TWI744817B - Conductive powder and test connector comprising the same - Google Patents

Abstract

One aspect of the present invention relates to a conductive powder comprising: a core particle; and a polymer layer that surrounds the surface of the core particle; and a plurality of conductive particles are bonded to the polymer layer, and the polymer includes one or more The unsaturated hydrocarbons, aromatic hydrocarbons or both. One aspect of the present invention relates to a connector for testing, which includes: a conductive portion including the above-mentioned conductive powder; and a sheet of insulating material. The conductive powder of one aspect of the present invention can exhibit excellent deformation resistance, abrasion resistance, and resistance stability.

Description

Conductive powder and test connector containing the conductive powder

The present invention relates to a novel conductive powder and a test connector including the conductive powder.

In the test process for judging whether the device under test, such as a semiconductor device, is defective, a test connector is arranged between the device under test and the test equipment. The following test methods are known for test connectors: the device under test is electrically connected with the testing equipment, and the device under test is judged whether the device under test is bad based on whether the device under test and the testing equipment are energized.

If the terminals of the device under test are in direct contact with the terminals of the testing equipment without using the test connector, the terminals of the testing equipment will be worn or damaged during repeated tests and the entire testing equipment needs to be replaced. Previously, testing connectors were used to prevent the need to replace the entire testing equipment. Specifically, when the test connector is worn or damaged due to repeated contact with the terminal of the device under test, only the corresponding test connector can be replaced.

The conductive powder used in the conductive part of the test connector is coated with gold (Au) on the magnetic core. At this time, if the test connector is repeatedly compressed during its use, it will cause various problems. For example, the conductive powder present in the connector is forced by compression, and the conductive powder contacts, so that the particles are deformed and abraded. If the gold-plated layer on the surface peels off due to the abrasion of the particles, iron (Fe), nickel (Ni) or cobalt (Co), which is a component of the magnetic core with lower conductivity, is exposed to the outside and the conductivity decreases and the contact resistance increases. , So that electrical signals cannot be transmitted smoothly.

In addition, the particles of the existing conductive powder are irregularly formed and the contact between the particles is in the form of point contact. Therefore, when the connector is compressed, the contacts between the particles are dislocated and the resistance becomes unstable, which may not be smoothly realized. Electric signal transmission. [Prior Technical Literature] [Patent Literature]

(Patent Document 1) Korean Patent Publication No. 10-2018-0132031 (2018.12.11.)

[The problem to be solved by the invention]

The object of the present invention is to provide a novel conductive powder that has less deformation and abrasion of the conductive powder, maintains a stable electrical resistance and smooth electrical signal transmission even if the connector for repeated compression testing is repeated. [Technical means to solve the problem]

In order to solve the above-mentioned problems, one aspect of the present invention provides a conductive powder comprising: a core particle; and a polymer layer surrounding the surface of the core particle; and a plurality of conductive particles are bonded to the polymer layer, and the polymer layer The product contains more than one unsaturated hydrocarbon, aromatic hydrocarbon or both. [Effects of Invention]

The conductive powder of one aspect of the present invention can exhibit excellent deformation resistance, abrasion resistance, and resistance stability. This kind of conductive powder can exhibit the following effects: when the connector for testing is compressed, the polymer layer is also flexibly deformed, and the contact points between the particles are not open and keep in contact with each other in a surface contact form. The polymer layer is combined with a plurality of Each conductive particle, therefore, exhibits excellent resistance stability, and even if used repeatedly, it also stably transmits electrical signals.

The embodiment or a viewpoint of the present invention is exemplified for the purpose of explaining the technical idea of the present invention. The scope of rights of the present invention is not limited to the following embodiments, a viewpoint, or specific descriptions thereof.

As long as there are no other definitions, all technical and scientific terms used in the present invention have the meanings commonly understood by those with common sense in the technical field to which the present invention belongs. All terms used in the present invention are selected for the purpose of more clearly describing the present invention, and not for the purpose of limiting the scope of rights of the present invention.

The expression system used in the present invention such as "include", "have", "have", etc., as long as other meanings are not mentioned in the sentence or sentence containing the corresponding expression, it should be understood as having the possibility of including other embodiments The open-ended terms (open-ended terms).

Expressions such as "only including" corresponding components used in the present invention should be understood as closed-ended terms that exclude the possibility of including other components in addition to the corresponding components.

As long as no other meaning is mentioned, the singular expression described in the present invention may include the plural meaning, and this situation is equally applicable to the singular expression described in the scope of the invention application.

The expressions such as "first" and "second" used in the present invention are used to distinguish plural constituent elements from each other, and do not limit the order or importance of corresponding constituent elements.

In one aspect of the present invention, the term "about" is used for the purpose of including errors included in the manufacturing process of specific numerical values or slight numerical adjustments belonging to the scope of the technical idea of the present invention. For example, the term "about" refers to the range of ±10% of the value it represents, in one viewpoint it is in the range of ±5%, and in another viewpoint it is in the range of ±2%. In the field of the content of the present invention, as long as the value is not mentioned and a smaller range is specifically required, the approximate value of the level is appropriate.

The direction indicators such as "upper" and "upper" used in the present invention refer to the direction in which the terminals 11 of the device under test 10 are arranged based on the test connector 100, and the direction indicators such as "downward" and "lower" It refers to the direction in which the terminal 21 of the testing device 20 is arranged based on the test connector 100. The "thickness direction" of the test connector 100 mentioned in the present invention refers to the vertical direction. The thickness direction is only a reference for the description to clearly understand the present invention. Of course, the upper and lower sides may be defined differently according to the reference position.

In one aspect, the present invention can provide a conductive powder comprising: a core particle; and a polymer layer surrounding the surface of the core particle; and the polymer layer includes conductive particles combined with a polymer, the polymer Contains more than one type of unsaturated hydrocarbons, aromatic hydrocarbons, or both.

In one aspect of the present invention, the bonding between the polymer layer and a plurality of conductive particles can be achieved by the following method: in a state where the polymer layer surrounds the core particles, the conductive particle precursor is included The solution is absorbed into the polymer layer to reduce the precursor. With this combination, a part of the plurality of conductive particles is attached or bonded to the outer surface of the polymer layer, and a part of the remaining part of the plurality of conductive particles can be injected or penetrated into the inside of the polymer layer to exist. .

In one aspect of the present invention, a part of the plurality of conductive particles is bonded to the polymer layer in a state exposed on the outer surface of the polymer layer, and the remaining part of the plurality of conductive particles can be impregnated The state of the above-mentioned polymer layer is bonded to the above-mentioned polymer layer.

In one aspect, the present invention can provide a conductive powder comprising a polymer, a plurality of conductive particles are bonded to the surface of the polymer, and the polymer comprises more than one unsaturated hydrocarbon, aromatic hydrocarbon, or both .

In one aspect of the present invention, the bonding between the polymer and a plurality of conductive particles can be achieved by the following method: the solution containing the precursor of the conductive particles is absorbed into the polymer, and the precursor is reduced . By this bonding, a part of the conductive particles is attached or bonded to the surface of the polymer, and a part of the remaining parts of the plurality of conductive particles can be injected or penetrated into the inside of the outer outline of the polymer to exist. .

In one aspect of the present invention, a part of the plurality of conductive particles is bonded to the polymer while being exposed on the external surface, and a part of the remaining part of the plurality of conductive particles can be impregnated in the polymer The state is combined.

In one aspect of the present invention, the above-mentioned polymer may be selected from polyethylene, polypropylene, polytetrafluoroethylene, polyvinyl chloride, polystyrene, polyacrylonitrile, polyvinyl acetate, polymethyl methacrylate, One or more of these combinations and the group consisting of these block copolymers. In one aspect of the present invention, the above-mentioned polymer may be a styrene block copolymer.

In one aspect of the present invention, the above-mentioned polymer may be a styrene block copolymer.

In one aspect of the present invention, the above-mentioned styrene block copolymer may be selected from styrene-butadiene-styrene (SBS) copolymers, SIS (styrene-isoprene-styrene) copolymers, There is one or more of styrene-(ethylene-butadiene)-styrene (SEBS) copolymers and combinations thereof, but it is not limited thereto. When such a polymer is used as a component of the polymer layer of a conductive powder, it adsorbs well with the core particles, and can excellently achieve the desired effect of the present invention.

In one aspect of the present invention, the styrene block copolymer may have a structure as shown in the following chemical formula 1, may be a styrene block copolymer, and may have two styrene polymer blocks.

(於上述化學式1中，x、y、z可為1以上之整數，x與z可相同，A可為普通技術人員可使用之任意之重複單元)[Chemical formula 1]

(In the above chemical formula 1, x, y, and z can be integers greater than 1, x and z can be the same, and A can be any repeating unit that can be used by a person of ordinary skill)

In one aspect of the present invention, the above-mentioned core particles may be magnetic particles, polymer particles, inorganic particles other than metals, or organic-inorganic hybrid particles, but are not limited thereto.

In one aspect of the present invention, the magnetic particles may include one or more selected from the group consisting of cobalt, nickel, iron, and alloys including any one or more of these, but it is not limited thereto. Thereby, the conductivity of the conductive portion 130 can be improved, and the property of magnetization of the magnetic particles in a magnetic field can be used to improve the manufacturability in the manufacturing method described below. In one aspect of the present invention, the above-mentioned alloy may be an alloy in which other substances (for example, copper) are added to any of the magnetic substances (cobalt, nickel, and iron), or may be made of these At least two alloys among them.

In one aspect of the present invention, the polymer of the above-mentioned polymer particles may be selected from polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, polybutadiene, polymethyl Methyl acrylate, polymethyl acrylate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin , Epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, polyether, polyphenylene ether, polyacetal, polyimide, polyimide imine, polyether One or more of the group consisting of ether ketone, polyether agglomerate, divinylbenzene polymer, divinylbenzene copolymer, and combinations thereof, but it is not limited thereto.

In one aspect of the present invention, the polymer of the polymer particles may be a polymer obtained by polymerizing one or more polymerizable monomers having ethylenic unsaturated groups. Here, the polymerizable monomer having an ethylenically unsaturated group may be a non-crosslinkable monomer or a crosslinkable monomer.

In one aspect of the present invention, examples of the non-crosslinkable monomer include: styrene-based monomers such as styrene and α-methylstyrene; (meth)acrylic acid, maleic acid, cis- Butenedioic anhydride and other monomers containing carboxyl groups; methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, (meth)acrylic acid 2- Ethylhexyl, lauryl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, isopropyl (meth)acrylate, etc. Alkyl (meth)acrylate compounds; 2-hydroxyethyl (meth)acrylate, glycerol (meth)acrylate, polyoxyethylene (meth)acrylate, glycidyl (meth)acrylate, etc. contain oxygen Atom (meth)acrylate compounds; (meth)acrylonitrile and other monomers containing nitriles; vinyl ether compounds such as methyl vinyl ether, ethyl vinyl ether, and propyl vinyl ether; vinyl acetate, Vinyl butyrate, vinyl laurate, vinyl stearate and other acid vinyl ester compounds; ethylene, propylene, isoprene, butadiene and other unsaturated hydrocarbons; (meth) trifluoromethyl acrylate, (formaldehyde) Base) pentafluoroethyl acrylate, vinyl chloride, vinyl fluoride, chlorostyrene and other halogen-containing monomers, etc., but not limited thereto.

In one aspect of the present invention, examples of the crosslinkable monomer include tetramethylolmethane tetra(meth)acrylate, tetramethylolmethane tri(meth)acrylate, and tetramethylolmethane tetra(meth)acrylate. Methane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, glycerol tri(meth)acrylate , Glycerol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, (poly)butanediol di(meth)acrylate, Multifunctional (meth)acrylate compounds such as 1,4-butanediol di(meth)acrylate; triallyl (iso)cyanurate, triallyl trimellitate, divinylbenzene, o-benzene Diallyl dicarboxylate, diallyl acrylamide, diallyl ether, γ-(meth)acryloxypropyl trimethoxysilane, trimethoxysilyl styrene, vinyl trimethoxysilane Monomers containing silane, etc.

In one aspect of the present invention, the polymerizable monomer having an ethylenically unsaturated group can be polymerized by a known method to obtain the polymer particle. Such known methods include, for example, a method of carrying out suspension polymerization in the presence of a radical polymerization initiator, and the use of non-crosslinked seed particles to swell the monomer together with the radical polymerization initiator. The method of polymerization is not limited to this.

In one aspect of the present invention, the polymer of the above-mentioned polymer particles can be selected from the group consisting of polypyrene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polypyrrole, polycarbazole, polybenzazole, polyazide, and Aniline, polythiophene, poly(3,4-ethylenedioxythiophene), polyphenylene sulfide, polyacetylene, polystyrene sulfonate and polyphenylene vinylene, and a combination of these The above, but not limited to this.

In one aspect of the present invention, the above-mentioned inorganic particles may include one or more selected from the group consisting of silica, alumina, barium titanate, zirconia, carbon black, and combinations thereof, but are not limited thereto. . The particles formed of the above-mentioned silicon oxide are not particularly limited. Examples include particles obtained by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups to form cross-linked polymer particles. After that, calcination is carried out as necessary. Examples of the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and acrylic resin. The organic-inorganic hybrid particles may be core-shell organic-inorganic hybrid particles having a core and a shell arranged on the surface of the core. At this time, the core may be an organic core, and the shell may be an inorganic shell. Here, the organic core may be a core using the above-mentioned polymer as a material.

In one aspect of the present invention, the conductive particles may be one or more selected from the group consisting of gold, silver, platinum, palladium, rhodium, and alloys containing any one or more of these, but are not limited to this. In one aspect of the present invention, the above-mentioned alloy may be an alloy in which other substances (for example, phosphorus) are added to any one of conductive particles (gold, silver, platinum, palladium, and rhodium), or also It may be an alloy formed from at least two of these.

In one aspect of the present invention, the shape of the core particles can be qualitatively spherical, angular, tear drop, cubic, sponge, needle Ancicular, cylindrical, irregular, ligamental, flake, fibrous, polygonal, dendritic, or collection Body shape (aggregate). In one aspect of the present invention, the size of the aforementioned core particles is difficult to be uniformly specified because the size is small and the size of each particle is different, but it can be expressed in terms of the diameter of the circle that contains all the particles inside (reference document [Randall M. German, Powder metallurgy science, Metal Powder Industry, 2nd edition, page 64 (March 1, 1994)]). For example, in one aspect of the present invention, regarding the size of the core particle, the diameter may be in the range of about 20 μm to about 60 μm.

In one aspect of the present invention, the above-mentioned polymer layer can surround or coat the surface of the core particle. At this time, it is difficult to uniformly specify the thickness of the above-mentioned polymer layer, but its thickness can be distributed in the range of about 0.1 μm or more and about 5 μm or less. In one aspect of the present invention, the conductive powder may further include a second coating layer. In one aspect of the present invention, the above-mentioned second coating layer may exist between the core particle and the polymer layer or on the polymer layer. In one aspect of the present invention, the second coating layer may include one or more selected from the group consisting of gold, silver, platinum, palladium, rhodium, and alloys containing any one or more of these, but is not limited Here.

In one aspect of the present invention, the size of the conductive powder may be in the range of about 20 μm to about 65 μm.

In one point of view, the present invention can provide a test connector, which is used to connect the device under test and the test equipment electrically to each other, which includes: an insulating material Sheet; and a conductive portion, which extends in the vertical direction within the sheet and can be energized in the vertical direction.

In one aspect of the present invention, the above-mentioned conductive portion may include the conductive powder according to one aspect of the present invention.

In one aspect of the present invention, referring to FIG. 1, the device under test 10 may be a semiconductor device or the like. The device under test 10 includes a plurality of terminals 11. A plurality of terminals 11 are arranged on the lower side of the device under test 10. When testing the device under test 10, a plurality of terminals 11 can be in contact with the upper side surface of the test connector 100.

The detection device 20 includes a plurality of terminals 21. The plural terminals 21 correspond to the plural terminals 11. When testing the device under test 10, a plurality of terminals 21 may be in contact with the lower side surface of the test connector 100.

In one aspect of the present invention, each of the plurality of terminals 21 is arranged at a position facing each of the plurality of terminals 11 in the vertical direction. Although not shown, in another embodiment where the plurality of conductive portions 130 are inclined with respect to the vertical direction, each of the plurality of terminals 21 may be arranged along the inclined direction of the plurality of conductive portions 130 and each of the plurality of terminals 11 The position that the person faces.

In one aspect of the present invention, the test connector 100 is configured to be arranged between the device under test 10 and the testing device 20 to electrically connect the device under test 10 and the testing device 20 to each other. The test connector 100 includes: a sheet 110 made of an insulating material; and a conductive portion 130 configured to electrically connect the terminal 11 of the device under test 10 and the terminal 21 of the testing equipment 20.

In one aspect of the present invention, the sheet 110 has a thickness in the vertical direction. The thickness (length in the thickness direction) of the sheet 110 is smaller than the length in the direction perpendicular to the thickness direction of the sheet 110.

In one aspect of the present invention, the sheet 110 is formed of an electrically insulating material. The sheet 110 may be formed of a material that can be elastically deformed.

In one aspect of the present invention, the sheet 110 may include an elastic polymer material with insulating properties. The above-mentioned elastic polymer substance may be a polymer substance having a cross-linked structure. Examples of the curable polymer material forming material that can be used to obtain the above-mentioned crosslinked polymer material include: polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, Conjugated diene rubbers such as acrylonitrile-butadiene copolymer rubber and their hydrogenated products, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, etc. Block copolymer rubber and such hydrides, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene- Diene copolymer rubber, etc., but not limited to this.

In one aspect of the present invention, the sheet 110 may include silicone rubber. Here, the silicone rubber may be liquid silicone rubber (LSR, Liquid Silicone Rubber). In addition, the polysiloxane rubber can be polysiloxane, and can be condensation type, addition type, polysiloxane containing vinyl or hydroxyl groups, for example, polydimethylsiloxane, polymethylphenylsilicone Oxyane, or polydiphenylsiloxane, but it is not limited to this. The liquid silicone rubber that can be used in the present invention may be included in the liquid silicone rubber that can be used as an insulating substance by an ordinary skilled person within a range that does not deteriorate the performance of the test connector in one of the aspects of the present invention.

In one aspect of the present invention, the conductive portion 130 may extend in the up-down direction. The conductive portion 130 extends in the vertical direction within the sheet 110 and can be energized in the vertical direction.

In one aspect of the present invention, the conductive portion 130 is disposed on the sheet 110. The conductive part 130 may be supported by the sheet 110.

In one aspect of the present invention, the plurality of conductive parts 130 are spaced apart from each other along a direction perpendicular to the up-down direction. The plurality of conductive parts 130 may be arranged substantially with a fixed interval from each other.

In one aspect of the present invention, the upper and lower ends of the conductive portion 130 are exposed on the upper and lower surfaces of the sheet 110. The upper end of the conductive portion 130 is exposed on the upper surface of the sheet 110, and the lower end of the conductive portion 130 is exposed on the lower surface of the sheet 110. The upper end of the conductive portion 130 is configured to be in contact with the terminal 11 of the device under test 10, and the lower end of the conductive portion 130 is configured to be in contact with the terminal 21 of the testing device 20.

In one aspect of the present invention, the conductive portion 130 includes an exposed portion (not shown) exposed on the surface of the sheet 110, and the exposed portion is the surface of the conductive portion 130. The above-mentioned exposed portions are located at both ends of the conductive portion 130. The sheet 110 can be configured to surround the conductive portion 130 other than the above-mentioned exposed portion.

Hereinafter, the manufacturing method of the conductive powder will be described.

In one aspect, the present invention can provide a manufacturing method, which is a manufacturing method of conductive powder, which includes the following steps: (1) the step of coating the surface of the core particle with a polymer layer (Figure 4(A)); (2) ) The step of absorbing the solution containing the precursor of conductive particles into the polymer layer (Figure 4(B)); (3) reducing the precursor of the conductive particles absorbed in the polymer layer to bond to the polymer layer Steps (Figure 4(C)).

In one aspect of the present invention, after step (3), the above-mentioned manufacturing method may further include (4) the step of repeatedly performing steps (2) and (3) to fully bond the conductive particles to the polymer layer.

The conductive powder according to one aspect of the present invention can be produced by a method including the following steps.

Step (1): Put the core particle and the polymer solution dissolved in the organic solvent into a beaker and mix. After adding water to separate the polymer solution, the polymer solution is removed.

Step (2): After that, ultrasonic treatment is performed to precipitate the polymer. Repeat the ultrasonic treatment and precipitation process until the water in the beaker becomes clear. Thereafter, the water is removed, and the polymer-coated core particles are cleaned with alcohol.

Step (3): Put the polymer-coated powder and conductive particle precursor solution obtained in the above step into another conical tube and stir. At this time, the conductive particle precursor solution may be obtained by dissolving a conductive particle precursor (for example, a compound such as silver trifluoroacetate (CF ₃ COOAg)) in alcohol. After stirring, remove the precursor solution.

Step (4): After that, add the reducing agent solution to the tube and stir. At this time, the reducing agent solution may be obtained by dissolving a reducing agent (for example, a reducing agent such as hydrazine hydrate (NH ₂ NH ₂ ·xH ₂ O)) in alcohol. After stirring, the reducing agent is removed, and then the powder is washed with water or alcohol.

Step (5): Repeat steps (3) and (4) until the conductive particles are fully bonded to the polymer layer coated on the surface of the core particles. Finally, after washing the powder with alcohol, it is dried to obtain the conductive powder of the present invention.

In one aspect of the present invention, in the polymer solution, the weight ratio of the polymer to the solvent may be 1:3 to 1:50. In one aspect of the present invention, the solvent of the polymer solution can be selected from n-Pentane, n-Hexane, n-Heptane, n-Octane ), 2-Methylpentane, Cyclopentane, Cyclohexane, Methylcyclohexane, Benzene, Ethylbenzene, 1-Hexene ), Tetrahydrofuran and toluene.

In one aspect of the present invention, in the conductive particle solution, the weight ratio of the compound containing the conductive particles to the solvent may be 1:2 to 1:10. In one aspect of the present invention, the solvent of the conductive particle solution can be water or alcohol. Specifically, it can be selected from water, methanol, ethanol, 2-propanol, 1-butanol, and combinations thereof. More than one in the group.

In one aspect of the present invention, in the reducing agent solution, the weight ratio of the reducing agent to the solvent may be 1:5 to 1:40. In one aspect of the present invention, the solvent of the conductive particle solution can be water or alcohol. Specifically, it can be selected from water, methanol, ethanol, 2-propanol, 1-butanol, and combinations thereof. More than one in the group.

Hereinafter, the manufacturing method of the connector 100 for a test is demonstrated. The above-mentioned manufacturing method of the embodiment A includes the step of arranging the solidified conductive part 130 extending in the vertical direction in the mold. The above-mentioned manufacturing method of the above-mentioned embodiment A thereafter includes a step of forming the sheet 110 by injecting a liquid insulating material such as polysiloxane into the above-mentioned mold to harden it.

In the embodiment B, the connector 100 for testing can also be manufactured by a three-dimensional printing method. Here, the sheet 110 or the conductive portion 130 may be formed by three-dimensional printing, or the entire test connector may be formed.

The manufacturing method of the embodiment C includes the step of forming a hole for disposing the conductive portion 130 in the hardened sheet 110. The above-mentioned holes can be formed by penetrating the sheet 110 up and down. A laser can be used to form the above-mentioned holes. The manufacturing method of the foregoing embodiment C includes a step of forming the conductive portion 130 by injecting a solution containing the conductive powder according to one aspect of the present invention into the hole of the sheet 110 to harden it.

The manufacturing method of the above-mentioned embodiment D includes the step (a) of injecting the mixture of the conductive powder and the liquid insulating material according to one aspect of the present invention to a specific position. For example, the above-mentioned liquid insulating material may be liquid polysiloxy material. After step (a), the manufacturing method of the above embodiment D includes a step (b) of generating a magnetic field to arrange the coated conductive powder to a predetermined position. In the step (b), the conductive powder forms the conductive portion 130 by generating the magnetic field. Here, the conductive portion 130 extends in the up-down direction and can be energized in the up-down direction. The liquid insulating material injected into the specific position together with the conductive powder is cured after the step (b). The insulating material cured after the step (b) above can constitute at least a part of the sheet 110. The insulating material cured after the step (b) above can perform the function of supporting the conductive portion 130.

As an example of the above-mentioned embodiment D, the above-mentioned specific position may be inside the mold. In the step (a), the mixture of the conductive powder and the liquid insulating material may be injected into the mold. The liquid insulating material injected in the step (a) is cured after the step (b), thereby forming the sheet 110. By the magnetic field generated in the step (b), the conductive powder can flow in the liquid insulating material and be arranged to a predetermined position.

As another example of the above-mentioned embodiment D, the above-mentioned specific position may be formed inside the hole of the hardened sheet. Before the step (a) above, a hole forming step of forming holes penetrating the hardened sheet in the vertical direction may be performed. The above-mentioned hole can be formed by penetrating the above-mentioned sheet up and down. A laser can be used to form the above-mentioned holes. In the above step (a), a mixture of the conductive powder and the liquid insulating material according to one aspect of the present invention can be injected into the hole. By the magnetic field generated in the step (b), the conductive powder can flow inside the pores and be arranged to a predetermined position. After the step (b), the liquid insulating material is cured, thereby forming a part of the sheet.

Hereinafter, examples and test examples are given to more specifically describe the structure and effects of the present invention. However, these examples and test examples are provided for the purpose of illustration to help understand the present invention, and the scope and scope of the present invention are not limited to the following examples.

In addition, embodiments of the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, the same or corresponding components may be given the same reference signs. In addition, in the description of the following embodiments, repetitive description of the same or corresponding constituent elements may be omitted. However, even if the description of the constituent elements is omitted, it does not mean that such constituent elements are not included in a certain embodiment.

[Example] Manufacturing of conductive powder with conductive particles attached or bonded to the outer surface of the polymer layer and injected or penetrated into the interior of the polymer layer (1) Put the nickel core particle powder with an average particle diameter of 30 μm and the styrene-butadiene-styrene (SBS) solution dissolved in toluene into a beaker and mix. At this time, the weight ratio of SBS polymer to toluene can be 1:25 to 1:40. After adding water to separate the SBS solution, the SBS solution was removed.

(2) After that, ultrasonic processing is performed to precipitate SBS. Repeat the ultrasonic treatment and precipitation process until the water in the beaker becomes clear. After that, the water is removed, and the nickel core particle powder coated with SBS is cleaned with alcohol.

(3) Put the SBS-coated powder and conductive particle solution obtained in the above steps into another conical tube and stir. At this time, the conductive particle solution may be obtained by dissolving a compound containing conductive particles (for example, a compound such as silver trifluoroacetate (CF ₃ COOAg)) in ethanol. At this time, the weight ratio of silver trifluoroacetate to ethanol may be 1:5. After stirring, the conductive particle solution is removed.

(4) After that, add the reducing agent solution to the tube and stir. At this time, the reducing agent solution may be obtained by dissolving a reducing agent (for example, a reducing agent such as hydrazine hydrate (NH ₂ NH ₂ ·xH ₂ O)) in ethanol. At this time, the weight ratio of reducing agent to ethanol may be 1:15. After stirring, the reducing agent is removed, and then the powder is washed with water or alcohol.

(5) Steps (3) and (4) are repeated until the conductive particles are sufficiently coated and impregnated to the polymer layer coated on the surface of the core particles. Finally, after washing the powder with alcohol, it is dried to obtain the conductive powder of the present invention.

[Test Example] Using Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) to observe the surface and cross-section of the conductive powder of the present invention finally obtained from the above examples. The SEM results are shown in FIG. 5, and the FIB results are shown in FIGS. 6 and 7. According to such figures, it can be confirmed that the conductive powders of the present invention do not aggregate with each other, and the polymer layer to which the conductive particles are bonded is applied well.

Above, the technical idea of the present invention has been explained by some embodiments and examples shown in the accompanying drawings. However, it should be understood that the technology of the present invention can be understood by those with common sense in the technical field to which the present invention belongs. Various substitutions, changes and changes are made within the mind and scope. In addition, it should be understood that such replacements, changes and changes fall within the scope of the attached invention application patent.

10: Device under test 11: Terminal of the device under test 20: Testing equipment 21: Terminals of testing equipment 30: conductive powder 40: polymer layer 50: conductive particles 60: core particles 100: Test connector 110: flakes 130: conductive part

FIG. 1 is a partial cross-sectional view of a test connector 100 according to an embodiment, showing a situation in which the test connector 100 is arranged between a device under test 10 and a testing device 20. Fig. 2 is a schematic diagram of the conductive powder 30 according to one aspect of the present invention. Such particles are in the form of a core particle 60 coated with a polymer layer 40. In the polymer layer, a plurality of conductive particles 50 are attached or bonded to the outer surface of the polymer layer and can be injected or penetrated into the polymer layer. Exist inside. Fig. 3 is a schematic diagram showing how the conductive powder according to one aspect of the present invention maintains a surface contact form when subjected to pressure before and after use. Here, the figure (a) shows the arrangement of the conductive powder 30 existing in the conductive part before use, and the figure (b) shows the state in which the conductive powders are in contact with each other when pressure is applied up and down. According to the figure, the conductive powder-based polymer layer under pressure deforms elastically and the contact area becomes larger. That is, the conductive powders are in surface contact with each other. Moreover, even if the degree of pushing and separating the conductive powder from each other decreases as the contact area becomes larger and becomes surface contact, when the pressure is removed, the conductive powder returns to the original position. FIG. 4 is a schematic diagram showing, in chronological order, the conductive powder obtained through the manufacturing steps of the conductive powder according to one aspect of the present invention. (A) represents a conductive powder obtained by coating a polymer layer on the surface of a core particle. (B) is a conductive powder showing a state in which conductive particles are absorbed in the polymer layer. (C) refers to the conductive powder in which the absorbed conductive particles are reduced, so that a plurality of conductive particles are attached or bonded to the outer surface of the polymer layer and injected or penetrated into the inside of the polymer layer. (D) represents the conductive powder before and after the penetration of conductive particles. Fig. 5 shows a scanning microscope photograph of a conductive powder coated with a polymer layer manufactured according to one aspect of the present invention. According to the present invention, after coating, the conductive powders do not aggregate with each other and are coated with the polymer layer well. Figures 6 and 7 show cross-sectional photographs of conductive powder coated with the polymer layer using focused ion beams.

10: Device under test

11: Terminal of the device under test

20: Testing equipment

21: Terminals of testing equipment

100: Test connector

110: flakes

130: conductive part

Claims (11)

A conductive powder comprising: a core particle; and a polymer layer surrounding the surface of the core particle; and a plurality of conductive particles are bonded to the polymer layer, and the polymer includes at least one unsaturated hydrocarbon and aromatic Hydrocarbon or both. The conductive powder of claim 1, wherein the bonding between the polymer layer and the plurality of conductive particles is achieved in a state where the polymer layer surrounds the core particles, before the conductive particles are contained The solution of the driving substance is absorbed into the polymer layer to reduce the precursor. The conductive powder of claim 2, wherein a part of the plurality of conductive particles is attached or bonded to the outer surface of the polymer layer, and a part of the remaining part of the plurality of conductive particles is injected or penetrated into the polymer layer的内。 The interior. The conductive powder of claim 1, wherein a part of the plurality of conductive particles is bonded to the polymer layer in a state exposed on the outer surface of the polymer layer, and one of the remaining parts of the plurality of conductive particles A part is bonded to the polymer layer in a state of being immersed in the polymer layer. The conductive powder according to any one of claims 1 to 4, wherein the above-mentioned polymer is selected from polyethylene Olefin, polypropylene, polytetrafluoroethylene, polyvinyl chloride, polystyrene, polyacrylonitrile, polyvinyl acetate, polymethyl methacrylate, combinations of these, and the group of block copolymers More than one of them. The conductive powder according to any one of claims 1 to 4, wherein the above-mentioned polymer is a styrene block copolymer. The conductive powder of claim 6, wherein the above-mentioned styrene block copolymer is selected from the group consisting of styrene-butadiene-styrene (SBS) copolymer, SIS (styrene-isoprene-styrene) copolymer, One or more of styrene-(ethylene-butadiene)-styrene (SEBS) copolymers and combinations thereof. The conductive powder according to any one of claims 1 to 4, wherein the above-mentioned core particles are magnetic particles. The conductive powder of claim 8, wherein the magnetic particles include one or more selected from the group consisting of nickel, cobalt, iron, and alloys containing any one or more of these. The conductive powder according to any one of claims 1 to 4, wherein the conductive particles are selected from the group consisting of gold, silver, platinum, copper, palladium, rhodium, and alloys containing any one or more of these More than one kind. A test connector, which includes: A thin sheet of insulating material; and a conductive portion, which extends in the vertical direction within the thin sheet and can be energized in the vertical direction; and the conductive portion includes the conductive powder according to any one of claims 1 to 4.

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