TWI748097B - 基板研磨裝置及方法 - Google Patents

基板研磨裝置及方法 Download PDF

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Publication number
TWI748097B
TWI748097B TW107115842A TW107115842A TWI748097B TW I748097 B TWI748097 B TW I748097B TW 107115842 A TW107115842 A TW 107115842A TW 107115842 A TW107115842 A TW 107115842A TW I748097 B TWI748097 B TW I748097B
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TW
Taiwan
Prior art keywords
dresser
polishing
speed
evaluation index
aforementioned
Prior art date
Application number
TW107115842A
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English (en)
Chinese (zh)
Other versions
TW201906688A (zh
Inventor
廣尾康正
八木圭太
Original Assignee
日商荏原製作所股份有限公司
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Publication of TW201906688A publication Critical patent/TW201906688A/zh
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Publication of TWI748097B publication Critical patent/TWI748097B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW107115842A 2017-07-05 2018-05-10 基板研磨裝置及方法 TWI748097B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-131968 2017-07-05
JP2017131968A JP6971664B2 (ja) 2017-07-05 2017-07-05 基板研磨装置及び方法

Publications (2)

Publication Number Publication Date
TW201906688A TW201906688A (zh) 2019-02-16
TWI748097B true TWI748097B (zh) 2021-12-01

Family

ID=64903958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107115842A TWI748097B (zh) 2017-07-05 2018-05-10 基板研磨裝置及方法

Country Status (5)

Country Link
US (1) US10828747B2 (enExample)
JP (1) JP6971664B2 (enExample)
KR (1) KR102371938B1 (enExample)
SG (1) SG10201805634WA (enExample)
TW (1) TWI748097B (enExample)

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* Cited by examiner, † Cited by third party
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US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
WO2020158773A1 (ja) 2019-01-30 2020-08-06 住友化学株式会社 ピリドン化合物の製造方法
MX2021011834A (es) 2019-03-29 2022-02-22 Saint Gobain Abrasives Inc Soluciones de rectificación de rendimiento.
JP7253458B2 (ja) 2019-06-27 2023-04-06 株式会社荏原製作所 光学式膜厚測定装置の最適な動作レシピを決定する方法、装置、およびシステム
JP7637482B2 (ja) * 2020-08-11 2025-02-28 株式会社荏原製作所 基板処理装置及び研磨部材のドレッシング制御方法
CN112936085B (zh) * 2021-02-04 2022-09-16 华海清科股份有限公司 一种化学机械抛光控制方法及控制系统
JP7684058B2 (ja) * 2021-03-01 2025-05-27 株式会社荏原製作所 研磨装置および研磨方法
WO2022256175A1 (en) * 2021-06-01 2022-12-08 Applied Materials, Inc. Methods of modeling and controlling pad wear
KR20230024626A (ko) 2021-08-12 2023-02-21 삼성전자주식회사 기판 연마 장치, 이를 이용한 기판 연마 방법 및 이를 포함하는 반도체 소자 제조 방법
JP7757903B2 (ja) * 2022-08-09 2025-10-22 株式会社Sumco ウェーハの片面研磨方法、ウェーハの製造方法、およびウェーハの片面研磨装置
TWI862986B (zh) * 2022-09-21 2024-11-21 中國砂輪企業股份有限公司 化學機械研磨修整器之再生方法及經再生之化學機械研磨修整器以及監測系統

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US9108292B2 (en) * 2013-02-22 2015-08-18 Ebara Corporation Method of obtaining a sliding distance distribution of a dresser on a polishing member, method of obtaining a sliding vector distribution of a dresser on a polishing member, and polishing apparatus
US9156122B2 (en) * 2011-06-02 2015-10-13 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
TWI572447B (zh) * 2007-11-28 2017-03-01 荏原製作所股份有限公司 硏磨墊之修整裝置

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JP4689367B2 (ja) * 2004-07-09 2011-05-25 株式会社荏原製作所 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置
US7846006B2 (en) * 2006-06-30 2010-12-07 Memc Electronic Materials, Inc. Dressing a wafer polishing pad
JP5415735B2 (ja) * 2008-09-26 2014-02-12 株式会社荏原製作所 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置
WO2011133386A2 (en) * 2010-04-20 2011-10-27 Applied Materials, Inc. Closed-loop control for improved polishing pad profiles
JP5898420B2 (ja) * 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
JP6444785B2 (ja) * 2015-03-19 2018-12-26 株式会社荏原製作所 研磨装置およびその制御方法ならびにドレッシング条件出力方法
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US9156122B2 (en) * 2011-06-02 2015-10-13 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
US9108292B2 (en) * 2013-02-22 2015-08-18 Ebara Corporation Method of obtaining a sliding distance distribution of a dresser on a polishing member, method of obtaining a sliding vector distribution of a dresser on a polishing member, and polishing apparatus
JP2014161944A (ja) * 2013-02-25 2014-09-08 Ebara Corp 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置
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Also Published As

Publication number Publication date
TW201906688A (zh) 2019-02-16
JP2019013999A (ja) 2019-01-31
US10828747B2 (en) 2020-11-10
JP6971664B2 (ja) 2021-11-24
KR102371938B1 (ko) 2022-03-08
KR20190005119A (ko) 2019-01-15
US20190009385A1 (en) 2019-01-10
SG10201805634WA (en) 2019-02-27

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