TWI739572B - Vacuum gas replacement device and method for wafer box - Google Patents
Vacuum gas replacement device and method for wafer box Download PDFInfo
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Abstract
本發明為有關一種晶舟盒之真空氣體換置裝置及其方法,主要結構包括一晶舟盒載體、一界定於晶舟盒載體內之容置空間、一活動設置於晶舟盒載體一側之容器蓋體、一收容於容置空間內之晶舟盒本體、一連通容置空間及晶舟盒本體內部之氣體導出件、一連通容置空間及晶舟盒本體內部之氣體導入件、一設於晶舟盒載體上之真空裝置、一設於晶舟盒載體上之惰性氣體導入裝置、及一過濾元件。藉此,利用先抽真空、再灌惰性氣體的動作,將晶舟盒本體內的一般大氣換置成純惰性氣體,且過程中晶舟盒本體所在的晶舟盒載體內,氣體種類皆與晶舟盒本體內部相同,而有效確保晶舟盒本體的氣體純度。 The present invention relates to a vacuum gas replacement device for a wafer boat box and a method thereof. The main structure includes a wafer boat box carrier, an accommodating space defined in the wafer boat box carrier, and a movably arranged on one side of the wafer boat box carrier The container cover, a wafer boat box body accommodated in the accommodating space, a gas outlet connecting the accommodating space and the inside of the wafer box body, a connecting accommodating space and the gas introduction inside the wafer box body Components, a vacuum device set on the wafer box carrier, an inert gas introduction device set on the wafer box carrier, and a filter element. In this way, the general atmosphere in the wafer boat box body is replaced with pure inert gas by the action of vacuuming first and then filled with inert gas. In the process, the gas type in the wafer boat box carrier where the wafer boat box body is located is the same The inside of the wafer boat box body is the same, and the gas purity of the wafer boat box body is effectively ensured.
Description
本發明為提供一種晶舟盒之真空氣體換置裝置及其方法,尤指一種可確保晶舟盒本體內的晶圓收容品質、及可提升晶舟盒本體內氣體純度的晶舟盒之真空氣體換置裝置及其方法。 The present invention provides a vacuum gas replacement device and method for a wafer box box, in particular to a wafer box vacuum that can ensure the wafer storage quality in the wafer box body and can improve the gas purity in the wafer box body Gas replacement device and method.
按,在半導體製造工程中,半導體晶圓之微細化越趨精密,加工製程也變得複雜,特別是藉由鹵系氣體的蝕刻工程中,蝕刻後殘留的鹵系氣體與乾空氣中的水分反應而產生酸,由於酸會對半導體晶圓產生腐蝕,而成為嚴重的問題,作為其對策,一般將加工後的晶圓(Wafer)收納於晶舟盒(FOUP)後,以無水真空環境或氮氣予以換置,來阻止酸(acid)的發生,以防止半導體晶圓腐蝕。但是晶圓在收納時或晶舟盒在搬運中,內部的晶圓可能因帶電,而發生半導體電路的靜電破壞,或因靜電使塵埃附著於晶圓表面,作為其對策,目前常以真空環境或供給氮氣,來除去化學氣體及靜電,進而除去水分來阻止半導體晶圓表面的酸之發生。 According to the semiconductor manufacturing process, the miniaturization of semiconductor wafers is becoming more and more precise, and the processing process has become more complicated, especially with the halogen-based gas etching process, the residual halogen-based gas after etching and the moisture in the dry air The reaction produces acid. The acid will corrode the semiconductor wafer, which becomes a serious problem. As a countermeasure, the processed wafer (Wafer) is generally stored in the FOUP, and then placed in a water-free vacuum environment or Nitrogen is replaced to prevent acid (acid) from occurring to prevent corrosion of semiconductor wafers. However, when the wafer is stored or the wafer box is being transported, the internal wafers may be charged, causing electrostatic damage to the semiconductor circuit, or dust may adhere to the surface of the wafer due to static electricity. As a countermeasure, a vacuum environment is often used. Or supply nitrogen to remove chemical gases and static electricity, and then remove moisture to prevent the generation of acid on the surface of semiconductor wafers.
然而,上述真空環境的營造或氮氣的填充,對晶舟盒本身而言,卻很難讓真空的效果或氮氣的品質維持在最佳狀態,主要原因在於在抽真空或填入氮氣時,都直接對晶舟盒操作,使得晶舟盒內部的氣體壓力與外部落差很大,而在抽氣或灌氣動作結束的瞬間,容易因壓力差流失部分氮氣而影響濃度、或混入一般的大氣甚至水氣,導致難以確保晶圓的收容品質。 However, it is difficult for the wafer boat box itself to create the vacuum environment or fill the nitrogen gas to maintain the best vacuum effect or the quality of the nitrogen gas. Direct operation of the wafer box makes the gas pressure inside the wafer box and the outside drop very large, and at the end of the pumping or filling action, it is easy to lose part of the nitrogen due to the pressure difference and affect the concentration, or mix into the general atmosphere or even Water vapor makes it difficult to ensure the quality of wafer storage.
是以,要如何解決上述習用之問題與缺失,即為本發明之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the creators of the present invention and the related manufacturers engaged in this industry are eager to study and improve.
故,本發明之創作人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種可確保晶舟盒本體內的晶圓收容品質、及可提升晶舟盒本體內氣體純度的晶舟盒之真空氣體換置裝置及其方法的發明專利者。 Therefore, in view of the above-mentioned deficiencies, the creator of the present invention collected relevant information, evaluated and considered in many ways, and based on the accumulated years of experience in this industry, through continuous trials and modifications, he designed such a guaranteed crystal boat box. The inventor of the wafer storage quality in the body and the vacuum gas replacement device and method of the wafer boat box that can improve the gas purity in the wafer boat box body.
本發明之主要目的在於:利用抽真空及填充惰性氣體的兩階段動作,使晶舟盒本體內部的晶圓收容品質最佳化,並於氣體換置過程中,將晶舟盒本體置於密閉空間同步進行氣體換置,以排除一般大氣或水氣混入晶舟盒本體內部、或惰性氣體流失的問題。 The main purpose of the present invention is to use the two-stage action of vacuuming and filling with inert gas to optimize the quality of wafer storage inside the wafer box body, and to place the wafer boat box body in the process of gas replacement. Simultaneous gas replacement is performed in the confined space to eliminate the problem of general air or water mixing into the inside of the wafer box body, or loss of inert gas.
為達成上述目的,本發明之主要結構包括:一晶舟盒載體、一容置空間、一容器蓋體、一晶舟盒本體、一氣體導出件、一氣體導入件、一真空裝置、一惰性氣體導入裝置、及一過濾元件。該容置空間界定於晶舟盒載體內,該容器蓋體活動設置於晶舟盒載體一側以密封該容置空間,該晶舟盒本體收容於容置空間內,該氣體導出件設於晶舟盒本體一側以連通容置空間及晶舟盒本體內部,該氣體導入件設於晶舟盒本體一側以連通容置空間及晶舟盒本體內部,該真空裝置設於晶舟盒載體上以供連結氣體導出件,該惰性氣體導入裝置設於晶舟盒載體上以供連結氣體導入件,而該過濾元件設於該惰性氣體導入裝置與該氣體導入件間。 In order to achieve the above object, the main structure of the present invention includes: a wafer boat box carrier, an accommodating space, a container cover, a wafer box body, a gas outlet, a gas inlet, a vacuum device, and an inert Gas introduction device and a filter element. The accommodating space is defined in the wafer boat box carrier, the container cover is movably arranged on one side of the wafer boat box carrier to seal the accommodating space, the wafer boat box body is accommodated in the accommodating space, and the gas outlet is arranged in One side of the wafer box body communicates with the accommodating space and the inside of the wafer box body, the gas inlet is arranged on one side of the wafer box body to communicate with the accommodating space and the inside of the wafer box body, and the vacuum device is arranged in the wafer box body. The boat box carrier is provided with a connecting gas outlet, the inert gas introduction device is arranged on the wafer box carrier for connecting the gas introduction piece, and the filter element is arranged between the inert gas introduction device and the gas introduction piece.
當使用者將本發明用於晶舟盒本體之氣體換置時,乃先將晶舟盒本體置入容置空間內,並以容器蓋體密封該容置空間,接著驅動真空裝置,將其連通氣體導出件,以使晶舟盒本體內及容置空間內形成真空狀態,然後關閉真空裝置並驅動惰性氣體導入裝置,將惰性氣體導入裝置連通氣體入出件,以使惰性氣體通過一過濾元件後充滿晶舟盒本體內及容置空間內,最後關閉惰性氣體導入裝置,並開啟該容器蓋體,如此,在晶舟盒本體與真空裝置或惰性氣體導入裝置斷開時,因容置空間內的氣體種類及氣體壓力皆與晶舟盒本體內部相同,而可確實排除大氣或水氣滲入或惰性氣體流失的風險,使最後取出的晶舟盒本體內部,對保存晶圓而言為最佳之環境。 When the user uses the present invention to replace the gas of the wafer box body, first put the wafer box body into the containing space, and seal the containing space with the container cover, and then drive the vacuum device to remove it. Connect the gas outlet to make the wafer box body and the accommodating space form a vacuum state, then close the vacuum device and drive the inert gas introduction device, the inert gas introduction device is connected to the gas inlet and outlet, so that the inert gas can pass through a filter element After filling the wafer box body and the accommodating space, the inert gas introduction device is closed and the container cover is opened. Thus, when the wafer box body is disconnected from the vacuum device or the inert gas introduction device, the accommodating space The gas type and gas pressure inside are the same as those inside the wafer box body, and the risk of air or water infiltration or loss of inert gas can be reliably eliminated, so that the inside of the wafer box body that is finally taken out is important for preserving wafers. For the best environment.
藉由上述技術,可針對習用真空環境的營造或氮氣的填充所存在之在抽氣或灌氣動作結束的瞬間,即容易流失氮氣或混入一般的大氣甚至水氣,導致難以確保晶圓的收容品質之問題點加以突破,達到上述優點之實用進步 性。 With the above technology, it is possible to deal with the creation of a conventional vacuum environment or the filling of nitrogen at the moment when the pumping or filling action ends, that is, it is easy to lose nitrogen or mix into general atmosphere or even moisture, which makes it difficult to ensure the storage of wafers. Make breakthroughs in quality problems, and achieve practical progress to achieve the above advantages sex.
1:晶舟盒載體 1: Wafer box carrier
11、11a:容置空間 11, 11a: accommodating space
12:容器蓋體 12: Container lid
121:密封膠條 121: Sealing strip
2、2a:晶舟盒本體 2, 2a: Wafer box body
21、21a:晶圓 21, 21a: Wafer
22a:氣體導出口 22a: gas outlet
23a:氣體導入口 23a: Gas inlet
3、3a:氣體導出件 3.3a: Gas outlet
31a:第一導桿 31a: first guide rod
32a:第一密封部 32a: The first sealing part
33a:第一彈性元件 33a: first elastic element
4、4a:氣體導入件 4.4a: Gas inlet
41a:第二導桿 41a: second guide rod
42a:第二密封部 42a: The second sealing part
43a:第二彈性元件 43a: second elastic element
5、5a:真空裝置 5, 5a: vacuum device
51:乾式真空泵浦 51: Dry vacuum pump
52:真空閥 52: Vacuum valve
53:真空吸取件 53: Vacuum suction parts
6、6a:惰性氣體導入裝置 6, 6a: Inert gas introduction device
61:氮氣導入管 61: Nitrogen inlet pipe
62:氮氣閥 62: Nitrogen valve
63:過濾元件 63: filter element
第一圖 係為本發明較佳實施例之立體透視圖。 The first figure is a perspective view of a preferred embodiment of the present invention.
第二圖 係為本發明較佳實施例之第一圖A-A線剖視圖。 The second figure is a cross-sectional view along the line A-A in the first figure of the preferred embodiment of the present invention.
第三圖 係為本發明較佳實施例之步驟方塊流程圖。 The third figure is a block flow diagram of the steps of the preferred embodiment of the present invention.
第四圖 係為本發明較佳實施例之收容示意圖。 The fourth figure is a schematic diagram of the storage of the preferred embodiment of the present invention.
第五圖 係為本發明較佳實施例之真空示意圖。 The fifth figure is a schematic diagram of the vacuum of the preferred embodiment of the present invention.
第六圖 係為本發明較佳實施例之填充示意圖。 The sixth figure is a schematic diagram of filling in a preferred embodiment of the present invention.
第七圖 係為本發明較佳實施例之取出示意圖。 The seventh figure is a schematic drawing of the preferred embodiment of the present invention.
第八圖 係為本發明再一較佳實施例之氣體導出件之動作示意圖。 The eighth figure is a schematic diagram of the action of the gas outlet of another preferred embodiment of the present invention.
第九圖 係為本發明再一較佳實施例之氣體導入件之動作示意圖。 The ninth figure is a schematic diagram of the operation of the gas inlet of another preferred embodiment of the present invention.
第十圖 係為本發明再一較佳實施例之還原密封示意圖。 The tenth figure is a schematic diagram of the reduction seal of another preferred embodiment of the present invention.
為達成上述目的及功效,本發明所採用之技術手段及構造,茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下,俾利完全了解。 In order to achieve the above-mentioned purposes and effects, the technical means and structure adopted by the present invention are illustrated in detail below to illustrate the characteristics and functions of the preferred embodiments of the present invention, so as to fully understand.
請參閱第一圖至第三圖所示,係為本發明較佳實施例之立體透視圖至步驟方塊流程圖,由圖中可清楚看出本發明係包括: Please refer to Figures 1 to 3, which are a three-dimensional perspective view to a block flow diagram of a preferred embodiment of the present invention. From the figures, it can be clearly seen that the present invention includes:
一晶舟盒載體1;
A
一容置空間11,係界定於該晶舟盒載體1內;
An
一容器蓋體12,係活動設置於該晶舟盒載體1一側以密封該容置空間11;
A
一晶舟盒本體2,係收容於該容置空間11內;
A
一氣體導出件3,係設於該晶舟盒本體2一側,以連通該容置空間11及該晶舟盒本體2內部;
A
一氣體導入件4,係設於該晶舟盒本體2一側,以連通該容置空間11及該晶舟盒本體2內部;
A
一真空裝置5,係設於該晶舟盒載體1上以供連結該氣體導出件
3;
A
一惰性氣體導入裝置6,係設於該晶舟盒載體1上以供連結該氣體導入件4;
An inert
一過濾元件63,係設於該惰性氣體導入裝置6與該氣體導入件4間。
A
而本發明之晶舟盒之真空氣體換置方法,其主要步驟包括: The main steps of the vacuum gas replacement method of the wafer boat box of the present invention include:
(a)收容晶舟盒本體:將一晶舟盒本體置入一晶舟盒載體之容置空間內,並以晶舟盒載體一側之容器蓋體密封該容置空間; (a) Containing the wafer boat box body: placing a wafer boat box body in the accommodating space of a wafer boat box carrier, and sealing the accommodating space with a container cover on the side of the wafer boat box carrier;
(b)驅動真空裝置:驅動一真空裝置,並將其連通晶舟盒本體一側之氣體導出件,以使晶舟盒本體內及容置空間內形成真空狀態; (b) Drive the vacuum device: drive a vacuum device and connect it to the gas outlet on the side of the wafer box body, so that the wafer box body and the accommodating space form a vacuum state;
(c)驅動惰性氣體導入裝置:關閉該真空裝置並驅動一惰性氣體導入裝置,將其連通晶舟盒本體一側之氣體導入件,以使惰性氣體通過一過濾元件後充滿晶舟盒本體內及容置空間內; (c) Drive the inert gas introduction device: turn off the vacuum device and drive an inert gas introduction device, and connect it to the gas introduction part on the side of the wafer box body, so that the inert gas can fill the wafer box body after passing through a filter element And in the accommodating space;
(d)取出晶舟盒本體:關閉該惰性氣體導入裝置,並開啟該容器蓋體,以取出晶舟盒本體。 (d) Take out the wafer boat box body: close the inert gas introduction device and open the container cover to take out the wafer boat box body.
藉由上述之說明,已可了解本技術之結構,而依據這個結構之對應配合,更可達到確保晶舟盒本體2內的晶圓收容品質、及提升晶舟盒本體2內氣體純度等優勢,而詳細之解說將於下述說明。
Through the above description, the structure of this technology can be understood, and according to the corresponding cooperation of this structure, the advantages of ensuring the wafer storage quality in the
請同時配合參閱第一圖至第七圖所示,係為本發明較佳實施例之立體透視圖至取出示意圖,藉由上述構件組構時,由圖中可清楚看出,該晶舟盒載體1為一上開式的容器;容器蓋體12則為樞設於晶舟盒載體1一側的上蓋,可配合密封膠條121加強容器蓋體12封閉後,容置空間11的密封效果;氣體導出件3與氣體導入件4為封閉晶舟盒本體2用之吸嘴;真空裝置5包括有乾式真空泵浦51、連結設置於乾式真空泵浦51一側之真空閥52、及連結氣體導出件3之真空吸取件53;惰性氣體導入裝置6則包括有氮氣導入管61、及連結設置於氮氣導入管61一側之氮氣閥62。上述元件之對應型態僅為較佳實施例之舉例,凡具有相同功能之型態者,皆屬本發明之範疇,不侷限於上述舉例。
Please also refer to the first to seventh figures, which are the perspective view to the schematic drawing of the preferred embodiment of the present invention. When the above-mentioned components are assembled, it can be clearly seen from the figure that the wafer box box The
如第四圖及步驟(a)所示,實際使用時,先將晶舟盒載體1的容器蓋體12向上開啟,利用俗稱天車的高架半運系統(Overhead Hoist Transfer,OHT)
將晶舟盒本體2從上而下裝載至晶舟盒載體1內,然後將容器蓋體12關閉,使容置空間11形成一密閉空間。
As shown in the fourth figure and step (a), in actual use, first open the
如第五圖及步驟(b)所示,晶舟盒本體2定位後,乃將真空裝置5的真空吸取件53連結晶舟盒本體2底部的氣體導出件3,並開啟真空裝置5的真空閥52及啟動真空裝置5的乾式真空泵浦51,以透過真空吸取件53將晶舟盒本體2內的一般大氣抽出,而由於晶舟盒本體2的氣體導出件3已與晶舟盒本體2分離,故真空裝置5的動作實際上可連同容置空間11內的一般大氣一起抽出,而對晶圓21存放環境而言,此抽真空動作可同時將容置空間11與晶舟盒本體2內的氣體(包含空氣中的水氣)排出,故抽真空的時間越久,真空環境的效果越好。
As shown in Figure 5 and step (b), after the wafer
如第六圖及步驟(c)所示,接著將真空裝置5的乾式真空泵浦51關閉,停止抽真空的動作,將惰性氣體導入裝置6的氮氣導入管61連結晶舟盒本體2底部的氣體導入件4,並開啟惰性氣體導入裝置6的氮氣閥62,以透過氮氣導入管61將氮氣填充至晶舟盒本體2內,直至氮氣完全充滿容置空間11及晶舟盒本體2內部,且惰性氣體導入裝置6輸出之惰性氣體,都會先經過過濾元件63,使輸入至晶舟盒本體2內的氣體無粉塵顆粒,而避免損傷內部之晶圓21。此時,由於晶舟盒本體2的氣體導出件3已與晶舟盒本體2分離,故惰性氣體導入裝置6的動作實際上可連同容置空間11一起填充氮氣。
As shown in Figure 6 and step (c), the
如第七圖及步驟(d)所示,接著關閉惰性氣體導入裝置6,停止填充氮氣的動作,使氣體導出件3及氣體導入件4恢復成封閉晶舟盒本體2之態樣,而後開啟容器蓋體12,讓容置空間11中的氮氣排出一段時間,即可以天車取出晶舟盒本體2。由於晶舟盒本體2的氣體導出件3及氣體導入件4在調整為封閉狀態時,晶舟盒本體2仍處於充滿氮氣的容置空間11內,且晶舟盒本體2與容置空間11的氣體壓力相同,故不會發生氮氣流失或一般大氣混入晶舟盒本體2內部之問題,藉此確保晶舟盒本體2內的氣體純度,而提供保存晶圓21的最佳環境。
As shown in Figure 7 and step (d), the inert
再請同時配合參閱第八圖至第十圖所示,係為本發明再一較佳實施例之氣體導出件之動作示意圖至還原密封示意圖,由圖中可清楚看出,本實施例與上述實施例為大同小異,僅於晶舟盒本體2a上具有一氣體導出口22
a及一氣體導入口23a,氣體導出件3a具有一活動穿設該氣體導出口22a之第一導桿31a、一設於該第一導桿31a一側且位於該氣體導出口22a外側之第一密封部32a、及一設於該第一導桿31a上使該第一密封部32a封閉該氣體導出口22a之第一彈性元件33a,該氣體導入件4a則具有一活動穿設該氣體導入口23a之第二導桿41a、一設於該第二導桿41a一側且位於該氣體導入口23a內側之第二密封部42a,及一設於該第二導桿41a上使該第二密封部42a封閉該氣體導入口23a之第二彈性元件43a。
Please also refer to Figures 8 to 10 at the same time, which are the schematic diagram of the operation of the gas outlet of another preferred embodiment of the present invention to the schematic diagram of the reduction seal. The embodiments are similar, and only have a gas outlet 22 on the
根據上述結構,在收容晶舟盒本體2a之步驟(a)後,可進一步進行步驟(a1)及步驟(a2),如第八圖所示,真空裝置5a開啟時,乃先對容置空間11a進行真空抽氣,當容置空間11a的氣壓小於晶舟盒本體2a內的氣壓時,氣體導出件3a即因負壓效果被拉出,而使氣體導出件3a的第一密封部32a與氣體導出口22a分離,此時,真空裝置5a即可同時對晶舟盒本體2a內部及容置空間11a進行抽真空的動作,並於晶舟盒本體2a內部及容置空間11a同處於真空狀態時關閉真空裝置5a。並於晶舟盒本體2a內部與容置空間11a壓力平衡時,氣體導出件3a係利用一第一彈性元件33a的彈力,使氣體導出件3a沿著其第一導桿31a的方向移動,而讓氣體導出件3a的第一密封部32a封閉氣體導出口22a。
According to the above structure, after step (a) of accommodating the
根據上述結構,在驅動真空裝置5a之步驟(b)後,可進一步進行步驟(b1),如第九圖所示,當惰性氣體導入裝置6a輸出惰性氣體時,乃藉由氣體壓力頂推氣體導入件4a,而使氣體導入件4a之第二密封部42a與氣體導入口23a分離,並於晶舟盒本體2a內部之氣體壓力大於容置空間11a時,利用內外的氣壓差使氣體導出件3a的第一密封部32a與氣體導出口22a分離,此時,晶舟盒本體2a內的惰性氣體便會流出至容置空間11a,換言之,惰性氣體導入裝置6a可同時對晶舟盒本體2a內部及容置空間11a同時灌入惰性氣體。
According to the above structure, after step (b) of driving the
根據上述結構,在驅動惰性氣體導入裝置6a之步驟(c)後,可進一步進行步驟(c1),如第十圖所示,當晶舟盒本體2a與容置空間11a之氣壓平衡後,氣體導出件3a將再次封閉氣體導出口22a,同時氣體導入件4a係利用一第二彈性元件43a的彈力,使氣體導入件4a沿著其第二導桿41
a的方向移動,而讓氣體導入件4a的第二密封部42a封閉氣體導入口23a。其中第一彈性元件33a為拉伸彈簧,設於靠近晶舟盒本體2a內側的位置,當第一密封部32a被拉出時,可用其彈力回拉第一密封部32a,且該回拉動作可利用第一導桿31a及氣體導出口22a的位置關係,限制氣體導出件3a僅能直線移動。同理,第二彈性元件43a亦為拉伸彈簧,設於靠近晶舟盒本體2a外側的位置,當第二密封部42a被頂出時,可用其彈力回拉第二密封部42a,且該回拉動作可利用第二導桿41a及氣體導入口23a的位置關係,限制氣體導入件4a僅能直線移動。
According to the above structure, after step (c) of driving the inert
惟,以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 However, the above description is only the preferred embodiments of the present invention, which does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be the same. It is included in the scope of the patent of the present invention, and is hereby stated.
綜上所述,本發明之晶舟盒之真空氣體換置裝置及其方法於使用時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本發明,以保障創作人之辛苦創作,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。 In summary, the vacuum gas replacement device and method of the wafer box box of the present invention can indeed achieve its effects and purposes when used. Therefore, the present invention is truly an invention with excellent practicability and is in line with invention patents. For application requirements, Yan filed an application in accordance with the law. I hope that the review committee will grant the invention as soon as possible to protect the creator's hard work. If the review committee has any doubts, please feel free to write instructions.
1:晶舟盒載體 1: Wafer box carrier
11:容置空間 11: accommodating space
12:容器蓋體 12: Container lid
2:晶舟盒本體 2: Wafer box body
3:氣體導出件 3: Gas outlet
4:氣體導入件 4: Gas inlet
5:真空裝置 5: Vacuum device
6:惰性氣體導入裝置 6: Inert gas introduction device
63:過濾元件 63: filter element
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