TWI746685B - Manufacturing method of active energy ray curable composition and manufacturing method of thin film using the same - Google Patents
Manufacturing method of active energy ray curable composition and manufacturing method of thin film using the same Download PDFInfo
- Publication number
- TWI746685B TWI746685B TW106138144A TW106138144A TWI746685B TW I746685 B TWI746685 B TW I746685B TW 106138144 A TW106138144 A TW 106138144A TW 106138144 A TW106138144 A TW 106138144A TW I746685 B TWI746685 B TW I746685B
- Authority
- TW
- Taiwan
- Prior art keywords
- active energy
- meth
- energy ray
- acrylate
- ray curable
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000010409 thin film Substances 0.000 title claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 260
- 239000011248 coating agent Substances 0.000 claims abstract description 46
- 238000000576 coating method Methods 0.000 claims abstract description 45
- 150000001875 compounds Chemical class 0.000 claims abstract description 17
- 238000009736 wetting Methods 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 82
- 239000002245 particle Substances 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 30
- 230000002776 aggregation Effects 0.000 claims description 3
- 238000005054 agglomeration Methods 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 88
- 238000002360 preparation method Methods 0.000 description 76
- 239000007788 liquid Substances 0.000 description 42
- -1 polyethylene terephthalate Polymers 0.000 description 33
- 239000000377 silicon dioxide Substances 0.000 description 25
- 239000011324 bead Substances 0.000 description 23
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- 239000005056 polyisocyanate Substances 0.000 description 17
- 229920001228 polyisocyanate Polymers 0.000 description 17
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 14
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 125000001931 aliphatic group Chemical group 0.000 description 11
- 229910002012 Aerosil® Inorganic materials 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 9
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 9
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000011049 filling Methods 0.000 description 5
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 5
- 239000003504 photosensitizing agent Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- IWZLBIVZPIDURM-UHFFFAOYSA-N trimethoxy(3-prop-1-enoxypropyl)silane Chemical compound CO[Si](OC)(OC)CCCOC=CC IWZLBIVZPIDURM-UHFFFAOYSA-N 0.000 description 5
- 125000002947 alkylene group Chemical group 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 230000005865 ionizing radiation Effects 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- MAOBFOXLCJIFLV-UHFFFAOYSA-N (2-aminophenyl)-phenylmethanone Chemical class NC1=CC=CC=C1C(=O)C1=CC=CC=C1 MAOBFOXLCJIFLV-UHFFFAOYSA-N 0.000 description 1
- LSFYCRUFNRBZNC-UHFFFAOYSA-N (2-hydroxyphenyl) acetate Chemical compound CC(=O)OC1=CC=CC=C1O LSFYCRUFNRBZNC-UHFFFAOYSA-N 0.000 description 1
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- HGCMSCWGVAYWHR-UHFFFAOYSA-N 1,3,5-trimethyl-2-[[phenyl-[(2,4,6-trimethylphenyl)methyl]phosphoryl]methyl]benzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)CC1=C(C)C=C(C)C=C1C HGCMSCWGVAYWHR-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- VYMSWGOFSKMMCE-UHFFFAOYSA-N 10-butyl-2-chloroacridin-9-one Chemical compound ClC1=CC=C2N(CCCC)C3=CC=CC=C3C(=O)C2=C1 VYMSWGOFSKMMCE-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- UXCIJKOCUAQMKD-UHFFFAOYSA-N 2,4-dichlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC(Cl)=C3SC2=C1 UXCIJKOCUAQMKD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- VZDIRINETBAVAV-UHFFFAOYSA-N 2,4-diisocyanato-1-methylcyclohexane Chemical compound CC1CCC(N=C=O)CC1N=C=O VZDIRINETBAVAV-UHFFFAOYSA-N 0.000 description 1
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- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
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- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- GNDOBZLRZOCGAS-JTQLQIEISA-N 2-isocyanatoethyl (2s)-2,6-diisocyanatohexanoate Chemical compound O=C=NCCCC[C@H](N=C=O)C(=O)OCCN=C=O GNDOBZLRZOCGAS-JTQLQIEISA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- 125000004864 4-thiomethylphenyl group Chemical group 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
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- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
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- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
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- ZCVZSTMWOQNVHQ-UHFFFAOYSA-K [di(dodecanoyloxy)-octylstannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(OC(=O)CCCCCCCCCCC)OC(=O)CCCCCCCCCCC ZCVZSTMWOQNVHQ-UHFFFAOYSA-K 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
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- PNXNSVYZNGNYIN-UHFFFAOYSA-N acetic acid;butanoic acid;propanoic acid Chemical compound CC(O)=O.CCC(O)=O.CCCC(O)=O PNXNSVYZNGNYIN-UHFFFAOYSA-N 0.000 description 1
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- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
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- 235000019382 gum benzoic Nutrition 0.000 description 1
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- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
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- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
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- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
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- ACLZYRNSDLQOIA-UHFFFAOYSA-N o-tolylthiourea Chemical compound CC1=CC=CC=C1NC(N)=S ACLZYRNSDLQOIA-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
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- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical class O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- HPAFOABSQZMTHE-UHFFFAOYSA-N phenyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)C1=CC=CC=C1 HPAFOABSQZMTHE-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
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- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
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- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
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- 150000003077 polyols Chemical class 0.000 description 1
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- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- UFUASNAHBMBJIX-UHFFFAOYSA-N propan-1-one Chemical compound CC[C]=O UFUASNAHBMBJIX-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- AALQBIFJJJPDHJ-UHFFFAOYSA-K trisodium;thiophosphate;dodecahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[Na+].[O-]P([O-])([O-])=S AALQBIFJJJPDHJ-UHFFFAOYSA-K 0.000 description 1
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- 239000008096 xylene Substances 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
Abstract
本發明提供一種活性能量線硬化性組成物,其係含有活性能量線硬化性化合物(A)及矽石粒子(B)之活性能量線硬化性組成物,其特徵為:該活性能量線硬化性組成物的硬化塗膜表面之潤濕張力為35~60mN/m之範圍。相對於100質量份的活性能量線硬化性化合物(A),前述矽石粒子(B)之配合量較佳為1~60質量份之範圍。本發明所欲解決的課題在於提供能對於薄膜表面賦予高的防黏連性,能形成具有高透明性與對於OCA等的高接著密著性之硬塗層之活性能量線硬化性組成物及使用其之薄膜。 The present invention provides an active energy ray curable composition, which is an active energy ray curable composition containing an active energy ray curable compound (A) and silica particles (B), and is characterized in that the active energy ray curable property The wetting tension of the hardened coating film surface of the composition is in the range of 35-60 mN/m. The blending amount of the aforementioned silica particles (B) is preferably in the range of 1 to 60 parts by mass relative to 100 parts by mass of the active energy ray curable compound (A). The problem to be solved by the present invention is to provide an active energy ray curable composition that can impart high anti-blocking properties to the film surface, and can form a hard coat with high transparency and high adhesion to OCA, etc., and Use its film.
Description
本發明關於活性能量線硬化性組成物及使用其之薄膜,該活性能量線硬化性組成物係藉由塗布在薄膜的表面上及使其硬化,而能對於薄膜表面賦予高的防黏連性,能形成具有高透明性與高接著密著性之硬塗層。 The present invention relates to a curable active energy ray composition and a film using the same. The curable active energy ray composition is coated on the surface of the film and hardened to impart high anti-blocking properties to the surface of the film , Can form a hard coat with high transparency and high adhesion.
各種樹脂薄膜係使用於液晶顯示器(LCD)、有機EL顯示器(OLED)、電漿顯示器(PDP)等的平板顯示器(FPD)表面之防損傷用薄膜、汽車的內外裝用裝飾薄膜(薄片)、窗用的低反射薄膜或熱線隔離薄膜等各種用途。然而,樹脂薄膜表面由於柔軟而耐擦傷性低,故以彌補此為目的,一般進行的是在薄膜表面上塗布由UV硬化性組成物等所成之硬塗劑及使其硬化,而在薄膜表面上設置硬塗層。概述設置硬塗層之步驟,其係從捲繞成捲筒狀的薄膜原材料送出到塗布機,塗布硬塗劑,藉由紫外線照射進行硬化,形成硬塗層後,再度捲取成捲筒狀。 Various resin films are used for damage prevention films on the surface of flat panel displays (FPD) such as liquid crystal displays (LCD), organic EL displays (OLED), and plasma displays (PDP), decorative films (sheets) for interior and exterior decoration of automobiles, Various applications such as low-reflection film for windows or heat-ray isolation film. However, the surface of the resin film is soft and the scratch resistance is low. Therefore, in order to compensate for this, it is generally performed to coat and harden a hard coat agent made of a UV curable composition on the surface of the film. A hard coating is provided on the surface. Outline the steps of setting up the hard coat layer, which is to send the film raw material wound into a roll to the coating machine, apply the hard coat agent, and harden by ultraviolet radiation to form the hard coat, and then roll it into a roll again .
此處,由於硬塗層的表面為平滑,故當再度捲取成捲筒狀時,薄膜彼此會黏住(黏連),於再加工時從捲筒送出薄膜時,發生因黏連所致的摩擦,有損傷薄膜表面之問題。Here, since the surface of the hard coat layer is smooth, the films will stick to each other (adhesion) when they are re-wound into a roll shape. When the film is sent out from the roll during reprocessing, the film will stick to each other. There is a problem of damaging the surface of the film.
作為防止上述薄膜的黏連(防黏連)之方法,有提案在硬塗劑中添加矽石粒子等的微粒子,於硬塗劑的硬化塗膜表面上形成凹凸之方法(例如,參照專利文獻1及2)。又,亦有提案併用平均一次粒徑為5~80nm的矽石粒子與平均一次粒徑為100~300nm的矽石粒子之方法(例如,參照專利文獻3)。 As a method of preventing the adhesion of the above-mentioned film (anti-blocking), a method of adding fine particles such as silica particles to the hard coating agent to form irregularities on the surface of the hard coating film of the hard coating agent has been proposed (for example, refer to Patent Literature 1 and 2). In addition, there is also a method of combining silica particles with an average primary particle size of 5 to 80 nm and silica particles with an average primary particle size of 100 to 300 nm (for example, refer to Patent Document 3).
於此,觸控面板所使用的氧化銦錫(ITO)薄膜之構成係主流為:於聚對苯二甲酸乙二酯(PET)基材之單面上形成高折射率硬塗層,於另一面上形成能防止薄膜彼此的黏連之賦有防黏連性的硬塗層。高折射率硬塗層側係在其上積層低折射率層後,濺鍍ITO,進行退火處理。 Here, the main composition of the indium tin oxide (ITO) film used in the touch panel is: a high refractive index hard coating is formed on one side of the polyethylene terephthalate (PET) substrate, and the other On one side, a hard coating with anti-blocking properties is formed to prevent the adhesion of the films to each other. After the high-refractive-index hard coat layer is laminated with a low-refractive index layer, ITO is sputtered and annealed.
另一方面,賦有防黏連性的硬塗層側係在上述退火處理完成之前黏貼耐熱保護PET薄膜。然後,剝離耐熱保護PET,使用高透明性黏著膠帶(OCA),組裝觸控面板之模組,但能賦予上述的防黏連性之硬塗劑的硬化塗膜,係有對於OCA不充分密著之問題。 On the other hand, the hard coat side with anti-blocking properties is bonded with a heat-resistant protective PET film before the above-mentioned annealing treatment is completed. Then, peel off the heat-resistant protective PET, use high-transparency adhesive tape (OCA) to assemble the touch panel module, but the hard coating film that can impart the anti-blocking properties mentioned above is not sufficiently dense for OCA. The problem.
因此,要求一種活性能量線硬化性組成物,其能對於薄膜表面賦予高的防黏連性,能形成具有高透明性與對於OCA等的高接著密著性之硬塗層。 Therefore, there is a demand for an active energy ray curable composition that can impart high anti-blocking properties to the film surface and can form a hard coat layer with high transparency and high adhesion to OCA.
[專利文獻1]日本特開2012-27401號公報 [Patent Document 1] JP 2012-27401 A
[專利文獻2]日本特開2011-98529號公報 [Patent Document 2] JP 2011-98529 A
[專利文獻3]日本特開2009-132880號公報 [Patent Document 3] JP 2009-132880 A
本發明所欲解決的課題在於提供活性能量線硬化性組成物及使用其之薄膜,該活性能量線硬化性組成物係能對於薄膜表面賦予高的防黏連性,能形成具有高透明性與對於OCA等的高接著密著性之硬塗層。 The problem to be solved by the present invention is to provide an active energy ray curable composition and a film using the same. The active energy ray curable composition can impart high anti-blocking properties to the surface of the film, and can be formed with high transparency and For OCA and other hard coatings with high adhesion.
本發明者等為了解決上述的課題而專心致力地研究,結果發現含有矽石粒子的活性能量線硬化性組成物之硬化塗膜表面的潤濕張力為一定之範圍者,係具有對於OCA等的高接著密著性,而完成本發明。 In order to solve the above-mentioned problems, the inventors have intensively studied and found that the wetting tension of the surface of the cured coating film of the active energy ray curable composition containing silica particles is within a certain range, which has the advantages of OCA, etc. High adhesiveness and complete the present invention.
即,關於活性能量線硬化性組成物及使用其之薄膜,該活性能量線硬化性組成物係含有活性能量線硬化性化合物(A)及矽石粒子(B)之活性能量線硬化性組成物,其特徵為:該活性能量線硬化性組成物的硬化塗膜表面之潤濕張力為35~60mN/m之範圍。 That is, regarding the active energy ray curable composition and the film using the same, the active energy ray curable composition is an active energy ray curable composition containing an active energy ray curable compound (A) and silica particles (B) It is characterized in that the wetting tension of the surface of the cured coating film of the active energy ray curable composition is in the range of 35-60 mN/m.
本發明之活性能量線硬化性組成物係可藉由塗布在樹脂薄膜表面上及進行硬化,而能對於薄膜表面賦予高的防黏連性,形成具有高透明性與對於OCA等的高接著密著性之硬塗層。因此,本發明之活性能量線硬化性組成物的硬化塗膜由於具有耐擦傷性,可防止各種樹脂薄膜表面的損傷,且當捲取成捲筒狀時,從捲筒送出之際,由於亦可避免黏連成為原因的困擾,故可提供其後的處理性優異之薄膜。又,具有由本發明之活性能 量線硬化性組成物的硬化塗膜所成之硬塗層的薄膜,係可用於液晶顯示器(LCD)、有機EL顯示器(OLED)、電漿顯示器(PDP)等的平板顯示器(FPD)表面之防損傷用薄膜(保護膜)或觸控面板、汽車的內外裝用裝飾薄膜(薄片)、窗用的低反射薄膜或熱線隔離薄膜等各種用途。特別是可適用於要求與OCA的高接著密著性之觸控面板用途。 The active energy ray curable composition system of the present invention can be coated on the surface of a resin film and cured to impart high anti-blocking properties to the surface of the film, forming high transparency and high adhesion to OCA. Adhesive hard coating. Therefore, the cured coating film of the active energy ray curable composition of the present invention has scratch resistance and can prevent damage to the surface of various resin films. It can avoid the problem of blocking as a cause, so it can provide a film with excellent subsequent handling properties. In addition, a film having a hard coat layer formed from a hardened coating film of the active energy ray curable composition of the present invention can be used for liquid crystal displays (LCD), organic EL displays (OLED), plasma displays (PDP), etc. Various applications such as anti-damage films (protective films) on the surface of flat panel displays (FPD) or touch panels, decorative films (sheets) for interior and exterior decoration of automobiles, low-reflection films for windows, or heat-shielding films. It is especially suitable for touch panel applications that require high adhesion to OCA.
本發明之活性能量線硬化性組成物係含有活性能量線硬化性化合物(A)及矽石粒子(B)之活性能量線硬化性組成物,該活性能量線硬化性組成物的硬化塗膜表面之潤濕張力為35~60mN/m之範圍。 The active energy ray curable composition of the present invention is an active energy ray curable composition containing an active energy ray curable compound (A) and silica particles (B), and the surface of the hardened coating film of the active energy ray curable composition The wetting tension is in the range of 35~60mN/m.
作為前述活性能量線硬化性化合物(A),例如可舉出多官能(甲基)丙烯酸酯(A1)、胺基甲酸酯(甲基)丙烯酸酯(A2)等。此等係可單獨使用,也可併用2種以上。 Examples of the active energy ray-curable compound (A) include polyfunctional (meth)acrylate (A1), urethane (meth)acrylate (A2), and the like. These systems may be used singly, or two or more of them may be used in combination.
再者,於本發明中,所謂的「(甲基)丙烯酸酯」,就是指丙烯酸酯與甲基丙烯酸酯的一者或兩者,所謂的「(甲基)丙烯醯基」,就是指丙烯醯基與甲基丙烯醯基的一者或兩者。 Furthermore, in the present invention, the so-called "(meth)acrylate" refers to one or both of acrylate and methacrylate, and the so-called "(meth)acryloyl" refers to propylene One or both of an acyl group and a methacrylic group.
前述多官能(甲基)丙烯酸酯(A1)係在1分子中具有2個以上的(甲基)丙烯醯基之化合物。作為此多官能(甲基)丙烯酸酯(a1)之具體例,可舉出1,4-丁二醇二(甲基)丙烯酸酯、3-甲基-1,5-戊二醇二(甲基)丙烯酸酯、 1,6-己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、2-甲基-1,8-辛二醇二(甲基)丙烯酸酯、2-丁基-2-乙基-1,3-丙二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯等的2元醇之二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、三(2-羥基乙基)異三聚氰酸酯之二(甲基)丙烯酸酯、於1莫耳的新戊二醇上附加4莫耳以上的環氧乙烷或環氧丙烷而得的二醇之二(甲基)丙烯酸酯、於1莫耳的雙酚A上附加2莫耳的環氧乙烷或環氧丙烷而得的二醇之二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷改性三羥甲基丙烷三(甲基)丙烯酸酯、環氧丙烷改性三羥甲基丙烷三(甲基)丙烯酸酯、貳三羥甲基丙烷三(甲基)丙烯酸酯、貳三羥甲基丙烷四(甲基)丙烯酸酯、三(2-(甲基)丙烯醯氧基乙基)異三聚氰酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等。此等的多官能(甲基)丙烯酸酯(A1)係可單獨使用,也可併用2種以上。又,於此等的多官能(甲基)丙烯酸酯(A1)之中,從本發明之活性能量線硬化性組成物的硬化塗膜之耐擦傷性升高來看,較佳為二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇三(甲 基)丙烯酸酯。 The aforementioned polyfunctional (meth)acrylate (A1) is a compound having two or more (meth)acryloyl groups in one molecule. As specific examples of this polyfunctional (meth)acrylate (a1), 1,4-butanediol di(meth)acrylate, 3-methyl-1,5-pentanediol bis(meth) Base) acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2-methyl-1,8-octanediol di(meth)acrylic acid Ester, 2-butyl-2-ethyl-1,3-propanediol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, ethylene glycol di(meth)acrylate, Diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate and other dihydric alcohols (Meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, tris(2-hydroxyethyl) isocyanurate di(meth)acrylic acid Ester, bis(meth)acrylate of the diol obtained by adding 4 mol of ethylene oxide or propylene oxide to 1 mol of neopentyl glycol, and adding 1 mol of bisphenol A 2 moles of ethylene oxide or propylene oxide diol bis(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethylene oxide modified trimethylolpropane Tri(meth)acrylate, propylene oxide modified trimethylolpropane tri(meth)acrylate, two trimethylolpropane tri(meth)acrylate, two trimethylolpropane tetra(methyl) ) Acrylate, tris(2-(meth)acryloyloxyethyl) isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth) ) Acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc. These polyfunctional (meth)acrylate (A1) systems may be used alone, or two or more of them may be used in combination. In addition, among these polyfunctional (meth)acrylates (A1), dipentaerythritol 6 is preferred from the viewpoint of improved scratch resistance of the cured coating film of the active energy ray curable composition of the present invention (Meth)acrylate, dipentaerythritol penta(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate.
前述胺基甲酸酯(甲基)丙烯酸酯(A2)係使聚異氰酸酯(a2-1)與具有羥基的(甲基)丙烯酸酯(a2-2)反應而得者。 The aforementioned urethane (meth)acrylate (A2) is obtained by reacting a polyisocyanate (a2-1) with a (meth)acrylate (a2-2) having a hydroxyl group.
作為前述聚異氰酸酯(a2-1),可舉出脂肪族聚異氰酸酯與芳香族聚異氰酸酯,但從能減少本發明之活性能量線硬化性組成物的硬化塗膜之著色來看,較佳為脂肪族聚異氰酸酯。 As the aforementioned polyisocyanate (a2-1), aliphatic polyisocyanate and aromatic polyisocyanate can be exemplified, but from the viewpoint of reducing the color of the cured coating film of the active energy ray curable composition of the present invention, aliphatic is preferred Group polyisocyanate.
前述脂肪族聚異氰酸酯係異氰酸酯基以外的部位由脂肪族烴所構成之化合物。作為此脂肪族聚異氰酸酯之具體例,可舉出六亞甲基二異氰酸酯、離胺酸二異氰酸酯、離胺酸三異氰酸酯等之脂肪族聚異氰酸酯;降烯二異氰酸酯、異佛爾酮二異氰酸酯、亞甲基雙(4-環己基異氰酸酯)、1,3-雙(異氰酸基甲基)環己烷、2-甲基-1,3-二異氰酸基環己烷、2-甲基-1,5-二異氰酸基環己烷等之脂環式聚異氰酸酯等。又,前述脂肪族聚異氰酸酯或脂環式聚異氰酸酯經三聚化的三聚化物亦可作為前述脂肪族聚異氰酸酯使用。還有,此等的脂肪族聚異氰酸酯係可單獨使用,也可併用2種以上。 The aforementioned aliphatic polyisocyanate is a compound in which parts other than isocyanate groups are composed of aliphatic hydrocarbons. Specific examples of this aliphatic polyisocyanate include aliphatic polyisocyanates such as hexamethylene diisocyanate, lysine diisocyanate, and lysine triisocyanate; and Diisocyanate, isophorone diisocyanate, methylene bis(4-cyclohexyl isocyanate), 1,3-bis(isocyanatomethyl)cyclohexane, 2-methyl-1,3-di Alicyclic polyisocyanates such as isocyanatocyclohexane, 2-methyl-1,5-diisocyanatocyclohexane, etc. In addition, a trimerized product of the aforementioned aliphatic polyisocyanate or alicyclic polyisocyanate can also be used as the aforementioned aliphatic polyisocyanate. In addition, these aliphatic polyisocyanate systems may be used alone or in combination of two or more kinds.
於前述脂肪族聚異氰酸酯之中,為了提高塗膜的耐擦傷性,於脂肪族聚異氰酸酯之中,較佳係屬於直鍵脂肪族烴的二異氰酸酯之六亞甲基二異氰酸酯、屬於脂環式二異氰酸酯之降烯二異氰酸酯、異佛爾酮二異氰酸酯。 Among the aforementioned aliphatic polyisocyanates, in order to improve the scratch resistance of the coating film, among the aliphatic polyisocyanates, hexamethylene diisocyanate, which is a diisocyanate of a straight-bonded aliphatic hydrocarbon, is preferably an alicyclic diisocyanate. Diisocyanate drop Diisocyanate, isophorone diisocyanate.
前述(甲基)丙烯酸酯(a2-2)係具有羥基與(甲 基)丙烯醯基之化合物。作為此(甲基)丙烯酸酯(a2-2)之具體例,可舉出(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯、1,5-戊二醇單(甲基)丙烯酸酯、1,6-己二醇單(甲基)丙烯酸酯、新戊二醇單(甲基)丙烯酸酯、羥基三甲基乙酸新戊二醇單(甲基)丙烯酸酯等之二元醇的單(甲基)丙烯酸酯;三羥甲基丙烷二(甲基)丙烯酸酯、環氧乙烷(EO)改性三羥甲基丙烷(甲基)丙烯酸酯、環氧丙烷(PO)改性三羥甲基丙烷二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、雙(2-(甲基)丙烯醯氧基乙基)羥基乙基異三聚氰酸酯等之三元醇的單或二(甲基)丙烯酸酯,或此等的醇性羥基之一部分經ε-己內酯所改性之具有羥基的單及二(甲基)丙烯酸酯;季戊四醇三(甲基)丙烯酸酯、貳三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯等之具有一官能的羥基與三官能以上的(甲基)丙烯醯基之化合物,或該化合物更經ε-己內酯所改性之具有羥基的多官能(甲基)丙烯酸酯;二丙二醇單(甲基)丙烯酸酯、二乙二醇單(甲基)丙烯酸酯、聚丙二醇單(甲基)丙烯酸酯、聚乙二醇單(甲基)丙烯酸酯等之具有氧化烯鏈的(甲基)丙烯酸酯;聚乙二醇-聚丙二醇單(甲基)丙烯酸酯、聚氧丁烯-聚氧丙烯單(甲基)丙烯酸酯等之具有嵌段結構的氧化烯鏈之(甲基)丙烯酸酯;聚(乙二醇-四亞甲基二醇)單(甲基)丙烯酸酯、聚(丙二醇-四亞甲基二醇)單(甲基)丙烯酸酯等之具有雜亂結構的氧化烯鏈之(甲基)丙烯酸酯等。此等的(甲基)丙烯酸酯(a2-2)係可單獨使用,也可併用 2種以上。 The aforementioned (meth)acrylate (a2-2) is a compound having a hydroxyl group and a (meth)acryloyl group. Specific examples of this (meth)acrylate (a2-2) include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate Butyl ester, 4-hydroxybutyl (meth)acrylate, 1,5-pentanediol mono(meth)acrylate, 1,6-hexanediol mono(meth)acrylate, neopentyl glycol mono( Mono(meth)acrylates of diols such as meth)acrylate, neopentyl glycol mono(meth)acrylate, etc.; trimethylolpropane di(meth)acrylate, ring Ethylene oxide (EO) modified trimethylolpropane (meth)acrylate, propylene oxide (PO) modified trimethylolpropane di(meth)acrylate, glycerol di(meth)acrylate, Mono- or di-(meth)acrylates of triols such as bis(2-(meth)acryloyloxyethyl)hydroxyethyl isocyanurate, or a part of these alcoholic hydroxyl groups Mono and di(meth)acrylates with hydroxyl groups modified by ε-caprolactone; pentaerythritol tri(meth)acrylate, two trimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate (Meth)acrylic acid esters and other compounds having monofunctional hydroxyl groups and trifunctional or higher (meth)acrylic acid groups, or polyfunctional (meth)acrylic acid compounds having hydroxyl groups modified by ε-caprolactone Esters; dipropylene glycol mono (meth) acrylate, diethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, polyethylene glycol mono (meth) acrylate, etc. with alkylene oxide Chain (meth)acrylate; polyethylene glycol-polypropylene glycol mono(meth)acrylate, polyoxybutylene-polyoxypropylene mono(meth)acrylate, etc. which have block structure of alkylene oxide chain (Meth) acrylate; poly(ethylene glycol-tetramethylene glycol) mono(meth)acrylate, poly(propylene glycol-tetramethylene glycol) mono(meth)acrylate, etc. Structure of (meth)acrylates of alkylene oxide chains, etc. These (meth)acrylate (a2-2) systems may be used singly, or two or more of them may be used in combination.
於前述胺基甲酸酯(甲基)丙烯酸酯(A2)之中,為了提高本發明之活性能量線硬化性組成物的硬化塗膜之耐擦傷性,較佳為在1分子中具有4個以上的(甲基)丙烯醯基者。由於將前述胺基甲酸酯(甲基)丙烯酸酯(A2)設為在1分子中具有4個以上的(甲基)丙烯醯基者,作為前述(甲基)丙烯酸酯(a2-2),較佳為具有2個以上的(甲基)丙烯醯基者。作為如此的(甲基)丙烯酸酯(a2-2),例如可舉出三羥甲基丙烷二(甲基)丙烯酸酯、環氧乙烷改性三羥甲基丙烷二(甲基)丙烯酸酯、環氧丙烷改性三羥甲基丙烷二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、雙(2-(甲基)丙烯醯氧基乙基)羥基乙基異三聚氰酸酯、季戊四醇三(甲基)丙烯酸酯、貳三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯等。相對於前述脂肪族聚異氰酸酯(a1)之1種,此等的(甲基)丙烯酸酯(a2-2)係可使用1種,也可併用2種以上。又,於此等的(甲基)丙烯酸酯(a2-2)之中,季戊四醇三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯由於可提高耐擦傷性而較宜。 Among the aforementioned urethane (meth)acrylates (A2), in order to improve the scratch resistance of the cured coating film of the active energy ray curable composition of the present invention, it is preferable to have 4 in one molecule The above (meth)acrylic acid base. Since the aforementioned urethane (meth)acrylate (A2) has 4 or more (meth)acrylic groups in one molecule, it is regarded as the aforementioned (meth)acrylate (a2-2) , Preferably having two or more (meth)acrylic groups. Examples of such (meth)acrylates (a2-2) include trimethylolpropane di(meth)acrylate and ethylene oxide modified trimethylolpropane di(meth)acrylate , Propylene oxide modified trimethylolpropane di(meth)acrylate, glycerol di(meth)acrylate, bis(2-(meth)acryloxyethyl) hydroxyethyl isocyanurate Acid ester, pentaerythritol tri(meth)acrylate, two trimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, etc. With respect to one type of the aforementioned aliphatic polyisocyanate (a1), one type of these (meth)acrylate (a2-2) systems may be used, or two or more types may be used in combination. In addition, among these (meth)acrylates (a2-2), pentaerythritol tri(meth)acrylate and dipentaerythritol penta(meth)acrylate are preferable because they can improve scratch resistance.
作為前述聚異氰酸酯(a2-1)與前述(甲基)丙烯酸酯(a2-2)之反應,可藉由常見方法的胺基甲酸酯化反應而進行。又,為了促進胺基甲酸酯化反應之進行,較佳為在胺基甲酸酯化觸媒之存在下進行胺基甲酸酯化反應。作為前述胺基甲酸酯化觸媒,例如可舉出吡啶、吡咯、三乙胺、二乙胺、二丁胺等之胺化合物;三苯基膦、三乙基膦等之磷化合物;二月桂酸二丁錫、三月桂酸 辛錫、二乙酸辛錫、二乙酸二丁錫、辛酸錫等之有機錫化合物、辛酸鋅等之有機鋅化合物等。 The reaction of the aforementioned polyisocyanate (a2-1) and the aforementioned (meth)acrylate (a2-2) can be carried out by a urethane reaction of a common method. Furthermore, in order to promote the urethane reaction, it is preferable to perform the urethane reaction in the presence of a urethane catalyst. Examples of the aforementioned carbamate catalyst include amine compounds such as pyridine, pyrrole, triethylamine, diethylamine, and dibutylamine; phosphorus compounds such as triphenylphosphine and triethylphosphine; Dibutyltin laurate, octyl tin trilaurate, octyl tin diacetate, dibutyl tin diacetate, tin octoate and other organic tin compounds, zinc octoate and other organic zinc compounds, etc.
又,按照需要,作為上述的多官能(甲基)丙烯酸酯(A1)、胺基甲酸酯(甲基)丙烯酸酯(A2)以外之活性能量線硬化性化合物(A),可使用環氧(甲基)丙烯酸酯、聚酯(甲基)丙烯酸酯、聚醚(甲基)丙烯酸酯等。作為前述環氧(甲基)丙烯酸酯,例如可舉出藉由對於雙酚型環氧樹脂、酚醛清漆型環氧樹脂、聚甲基丙烯酸環氧丙酯等,使(甲基)丙烯酸反應、酯化而得者。另外,作為前述聚酯(甲基)丙烯酸酯,例如可舉出藉由對於將多元羧酸與多元醇予以聚縮合而得的兩末端為羥基之聚酯,使(甲基)丙烯酸反應、酯化而得者,或藉由對於在多元羧酸上附加有環氧烷者,使(甲基)丙烯酸反應、酯化而得者。再者,作為前述聚醚(甲基)丙烯酸酯,例如可舉出藉由對於聚醚多元醇,使(甲基)丙烯酸反應、酯化而得者。 In addition, as necessary, as the active energy ray curable compound (A) other than the above-mentioned polyfunctional (meth)acrylate (A1) and urethane (meth)acrylate (A2), epoxy can be used (Meth)acrylate, polyester (meth)acrylate, polyether (meth)acrylate, etc. Examples of the epoxy (meth)acrylate include reacting (meth)acrylic acid with bisphenol type epoxy resin, novolak type epoxy resin, polyglycidyl methacrylate, etc., Those derived from esterification. In addition, as the aforementioned polyester (meth)acrylate, for example, a polyester obtained by polycondensing a polyhydric carboxylic acid and a polyhydric alcohol having hydroxyl groups at both ends, reacting (meth)acrylic acid, and ester Or obtained by reacting and esterifying (meth)acrylic acid with alkylene oxide added to polycarboxylic acid. In addition, as the aforementioned polyether (meth)acrylate, for example, one obtained by reacting and esterifying (meth)acrylic acid with a polyether polyol can be mentioned.
前述矽石粒子(B)的一次平均粒徑通常較佳為1nm以上,從可進一步提高透明性來看,較佳為50nm以下,更佳為40nm以下,尤佳為30nm以下。再者,前述矽石粒子(B)之一次平均粒徑係由以穿透型電子顯微鏡觀察的結果求出。 The primary average particle size of the aforementioned silica particles (B) is generally preferably 1 nm or more, and from the viewpoint of further improving transparency, it is preferably 50 nm or less, more preferably 40 nm or less, and particularly preferably 30 nm or less. In addition, the primary average particle size of the aforementioned silica particles (B) is determined from the result of observation with a transmission electron microscope.
又,前述矽石粒子(B)較佳為使用具有上述的一次平均粒徑之矽石粒子所二次凝集者。矽石粒子的二次凝集後之粒度分布中的D50之粒徑(以下,僅簡稱「平均粒徑」),從可兼顧高的防黏連性與高透明性來看,較佳為50nm以上,更佳為100nm以上,尤佳為120nm以上。 又,基於同樣的理由,矽石粒子的二次凝集後之平均粒徑較佳為500nm以下,更佳為400nm以下,尤佳為300nm以下。再者,所謂粒度分布中的D50之粒徑,就是表示於粒度分布測定結果的累計粒子量曲線中,其累計量佔50%時的粒徑。 In addition, it is preferable that the aforementioned silica particles (B) are those that are secondarily aggregated using silica particles having the above-mentioned primary average particle diameter. The particle size of D50 in the particle size distribution after the secondary agglomeration of silica particles (hereinafter referred to as "average particle size") is preferably 50nm or more from the viewpoint of achieving both high anti-blocking properties and high transparency. , More preferably 100nm or more, particularly preferably 120nm or more. In addition, for the same reason, the average particle size of the silica particles after secondary aggregation is preferably 500 nm or less, more preferably 400 nm or less, and particularly preferably 300 nm or less. Furthermore, the so-called D50 particle size in the particle size distribution is the particle size at which the cumulative amount occupies 50% in the cumulative particle amount curve of the particle size distribution measurement result.
前述矽石粒子(B)例如可使用以濕式法所製造者。又,於濕式法中,已知沉降法與凝膠法,但任一方法所製造的矽石粒子皆可使用。再者,為了成為具有本發明所用之尺寸的一次平均粒徑及二次平均粒徑的矽石粒子,沉降法、凝膠法皆可藉由調整作為矽石粒子之原料的矽酸鈉與硫酸等的礦酸之反應條件(pH、原料濃度、反應溫度等)而達成。又,一旦製造具有稍大的二次平均粒徑之矽石粒子後,亦可進行粉碎而成為所欲的二次平均粒徑。 The aforementioned silica particles (B) can be produced by a wet method, for example. In addition, in the wet method, the sedimentation method and the gel method are known, but silica particles produced by either method can be used. Furthermore, in order to become silica particles with the primary average particle diameter and the secondary average particle diameter of the size used in the present invention, both the sedimentation method and the gel method can be adjusted by adjusting the sodium silicate and sulfuric acid used as the raw material of the silica particles. The reaction conditions (pH, raw material concentration, reaction temperature, etc.) of the same mineral acid are achieved. Furthermore, once silica particles having a slightly larger secondary average particle size are produced, they can be pulverized to obtain the desired secondary average particle size.
作為上述的矽石粒子之粉碎時所用的裝置,可舉出球磨機、珠磨機、棒磨機、SAG磨機、高壓粉碎輥、縱軸衝擊(VSI)磨機、膠體磨機、錐磨機、盤磨機、輪碾機、錘磨機、乳缽、噴射磨機等。 As the above-mentioned equipment used for the pulverization of silica particles, ball mills, bead mills, rod mills, SAG mills, high-pressure crushing rolls, vertical axis impact (VSI) mills, colloidal mills, and cone mills can be mentioned. , Disc mill, wheel mill, hammer mill, mortar, jet mill, etc.
又,於粉碎矽石粒子之際,亦較佳為添加矽烷偶合劑,與粉碎同時地以有機基修飾矽石粒子之表面。作為前述矽烷偶合劑,例如可使用三氟丙基三甲氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、甲基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷等。 In addition, when pulverizing the silica particles, it is also preferable to add a silane coupling agent to modify the surface of the silica particles with an organic group at the same time as the pulverization. As the aforementioned silane coupling agent, for example, trifluoropropyltrimethoxysilane, 3-propenoxypropyltrimethoxysilane, methyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane can be used. Base silane and so on.
前述矽石粒子(B)之配合量,從進一步提高防黏連性來看,相對於100質量份的前述活性能量線硬化性 化合物(A),較佳為1~60質量份之範圍,更佳為2~50質量份之範圍,尤佳為5~40質量份之範圍。 The compounding amount of the aforementioned silica particles (B) is preferably in the range of 1-60 parts by mass relative to 100 parts by mass of the active energy ray-curable compound (A) from the viewpoint of further improving anti-blocking properties. It is preferably in the range of 2-50 parts by mass, particularly preferably in the range of 5-40 parts by mass.
本發明之活性能量線硬化性組成物的硬化塗膜表面之潤濕張力為35~60mN/m之範圍,但從進一步提高與OCA的密著性來看,較佳為40mN/m以上,更佳為40~55mN/m之範圍。再者,潤濕張力係根據JIS試驗方法K6768:1999所測定之值。 The wetting tension on the surface of the cured coating film of the active energy ray curable composition of the present invention is in the range of 35-60 mN/m, but from the viewpoint of further improving the adhesion to OCA, it is preferably 40 mN/m or more, and more Preferably, it is in the range of 40~55mN/m. In addition, the wetting tension is a value measured in accordance with JIS test method K6768:1999.
為了使前述潤濕張力成為所欲之範圍,可藉由適宜調整前述矽石粒子(B)之種類、表面處理、配合量等而進行。 In order to bring the aforementioned wetting tension into a desired range, it can be performed by appropriately adjusting the type, surface treatment, blending amount, etc. of the aforementioned silica particles (B).
又,本發明之活性能量線硬化性組成物係在塗布於基材上後,可照射活性能量線而成為硬化塗膜。此所謂的活性能量線,就是指紫外線、電子線、α射線、β射線、γ射線等之電離放射線。照射紫外線作為活性能量線而形成硬化塗膜時,較佳為於本發明之活性能量線硬化性組成物中添加光聚合起始劑(C),而提高硬化性。另外,若需要,亦可進一步添加光增感劑(D),而提高硬化性。另一方面,使用電子線、α射線、β射線、γ射線等之電離放射線時,由於即使不使用光聚合起始劑(C)或光增感劑(D)也能快速地硬化,故沒有特別添加光聚合起始劑(C)或光增感劑(D)之必要。 In addition, the active energy ray curable composition of the present invention can be irradiated with active energy rays to form a cured coating film after being coated on a substrate. The so-called active energy rays refer to ionizing radiation such as ultraviolet rays, electron rays, α rays, β rays, and γ rays. When irradiating ultraviolet rays as an active energy ray to form a cured coating film, it is preferable to add a photopolymerization initiator (C) to the active energy ray curable composition of the present invention to improve the curability. In addition, if necessary, a photosensitizer (D) may be further added to improve the curability. On the other hand, when using ionizing radiation such as electron rays, α rays, β rays, and γ rays, it hardens quickly even without using photopolymerization initiator (C) or photosensitizer (D), so there is no In particular, it is necessary to add a photopolymerization initiator (C) or a photosensitizer (D).
作為前述光聚合起始劑(C),例如可舉出二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、寡聚{2-羥基-2-甲基-1-[4-(1-甲基乙烯基)苯基]丙酮}、苄基二甲基縮酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、 4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮、1-羥基環己基苯基酮、2-甲基-2-啉基(4-硫甲基苯基)丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-啉基苯基)-丁酮等之苯乙酮系化合物;苯偶姻、苯偶姻甲基醚、苯偶姻異丙基醚等之苯偶姻系化合物;2,4,6-三甲基苯偶姻二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦等之醯基氧化膦系化合物;二苯乙二酮(二苯甲醯)、甲基苯基乙醛酸酯、羥基苯基乙酸2-(2-羥基乙氧基)乙酯、羥基苯基乙酸2-(2-側氧基-2-苯基乙醯氧基乙氧基)乙酯等之二苯乙二酮系化合物;二苯基酮、鄰苯甲醯基苯甲酸甲基-4-苯基二苯基酮、4,4’-二氯二苯基酮、羥基二苯基酮、4-苯甲醯基-4’-甲基-二苯基硫化物、丙烯酸化二苯基酮、3,3’,4,4’-四(第三丁基過氧羰基)二苯基酮、3,3’-二甲基-4-甲氧基二苯基酮、2,4,6-三甲基二苯基酮、4-甲基二苯基酮等之二苯基酮系化合物;2-異丙基噻噸酮、2,4-二甲基噻噸酮、2,4-二乙基噻噸酮、2,4-二氯噻噸酮等之噻噸酮系化合物;米其勒酮、4,4’-二乙基胺基二苯基酮等之胺基二苯基酮系化合物;10-丁基-2-氯吖啶酮、2-乙基蒽醌、9,10-菲醌、樟腦醌、1-[4-(4-苯甲醯基苯基巰基)苯基]-2-甲基-2-(4-甲基苯基磺醯基)丙烷-1-酮等。此等之光聚合起始劑(C)係可單獨使用,也可併用2種以上。 As the aforementioned photopolymerization initiator (C), for example, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and oligo {2-hydroxy-2 -Methyl-1-[4-(1-methylvinyl)phenyl]acetone}, benzyl dimethyl ketal, 1-(4-isopropylphenyl)-2-hydroxy-2-methyl Propane-1-one, 4-(2-hydroxyethoxy) phenyl-(2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2- Linyl (4-thiomethylphenyl) propane-1-one, 2-benzyl-2-dimethylamino-1-(4- Acetophenone compounds such as linylphenyl)-butanone; benzoin compounds such as benzoin, benzoin methyl ether, and benzoin isopropyl ether; 2,4,6-trimethyl Benzoin diphenyl phosphine oxide, bis(2,4,6-trimethylbenzyl)-phenyl phosphine oxide and other phenyl phosphine oxide compounds; ), methyl phenyl glyoxylate, 2-(2-hydroxyethoxy) ethyl hydroxyphenylacetate, 2-(2-side oxy-2-phenylacetoxyethyl) hydroxyphenylacetate (Oxy) ethyl ester and other diacetophenone compounds; diphenyl ketone, phthalic acid methyl-4-phenyl diphenyl ketone, 4,4'-dichloro diphenyl ketone , Hydroxy diphenyl ketone, 4-benzyl-4'-methyl-diphenyl sulfide, acrylated diphenyl ketone, 3,3',4,4'-tetra(tertiary butyl per Oxycarbonyl) benzophenone, 3,3'-dimethyl-4-methoxybenzophenone, 2,4,6-trimethylbenzophenone, 4-methylbenzophenone, etc. Of diphenyl ketone compounds; 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, etc. Thioxanthone compounds; Aminobenzophenone compounds such as Michelone, 4,4'-diethylaminobenzophenone, etc.; 10-Butyl-2-chloroacridone, 2- Ethylanthraquinone, 9,10-phenanthrenequinone, camphorquinone, 1-[4-(4-benzylphenylmercapto)phenyl]-2-methyl-2-(4-methylphenylsulfonate (Alkyl) propan-1-one and the like. These photopolymerization initiators (C) may be used alone or in combination of two or more kinds.
又,作為前述光增感劑(D),例如可舉出二乙醇胺、N-甲基二乙醇胺、三丁胺等之三級胺化合物、鄰甲苯基硫脲等之脲化合物、二乙基二硫磷酸鈉、s-苄基異硫脲鎓對甲苯磺酸鹽等之硫化合物等。 In addition, as the aforementioned photosensitizer (D), for example, tertiary amine compounds such as diethanolamine, N-methyldiethanolamine, and tributylamine, urea compounds such as o-tolylthiourea, and diethyldiethanolamine Sulfur compounds such as sodium thiophosphate, s-benzylisothiouronium p-toluenesulfonate, etc.
上述的光聚合起始劑(C)及光增感劑(D)之使用量,相對於本發明之活性能量線硬化性組成物中的前述活性能量線硬化性化合物(A)及前述化合物(B)之合計100質量份,各自較佳為0.05~20質量份,更佳為0.5~10質量份。 The usage amounts of the above-mentioned photopolymerization initiator (C) and photosensitizer (D) are relative to the active energy ray-curable compound (A) and the aforementioned compound ( The total of 100 parts by mass of B) is preferably 0.05 to 20 parts by mass, and more preferably 0.5 to 10 parts by mass.
於本發明之活性能量線硬化性組成物中,除了上述之活性能量線硬化性化合物(A)及矽石粒子(B)等,按照用途、要求特性,還可摻合有機溶劑、聚合抑制劑、表面調整劑、抗靜電劑、消泡劑、黏度調整劑、耐光安定劑、耐候安定劑、耐熱安定劑、紫外線吸收劑、抗氧化劑、調平劑、有機顏料、無機顏料、顏料分散劑、矽石珠、有機珠等之添加劑;氧化矽、氧化鋁、氧化鈦、氧化鋯、五氧化二銻等之無機填充劑等。此等其它的摻合物係可單獨使用,也可併用2種以上。 In the active energy ray curable composition of the present invention, in addition to the above-mentioned active energy ray curable compound (A) and silica particles (B), etc., organic solvents and polymerization inhibitors may be blended according to the application and required characteristics. , Surface modifiers, antistatic agents, defoamers, viscosity modifiers, light stabilizers, weather stabilizers, heat stabilizers, ultraviolet absorbers, antioxidants, leveling agents, organic pigments, inorganic pigments, pigment dispersants, Additives for silica beads and organic beads; inorganic fillers for silica, alumina, titania, zirconia, antimony pentoxide, etc. These other blend systems may be used alone, or two or more of them may be used in combination.
前述有機溶劑係在適宜調整本發明之活性能量線硬化性組成物的溶液黏度之方面有用,特別是為了進行薄膜塗布,其可容易調整膜厚。作為此處可使用的有機溶劑,例如可舉出甲醇、乙醇、異丙醇、第三丁醇等之醇;乙酸乙酯、乙酸丁酯、丙二醇單甲基醚乙酸酯等之酯化合物;丙酮、甲基乙基酮、甲基異丁基酮、環己酮等之酮化合物;甲苯、二甲苯等之芳香族烴等。此等之有機溶劑係可單獨使用,也可併用2種以上。 The aforementioned organic solvents are useful for suitably adjusting the solution viscosity of the active energy ray curable composition of the present invention, especially for thin film coating, which can easily adjust the film thickness. Examples of organic solvents that can be used here include alcohols such as methanol, ethanol, isopropanol, and tert-butanol; ester compounds such as ethyl acetate, butyl acetate, and propylene glycol monomethyl ether acetate; Acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and other ketone compounds; toluene, xylene and other aromatic hydrocarbons. These organic solvents may be used alone or in combination of two or more kinds.
本發明之薄膜所用的前述基材薄膜係可為薄膜狀,也可為薄片狀,其厚度較佳為20~500μm之範圍。又,作為前述基材薄膜之材質,較佳為透明性高的樹 脂,例如可舉出聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等之聚酯系樹脂;聚丙烯、聚乙烯、聚甲基戊烯-1等之聚烯烴系樹脂;纖維素乙酸酯(二乙醯纖維素、三乙醯纖維素等)、纖維素乙酸丙酸酯、纖維素乙酸丁酸酯、纖維素乙酸丙酸丁酸酯、纖維素乙酸鄰苯二甲酸酯、硝酸纖維素等之纖維素系樹脂;聚甲基丙烯酸甲酯等之丙烯酸系樹脂;聚氯乙烯、聚偏二氯乙烯等之氯乙烯系樹脂;聚乙烯醇;乙烯-乙酸乙烯酯共聚物;聚苯乙烯;聚醯胺;聚碳酸酯;聚碸;聚醚碸;聚醚醚酮;聚醯亞胺、聚醚醯亞胺等之聚醯亞胺系樹脂;降烯系樹脂(例如,日本ZEON股份有限公司製「Zeonor」)、改性降烯系樹脂(例如,(JSR股份有限公司製「Arton」)、環狀烯烴共聚物(例如,三井化學股份有限公司製「Apel」)等。再者,亦可使用貼合有2種以上的由此等之樹脂所構成的基材者。 The aforementioned substrate film used in the film of the present invention may be in the form of a film or a sheet, and its thickness is preferably in the range of 20 to 500 μm. In addition, as the material of the aforementioned base film, a resin with high transparency is preferable, for example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc. Polyester resins; Polyolefin resins such as polypropylene, polyethylene, polymethylpentene-1, etc.; Cellulose acetate (diacetyl cellulose, triacetyl cellulose, etc.), cellulose acetate propionate Cellulose resins such as esters, cellulose acetate butyrate, cellulose acetate propionate butyrate, cellulose acetate phthalate, and nitrocellulose; acrylic resins such as polymethyl methacrylate; Vinyl chloride resins such as polyvinyl chloride and polyvinylidene chloride; polyvinyl alcohol; ethylene-vinyl acetate copolymer; polystyrene; polyamide; polycarbonate; Ketones; Polyimine resins such as polyimine and polyetherimine; down Olefin resin (for example, "Zeonor" manufactured by ZEON Co., Ltd.), modified and reduced Olefin resins (for example, ("Arton" manufactured by JSR Co., Ltd.)), cyclic olefin copolymers (for example, "Apel" manufactured by Mitsui Chemicals Co., Ltd.), etc. In addition, two or more types bonded together can also be used Those made of such a resin as a base material.
又,前述樹脂薄膜之厚度較佳為20~200μm之範圍,更佳為30~150μm之範圍,尤佳為40~130μm之範圍。由於將薄膜基材之厚度設為該範圍,即使在環狀烯烴樹脂薄膜之單面上,藉由本發明之活性能量線硬化性組成物設置硬塗層時,也容易抑制捲曲。 In addition, the thickness of the aforementioned resin film is preferably in the range of 20 to 200 μm, more preferably in the range of 30 to 150 μm, and particularly preferably in the range of 40 to 130 μm. Since the thickness of the film substrate is within this range, even when a hard coat layer is provided on one side of the cyclic olefin resin film with the active energy ray curable composition of the present invention, curling is easily suppressed.
本發明之薄膜係藉由在該薄膜的至少一面上,塗布本發明之活性能量線硬化性組成物,然後照射活性能量線,成為硬化塗膜而得者。作為在薄膜上塗布本發明之活性能量線硬化性組成物之方法,例如可舉出模塗、微凹版塗布、凹版塗布、輥塗、缺角輪塗布、空氣 刀塗布、吻塗、噴塗、架掛塗布、浸塗、旋轉塗布、輪塗、毛刷塗布、藉由絲網的全面塗布、線棒塗布、流塗等。 The film of the present invention is obtained by coating the active energy ray curable composition of the present invention on at least one side of the film, and then irradiating the active energy ray to form a cured coating film. As a method of coating the active energy ray curable composition of the present invention on a film, for example, die coating, micro-gravure coating, gravure coating, roll coating, chipped wheel coating, air knife coating, kiss coating, spray coating, and frame coating can be mentioned. Hang coating, dip coating, spin coating, wheel coating, brush coating, full coating by screen, wire rod coating, flow coating, etc.
又,於本發明之活性能量線硬化性組成物中包含有機溶劑時,將活性能量線硬化性組成物塗布到基材薄膜後,於照射活性能量線之前,為了使有機溶劑揮發,或為了使前述矽石粒子(B)偏析在塗膜表面,較佳為進行加熱或室溫乾燥。作為加熱乾燥之條件,只要是有機溶劑揮發之條件,則沒有特別的限定,但一般較佳為在溫度50~100℃之範圍,時間在0.5~10分鐘之範圍,進行加熱乾燥。 Furthermore, when an organic solvent is included in the active energy ray curable composition of the present invention, after the active energy ray curable composition is applied to the base film, before the active energy ray is irradiated, in order to volatilize the organic solvent, or in order to The aforementioned silica particles (B) are segregated on the surface of the coating film and are preferably heated or dried at room temperature. The heating and drying conditions are not particularly limited as long as the organic solvent volatilizes, but it is generally preferable to perform heating and drying at a temperature in the range of 50-100°C and a time in the range of 0.5-10 minutes.
另外,作為用於將活性能量線硬化性組成物予以硬化而照射紫外線之裝置,例如可舉出低壓水銀燈、高壓水銀燈、超高壓水銀燈、金屬鹵化物燈、無電極燈(熔合燈)、化學燈、黑光燈、水銀-氙燈、短弧燈、氦-鎘雷射、氬雷射、太陽光、LED燈等。 In addition, as a device for curing the active energy ray curable composition and irradiating ultraviolet rays, for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, an electrodeless lamp (fusion lamp), and a chemical lamp , Black light lamp, mercury-xenon lamp, short arc lamp, helium-cadmium laser, argon laser, sunlight, LED lamp, etc.
具有本發明之活性能量線硬化性組成物的硬化塗膜之薄膜,由於高的防黏連性,加上其表面的耐擦傷性優異,故可適用於各種用途,但特別適用作為液晶顯示器(LCD)、有機EL顯示器(OLED)等之影像顯示裝置的影像顯示部所用的光學薄膜。特別是由於即使為薄型也具有優異的耐擦傷性,故例如可適用作為電子筆記本、行動電話、智慧型手機、攜帶型音頻播放器、攜帶型電腦、平板終端等之小型化或薄型化的要求高之攜帶型電子終端的影像顯示裝置之影像顯示部的光學薄膜。又 ,作為光學薄膜使用時,可使用作為影像顯示裝置之影像顯示部的最外表面所用之保護膜、觸控面板的基材。再者,作為保護膜使用時,例如於LCD模組或OLED模組等之影像顯示模組之上部設有能保護該影像顯示模組的透明面板之構成的影像顯示裝置中,藉由貼附在該透明面板的表面或背面而使用,可有效於防止損傷或防止透明面板破損時的飛散。 The film of the cured coating film with the active energy ray curable composition of the present invention can be used in various applications due to its high anti-blocking properties and excellent scratch resistance on the surface, but it is particularly suitable as a liquid crystal display ( Optical film used in the image display part of image display devices such as LCD) and organic EL display (OLED). Especially because it has excellent scratch resistance even if it is thin, it can be used as an electronic notebook, mobile phone, smart phone, portable audio player, portable computer, tablet terminal, etc. for miniaturization or thinning requirements, for example Optical film for the image display part of the image display device of the Gaozhi portable electronic terminal. In addition, when used as an optical film, it can be used as a protective film for the outermost surface of the image display part of an image display device, and a base material for a touch panel. Furthermore, when used as a protective film, for example, in an image display device with a transparent panel that can protect the image display module on top of an image display module such as an LCD module or an OLED module, by attaching Use on the front or back of the transparent panel is effective in preventing damage or scattering when the transparent panel is broken.
以下,藉由實施例更具體地說明本發明。再者,矽石粒子之平均粒徑係使用粒度分布計(日機裝股份有限公司製「Microtrac UPA」測定。 Hereinafter, the present invention will be explained in more detail with examples. In addition, the average particle size of silica particles was measured using a particle size distribution meter ("Microtrac UPA" manufactured by Nikkiso Co., Ltd.).
(調製例1:矽石分散液(1)之調製) (Preparation example 1: Preparation of silica dispersion liquid (1))
於16質量份的矽石粒子(Tosoh Silica股份有限公司製「Nipsil E-220A」,平均粒徑:1.7μm,表面未處理品)中,添加42質量份的甲基乙基酮、42質量份的丙二醇單甲基醚,藉由分散磨機混合後,使用珠磨機(Willy A.Bachofen公司製「Dyno-Mill ECM」;介質:氧化鋯珠,珠徑:0.3~0.4mm,珠填充率:60%),進行粉碎、分散,得到矽石粒子之含有率為16質量%的矽石分散液(1)。此矽石分散液(1)中的矽石粒子之平均粒徑為251nm。 To 16 parts by mass of silica particles ("Nipsil E-220A" manufactured by Tosoh Silica Co., Ltd., average particle size: 1.7 μm, untreated surface), 42 parts by mass of methyl ethyl ketone and 42 parts by mass were added Propylene glycol monomethyl ether, after mixing with a dispersion mill, use a bead mill ("Dyno-Mill ECM" manufactured by Willy A. Bachofen; medium: zirconia beads, bead diameter: 0.3~0.4mm, bead filling rate : 60%), pulverize and disperse to obtain a silica dispersion (1) with a silica particle content of 16% by mass. The average particle diameter of the silica particles in this silica dispersion (1) is 251 nm.
(調製例2:矽石分散液(2)之調製) (Preparation example 2: Preparation of silica dispersion liquid (2))
除了使用矽石粒子(Tosoh Silica股份有限公司製「Nipsil BY-200」,平均粒徑:1.7μm,表面未處理品)以外,與調製例1同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(2)。此矽石分散液(2)中的矽石粒子 之平均粒徑為455nm。 Except that silica particles ("Nipsil BY-200" manufactured by Tosoh Silica Co., Ltd., "Nipsil BY-200", average particle size: 1.7 μm, surface untreated product) were used, the same procedure as in Preparation Example 1 was carried out to obtain a silica particle content rate of 16 Mass% silica dispersion (2). The silica particles in this silica dispersion (2) have an average particle size of 455 nm.
(調製例3:矽石分散液(3)之調製) (Preparation example 3: Preparation of silica dispersion liquid (3))
除了使用矽石粒子(日本AEROSIL股份有限公司製「Aerosil 50」,平均粒徑:0.3μm,表面未處理品)以外,與調製例1同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(3)。此矽石分散液(3)中的矽石粒子之平均粒徑為368nm。 Except that silica particles ("Aerosil 50" manufactured by AEROSIL Co., Ltd., Japan, average particle size: 0.3μm, untreated surface) were used, the same procedure was carried out as in Preparation Example 1, and the content of silica particles was 16% by mass. The silica dispersion liquid (3). The average particle size of the silica particles in the silica dispersion liquid (3) is 368 nm.
(調製例4:矽石分散液(4)之調製) (Preparation example 4: Preparation of silica dispersion liquid (4))
於16質量份的矽石粒子(Tosoh Silica股份有限公司製「Nipsil E-220A」,平均粒徑:1.7μm,表面未處理品)中,添加42質量份的甲基乙基酮、42質量份的丙二醇單甲基醚,藉由分散磨機混合後,添加相對於矽石粒子而言為0.5質量%的三氟丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-7103」),藉由分散磨機進一步混合,使用珠磨機(Willy A.Bachofen公司製「Dyno-Mill ECM」;介質:氧化鋯珠,珠徑:0.3~0.4mm,珠填充率:60%),粉碎、分散所得之混合液,得到矽石粒子之含有率為16質量%的矽石分散液(4)。此矽石分散液(4)中的矽石粒子之平均粒徑為214nm。 To 16 parts by mass of silica particles ("Nipsil E-220A" manufactured by Tosoh Silica Co., Ltd., average particle size: 1.7 μm, untreated surface), 42 parts by mass of methyl ethyl ketone and 42 parts by mass were added The propylene glycol monomethyl ether is mixed with a dispersing mill, and 0.5% by mass of trifluoropropyltrimethoxysilane (produced by Shin-Etsu Chemical Co., Ltd. "KBM-7103") is added to the silica particles. , Further mixing by a dispersion mill, using a bead mill ("Dyno-Mill ECM" manufactured by Willy A. Bachofen; medium: zirconia beads, bead diameter: 0.3~0.4mm, bead filling rate: 60%), and crush , Disperse the resulting mixture to obtain a silica dispersion (4) with a silica particle content of 16% by mass. The silica particles in this silica dispersion (4) have an average particle size of 214 nm.
(調製例5:矽石分散液(5)之調製) (Preparation example 5: Preparation of silica dispersion liquid (5))
除了將調製例4所用的三氟丙基三甲氧基矽烷變更為3-丙烯醯氧基丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-5103」)以外,與調製例4同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(5)。此矽石分散液(5)中的矽石粒子之平均粒徑為237nm。 The same as Preparation Example 4 except that the trifluoropropyltrimethoxysilane used in Preparation Example 4 was changed to 3-propenoxypropyltrimethoxysilane ("KBM-5103" manufactured by Shin-Etsu Chemical Co., Ltd.) The silica dispersion liquid (5) having a silica particle content rate of 16% by mass was obtained. The average particle diameter of the silica particles in this silica dispersion (5) is 237 nm.
(調製例6:矽石分散液(6)之調製) (Preparation example 6: Preparation of silica dispersion liquid (6))
除了將調製例4所用的三氟丙基三甲氧基矽烷變更為甲基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-13」)以外,與調製例4同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(6)。此矽石分散液(6)中的矽石粒子之平均粒徑為209nm。 Except that the trifluoropropyltrimethoxysilane used in Preparation Example 4 was changed to methyltrimethoxysilane ("KBM-13" manufactured by Shin-Etsu Chemical Co., Ltd.), the same procedure as in Preparation Example 4 was carried out to obtain silica A silica dispersion liquid (6) with a particle content of 16% by mass. The average particle size of the silica particles in this silica dispersion (6) is 209 nm.
(調製例7:矽石分散液(7)之調製) (Preparation example 7: Preparation of silica dispersion liquid (7))
除了將調製例4所用三氟丙基三甲氧基矽烷變更為3-甲基丙烯醯氧基丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-503」)以外,與調製例4同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(7)。此矽石分散液(7)中的矽石粒子之平均粒徑為223nm。 Except that the trifluoropropyltrimethoxysilane used in Preparation Example 4 was changed to 3-methacryloxypropyltrimethoxysilane ("KBM-503" manufactured by Shin-Etsu Chemical Co., Ltd.), the same as Preparation Example 4 In the same manner, a silica dispersion liquid (7) having a silica particle content of 16% by mass was obtained. The average particle diameter of the silica particles in this silica dispersion liquid (7) is 223 nm.
(調製例8:矽石分散液(8)之調製) (Preparation example 8: Preparation of silica dispersion liquid (8))
除了將調製例4所用的三氟丙基三甲氧基矽烷變更為乙烯基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-1003」)以外,與調製例4同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(8)。此矽石分散液(8)中的矽石粒子之平均粒徑為225nm。 Except that the trifluoropropyltrimethoxysilane used in Preparation Example 4 was changed to vinyltrimethoxysilane ("KBM-1003" manufactured by Shin-Etsu Chemical Co., Ltd.), the same procedure as in Preparation Example 4 was carried out to obtain silica A silica dispersion liquid (8) with a particle content rate of 16% by mass. The average particle size of silica particles in this silica dispersion (8) is 225 nm.
(調製例9:矽石分散液(9)之調製) (Preparation example 9: Preparation of silica dispersion liquid (9))
除了將調製例4所用的三氟丙基三甲氧基矽烷變更為3-環氧丙氧基丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-403」)以外,與調製例4同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(9)。此矽石分散液(9)中的矽石粒子之平均粒徑為219nm。 Except that the trifluoropropyltrimethoxysilane used in Preparation Example 4 was changed to 3-glycidoxypropyltrimethoxysilane ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.), the same as Preparation Example 4 In the same manner, a silica dispersion liquid (9) having a silica particle content of 16% by mass was obtained. The average particle diameter of the silica particles in this silica dispersion (9) is 219 nm.
(調製例10:矽石分散液(10)之調製) (Preparation example 10: Preparation of silica dispersion liquid (10))
於16質量份的矽石粒子(Tosoh Silica股份有限公司製「Nipsil BY-200」,平均粒徑:1.7μm,表面未處理品)中,添加42質量份的甲基乙基酮、42質量份的丙二醇單甲基醚,藉由分散磨機混合後,添加相對於矽石粒子而言為0.5質量%的三氟丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-7103」),藉由分散磨機進一步混合,使用珠磨機(Willy A.Bachofen公司製「Dyno-Mill ECM」;介質:氧化鋯珠,珠徑:0.3~0.4mm,珠填充率:60%),粉碎、分散所得之混合液,得到矽石粒子之含有率為16質量%的矽石分散液(10)。此矽石分散液(10)中的矽石粒子之平均粒徑為452nm。 To 16 parts by mass of silica particles ("Nipsil BY-200" manufactured by Tosoh Silica Co., Ltd., average particle size: 1.7 μm, untreated surface), 42 parts by mass of methyl ethyl ketone and 42 parts by mass were added The propylene glycol monomethyl ether is mixed with a dispersing mill, and 0.5% by mass of trifluoropropyltrimethoxysilane (produced by Shin-Etsu Chemical Co., Ltd. "KBM-7103") is added to the silica particles. , Further mixing by a dispersion mill, using a bead mill ("Dyno-Mill ECM" manufactured by Willy A. Bachofen; medium: zirconia beads, bead diameter: 0.3~0.4mm, bead filling rate: 60%), and crush , Disperse the resulting mixture to obtain a silica dispersion (10) with a silica particle content of 16% by mass. The average particle size of the silica particles in the silica dispersion (10) is 452 nm.
(調製例11:矽石分散液(11)之調製) (Preparation example 11: Preparation of silica dispersion liquid (11))
除了將調製例10所用的三氟丙基三甲氧基矽烷變更為3-丙烯醯氧基丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-5103」)以外,與調製例10同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(9)。此矽石分散液(9)中的矽石粒子之平均粒徑為463nm。 The same as Preparation Example 10 except that the trifluoropropyltrimethoxysilane used in Preparation Example 10 was changed to 3-propenoxypropyltrimethoxysilane ("KBM-5103" manufactured by Shin-Etsu Chemical Co., Ltd.) It was carried out to obtain a silica dispersion liquid (9) with a silica particle content of 16% by mass. The silica particles in this silica dispersion (9) have an average particle size of 463 nm.
(調製例12:矽石分散液(12)之調製) (Preparation example 12: Preparation of silica dispersion liquid (12))
除了將調製例10所用的三氟丙基三甲氧基矽烷變更為甲基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-13」)以外,與調製例10同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(9)。此矽石分散液(9)中的矽石粒子之平均粒徑為423nm。 Except that the trifluoropropyltrimethoxysilane used in Preparation Example 10 was changed to methyltrimethoxysilane ("KBM-13" manufactured by Shin-Etsu Chemical Co., Ltd.), the same procedure as in Preparation Example 10 was carried out to obtain silica A silica dispersion liquid (9) with a particle content rate of 16% by mass. The average particle diameter of the silica particles in this silica dispersion (9) is 423 nm.
(調製例13:矽石分散液(13)之調製) (Preparation example 13: Preparation of silica dispersion liquid (13))
除了將調製例10所用之0.5質量份的三氟丙基三甲 氧基矽烷變更為相對於矽石粒子而言為0.5質量%的3-丙烯醯氧基丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-5103」)及相對於矽石粒子而言為0.5質量%的甲基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-13」)以外,與調製例10同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(10)。此矽石分散液(10)中的矽石粒子之平均粒徑為315nm。 Except that the 0.5 parts by mass of trifluoropropyltrimethoxysilane used in Preparation Example 10 was changed to 0.5% by mass of 3-propenoxypropyltrimethoxysilane with respect to silica particles (Shin-Etsu Chemical Co., Ltd. Co., Ltd. "KBM-5103") and 0.5% by mass of methyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. "KBM-13") with respect to silica particles, the same as Preparation Example 10 Proceeding to obtain a silica dispersion liquid (10) having a silica particle content rate of 16% by mass. The average particle size of the silica particles in the silica dispersion (10) is 315 nm.
(調製例14:矽石分散液(14)之調製) (Preparation example 14: Preparation of silica dispersion liquid (14))
於8質量份的矽石粒子(日本AEROSIL股份有限公司製「Aerosil 50」,平均粒徑:0.3μm,表面未處理品)中,添加42質量份的甲基乙基酮、42質量份的丙二醇單甲基醚,藉由分散磨機混合後,添加相對於矽石粒子而言為0.5質量%的三氟丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-7103」),藉由分散磨機進一步混合,使用珠磨機(Willy A.Bachofen公司製「Dyno-Mill ECM」;介質:氧化鋯珠,珠徑:0.3~0.4mm,珠填充率:60%),粉碎、分散所得之混合液,得到矽石粒子之含有率為16質量%的矽石分散液(14)。此矽石分散液(14)中的矽石粒子之平均粒徑為263nm。 To 8 parts by mass of silica particles ("Aerosil 50" manufactured by AEROSIL Co., Ltd., average particle size: 0.3μm, untreated surface), 42 parts by mass of methyl ethyl ketone and 42 parts by mass of propylene glycol are added Monomethyl ether is mixed with a dispersion mill, and 0.5% by mass of trifluoropropyltrimethoxysilane (“KBM-7103” manufactured by Shin-Etsu Chemical Co., Ltd.) is added to the silica particles. Further mixing by a dispersing mill, using a bead mill ("Dyno-Mill ECM" manufactured by Willy A. Bachofen; medium: zirconia beads, bead diameter: 0.3~0.4mm, bead filling rate: 60%), pulverizing and dispersing From the obtained mixed liquid, a silica dispersion liquid (14) having a silica particle content of 16% by mass was obtained. The silica particles in this silica dispersion (14) have an average particle size of 263 nm.
(調製例15:矽石分散液(15)之調製) (Preparation Example 15: Preparation of Silica Dispersion Liquid (15))
除了將調製例14所用的三氟丙基三甲氧基矽烷變更為3-丙烯醯氧基丙基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-5103」)以外,與調製例14同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(15)。此矽石分散液(15)中的矽石粒子之平均粒徑為293nm。 The same as Preparation Example 14 except that the trifluoropropyltrimethoxysilane used in Preparation Example 14 was changed to 3-propenoxypropyltrimethoxysilane ("KBM-5103" manufactured by Shin-Etsu Chemical Co., Ltd.) It was carried out to obtain a silica dispersion liquid (15) with a silica particle content of 16% by mass. The average particle diameter of the silica particles in this silica dispersion (15) is 293 nm.
(調製例16:矽石分散液(16)之調製) (Preparation example 16: Preparation of silica dispersion (16))
除了將調製例14所用的三氟丙基三甲氧基矽烷變更為甲基三甲氧基矽烷(信越化學工業股份有限公司製「KBM-13」)以外,與調製例14同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(16)。此矽石分散液(16)中的矽石粒子之平均粒徑為281nm。 Except that the trifluoropropyltrimethoxysilane used in Preparation Example 14 was changed to methyltrimethoxysilane ("KBM-13" manufactured by Shin-Etsu Chemical Co., Ltd.), the same procedure as in Preparation Example 14 was carried out to obtain silica A silica dispersion liquid (16) with a particle content of 16% by mass. The average particle size of the silica particles in this silica dispersion (16) was 281 nm.
(調製例17:矽石分散液(17)之調製) (Preparation example 17: Preparation of silica dispersion liquid (17))
於8質量份的矽石粒子(日本AEROSIL股份有限公司製「Aerosil NAX50」,平均粒徑:27.2μm,藉由六甲基二矽氮烷的表面處理品)中,添加46質量份的甲基乙基酮、46質量份的丙二醇單甲基醚,藉由分散磨機混合後,使用珠磨機(Willy A.Bachofen公司製「Dyno-Mill ECM」;介質:氧化鋯珠,珠徑:0.3~0.4mm,珠填充率:60%),進行粉碎、分散,得到矽石粒子之含有率為8質量%的矽石分散液(17)。此矽石分散液(17)中的矽石粒子之平均粒徑為207nm。 To 8 parts by mass of silica particles ("Aerosil NAX50" manufactured by AEROSIL Co., Ltd., average particle size: 27.2μm, surface-treated product with hexamethyldisilazane), 46 parts by mass of methyl are added Ethyl ketone and 46 parts by mass of propylene glycol monomethyl ether were mixed by a dispersion mill, and then a bead mill ("Dyno-Mill ECM" manufactured by Willy A. Bachofen Co., Ltd.; medium: zirconia beads, bead diameter: 0.3 ~0.4mm, bead filling rate: 60%), pulverize and disperse to obtain a silica dispersion (17) with a silica particle content of 8% by mass. The average particle diameter of the silica particles in this silica dispersion (17) is 207 nm.
(調製例18:矽石分散液(18)之調製) (Preparation example 18: Preparation of silica dispersion liquid (18))
除了使用矽石粒子(日本AEROSIL股份有限公司製「Aerosil 200」,平均粒徑:42.2μm,表面未處理品)以外,與調製例17同樣地進行,得到矽石粒子之含有率為8質量%的矽石分散液(18)。此矽石分散液(18)中的矽石粒子之平均粒徑為259nm。 Except that silica particles ("Aerosil 200" manufactured by AEROSIL Co., Ltd., Japan, average particle size: 42.2μm, untreated surface) were used, the same procedure as in Preparation Example 17 was carried out to obtain a silica particle content rate of 8% by mass. The silica dispersion (18). The silica particles in this silica dispersion (18) have an average particle size of 259 nm.
(調製例19:矽石分散液(19)之調製) (Preparation Example 19: Preparation of Silica Dispersion Liquid (19))
除了使用矽石粒子(日本AEROSIL股份有限公司製「Aerosil R974」,平均粒徑:52.0μm,藉由二甲基二氯 矽烷的表面處理品)以外,與調製例17同樣地進行,得到矽石粒子之含有率為8質量%的矽石分散液(19)。此矽石分散液(19)中的矽石粒子之平均粒徑為149nm。 Except that silica particles ("Aerosil R974" manufactured by AEROSIL Co., Ltd., Japan, average particle size: 52.0μm, surface-treated with dimethyldichlorosilane) were used, the same procedure as in Preparation Example 17 was carried out to obtain silica A silica dispersion liquid (19) with a particle content of 8% by mass. The silica particles in this silica dispersion (19) have an average particle size of 149 nm.
(調製例20:矽石分散液(20)之調製) (Preparation example 20: Preparation of silica dispersion (20))
除了使用Tosoh Silica股份有限公司製「Nipsil SS-50F」,平均粒徑:1.2μm,藉由二甲基聚矽氧烷的表面處理品)以外,與調製例1同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(20)。此矽石分散液(20)中的矽石粒子之平均粒徑為97nm。 Except for using "Nipsil SS-50F" manufactured by Tosoh Silica Co., Ltd., average particle size: 1.2μm, surface-treated product with dimethylpolysiloxane), the same procedure as in Preparation Example 1 was carried out to obtain silica particles The silica dispersion liquid (20) with a content rate of 16% by mass. The average particle diameter of the silica particles in the silica dispersion (20) is 97 nm.
(調製例21:矽石分散液(21)之調製) (Preparation example 21: Preparation of silica dispersion liquid (21))
除了使用Tosoh Silica股份有限公司製「Nipsil SBY-61」,平均粒徑:1.5μm,藉由二甲基聚矽氧烷的表面處理品)以外,與調製例1同樣地進行,得到矽石粒子之含有率為16質量%的矽石分散液(21)。此矽石分散液(21)中的矽石粒子之平均粒徑為358nm。 Except for using "Nipsil SBY-61" manufactured by Tosoh Silica Co., Ltd., average particle size: 1.5μm, surface-treated product with dimethylpolysiloxane), the same procedure as in Preparation Example 1 was carried out to obtain silica particles The silica dispersion liquid (21) with a content rate of 16% by mass. The average particle diameter of the silica particles in this silica dispersion (21) is 358nm.
(調製例22:矽石分散液(22)之調製) (Preparation example 22: Preparation of silica dispersion liquid (22))
除了使用矽石粒子(日本AEROSIL股份有限公司製「Aerosil NY50」,平均粒徑:29.4μm,藉由二甲基二氯矽烷的表面處理品)以外,與調製例17同樣地進行,得到矽石粒子之含有率為8質量%的矽石分散液(22)。此矽石分散液(22)中的矽石粒子之平均粒徑為234nm。 Except that silica particles ("Aerosil NY50" manufactured by AEROSIL Co., Ltd., Japan, average particle size: 29.4μm, surface treated with dimethyldichlorosilane) were used, the same procedure as in Preparation Example 17 was carried out to obtain silica A silica dispersion liquid (22) with a particle content of 8% by mass. The average particle size of the silica particles in this silica dispersion (22) is 234 nm.
(調製例23:矽石分散液(23)之調製) (Preparation example 23: Preparation of silica dispersion liquid (23))
除了使用矽石粒子(日本AEROSIL股份有限公司製「Aerosil RY200」,平均粒徑:59.4μm,藉由二甲基二氯矽烷的表面處理品)以外,與調製例17同樣地進行,得 到矽石粒子之含有率為8質量%的矽石分散液(23)。此矽石分散液(23)中的矽石粒子之平均粒徑為901nm。 Except that silica particles ("Aerosil RY200" manufactured by AEROSIL Co., Ltd., Japan, average particle size: 59.4μm, surface-treated with dimethyldichlorosilane) were used, the same procedure as in Preparation Example 17 was carried out to obtain silica A silica dispersion liquid (23) with a particle content of 8% by mass. The average particle size of the silica particles in this silica dispersion (23) is 901 nm.
(實施例1) (Example 1)
均勻混合10質量份的二季戊四醇六丙烯酸酯(東亞合成股份有限公司製「Lumicure DPA-620」,一部分含有二季戊四醇五丙烯酸酯;以下簡稱「DPHA」)、20質量份的季戊四醇三丙烯酸酯(東亞合成股份有限公司製「Aronix M-450」,一部分含有季戊四醇三丙烯酸酯;以下簡稱「PETA」)、30質量份的異三聚氰酸EO(環氧乙烷)改性三丙烯酸酯(東亞合成股份有限公司製「Aronix M-315」)及40質量份的胺基甲酸酯丙烯酸酯(MIWON公司製「PU-610」)。 Uniformly mix 10 parts by mass of dipentaerythritol hexaacrylate (“Lumicure DPA-620” manufactured by Toagosei Co., Ltd., part of which contains dipentaerythritol pentaacrylate; hereinafter referred to as “DPHA”), and 20 parts by mass of pentaerythritol triacrylate (Toya "Aronix M-450" manufactured by Synthetic Co., Ltd., partly containing pentaerythritol triacrylate; hereinafter referred to as "PETA"), 30 parts by mass of isocyanuric acid EO (ethylene oxide) modified triacrylate (Toya Gosei "Aronix M-315" manufactured by Co., Ltd.) and 40 parts by mass of urethane acrylate ("PU-610" manufactured by MIWON).
接著,於其中加入20質量份的以矽石粒子之含有率成為8質量%之方式以甲基乙基酮及丙二醇單甲基醚的混合溶劑(質量比=50/50)稀釋調製例1所得之矽石分散液(1)者及4質量份的光聚合起始劑(BASF日本股份有限公司製「Irgacure 184」與「Irgacure 2959」之質量比為1:1之混合物)後,以甲基異丁基酮稀釋到不揮發分成為30質量%,得到活性能量線硬化性組成物(1)。 Next, 20 parts by mass of the silica particles were added to the mixture and diluted with a mixed solvent of methyl ethyl ketone and propylene glycol monomethyl ether (mass ratio = 50/50) so that the content of silica particles became 8% by mass. The silica dispersion liquid (1) and 4 parts by mass of the photopolymerization initiator (a mixture of "Irgacure 184" and "Irgacure 2959" made by BASF Japan Co., Ltd. with a mass ratio of 1:1), then methyl The isobutyl ketone was diluted to a non-volatile content of 30% by mass, and an active energy ray curable composition (1) was obtained.
(實施例2~19) (Examples 2-19)
除了將實施例1所用之矽石分散液(1)變更為調製例2~19所得之矽石分散液(2)~(19)以外,與實施例1同樣地進行,得到活性能量線硬化性組成物(2)~(19)。 Except that the silica dispersion (1) used in Example 1 was changed to the silica dispersions (2) to (19) obtained in Preparation Examples 2 to 19, the same procedure as in Example 1 was carried out to obtain active energy ray curability Compositions (2)~(19).
(比較例1~4) (Comparative Examples 1~4)
除了將實施例1所用之矽石分散液(1)變更為調製例 20~23所得之矽石分散液(20)~(23)以外,與實施例1同樣地進行,得到活性能量線硬化性組成物(R1)~(R4)。 Except that the silica dispersion (1) used in Example 1 was changed to the silica dispersions (20) to (23) obtained in Preparation Examples 20 to 23, the same procedure as in Example 1 was carried out to obtain active energy ray curability Composition (R1)~(R4).
[評價用薄膜之製作] [Production of evaluation film]
使用線棒,將上述所得之活性能量線硬化性組成物(1)~(19)及(R1)~(R4)塗布於聚對苯二甲酸乙二酯(PET)薄膜(東麗股份有限公司製「Lumirror UH-13」,厚度:50μm)上,在60℃乾燥60秒。接著,於空氣環境下使用紫外線照射裝置(Eye Graphics「UV照射裝置」,高壓水銀燈:120W/cm,照射光量:1.5kJ/m2),照射紫外線,得到具有膜厚2μm的硬化塗膜之評價用薄膜。 Using a wire rod, apply the curable active energy ray composition (1)~(19) and (R1)~(R4) obtained above on a polyethylene terephthalate (PET) film (Toray Co., Ltd. "Lumirror UH-13", thickness: 50μm), dried at 60°C for 60 seconds. Next, use an ultraviolet irradiation device (Eye Graphics "UV irradiation device", high-pressure mercury lamp: 120W/cm, irradiation light quantity: 1.5kJ/m 2 ) in an air environment, and irradiate ultraviolet rays to obtain a cured coating film with a thickness of 2μm. Use film.
[潤濕張力之測定] [Measurement of wetting tension]
對於上述所得之評價用薄膜的硬化塗膜表面,依據JIS試驗方法K6768:1999,測定潤濕張力。 With respect to the surface of the cured coating film of the evaluation film obtained above, the wetting tension was measured in accordance with JIS test method K6768: 1999.
[霧值之測定及透明性之評價] [Determination of Haze Value and Evaluation of Transparency]
對於上述所得之評價用薄膜,用霧度計(日本電色工業股份有限公司製「NDH2000」)測定。從所得之霧值,依照下述之基準,評價透明性。 The evaluation film obtained above was measured with a haze meter ("NDH2000" manufactured by Nippon Denshoku Kogyo Co., Ltd.). From the obtained haze value, the transparency was evaluated according to the following criteria.
A:霧值小於0.5。 A: The haze value is less than 0.5.
B:霧值為0.5以上且小於2.0。 B: The haze value is 0.5 or more and less than 2.0.
C:霧值為2.0以上。 C: The haze value is 2.0 or more.
[防黏連性之評價] [Evaluation of anti-blocking property]
使上述所得之評價用薄膜的硬化塗膜表面彼此或評價用薄膜的硬化塗膜表面與基材面(硬化塗膜的相反面)接觸,依照下述之基準,評價防黏連性(以下,簡稱「AB性」)。 The surface of the cured coating film of the evaluation film obtained above or the surface of the cured coating film of the evaluation film and the substrate surface (the opposite side of the cured coating film) were brought into contact with each other, and the anti-blocking properties were evaluated according to the following criteria (hereinafter, Referred to as "AB sex").
A:即使強的摩擦也不牽扯。 A: Even strong friction is not involved.
B:強的摩擦時稍微牽扯。 B: Slightly involved in strong friction.
C:會黏住。 C: It will stick.
[OCA密著性之評價] [Evaluation of OCA Adhesion]
對於上述所得之評價用薄膜的硬化塗膜面,貼附寬度25mm、膜厚25μm的OCA(DIC股份有限公司製「Finetac CT-6030」與「Finetac硬化劑DN」以100/1之摻合比混合者),用拉伸試驗機進行180°剝離試驗,測定剝離強度。從所得的剝離強度之值,依照下述之基準,評價密著性。 On the hardened coating surface of the evaluation film obtained above, an OCA (Finetac CT-6030 made by DIC Co., Ltd. and "Finetac hardener DN" with a width of 25mm and a film thickness of 25μm at a blending ratio of 100/1 Mixer), perform a 180° peel test with a tensile testing machine to measure the peel strength. From the obtained value of the peel strength, the adhesion was evaluated in accordance with the following criteria.
A:剝離強度為17N以上。 A: The peel strength is 17N or more.
B:剝離強度為12N以上且小於17N。 B: The peel strength is 12N or more and less than 17N.
C:剝離強度小於12N。 C: The peel strength is less than 12N.
表1中顯示上述之實施例1~19及比較例1~4所調製的活性能量線硬化性組成物中使用的矽石種類及評價結果。 Table 1 shows the types of silica used in the active energy ray curable compositions prepared in the above-mentioned Examples 1 to 19 and Comparative Examples 1 to 4 and the evaluation results.
可確認本發明之活性能量線硬化性組成物(實施例1~19)的硬化塗膜係透明性高,AB性亦良好,與OCA的密著性亦高。 It can be confirmed that the cured coating film of the active energy ray curable composition (Examples 1 to 19) of the present invention has high transparency, good AB properties, and high adhesion to OCA.
另一方面,比較例1~4之活性能量線硬化性組成物雖然為其硬化塗膜表面之潤濕張力小於35mN/m之例,但是可確認透明性、OCA密著性的至少1個為不充分。 On the other hand, although the active energy ray curable composition of Comparative Examples 1 to 4 is an example in which the wetting tension of the cured coating film surface is less than 35mN/m, it can be confirmed that at least one of transparency and OCA adhesion is insufficient.
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