JP2019106171A - 複数のアイテムを分類するためのシステム、方法およびコンピュータプログラム製品 - Google Patents

複数のアイテムを分類するためのシステム、方法およびコンピュータプログラム製品 Download PDF

Info

Publication number
JP2019106171A
JP2019106171A JP2018183320A JP2018183320A JP2019106171A JP 2019106171 A JP2019106171 A JP 2019106171A JP 2018183320 A JP2018183320 A JP 2018183320A JP 2018183320 A JP2018183320 A JP 2018183320A JP 2019106171 A JP2019106171 A JP 2019106171A
Authority
JP
Japan
Prior art keywords
defects
defect
class
user
classified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018183320A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019106171A5 (enExample
Inventor
アズバッグ アッサフ
Asbag Assaf
アズバッグ アッサフ
コーエン ボアズ
Cohen Boaz
コーエン ボアズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Israel Ltd
Original Assignee
Applied Materials Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Israel Ltd filed Critical Applied Materials Israel Ltd
Publication of JP2019106171A publication Critical patent/JP2019106171A/ja
Publication of JP2019106171A5 publication Critical patent/JP2019106171A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/23—Clustering techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2415—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on parametric or probabilistic models, e.g. based on likelihood ratio or false acceptance rate versus a false rejection rate
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/40—Software arrangements specially adapted for pattern recognition, e.g. user interfaces or toolboxes therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0481—Interaction techniques based on graphical user interfaces [GUI] based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance
    • G06F3/0482—Interaction with lists of selectable items, e.g. menus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/02—Knowledge representation; Symbolic representation
    • G06N5/022—Knowledge engineering; Knowledge acquisition
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/762—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using clustering, e.g. of similar faces in social networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/94—Hardware or software architectures specially adapted for image or video understanding
    • G06V10/945—User interactive design; Environments; Toolboxes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Computing Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Multimedia (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Medical Informatics (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Databases & Information Systems (AREA)
  • Mathematical Physics (AREA)
  • Human Computer Interaction (AREA)
  • Quality & Reliability (AREA)
  • Computational Linguistics (AREA)
  • Probability & Statistics with Applications (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)
JP2018183320A 2017-09-28 2018-09-28 複数のアイテムを分類するためのシステム、方法およびコンピュータプログラム製品 Pending JP2019106171A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/719,433 US11138507B2 (en) 2017-09-28 2017-09-28 System, method and computer program product for classifying a multiplicity of items
US15/719,433 2017-09-28

Publications (2)

Publication Number Publication Date
JP2019106171A true JP2019106171A (ja) 2019-06-27
JP2019106171A5 JP2019106171A5 (enExample) 2021-09-30

Family

ID=65807515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018183320A Pending JP2019106171A (ja) 2017-09-28 2018-09-28 複数のアイテムを分類するためのシステム、方法およびコンピュータプログラム製品

Country Status (5)

Country Link
US (1) US11138507B2 (enExample)
JP (1) JP2019106171A (enExample)
KR (1) KR102377374B1 (enExample)
CN (1) CN109598698B (enExample)
TW (1) TWI748122B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110598086B (zh) * 2018-05-25 2020-11-24 腾讯科技（深圳）有限公司 文章推荐方法、装置、计算机设备及存储介质
EP3792717A1 (en) * 2019-09-12 2021-03-17 FRAUNHOFER-GESELLSCHAFT zur Förderung der angewandten Forschung e.V. Tracking system
US11282189B2 (en) * 2019-09-16 2022-03-22 Intel Corporation Unsupervised clustering to identify anomalies
US11360030B2 (en) * 2020-02-04 2022-06-14 Applied Materials Isreal Ltd Selecting a coreset of potential defects for estimating expected defects of interest
US11379972B2 (en) 2020-06-03 2022-07-05 Applied Materials Israel Ltd. Detecting defects in semiconductor specimens using weak labeling
CN111680750B (zh) * 2020-06-09 2022-12-06 创新奇智(合肥)科技有限公司 图像识别方法、装置和设备
US11507252B2 (en) 2020-08-19 2022-11-22 Panasonic Intellectual Property Management Co., Ltd. Methods and systems for monitoring objects for labelling
JP7635540B2 (ja) * 2020-12-09 2025-02-26 富士フイルムビジネスイノベーション株式会社 情報処理装置、及び情報処理プログラム
US11176516B1 (en) * 2020-12-21 2021-11-16 Coupang Corp. Systems and methods for automated information collection and processing
EP4315178A4 (en) * 2021-03-30 2024-12-04 Siemens Industry Software Inc. METHOD AND SYSTEM FOR DETECTING A FALSE ERROR ON A COMPONENT OF A BOARD INSPECTED BY AN AOI MACHINE
US12198332B2 (en) * 2021-09-28 2025-01-14 Siemens Healthineers International Ag Systems and methods for refining training data
KR20240112881A (ko) 2021-12-20 2024-07-19 칼 짜이스 에스엠테 게엠베하 증가된 처리량을 갖는 반도체 피처의 측정 방법 및 장치
WO2023143950A1 (en) 2022-01-27 2023-08-03 Carl Zeiss Smt Gmbh Computer implemented method for the detection and classification of anomalies in an imaging dataset of a wafer, and systems making use of such methods
CN116486178B (zh) * 2023-05-16 2024-01-19 中科慧远视觉技术（洛阳）有限公司 一种缺陷检测方法、装置、电子设备及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005293264A (ja) * 2004-03-31 2005-10-20 Olympus Corp 学習型分類装置及び学習型分類方法
WO2010041377A1 (ja) * 2008-10-06 2010-04-15 パナソニック株式会社 代表画像表示装置及び代表画像選択方法
US20170082555A1 (en) * 2015-09-18 2017-03-23 Kla-Tencor Corporation Adaptive Automatic Defect Classification

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5544256A (en) * 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
US5966459A (en) * 1997-07-17 1999-10-12 Advanced Micro Devices, Inc. Automatic defect classification (ADC) reclassification engine
US6185511B1 (en) * 1997-11-28 2001-02-06 Advanced Micro Devices, Inc. Method to accurately determine classification codes for defects during semiconductor manufacturing
JP4132229B2 (ja) * 1998-06-03 2008-08-13 株式会社ルネサステクノロジ 欠陥分類方法
US6922482B1 (en) * 1999-06-15 2005-07-26 Applied Materials, Inc. Hybrid invariant adaptive automatic defect classification
JP2001156135A (ja) * 1999-11-29 2001-06-08 Hitachi Ltd 欠陥画像の分類方法及びその装置並びにそれを用いた半導体デバイスの製造方法
JP2001168160A (ja) * 1999-12-07 2001-06-22 Sony Corp 半導体ウェハの検査システム
US6456899B1 (en) * 1999-12-07 2002-09-24 Ut-Battelle, Llc Context-based automated defect classification system using multiple morphological masks
JP2002310962A (ja) * 2001-04-19 2002-10-23 Hitachi Ltd 画像分類方法並びに観察方法及びその装置
US7162071B2 (en) * 2002-12-20 2007-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. Progressive self-learning defect review and classification method
US7756320B2 (en) * 2003-03-12 2010-07-13 Hitachi High-Technologies Corporation Defect classification using a logical equation for high stage classification
US7020536B2 (en) * 2004-02-06 2006-03-28 Powerchip Semiconductor Corp. Method of building a defect database
CN101120329A (zh) * 2004-10-12 2008-02-06 恪纳腾技术公司 用于分类样品上的缺陷的计算机实现的方法和系统
US7904845B2 (en) * 2006-12-06 2011-03-08 Kla-Tencor Corp. Determining locations on a wafer to be reviewed during defect review
KR101214806B1 (ko) * 2010-05-11 2012-12-24 가부시키가이샤 사무코 웨이퍼 결함 검사 장치 및 웨이퍼 결함 검사 방법
WO2011155123A1 (ja) * 2010-06-07 2011-12-15 株式会社 日立ハイテクノロジーズ 観察画像の分類基準の最適化方法、および画像分類装置
JP5608575B2 (ja) * 2011-01-19 2014-10-15 株式会社日立ハイテクノロジーズ 画像分類方法および画像分類装置
US10330608B2 (en) * 2012-05-11 2019-06-25 Kla-Tencor Corporation Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools
US10140698B2 (en) * 2015-08-10 2018-11-27 Kla-Tencor Corporation Polygon-based geometry classification for semiconductor mask inspection
TWI737659B (zh) * 2015-12-22 2021-09-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US10223615B2 (en) * 2016-08-23 2019-03-05 Dongfang Jingyuan Electron Limited Learning based defect classification
US10713769B2 (en) * 2018-06-05 2020-07-14 Kla-Tencor Corp. Active learning for defect classifier training
US10825650B2 (en) * 2018-09-28 2020-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. Machine learning on wafer defect review
CN110414538B (zh) * 2019-07-24 2022-05-27 京东方科技集团股份有限公司 缺陷分类方法、缺陷分类训练方法及其装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005293264A (ja) * 2004-03-31 2005-10-20 Olympus Corp 学習型分類装置及び学習型分類方法
WO2010041377A1 (ja) * 2008-10-06 2010-04-15 パナソニック株式会社 代表画像表示装置及び代表画像選択方法
US20170082555A1 (en) * 2015-09-18 2017-03-23 Kla-Tencor Corporation Adaptive Automatic Defect Classification

Also Published As

Publication number Publication date
KR20190037161A (ko) 2019-04-05
TW201933279A (zh) 2019-08-16
CN109598698B (zh) 2024-02-27
TWI748122B (zh) 2021-12-01
CN109598698A (zh) 2019-04-09
US20190095800A1 (en) 2019-03-28
KR102377374B1 (ko) 2022-03-21
US11138507B2 (en) 2021-10-05

Similar Documents

Publication Publication Date Title
TWI748122B (zh) 用於對多個項進行分類的系統、方法和電腦程式產品
US12007335B2 (en) Automatic optimization of an examination recipe
CN114092387B (zh) 生成可用于检查半导体样本的训练数据
US11568531B2 (en) Method of deep learning-based examination of a semiconductor specimen and system thereof
CN110945528B (zh) 产生可用于检查半导体样品的训练集的方法及其系统
US12361531B2 (en) Machine learning-based classification of defects in a semiconductor specimen
US11423529B2 (en) Determination of defect location for examination of a specimen
US12277750B2 (en) Identification of an array in a semiconductor specimen
KR102893525B1 (ko) 기준 이미지에 기반한 시편에서의 결함들 및/또는 가장자리 거칠기의 결정
US11360030B2 (en) Selecting a coreset of potential defects for estimating expected defects of interest
TWI906018B (zh) 檢查方案的自動最佳化

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210705

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210819

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20210819

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20211216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220406

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220622