TWI749261B - 電連接器組合及其固定座 - Google Patents

電連接器組合及其固定座 Download PDF

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TWI749261B
TWI749261B TW107133047A TW107133047A TWI749261B TW I749261 B TWI749261 B TW I749261B TW 107133047 A TW107133047 A TW 107133047A TW 107133047 A TW107133047 A TW 107133047A TW I749261 B TWI749261 B TW I749261B
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electrical connector
connector assembly
fixing
fixing seat
insulating body
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TW201917953A (zh
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鄔恒康
彭付金
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英屬開曼群島商鴻騰精密科技股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7076Coupling devices for connection between PCB and component, e.g. display
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5213Covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/066Heatsink mounted on the surface of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一種電連接器組合及其固定座,電連接器組合包括電連接器、圍設於電連接器外的固定座及可以安裝固定於所述固定座的保護蓋,所述電連接器包括絕緣本體及固持於所述絕緣本體的複數導電端子,絕緣本體具有晶片收容腔,所述導電端子凸伸入所述晶片收容腔,所述固定座包括設置於所述電連接器相對兩側的第一固定座及第二固定座,所述第一、第二固定座彼此獨立設置,藉此實現降低產品製造成本的同時便於安裝與拆卸。

Description

電連接器組合及其固定座
一種電連接器組合及其固定座,尤其涉及一種電性連接晶片模組至電路板的電連接器組合及其固定座。
電連接器因電氣性能穩定而廣泛應用於電腦等電子領域中,用於連接晶片模組至電路板的組合式電連接器通常包括複數絕緣本體、收容於絕緣本體中的導電端子。參照中國大陸發明專利公告第CN106711685A號公開了一種電連接器,其包括一固定座,所述晶片係由一散熱器按壓固定於所述絕緣本體的上方,所述散熱器組裝並固定於所述固定座,所述固定座包括組裝於所述底座的一組對角的兩螺絲、組裝於所述底座的另一組對角的兩直徑一大一小的定位柱及於所述前後方向的中間位置的一對用以支撐所述散熱器的彈性金屬件。然而,其固定座一體式設置成U字型,增加了製造成本的同時,於所述固定座一邊損壞的情況下,則需要更換整個固定座才能達到目的,因而不僅提升了成本且不易於更換所述固定座。
是以,確有必要提供一種新的技術方案,俾克服上述缺陷。
本發明所要達成之目的係提供便於拆卸的電連接器組合及其固定座。
為解決上述技術問題,本發明提供一種固定座,其用於安裝至一電路板以固定電連接器,所述固定座包括第一固定座及第二固定座,所述第一、第二固定座彼此獨立且相互平行設置而形成用來限制所述電連接器的限位空間,所述第一、第二固定座分別於其一端設置一定位柱,第一、第二固定座的定位柱彼此呈斜對角設置且一大一小。
為實現上述目的,本發明還可以採用如下技術方案:一種電連接器組合,包括電連接器、圍設於電連接器外的固定座及可以安裝固定於所述固定座的保護蓋,所述電連接器包括絕緣本體及固持於所述絕緣本體的複數導電端子,絕緣本體具有晶片收容腔,所述導電端子凸伸入所述晶片收容腔,所述固定座包括設置於所述電連接器相對兩側的第一固定座及第二固定座,所述第一、第二固定座彼此獨立設置。
相對先前技術,本發明具有如下有益效果:所述固定座分體兩件式設置,實現將所述散熱器穩定固定的技術效果的同時,使得製造成本更少、利於更換損壞的產品及便於拆卸與安裝。
100:電連接器組合
200:電路板
10:電連接器
11:絕緣本體
110:晶片收容腔
20:固定座
21:底座
210:凸柱
211:鎖緊件
212:定位柱
22:金屬件
220:固定孔
221:穿孔
222:讓位孔
23:螺釘
230:螺紋部
231:螺帽部
30:保護蓋
31:主體部
32:卡扣部
320:水平部
321:卡勾
33:環扣部
330:環形孔
34:配合部
340:配合孔
第一圖係本發明電連接器組合組裝於一電路板上的立體圖。
第二圖係第一圖對應的側視圖。
第三圖係第一圖所示電連接器組合的部分分解圖。
第四圖係第一圖所示電連接器組合的部分分解圖。
第五圖係第一圖所示保護蓋與金屬件配合時的立體圖。
第六圖係第五圖的立體分解圖。
第七圖係第五圖另一角度的立體圖。
第八圖係第七圖的立體分解圖。
如下具體實施方式將結合上述附圖進一步說明本發明。
以下,將結合第一圖至第八圖介紹本發明電連接器組合及其固定座的具體實施方式。本發明電連接器組合100,用於連接晶片模組(未圖示)至電路板200,其包括電連接器10、圍設於電連接器10外的固定座20及固定於所述固定座20並蓋設於所述電連接器10上方的保護蓋30。所述電連接器10具有絕緣本體11、固持於所述絕緣本體11的複數導電端子(未圖示)。所述絕緣本體11具有晶片收容腔110,所述導電端子凸伸入所述晶片收容腔110。定義所述保護蓋30與固定座20的組裝方向為上下方向,未組裝晶片模組時,所述保護蓋30向下扣合於所述固定座20,當需要組裝晶片時,所述保護蓋30首先從所述固定座20拆離。所述晶片模組係由一散熱器(未圖示)按壓固定於所述絕緣本體11的上方。
重點參閱第三圖所示,所述固定座20包括於所述電連接器10兩側相對設置的第一固定座及第二固定座,所述第一、第二固定座彼此獨立且相互平行設置而形成用來限制所述電連接器10的限位空間(未標號)。所述第一固定座及第二固定座設置於所述絕緣本體11相對較長側邊的外側,其於絕緣本體11相對較短側邊處呈開口狀,從而形成用以限制所述絕緣本體11的限位空間。所述第一、第二固定座均設有一底座21、與所述底座21配合固定的一金屬件22及一置於所述底座21中部的螺釘23,所述底座21、金屬件22及螺釘23互相配合固定。每一底座21均設有一對向上凸伸的凸柱210及位於所述凸柱210之間的一對鎖緊件211,所述螺釘23位於所述鎖緊件211之間且具有螺紋部230以及位於螺 紋部230下方的螺帽部231,所述金屬件22設有與所述凸柱210配合固定的固定孔220、供所述螺紋部230讓位的穿孔221及供所述鎖緊件211讓位的讓位孔222。所述第一、第二固定座分別於自其一端設有一向上凸伸並高於所述凸柱210的定位柱212,第一、第二固定座的定位柱212彼此呈斜對角設置且一大一小。
所述保護蓋30包括蓋設於所述導電端子上方以保護所述導電端子的主體部31、設於所述主體部31縱長兩側的一對卡扣至所述金屬件22的卡扣部32、位於所述卡扣部32之間的一環扣部33及與所述定位柱212配合固定的配合部34。所述卡扣部32包括自所述主體部31水平延伸的水平部320及自所述水平部320向下彎折延伸的卡勾321,所述卡勾321與所述金屬件22扣合固定,所述環扣部33上設有環形孔330以套設至所述螺釘23的螺紋部230上,所述配合部34設有一大一小的配合孔340分別與所述一大一小的定位柱212固定配合,所述兩配合部34的配合孔340均上下貫穿其本體。
組裝步驟如下:首先將所述電連接器10及一對底座21安裝至所述電路板200上,所述底座21相對設置於所述電連接器10的絕緣本體11相對較長側邊的外側,所述底座21通過所述鎖緊件211鎖定至所述電路板200上,所述兩鎖緊件211之間形成有限制所述電連接器10的限位空間;而後將所述螺釘23置於所述底座21的中部,再將所述金屬件22固定至所述底座21上,此時,所述固定孔220與所述凸柱210配合固定,所述螺紋部230扣合至所述穿孔221,所述讓位孔222位於所述鎖緊件211上方以供所述螺絲刀(未圖示)旋緊所述鎖緊件211以將所述底座21穩定的固定至所述電路板200;最後將所述保護蓋30的卡扣部32卡扣至所述金屬件22的下側,將所述環扣部33扣合至所述螺紋部230並搭接至所述金屬件22的上表面上,另外,所述配合部34一大一小的配合孔340分別扣合固定至對應的一大一小的定位柱212上。將本電連接器組合100去固定晶片模組時,首 先將所述保護蓋30取下,而後再將所述晶片模組固定至電連接器10以實現電性連接。
綜上所述,本發明電連接器組合100通過將所述固定座20分體兩件式設置,且分別置於所述電連接器10的兩較長的側邊的兩側,可以將所述散熱器穩定固定至所述凸柱210上,進一步的,於安裝與拆卸的過程中,其中一固定座20損壞的情形下,僅需更換一固定座即可而無需更換整個固定座造成資源浪費,因而降低了所述電連接器組合的製造成本並簡化了安裝與拆卸的過程。另外,於所述保護蓋30的縱長兩側設有卡扣至所述固定座20的卡扣部32,可以將所述保護蓋30更加穩固的固定配合至所述固定座20上,而提升所述電連接器10的防塵效果。
以上所述僅為本發明的部分實施方式,不是全部的實施方式,本領域普通技術人員通過閱讀本發明說明書而對本發明技術方案採取的任何等效的變化,均為本發明的權利要求所涵蓋。
200:電路板
10:電連接器
11:絕緣本體
110:晶片收容腔
21:底座
212:定位柱
22:金屬件
23:螺釘
31:主體部
32:卡扣部
33:環扣部
330:環形孔
34:配合部
340:配合孔

Claims (7)

  1. 一種電連接器組合,包括:電連接器,包括絕緣本體及固持於所述絕緣本體的複數導電端子,所述絕緣本體具有晶片收容腔,所述導電端子凸伸入所述晶片收容腔;固定座,圍設於電連接器外;以及保護蓋,安裝固定於所述固定座;其中,所述固定座包括設置於所述電連接器相對兩側的第一固定座及第二固定座,所述第一、第二固定座彼此獨立設置,所述第一、二固定座均包括底座及與所述底座配合固定的金屬件,所述保護蓋的縱長兩側分別設有卡扣至所述金屬件的一對卡扣部及位於所述卡扣部之間的一環扣部。
  2. 如請求項1所述之電連接器組合,其中所述第一固定座及第二固定座設置於所述絕緣本體相對較長側邊的外側,其於絕緣本體相對較短側邊處呈開口狀,從而形成用以限制所述絕緣本體的限位空間。
  3. 如請求項1所述之電連接器組合,其中所述底座設有一對向上凸伸的凸柱,所述金屬件設有與所述凸柱配合固定的固定孔。
  4. 如請求項3所述之電連接器組合,其中所述兩底座分別自其一端設有一向上凸伸並高於所述凸柱的定位柱,所述定位柱呈一大一小對角設置。
  5. 如請求項4所述之電連接器組合,其中所述第一、第二固定座分別設有一置於所述底座的螺釘,所述螺釘具有螺紋部以及位於螺紋部下方的螺帽部,所述金屬件設有供所述螺紋部穿過的穿孔。
  6. 如請求項5所述之電連接器組合,其中所述環扣部供所述螺釘穿過。
  7. 如請求項6所述之電連接器組合,其中所述保護蓋的兩對角分設有與所述定位柱配合固定的配合部,以固定所述保護蓋,所述配合 部設有一大一小的配合孔。
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