flow in, so as to further package the entire circuit board, and further overcome the problem that the adapter board is easily deformed at high temperature.

Further, as shown in fig. 1 to 4, in a plurality of the conductive connection parts 2 in the same layer, the groove 3 is provided between two adjacent conductive connection parts 2.

Specifically, in a plurality of conductive connection portions 2 in the same layer, the groove 3 may be provided between a part of adjacent two of the conductive connection portions 2, or may be provided between all of adjacent two of the conductive connection portions 2. The number of the conductive connection parts 2 of the same layer is plural, that is, one layer refers to one turn of the ring-shaped substrate 1. For example: the annular substrate 1 is an annular rectangular substrate, and the conductive connection parts 2 on the same layer are formed into a circle of rectangular conductive connection parts 2.

Specifically, in all the conductive connecting portions 2 on the same layer, the interval between every two adjacent conductive connecting portions 2 is the same, or the interval between some adjacent conductive connecting portions 2 is the same, and the other part is different, which may be specifically represented as that some conductive connecting portions 2 are arranged more intensively (densely), and the other part is arranged more dispersedly, and is not specifically limited herein.

Further, as shown in fig. 2 to 4, when a plurality of layers of the conductive connection portions 2 are disposed around the annular substrate 1, the plurality of layers of the conductive connection portions 2 are surrounded.

Specifically, if the number of layers is two, the outer conductive connecting portion 2 surrounds the inner conductive connecting portion 2 to form a plurality of rows of conductive connecting portions 2, and each row has two conductive connecting portions 2. The number of layers and the number of conductive connection portions 2 per layer are not particularly limited.

Further, as shown in fig. 3 and 4, the first hollow area 4 in the middle of the annular substrate 1 is provided with a substrate connecting portion 11, and the first hollow area 4 forms a plurality of second hollow areas 41 through the substrate connecting portion 11.

Specifically, since the annular substrate 1 is an annular structure, the middle part is a first hollow area 4; the first hollow-out region 4 may be formed by a plurality of second hollow-out regions 41, the plurality of second hollow-out regions 41 are separated from each other by a substrate connection portion 11, and the substrate connection portion 11 and the annular substrate 1 may be made of the same material.

Further, the conductive connection portion 2 is a metal member.

Specifically, the metal component may be a metal pillar or other shape, and is not limited in particular.

The process for forming the transfer sheet is described in detail below by way of specific examples:

first, as shown in fig. 5, a plurality of conductive connection portions 2 are fixed on a metal plate 7 by stamping or etching according to design requirements, and are formed at one time. Compared with the traditional printed circuit board which is used as an adapter plate, a plurality of processes such as drilling, hole plating, hole filling and the like are needed, the scheme is simpler in process, lower in cost and shorter in production period.

And secondly, as shown in fig. 6, the conductive connecting part 2 is plastically packaged by adopting a plastic packaging glue injection or pressing process, the plastic packaging process is a very mature packaging process, and the plastic packaging glue material is low in price and good in heat dissipation, strength and the like compared with a printed circuit board or a carrier plate material.

Thirdly, as shown in fig. 7, the upper and lower surfaces are thinned by grinding, numerical control or laser process to expose the conductive connection part 2 on both the upper and lower surfaces.

And fourthly, as shown in fig. 8, removing the plastic packaging material in the designated area by using a mechanical or laser cutting process through controlling energy parameters to form a concave structure.

And fifthly, as shown in fig. 2, removing the unnecessary middle part by using a numerical control or laser processing process to form a window (i.e. the first hollow-out area 4), wherein the purpose of the window is to remove the blank part to form a frame structure (i.e. the annular substrate 1).

In the embodiment of the invention, the adapter plate with the first hollow-out area 4 and the groove 3 is manufactured by adopting a packaging process and combining a metal plate 7 or a carrier plate with plastic packaging, grinding and a mechanical/laser process to replace the traditional adapter plate manufactured by a printed circuit board, so that the process is simple and the cost is lower; moreover, the adapter plate is applied to the whole machine, so that plastic package materials are allowed to flow into the groove 3, and the whole circuit board can be further subjected to plastic package; moreover, the solid part of the adapter plate is also a plastic package material, and the thermal expansion coefficients of the solid part of the adapter plate are matched with those of the plastic package material filled in the whole machine, so that the problem that the traditional printed circuit board type adapter plate is easy to deform at high temperature is solved, and the electronic elements in the circuit board can be effectively protected and radiated.

As shown in fig. 9 and 10, an embodiment of the present invention further provides a circuit board, which includes a plurality of circuit board bodies, and further includes an interposer according to any one of the above embodiments;

Specifically, under the condition that the number of the circuit board bodies is two, the circuit board bodies can be a first circuit board body 5 and a second circuit board body 6, and the first circuit board body 5 is attached to the second circuit board body through an adapter plate to form a multilayer circuit board. Wherein the number of the circuit board bodies is not limited.

Further, as shown in fig. 9, a plurality of circuit board bodies are all provided with electronic components, and the electronic components on different circuit board bodies are electrically connected through the conductive connecting portion 2.

Specifically, a first electronic component 51 is disposed on the first circuit board body 5, a second electronic component 61 is disposed on the second circuit board body 6, and the first electronic component 51 and the second electronic component 61 are electrically connected through the conductive connecting portion 2.

Further, as shown in fig. 10, the groove 3 on the interposer is filled with a plastic package material 8.

Specifically, the plastic package material 8 may be a liquid plastic package material after the plastic package material is melted.

Further, the molding compound 8 is made of the same material as the annular substrate 1, such as a molding compound, which is not limited herein.

In the embodiment of the invention, the plastic package material 8 is allowed to flow in through the groove 3 arranged between the adjacent conductive connecting parts 2, the whole circuit board can be further subjected to plastic package, the stacked circuit boards or main boards of the whole machine are effectively protected, and the heat dissipation capacity of the circuit board is improved through the plastic package.

The embodiment of the invention also provides electronic equipment which comprises the circuit board in any one of the above embodiments.

The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.

While the preferred embodiments of the present invention have been described, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims.

Claims

1. An interposer, comprising:

an annular substrate (1);

at least one layer of conductive connecting parts (2) is arranged around the annular substrate (1), the number of each layer of conductive connecting parts (2) is multiple, and the multiple conductive connecting parts (2) penetrate through the annular substrate (1) at intervals;

a plurality of grooves (3) disposed between the conductive connection parts (2); and plastic package materials (8) are filled in the grooves (3).

2. An interposer according to claim 1, characterized in that in a plurality of said electrically conductive connection parts (2) in the same layer, said recess (3) is provided between two adjacent electrically conductive connection parts (2).

3. The interposer as claimed in claim 1, wherein when a plurality of said conductive connection portions (2) are arranged around the circumference of said ring-shaped substrate (1), a plurality of said conductive connection portions (2) are arranged in a surrounding manner.

4. The interposer according to claim 1, characterized in that a first hollowed-out area (4) in the middle of the annular substrate (1) is provided with substrate connections (11), by means of which substrate connections (11) the first hollowed-out area (4) forms a plurality of second hollowed-out areas (41).

5. An adapter plate according to claim 1, characterized in that the electrically conductive connection part (2) is a metal part.

6. A circuit board comprising a plurality of circuit board bodies, characterized by further comprising an interposer as claimed in any one of claims 1 to 5;

7. The circuit board according to claim 6, wherein a plurality of the circuit board bodies are each provided with an electronic component thereon, and the electronic components on different circuit board bodies are electrically connected through the conductive connecting portion (2).

8. The circuit board according to claim 6, characterized in that the molding compound (8) is the same material as the annular substrate (1).

9. An electronic device characterized by comprising a circuit board according to any one of claims 6 to 8.