TWI743830B - 光源模組 - Google Patents

光源模組 Download PDF

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TWI743830B
TWI743830B TW109119779A TW109119779A TWI743830B TW I743830 B TWI743830 B TW I743830B TW 109119779 A TW109119779 A TW 109119779A TW 109119779 A TW109119779 A TW 109119779A TW I743830 B TWI743830 B TW I743830B
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light
source module
light source
recessed
module according
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TW202146985A (zh
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許俊昇
林孟緯
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佳世達科技股份有限公司
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Priority to US17/345,071 priority patent/US20210391511A1/en
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    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
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    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01ELECTRIC ELEMENTS
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031Reflecting element, sheet or layer
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    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068Arrangements of plural sources, e.g. multi-colour light sources
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    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073Light emitting diode [LED]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086Positioning aspects
    • G02B6/009Positioning aspects of the light source in the package
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Abstract

一種光源模組,包括電路基板、複數個發光單元以及波長轉換層。電路基板具有凹陷部。發光單元設置於凹陷部內。波長轉換層覆蓋於這些發光單元,且填充於凹陷部。

Description

光源模組
本發明是有關於一種光源模組,且特別是有關於一種可縮減厚度的光源模組。
現有的顯示裝置逐漸朝向薄型化發展,部分顯示裝置會選擇採用側向入光的方式,而將光源模組設置在顯示裝置的邊框內,以在厚度方向縮減顯示裝置的尺寸。
然而,目前顯示裝置也以窄邊框為趨勢發展,光源模組本身的厚度勢必也要進一步縮減。
本發明係有關於一種光源模組,可在維持一定混光距離的條件下,縮減光源模組的厚度。
本發明提出一種光源模組。光源模組包括電路基板、複數個發光單元以及波長轉換層。電路基板具有凹陷部。發光單元設置於凹陷部內。波長轉換層覆蓋於這些發光單元,且填充於凹陷部。
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:
1:顯示裝置
10:導光板
101:入光面
102:出光面
11:背光模組
12:顯示面板
12A:顯露區域
12B:非顯露區域
100,100’,200,300,400:光源模組
110:電路基板
112,112’:凹陷部
114:第一表面
116:底部
118:側壁
120:發光單元
130:波長轉換層
140:反射層
150,150a,150b,150c,151,151a,151b,151c:微結構
D:混光距離
T:光源模組的厚度
第1圖是本發明一實施例之顯示裝置的示意圖。
第2圖是本發明一實施例之光源模組的立體圖。
第3圖是本發明另一實施例之光源模組的立體圖。
第4圖是第2圖之光源模組沿剖面線4-4’的剖視圖。
第5圖是本發明又一實施例之光源模組的剖視圖。
第6圖是本發明再一實施例之光源模組的立體圖。
第7圖是第6圖之光源模組沿剖面線7-7’的剖視圖。
第8圖是本發明其它實施例之光源模組的剖視圖。
以下將詳述本發明的各實施例,並配合圖式作為例示。除了這些詳細描述之外,本發明還可以廣泛地施行在其他的實施例中,任何所述實施例的輕易替代、修改、等效變化都包含在本案的範圍內,並以之後的專利範圍為準。在說明書的描述中,為了使讀者對本發明有較完整的瞭解,提供了許多特定細節;然而,本發明可能在省略部分或全部這些特定細節的前提下,仍可實施。此外,眾所周知的步驟或元件並未描述 於細節中,以避免造成本發明不必要之限制。圖式中相同或類似之元件將以相同或類似符號來表示。特別注意的是,圖式僅為示意之用,並非代表元件實際的尺寸或數量,除非有特別說明。
請參照第1圖,其是本發明一實施例之顯示裝置1的示意圖。顯示裝置1包括背光模組11及顯示面板12。背光模組11設置於顯示面板12的一側,用以提供光線至顯示面板12,以供影像顯示之用。
顯示面板12具有顯露區域12A及非顯露區域12B,顯露區域12A及非顯露區域12B彼此相連。顯露區域12A可包括顯示面板12的主動區,非顯露區域12B可包括顯示面板12的外引腳接合區,但本發明不以此為限。另一實施例中,顯露區域12A包括主動區與可視區。換言之,顯露區域12A是顯示裝置1的邊框(未繪示)未遮蔽的部分,因而可視於外界。非顯露區域12B是被顯示裝置1的邊框所遮蔽的部分,而不可視於外界。
背光模組11包括光源模組100及導光板10。導光板10具有入光面101及出光面102,出光面102面向顯示面板12,入光面101位於出光面102及導光板10的底面(未標示)之間。在本實施例中,光源模組100係以側向方式入光,光源模組100設置於入光面101之一側。光源模組100所提供之光線入 射至導光板10內,經由導光板10內結構的導引,而可於出光面102產生分佈均勻的面光源。
光源模組100包括電路基板110、多個發光單元120以及波長轉換層130。電路基板110可以但不限於是印刷電路板、金屬印刷電路板(MCPCB)、陶瓷基板或覆銅陶瓷基板等。
發光單元120可以是發光二極體,例如是有機發光二極體、微型發光二極體、量子點發光二極體等。發光單元120設置在電路基板110之方式為表面貼裝製程(Surface Mount Technology,SMT),但本發明不以此為限。在一些實施例中,發光單元120可以是單面發光;在另一些實施例中,發光單元120可以是五面發光,以進一步增加光耦合的效率。
波長轉換層130覆蓋於發光單元120,且填充於凹陷部112,其可用以將單色光線轉換成不同波長的光線,以進行混光之處理。波長轉換層130可以包括螢光體材料,例如是釔鋁石榴石(Yttrium Aluminum Garnet,YAG)螢光粉、氟矽酸鉀(KSF)螢光粉等。在另一實施例中,波長轉換層130也可以包括量子點材料,或其它合適的波長轉換材料或其組合。
特別地,電路基板110還具有凹陷部112,發光單元120設置於凹陷部112內。本發明藉由凹陷部112的設置,能夠進一步使發光單元120與顯露區域12A之間的混光距離D得以延伸。
詳細地說,一般發光單元係設置在電路基板的表面上。一般而言,係期望光源模組的位置能夠愈靠近導光板,以因應窄邊框的潮流。然,倘若光源模組的位置太接近導光板,使發光單元過於接近導光板的入光面,將會導致混光距離的不足,影響光線混光的效果。本發明藉由在電路基板110中設置凹陷部112,不但可維持一定的混光距離D,同時還可進一步縮減光源模組100整體的厚度T。
第2圖是本發明一實施例之光源模組100的立體圖。第3圖是本發明另一實施例之光源模組100’的立體圖。第2圖及第3圖分別繪示不同形式的凹陷部112、112’,其可藉由蝕刻電路基板110的方式生成。於第2圖中,凹陷部112為多個凹陷空間,且發光單元120係一對一地設置於其一凹陷空間內。其中,凹陷空間的形狀可以但不限於是矩形、圓形、多邊形、蜂巢狀等。於第3圖中,凹陷部112’為一長條形凹陷空間,發光單元120均設置於此長條形凹陷空間內。長條形凹陷空間以矩形為例做說明,然本發明不以此為限。此外,凹陷部112、112’的周緣也可具有倒角或圓角。
請參照第4圖,其是第2圖之光源模組100沿剖面線4-4’的剖視圖。電路基板110包括第一表面114,凹陷部112係自第一表面114向內凹陷,進而形成底部116及側壁118。側壁118可傾斜地連接於底部116,但本發明不以此為限。發光單 元120係設置於底部116上,且發光單元120容置於凹陷部112內而未超出電路基板110的第一表面114。
底部116及側壁118之至少一者可具有經過表面處理的粗糙結構,粗糙結構的設置與否及設置方式端看使用者的設計需求來決定。舉例來說,底部116及側壁118可同時具有經過表面處理的粗糙結構,以進一步擴散發光單元120所射出的光線。
此外,經過表面處理的粗糙結構亦可與其它結構相配合。舉例來說,如第5圖所示,其是本發明又一實施例之光源模組200的剖視圖。光源模組200還可包括反射層140,以避免光線的散失。反射層140可設置於底部116及側壁118之至少一者上。於此,反射層140係同時覆蓋底部116及側壁118。然在其它實施例中,反射層140可單獨地設置於底部116或側壁118上,並與前述經過表面處理的粗糙結構相配合,以達到不同的光線擴散效果。
第6圖是本發明再一實施例之光源模組300的立體圖。第7圖是第6圖之光源模組300沿剖面線7-7’的剖視圖。請參照第6圖及第7圖,光源模組300還可包括多個微結構150,以進一步增加光線的指向性、或可進一步擴散光線。微結構150可設置於底部116及側壁118之至少一者上。於此,微結構150係設置於底部116上。
如第6圖及第7圖的實施例所示,微結構150的形狀為圓柱,多條圓柱係平行於彼此排列於底部116上,但微結構150亦可同時排列於側壁118上,或是僅排列於側壁118上。
另一實施例中,微結構也可以包括其它形狀。舉例來說,請參照第8圖,其是本發明其它實施例之光源模組400的剖視圖。光源模組400包括多個設置於底部116上的微結構151,微結構151的形狀為三角柱,多條三角柱係平行於彼此排列於底部116上,但微結構151亦可同時排列於側壁118上,或是僅排列於側壁118上。
當然,微結構不僅限於上述所列舉的形狀,亦可包括其它形狀,其可以是錐狀體、球形凸點、多邊形體及其組合。舉例來說,在其它未繪示的實施例中,其形狀可以如微結構150所示的圓柱及如微結構151所示的三角柱之組合。
此外,微結構的材料可以同電路基板110的材料,例如可以藉由蝕刻電路基板110的方式生成。
請參照第7圖及第8圖,於另一實施例中,位於底部116的這些微結構150、151中,越遠離發光單元120者可具有越高的高度。如第7圖所示,微結構150b係最為遠離發光單元120之一者。因此,可使微結構150a、150c、150b的高度依序增加,讓較為遠離發光單元120的微結構150c、150b有更高的機會反射光線。同理,又如第8圖所示,微結構151b係最為遠離發光單元120之一者。因此,可使微結構151a、151c、 151b的高度依序增加,讓較為遠離發光單元120的微結構151c、151b有更高的機會反射光線。
值得一提的是,前述經過表面處理的粗糙結構、反射層也可以和微結構互相配合設置在底部116及側壁118之至少一者上,使用者可視所需的產品需求變更上述設計,達到所需的各種效果,例如是將光線擴散、使光線朝某方向集中而提高光線指向性、或提高光線發散角度等效果。
此外,光源模組還可包括二次光學透鏡(未繪示),覆蓋於凹陷部112,且波長轉換層130更填充於二次光學透鏡內而位於底部116與二次光學透鏡之間。二次光學透鏡例如是凸透鏡、凹透鏡或其組合,其中凸透鏡及凹透鏡可以是球面透鏡、非球面透鏡或自由曲面透鏡。一實施例中,若凹陷部112係形成如第2圖所示的多個凹陷空間,相應地二次光學透鏡的數量亦具有多個,並以一對一的方式覆蓋於每個凹陷空間。另一實施例中,若凹陷部112’係形成如第3圖所示的長條形凹陷空間,二次光學透鏡則完整覆蓋於此長條形凹陷空間。使用者可以選擇不同形狀二次光學透鏡,有效地改變光線的走向,例如是將光線擴散、使光線朝某方向集中而提高光線指向性、或提高光線發散角度,以符合產品的應用需求。
雖然前述光源模組舉例為顯示裝置之背光模組的應用,然本發明不以此為限。在其它實施例中,光源模組也可以是照明裝置、或其它用以提供光源的裝置。
本發明藉由上述設計,在電路基板設置凹陷部,相較於先前技術,不但可以延伸混光距離,並在維持一定混光距離的條件下,進一步縮減光源模組的厚度,有利於現今窄邊框的潮流。並且,由於電路基板具有凹陷部,得以減少電路基板的厚度,因而可縮短發光單元與散熱元件的距離,降低熱阻抗,並提升發光單元的散熱效果。此外,凹陷部中可設置特殊的結構,例如將其表面進行表面處理形成粗糙結構、設置反射層及/或微結構等方式,使得發光單元所發出的光線可在凹陷部中充分的混合與傳遞。再者,於凹陷部上還可設有二次光學透鏡,以因應產品的應用需求改變光線的走向。
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。
300:光源模組
110:電路基板
112:凹陷部
114:第一表面
116:底部
118:側壁
120:發光單元
130:波長轉換層
150,150a,150b,150c:微結構

Claims (8)

  1. 一種光源模組,包括:一電路基板,包括一第一表面且具有一凹陷部,該凹陷部係自該第一表面向內凹陷,且該電路基板形成一底部及一側壁於該凹陷部內;複數個發光單元,設置於該底部,且位於該凹陷部內;複數個微結構,設置於該底部及該側壁之至少一者上;以及一波長轉換層,覆蓋於該些發光單元,且填充於該凹陷部。
  2. 如請求項1所述之光源模組,其中該凹陷部為複數個凹陷空間,該些發光單元係一對一地設置於該些凹陷空間內。
  3. 如請求項1所述之光源模組,其中該凹陷部為一長條形凹陷空間,該些發光單元均設置於該長條形凹陷空間內。
  4. 如請求項1所述之光源模組,其中該側壁係傾斜地連接於該底部。
  5. 如請求項1所述之光源模組,更包括一反射層,設置於該底部及該側壁之至少一者上。
  6. 如請求項1所述之光源模組,其中該底部及該側壁之至少一者具有經過表面處理的粗糙結構。
  7. 如請求項1所述之光源模組,其中位於該底部的該些微結構中,越遠離各該發光單元者具有越高的高度。
  8. 如請求項1所述之光源模組,更包括一二次光學透鏡,覆蓋於該凹陷部,其中該波長轉換層位於該底部與該二次光學透鏡之間。
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TWI392931B (zh) * 2009-11-09 2013-04-11 Au Optronics Corp 發光裝置
CN209729950U (zh) * 2019-04-29 2019-12-03 深圳市聚飞光电股份有限公司 一种微型led结构模组
CN110967871A (zh) * 2019-12-18 2020-04-07 京东方科技集团股份有限公司 背光模组及显示设备

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JP2007305785A (ja) * 2006-05-11 2007-11-22 Nichia Chem Ind Ltd 発光装置
KR101637581B1 (ko) * 2010-03-09 2016-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
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TWI392931B (zh) * 2009-11-09 2013-04-11 Au Optronics Corp 發光裝置
CN209729950U (zh) * 2019-04-29 2019-12-03 深圳市聚飞光电股份有限公司 一种微型led结构模组
CN110967871A (zh) * 2019-12-18 2020-04-07 京东方科技集团股份有限公司 背光模组及显示设备

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