TWI748122B - 用於對多個項進行分類的系統、方法和電腦程式產品 - Google Patents

用於對多個項進行分類的系統、方法和電腦程式產品 Download PDF

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TWI748122B
TWI748122B TW107130054A TW107130054A TWI748122B TW I748122 B TWI748122 B TW I748122B TW 107130054 A TW107130054 A TW 107130054A TW 107130054 A TW107130054 A TW 107130054A TW I748122 B TWI748122 B TW I748122B
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defects
defect
user
class
given
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TW107130054A
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TW201933279A (zh
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阿賽夫 艾斯拜格
寶茲 扣漢
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以色列商應用材料以色列公司
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/23—Clustering techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2415—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on parametric or probabilistic models, e.g. based on likelihood ratio or false acceptance rate versus a false rejection rate
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/40—Software arrangements specially adapted for pattern recognition, e.g. user interfaces or toolboxes therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0481—Interaction techniques based on graphical user interfaces [GUI] based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance
    • G06F3/0482—Interaction with lists of selectable items, e.g. menus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/02—Knowledge representation; Symbolic representation
    • G06N5/022—Knowledge engineering; Knowledge acquisition
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/762—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using clustering, e.g. of similar faces in social networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/94—Hardware or software architectures specially adapted for image or video understanding
    • G06V10/945—User interactive design; Environments; Toolboxes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Computing Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Multimedia (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Medical Informatics (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Databases & Information Systems (AREA)
  • Mathematical Physics (AREA)
  • Human Computer Interaction (AREA)
  • Quality & Reliability (AREA)
  • Computational Linguistics (AREA)
  • Probability & Statistics with Applications (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)
TW107130054A 2017-09-28 2018-08-29 用於對多個項進行分類的系統、方法和電腦程式產品 TWI748122B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/719,433 US11138507B2 (en) 2017-09-28 2017-09-28 System, method and computer program product for classifying a multiplicity of items
US15/719,433 2017-09-28

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TW201933279A TW201933279A (zh) 2019-08-16
TWI748122B true TWI748122B (zh) 2021-12-01

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US (1) US11138507B2 (enExample)
JP (1) JP2019106171A (enExample)
KR (1) KR102377374B1 (enExample)
CN (1) CN109598698B (enExample)
TW (1) TWI748122B (enExample)

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US11282189B2 (en) * 2019-09-16 2022-03-22 Intel Corporation Unsupervised clustering to identify anomalies
US11360030B2 (en) * 2020-02-04 2022-06-14 Applied Materials Isreal Ltd Selecting a coreset of potential defects for estimating expected defects of interest
US11379972B2 (en) 2020-06-03 2022-07-05 Applied Materials Israel Ltd. Detecting defects in semiconductor specimens using weak labeling
CN111680750B (zh) * 2020-06-09 2022-12-06 创新奇智(合肥)科技有限公司 图像识别方法、装置和设备
US11507252B2 (en) 2020-08-19 2022-11-22 Panasonic Intellectual Property Management Co., Ltd. Methods and systems for monitoring objects for labelling
JP7635540B2 (ja) * 2020-12-09 2025-02-26 富士フイルムビジネスイノベーション株式会社 情報処理装置、及び情報処理プログラム
US11176516B1 (en) * 2020-12-21 2021-11-16 Coupang Corp. Systems and methods for automated information collection and processing
EP4315178A4 (en) * 2021-03-30 2024-12-04 Siemens Industry Software Inc. METHOD AND SYSTEM FOR DETECTING A FALSE ERROR ON A COMPONENT OF A BOARD INSPECTED BY AN AOI MACHINE
US12198332B2 (en) * 2021-09-28 2025-01-14 Siemens Healthineers International Ag Systems and methods for refining training data
KR20240112881A (ko) 2021-12-20 2024-07-19 칼 짜이스 에스엠테 게엠베하 증가된 처리량을 갖는 반도체 피처의 측정 방법 및 장치
WO2023143950A1 (en) 2022-01-27 2023-08-03 Carl Zeiss Smt Gmbh Computer implemented method for the detection and classification of anomalies in an imaging dataset of a wafer, and systems making use of such methods
CN116486178B (zh) * 2023-05-16 2024-01-19 中科慧远视觉技术（洛阳）有限公司 一种缺陷检测方法、装置、电子设备及存储介质

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KR20190037161A (ko) 2019-04-05
TW201933279A (zh) 2019-08-16
JP2019106171A (ja) 2019-06-27
CN109598698B (zh) 2024-02-27
CN109598698A (zh) 2019-04-09
US20190095800A1 (en) 2019-03-28
KR102377374B1 (ko) 2022-03-21
US11138507B2 (en) 2021-10-05

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