TWI740643B - Packing box and packing method of heat spreader - Google Patents
Packing box and packing method of heat spreader Download PDFInfo
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- TWI740643B TWI740643B TW109131402A TW109131402A TWI740643B TW I740643 B TWI740643 B TW I740643B TW 109131402 A TW109131402 A TW 109131402A TW 109131402 A TW109131402 A TW 109131402A TW I740643 B TWI740643 B TW I740643B
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- heat equalizing
- gaskets
- heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
- B65D25/108—Devices, e.g. plates, presenting apertures through which the articles project
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/04—Partitions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
- B65D25/101—Springs, elastic lips, or other resilient elements to locate the articles by pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/38—Devices for discharging contents
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F99/00—Subject matter not provided for in other groups of this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B25/00—Packaging other articles presenting special problems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B5/00—Packaging individual articles in containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, jars
- B65B5/06—Packaging groups of articles, the groups being treated as single articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B5/00—Packaging individual articles in containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, jars
- B65B5/10—Filling containers or receptacles progressively or in stages by introducing successive articles, or layers of articles
- B65B5/108—Article support means temporarily arranged in the container
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
Description
本揭露有關於包裝盒與包裝方法,特別是用於均熱片的包裝。This disclosure relates to packaging boxes and packaging methods, especially packaging for heat spreaders.
隨著智慧型手機裝置及5G設備發展,晶片尺寸及熱源增加,負責晶片散熱的均熱片需求越來越多,且在搭配封裝設備自動上、下料需求,包裝型式也越來越多樣化,例如槽格式粹盤、蛋糕盒及管狀推疊包裝等,這些包裝都必須通過運輸測試來確保能有效保護外觀。With the development of smart phone devices and 5G equipment, the size of chips and heat sources have increased, and the demand for heat spreaders responsible for chip heat dissipation has increased. In addition, with the automatic loading and unloading requirements of packaging equipment, packaging types have become more and more diversified. , Such as slotted trays, cake boxes and tubular stacking packaging, etc., these packaging must pass the transportation test to ensure that they can effectively protect the appearance.
部分的均熱片以堆疊方式出貨,以利後續設置均熱片的流程。然而,堆疊均熱片可能產生外觀上問題,例如可能導致表面刮傷、磨傷、擦傷等。Some of the heat spreaders are shipped in a stack to facilitate the subsequent process of setting up heat spreaders. However, the stacking of heat spreaders may cause appearance problems, such as surface scratches, abrasions, abrasions, etc.
本揭露之一態樣有關於一種包裝方法。One aspect of this disclosure relates to a packaging method.
根據本揭露的一或多個實施方式中,一種均熱片的包裝方法包括以下步驟。交錯地排列複數個均熱片與複數個墊片至容器,其中均熱片中最鄰近的任二均熱片之間設置有至少其中之一墊片。同時將墊片都從容器取出。According to one or more embodiments of the present disclosure, a method for packaging a heat spreading sheet includes the following steps. A plurality of heat equalizing fins and a plurality of gaskets are arranged in a staggered manner to the container, wherein at least one of the gaskets is arranged between any two of the most adjacent heat equalizing fins. At the same time, remove all the gaskets from the container.
在一或多個實施方式中,每一墊片具有凸出均熱片的夾持部。墊片的夾持部通過開口凸出於容器。在同時將墊片都從容器取出的步驟中,進一步包括以下步驟。通過夾持凸出的夾持部,將墊片同時從容器中取出。In one or more embodiments, each gasket has a clamping portion protruding from the heat spreader. The clamping part of the gasket protrudes out of the container through the opening. In the step of removing all the gaskets from the container at the same time, the following steps are further included. By clamping the protruding clamping part, the gasket is taken out of the container at the same time.
在一或多個實施方式中,墊片彼此連接以形成一體成形的隔離件。In one or more embodiments, the spacers are connected to each other to form an integrally formed spacer.
在一些實施方式中,在交錯地排列均熱片與墊片至容器的步驟中,進一步包括以下步驟。放置均熱片中的第一均熱片至容器。提供延展件,對準第一均熱片的相鄰處推入延展件的部分,以形成墊片中的第一墊片,使延展件作為隔離件的部分。放置均熱片的第二均熱片至容器。第一墊片隔離於第一均熱片與第二均熱片之間。In some embodiments, the step of staggeredly arranging the heat spreading sheet and the gasket to the container further includes the following steps. Place the first heat spreader among the heat spreaders on the container. An extension piece is provided, and the part of the extension piece pushed into the adjacent portion of the first heat equalizing sheet is aligned to form the first shim in the shim, and the extension piece is used as a part of the spacer. Place the second heat spreader of the heat spreader to the container. The first gasket is isolated between the first heat equalizing sheet and the second heat equalizing sheet.
在一些實施方式中,在隔離件具有從容器凸出的相對二端。在同時將墊片都從容器取出的步驟中,進一步包括以下步驟。通過二端將隔離件從容器取出,以使將墊片同時離開墊片之間。In some embodiments, the spacer has two opposite ends protruding from the container. In the step of removing all the gaskets from the container at the same time, the following steps are further included. Take the spacer out of the container through the two ends, so that the gaskets can leave between the gaskets at the same time.
在一或多個實施方式中,該容器進一步包括開口提取口。包裝方法進一步包括以下步驟。在墊片都通過開口從容器取出後,從提取口取出均熱片。In one or more embodiments, the container further includes an open extraction port. The packaging method further includes the following steps. After the gaskets are all taken out from the container through the opening, take out the soaking sheet from the extraction port.
本揭露之一態樣有關於一種包裝盒。One aspect of this disclosure relates to a packaging box.
根據本揭露的一或多個實施方式中,一種包裝盒係設置以放置複數個均熱片。包裝盒包括容器以及複數個墊片。容器設置以容置複數個均熱片。墊片容置於容器內。均熱片中最鄰近的任二均熱片之間設置有至少一墊片。每一墊片具有凸出於均熱片的夾持部。According to one or more embodiments of the present disclosure, a packaging box is configured to hold a plurality of heat equalizing plates. The packaging box includes a container and a plurality of gaskets. The container is arranged to contain a plurality of heat equalizing plates. The gasket is contained in the container. At least one gasket is arranged between any two of the most adjacent heat spreading fins. Each gasket has a clamping part protruding from the heat spreader.
在一或多個實施方式中,容器沿第一方向延伸。熱片與墊片於第一方向上交錯地彼此平行排列。墊片的夾持部沿垂直於第一方向的第二方向凸出。每一墊片的形狀為L型。In one or more embodiments, the container extends in the first direction. The heat fins and the spacers are arranged alternately and parallel to each other in the first direction. The clamping portion of the gasket protrudes in a second direction perpendicular to the first direction. The shape of each gasket is L-shaped.
在一或多個實施方式中,墊片橫跨均熱片而彼此連接,以形成隔離件。隔離件具有凸出於容器的相對二端。In one or more embodiments, the spacers are connected to each other across the heat spreader to form a spacer. The spacer has two opposite ends protruding from the container.
在一或多個實施方式中,容器包括開口。墊片的夾持部通過開口凸出於容器。開口的寬度小於每一均熱片的寬度。In one or more embodiments, the container includes an opening. The clamping part of the gasket protrudes out of the container through the opening. The width of the opening is smaller than the width of each heat spreader.
綜上所述,通過在堆疊的均熱片設置墊片,避免均熱片之間非預期的接觸所造成的損害。同時墊片設計為可以同時取出,也能夠滿足在後續放置均熱片流程的需求。In summary, by arranging spacers on the stacked heat spreading fins, damage caused by unintended contact between the heat spreading fins can be avoided. At the same time, the gasket is designed to be taken out at the same time, which can also meet the needs of the subsequent process of placing the heat spreader.
以上所述僅係用以闡述本揭露所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本揭露之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above descriptions are only used to illustrate the problems to be solved by the present disclosure, the technical means to solve the problems, and the effects they produce, etc. The specific details of the present disclosure will be described in detail in the following embodiments and related drawings.
下文係舉實施例配合所附圖式進行詳細說明,但所提供之實施例並非用以限制本揭露所涵蓋的範圍,而結構運作之描述非用以限制其執行之順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭露所涵蓋的範圍。另外,圖式僅以說明為目的,並未依照原尺寸作圖。為便於理解,下述說明中相同元件或相似元件將以相同之符號標示來說明。The following is a detailed description of the embodiments with the accompanying drawings, but the provided embodiments are not used to limit the scope of the disclosure, and the description of the structure operation is not used to limit the order of its execution, any recombination of components The structure and the devices with equal effects are all within the scope of this disclosure. In addition, the drawings are for illustrative purposes only, and are not drawn in accordance with the original dimensions. For ease of understanding, the same or similar elements in the following description will be described with the same symbols.
另外,在全篇說明書與申請專利範圍所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。某些用以描述本揭露之用詞,將於下或在此說明書的別處討論,以提供本領域技術人員在有關本揭露之描述上額外的引導。In addition, the terms (terms) used in the entire specification and the scope of the patent application, unless otherwise specified, usually have the usual meaning of each term used in this field, in the content disclosed here, and in the special content . Some terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance on the description of the present disclosure.
在本文中,「第一」、「第二」等等用語僅是用於區隔具有相同技術術語的元件或操作方法,而非旨在表示順序或限制本揭露。In this article, terms such as “first”, “second”, etc. are only used to distinguish elements or operating methods with the same technical terms, and are not intended to indicate a sequence or limit the present disclosure.
此外,「包含」、「包括」、「提供」等相似的用語,在本文中都是開放式的限制,意指包含但不限於。In addition, similar terms such as "include", "include", and "provide" are all open-ended restrictions in this article, meaning including but not limited to.
進一步地,在本文中,除非內文中對於冠詞有所特別限定,否則「一」與「該』可泛指單一個或多個。將進一步理解的是,本文中所使用之「包含」、「包括」、「具有」及相似詞彙,指明其所記載的特徵、區域、整數、步驟、操作、元件與/或組件,但不排除其所述或額外的其一個或多個其它特徵、區域、整數、步驟、操作、元件、組件,與/或其中之群組。Further, in this article, unless the article is specifically limited in the context, "a" and "the" can refer to one or more in general. It will be further understood that the words "including" and "inclusive" used in this article "Include", "have" and similar words indicate the features, regions, integers, steps, operations, elements and/or components described therein, but do not exclude the described or additional one or more other features, regions, Integers, steps, operations, elements, components, and/or groups thereof.
均熱片係用以設置在元件上,以傳導元件所發出的熱能,以發揮散熱的效果。舉例而言,均熱片能夠設置在電腦主機中的元件上。在一些實施方式中,均熱片包括平整的金屬片,並且其上方可以設置有於辯識的條紋,例如可供掃描QR碼。在一些實施方式中,均熱片以堆疊方式容置於容器。然而,在運送時,堆疊的均熱片彼此之間可能存在摩擦,從而損害到均熱片的表面。對此,在本揭露一些實施方式中,通過於均熱片之間設置墊片,藉以避免均熱片之間的磨損。The heat spreader is used to set on the element to conduct the heat energy emitted by the element to exert the effect of heat dissipation. For example, the heat spreader can be set on the components in the computer host. In some embodiments, the heat spreading sheet includes a flat metal sheet, and can be provided with recognizable stripes, for example, for scanning a QR code. In some embodiments, the heat spreading sheet is housed in the container in a stacked manner. However, during transportation, there may be friction between the stacked heat spreading fins, which damages the surface of the heat spreading fins. In this regard, in some embodiments of the present disclosure, spacers are arranged between the heat spreading fins to avoid abrasion between the heat spreading fins.
請參照第1A圖與第1B圖。第1A圖根據本揭露之一實施方式繪示一包裝盒100的一上視示意圖。第1B圖繪示第1A圖的包裝盒100的一側視示意圖。Please refer to Figure 1A and Figure 1B. FIG. 1A shows a schematic top view of a
如第1A圖與第1B圖所示,在本實施方式中,包裝盒100為管型。具體而言,在本實施方式中,包裝盒100包括容器110與墊片130。容器110包括開口115、提取口120以及封蓋125。在包裝盒100的容器110內,容置多個均熱片200,並且任二個最鄰近的均熱片200之間,均通過墊片130隔離。換言之,在本實施方式中,均熱片200與墊片130彼此是交錯排列。在第1A圖與第1B圖中,均熱片200與墊片130彼此是在方向D1交錯排列。如此,可以避免均熱片200之間於堆疊時直接接觸,從而避免在堆疊的均熱片200因彼此之間非預期的碰撞而磨損。As shown in Figs. 1A and 1B, in this embodiment, the
容器110的開口115裸露均熱片200。而如第1A圖的頂視視圖所示,在本實施方式中,每一個墊片130都具有凸出於均熱片200的夾持部135。進一步地,在本實施方式中,均熱片200的夾持部135都從開口115凸出。如此一來,將可以通過夾持部135將墊片130,同時從容器110中取出,使均熱片200以堆疊的方式容置於容器110內。The
進一步地,如第1B圖虛線所標示,在本實施方式中,容器110包括由提取口120,提取口120由封蓋125所封閉。當欲將均熱片200從容器110取出,則可以打開封蓋125,將均熱片200從提取口120取出。Furthermore, as indicated by the dotted line in FIG. 1B, in this embodiment, the
在一些實施例中,可以設置墊片130的夾持部135凸出於均熱片200,但仍保持墊片130的夾持部135未凸出容器110,而僅是通過長條型的開口115一起裸露。在這樣的實施例中,得於容器110上進一步設置外殼來覆蓋開口115。待需取出墊片130時,再移除外殻,以通過夾持部135將墊片130都從容器110中移除。In some embodiments, the clamping
為進一步說明,請參照第1C圖。第1C圖繪示第1A圖的包裝盒100另一角度的一側視示意圖。為了簡單說明的目的,封蓋125未繪示於第1C圖。For further explanation, please refer to Figure 1C. FIG. 1C is a schematic side view of the
在第1C圖中,從提取口120往容器110的視角。均熱片200容置在容器110內。均熱片200在方向D2上的寬度W2,小於容器110開口115的寬度W1。墊片130具有相同於開口115的寬度W1,並且墊片130的夾持部135凸出於開口115。如此一來,通過夾持部135,將容器110內的墊片130將可以從開口115取出。In Figure 1C, the view from the
在本實施方式中,包裝盒100整體可以被認為是一個包裝管。第1B圖透視地繪示出長條型容器110內部用以容置均熱片200的部分輪廓。第1C圖則從另一側面繪示長條型管狀的容器110的一端。均熱片200設置於長條型管狀的容器110內。開口115在容器110的側邊上並沿方向D1延伸。提取口120則位在長條型管狀的容器110的一端。如此一來,均熱片200設置於長條型管狀的容器110內,墊片130從長條型管狀的容器110的側邊上的開口115插入,藉以隔離均熱片200。在墊片130從均熱片200之間取出後,均熱片200從長條型的容器110一端的提取口120取出。In this embodiment, the
此外,在本實施方式中,如第1C圖所示,夾持部135從開口115凸出外,亦進一步沿方向D2延伸。這使得夾持部135的形狀為L型。如此,夾持部135在方向D2上延伸的寬度W(如第3圖所示),將大於開口115的寬度W1。隨後,將可以通過夾持部135,將墊片130沿方向D3從開口115取出。具體請見後述。In addition, in this embodiment, as shown in FIG. 1C, the clamping
如第1C圖所示,由於均熱片200的寬度W2小於開口115的寬度W1,均熱片200將僅能使用提取口120置入容器110或從容器110中取出。因此,在本揭露的一些實施方式中,均熱片200與墊片130的交錯排列,可以先從開口115置入墊片130,隨後從提取口120置入均熱片200。如此反覆,直到容器110內堆疊滿交錯排列的均熱片200與墊片130,蓋上封蓋125以封閉容器110。這樣容置均熱片200的包裝盒100,即可運輸到需要安裝均熱片200的單位。由於均熱片200之間設置有墊片130,在搬運的過程中,均熱片200之間的非預期磨損問題,將可以獲得改善。As shown in FIG. 1C, since the width W2 of the
第2圖繪示第1B圖的包裝盒100的一局部R1。如第2圖所示,容器110內的均熱片200彼此之間以墊片130隔離。墊片130的夾持部135相較均熱片200具有不同高度。Fig. 2 shows a part R1 of the
第3圖根據本揭露之一實施方式繪示一墊片130的一示意圖。在本實施方式中,墊片130具有凸出的夾持部135,這使得墊片130為L型。墊片130具有寬度W1,墊片130的夾持部135則具有寬度W。夾持部135的寬度W大於墊片130於容器110內的寬度W1。墊片130的整體厚度H1,墊片130的夾持部135具有厚度H2,厚度H1大於厚度H2,且厚度H1減去厚度H2應大於容器110在方向D2上的高度,確保夾持部135是凸出於容器110之外。FIG. 3 shows a schematic diagram of a
請參照第4A圖與第4B圖,同時對應參照第5A圖與第5B圖。第4A圖與第4B圖,以及對應的第5A圖與第5B圖,繪示了本揭露的一均熱片的包裝方法的不同步驟。第4A圖與第4B圖本揭露之一實施方式繪示取出墊片130時不同步驟的側視示意圖。第5A圖與第5B圖分別繪示第4A圖與第4B圖另一角度的側視示意圖。為了簡單說明的目的,第5A圖與第5B圖未繪示包裝盒100的封蓋125。Please refer to Figures 4A and 4B, and correspondingly refer to Figures 5A and 5B. Fig. 4A and Fig. 4B, and corresponding Fig. 5A and Fig. 5B, illustrate different steps of the packaging method of a heat spreader of the present disclosure. FIGS. 4A and 4B show schematic side views of different steps when removing the
在如第1A-1C圖所示,交錯地排列均熱片200與墊片130後,將可以安全地搬運均熱片200,不用擔心均熱片200非預期的磨損。在均熱片200運送到目的地後,應同時將墊片130一起取出,以節省時間,並使均熱片200回到一般的堆疊情況。對此,請同時參照第4A圖與第5A圖。As shown in Figs. 1A-1C, after staggered arrangement of the
如第4A圖與第5A圖所示,通過夾具300,將可以把墊片130同時從容器110中取出。具體而言,在本實施方式中,夾具300包括卡勾315與卡勾320,卡勾315與卡勾320彼此以彈簧310連接。卡勾315與卡勾320同時夾持住多個墊片130的夾持部135。As shown in FIG. 4A and FIG. 5A, through the
進入到第4B圖與第5B圖,在卡勾315與卡勾320同時夾持住多個墊片130的夾持部135後,夾具300上移,即可一次性的將墊片130都從容器110取出。如此一來,均熱片200將可以從提取口120取出,不受墊片130阻礙。Entering Figures 4B and 5B, after the
同時將多個墊片130取出,不僅節省時間,在使均熱片200回到堆疊的排列方式後,便可以直街應用在一些現有的均熱片200安裝流程中。舉例而言,在一些實施方式中,在墊片130都從容器110取出後,容置有堆疊均熱片200的容器110,可以直接架設在安裝均熱片200的機台上,將均熱片200一片一片推送安裝至欲散熱的電腦元件上。Taking out a plurality of
應留意到,上述圖式中繪示在均熱片200的數量僅為示意,而並不以此限制本揭露均熱片200的數量。此外,上述圖式中繪示均熱片200與墊片130的厚度,亦僅為示意,因此亦不因以此限制本揭露。It should be noted that the number of
第6圖根據本揭露之一實施方式繪示一包裝盒100’的一側視示意圖。第6圖的包裝盒100’與第1B圖包裝盒100的差異,在於第6圖的包裝盒100’中的多個墊片155是彼此連接。Fig. 6 shows a schematic side view of a packaging box 100' according to an embodiment of the present disclosure. The difference between the packaging box 100' of FIG. 6 and the
如第6圖所示,包裝盒100’包括容器110與隔離件150。容器110包括開口115、提取口120以及封蓋125。均熱片200設置於容器110內。在任二個最鄰近的均熱片200之間,設置有隔離件150的其中一個墊片155。As shown in Figure 6, the packaging box 100' includes a
詳細而言,在包裝盒100’中,隔離件150包括複數個墊片155與連接部160。墊片155通過連接部160彼此連接,而形成一體成形的隔離件150。In detail, in the packaging box 100', the
相較於第1B圖包裝盒100的墊片130,在包裝盒100’中,每一個墊片155為U型,U型墊片155的兩側各自於其中一個均熱片200相鄰/相接觸,而U型墊片155的底部則接觸的容器110的底部。這些U型墊片155通過橫跨均熱片200的連接部160,實現一體成形。Compared with the
如此一來,無需通過夾具,即可將容器110内的所有墊片155一次性的取出。In this way, all the
請參照第7圖。第7圖繪示從包裝盒100’取出墊片155的一側視示意圖。更具體而言,是將整片一體成形以形成隔離件150的墊片155都一起從容器110的開口115取出,使隔離件150沿方向D3移動。在本實施方式中,方向D3垂直於均熱片200與墊片155交錯排列的方向D1上。Please refer to Figure 7. Figure 7 is a schematic side view of the
舉例而言,同時參照第6圖與第7圖,隔離件150具有凸出於開口115的第一端151與第二端152。在一些實施方式中,若要將隔離件150的多個墊片155都一起取出,僅需通過向第一端151與第二端152施力,即可將整片隔離件150都沿方向D3移動,使得多個墊片155同時從均熱片200之間移除。如此,均熱片200在容器110中,便能夠恢復以堆疊方式排列。For example, referring to FIGS. 6 and 7 at the same time, the
第8圖繪示第6圖的包裝盒100’的一局部。同時參照第6圖與第8圖,均熱片200包括第一均熱片201以及第二均熱片202,第一均熱片201與第二均熱片202之間設置有U型的墊片155。墊片155彼此以連接部160橫跨均熱片200(例如橫跨第二均熱片202)連接,以形成隔離件150。隔離件150的第一端151凸出於容器110。Fig. 8 shows a part of the packaging box 100' of Fig. 6. Referring to FIGS. 6 and 8 at the same time, the
從第6圖與第8圖所示,在本實施方式中,隔離件150的連接部160在方向D3上與均熱片200存在間距。這是基於製造過程上的方便留下間距。在一些實施方式中,連接部160與均熱片200之間的間距也可以為0,而使連接部160緊貼均熱片200。As shown in FIGS. 6 and 8, in this embodiment, the connecting
請參照第9圖、第10圖與第11圖。第9圖、第10圖與第11圖繪示了本揭露的另一均熱片的包裝方法的不同步驟。第9圖、第10圖與第11圖分別繪示設置墊片時的不同步驟側視示意圖。Please refer to Figure 9, Figure 10 and Figure 11. Figures 9, 10, and 11 illustrate different steps of another heat spreader packaging method of the present disclosure. Figure 9, Figure 10 and Figure 11 respectively show schematic side views of different steps when setting the gasket.
如第9圖所示,提供包裝盒100’的容器110後,設置均熱片200中的第一均熱片201,使其抵靠容器110的一側。As shown in Figure 9, after the
隨後,如第9圖所示,提供延展件330。延展件330在方向D2上的寬度,小於等於開口115在方向D2上的寬度W1(如第1C圖所繪示)。並且,閘門340設置於延展件330與容器110之間,閘門340的成型孔341對齊均熱片200的一側。延展件330與容器110存在能夠設置閘門340的距離。另一方面,推料器350設置位於延展件330相對閘門340的另一側。推料器350對準閘門340的成型孔341。Subsequently, as shown in Figure 9, an
進入到第10圖。在第10圖中,推料器350往容器110移動,進而推動延展件330的部分進入到容器110內,形成U型的墊片155。U型墊片155的一側與第一均熱片201抵靠。U型墊片155的底部與容器110的底部相接。Go to figure 10. In FIG. 10, the
在墊片155形成後,進入到第11圖,設置均熱片200中的第二均熱片202至容器110內,並且第二均熱片202與U型墊片155的另一側相接。如此一來,U型墊片155實質設置在最相鄰的第一均熱片201與第二均熱片202之間。在一些實施方式中,在形成U型墊片155後,能夠從方向D1通過容器110的提取口120(如第6圖所示)置入第二均熱片202。After the
在第11圖完成第二均熱片202的設置後,便可以將推料器350從成形的U型墊片155移除,再從方向D2退出閘門340。隨後,重覆第9圖至第11圖,再於第二均熱片202的另一側形成U型墊片155,置入其他的均熱片200。如此,重覆第9圖至第11圖的步驟,交錯排列U型墊片155與均熱片200,直到容器110填滿。最後,斷開延展件330,使得留在容器110並位於均熱片200之間的延展件330部分形成一體而形的隔離件150,如第6圖所示。After completing the setting of the second
如此一來,如第6圖所示,成形的U型墊片155通過連接部160彼此橫跨均熱片200連接,形成隔離件150。隔離件150具有凸出容器110的第一端151與第二端152,便於不使用額外的夾具,即可將隔離件150的多個墊片155同時從容器110移除。In this way, as shown in FIG. 6, the formed
應留意到,上述圖式中繪示在均熱片200的數量僅為示意,而並不以此限制本揭露均熱片200的數量。此外,上述圖式中繪示均熱片200與隔離件150中各個墊片155的厚度,亦僅為示意,因此亦不因以此限制本揭露。It should be noted that the number of
在一些實施方式中,延展件330的材料包括捲料。In some embodiments, the material of the
綜上所述,本揭露提供包裝盒以及相應的包裝方法,將均熱片間隔墊片排列於容器中,避免掉運輸時堆疊均熱片之間的非預期磨損。此外,均熱片也設計為能夠同時移除,使均熱片回到堆疊的態樣,而能夠使用一些現有的安裝方式來安裝堆疊的均熱片。在一些實施方式中,均熱片更設計為一體成形,使得無需使用額外的夾具,即可將墊片同時從均熱片之間移除。In summary, the present disclosure provides a packaging box and a corresponding packaging method. The spacers for the heat spreader are arranged in the container to avoid unexpected wear between stacked heat spreaders during transportation. In addition, the heat spreading fins are also designed to be able to be removed at the same time, so that the heat spreading fins return to the stacked state, and some existing installation methods can be used to install the stacked heat spreading fins. In some embodiments, the heat spreading sheet is further designed to be integrally formed, so that the gasket can be removed from between the heat spreading sheets at the same time without using additional clamps.
雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何本領域具通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed in the above implementation manner, it is not intended to limit this disclosure. Anyone with ordinary knowledge in the field can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure The scope of protection shall be subject to the scope of the attached patent application.
100,100’:包裝盒 110:容器 115:開口 120:提取口 125:封蓋 130:墊片 135:夾持部 150:隔離件 151:第一端 152:第二端 155:墊片 160:連接部 200:均熱片 201:第一均熱片 202:第二均熱片 300:夾具 310:彈簧 315,320:卡勾 330:延展件 340:閘門 341:成型孔 350:推料器 W,W1,W2:寬度 D1,D2,D3:方向 H1,H2:厚度 R1:局部 100,100’: Packing box 110: container 115: opening 120: Extraction port 125: cap 130: Gasket 135: Clamping part 150: spacer 151: first end 152: second end 155: Gasket 160: connecting part 200: Soaking film 201: The first soaking film 202: The second soaking film 300: Fixture 310: Spring 315,320: hook 330: Extension 340: Gate 341: forming hole 350: Pusher W, W1, W2: width D1, D2, D3: direction H1, H2: thickness R1: Partial
本揭露的優點與圖式,應由接下來列舉的實施方式,並參考附圖,以獲得更好的理解。這些圖式的說明僅僅是列舉的實施方式,因此不該認為是限制了個別實施方式,或是限制了發明申請專利範圍的範圍。 第1A圖根據本揭露之一實施方式繪示一包裝盒的一上視示意圖; 第1B圖繪示第1A圖的包裝盒的一側視示意圖; 第1C圖繪示第1A圖的包裝盒另一角度的一側視示意圖; 第2圖繪示第1B圖的包裝盒的一局部; 第3圖根據本揭露之一實施方式繪示一墊片的一示意圖; 第4A圖與第4B圖本揭露之一實施方式繪示取出墊片時不同步驟的側視示意圖; 第5A圖與第5B圖分別繪示第4A圖與第4B圖另一角度的側視示意圖; 第6圖根據本揭露之一實施方式繪示一包裝盒的一側視示意圖; 第7圖繪示從包裝盒取出墊片的一側視示意圖; 第8圖繪示第6圖的包裝盒的一局部;以及 第9圖、第10圖與第11圖繪示設置墊片時的不同步驟側視示意圖。 The advantages and drawings of the present disclosure should be better understood by the following embodiments and with reference to the drawings. The descriptions of these drawings are merely examples of implementations, and therefore should not be considered as limiting individual implementations or limiting the scope of the invention patent application. FIG. 1A shows a schematic top view of a packaging box according to an embodiment of the present disclosure; Figure 1B shows a schematic side view of the packaging box of Figure 1A; Figure 1C is a schematic side view of the packaging box of Figure 1A from another angle; Figure 2 shows a part of the packaging box of Figure 1B; Fig. 3 shows a schematic diagram of a gasket according to an embodiment of the present disclosure; Figures 4A and 4B illustrate a schematic side view of an embodiment of the present disclosure showing different steps when removing the gasket; Figures 5A and 5B show schematic side views of Figures 4A and 4B from another angle, respectively; Figure 6 shows a schematic side view of a packaging box according to an embodiment of the present disclosure; Figure 7 shows a schematic side view of taking out the gasket from the packing box; Figure 8 shows a part of the packaging box of Figure 6; and Figure 9, Figure 10 and Figure 11 show schematic side views of different steps when setting the gasket.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in the order of deposit institution, date and number) without Foreign hosting information (please note in the order of hosting country, institution, date, and number) without
100:包裝盒 100: box
110:容器 110: container
115:開口 115: opening
120:提取口 120: Extraction port
125:封蓋 125: cap
130:墊片 130: Gasket
135:夾持部 135: Clamping part
200:均熱片 200: Soaking film
R1:局部 R1: Partial
D1,D2,D3:方向 D1, D2, D3: direction
Claims (10)
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CN202011576988.8A CN114162432B (en) | 2020-09-11 | 2020-12-28 | Packaging box and packaging method for soaking slices |
US17/144,124 US11834225B2 (en) | 2020-09-11 | 2021-01-07 | Packing box and packing method of heat spreader |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200927604A (en) * | 2007-12-31 | 2009-07-01 | Au Optronics Corp | Packing device and a carrying device thereof for loading plate-shaped electronic devices |
TWM424304U (en) * | 2011-06-24 | 2012-03-11 | Yan Du Technology Co Ltd | Assembling jig for memory/heat dissipation plate package |
CN205441247U (en) * | 2015-12-28 | 2016-08-10 | 江苏易实精密科技股份有限公司 | Portable electronic connectors mounting box |
US10396414B2 (en) * | 2012-08-31 | 2019-08-27 | Avl Powertrain Engineering, Inc. | High power battery cells having improved cooling |
TWM605805U (en) * | 2020-09-11 | 2020-12-21 | 健策精密工業股份有限公司 | Packing box of heat spreader |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4932529A (en) * | 1989-03-27 | 1990-06-12 | Print Technology, Inc. | Display and storage container with a liner having a spacer flap for photographic prints |
TW200509776A (en) * | 2003-08-22 | 2005-03-01 | Malico Inc | Heat sink structure and the manufacturing method thereof |
GB0715503D0 (en) * | 2007-08-08 | 2007-09-19 | Antistat Ltd | Electronic component package |
US20100089789A1 (en) * | 2008-10-14 | 2010-04-15 | Rosenbaum Ronald | Dosage form package and a frangible electrical circuit sheet therefor |
CN101741006A (en) * | 2008-11-26 | 2010-06-16 | 深圳世纪晶源光子技术有限公司 | Placement clamp of semiconductor laser array chip and chip placement method |
US9070662B2 (en) * | 2009-03-05 | 2015-06-30 | Volterra Semiconductor Corporation | Chip-scale packaging with protective heat spreader |
IT1401858B1 (en) * | 2010-09-01 | 2013-08-28 | Guala Pack Spa | DEVICE AND METHOD FOR PACKAGING THIN BODY CONTAINERS AND TO ASSIST TRANSPORT OF THESE CONTAINERS |
JP5609746B2 (en) * | 2011-04-04 | 2014-10-22 | 三菱樹脂株式会社 | Temperature control mat and temperature control structure |
EP2938556B1 (en) * | 2012-12-27 | 2016-10-05 | Sca Hygiene Products AB | Package of a stack of flexible articles |
CN203158543U (en) * | 2013-03-04 | 2013-08-28 | 珠海华尚汽车玻璃工业有限公司 | Toughened glass storage apparatus |
US9543175B2 (en) * | 2013-09-25 | 2017-01-10 | International Business Machines Corporation | Package assembly for thin wafer shipping and method of use |
EP3148495B1 (en) * | 2014-05-27 | 2020-07-15 | The Procter and Gamble Company | Method of making an absorbent product |
SG10201403372SA (en) * | 2014-06-18 | 2016-01-28 | Mfg Integration Technology Ltd | System and method for peeling a semiconductor chip from a tape using a multistage ejector |
US10184703B2 (en) * | 2014-08-19 | 2019-01-22 | Carrier Corporation | Multipass microchannel heat exchanger |
CN105138092A (en) * | 2015-08-11 | 2015-12-09 | 成都思邦力克科技有限公司 | Heat dissipating type hard disk extracting holder |
CN205738710U (en) * | 2016-05-10 | 2016-11-30 | 范富军 | A kind of package and packing box |
TWI629446B (en) * | 2016-12-29 | 2018-07-11 | 廣達電腦股份有限公司 | Heat dissipation assembly and electronic device using the same |
CN107600644B (en) * | 2017-09-19 | 2020-03-10 | 深圳市华星光电技术有限公司 | Spacer for packaging display panel and packaging box |
US20200047967A1 (en) * | 2018-08-10 | 2020-02-13 | Miraclecorp Products | Unblended pet food product and method for making a pet food product |
-
2020
- 2020-09-11 TW TW109131402A patent/TWI740643B/en active
- 2020-12-28 CN CN202011576988.8A patent/CN114162432B/en active Active
-
2021
- 2021-01-07 US US17/144,124 patent/US11834225B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200927604A (en) * | 2007-12-31 | 2009-07-01 | Au Optronics Corp | Packing device and a carrying device thereof for loading plate-shaped electronic devices |
TWM424304U (en) * | 2011-06-24 | 2012-03-11 | Yan Du Technology Co Ltd | Assembling jig for memory/heat dissipation plate package |
US10396414B2 (en) * | 2012-08-31 | 2019-08-27 | Avl Powertrain Engineering, Inc. | High power battery cells having improved cooling |
CN205441247U (en) * | 2015-12-28 | 2016-08-10 | 江苏易实精密科技股份有限公司 | Portable electronic connectors mounting box |
TWM605805U (en) * | 2020-09-11 | 2020-12-21 | 健策精密工業股份有限公司 | Packing box of heat spreader |
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US11834225B2 (en) | 2023-12-05 |
TW202210382A (en) | 2022-03-16 |
US20220081166A1 (en) | 2022-03-17 |
CN114162432B (en) | 2024-05-24 |
CN114162432A (en) | 2022-03-11 |
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