KR101148143B1 - Insulated conductive particles and anisotropic conductive film composition using the same - Google Patents

Abstract

The present invention relates to an insulating conductive particle and a composition for an anisotropic conductive film comprising the same, and more particularly, by forming an insulating resin layer on the surface of the conductive particle using insulating resin fine particles having an epoxy reactive functional group at an end thereof. Insulating conductive particles capable of forming a sufficient insulating layer on the conductive particles while avoiding agglomeration, satisfying bonding strength with the metal, excellent resin flowability, and providing uniform and excellent quality electrical connection properties, and including the same It relates to a composition for an anisotropic conductive film.

Description

Insulating conductive particles and composition for anisotropic conductive film comprising the same {INSULATED CONDUCTIVE PARTICLES AND ANISOTROPIC CONDUCTIVE FILM COMPOSITION USING THE SAME}

The present invention relates to an insulating conductive particle and a composition for an anisotropic conductive film comprising the same, and more particularly, to an insulating conductive particle in which an insulating resin layer is formed by using insulating resin fine particles having an epoxy reactive functional group on the surface of the conductive particle. And it relates to a composition for an anisotropic conductive film comprising the same.

BACKGROUND OF THE INVENTION Anisotropic conductive connection methods have been widely used in conductive connection of connection terminals of electronic components, semiconductor devices, and substrates. The anisotropic conductive connection method is widely used for the connection between the transparent terminal of the TCP terminal and the glass substrate, the connection between the driving I / C and the FPC terminal, and the connection between the driving I / C and the transparent electrode in the manufacture of flat panel display panels. In chip-chip chip packaging, applications are expanding to future packaging methods that replace the solder ball connection method.

In recent years, due to the thinning and miniaturization of electronic components, the pattern of the connection terminals has been further refined. Therefore, it is an important issue to prevent short circuits between adjacent terminals when performing anisotropic conductive connection. In order to avoid such a short generation, the use of what is called insulating electroconductive particle which coat | covered the surface of general electroconductive particle with a thin resin layer as electroconductive particle for anisotropic conductive connection is gradually expanded.

However, the insulating conductive particles developed so far have various problems in the manufacturing process and the characteristics of the product. The types of insulating conductive particles developed to date can be roughly classified into three types when the insulating layer is composed of a thermoplastic resin, a thermosetting resin, and a partially cured resin.

First, when the insulating layer is coated with a thermoplastic resin, there is a manufacturing problem that it is difficult to uniformly form the insulating layer to a sufficient thickness during the manufacturing process. In practice, the process of dipping the conductive particles in a solution of a certain concentration, taking out and drying them repeatedly to obtain a constant thickness, and a monomer that supports the surface of the conductive particles with a coupling agent or surface treatment agent containing a specific immersion group and a surface treatment agent The interfacial polymerization method etc. which add and superpose | polymerize are reported. However, all of these methods require a multi-step process, which does not guarantee consistent quality and high yield, and also prevents agglomeration of particles that inevitably occur during the manufacturing process. It is the main cause of bad connection when used in In addition, when anisotropic conductive connection materials are manufactured using insulating conductive particles having a thermoplastic insulating layer, the resin film may be dissolved or peeled off by a solvent, and the problem that the solvent is limited and the formulation composition is also inevitable cannot be avoided.

On the other hand, when the coating layer is formed of a thermosetting resin, the dissolution and agglomeration problems occurring in the case of the thermoplastic resin can be avoided to some extent, but there is a problem in that the control of the crosslink density of the insulating resin layer is not easy. If the crosslinking density is too low, there is the same problem as the thermoplastic resin. If the crosslinking density is too high, the coating layer may not be peeled off during anisotropic connection, and thus, the electrode may not be energized, and it is pressurized at high pressure to break the insulating film of the conductive particles. It may be necessary to damage the electrode terminal to be connected, and nevertheless there is a disadvantage that the film flakes are not properly removed from the boundary between the electrode and the conductive particles, so that the interelectrode conduction is not reliable.

In order to solve such problems, a technique for preparing an insulating gel resin powder having an appropriate crosslinking degree and then adhering it to conductive fine particles by physical and mechanical methods to produce insulating conductive fine particles, and insulating resin fine particles containing hetero elements or functional groups on the surface thereof The technology for manufacturing the was developed. However, the above techniques are difficult to uniformly apply the insulating layer to a sufficient thickness during the manufacturing process, it is difficult to ensure a high yield by using a multi-step process, the coagulation between particles is a major cause of poor connection, the resin film is dissolved There is this.

In order to solve the problems of the prior art as described above, an object of the present invention is to provide insulating conductive particles capable of forming a sufficient insulating layer on the conductive particles while avoiding aggregation between the conductive particles.

In addition, an object of the present invention is to provide an insulating conductive particle and a composition for anisotropic conductive film that can satisfy the bonding force with the metal, excellent resin flow properties, and can provide a uniform and excellent quality electrical connection properties. do.

In order to achieve the above object, the present invention is conductive particles; And an insulating resin layer formed on the surface of the conductive particles, wherein the insulating resin layer is formed of insulating resin fine particles having an epoxy reactive functional group at an end thereof.

In another aspect, the present invention provides a composition for an anisotropic conductive film comprising an insulating adhesive component, the insulating conductive particles and inorganic fine particles.

The present invention also provides an anisotropic conductive film formed of the composition.

The insulating conductive particles of the present invention can form an insulating layer sufficient for the conductive particles while avoiding agglomeration between the conductive particles, and the anisotropic conductive film containing such insulating conductive particles satisfies the bonding force with the metal, and excellent resin flowability It is possible to provide uniform and excellent quality electrical connection characteristics.

Hereinafter, the present invention will be described in detail.

The present invention is excellent in resin flowability when the anisotropic conductive film is applied to the module by surface-treating the conductive particles using the insulating resin fine particles having an epoxy reactive functional group at the end, while avoiding agglomeration between the conductive particles, an insulating layer sufficient for the conductive particles. When applied to an anisotropic conductive film, especially an anisotropic conductive film of epoxy composition, it has excellent insulation properties, meets bonding strength with metals, provides uniform and excellent electrical connection properties, and imparts insulation properties to non-connected sites. can do.

The insulating conductive particles of the present invention include conductive particles and an insulating resin layer formed on the surface of the conductive particles, wherein the insulating resin layer is formed of insulating resin fine particles having an epoxy reactive functional group at an end thereof.

The conductive particles may be used without limitation as long as they are conventionally used in an anisotropic conductive film, specifically, metal particles including Au, Ag, Ni, Cu, solder, etc .; carbon; Particles coated with a metal containing Au, Ag, Ni, etc., using resins containing polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, and the like, and modified resins thereof as particles; Insulated electroconductive particle etc. which further coated the insulating particle on it can be used.

The size of the conductive particles can be selected and used depending on the application in the range of 2 to 30 ㎛ by the pitch of the circuit to be applied.

The insulating resin fine particles forming the insulating resin layer of the present invention can be used to bond an epoxy reactive functional group to the surface of the polymer core material, and to have an epoxy reactive functional group at its terminal.

Specifically, the insulating resin fine particles may be prepared by preparing a polymer core material and bonding an epoxy reactive functional group to an end of the polymer core material.

The polymer core may have a single structure or a core-shell type two-layer structure, but more preferably a core-shell type two-layer structure.

The polymer core material may be made of any one of high-crosslinked organic polymer particles, silica particles, inorganic particles including titanium dioxide particles, organic / inorganic composite particles, and metal oxide particles.

The high crosslinked organic polymer particles may be prepared using a polymer using a crosslinkable polymerizable monomer alone or a copolymer of a crosslinkable polymerizable monomer with at least one general polymerizable monomer based on 30% by weight or more of the total amount of the polymerizable monomer.

The crosslinkable polymerizable polymer is capable of radical polymerization, and may be divinylbenzene, 1,4-divinyloxybutane, divinyl sulfone, diallyl phthalate, diallyl acrylamide, triallyl (iso) cyanurate, trially trimelli Allyl compounds, such as a tate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, penta erythritol tetra (meth) acrylate, penta erythritol tri ( Meth) acrylate, pentaaryl tritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) An acrylate crosslinking compound, such as an acrylate and glycerol tri (meth) acrylate, can be used.

In addition, the general polymerizable monomer is capable of radical polymerization, styrene monomers such as styrene, α-methyl styrene, m-chloromethyl styrene and ethyl vinyl benzene, methyl (meth) acrylate, ethyl (meth) acrylate , Propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) Acrylate monomers such as acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, vinyl chloride, vinyl acetate, vinyl ether, vinyl propionate, vinyl butyrate and the like can be used.

In addition, when the polymer core material has a core-shell type two-layer structure, the surface of the polymer core material as described above may be a carboxyl group, a hydroxyl group, a glycol group, an aldehyde group, an oxazoline group, a silane group, a silanol, and a metal affinity functional group. (silanol) groups, amine groups, ammonium groups, amide groups, imide groups, nitro groups, nitrile groups, pyrrolidone groups, thiol groups, sulfonic acid groups, sulfonium groups, sulfides A shell layer can be formed using linear or low crosslinking degree organic polymer resin, such as a group and an isocyanate group.

As the epoxy reactive functional group bonded to the polymer core as described above, any polymer resin having an epoxy group can be used without limitation, and specifically, glycidyl methacrylate, epoxy acrylate; Epoxy methacrylates; Or an epoxy compound having two epoxy groups in one molecule of an unsaturated group-containing dicarboxylic acid compound obtained by reacting an acid anhydride (ai) of a tribasic acid and / or a tetrabasic acid with an unsaturated group-containing monoalcohol (a-ii). Acid-modified epoxy (meth) acrylate compound obtained by making polybasic acid anhydride react with the reaction product obtained by making the unsaturated compound containing epoxy group and the unsaturated group containing monocarboxylic acid react with two epoxy groups in 1 molecule obtained by making it react, and the said Acid-modified epoxy (meth) acrylate compounds; The epoxy compound etc. which have two or more epoxy groups in 1 molecule can be used.

The method for producing the insulating resin fine particles is not particularly limited, and for example, an emulsion polymerization method, a soap-free emulsion polymerization method, a seed polymerization method and the like can be used.

Insulating resin microparticles | fine-particles manufactured as mentioned above and having an epoxy reactive functional group at the terminal are processed to the surface of electroconductive particle, and form an insulating resin layer.

At this time, the insulating resin fine particles to be treated to the conductive particles can be adhered to the surface of the conductive particles by a physical / chemical method, the adhesion form is also possible to be bonded to both the fixed type and the coating type.

The insulating resin layer is preferably formed on the surface of the conductive particles to a thickness of 0.01 to 1 ㎛, when the thickness is less than 0.01 ㎛ may lower the insulation performance, if it exceeds 1 ㎛ the connection characteristics are not expressed May not

In another aspect, the present invention provides a composition for anisotropic conductive film comprising insulating conductive particles formed with an insulating resin layer using insulating resin fine particles having an epoxy reactive functional group on the surface of the conductive particles as described above.

Specifically, the composition for the anisotropic conductive film includes the insulating conductive particles, an insulating adhesive component, and inorganic fine particles.

The said insulating adhesive component used for the composition for anisotropic conductive films of this invention contains resin which has an epoxy group, and resin for film formation.

It is preferable that the resin which has the said epoxy group uses the polyhydric epoxy resin which has 2 or more epoxy groups in a molecule | numerator. Specifically, examples of the resin having an epoxy group include polyhydric phenols such as novolac resins such as phenol novolac and cresol novolac, bisphenol A, bisphenol F, and bishydroxyphenyl ether, ethylene glycol, neopentyl glycol, glycerin, and trimethylol. Polyhydric alcohols, such as propane and polypropylene glycol, Polyamino compounds, such as ethylenediamine, triethylene tetraamine, and aniline, Polyhydric carboxy compounds, such as phthalic acid and isophthalic acid, can also be used.

It is preferable that resin which has the said epoxy group is contained by 10 to 40weight% in an insulation adhesive component. When the content is less than 10% by weight, compatibility and reaction with the epoxy is insufficient, and when the content exceeds 40% by weight may not be polymerization.

The resin for forming a film may be used without limitation as long as the resin is capable of forming a film well without chemically reacting with the curing agent used. Specifically, the film forming resin may be an acrylic resin such as an acrylate resin, an ethylene acrylate copolymer, an ethylene acrylic acid copolymer, an olefin resin such as an ethylene resin or an ethylene propylene copolymer, butadiene resin, acrylonitrile-butadiene air Copolymer, Styrene-Butadiene Block Copolymer, Styrene-Butadiene-Styrene Block Copolymer, Carboxylated Styrene-Ethylene-Butadiene-Styrene-Block Copolymer, Tylene Styrene-Butylene Block Copolymer, Nitrile Butadiene Rubbers such as rubber, styrene butadiene rubber, chloroprene rubber, vinyl resins such as vinyl butylal resin and vinyl form resin, ester resins such as polyester and cyanate ester resin, phenoxy resin, silicone rubber, urethane resin, etc. Can be used.

The film forming resin is preferably contained in 10 to 50% by weight in the insulating adhesive component. When the content is less than 10% by weight it may be difficult to form a film, when it exceeds 50% by weight it may be difficult to manufacture a flowable resin in a solid phase.

Since the insulating conductive particles used in the composition for anisotropic conductive film of the present invention are the same as described above, detailed description thereof will be omitted.

The insulating conductive particles are preferably contained in 1 to 30 parts by weight based on 100 parts by weight of the insulating adhesive component. If the content is less than 1 part by weight, the conductivity may be lowered. If the content is more than 30 parts by weight, it may be difficult to control the insulation of the film formation and the pitch-to-pitch conduction due to the excessive amount of conductive particles.

The inorganic fine particles used in the composition for anisotropic conductive films of the present invention are silica; Particles coated with an organic substance using inorganic fine particles such as titanium oxide and a resin including polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, and the like and a modified resin thereof; Insulated electroconductive particle etc. which further coated the insulating particle on it can be used.

The inorganic fine particles are preferably contained in 0.1 to 10 parts by weight based on 100 parts by weight of the insulating adhesive component. If the content is less than 0.1 parts by weight, flow control by the microparticles may be insufficient, and when the content exceeds 10 parts by weight, film formation and dispersion of the fine particles may not be easy.

The composition for anisotropic conductive films containing the above components may further include a curing agent, a solvent, an additive, and the like.

The curing agent may be used having two or more active hydrogen in the molecule, specifically, may be used imidazole, isocyanate, amine, amide, acid anhydride. The content may be included in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the insulating adhesive component.

The solvent uniformly mixes each component included in the composition for the anisotropic conductive film, and serves to make the film easier by lowering the composition of the composition.

The solvent may be used without limitation as long as it is conventional, and specifically, toluene, xylene, propylene glycol monomethyl ether acetate, benzene, acetone, methyl ethyl ketone, tetrahydrofuran, dimethylformaldehyde, cyclohexanone, etc. may be used. . The content may be included in 10 to 70 parts by weight based on 100 parts by weight of the insulating adhesive component.

The additive is used to add additional physical properties without inhibiting the basic physical properties of the composition for the anisotropic conductive film, polymerization inhibitors, antioxidants, heat stabilizers, curing accelerators, coupling agents and the like can be used. The content is preferably included in 0.01 to 5 parts by weight based on 100 parts by weight of the insulating adhesive component.

As the polymerization inhibitor, hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, phenothiazine, and mixtures thereof may be used. In addition, as the antioxidant used for the purpose of preventing oxidation reaction and imparting thermal stability of the composition induced by heat, a branched phenolic or hydroxy cinnamate-based substance may be added. For example, tetrakis -(Methylene- (3,5-di-t-butyl-4-hydro cinnamate) methane, 3,5-bis (1,1-dimethylethyl) -4-hydroxy benzene propanoic acid thiol di- 2,1-ethanediyl ester, octadecyl 3,5-di-t-butyl-4-hydroxy hydrocinnamate (above manufactured by Ciba), 2,6-di-tertiary-p-methylphenol, and the like. As the curing accelerator for improving the reaction rate, at least one of a solid imidazole accelerator, a solid phase and a liquid amine curing accelerator can be used, etc. As the coupling agent, vinyl trichloro silane, vinyl trimethoxy silane, 3- Glycidoxy propyl trimethoxy silane, 3-methacryloxy propyl trimeth Methoxy silane, 2-aminoethyl-3-aminopropyl methyldimethoxy silane, 3-ureidopropyl triethoxy silane, and the like, and one or more of these various silane coupling agents may be used. It is not limited to kinds.

In addition, the composition for the anisotropic conductive film of the present invention is hydrophobic nano having a size of about 5 to 20 nanometers (nm) surface-treated with an organic silane, in addition to the basic constituent factors and essential containing factors for achieving the object of the present invention. The inclusion of silica particles induces smooth control of flowability according to the process conditions and very hardening of the cured structure of the cured anisotropic conductive film, thereby preventing expansion at high temperatures, thereby providing excellent initial adhesion and low connection resistance. You may manufacture an anisotropic conductive film.

Hydrophobic nano silica particles having a size of about 5-20 nanometers (nm) surface-treated with such organic silanes include Aerosil R-972, Aerosil R-202, Aerosil R-805, Aerosil R-812, Aerosil R-8200 (Degussa) and the like, and may be used in any kind, but is not necessarily limited thereto.

In another aspect, the present invention provides an anisotropic conductive film formed of the composition for an anisotropic conductive film as described above.

The method for forming the anisotropic conductive film does not require any special apparatus or equipment, and the insulating adhesive component, the insulating conductive particles, the inorganic fine particles, the curing agent and other additives are dissolved in a solvent to liquefy and the above components are within the range of the pulverization. After stirring for a certain time to obtain a uniform mixture, it is applied to a thickness of 10 ~ 50 ㎛ on a release film and then dried for a certain time to obtain a monolayer anisotropic conductive film. Moreover, in this invention, anisotropic conductive film which has a multilayer structure of two or more layers can also be obtained by repeating the above process twice or more.

Hereinafter, the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional view showing the insulating resin fine particles of the present invention. As shown in FIG. 1, the insulating resin fine particles 10 of the present invention have a core-shell-type polymer core member 13 having a core layer 11 and a shell layer 12, and ends of the polymer core member 13. It is composed of bonded epoxy reactive functional groups 14.

1 illustrates a structure in which an epoxy-reactive functional group is bonded to the core-shell-shaped polymer core end, but the insulating resin fine particles of the present invention are not limited to the core-shell polymer core but are epoxy at the end of a single core polymer core. It also includes all reactive functional groups.

Since the detailed description of the insulating resin fine particles is the same as described above, detailed description thereof will be omitted.

2 is a cross-sectional view showing the insulating conductive particles of the present invention. As shown in FIG. 2, the insulating conductive particles 20 of the present invention are formed on the surfaces of the conductive particles 21 and the conductive particles 21, and have insulating resin fine particles having an epoxy reactive functional group 14 at an end thereof. It consists of an insulating resin layer 22 formed of 10).

The insulating conductive particles 20 can form a sufficient insulating resin layer 22 on the surface of the conductive particles 21 while avoiding aggregation between the conductive particles 21.

When energy is applied to the insulating conductive particles 20, the epoxy reactive functional groups 14 bonded to the ends of the insulating resin fine particles 10 react with the film composition, thereby exhibiting excellent insulating properties.

Since the detailed description of the insulating conductive particles is the same as the above description, detailed description thereof will be omitted.

3 is a cross-sectional view showing an anisotropic conductive film of the present invention. As shown in FIG. 3, the anisotropic conductive film 30 of this invention consists of the insulating conductive particle 20, the inorganic fine particle 31, and the insulating adhesive component 32. As shown in FIG.

The anisotropic conductive film 30, including the insulating conductive particles 20 of the present invention exhibits excellent insulating properties, meets the bonding force with the metal, and provides a uniform and excellent electrical connection properties.

Since the detailed description of the anisotropic conductive film is the same as the foregoing, detailed description thereof will be omitted.

Hereinafter, the present invention will be described in more detail with reference to Synthesis Examples and Examples. These embodiments are for purposes of illustration only and are not intended to limit the scope of protection of the present invention.

Example 1 Preparation of Insulating Resin Fine Particles

0.5 g of sodium lauryl sulfate (SLS) was dispersed in 3,000 g of ultrapure water (DI water) for 10 minutes. 30 g of styrene (St) was added thereto and dispersed and emulsified for 1 hour. At this time, a nitrogen (N ₂ ) atmosphere was formed. Then, 1g of potassium persulfate (potassium persulfate, KPS) was dissolved in water, added and reacted at 80 ° C for 1 hour to form a polymer core. After completion of the reaction, 45 g of styrene, 75 g of divinylbenzene (DVB), and 3.5 g of potassium persulfate were sequentially added, followed by reaction at the same temperature for 10 hours. After the reaction was completed, 1.5 g of sodium lauryl sulfate and 0.5 g of potassium persulfate were further added thereto, followed by stirring for 20 minutes. Then, 195 g of styrene, 25 g of divinylbenzene, and 45 g of glycidyl methacrylate were sequentially added. The reaction was carried out for 10 hours. After completion of the reaction, the emulsion was separated from the polymer using a centrifuge and freeze-dried to obtain final insulating resin fine particles.

Example 2. Preparation of Insulating Resin Fine Particles

Except for using glycidyl methacrylate in 80g in Example 1 was carried out in the same manner as in Example 1.

Comparative Example 1. Preparation of insulating resin fine particles

Except for using glycidyl methacrylate in Example 1 was carried out in the same manner as in Example 1.

Examples 3-8. Insulation Conductive Particles Manufacturing

As shown in Table 1, the insulating fine particles prepared in Example 1 or 2 were formed on the surface of the conductive ball (Sekisui AUL-704) having a diameter of 4 μm using a physical impact method (Hybridizer).

Comparative Examples 2-4. Insulation Conductive Particles Manufacturing

As shown in Table 2, the insulating fine particles prepared in Comparative Example 1 were formed on the surface of the conductive ball (Sekisui AUL-704) having a diameter of 4 μm using a physical impact method (Hybridizer).

The withstand voltage of the prepared insulating conductive particles was measured using the method shown in FIG. 4, and the results are shown in Tables 1 and 2 below. The withstand voltage means that the higher the value, the less the electricity passes. Therefore, the insulation characteristic is excellent when the withstand voltage is 0.5 ~ 1.2kV.

Example Insulating fine particles
(Production example) Challenge Ball
Content (wt%) Coverage
(%) Insulation layer thickness
(Nm) Withstand voltage
(kV) 3 One 4 68 50 0.3 4 One 8 70 60 0.8 5 One 12 74 70 0.9 6 2 4 64 44 0.5 7 2 8 66 52 0.6 8 2 12 67 58 0.8

Comparative example Insulating fine particles
(Comparative Example) Challenge Ball
Content (wt%) Coverage
(%) Insulation layer thickness
(Nm) Withstand voltage
(kV) 2 One 4 72 60 0.1 3 One 8 76 62 0.3 4 One 12 77 64 0.4

As shown in Table 1 and Table 2, the insulating conductive particles of Examples 3 to 8 surface-treated using insulating resin fine particles having an epoxy reactive functional group at the terminal according to the present invention has a breakdown voltage of 0.3 ~ 0.9KV Comparative Example Compared with 2 to 4 it was confirmed that the insulation properties are excellent.

Examples 9-14. Preparation of composition for anisotropic conductive film

To the composition and composition shown in Table 3 below to prepare a composition for an anisotropic conductive film.

Kinds product name Maker Content (wt%) Rubber RKB2023 Regina 25 Phenoxy watch PKHH Inchemrez 20 BPA system YP50 Kukdo Chemical 25 Flow system BPEFG Osaka Gas 20 Hardener HXA-394 Asahi Kasahi One Insulation Ball Example (9-14) 4 Silica Aerosil 200 Degussa 5

After apply | coating said composition for anisotropic conductive films on a white release film, respectively, the solvent was volatilized in the dryer of 80 degreeC, and the dried anisotropic conductive film of 20 micrometer thickness was obtained.

Then, the connection resistance and insulation resistance were measured by the method shown in FIGS. 5 and 6 using the anisotropic conductive film, and the results are shown in Table 4 below.

Example Applicable Insulation Ball
(Example) Connection resistance
(Ω) Insulation Resistance
(Ω) Driving characteristics 9 3 0.8 1.3 × 10 ¹² OK 10 4 0.8 2.1 × 10 ¹² OK 11 5 0.9 2.5 × 10 ¹² OK 12 6 0.8 6.8 × 10 ¹¹ OK 13 7 0.8 5.2 × 10 ¹² OK 14 8 0.8 9.6 × 10 ¹² OK

As shown in Table 4, the anisotropic conductive films of Examples 9 to 14 containing the insulating conductive particles surface-treated using the insulating resin fine particles having an epoxy reactive functional group at the terminal according to the present invention, the connection resistance, insulation resistance and It was confirmed that the driving characteristics were superior to the conductive film including the insulating conductive particles insulated with the same content of the insulating particles not containing the epoxy group.

Although the present invention has been described as the preferred embodiment mentioned above, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. The appended claims also cover such modifications and variations as fall within the spirit of the invention.

1 is a cross-sectional view showing the insulating resin fine particles of the present invention.

2 is a cross-sectional view showing the insulating conductive particles of the present invention.

3 is a cross-sectional view showing an anisotropic conductive film of the present invention.

Figure 4 illustrates a method for measuring the breakdown voltage of the insulating conductive particles in accordance with an embodiment of the present invention.

Figure 5 shows a method for measuring the connection resistance of the anisotropic conductive film in accordance with an embodiment of the present invention.

Figure 6 illustrates a method for measuring the insulation resistance of the anisotropic conductive film according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: insulating resin fine particles

11: core layer 12: shell layer

13: core-shell polymer core 14: epoxy reactive functional group

20: insulating conductive particles

21: conductive particles 22: insulating resin layer

30: anisotropic conductive film

31: inorganic fine particles 32: insulating adhesive component

Claims (17)

Electroconductive particle; And It comprises an insulating resin layer formed on the surface of the conductive particles, the insulating resin layer is formed of insulating resin fine particles having an epoxy reactive functional group at the end, The insulating resin fine particles are insulating conductive particles, characterized in that having a structure in which the epoxy-reactive functional group is bonded to the end of the core core of the core-shell type. The method of claim 1, The conductive particles may be metal particles containing Au, Ag, Ni, Cu or solder; carbon; Particles coated with a metal using at least one resin selected from polyethylene, polypropylene, polyester, polystyrene, and polyvinyl alcohol and modified resin thereof as particles; Insulating conductive particles, characterized in that any one or more selected from insulated particles coated by adding insulating particles thereon. The method of claim 1, The insulating resin fine particles are insulating conductive particles, characterized in that prepared by the step of preparing a polymer core material and the step of bonding the epoxy reactive functional group to the end of the polymer core material. The method of claim 3, The polymer core material is an insulating conductive particle, characterized in that at least any one selected from high-crosslinked organic polymer particles, silica particles, inorganic particles including titanium dioxide particles, organic / inorganic composite particles, metal oxide particles. The method of claim 3, The epoxy reactive functional group is glycidyl methacrylate; Epoxy acrylates; Epoxy methacrylates; An epoxy group having two epoxy groups in one molecule is reacted with an unsaturated group-containing dicarboxylic acid compound obtained by reacting an acid anhydride (ai) of a tribasic or tetrabasic acid with an unsaturated group-containing monoalcohol (a-ii). An acid-modified epoxy (meth) acrylate compound obtained by reacting a polybasic acid anhydride with a reaction product obtained by reacting an unsaturated compound-containing epoxy compound having two epoxy groups in one molecule and an unsaturated group-containing monocarboxylic acid, and the acid-modified epoxy (Meth) acrylate compounds; And a polymer resin having any one or more epoxy groups selected from epoxy compounds having two or more epoxy groups in one molecule. The method of claim 1, The insulating resin layer is insulating conductive particles, characterized in that formed on the surface of the conductive particles to a thickness of 0.01 to 1㎛. Insulating adhesive components; Insulating conductive particles according to claim 4; And Inorganic fine particles; Composition for anisotropic conductive film comprising a. The method of claim 7, wherein Based on 100 parts by weight of the insulating adhesive component; 1 to 30 parts by weight of the insulating conductive particles according to claim 4; And 0.1 to 10 parts by weight of the inorganic fine particles; Composition for anisotropic conductive film comprising a. The method of claim 7, wherein The insulating adhesive component is an anisotropic conductive film composition comprising a resin having an epoxy group and a resin for film formation. 10. The method of claim 9, The resin having the epoxy group is a novolac resin containing phenol novolac or cresol novolac, bisphenol A, bisphenol F, bishydroxyphenyl ether, ethylene glycol, neopentyl glycol, glycerin, trimethylolpropane, polypropylene glycol, ethylene A composition for an anisotropic conductive film, characterized in that any one or more selected from diamine, triethylenetetraamine, aniline, phthalic acid and isophthalic acid. 10. The method of claim 9, The film forming resin is an acrylate resin, ethylene acrylate copolymer, ethylene acrylic acid copolymer, ethylene resin, ethylene propylene copolymer, butadiene resin, acrylonitrile-butadiene copolymer, styrene-butadiene block copolymer, styrene -Butadiene-styrene block copolymer, carboxylated styrene-ethylene-butadiene-styrene-block copolymer, styrene styrene-butylene block copolymer, nitrile butadiene rubber, styrenebutadiene rubber, chloroprene rubber, vinyl butyl Composition for an anisotropic conductive film, characterized in that any one or more selected from an egg resin, vinylform resin, polyester, cyanate ester resin, phenoxy resin, silicone rubber and urethane resin. The method of claim 7, wherein The inorganic fine particles are silica; Inorganic particles containing titanium oxide and resins containing polyethylene, polypropylene, polyester, polystyrene or polyvinyl alcohol, and modified resins thereof, and particles coated with an organic substance; The composition for anisotropic conductive films, characterized in that any one or more selected from the insulating treated conductive particles further coated with insulating particles thereon. The method of claim 7, wherein The composition for anisotropic conductive film is a composition for anisotropic conductive film, further comprising a curing agent, a solvent and an additive. The method of claim 13, The curing agent is an composition for an anisotropic conductive film, characterized in that any one or more selected from imidazole, isocyanate, amine, amide and acid anhydride. The method of claim 13, The solvent is an anisotropic conductive film composition, characterized in that any one or more selected from toluene, xylene, propylene glycol monomethyl ether acetate, benzene, acetone, methyl ethyl ketone, tetrahydrofuran, dimethylformaldehyde and cyclohexanone. The method of claim 13, The additive is an anisotropic conductive film composition, characterized in that any one or more selected from a polymerization inhibitor, antioxidant, heat stabilizer, curing accelerator and coupling agent. Anisotropic conductive film formed of the composition of claim 7.

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