TWI742204B - 可撓性元件基板形成用組成物 - Google Patents
可撓性元件基板形成用組成物 Download PDFInfo
- Publication number
- TWI742204B TWI742204B TW106140874A TW106140874A TWI742204B TW I742204 B TWI742204 B TW I742204B TW 106140874 A TW106140874 A TW 106140874A TW 106140874 A TW106140874 A TW 106140874A TW I742204 B TWI742204 B TW I742204B
- Authority
- TW
- Taiwan
- Prior art keywords
- formula
- flexible element
- diamine
- composition
- element substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016228026 | 2016-11-24 | ||
JP2016-228026 | 2016-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201833181A TW201833181A (zh) | 2018-09-16 |
TWI742204B true TWI742204B (zh) | 2021-10-11 |
Family
ID=62195600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106140874A TWI742204B (zh) | 2016-11-24 | 2017-11-24 | 可撓性元件基板形成用組成物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7011231B2 (ja) |
TW (1) | TWI742204B (ja) |
WO (1) | WO2018097143A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200053302A (ko) * | 2018-11-08 | 2020-05-18 | 삼성전자주식회사 | 폴리(아미드-이미드) 코폴리머, 폴리(아미드-이미드) 코폴리머 제조용 조성물, 폴리(아미드-이미드) 코폴리머를 포함하는 성형품 및 표시 장치 |
JP7346146B2 (ja) * | 2019-08-06 | 2023-09-19 | 三菱瓦斯化学株式会社 | ポリイミド及びポリイミドフィルム |
KR20220123394A (ko) * | 2019-12-27 | 2022-09-06 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 폴리이미드 수지, 바니시 및 폴리이미드 필름 |
JPWO2022019225A1 (ja) | 2020-07-21 | 2022-01-27 | ||
JPWO2022019226A1 (ja) | 2020-07-21 | 2022-01-27 | ||
KR20230095953A (ko) * | 2020-10-26 | 2023-06-29 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름 |
WO2023085041A1 (ja) * | 2021-11-11 | 2023-05-19 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ワニス及びポリイミドフィルム |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105916910A (zh) * | 2014-02-14 | 2016-08-31 | 旭化成株式会社 | 聚酰亚胺前体和含有其的树脂组合物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5920337B2 (ja) * | 2011-03-11 | 2016-05-18 | 宇部興産株式会社 | ポリイミド前駆体及びポリイミド |
CN104508009B (zh) * | 2012-05-28 | 2016-09-07 | 宇部兴产株式会社 | 聚酰亚胺前体和聚酰亚胺 |
US20150284513A1 (en) * | 2012-09-10 | 2015-10-08 | Ube Industries, Ltd. | Polyimide precursor, polyimide, varnish, polyimide film, and substrate |
CN107406675B (zh) * | 2015-03-31 | 2020-11-06 | 日产化学工业株式会社 | 剥离层形成用组合物和剥离层 |
-
2017
- 2017-11-21 JP JP2018552596A patent/JP7011231B2/ja active Active
- 2017-11-21 WO PCT/JP2017/041882 patent/WO2018097143A1/ja active Application Filing
- 2017-11-24 TW TW106140874A patent/TWI742204B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105916910A (zh) * | 2014-02-14 | 2016-08-31 | 旭化成株式会社 | 聚酰亚胺前体和含有其的树脂组合物 |
Also Published As
Publication number | Publication date |
---|---|
JP7011231B2 (ja) | 2022-01-26 |
WO2018097143A1 (ja) | 2018-05-31 |
TW201833181A (zh) | 2018-09-16 |
JPWO2018097143A1 (ja) | 2019-10-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI705993B (zh) | 樹脂薄膜之製造方法及樹脂薄膜形成用組成物 | |
TWI742204B (zh) | 可撓性元件基板形成用組成物 | |
KR102599925B1 (ko) | 수지박막형성용 조성물 | |
TWI804564B (zh) | 混合樹脂組成物 | |
TWI758357B (zh) | 可撓性元件基板形成用組成物 | |
JP7116366B2 (ja) | フレキシブルデバイス用基板の製造方法 | |
WO2014077253A1 (ja) | ポリイミド樹脂フィルム及びポリイミド樹脂フィルムからなる電子デバイス用基板 | |
TWI775739B (zh) | 可撓性元件基板形成用組成物 |