TWI753320B - Heat dissipation unit and heat dissipation device using same - Google Patents
Heat dissipation unit and heat dissipation device using same Download PDFInfo
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- TWI753320B TWI753320B TW108140474A TW108140474A TWI753320B TW I753320 B TWI753320 B TW I753320B TW 108140474 A TW108140474 A TW 108140474A TW 108140474 A TW108140474 A TW 108140474A TW I753320 B TWI753320 B TW I753320B
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本發明是有關於一種散熱單元及其散熱裝置,尤指一種大幅增加散熱效率之散熱單元及其散熱裝置。 The present invention relates to a heat dissipation unit and a heat dissipation device thereof, in particular to a heat dissipation unit and a heat dissipation device thereof which greatly increase the heat dissipation efficiency.
現行行動裝置、個人電腦、伺服器、通信機箱或其他系統或裝置皆因運算效能提升,而其內部計算單元所產生之熱量亦隨著提升,因此則相對的更加需要散熱單元來輔助其散熱,絕大多數業者選用散熱器、熱管、均溫板等散熱元件搭配風扇進行輔助散熱,並當遇到需大面積進行散熱時則選用散熱裝置(散熱器)及散熱風扇進行強制散熱。 The current mobile devices, personal computers, servers, communication boxes or other systems or devices have improved computing performance, and the heat generated by their internal computing units has also increased, so relatively more heat dissipation units are needed to assist their heat dissipation. The vast majority of manufacturers use cooling elements such as radiators, heat pipes, and vapor chambers with fans for auxiliary cooling, and when a large area is required for cooling, they use cooling devices (radiators) and cooling fans for forced cooling.
一般業界常見的散熱裝置(散熱器)都是由一基板及複數散熱鰭片所組成,該等散熱鰭片係設置於該基板之一側,由於隨著前述各裝置運算效能的提升,相對的各裝置內部產生的熱量也逐步增加的狀況下,基板上的散熱鰭片尺寸也必須相對增大及增高藉以得到更大更多的散熱面積進而得以排去各裝置內部的熱量,然而,散熱鰭片的散熱效率會隨著其高度的增加而逐漸降低,從而導致散熱裝置整體的散熱效率下降。 Generally, common heat dissipation devices (heat sinks) in the industry are composed of a substrate and a plurality of heat dissipation fins, and these heat dissipation fins are arranged on one side of the substrate. Under the condition that the heat generated inside each device is also gradually increasing, the size of the heat dissipation fins on the substrate must also be relatively increased and increased in order to obtain a larger and more heat dissipation area so as to dissipate the heat inside each device. However, the heat dissipation fins The heat dissipation efficiency of the sheet will gradually decrease with the increase of its height, thereby causing the overall heat dissipation efficiency of the heat dissipation device to decrease.
以上所述,習知具有下列之缺點:1.散熱效率極差;2.散熱裝置體積過大。 As mentioned above, the conventional one has the following disadvantages: 1. The heat dissipation efficiency is extremely poor; 2. The volume of the heat dissipation device is too large.
是以,要如何解決上述習用之問題與缺失,即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the inventor of this case and the relevant manufacturers engaged in this industry are eager to research and improve.
爰此,為有效解決上述之問題,本發明之主要目的在於提供一種大幅增加散熱效率之散熱單元。 Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation unit that greatly increases the heat dissipation efficiency.
本發明之次要目的,在於提供一種可大幅減少散熱裝置體積之散熱單元。 A secondary objective of the present invention is to provide a heat dissipation unit that can greatly reduce the volume of the heat dissipation device.
本發明之次要目的,在於提供一種大幅增加散熱效率之散熱裝置。 A secondary objective of the present invention is to provide a heat dissipation device that greatly increases heat dissipation efficiency.
本發明之次要目的,在於提供一種可大幅減少散熱裝置體積之散熱裝置。 A secondary objective of the present invention is to provide a heat dissipation device that can greatly reduce the volume of the heat dissipation device.
為達上述目的,本發明係提供一種散熱單元,其具有至少一散熱鰭片,該散熱鰭片係由一第一板體及一第二板體相對應蓋合構成,並該第一、二板體共同界定複數獨立流道,該等獨立流道彼此相連通,該等獨立流道內填充一工作流體。 In order to achieve the above object, the present invention provides a heat dissipation unit, which has at least one heat dissipation fin. The plate bodies together define a plurality of independent flow channels, the independent flow channels are communicated with each other, and a working fluid is filled in the independent flow channels.
為達上述目的,本發明係提供一種散熱裝置,係包括一基座及一散熱單元,該基座具有一第一側及一第二側,該散熱單元具有至少一散熱鰭片對應設置於所述第一側上,該散熱鰭片係由一第一板體及一第二板體相對應蓋合構成,並該第一、二板體共同界定複數獨立流道,該等獨立流道彼此相連通,該等獨立流道內填充一工作流體(可選擇為氨或冷媒或水或碳氫化合物或其他化合物其中任一)。 In order to achieve the above object, the present invention provides a heat dissipation device, which includes a base and a heat dissipation unit, the base has a first side and a second side, and the heat dissipation unit has at least one heat dissipation fin correspondingly disposed on the heat dissipation unit. On the first side, the heat dissipation fin is composed of a first plate body and a second plate body correspondingly covered, and the first and second plate bodies together define a plurality of independent flow channels, and the independent flow channels are mutually These independent flow channels are filled with a working fluid (optionally ammonia or refrigerant or water or hydrocarbons or other compounds).
透過本發明此結構的設計,藉由所述散熱鰭片內設置彼此相連通的獨立流道之結構設計,當該基座之第二側與一熱源相接觸時,該熱源產生的熱量會由基座的第二側傳遞至第一側再傳遞至該散熱鰭片上,接著熱量會傳遞至所述獨立流道內,以令該彼此相連通之獨立流道內的工作流體形成氣態,並該氣態工作流體會將熱量快速帶至遠離熱源的另一端,並且該氣態工作流體聚集凝結成液態工作流體後,再藉由獨立流道之內壁設置的至 少一毛細結構將液態工作流體迴流至靠近熱源一端的散熱鰭片處,如此一來即形成一氣液兩相不斷循環的散熱鰭片,達到快速解熱之效果,而可大幅提高散熱裝置的散熱效率。 Through the design of the structure of the present invention, through the structural design of independent flow channels connected to each other in the heat dissipation fins, when the second side of the base is in contact with a heat source, the heat generated by the heat source will be generated by the heat source. The second side of the base is transferred to the first side and then transferred to the heat dissipation fin, and then the heat is transferred to the independent flow channels, so that the working fluid in the independent flow channels connected to each other forms a gaseous state, and the The gaseous working fluid will quickly bring heat to the other end away from the heat source, and after the gaseous working fluid is condensed and condensed into a liquid working fluid, it is then passed through the inner wall of the independent flow channel. One less capillary structure returns the liquid working fluid to the heat dissipation fin near the end of the heat source, thus forming a heat dissipation fin with continuous circulation of gas and liquid two phases, achieving the effect of rapid heat dissipation, and can greatly improve the heat dissipation efficiency of the heat dissipation device .
此外,透過所述散熱鰭片內彼此相連通的獨立流道結構設計,可改善習知散熱裝置之散熱鰭片體積過大而導致的散熱效率極差的問題,本發明利用具有氣液兩相循環的獨立流道之結構設計,得以使該散熱裝置的體積雖小但不影響其散熱效率甚至更優於習知之散熱裝置。 In addition, through the design of the independent flow channels in the heat dissipation fins that communicate with each other, the problem of extremely poor heat dissipation efficiency caused by the excessively large heat dissipation fins of the conventional heat dissipation device can be improved. The present invention utilizes a gas-liquid two-phase circulation The structure design of the independent flow channel can make the heat dissipation device small but not affect its heat dissipation efficiency or even better than the conventional heat dissipation device.
2:散熱單元 2: cooling unit
20:散熱鰭片 20: cooling fins
201:第一板體 201: The first board body
202:第二板體 202: Second plate body
21 a、21b:獨立流道 21a, 21b: Independent flow channel
211a、211b:遠離熱源端 211a, 211b: away from the heat source
212a、212b:靠近熱源端 212a, 212b: near the heat source end
210:凹槽 210: Groove
211:第一槽部 211: The first groove
212:第二槽部 212: The second groove
22:工作流體 22: Working fluid
23:毛細結構 23: capillary structure
24:填充口 24: Filling port
25:肋條 25: Ribs
3:基座 3: Base
30:第一側 30: First side
300:嵌槽 300: Groove
31:第二側 31: Second side
4:散熱裝置 4: cooling device
5:熱源 5: heat source
第1圖係為本發明散熱單元之第一實施例之立體分解圖;第2圖係為本發明散熱單元之第一實施例之剖視圖;第3圖係為本發明散熱單元之第二實施例之立體分解圖;第4圖係為本發明散熱單元之第二實施例之立體組合圖;第5圖係為本發明散熱單元之第二實施例之剖視圖;第6圖係為本發明散熱單元之第三實施例之立體圖;第7圖係為本發明散熱裝置之第一、二實施例之立體組合圖;第8圖係為本發明散熱裝置之第二實施例之剖視圖。 Figure 1 is an exploded perspective view of the first embodiment of the heat dissipation unit of the present invention; Figure 2 is a cross-sectional view of the first embodiment of the heat dissipation unit of the present invention; Figure 3 is the second embodiment of the heat dissipation unit of the present invention Figure 4 is a perspective combined view of the second embodiment of the heat dissipation unit of the present invention; Figure 5 is a cross-sectional view of the second embodiment of the heat dissipation unit of the present invention; Figure 6 is the heat dissipation unit of the present invention. FIG. 7 is a three-dimensional combined view of the first and second embodiments of the heat dissipation device of the present invention; and FIG. 8 is a cross-sectional view of the second embodiment of the heat dissipation device of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.
請參閱第1、2圖,係為本發明散熱單元之第一實施例之立體分解圖及剖視圖,如圖所示,一種散熱單元2,其具有至少一散熱鰭片20,該散熱鰭片20係由一第一板體201及一第二板體202相對應蓋合所構成,於本實施例中,於該第一板體201上形成有至少一凹槽210(當然也可選擇在第二板體202上形成所述凹槽210,本實施例係以第一板體201做說明),更詳細地說,本實
施例該散熱鰭片20的第一板體201具有一凹槽210結構,該第二板體202則為一平板體(不具有凹槽210結構);將所述第一、二板體201、202相對應蓋合以令該第一板體201的凹槽210與所述第二板體202構成複數獨立流道21a、21b,呈長短交錯排列設置(圖中顯示該獨立流道21a相對該獨立流道21b較長;亦即該獨立流道21b較短),且每一獨立流道21 a、21b具有一靠近熱源端212a、212b及一遠離熱源端211a、211b,相鄰的獨立流道21 a、21b的靠近熱源端212a、212b及遠離熱源端211a、211b係為高低不一的設置。該等獨立流道21 a、21b彼此相互連通,並於該等獨立流道21 a、21b內填充有一工作流體22位於該靠近熱源端212a、212b以供氣液循環使用,另外,每一獨立流道21 a、21b之內壁還可以再設置至少一毛細結構23(請參閱第1、2圖)或鍍膜,該毛細結構23係可選擇為網格體或纖維體或具有多孔性質之結構體或溝槽其中任一,其目的係增加該獨立流道21 a、21b內工作流體22的氣液循環之效能。
Please refer to FIGS. 1 and 2, which are an exploded perspective view and a cross-sectional view of a first embodiment of a heat dissipation unit of the present invention. As shown in the figures, a
所述鍍膜可設於獨立流道21 a、21b內壁或毛細結構23其一或二者都可設置。
The coating film may be provided on the inner walls of the
再請參閱第3、4、5圖,係為本發明散熱單元之第二實施例之立體圖及剖視圖,第二實施例與第一實施例之差異在於,該散熱鰭片20的第一板體201上形成有至少一第一槽部211,而於該第二板體202上則形成有至少一第二槽部212,也就是在第一、二板體201、202皆形成有槽部的結構,將所述第一、二板體201、202相對應蓋合令所述第一、二槽部211、212構成所述獨立流道21 a、21b,該獨立流道21 a、21b內同樣也填充有所述工作流體22。
Please refer to Figures 3, 4, and 5, which are perspective views and cross-sectional views of the second embodiment of the heat dissipation unit of the present invention. The difference between the second embodiment and the first embodiment is that the first plate body of the
前述之散熱鰭片20的製造流程大致如後所述:首先,先將第一、二板體201、202之其中一板體進行機械加工處理以形成前述凹槽210,亦或是同時將第一、二板體201、202透過機械加工形成前述之第一、二槽部211、212,
而所述機械加工係利用沖壓加工方式形成前述之凹槽210或是第一、二槽部211、212,再將第一、二板體201、202利用焊接或其他結合方式將其相對應蓋合固定,而使第一板體201或第二板體202上形成的凹槽210(或第一板體201上形成的第一槽部211及第二板體202上形成的第二槽部212)構成前述的獨立流道21 a、21b結構,接著將該獨立流道21 a、21b進行抽真空處理並同時由該散熱鰭片20的一填充口24(如第4圖所示)填入所述工作流體22(可選擇為氨或冷媒或水或碳氫化合物或其他化合物其中任一)再將該等凹槽210周緣以及該填充口24進行密封處理後,即形成本發明之散熱鰭片20結構。
The manufacturing process of the aforementioned heat dissipation fins 20 is generally as follows: first, one of the first and
另外,需補充說明的是,前述之凹槽210(或第一、二槽部211、212)的形狀、大小、排列方式及排列方向並沒有特別限制,如:凹槽210可呈長短不一交錯排列形成於所述第一、二板體201、202上,或是凹槽210的排列方向可呈直向並排或呈斜向並排方式(如第4圖所示)形成於所述第一、二板體201、202,其係可依照使用者的需求進行調整;只要所述凹槽210(或第一、二槽部211、212)因所述第一、二板體201、202相互蓋合被構成前述之獨立流道21 a、21b結構態樣,皆包含於本發明之範圍內,合先敘明;此外,該獨立流道21 a、21b內壁及毛細結構或二者之間可進一步設置前述之鍍膜(圖未示),以增加該工作流體22於該獨立流道21 a、21b內的氣液循環之效能。
In addition, it should be added that the shape, size, arrangement and arrangement direction of the aforementioned grooves 210 (or the first and
再請參閱第6圖,係為本發明散熱單元之第三實施例之立體圖,與第一實施例之差異在於,所述散熱鰭片20更形成複數肋條25,該等肋條25並不限制數量及設置的方向(可呈橫向或縱向方向或交錯設置),其係根據使用者之需求進行調整,而所述肋條25結構之作用係用以增加所述散熱鰭片20之結構強度,使散熱鰭片20不易變形。
Please refer to FIG. 6 again, which is a perspective view of a third embodiment of the heat dissipation unit of the present invention. The difference from the first embodiment is that the
請一併參閱第7圖,係為本發明散熱裝置第一、第二實施例之立體組合圖,該散熱裝置4係將前述之散熱單元2搭配一基座3所構成,該基座3具有一第一側30及一第二側31,並該第一側30形成至少一嵌槽300,所述散熱鰭片20對應固設於該嵌槽300內,而散熱鰭片20的固設方式係可選擇利用嵌合或鉚接或焊接或膠黏或卡接其中任一方式固設於所述嵌槽300內。
Please also refer to FIG. 7, which is a three-dimensional combined view of the first and second embodiments of the heat dissipation device of the present invention. The
再請一併參閱第8圖,透過本發明此結構的設計,藉由所述散熱鰭片20內設置彼此相互連通的獨立流道21 a、21b之結構設計,當該基座3之第二側31與一熱源5相接觸時,該熱源5產生的熱量會由基座3的第二側31傳遞至第一側30再傳遞至該散熱鰭片20上,接著熱量會傳遞至所述獨立流道21 a、21b內,以令該獨立流道21 a、21b內的工作流體22形成氣態,並該氣態工作流體22會快速將熱量帶至遠離熱源5的另一端(即該遠離熱源端211a、211b),並且該氣態工作流體22聚集凝結成液態工作流體22後,藉由獨立流道21 a、21b之內壁設置的毛細結構23以將液態工作流體22迴流至靠近熱源5一端(即該靠近熱源端212a、212b)的散熱鰭片20處,如此一來即形成一氣液兩相不斷循環的散熱鰭片20,達到快速解熱之效果,而可大幅提高散熱裝置4的散熱效率。
Please also refer to FIG. 8 , through the design of the structure of the present invention, the
此外,透過本發明之散熱鰭片20內的獨立流道21 a、21b結構設計,還可改善習知散熱裝置4之散熱鰭片20體積過大而導致的散熱效率極差的問題,本發明利用具有氣液兩相的獨立流道21 a、21b之結構設計,得以使該散熱裝置4的體積雖小但不影響其散熱效率甚至更優於習知之散熱裝置。
In addition, through the structural design of the
以上所述,本發明相較於習知具有下列優點:1.大幅提高散熱效率;2.大幅減少散熱裝置體積。 As mentioned above, the present invention has the following advantages compared with the prior art: 1. Greatly improve the heat dissipation efficiency; 2. Greatly reduce the volume of the heat dissipation device.
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳 實施例而已,當不能限定本發明實施之範圍,即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the above is only one of the preferred embodiments of the present invention The examples are only examples, which cannot limit the scope of implementation of the present invention, that is, all equivalent changes and modifications made according to the scope of the application of the present invention should still fall within the scope of the patent of the present invention.
2:散熱單元 2: cooling unit
201:第一板體 201: The first board body
202:第二板體 202: Second plate body
21:獨立流道 21: Independent runner
210:凹槽 210: Groove
23:毛細結構 23: capillary structure
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TW108100330 | 2019-01-04 | ||
TW108100330 | 2019-01-04 |
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TW202026587A TW202026587A (en) | 2020-07-16 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWM452370U (en) * | 2012-11-16 | 2013-05-01 | Asia Vital Components Co Ltd | Heat dissipation device |
CN108336048A (en) * | 2018-01-31 | 2018-07-27 | 上海嘉熙科技有限公司 | Hot superconduction fin radiator with phase-transition heat-storage function |
CN108803837A (en) * | 2017-04-26 | 2018-11-13 | 联想(新加坡)私人有限公司 | The manufacturing method of template heat transfer apparatus, electronic equipment and template heat transfer apparatus |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM452370U (en) * | 2012-11-16 | 2013-05-01 | Asia Vital Components Co Ltd | Heat dissipation device |
CN108803837A (en) * | 2017-04-26 | 2018-11-13 | 联想(新加坡)私人有限公司 | The manufacturing method of template heat transfer apparatus, electronic equipment and template heat transfer apparatus |
CN108336048A (en) * | 2018-01-31 | 2018-07-27 | 上海嘉熙科技有限公司 | Hot superconduction fin radiator with phase-transition heat-storage function |
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