TWI738910B - Resin composition, black matrix, display device, and manufacturing method of black matrix - Google Patents

Abstract

The present invention provides the following: a photosensitive resin composition with excellent sensitivity that can form a black matrix with high impedance and excellent water resistance, a black matrix formed by curing the resin composition, a display device with the black matrix, and the use of the aforementioned resin The manufacturing method of the black matrix of the composition. In a photosensitive resin composition containing (A) alkali-soluble resin, (B) photopolymerizable compound, (C) photopolymerization initiator, (D) light-shielding material, and (E) epoxy compound, it is used in the main chain A resin containing an aromatic ring is used as the (A) alkali-soluble resin, and an epoxy compound having a specific structure containing an aromatic group and an average molecular weight of 800 or more is used as the (E) epoxy compound.

Description

Resin composition, black matrix, display device, and manufacturing method of black matrix

[0001] The present invention relates to a resin composition, a black matrix formed by curing the resin composition, a display device provided with the black matrix, and a method of manufacturing a black matrix using the aforementioned resin composition.

[0002] The structure of a display such as a liquid crystal display is that a liquid crystal layer is sandwiched between two substrates, and the two substrates are formed with pairs of electrodes facing each other. In addition, a color filter is formed on the inner side of the substrate on one side, and the color filter has image elements composed of various colors such as red (R), green (G), and blue (B). Moreover, in this color filter, in order to prevent the color mixing of different colors in each picture element, or to hide the pattern of the electrode, a black matrix is usually formed, and the black matrix is arranged in a matrix shape to divide the colors of R, G, and B.的图元.　　[0003] Generally, color filters are formed by photolithography. Specifically, first, a black photosensitive composition is coated on a substrate, exposed to light, and developed to form a black matrix. After that, by repeatedly coating, exposing, and developing the photosensitive composition of each color of red (R), green (G), and blue (B), the pattern of each color is formed at a predetermined position to form a color filter piece.　　[0004] As a method for forming a colored film constituting a color filter, for example, a method for forming a black matrix using a negative photosensitive resin composition is proposed. For example, in Patent Document 1, as a black photosensitive resin composition that can form a black matrix with excellent adhesion to a substrate and excellent light-shielding properties, it is shown that the alkali-soluble resin includes a cardo structure Negative photosensitive resin composition of resin and acrylic resin. [Prior Art Document] [Patent Document] 　　[0005] [Patent Document 1]: Japanese Patent Application Publication No. 2011-133851

式(E1)中，OGly為環氧丙氧基，R^e1 係鹵素原子或者碳原子數1～8之1價基，a為0～4之整數，b為括弧內之單元之重複數，在a為2以上之整數之情況下，苯環上相鄰之2個R^e1 亦可相互地鍵結而形成環，R^e2 為2價之脂肪族環式基，或以下述式(E1-1)表示之基，

式(E1-1)中，OGly為環氧丙氧基，R^e3 為芳香族烴基，R^e4 為鹵素原子或碳原子數1～4之烷基，c為0或者1，d為0～8之整數，R^e5 為氫原子或以下述式(E1-2)表示之基，

式(E1-2)中，OGly為環氧丙氧基，R^e6 是鹵素原子、碳原子數1～4之烷基或苯基，e為0～4之整數； 　　以式(E1)表示之環氧化合物之平均分子量為800以上。 　　[0011] 本發明之第2種態樣為一種黑色基質，由第1種態樣所述之樹脂組成物硬化而成。 　　[0012] 本發明之第3種態樣為一種顯示裝置，具備第種2態樣所述之黑色基質。 　　[0013] 本發明之第4種態樣為一種黑色基質之製造方法，包含： 　　藉由塗佈第1種態樣所述之樹脂組成物而形成塗膜之步驟、 　　選擇位置對塗膜進行曝光之步驟、 　　使經曝光之塗膜顯影，形成圖案化之硬化膜之步驟與 　　烘烤圖案化之硬化膜之步驟。 [發明之效果] 　　[0014] 根據本發明，藉由使用具備特定構成之(E)環氧化合物，不會過度地損壞組成物之靈敏度，可實現賦予硬化膜以高阻抗化與高耐水性。 　　因此，根據本發明，可提供以下內容：可形成高阻抗且耐水性優良之黑色基質之靈敏度優良之感光性樹脂組成物、使該樹脂組成物硬化而成之黑色基質、具備該黑色基質之顯示裝置與使用前述樹脂組成物之黑色基質之製造方法。[Problem to be Solved by the Invention] [0006] However, in the photosensitive resin composition for forming a black matrix, it is generally desired to form a black matrix showing a high resistance value. In recent years, the requirements for this aspect have become higher and higher, and even the photosensitive resin composition described in Patent Document 1 has a technical problem that it is difficult to form a black matrix with a desired high resistance value. [0007] It is generally believed that such technical problems may occur in the step of heating the resin composition. That is, after the black matrix is formed, it is supplied to the heating step, thereby causing thermal deformation or thermal degradation of the acrylic resin, and thus the pigments contained in it are close to each other. In order to eliminate the above phenomenon, for the photosensitive resin composition, it is considered to use a resin with a cardo structure as an alkali-soluble resin, or to use more alkali-soluble resins with excellent heat resistance like novolak resins. However, when an alkali-soluble resin excessively contains a resin having a cardo structure, it tends to be difficult to form a black matrix with excellent water resistance. In addition, when a novolak resin is used instead of an acrylic resin, it may be difficult to obtain a photosensitive resin composition with good sensitivity. That is, in the technical field, there are actual situations in which a resin composition with an excellent balance of high impedance, high water resistance, and high sensitivity is required. There is a limit to the method of only selecting alkali-soluble resins to meet such needs. [0008] The present invention is an invention made in view of the above technical problems, and its object is to provide the following: a photosensitive resin composition that can form a black matrix with high impedance and excellent water resistance and excellent sensitivity, and harden the resin composition A method for producing a black matrix, a display device equipped with the black matrix, and a black matrix using the aforementioned resin composition. [Means to Solve the Problem] [0009] The present inventors found that the inclusion of (A) alkali-soluble resin, (B) photopolymerizable compound, (C) photopolymerization initiator, (D) light-shielding material, and (E) In the photosensitive resin composition of the epoxy compound, a resin containing an aromatic ring in the main chain is used as (A) an alkali-soluble resin, and an epoxy compound having a specific structure containing an aromatic group and an average molecular weight of 800 or more is used As the epoxy compound (E), the above technical problems can be solved, and the present invention has been completed. Specifically, the present invention provides the following. [0010] The first aspect of the present invention is a resin composition used to form a black matrix, comprising: (A) an alkali-soluble resin, (B) a photopolymerizable compound, and (C) a photopolymerization initiator , (D) Light-shielding material and (E) epoxy compound; (A) Alkali-soluble resin contains a resin containing an aromatic ring in the main chain; (E) epoxy compound contains an epoxy compound represented by the following formula (E1) ,

In formula (E1), OGly is a glycidoxy group, R ^e1 is a halogen atom or a monovalent group with 1 to 8 carbon atoms, a is an integer of 0 to 4, and b is the repeating number of the unit in parentheses. When a is an integer of 2 or more, two adjacent R ^e1 on the benzene ring may be bonded to each other to form a ring, and R ^e2 is a divalent aliphatic cyclic group, or the following formula (E1-1 ) Represents the base,

In the formula (E1-1), OGly epoxy propoxy, R ^e3 is an aromatic hydrocarbon group, R ^e4 is a halogen atom or an alkyl group having 1 to 4 carbon atoms of, c is 0 or 1, d is 0 to 8 R ^e5 is a hydrogen atom or a group represented by the following formula (E1-2),

In the formula (E1-2), OGly is a glycidoxy group, R ^e6 is a halogen atom, an alkyl group with 1 to 4 carbon atoms or a phenyl group, and e is an integer of 0 to 4; represented by the formula (E1) The average molecular weight of the epoxy compound is 800 or more. [0011] The second aspect of the present invention is a black matrix formed by curing the resin composition described in the first aspect. [0012] The third aspect of the present invention is a display device provided with the black matrix described in the second aspect. [0013] The fourth aspect of the present invention is a method of manufacturing a black matrix, including: a step of forming a coating film by coating the resin composition described in the first aspect, and selecting a position to expose the coating film The steps of developing the exposed coating film to form a patterned hardened film and baking the patterned hardened film. [Effects of the Invention] [0014] According to the present invention, by using the (E) epoxy compound having a specific composition, the sensitivity of the composition is not excessively damaged, and the cured film can be imparted with high resistance and high water resistance. Therefore, according to the present invention, the following can be provided: a photosensitive resin composition with excellent sensitivity that can form a black matrix with high impedance and excellent water resistance, a black matrix formed by curing the resin composition, and a display provided with the black matrix The device and the manufacturing method of the black matrix using the aforementioned resin composition.

[0023] 在式(a-1)中，X^a 表示以下述式(a-2)所示之基。m1表示0～20之整數。 　　[0024]

[0025] 在上述式(a-2)中，R^a1 分別獨立地表示氫原子、碳原子數1～6之烴基或鹵素原子，R^a2 分別獨立地表示氫原子或者甲基，R^a3 分別獨立地表示直鏈或者支鏈之亞烷基，m2表示0或1，W^a 表示以下述式(a-3)所示之基。 　　[0026]

[0027] 在式(a-2)中，作為R^a3 ，較佳碳原子數1～20之亞烷基，更較佳碳原子數1～10之亞烷基，特別佳碳原子數1～6之亞烷基，最佳乙烷-1,2-二基、丙烷-1,2-二基及丙烷-1,3-二基。 　　[0028] 式(a-3)中之環A表示脂肪族環，可與芳香族環縮合，亦可具有取代基。脂肪族環可為脂肪族烴環，亦可為脂肪族雜環。 　　作為脂肪族環，可列舉單環烷烴、雙環烷烴、三環烷烴、四環烷烴等。 　　具體而言，可列舉環戊烷、環己烷、環庚烷、環辛烷等單環烷烴或金剛烷、降冰片烷、異冰片烷、三環癸烷、四環十二烷。 　　可與脂肪族環縮合之芳香族環可為芳香族烴環，亦可為芳香族雜環，較佳芳香族烴環。具體而言，較佳苯環及萘環。 　　[0029] 作為以式(a-3)表示之2價基之較佳例子，可列舉下述之基。

[0030] 式(a-1)中之2價基X^a 經由使提供殘基Z^a 之四羧酸二酐與以下述式(a-2a)表示之二醇化合物發生反應，被導入至(A1)卡多樹脂中。

[0031] 在式(a-2a)中，R^a1 、R^a2 、R^a3 及m2同式(a-2)之說明。式(a-2a)中之環A同式(a-3)之說明。 　　[0032] 以式(a-2a)表示之二醇化合物可經由例如以下之方法製造得到。 　　首先，根據需要依據常規方法將以下述式(a-2b)表示之二醇化合物具有之酚性羥基中之氫原子取代為以-R^a3 -OH表示之基之後，使用環氧氯丙烷等縮水甘油基化，得到以下述式(a-2c)表示之環氧化合物。 　　接著，經由使以式(a-2c)表示之環氧化合物與丙烯酸或甲基丙烯酸發生反應，得到以式(a-2a)表示之二醇化合物。 　　在式(a-2b)及式(a-2c)中，R^a1 、R^a3 及m2同式(a-2)之說明。通式(a-2b)及式(a-2c)中之環A同式(a-3)之說明。 　　另外，以式(a-2a)表示之二醇化合物之製造方法不限定於上述方法。

[0033] 作為以式(a-2b)表示之二醇化合物之較佳例子，可列舉以下之二醇化合物。

[0034] 上述式(a-1)中，R^a0 為氫原子或以-CO-Y^a -COOH表示之基。於此，Y^a 表示從二羧酸酐除去酸酐基(-CO-O-CO-)後之殘基。作為二羧酸酐之例子，可列舉馬來酸酐、琥珀酸酐、衣康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基橋亞甲基四氫鄰苯二甲酸酐、氯菌酸酐、甲基四氫鄰苯二甲酸酐、戊二酸酐等。 　　[0035] 此外，上述式(a-1)中，Z^a 表示從四羧酸二酐除去2個酸酐基後之殘基。作為四羧酸二酐之例子，可列舉以下述式(a-4)表示之四羧酸二酐、均苯四甲酸二酐、二苯酮四羧酸二酐、聯苯四羧酸二酐、聯苯醚四羧酸二酐等。 　　此外，上述式(a-1)中，m表示0～20之整數。 　　[0036]

式(a-4)中，R^a4 、R^a5 及R^a6 分別獨立地表示選自氫原子、碳原子數1～10之烷基及氟原子之1種，m3表示0～12之整數。 　　[0037] 可選為式(a-4)中之R^a4 之烷基係碳原子數為1～10之烷基。藉由將烷基具備之碳原子數設定在該範圍，可進一步提高得到之羧酸酯之耐熱性。在R^a4 為烷基之情況下，從容易獲得耐熱性優良之卡多樹脂之觀點來看，其碳原子數較佳為1～6，更佳是1～5，進一步較佳為1～4，特別佳為1～3。 　　在R^a4 為烷基之情況下，該烷基可為直鏈狀，亦可為支鏈狀。 　　[0038] 從容易獲得耐熱性優良之卡多樹脂之觀點來看，作為式(a-4)中之R^a4 ，更佳分別獨立地為氫原子或碳原子數1～10之烷基。式(a-4)中之R^a4 進一步較佳為氫原子、甲基、乙基、正丙基或者異丙基，特別佳為氫原子或甲基。 　　因為容易調製高純度之四羧酸二酐，所以式(a-4)中之多個R^a4 較佳為相同之基。 　　[0039] 式(a-4)中之m3表示0～12之整數。經由使得m3之值為12以下，可使四羧酸二酐之純化變得容易。 　　從四羧酸二酐容易純化之觀點來看，m3之上限較佳為5，更佳為3。 　　從四羧酸二酐之化學穩定性之觀點來看，m3之下限較佳為1，更佳為2。 　　式(a-4)中之m3特別佳為2或3。 　　[0040] 可選為式(a-4)中R^a5 及R^a6 之碳原子數1～10之烷基與可選為R^a4 之碳原子數1～10之烷基相同。 　　從四羧酸二酐容易純化之觀點來看，R^a5 及R^a6 較佳為氫原子或碳原子數1～10(較佳為1～6，更佳為1～5，進一步較佳為1～4，特別佳為1～3)之烷基，特別佳為氫原子或甲基。 　　[0041] 作為以式(a-4)表示之四羧酸二酐，可列舉例如：降冰片烷-2-螺-α-環戊酮-α’-螺-2”-降冰片烷-5,5”,6,6”-四羧酸二酐(別名「降冰片烷-2-螺-2’-環戊酮-5’-螺-2”-降冰片烷-5,5”,6,6”-四羧酸二酐」)、甲基降冰片烷-2-螺-α-環戊酮-α’-螺-2”-(甲基降冰片烷)-5,5”,6,6” -四羧酸二酐、降冰片烷-2-螺-α-環己酮-α’-螺-2”-降冰片烷-5,5”,6,6”-四羧酸二酐”(別名「降冰片烷-2-螺-2’ -環己酮-6’-螺-2”-降冰片烷-5,5”,6,6” -四羧酸二酐」)、甲基降冰片烷-2-螺-α-環己酮-α’-螺-2” -(甲基降冰片烷)-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環丙酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環丁酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環丁酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環辛酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環壬酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環癸酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環十一酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環十二酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環十三酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環十四酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-環十五酮-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-(甲基環戊酮)-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐、降冰片烷-2-螺-α-(甲基環己酮)-α’-螺-2” -降冰片烷-5,5”,6,6”-四羧酸二酐等。 　　[0042] (A1)卡多樹脂之重量平均分子量較佳為1000～40000，更佳為1500～30000，進一步較佳為2000～10000。經由使(A1)卡多樹脂之重量平均分子量為上述範圍，可獲得良好之顯影性，並且獲得充分之耐熱性、膜強度。 　　[0043] [酚醛清漆樹脂(a-2)] 　　作為在主鏈中包含芳香族環之鹼可溶性樹脂，從抑制黑色基質因後烘烤時之加熱而過度地熱流動之觀點來看，較佳亦包含酚醛清漆樹脂(a-2)。 　　作為酚醛清漆樹脂(a-2)，可使用以往感光性樹脂組成物所摻合之各種酚醛清漆樹脂。作為酚醛清漆樹脂(a-2)，較佳經由使具有酚性羥基之芳香族化合物(以下，簡稱為「酚類」)與醛類在酸催化劑下加成縮合而得。 　　[0044] (酚類) 　　作為製作酚醛清漆樹脂(a-2)時所用之酚類，可列舉，例如苯酚;鄰甲酚、間甲酚、對甲酚等甲酚類；2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、2,6-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚等二甲苯酚類；鄰乙基苯酚、間乙基苯酚、對乙基苯酚等乙基苯酚類；2-異丙基苯酚、3-異丙基苯酚、4-異丙基苯酚、鄰丁基苯酚、間丁基苯酚、對丁基苯酚及對叔丁基苯酚等烷基苯酚類；2,3,5-三甲基苯酚及3,4,5-三甲基苯酚等三烷基苯酚類；間苯二酚、鄰苯二酚、對苯二酚、對苯二酚單甲基醚、連苯三酚及間苯三酚等多元酚類；烷基間苯二酚、烷基鄰苯二酚及烷基對苯二酚等烷基多元酚類(所有之烷基之碳原子數均為1以上4以下)；α-萘酚；β-萘酚；羥基聯苯及雙酚A等。此等酚類可單獨地使用，亦可組合2種以上使用。 　　[0045] 在此等酚類中，較佳間甲酚及對甲酚，更佳併用間甲酚與對甲酚。在這種情況下，經由調整二者之摻合比例，可調節使用樹脂組成物形成之黑色基質之耐熱性等諸多特性。 　　雖然間甲酚與對甲酚之摻合比例沒有特別地限定，但是以間甲酚/對甲酚之莫耳比計，較佳為3/7以上8/2以下。以上述範圍之比例使用間甲酚及對甲酚，容易獲得可形成耐熱性優良之黑色基質之樹脂組成物。 　　[0046] 此外，亦較佳併用間甲酚與2,3,5-三甲基苯酚而製造之酚醛清漆樹脂。在使用所述酚醛清漆樹脂之情況下，特別容易獲得可形成不易因後烘烤時之加熱而過度流動之黑色基質之樹脂組成物。 　　雖然甲酚與2,3,5-三甲基苯酚之摻合比例沒有特別地限定，但是以間甲酚/2,3,5-三甲基苯酚之莫耳比計,較佳70/30以上95/5以下。 　　[0047] (醛類) 　　作為製作酚醛清漆樹脂(a-2)時所用之醛類，可列舉，例如甲醛、多聚甲醛、糠醛、苯甲醛、硝基苯甲醛及乙醛等。此等醛類可單獨使用，亦可組合2種以上使用。 　　[0048] (酸催化劑) 　　作為製作酚醛清漆樹脂(a-2)時所用之酸催化劑，可列舉，例如鹽酸、硫酸、硝酸、磷酸及亞磷酸等無機酸類；甲酸、草酸、乙酸、二乙基硫酸及對甲苯磺酸等有機酸類；及乙酸鋅等金屬鹽類等。此等酸催化劑可單獨使用，亦可組合2種以上使用。 　　[0049] (分子量) 　　從使用樹脂組成物形成之黑色基質對加熱導致之流動之耐受性之觀點來看，酚醛清漆樹脂(a-2)之聚苯乙烯換算重量平均分子量(Mw；以下也簡稱為「重量平均分子量」)之下限值較佳為2000，更佳為5000，特別佳為10000，進一步較佳為15000，最佳為20000，上限值較佳為50000，更佳為45000，進一步較佳為40000，最佳為35000。 　　[0050] 作為酚醛清漆樹脂(a-2)，可組合地使用至少2種聚苯乙烯換算重量平均分子量不同之酚醛清漆樹脂。經由大小組合地使用重量平均分子量不同之樹脂，可平衡樹脂組成物之顯影性與使用樹脂組成物形成之黑色基質之耐熱性。 　　[0051] [改性環氧樹脂(a-3)] 　　從實現烘烤時更高之耐流動性及硬化膜較高之耐水性之觀點來看，作為在主鏈中包含芳香族環之(A)鹼可溶性樹脂，亦可包含作為環氧化合物(a-3a)與含不飽和基之羧酸(a-3b)之反應產物之、多元酸酐(a-3c)加成物(a-3)。所述加成物(a-3)也記作「改性環氧樹脂(a-3)」。 　　另外，在本申請之說明書及請求項書中，符合上述定義且不屬於前述具有卡多構造之樹脂(a-1)之化合物作為改性環氧樹脂(a-3)。 　　[0052] 以下，對環氧化合物(a-3a)、含不飽和基之羧酸(a-3b)及多元酸酐(a-3c)進行說明。 　　[0053] ＜環氧化合物(a-3a)＞ 　　環氧化合物(a-3a)只要是具有環氧基之化合物即可，沒有特別地限定，可為具有芳香族基之芳香族環氧化合物，亦可為不含芳香族基之脂肪族環氧化合物，較佳為具有芳香族基之芳香族環氧化合物。 　　但是，多元酸酐(a-3c)不含芳香族基之情況下，為了在主鏈中導入芳香族環，使用具有芳香族基之芳香族環氧化合物作為環氧化合物(a-3a)。 　　環氧化合物(a-3a)可為單官能環氧化合物，亦可為2官能以上之多官能環氧化合物，較佳為多官能環氧化合物。 　　[0054] 作為環氧化合物(a-3a)之具體例，可列舉雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚AD型環氧樹脂、萘型環氧樹脂及聯苯型環氧樹脂等2官能環氧樹脂；二聚酸縮水甘油基酯及三縮水甘油基酯等縮水甘油基酯型環氧樹脂；四縮水甘油基胺基二苯基甲烷、三縮水甘油基對胺基苯酚、四縮水甘油基間苯二甲胺及四縮水甘油基雙胺基甲基環己烷等縮水甘油基胺型環氧樹脂；三縮水甘油基異氰脲酸酯等雜環式環氧樹脂；間苯三酚三縮水甘油基醚、三羥基聯苯三縮水甘油基醚、三羥基苯基甲烷三縮水甘油基醚、甘油三縮水甘油基醚、2-[4-(2,3-環氧丙氧基)苯基]-2-[4-[1,1-雙[4-(2,3-環氧丙氧基)苯基]乙基]苯基]丙烷及1,3-雙[4-[1-[4-(2,3-環氧丙氧基)苯基]-1-[4-[1-[4-(2,3-環氧丙氧基)苯基]-1-甲基乙基]苯基]乙基]苯氧基]-2-丙醇等3官能型環氧樹脂；四羥基苯基乙烷四縮水甘油基醚、四縮水甘油基二苯酮、雙間苯二酚四縮水甘油基醚及四環氧丙氧基聯苯等4官能型環氧樹脂。 　　[0055] 此外，作為環氧化合物(a-3a)，較佳具有聯苯骨架之環氧化合物。 　　具有聯苯骨架之環氧化合物較佳在主鏈具有至少1個以上之以下述式(a-3a-1)表示之聯苯骨架。 　　具有聯苯骨架之環氧化合物較佳具有2個以上之環氧基之多官能環氧化合物。 　　經由使用具有聯苯骨架之環氧化合物，容易得到靈敏度與顯影性之平衡優良、可形成與基板之密著性優良之黑色基質之樹脂組成物。 　　[0056]

式(a-3a-1)中，R^a7 分別獨立地為氫原子、碳原子數1～12之烷基、鹵素原子或者可以具有取代基之苯基，j為1～4之整數。 　　[0057] 在R^a7 為碳原子數1～12之烷基之情況下，作為烷基之具體例子，可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基、異癸基、正十一烷基及正十二烷基。 　　[0058] 在R^a7 為鹵素原子之情況下，作為鹵素原子之具體例子，可列舉氟原子、氯原子、溴原子及碘原子。 　　[0059] 在R^a7 為可具有取代基之苯基之情況下，對苯基上之取代基之數量沒有特別地限定。苯基上之取代基之數量為0～5，較佳為0或者1。 　　作為取代基之例子，可列舉碳原子數1～4之烷基、碳原子數1～4之烷氧基、碳原子數2～4之脂肪族醯基、鹵素原子、氰基及硝基。 　　[0060] 作為具有以上述式(a-3a-1)所表示之聯苯骨架之環氧化合物(a-3a)，沒有特別地限定，可列舉例如以下述式(a-3a-2)所表示之環氧化合物。

式(a-3a-2)中，R^a7 及j同式(a-3a-1)，k為括弧內之單元之平均重複數，為0～10。 　　[0061] 在以式(a-3a-2)所表示之環氧化合物中，因為特別容易得到靈敏度與顯影性之平衡優良之樹脂組成物，所以較佳以下述式(a-3a-3)所表示之化合物。

式(a-3a-3)中，k同式(a-3a-2)。 　　[0062] ＜含不飽和基之羧酸(a-3b)＞ 　　在調製改性環氧化合物(a-3)時，使環氧化合物(a-3a)與含不飽和基之羧酸(a-3b)反應。 　　作為含不飽和基之羧酸(a-3b)，較佳分子中含有丙烯醯基或甲基丙烯醯基等之反應性不飽和雙鍵之單羧酸。作為上述含不飽和基之羧酸，可列舉例如丙烯酸、甲基丙烯酸、β-苯乙烯基丙烯酸、β-糠基丙烯酸、α-氰基肉桂酸、肉桂酸等。此外，含不飽和基之羧酸(a-3b)可單獨使用或者組合2種以上使用。 　　[0063] 可經由公知之方法使環氧化合物(a-3a)與含不飽和基之羧酸(a-3b)反應。作為較佳之反應方法，可列舉例如下述方法：將三乙胺、苄基乙胺等叔胺，十二烷基三甲基氯化銨、四甲基氯化銨、四乙基氯化銨、苄基三乙基氯化銨等季銨鹽、吡啶或三苯基膦等作為催化劑，使環氧化合物(a-3a)與含不飽和基之羧酸(a-3b)在有機溶劑中於50～150℃之反應溫度反應數小時到數十小時。 　　[0064] 環氧化合物(a-3a)與含不飽和基之羧酸(a-3b)在反應中之使用量之比例以環氧化合物(a-3a)之環氧當量與含不飽和基之羧酸(a-3b)之羧酸當量之比計，通常為1∶0.5～1∶2，較佳為1∶0.8～1∶1.25，特別佳為1∶0.9～1∶1.1。 　　如果環氧化合物(a-3a)之使用量與含不飽和基之羧酸(a-3b)之使用量之比例以前述當量比計為1∶0.5～1∶2，則存在交聯效率提高之傾向，從而較佳。 　　[0065] (多元酸酐(a-3c)) 　　多元酸酐(a-3c)為具有2個以上羧基之羧酸之酸酐。 　　作為多元酸酐(a-3c)，沒有特別地限定，可列舉例如馬來酸酐、琥珀酸酐、衣康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸二酐、二苯酮四甲酸二酐、3-甲基六氫鄰苯二甲酸酐、4-甲基六氫鄰苯二甲酸酐、3-乙基六氫鄰苯二甲酸酐、4-乙基六氫鄰苯二甲酸酐、 四氫鄰苯二甲酸酐、3-甲基四氫鄰苯二甲酸酐、4-甲基四氫鄰苯二甲酸酐、3-乙基四氫鄰苯二甲酸酐、4-乙基四氫鄰苯二甲酸酐、以下述式(a-3c-1)表示之化合物及以下述式(a-3c-2)表示之化合物。此外，多元酸酐(a-3c)可單獨使用，或者組合2種以上使用。 　　[0066]

式(a-3a-2)中，R^a8 表示可具有碳原子數1～10之取代基之亞烷基。 　　[0067] 作為多元酸酐(a-3c)，因為容易得到靈敏度與顯影性之平衡優良之樹脂組成物，所以較佳為具有2個以上苯環之化合物。此外，多元酸酐(a-3c)更佳包含以上述式(a-3c-1)表示之化合物及以上述式(a-3c-2)表示之化合物之至少一種。 　　[0068] 在使環氧化合物(a-3a)與含不飽和基之羧酸(a-3b)反應後使多元酸酐(a-3c)反應之方法可從公知之方法適當選擇。 　　此外，使用量比以環氧化合物(a-3a)與含不飽和基之羧酸(a-3b)之反應後之成分中之OH基之莫耳數與多元酸酐(a-3c)之酸酐基之當量比計，通常為1∶1～1∶0.1，較佳為1∶0.8～1∶0.2。經由使所述使用量比為上述範圍，容易得到顯影性良好之樹脂組成物。 　　[0069] 此外，改性環氧樹脂(a-3)之酸值以樹脂固體成分計較佳為10mgKOH/g以上且150mgKOH/g以下，更佳為70mgKOH/g以上且110mgKOH/g以下。經由使樹脂之酸值為10mgKOH/g以上，可對於顯影液得到充分之溶解性，此外經由使樹脂之酸值為150mgKOH/g以下，可得到充分之硬化性，可使表面性良好。 　　[0070] 此外，改性環氧樹脂(a-3)之重量平均分子量較佳為1000以上40000以下，更佳為2000以上30000以下。經由使重量平均分子量為1000以上，容易形成耐熱性及強度優良之黑色基質。此外，經由使重量平均分子量為40000以下，容易得到對於顯影液顯示充分之溶解性之樹脂組成物。 　　[0071] [丙烯酸系樹脂(a-4)] 　　在不妨礙本發明之目的之範圍內，(A)鹼可溶性樹脂也可包含丙烯酸系樹脂(a-4)。另外，丙烯酸類樹脂通常在主鏈中不含芳香族環，因此(A)鹼可溶性樹脂較佳不包含丙烯酸系樹脂(a-4)。 　　[0072] 作為丙烯酸系樹脂(a-4)，可使用含有來自(甲基)丙烯酸之構造單元、及/或來自(甲基)丙烯酸酯等其他單體之構造單元之丙烯酸類樹脂。(甲基)丙烯酸為丙烯酸或甲基丙烯酸。(甲基)丙烯酸酯為以下述式(a-4-1)表示之物質，只要不妨礙本發明之目的，就沒有特別地限定。 　　[0073]

[0074] 在上述式(a-4-1)中，R^a9 為氫原子或甲基，R^a10 為1價之有機基。該有機基亦可在該有機基中包含雜原子等烴基以外之鍵或取代基。此外，該有機基可為直鏈狀、支鏈狀、環狀之任一種。 　　[0075] 作為R^a10 之有機基中之烴基以外之取代基，只要不損害本發明之效果，就沒有特別地限定，可列舉鹵素原子、羥基、巰基、硫醚基、氰基、異氰基、氰醯基、異氰醯基、硫代氰醯基、異硫代氰醯基、矽烷基、矽烷醇基、烷氧基、烷氧基羰基、胺基甲醯基、硫代胺基甲醯基、硝基、亞硝基、羧基、羧酸酯基、醯基、醯氧基、亞磺基、磺基、磺酸根(sulfonato)、膦基、氧膦基、膦醯基、膦酸根(phosphonato)、羥亞胺基、烷基醚基、烷基硫醚基、芳基醚基、芳基硫醚基、胺基(-NH₂ 、-NHR、-NRR’：R及R’分別獨立地表示烴基)等。上述取代基中所含之氫原子也可被烴基取代。此外，上述取代基中所含之烴基可為直鏈狀、支鏈狀及環狀之任一種。 　　[0076] 作為R^a10 ，較佳烷基、芳基、芳烷基或雜環基，此等基可被鹵素原子、羥基、烷基或雜環基取代。此外，在此等基包含亞烷基部分之情況下，亞烷基部分可被醚鍵、硫醚鍵、酯鍵中斷。 　　[0077] 在烷基為直鏈狀或支鏈狀之情況下，其碳原子數較佳為1～20，更佳為1～15，特別佳為1～10。作為較佳之烷基之例子，可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基、異癸基等。 　　[0078] 在烷基為脂環族基或為包含脂環族基之基之情況下，作為烷基所含之較佳之脂環族基，可列舉環戊基及環己基等單環之脂環族基，或金剛烷基、降冰片基、異冰片基、三環壬基、三環癸基及四環十二烷基等多環脂環族基等。 　　[0079] 此外，丙烯酸系樹脂(a-4)亦可是為使(甲基)丙烯酸酯以外之單體聚合而成之物質。作為這樣之單體，可列舉(甲基)丙烯醯胺類、不飽和羧酸類、烯丙基化合物、乙烯基醚類、乙烯基酯類、苯乙烯類等。此等單體可單獨使用，或組合2種以上使用。 　　[0080] 作為(甲基)丙烯醯胺類，可列舉(甲基)丙烯醯胺、N-烷基(甲基)丙烯醯胺、N-芳基(甲基)丙烯醯胺、N,N-二烷基(甲基)丙烯醯胺、N,N-芳基(甲基)丙烯醯胺、N-甲基-N-苯基(甲基)丙烯醯胺、N-羥基乙基-N-甲基(甲基)丙烯醯胺等。 　　[0081] 作為不飽和羧酸類，可列舉丁烯酸等單羧酸；馬來酸、富馬酸、檸康酸、中康酸、衣康酸等二羧酸；此等二羧酸之酸酐等。 　　[0082] 作為烯丙基化合物，可列舉乙酸烯丙酯、己酸烯丙酯、辛酸烯丙酯、月桂酸烯丙酯、棕櫚酸烯丙酯、硬脂酸烯丙酯、苯甲酸烯丙酯、乙醯乙酸烯丙酯、乳酸烯丙酯等烯丙基酯類；烯丙氧基乙醇等。 　　[0083] 作為乙烯基醚類，可列舉己基乙烯基醚、辛基乙烯基醚、癸基乙烯基醚、乙基己基乙烯基醚、甲氧基乙基乙烯基醚、乙氧基乙基乙烯基醚、氯乙基乙烯基醚、1-甲基-2,2-二甲基丙基乙烯基醚、2-乙基丁基乙烯基醚、羥基乙基乙烯基醚、二乙二醇乙烯基醚、二甲基胺基乙基乙烯基醚、二乙基胺基乙基乙烯基醚、丁基胺基乙基乙烯基醚、苄基乙烯基醚、四氫糠基乙烯基醚等烷基乙烯基醚；乙烯基苯基醚、乙烯基甲苯基醚、乙烯基氯苯基醚、乙烯基-2,4-二氯苯基醚、乙烯基萘基醚、乙烯基蒽基醚等乙烯基芳基醚等。 　　[0084] 作為乙烯基酯類，可列舉丁酸乙烯酯、異丁酸乙烯酯、三甲基乙酸乙烯酯、二乙基乙酸乙烯酯、戊酸乙烯酯、己酸乙烯酯、氯乙酸乙烯酯、二氯乙酸乙烯酯、甲氧基乙酸乙烯酯、丁氧基乙酸乙烯酯、苯基乙酸乙烯酯、乙醯乙酸乙烯酯、乳酸乙烯酯、β-苯基丁酸乙烯酯、苯甲酸乙烯酯、水楊酸乙烯酯、氯苯甲酸乙烯酯、四氯苯甲酸乙烯酯、萘甲酸乙烯酯等。 　　[0085] 作為苯乙烯類，可列舉苯乙烯；甲基苯乙烯、二甲基苯乙烯、三甲基苯乙烯、乙基苯乙烯、二乙基苯乙烯、異丙基苯乙烯、丁基苯乙烯、己基苯乙烯、環己基苯乙烯、癸基苯乙烯、苄基苯乙烯、氯甲基苯乙烯、三氟甲基苯乙烯、乙氧基甲基苯乙烯、乙醯氧基甲基苯乙烯等烷基苯乙烯；甲氧基苯乙烯、4-甲氧基-3-甲基苯乙烯、二甲氧基苯乙烯等烷氧基苯乙烯；氯苯乙烯、二氯苯乙烯、三氯苯乙烯、四氯苯乙烯、五氯苯乙烯、溴苯乙烯、二溴苯乙烯、碘苯乙烯、氟苯乙烯、三氟苯乙烯、2-溴-4-三氟甲基苯乙烯、4-氟-3-三氟甲基苯乙烯等鹵代苯乙烯等。 　　[0086] 在不損害本發明目的之範圍內，對丙烯酸系樹脂(a-4)中之來自(甲基)丙烯酸之構造單元之量與來自其他單體之構造單元之量並沒有特別地限定。相對於丙烯酸類樹脂之質量，丙烯酸類樹脂(a-4)中之來自(甲基)丙烯酸之構造單元之量較佳為5～50質量%，更佳為10～30質量%。 　　[0087] 丙烯酸類樹脂(a-4)之重量平均分子量較佳為2000～50000，更佳為5000～30000。經由使丙烯酸系樹脂(a-4)之重量平均分子量為上述之範圍，存在容易獲得樹脂組成物之膜形成性能、曝光後之顯影性之平衡之傾向。 　　[0088] 相對於樹脂組成物之固態成分之總質量，(A)鹼可溶性樹脂之含量較佳為10～65質量%，更佳為15～50質量%。經由使(A)鹼可溶性樹脂之含量為上述範圍，容易獲得顯影性優良之樹脂組成物。 　　[0089] 在使用卡多樹脂(a-1)之情況下，其含量相對於樹脂組成物之固態成分之總質量較佳為5～40質量%，更佳為8～35質量%，進一步較佳為10～30質量%。 　　相對於樹脂組成物之固態成分之總質量，酚醛清漆樹脂(a-2)之含量較佳為0.2～12質量%，更佳為0.5～8質量%，進一步較佳為1～4質量%。 　　相對於樹脂組成物之固態成分之總質量，改性環氧樹脂(a-3)之含量較佳為0.2～20質量%，更佳為1～15質量%，進一步較佳2～12質量%。 　　經由使用上述範圍內之量之上述樹脂，容易得到具有期望特性之樹脂組成物。 　　[0090] ＜(B)光聚合性化合物＞ 　　樹脂組成物包含(B)光聚合性化合物。作為(B)光聚合性化合物，較佳具有乙烯性不飽和基之單體。所述單體中有單官能單體與多官能單體。 　　[0091] 作為單官能單體，可列舉(甲基)丙烯醯胺、羥甲基(甲基)丙烯醯胺、甲氧基甲基(甲基)丙烯醯胺、乙氧基甲基(甲基)丙烯醯胺、丙氧基甲基(甲基)丙烯醯胺、丁氧基甲氧基甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥基甲基(甲基)丙烯醯胺、(甲基)丙烯酸、富馬酸、馬來酸、馬來酸酐、衣康酸、衣康酸酐、檸康酸、檸康酸酐、丁烯酸、2-丙烯醯胺-2-甲基丙磺酸、叔丁基丙烯醯胺磺酸、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸2-苯氧基-2-羥基丙酯、2-(甲基)丙烯醯氧基-2-羥基丙基鄰苯二甲酸酯、丙三醇單(甲基)丙烯酸酯、(甲基)丙烯酸四氫糠基酯、二甲基胺基乙基(甲基)丙烯酸酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸2,2,2-三氟乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、鄰苯二甲酸衍生物之半(甲基)丙烯酸酯等。此等單官能單體可單獨使用或組合2種以上使用。 　　[0092] 另一方面，作為多官能單體，可列舉乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、丙三醇二(甲基)丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇五丙烯酸酯、二季戊四醇六丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、2,2-雙(4-(甲基)丙烯醯氧基二乙氧基苯基)丙烷、2,2-雙(4-(甲基)丙烯醯氧基聚乙氧基苯基)丙烷、2-羥基-3-(甲基)丙烯醯氧基丙基(甲基)丙烯酸酯、乙二醇二縮水甘油基醚二(甲基)丙烯酸酯、二乙二醇二縮水甘油基醚二(甲基)丙烯酸酯、鄰苯二甲酸二縮水甘油酯二(甲基)丙烯酸酯、丙三醇三丙烯酸酯、丙三醇多縮水甘油醚聚(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸 (即，甲苯二異氰酸酯、三甲基六亞甲基二異氰酸酯或者六亞甲基二異氰酸酯等與(甲基)丙烯酸2-羥基乙酯之反應產物)、亞甲基雙(甲基)丙烯醯胺、(甲基)丙烯醯胺亞甲基醚、多元醇與N-羥甲基(甲基)丙烯醯胺之縮合物等多官能單體、三丙烯醯基六氫均三嗪等。此等多官能單體可單獨使用或組合2種以上而使用。 　　[0093] 此等具有乙烯性不飽和基之單體中，從存在提高樹脂組成物相對於基板之密著性、樹脂組成物硬化後之強度之傾向方面考慮，較佳3官能以上之多官能單體，更佳4官能以上之多官能單體，進一步較佳5官能以上之多官能單體。 　　具體而言，較佳使用5官能以上之多官能單體，更佳使用二季戊四醇五(甲基)丙烯酸酯及/或者二季戊四醇六(甲基)丙烯酸酯。 　　[0094] 相對於樹脂組成物之固態成分之總質量，(B)光聚合性化合物在樹脂組成物中之含量較佳為1～50質量%，更佳為5～40質量%。經由使(B)光聚合性化合物在樹脂組成物中之含量為上述之範圍，存在容易獲得靈敏度、顯影性、解析度之平衡之傾向。 　　[0095] ＜(C)光聚合引發劑＞ 　　作為(C)光聚合引發劑，並沒有特別地限定，可使用目前公知之光聚合引發劑。 　　[0096] 具體而言，作為(C)光聚合引發劑，可列舉1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-1-丙酮、1-〔4-(2-羥基乙氧基)苯基〕-2-羥基-2-甲基-1-丙酮、1-(4-異丙基苯基)-2-羥基-2-甲基-1-丙酮、1-(4-十二烷基苯基)-2-羥基-2-甲基-1-丙酮、2,2-二甲氧基-1,2-二苯基-1-乙酮、雙(4-二甲基胺基苯基)酮、2-甲基-1-〔4-(甲基硫基)苯基〕-2-嗎啉基-1-丙酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮、O-乙醯基-1-[6-(2-甲基苯甲醯基)-9-乙基-9H-哢唑-3-基]乙酮肟、(9-乙基-6-硝基-9H-哢唑-3-基)[4-(2-甲氧基-1-甲基乙氧基)-2-甲基苯基]甲酮O-乙醯基肟、2-(苯甲醯基氧基亞胺基)-1-[4-(苯基硫基)苯基]-1-辛酮、2,4,6-三甲基苯甲醯基二苯基氧化膦、4-苯甲醯基-4’-甲基二甲基硫、4-二甲基胺基苯甲酸、4-二甲基胺基苯甲酸甲酯、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸丁酯、4-二甲基胺基-2-乙基己基苯甲酸、4-二甲基胺基-2-異戊基苯甲酸、苯偶醯-β-甲氧基乙基縮醛、苯偶醯二甲基縮酮、1-苯基-1,2-丙二酮-2-(O-乙氧基羰基)肟、鄰苯甲醯基苯甲酸甲酯、2,4-二乙基噻噸酮、2-氯噻噸酮、2,4-二甲基噻噸酮、1-氯-4-丙氧基噻噸酮、噻噸、2-氯噻噸、2,4-二乙基噻噸、2-甲基噻噸、2-異丙基噻噸、2-乙基蒽醌、八甲基蒽醌、1,2-苯並蒽醌、2,3-二苯基蒽醌、偶氮雙異丁腈、過氧化苯甲醯、過氧化氫異丙苯、2-巰基苯并咪唑、2-巰基苯并噁唑、2-巰基苯并噻唑、2-(鄰氯苯基)-4,5-二(間甲氧基苯基)-咪唑基二聚物、二苯酮、2-氯二苯酮、p,p’-雙二甲基胺基二苯酮、4,4’-雙二乙基胺基二苯酮、4,4’-二氯二苯酮、3,3-二甲基-4-甲氧基二苯酮、苯偶醯、苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻異丙基醚、苯偶姻正丁基醚、苯偶姻異丁基醚、苯偶姻丁基醚、苯乙酮、2,2-二乙氧基苯乙酮、對二甲基苯乙酮、對二甲基胺基苯丙酮、二氯苯乙酮、三氯苯乙酮、對叔丁基苯乙酮、對二甲基胺基苯乙酮、對叔丁基三氯苯乙酮、對叔丁基二氯苯乙酮、α,α-二氯-4-苯氧基苯乙酮、噻噸酮、2-甲基噻噸酮、2-異丙基噻噸酮、二苯并環庚酮、戊基-4-二甲基胺基苯甲酸酯、9-苯基吖啶、1,7-雙-(9-吖啶基)庚烷、1,5-雙-(9-吖啶基)戊烷、1,3-雙-(9-吖啶基)丙烷、對甲氧基三嗪、2,4,6-三(三氯甲基)均三嗪、2-甲基-4,6-雙(三氯甲基)均三嗪、2-[2-(5-甲基呋喃-2-基)乙烯基]-4,6-雙(三氯甲基)均三嗪、2-[2-(呋喃-2-基)乙烯基]-4,6-雙 (三氯甲基)均三嗪、2-[2-(4-二乙基胺基-2-甲基苯基)乙烯基]-4,6-雙(三氯甲基)均三嗪、2-[2-(3,4-二甲氧基苯基)乙烯基]-4,6-雙(三氯甲基)均三嗪、2-(4-甲氧基苯基)-4,6-雙(三氯甲基)均三嗪、2-(4-乙氧基苯乙烯基)-4,6-雙(三氯甲基)均三嗪、2-(4-正丁氧基苯基)-4,6-雙(三氯甲基)均三嗪、2,4-雙-三氯甲基-6-(3-溴-4-甲氧基)苯基均三嗪、2,4-雙-三氯甲基-6-(2-溴-4-甲氧基)苯基均三嗪、2,4-雙-三氯甲基-6-(3-溴-4-甲氧基)苯乙烯基苯基均三嗪、2,4-雙-三氯甲基-6-(2-溴-4-甲氧基)苯乙烯基苯基均三嗪等。此等光聚合引發劑可單獨使用或組合2種以上而使用。 　　[0097] 其中，從靈敏度方面考慮，特別較佳使用肟系之光聚合引發劑。肟系之光聚合引發劑中，作為特別較佳之肟系之光聚合引發劑，可列舉O-乙醯基-1-[6-(2-甲基苯甲醯基)-9-乙基-9H-哢唑-3-基]乙酮肟、1-[9-乙基-6-(吡咯-2-基羰基)-9H-哢唑-3-基] 乙酮-1-O-乙醯基肟及2-(苯甲醯基氧基亞胺基)-1-[4-(苯基硫基)苯基]-1-辛酮。 　　[0098] 作為光聚合引發劑，亦較佳使用以下述式(c1)表示之肟系化合物。

R^C1 為選自1價之有機基、胺基、鹵素、硝基及氰基之基，n1為0～4之整數，n2為0或者1，R^C2 為可具有取代基之苯基或可具有取代基之哢唑基，R^C3 為氫原子或者碳原子數1～6之烷基。 　　[0099] 在式(c1)中，在不損害本發明目的之範圍內，R^C1 並沒有特別地限定，可從各種有機基中適當地選擇。在R^C1 為有機基之情況下，作為較佳之例子，可列舉烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、飽和脂肪族醯基氧基、烷氧基羰基、可以具有取代基之苯基、可以具有取代基之苯氧基、可以具有取代基之苯甲醯基、可以具有取代基之苯氧基羰基、可以具有取代基之苯甲醯基氧基、可以具有取代基之苯基烷基、可以具有取代基之萘基、可以具有取代基之萘氧基、可以具有取代基之萘甲醯基、可以具有取代基之萘氧基羰基、可以具有取代基之萘甲醯基氧基、可以具有取代基之萘基烷基、可以具有取代基之雜環基、胺基、被1個或2個有機基取代之胺基、嗎啉-1-基及呱嗪-1-基、鹵素、硝基及氰基等。n1為2～4之整數之情況下，R^C1 可以相同或不同。此外，取代基之碳原子數不包含取代基進一步具有之取代基之碳原子數。 　　[0100] 在R^C1 為烷基之情況下，碳原子數較佳為1～20，更佳為1～6。此外，在R^C1 為烷基之情況下，可為直鏈，亦可為支鏈。作為R^C1 為烷基之情況之具體例子，可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基及異癸基等。此外，在R^C1 為烷基之情況下，烷基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵之烷基之例子，可列舉甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙氧基乙氧基乙基及甲氧基丙基等。 　　[0101] 在R^C1 為烷氧基之情況下，碳原子數較佳為1～20，更佳為1～6。此外，在R^C1 為烷氧基之情況下，可為直鏈，亦可為支鏈。作為在R^C1 為烷氧基時之具體例子，可列舉甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、仲丁氧基、叔丁氧基、正戊氧基、異戊氧基、仲戊氧基、叔戊氧基、正己氧基、正庚氧基、正辛氧基、異辛氧基、仲辛氧基、叔辛氧基、正壬氧基、異壬氧基、正癸氧基及異癸氧基等。此外，在R^C1 為烷氧基之情況下，烷氧基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵之烷氧基之例子，可列舉甲氧基乙氧基、乙氧基乙氧基、甲氧基乙氧基乙氧基、乙氧基乙氧基乙氧基、丙氧基乙氧基乙氧基及甲氧基丙氧基等。 　　[0102] 在R^C1 為環烷基或者環烷氧基時，碳原子數較佳3～10，更佳為3～6。作為R^C1 為環烷基時之具體例子，可列舉環丙基、環丁基、環戊基、環己基、環庚基及環辛基等。作為R^C1 為環烷氧基時之具體例子，可列舉環丙氧基、環丁氧基、環戊氧基、環己氧基、環庚氧基及環辛氧基等。 　　[0103] 在R^C1 為飽和脂肪族醯基或飽和脂肪族醯基氧基之情況下，碳原子數較佳為2～20，更佳為2～7。作為R^C1 為飽和脂肪族醯基時之具體例子，可列舉乙醯基、丙醯基、正丁醯基、2-甲基丙醯基、正戊醯基、2,2-二甲基丙醯基、正己醯基、正庚醯基、正辛醯基、正壬醯基、正癸醯基、正十一烷醯基、正十二烷醯基、正十三烷醯基、正十四烷醯基、正十五烷醯基及正十六烷醯基等。作為R^C1 為飽和脂肪族醯基氧基時之具體例子，可列舉乙醯基氧基、丙醯基氧基、正丁醯基氧基、2-甲基丙醯基氧基、正戊醯基氧基、2,2-二甲基丙醯基氧基、正己醯基氧基、正庚醯基氧基、正辛醯基氧基、正壬醯基氧基、正癸醯基氧基、正十一烷醯基氧基、正十二烷醯基氧基、正十三烷醯基氧基、正十四烷醯基氧基、正十五烷醯基氧基及正十六烷醯基氧基等。 　　[0104] 在R^C1 為烷氧基羰基時，碳原子數較佳為2～20，更佳為2～7。作為R^C1 為烷氧基羰基時之具體例子，可列舉甲氧基羰基、乙氧基羰基、正丙基氧基羰基、異丙基氧基羰基、正丁基氧基羰基、異丁基氧基羰基、仲丁基氧基羰基、叔丁基氧基羰基、正戊氧基羰基、異戊氧基羰基、仲戊氧基羰基、叔戊氧基羰基、正己氧基羰基、正庚氧基羰基、正辛氧基羰基、異辛氧基羰基、仲辛氧基羰基、叔辛氧基羰基、正壬氧基羰基、異壬氧基羰基、正癸氧基羰基及異癸氧基羰基等。 　　[0105] 在R^C1 為苯基烷基時，碳原子數較佳為7～20，更佳 7～10。此外，在R^C1 為萘基烷基時，碳原子數較佳為11～20，更佳為11～14。作為R^C1 為苯基烷基時之具體例子，可列舉苄基、2-苯基乙基、3-苯基丙基及4-苯基丁基。作為R^C1 為萘基烷基時之具體例子，可列舉α-萘基甲基、β-萘基甲基、2-(α-萘基)乙基及2-(β-萘基)乙基。在R^C1 為苯基烷基或者萘基烷基時，R^C1 可在苯基或萘基上進一步具有取代基。 　　[0106] 在R^C1 為雜環基時，雜環基為包含1個以上N、S、O之五元或六元之單環，或所述單環彼此縮合而成之雜環基，或所述單環與苯環縮合而成之雜環基。雜環基為縮合環時，環數為3以下。作為構成所述雜環基之雜環，可列舉呋喃、噻吩、吡咯、噁唑、異噁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡嗪、嘧啶、噠嗪、苯并呋喃、苯并噻吩、吲哚、異吲哚、吲哚嗪、苯并咪唑、苯并三唑、苯并噁唑、苯并噻唑、哢唑、嘌呤、喹啉、異喹啉、喹唑啉、酞嗪、噌啉及喹喔啉等。在R^C1 為雜環基時，雜環基可進一步具有取代基。 　　[0107] 在R^C1 為被1個或2個有機基取代之胺基時，有機基之較佳例子可列舉碳原子數1～20之烷基、碳原子數3～10之環烷基、碳原子數2～20之飽和脂肪族醯基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之碳原子數7～20之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之碳原子數11～20之萘基烷基及雜環基等。此等較佳之有機基之具體例子與R^C1 相同。作為被1個或2個有機基取代之胺基之具體例子，可列舉甲基胺基、乙基胺基、二乙基胺基、正丙基胺基、二正丙基胺基、異丙基胺基、正丁基胺基、二正丁基胺基、正戊基胺基、正己基胺基、正庚基胺基、正辛基胺基、正壬基胺基、正癸基胺基、苯基胺基、萘基胺基、乙醯基胺基、丙醯基胺基、正丁醯基胺基、正戊醯基胺基、正己醯基胺基、正庚醯基胺基、正辛醯基胺基、正癸醯基胺基、苯甲醯基胺基、α-萘甲醯基胺基及β-萘甲醯基胺基等。 　　[0108] 作為R^C1 中包含之苯基、萘基及雜環基進一步具有取代基時之取代基，可列舉碳原子數1～6之烷基、碳原子數1～6之烷氧基、碳原子數2～7之飽和脂肪族醯基、碳原子數2～7之烷氧基羰基、碳原子數2～7之飽和脂肪族醯基氧基、具有碳原子數1～6之烷基之單烷基胺基、具有碳原子數1～6之烷基之二烷基胺基、嗎啉-1-基、呱嗪-1-基、鹵素、硝基及氰基等。在R^C1 中包含之苯基、萘基及雜環基進一步具有取代基之情況下，該取代基之數目在不妨礙本發明之目的之範圍內不受限制，但較佳為1～4。R^C1 中包含之苯基、萘基及雜環基具有多個取代基時，多個取代基可相同亦可不同。 　　[0109] R^C1 中，從化學性質穩定、空間位阻少、肟酯化合物之合成容易等方面考慮，較佳選自碳原子數1～6之烷基、碳原子數1～6之烷氧基及碳原子數2～7之飽和脂肪族醯基之基，更佳碳原子數1～6之烷基，特別佳甲基。 　　[0110] 對於R^C1 所鍵結之苯基，將苯基與肟酯化合物之主骨架之鍵結位置作為1 位，將甲基之位置作為2位時，R^C1 在苯基上鍵結之位置較佳為4位或5位，更優選是5位。此外，n1較佳為0～3之整數，更佳為0～2之整數，特別較佳為0或1。 　　[0111] R^C2 為可具有取代基之苯基，或是可具有取代基之哢唑基。此外，在R^C2 為可具有取代基之哢唑基之情況下，哢唑基上之氮原子可被碳原子數1～6之烷基取代。 　　[0112] 在R^C2 中，在不妨礙本發明目的之範圍內，苯基或哢唑基具有之取代基並沒有特別地限定。作為苯基或哢唑基可在碳原子上具有之較佳之取代基之例子，可列舉碳原子數1～20之烷基、碳原子數1～20之烷氧基、碳原子數3～10之環烷基、碳原子數3～10之環烷氧基、 碳原子數2～20之飽和脂肪族醯基、碳原子數2～20之烷氧基羰基、碳原子數2～20之飽和脂肪族醯基氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯基硫基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯基氧基、可具有取代基之碳原子數7～20之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯基氧基、可具有取代基之碳原子數11～20之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、胺基、被1個或2個有機基取代之胺基、嗎啉-1-基及呱嗪-1-基、鹵素、硝基及氰基等。 　　[0113] 在R^C2 為哢唑基之情況下，作為哢唑基可在氮原子上具有之較佳之取代基之例子，可列舉碳原子數1～20之烷基、碳原子數3～10之環烷基、碳原子數2～20之飽和脂肪族醯基、碳原子數2～20之烷氧基羰基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之碳原子數7～20之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之碳原子數11～20之萘基烷基、可以具有取代基之雜環基及可具有取代基之雜環基羰基等。在此等取代基中，較佳碳原子數1～20之烷基，更佳選碳原子數1～6之烷基，特別佳乙基。 　　[0114] 對於苯基或哢唑基可具有之取代基之具體例子，關於烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯基氧基、可具有取代基之苯基烷基、可具有取代基之萘基烷基、可具有取代基之雜環基及被1個或2個有機基取代之胺胺基，與 R^C1 相同。 　　[0115] 在R^C2 中，作為苯基或哢唑基所具有之取代基中包含之苯基、萘基及雜環基進一步具有取代基時之取代基之例子，可列舉碳原子數1～6之烷基；碳原子數1～6之烷氧基；碳原子數2 ～7之飽和脂肪族醯基；碳原子數2～7之烷氧基羰基；碳原子數2～7之飽和脂肪族醯基氧基；苯基；萘基；苯甲醯基；萘甲醯基；被選自碳原子數1～6之烷基、嗎啉-1-基、呱嗪-1- 基及苯基中之基取代之苯甲醯基；具有碳原子數1～6之烷基之單烷基胺基；具有碳原子數1～6之烷基之二烷基胺基；嗎啉-1-基；呱嗪-1-基；鹵素；硝基；氰基。苯基或者哢唑基所具有之取代基中包含之苯基、萘基及雜環基進一步具有取代基時，該取代基之數目在不妨礙本發明之目的之範圍內不受限制，但較佳為1～4。苯基、萘基及雜環基具有多個取代基時，多個取代基可相同亦可以不同。 　　[0116] 在R^C2 中，從容易得到靈敏度優良之光聚合引發劑之觀點來看，較佳以下述式(c2)或(c3)表示之基，更佳以下述式(c2)表示之基，特別佳以下述式(c2)表示且A為S之基。 　　[0117]

R^c4 為選自1價之有機基、胺基、鹵素、硝基及氰基之基，A為S或者O，n3為0～4之整數。 　　[0118]

R^c5 及R^c6 分別為1價之有機基。 　　[0119] 在式(c2)中之R^c4 為有機基之情況下，在不妨礙本發明目的之範圍內，可從各種之有機基中進行選擇。在式(c2)中，作為R^c4 為有機基時之較佳例子，可列舉碳原子數1～6之烷基；碳原子數1～6之烷氧基；碳原子數2 ～7之飽和脂肪族醯基；碳原子數2～7之烷氧基羰基；碳原子數2～7之飽和脂肪族醯基氧基；苯基；萘基；苯甲醯基；萘甲醯基；被選自碳原子數1～6之烷基、嗎啉-1-基、呱嗪-1-基及苯基中之基取代之苯甲醯基；具有碳原子數1～6之烷基之單烷基胺基；具有碳原子數1～6之烷基之二烷基胺基；嗎啉-1-基；呱嗪-1-基；鹵素；硝基；氰基。 　　[0120] 在R^c4 中，較佳苯甲醯基；萘甲醯基；被選自碳原子數1～6之烷基、嗎啉-1-基、呱嗪-1-基及苯基中之基取代之苯甲醯基、硝基，更佳苯甲醯基；萘甲醯基；2-甲基苯基羰基；4-(呱嗪-1-基)苯基羰基；4-(苯基)苯基羰基。 　　[0121] 此外，在式(c2)中，n3較佳0～3之整數，更佳為0～2之整數，特別佳為0或1。在n3為1之情況下，R^c4 鍵結之位置相對於R^c4 所鍵結之苯基與氧原子或者硫原子鍵結之位置較佳為對位。 　　[0122] 在不妨礙本發明目的之範圍內，式(c3)中之R^c5 可從各種之有機基中進行選擇。作為R^c5 之較佳例子，可列舉碳原子數1～20之烷基、碳原子數3～10之環烷基、碳原子數2～20之飽和脂肪族醯基、碳原子數2～20之烷氧基羰基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之碳原子數7～20之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之碳原子數11～20之萘基烷基、可具有取代基之雜環基及可具有取代基之雜環基羰基等。 　　[0123] 在R^c5 中，較佳碳原子數1～20之烷基，更佳碳原子數1～6之烷基，特別佳乙基。 　　[0124] 在不妨礙本發明目的之範圍內並沒有特別地限定，式(c3)中之R^c6 可從各種之有機基中進行選擇。作為R^c6 之較佳之基之具體例子，可列舉碳原子數1～20之烷基、可具有取代基之苯基、可具有取代基之萘基及可具有取代基之雜環基。作為R^c6 ，在此等基之中，更佳可具有取代基之苯基，特別佳2-甲基苯基。 　　[0125] 作為R^c4 、R^c5 或者R^c6 中包含之苯基、萘基及雜環基進一步具有取代基時之取代基，可列舉碳原子數1～6之烷基、碳原子數1～6之烷氧基、碳原子數2～7之飽和脂肪族醯基、碳原子數2～7之烷氧基羰基、碳原子數2～7之飽和脂肪族醯基氧基、具有碳原子數1～6之烷基之單烷基胺基、具有碳原子數1～6之烷基之二烷基胺胺基、嗎啉-1-基、呱嗪-1-基、鹵素、硝基及氰基等。R^c4 、R^c5 或者R^c6 中包含之苯基、萘基及雜環基進一步具有取代基時，其取代基之數目在不妨礙本發明之目的之範圍內不受限制，但較佳為1～4。R^c4 、R^c5 或者R^c6 中包含之苯基、萘基及雜環基具有多個取代基時，多個取代基可相同亦可不同。 　　[0126] 式(c1)中之R^c3 為氫原子或碳原子數1～6之烷基。作為R^c3 ，較佳甲基或者乙基，特別較佳甲基。 　　[0127] 作為以式(c1)表示之肟酯化合物中特別較佳之化合物，可列舉下述之PI-1～PI-42。

[0128]

[0129]

[0130]

[0131]

[0132]

[0133] 此外，以下述式(c4)表示之肟酯化合物亦較佳作為光聚合引發劑。 　　[0134]

R^c7 為氫原子、硝基或1價之有機基，R^c8 及R^c9 分別為可具有取代基之鏈狀烷基、可具有取代基之環狀有機基或氫原子，R^c8 與R^c9 可相互鍵結而形成環，R^c10 為1價之有機基，R^c11 為氫原子、可具有取代基之碳原子數1～11之烷基或者可具有取代基之芳基，n4為0～4之整數，n5為0或者1。 　　[0135] 於此，作為用於製造式(c4)之肟酯化合物之肟化合物，較佳以下述式(c5)表示之化合物。 　　[0136]

R^c7 、R^c8 、R^c9 、R^c10 、n4及n5與式(c4)相同。 　　[0137] 式(c4)及(c5)中，R^c7 為氫原子、硝基或1價之有機基。R^c7 在式(c4)中之芴環上與以-(CO)_n5 -表示之基所鍵結之6元芳香環不同之6元芳香環鍵結。在式(c4)中，R^c7 相對於芴環之鍵結位置沒有特別地限定。在以式(c4)表示之化合物具有1個以上之R^c7 之情況下，從以式(c4)表示之化合物之合成容易等方面考慮，較佳1個以上之R^c7 中之一個鍵結於芴環中之2位。在R^c7 為多個之情況下，多個R^c7 可以相同亦可不同。 　　[0138] 在R^c7 為有機基之情況下，R^c7 在不妨礙本發明目的之範圍內沒有特別地限定，可從各種有機基中適當地選擇。作為R^c7 為有機基時之較佳例子，可列舉烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、飽和脂肪族醯基氧基、烷氧基羰基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯基氧基、可具有取代基之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯基氧基、可具有取代基之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、被1個或2個有機基取代之胺基、嗎啉-1-基及呱嗪-1-基等。 　　[0139] 在R^C7 為烷基之情況下，烷基之碳原子數較佳為1～20，更佳為1～6。此外，在R^C7 為烷基之情況下，可為直鏈，亦可為支鏈。作為R^C7 為烷基時之具體例子，可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基及異癸基等。此外，在R^C7 為烷基之情況下，烷基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵之烷基之例子，可列舉甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙氧基乙氧基乙基及甲氧基丙基等。 　　[0140] 在R^C7 為烷氧基之情況下，烷氧基之碳原子數較佳為1～20，更佳為1～6。此外，在R^C7 為烷氧基之情況下，可為直鏈，亦可為支鏈。作為R^C7 為烷氧基時之具體例子，可列舉甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、仲丁氧基、叔丁氧基、正戊氧基、異戊氧基、仲戊氧基、叔戊氧基、正己氧基、正庚氧基、正辛氧基、異辛氧基、仲辛氧基、叔辛氧基、正壬氧基、異壬氧基、正癸氧基及異癸氧基等。此外，在R^C7 為烷氧基之情況下，烷氧基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵之烷氧基之例子，可列舉甲氧基乙氧基、乙氧基乙氧基、甲氧基乙氧基乙氧基、乙氧基乙氧基乙氧基、丙氧基乙氧基乙氧基及甲氧基丙氧基等。 　　[0141] 在R^C7 為環烷基或者環烷氧基時，環烷基或環烷氧基之碳原子數較佳為3～10，更佳為3～6。作為R^C7 為環烷基時之具體例子，可列舉環丙基、環丁基、環戊基、環己基、環庚基及環辛基等。作為R^C7 為環烷氧基時之具體例子，可列舉環丙氧基、環丁氧基、環戊氧基、環己氧基、環庚氧基及環辛氧基等。 　　[0142] 在R^C7 為飽和脂肪族醯基或者脂肪族醯基氧基之情況下，飽和脂肪族醯基或脂肪族醯基氧基之碳原子數較佳為2～21，更佳為2～7。作為R^C7 為飽和脂肪族醯基時之具體例子，可列舉乙醯基、丙醯基、正丁醯基、2-甲基丙醯基、正戊醯基、2,2-二甲基丙醯基、正己醯基、正庚醯基、正辛醯基、正壬醯基、正癸醯基、正十一烷醯基、正十二烷醯基、正十三烷醯基、正十四烷醯基、正十五烷醯基及正十六烷醯基等。作為R^C7 為飽和脂肪族醯基氧基時之具體例子，可列舉乙醯基氧基、丙醯基氧基、正丁醯基氧基、2-甲基丙醯基氧基、正戊醯基氧基、2,2-二甲基丙醯基氧基、正己醯基氧基、正庚醯基氧基、正辛醯基氧基、正壬醯基氧基、正癸醯基氧基、正十一烷醯基氧基、正十二烷醯基氧基、正十三烷醯基氧基、正十四烷醯基氧基、正十五烷醯基氧基及正十六烷醯基氧基等。 　　[0143] 在R^C7 為烷氧基羰基時，烷氧基羰基之碳原子數較佳為2～20，更佳為2～7。作為R^C7 為烷氧基羰基時之具體例子，可列舉甲氧基羰基、乙氧基羰基、正丙氧基羰基、異丙氧基羰基、正丁氧基羰基、異丁氧基羰基、仲丁氧基羰基、叔丁氧基羰基、正戊氧基羰基、異戊氧基羰基、仲戊氧基羰基、叔戊氧基羰基、正己氧基羰基、正庚氧基羰基、正辛氧基羰基、異辛氧基羰基、仲辛氧基羰基、叔辛氧基羰基、正壬氧基羰基、異壬氧基羰基、正癸氧基羰基及異癸氧基羰基等。 　　[0144] 在R^C7 為苯基烷基時，苯基烷基之碳原子數較佳為7～20，更佳7～10。此外，在R^C7 為萘基烷基時，萘基烷基之碳原子數較佳為11～20，更佳為11～14。作為R^C7 為苯基烷基時之具體例子，可列舉苄基、2-苯基乙基、3-苯基丙基及4-苯基丁基。作為R^C7 為萘基烷基時之具體例子，可列舉α-萘基甲基、β-萘基甲基、2-(α-萘基)乙基及2-(β-萘基)乙基。在R^C7 為苯基烷基或者萘基烷基時，R^C7 可在苯基或萘基上進一步具有取代基。 　　[0145] 在R^C7 為雜環基時，雜環基為包含1個以上N、S、O之五元或六元之單環，或者所述單環彼此縮合而成之雜環基，或所述單環與苯環縮合而成之雜環基。雜環基為縮合環時，環數為3以下。雜環基可為芳香族基(雜芳基)，亦可為非芳香族基。作為構成所述雜環基之雜環，可列舉呋喃、噻吩、吡咯、噁唑、異噁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡嗪、嘧啶、噠嗪、苯并呋喃、苯并噻吩、吲哚、異吲哚、吲哚嗪、苯并咪唑、苯并三唑、苯并噁唑、苯并噻唑、哢唑、嘌呤、喹啉、異喹啉、喹唑啉、酞嗪、噌啉、喹喔啉、呱啶、呱嗪、嗎啉、呱啶、四氫吡喃及四氫呋喃等。在R^C7 為雜環基時，雜環基可進一步具有取代基。 　　[0146] 在R^C7 為雜環基羰基時，雜環基羰基所含之雜環基與R^C7 為雜環基時相同。 　　[0147] 在R^C7 為被1個或2個有機基取代之胺基時，有機基之較佳例子可列舉碳原子數1～20之烷基、碳原子數3～10之環烷基、碳原子數2～21之飽和脂肪族醯基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之碳原子數7～20之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之碳原子數11～20之萘基烷基及雜環基等。此等較佳之有機基之具體例子與R^C7 相同。作為被1個或2個有機基取代之胺基之具體例子，可列舉甲基胺基、乙基胺基、二乙基胺基、正丙基胺基、二正丙基胺基、異丙基胺基、正丁基胺基、二正丁基胺基、正戊基胺基、正己基胺基、正庚基胺基、正辛基胺基、正壬基胺基、正癸基胺基、苯基胺基、萘基胺基、乙醯基胺基、丙醯基胺基、正丁醯基胺基、正戊醯基胺基、正己醯基胺基、正庚醯基胺基、正辛醯基胺基、正癸醯基胺基、苯甲醯基胺基、α-萘甲醯基胺基及β-萘甲醯基胺基等。 　　[0148] 作為R^C7 中包含之苯基、萘基及雜環基進一步具有取代基時之取代基，可列舉碳原子數1～6之烷基、碳原子數1～6之烷氧基、碳原子數2～7之飽和脂肪族醯基、碳原子數2～7之烷氧基羰基、碳原子數2～7之飽和脂肪族醯基氧基、具有碳原子數1～6之烷基之單烷基胺基、具有碳原子數1～6之烷基之二烷基胺基、嗎啉-1-基、呱嗪-1-基、鹵素、硝基及氰基等。在R^C7 中包含之苯基、萘基及雜環基進一步具有取代基之情況下，該取代基之數目在不妨礙本發明之目的之範圍內不受限制，但較佳為1～4。R^C7 中包含之苯基、萘基及雜環基具有多個取代基時，多個取代基可相同亦可不同。 　　[0149] 在以上說明之基之中，若R^C7 為硝基或以R^c12 -CO-表示之基，則存在靈敏度提高之傾向，從而較佳。在不妨礙本發明目的之範圍內，R^c12 沒有特別限定，可從各種有機基中選擇。作為R^c12 較佳之基之例子，可列舉碳原子數1～20之烷基、可具有取代基之苯基、可具有取代基之萘基及可以具有取代基之雜環基。作為R^c12 ，在此等基之中，特別較佳2-甲基苯基、噻吩-2-基及α-萘基。 　　此外，若R^C7 為氫原子，則存在透明性良好之傾向，從而較佳。另外，若R^C7 為氫原子且R^C10 為後述之以式(c4a)或(c4b)表示之基，則存在透明性更良好之傾向。 　　[0150] 式(c4)中，R^c8 及R^c9 分別為可具有取代基之鏈狀烷基、可具有取代基之環狀有機基或氫原子。R^c8 與R^c9 亦可相互鍵結而形成環。在此等基之中，作為R^c8 及R^c9 ，較佳可具有取代基之鏈狀烷基。在R^c8 及R^c9 為可具有取代基之鏈狀烷基之情況下，鏈狀烷基可為直鏈烷基，亦可為支鏈烷基。 　　[0151] 在R^c8 及R^c9 為不具有取代基之鏈狀烷基之情況下，鏈狀烷基之碳原子數較佳為1～20，更佳為1～10，特別較佳1～6。作為R^c8 及R^c9 為鏈狀烷基時之具體例子，可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基及異癸基等。此外，在R^c8 及R^c9 為烷基之情況下，烷基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵之烷基之例子，可列舉甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙基氧基乙氧基乙基及甲氧基丙基等。 　　[0152] 在R^c8 及R^c9 為具有取代基之鏈狀烷基之情況下，鏈狀烷基之碳原子數較佳為1～20，更佳為1～10，特別佳為1～6。在該情況下，鏈狀烷基之碳原子數不包含取代基之碳原子數。具有取代基之鏈狀烷基，較佳為直鏈狀。 　　在不妨礙本發明目的之範圍內，烷基可具有之取代基並沒有特別地限定。作為取代基之較佳之例子，可列舉氰基、鹵素原子、環狀有機基及烷氧基羰基。作為鹵素原子，可列舉氟原子、氯原子、溴原子、碘原子。在此等原子之中，較佳為氟原子、氯原子、溴原子。作為環狀有機基，可列舉環烷基、芳香族烴基、雜環基。作為環烷基之具體例子，與R^c7 為環烷基時較佳之例子相同。作為芳香族烴基之具體例子，可列舉苯基、萘基、聯苯基、蒽基及菲基等。作為雜環基之具體例子，與R^c7 為雜環基時較佳之例子相同。在R^c7 為烷氧基羰基時，烷氧基羰基所含之烷氧基可為直鏈狀，亦可為支鏈狀，較佳為直鏈狀。烷氧基羰基所含之烷氧基之碳原子數較佳為1～10，更佳為1～6。 　　[0153] 在鏈狀烷基具有取代基之情況下，取代基之數量沒有特別地限定。較佳之取代基之數量根據鏈狀烷基之碳原子數而改變。典型之取代基之數量為1～20，較佳為1～10，更佳為1～6。 　　[0154] 在R^c8 及R^c9 為環狀有機基之情況下，環狀有機基可為脂環族基，亦可為芳香族基。作為環狀有機基，可列舉脂肪族環狀烴基、芳香族烴基、雜環基。在R^c8 及R^c9 為環狀有機基之情況下，環狀有機基可具有之取代基與R^c8 及R^c9 為鏈狀烷基時相同。 　　[0155] 在R^c8 及R^c9 為芳香族烴基之情況下，芳香族烴基較佳為苯基，或多個苯環經由碳-碳鍵鍵結而成之基，或多個苯環縮合而形成之基。在芳香族烴基為苯基或多個苯環鍵結或縮合形成之基之情況下，芳香族烴基所含之苯環之環數沒有特別地限定，但較佳為3以下，更佳為2以下，特別佳為1。作為芳香族烴基較佳之具體例子，可列舉苯基、萘基、聯苯基、蒽基及菲基等。 　　[0156] 在R^c8 及R^c9 為脂肪族環狀烴基之情況下，脂肪族環狀烴基可為單環式，亦可為多環式。脂肪族環狀烴基之碳原子數並沒有特別限定，但較佳為3～20，更佳為3～10。作為單環式之環狀烴基之例子，可列舉環丙基、環丁基、環戊基、環己基、環庚基、環辛基、降冰片基、異冰片基、三環壬基、三環癸基、四環十二烷基及金剛烷基等。 　　[0157] 在R^c8 及R^c9 為雜環基之情況下，雜環基為包含1個以上N、S、O之五元或六元之單環，或者所述單環彼此縮合而成之雜環基，或者所述單環與苯環縮合而成之雜環基。雜環基為縮合環時，環數為3以下。雜環基可為芳香族基(雜芳基)，亦可為非芳香族基。作為構成所述雜環基之雜環，可列舉呋喃、噻吩、吡咯、噁唑、異噁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡嗪、嘧啶、噠嗪、苯并呋喃、苯并噻吩、吲哚、異吲哚、吲哚嗪、苯并咪唑、苯并三唑、苯并噁唑、苯并噻唑、哢唑、嘌呤、喹啉、異喹啉、喹唑啉、酞嗪、噌啉、喹喔啉、呱啶、呱嗪、嗎啉、呱啶、四氫吡喃及四氫呋喃等。 　　[0158] R^c8 及R^c9 亦可相互地鍵結形成環。由R^c8 與R^c9 形成之環構成之基較佳為亞環烷基。在R^c8 與R^c9 鍵結形成亞環烷基之情況下，構成亞環烷基之環較佳為五元環～六元環，更佳為五元環。 　　[0159] 在R^c8 與R^c9 鍵結而形成之基為亞環烷基之情況下，亞環烷基亦可為與1個以上之其他之環縮合。作為可以與亞環烷基縮合之環之例子，可列舉苯環、萘環、環丁烷環、環戊烷環、環己烷環、環庚烷環、環辛烷環、呋喃環、噻吩環、吡咯環、吡啶環、吡嗪環及嘧啶環等。 　　[0160] 作為以上說明之R^c8 及R^c9 之中較佳之基之例子，可列舉以式-A¹ -A² 表示之基。式中，A¹ 為直鏈亞烷基，A² 可列舉烷氧基、氰基、鹵素原子、鹵代烷基、環狀有機基及烷氧基羰基。 　　[0161] A¹ 之直鏈亞烷基之碳原子數較佳為1～10，更佳為1～6。在A² 為烷氧基之情況下，烷氧基可為直鏈狀，亦可為支鏈狀，較佳為直鏈狀。烷氧基之碳原子數較佳為1～10，更佳為1～6。在A² 為鹵素原子之情況下，較佳氟原子、氯原子、溴原子、碘原子，更佳氟原子、氯原子、溴原子。在A² 為鹵代烷基之情況下，鹵代烷基所含之鹵素原子較佳氟原子、氯原子、溴原子、碘原子，更佳氟原子、氯原子、溴原子。鹵代烷基可為直鏈狀，亦可為支鏈狀，較佳為直鏈狀。在A² 為環狀有機基之情況下，環狀有機基之例子與R^c8 及R^c9 作為取代基具有之環狀有機基相同。在A² 為烷氧基羰基之情況下，烷氧基羰基之例子與R^c8 及R^c9 作為取代基具有之烷氧基羰基相同。 　　[0162] 作為R^c8 及R^c9 較佳之具體例子，可列舉乙基、正丙基、正丁基、正己基、正庚基及正辛基等烷基；2-甲氧基乙基、3-甲氧基正丙基、4-甲氧基正丁基、5-甲氧基正戊基、6-甲氧基正己基、7-甲氧基正庚基、8-甲氧基正辛基、2-乙氧基乙基、3-乙氧基正丙基、4-乙氧基正丁基、5-乙氧基正戊基、6-乙氧基正己基、7-乙氧基正庚基及8-乙氧基正辛基等烷氧基烷基；2-氰基乙基、3-氰基正丙基、4-氰基正丁基、5-氰基正戊基、6-氰基正己基、7-氰基正庚基及8-氰基正辛基等氰基烷基；2-苯基乙基、3-苯基正丙基、4-苯基正丁基、5-苯基正戊基、6-苯基正己基、7-苯基正庚基及8-苯基正辛基等苯基烷基；2-環己基乙基、3-環己基正丙基、4-環己基正丁基、5-環己基正戊基、6-環己基正己基、7-環己基正庚基、8-環己基正辛基、2-環戊基乙基、3-環戊基正丙基、4-環戊基正丁基、5-環戊基正戊基、6-環戊基正己基、7-環戊基正庚基及8-環戊基正辛基等環烷基烷基；2-甲氧基羰基乙基、3-甲氧基羰基正丙基、4-甲氧基羰基正丁基、5-甲氧基羰基正戊基、6-甲氧基羰基正己基、7-甲氧基羰基正庚基、8-甲氧基羰基正辛基、2-乙氧基羰基乙基、3-乙氧基羰基正丙基、4-乙氧基羰基正丁基、5-乙氧基羰基正戊基、6-乙氧基羰基正己基、7-乙氧基羰基正庚基及8-乙氧基羰基正辛基等烷氧基羰基烷基；2-氯乙基、3-氯正丙基、4-氯正丁基、5-氯正戊基、6-氯正己基、7-氯正庚基、8-氯正辛基、2-溴乙基、3-溴正丙基、4-溴正丁基、5-溴正戊基、6-溴正己基、7-溴正庚基、8-溴正辛基、3,3,3-三氟丙基及3,3,4,4,5,5,5-七氟正戊基等鹵代烷基。 　　[0163] 作為R^c8 及R^c9 ，上述中較佳之基為乙基、正丙基、正丁基、正戊基、2-甲氧基乙基、2-氰基乙基、2-苯基乙基、2-環己基乙基、2-甲氧基羰基乙基、2-氯乙基、2-溴乙基、3,3,3-三氟丙基及3,3,4,4,5,5,5-七氟正戊基。 　　[0164] 作為R^c10 較佳之有機基之例子，如R^c7 同樣地，可列舉烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯基氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯基氧基、可具有取代基之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯基氧基、可具有取代基之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、被1個或2個有機基取代之胺基、嗎啉-1-基及呱嗪-1-基等。此等基之具體例子與R^c7 之說明相同。此外，作為R^c10 ，亦較佳環烷基烷基、可在芳香環上具有取代基之苯氧基烷基、可在芳香環上具有取代基之苯基硫基烷基。苯氧基烷基及苯基硫基烷基可具有之取代基與R^c7 所含之苯基可具有之取代基相同。 　　[0165] 在有機基中，作為R^c10 ，較佳烷基、環烷基、可具有取代基之苯基、或環烷基烷基、可在芳香環上具有取代基之苯基硫基烷基。作為烷基，較佳碳原子數1～20之烷基，更佳碳原子數1～8之烷基，特別佳碳原子數1～4之烷基，最佳甲基。可具有取代基之苯基中，較佳甲基苯基，更佳2-甲基苯基。環烷基烷基中包含之環烷基之碳原子數較佳為5～10，更佳為5～8，特別佳為5或6。環烷基烷基中包含之亞烷基之碳原子數較佳為1～8，更佳為1～4，特別佳為2。環烷基烷基中，較佳環戊基乙基。可在芳香環上具有取代基之苯基硫基烷基中包含之亞烷基之碳原子數較佳為1～8，更佳為1～4，特別較佳為2。可在芳香環上具有取代基之苯基硫基烷基中，較佳2-(4-氯苯基硫基)乙基。 　　[0166] 此外，作為R^c10 ，亦較佳以-A³ -CO-O-A⁴ 表示之基。A³ 為2價之有機基，較佳為2價之烴基，較佳為亞烷基。A⁴ 為1價之有機基，較佳為1價之烴基。 　　[0167] 在A³ 為亞烷基之情況下，亞烷基可為直鏈狀，亦可為支鏈狀，較佳為直鏈狀。在A³ 為亞烷基之情況下，亞烷基之碳原子數較佳為1～10，更佳為1～6，特別佳為1～4。 　　[0168] 作為A⁴ 之較佳例子，可列舉碳原子數1～10之烷基、碳原子數7～20之芳烷基及碳原子數6～20之芳香族烴基。作為A⁴ 之較佳之具體例子，可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、正己基、苯基、萘基、苄基、苯乙基、α-萘基甲基及β-萘基甲基等。 　　[0169] 作為以-A³ -CO-O-A⁴ 表示之基之較佳之具體例子，可列舉2-甲氧基羰基乙基、2-乙氧基羰基乙基、2-正丙氧基羰基乙基、2-正丁氧基羰基乙基、2-正戊氧基羰基乙基、2-正己氧基羰基乙基、2-苄氧基羰基乙基、2-苯氧基羰基乙基、3-甲氧基羰基正丙基、3-乙氧基羰基正丙基、3-正丙氧基羰基正丙基、3-正丁氧基羰基正丙基、3-正戊氧基羰基正丙基、3-正己氧基羰基正丙基、3-苄氧基羰基正丙基及3-苯氧基羰基正丙基等。 　　[0170] 以上，雖然對R^c10 進行了說明，但是作為R^c10 ，較佳以下述式(c4a)或(c4b)表示之基。

式(c4a)及(c4b)中，R^c13 及R^c14 分別為有機基，n6為0～4之整數，在R^c13 及R^c8 存在於苯環上之相鄰位置時，R^c13 與R^c14 可以相互地鍵結形成環，n7為1～8之整數，n8為1～5之整數，n9為0～(n8+3)之整數，R^c15 為有機基。 　　[0171] 關於式(c4a)中之R^c13 及R^c14 之有機基之例子與R^c7 相同。作為R^c13 ，較佳烷基或者苯基。在R^c13 為烷基之情況下，其碳原子數較佳為1～10，更佳為1～5，特別佳為1～3，最佳為1。即，R^c13 最佳為甲基。在R^c13 與R^c14 鍵結地形成環之情況下，該環可為芳香族環，亦可為脂肪族環。作為以式(c4a)表示且R^c13 與R^c14 形成環之基之較佳之例子，可列舉萘-1-基、1,2,3,4-四氫萘-5-基等。上述式(c4a)中，n6為0～4之整數，較佳為0或1，更佳為0。 　　[0172] 上述式(c4b)中，R^c15 為有機基。作為有機基，可列舉與針對R^c7 而說明之有機基同樣之基。在有機基中，較佳烷基。烷基可為直鏈狀，亦可為支鏈狀。烷基之碳原子數較佳為1～10，更佳為1～5，特別佳為1～3。作為R^c15 ，可較佳例示甲基、乙基、丙基、異丙基、丁基等，在此等基中更佳甲基。 　　[0173] 上述式(c4b)中，n8為1～5之整數，較佳為1～3之整數，更佳為1或2。上述式(c4b)中，n9為0～(n8+3)，較佳為0～3之整數，更佳為0～2之整數，特別佳為0。上述式(c4b)中，n7為1～8之整數，較佳為1～5之整數，更佳為1～3之整數，特別較佳為1或2。 　　[0174] 式(c4)中，R^c11 為氫原子、可具有取代基之碳原子數1～11之烷基、或者可具有取代基之芳基。作為R^c11 為烷基時可具有之取代基，可較佳例舉苯基、萘基等。此外，作為R^c7 為芳基時可以具有之取代基，可較佳例舉碳原子數1～5之烷基、烷氧基、鹵素原子等。 　　[0175] 式(c4)中，作為R^c11 ，可較佳例舉氫原子、甲基、乙基、正丙基、異丙基、正丁基、苯基、苄基、甲基苯基、萘基等，在此等基中更較佳甲基或苯基。 　　[0176] 以式(c4)表示之化合物經由包含下述步驟之方法製造：將所述以式(c5)表示之化合物所含之肟基(＞C=N-OH)轉化為以＞C=N-O-COR^c11 表示之肟酯基。R^c11 與式(c4)中之R^c11 相同。 　　[0177] 從肟基(＞C=N-OH)向以＞C=N-O-COR^c11 表示之肟酯基之轉化經由使前述以式(c5)表示之化合物與醯化劑反應而進行。 　　作為提供以-COR^c11 表示之醯基之醯化劑，可列舉以(R^c11 C0)₂ O表示之酸酐、以R^c11 COHal(Hal為鹵素原子)表示之醯鹵。 　　[0178] 作為以式(c4)表示之化合物較佳之具體例子，可列舉以下之PI-43～PI-83。

[0179]

[0180] 相對於樹脂組成物之固態成分之總質量，(C)光聚合引發劑之含量較佳為0.5～30質量%，更佳為1～20質量%。經由使(C)光聚合引發劑之含量為上述範圍，可得到不易產生圖案形狀不良之樹脂組成物。 　　[0181] 此外，(C)光聚合引發劑可組合光引發助劑。作為光引發助劑，可列舉三乙醇胺、甲基二乙醇胺、三異丙醇胺、4-二甲基胺基苯甲酸甲酯、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、4-二甲基胺基苯甲酸2-乙基己酯、苯甲酸2-二甲基胺基乙酯、N,N-二甲基對甲苯胺、4,4’-雙(二甲基胺基)二苯酮、9,10-二甲氧基蒽、2-乙基-9,10-二甲氧基蒽、9,10-二乙氧基蒽、2-乙基-9,10-二乙氧基蒽、2-巰基苯并噻唑、2-巰基苯并噁唑、2-巰基苯并咪唑、2-巰基-5-甲氧基苯并噻唑、3-巰基丙酸、3-巰基丙酸甲酯、季戊四醇四巰基乙酸酯、3-巰基丙酸酯等硫醇化合物等。此等光引發助劑可單獨使用或組合2種以上使用。 　　[0182] ＜(D)遮光材料＞ 　　樹脂組成物因為被用於黑色基質而包含(D)遮光材料。典型之(D)遮光材料較佳包含黑色顏料。經由使用包含黑色顏料之樹脂組成物，可賦予形成之硬化膜以遮光性。因此，包含黑色顏料之樹脂組成物較佳用於形成液晶顯示面板等圖像顯示面板中之黑色基質。 　　[0183] 作為黑色顏料之例子，可列舉碳黑、苝系顏料、內醯胺系顏料、鈦黑、銅、鐵、錳、鈷、鉻、鎳、鋅、鈣、銀等之金屬氧化物、複合氧化物、金屬硫化物、金屬硫酸鹽或金屬碳酸鹽等各種顏料，不論是有機物還是無機物均可。在此等黑色顏料之中，從容易獲得和容易形成遮光性優良且電阻高之硬化膜之觀點來看，較佳碳黑。 　　另外，黑色顏料之色調並非限定於色彩論上之無彩色，即黑色，亦可為紫黑色、藍黑色、紅黑色。 　　[0184] 作為碳黑，可使用槽法碳黑、爐法碳黑、熱裂碳黑、燈黑等公知之碳黑。此外，亦可使用樹脂包覆碳黑。 　　[0185] 作為碳黑，亦較佳實施了導入酸性基之處理之碳黑。導入碳黑之酸性基為顯示基於布朗斯特定義之酸性之官能基。作為酸性基之具體例子，可列舉羧基、磺酸基、磷酸基等。導入碳黑之酸性基亦可形成鹽。與酸性基形成鹽之陽離子在不妨礙本發明目的之範圍內沒有特別地限定。作為陽離子之例子，可列舉各種之金屬離子、含氮化合物之陽離子、銨離子等，較佳鈉離子、鉀離子、鋰離子等鹼金屬離子或者銨離子。 　　[0186] 在實施了導入以上說明之酸性基之處理之碳黑中，從實現使用樹脂組成物形成之遮光性之硬化膜之高阻抗之觀點來看，較佳具有選自羧酸基、羧酸鹽基、磺酸基及磺酸鹽基之1種以上之官能基之碳黑。 　　[0187] 將酸性基導入碳黑之方法沒有特別地限定。作為導入酸性基之方法，可列舉例如以下之方法。 　　1) 經由使用濃硫酸、發煙硫酸、氯磺酸等之直接取代法，或使用亞硫酸鹽、亞硫酸氫鹽等之間接取代法，向碳黑導入磺酸基之方法。 　　2) 使具有胺基與酸性基之有機化合物與碳黑重氮偶合之方法。 　　3) 經由威廉姆森醚化法，使具有鹵素原子與酸性基之有機化合物與具有羥基之碳黑發生反應之方法。 　　4) 使具有鹵代羰基與由保護基保護之酸性基之有機化合物與具有羥基之碳黑發生反應之方法。 　　5) 使用具有鹵代羰基與由保護基保護之酸性基之有機化合物，對於碳黑進行傅-克反應後，進行脫保護之方法。 　　[0188] 在此等方法之中，從酸性基之導入處理容易且安全之觀點來看，較佳方法2)。作為方法2)中使用之具有胺基與酸性基之有機化合物，較佳在芳香族基上鍵結了胺基與酸性基之化合物。作為該化合物之例子，可列舉對胺基苯磺酸那樣之胺基苯磺酸，或4-胺基苯甲酸那樣之胺基苯甲酸。 　　[0189] 在不妨礙本發明目的之範圍內，導入碳黑之酸性基之莫耳數沒有特別地限定。相對於100g之碳黑，導入碳黑之酸性基之莫耳數較佳為1～200mmol，更佳為5～100mmol。 　　[0190] 導入了酸性基之碳黑亦可實施利用樹脂之包覆處理。在使用包含由樹脂包覆之碳黑之樹脂組成物之情況下，容易形成遮光性及絕緣性優良、表面反射率低之遮光性硬化膜。另外，經由利用樹脂之包覆處理，不會對使用樹脂組成物形成之遮光性硬化膜之介電常數產生顯著之不良影響。作為可用於碳黑之包覆之樹脂之例子，可列舉酚醛樹脂、三聚氰胺樹脂、二甲苯樹脂、鄰苯二甲酸二烯丙酯樹脂、甘酞樹脂、環氧樹脂、烷基苯樹脂等熱硬化性樹脂，或聚苯乙烯、聚碳酸酯、聚對苯二甲酸乙二醇酯、聚對苯二甲酸丁二醇酯、改性聚苯醚、聚碸、聚對苯二甲醯對苯二胺、聚醯胺醯亞胺、聚醯亞胺、聚胺基雙馬來醯亞胺、聚醚碸、聚亞苯基碸、聚芳酯、聚醚醚酮等熱塑性樹脂。樹脂相對於碳黑之包覆量相對於碳黑之質量與樹脂之質量之合計較佳為1～30質量%。 　　[0191] 此外，作為黑色顏料，還可較佳使用苝系顏料。作為苝系顏料之具體例子，可列舉以下述式(d-1)表示之苝系顏料、以下述式(d-2)表示之苝系顏料及以下述式(d-3)表示之苝系顏料。在市售品中，可較佳使用BASF公司製之產品名稱KOO84及K0086，或顏料黑21、30、31、32、33及34等作為苝系顏料。 　　[0192]

式(d-1)中，R^d1 及R^d2 分別獨立地表示碳原子數1～3之亞烷基，R^d3 及R^d4 分別獨立地表示氫原子、羥基、甲氧基或者乙醯基。 　　[0193]

式(d-2)中，R^d5 及R^d6 分別獨立地表示碳原子數1～7之亞烷基。 　　[0194]

式(d-3)中，R^d7 及R^d8 分別獨立地表示氫原子、碳原子數1～22之烷基，可包含N、O、S或P此等雜原子。在R^d7 及R^d8 為烷基之情況下，該烷基可為直鏈狀，亦可為支鏈狀。 　　[0195] 上述之以式(d-1)表示之化合物、以式(d-2)表示之化合物及以式(d-3)表示之化合物可使用例如日本特開昭62-1753號公報、日本特公昭63-26784號公報記載之方法合成。即，以苝-3,5,9,10-四甲酸或者苝-3,5,9,10-四甲酸二酐與胺類為原料，在水中或有機溶劑中進行加熱反應。接著，使得到之粗製物在硫酸中再沉澱，或者在水、有機溶劑或者水與有機溶劑之混合溶劑中再結晶，從而可得到目標物質。 　　[0196] 為了使苝系顏料良好地在樹脂組成物中分散，苝系顏料之平均粒徑較佳為10～1000nm。 　　[0197] 此外，作為(D)遮光材料，亦可包含內醯胺系顏料。作為內醯胺系顏料，可列舉例如以下述式(d-4)表示之化合物。 　　[0198]

[0199] 式(d-4)中，X^d 表示雙鍵，作為幾何異構體分別獨立地為E體或者Z體，R^d9 分別獨立地表示氫原子、甲基、硝基、甲氧基、溴原子、氯原子、氟原子、羧基或磺基，R^d10 分別獨立地表示氫原子、甲基或者苯基，R^d11 各自獨立地表示氫原子、甲基或者氯原子。 　　以式(d-4)表示之化合物可單獨使用或組合2種以上使用。 　　從以式(d-4)表示之化合物製造容易之觀點來看，R^d9 較佳鍵結在二氫吲哚酮環之6位上，R^d11 較佳鍵結在二氫吲哚酮環之4位上。從同樣之觀點來看，R^d9 、R^d10 及R^d11 較佳為氫原子。 　　以式(d-4)表示之化合物雖然作為幾何異構體具有EE體、ZZ體、EZ體，但可為其中之任一種單一之化合物，亦可為此等幾何異構體之混合物。 　　以式(d-4)表示之化合物可經由例如國際公開第2000/24736號及國際公開第2010/081624號記載之方法製造。 　　[0200] 為了使內醯胺系顏料良好地在樹脂組成物中分散，內醯胺系顏料之平均粒徑較佳為10～1000nm。 　　[0201] 另外，還較佳使用以銀錫(AgSn)合金為主要成分之微粒(以下，稱為“AgSn 合金微粒”)作為黑色顏料。該AgSn 合金微粒只要AgSn 合金為主要成分即可，作為其他金屬成分，可以含有例如Ni、Pd、Au等。 　　該AgSn 合金微粒之平均粒徑較佳為1～300nm。 　　[0202] 在AgSn合金用化學式AgxSn表示之情況下，可得到化學性質穩定之AgSn合金之x之範圍為1≤x≤10，同時得到化學穩定性與黑色度之x之範圍為3≤x≤4。 　　於此，若在上述x之範圍內，求出AgSn合金中之Ag之質量比，則 　　X=1時，Ag/AgSn=0.4762 　　X=3時，3·Ag/Ag3Sn=0.7317 　　X=4時，4·Ag/Ag4Sn=0.7843 　　X=10時，10·Ag/Ag10Sn=0.9008。 　　因此，該AgSn合金在含有47.6～90質量%之Ag之情況下，化學性質穩定，在含有73.17～78.43重量%之Ag之情況下，可對應於Ag量有效地獲得化學穩定性與黑色度。 　　[0203] 該AgSn合金微粒可使用通常之微粒合成法製作。作為微粒合成法，可列舉氣相反應法、噴霧熱分解法、霧化法、液相反應法、冷凍乾燥法、水熱合成法等。 　　[0204] AgSn合金微粒雖然絕緣性較高，但是為了進一步提高黑色基質之絕緣性，亦可在AgSn合金微粒之表面覆蓋絕緣膜。作為該絕緣膜之材料，較佳金屬氧化物或有機高分子化合物。 　　作為金屬氧化物，較佳使用具有絕緣性之金屬氧化物，例如氧化矽(二氧化矽)、氧化鋁(三氧化二鋁)、氧化鋯(二氧化鋯)、氧化釔(三氧化二釔)、氧化鈦(二氧化鈦)等。 　　此外，作為有機高分子化合物，較佳使用具有絕緣性之樹脂，例如聚醯亞胺、聚醚、聚丙烯酸酯、聚胺化合物等。 　　[0205] 為了充分提高AgSn合金微粒之表面之絕緣性，絕緣膜之膜厚較佳為1～100nm之厚度，更佳為5～50nm。 　　絕緣膜可經由表面改性技術或者表面之被覆技術容易地形成。特別是如果使用四乙氧基矽烷、三乙氧基鋁等烷氧基化合物，可在較低之溫度下形成膜厚均勻之絕緣膜，所以較佳。 　　[0206] 作為黑色顏料，可單獨地使用上述之苝系顏料、內醯胺系顏料、AgSn合金微粒，可組合使用此等物質。 　　此外，出於調整色調之目的等，黑色顏料亦可以含有紅、藍、綠、黃等色相之色素。作為黑色顏料之其他色相之色素，可從公知之色素適當地選擇。例如，作為黑色顏料之其他色相之色素，可使用上述各種之顏料。黑色顏料之其他色相之色素之使用量，相對於黑色顏料之總質量，較佳15質量%以下，更佳10質量%以下。 　　[0207] 為了使以上說明之(D)遮光材料均勻地分散在樹脂組成物中，可以進一步使用分散劑。作為這樣之分散劑，較佳使用聚乙烯亞胺系、聚胺酯樹脂系、丙烯酸樹脂系之高分子分散劑。尤其是使用碳黑作為(D)遮光材料時，分散劑較佳使用丙烯酸樹脂系之分散劑或聚胺酯樹脂系之分散劑。 　　另外，也存在因分散劑而從硬化膜中產生腐蝕性氣體之情況。因此，(D)遮光材料在不使用分散劑之情況下進行分散處理亦為較佳方案之一例。 　　[0208] 此外，作為(D)遮光材料，無機顏料與有機顏料分別可單獨使用，或亦可併用2種以上，在併用之情況下，相對於無機顏料與有機顏料之總量100質量份，較佳以10～80質量份之範圍使用有機顏料，更佳以20～40質量份之範圍使用有機顏料。 　　[0209] 另外，在樹脂組成物中，作為(D)遮光材料，亦可以將顏料與染料組合使用。該染料從公知之材料中適當地選擇即可。 　　作為可用於樹脂組成物之染料，可列舉例如偶氮染料，金屬錯鹽偶氮染料、蒽醌染料、三苯甲烷染料、呫噸染料、花青染料，萘醌染料、醌亞胺染料、次甲基染料、酞菁染料等。 　　此外，關於此等染料，經由色澱化(成鹽化)使其分散在有機溶劑等，可將其作為(D)遮光材料使用。 　　除了此等染料以外，亦可較佳使用例如日本特開2013-225132號公報、日本特開2014-178477號公報、日本特開2013-137543號公報、日本特開2011-38085號公報、日本特開2014-197206號公報等記載之染料等。 　　[0210] 樹脂組成物中之(D)遮光材料之使用量可在不妨礙本發明目的之範圍內適當地選擇，典型之是相對於樹脂組成物之固態成分之總質量，較佳為2～75質量%，更佳為3～70質量%。 　　[0211] (D)遮光材料較佳在存在或不存在分散劑之情況下，製成以適當濃度分散之分散液後，添加到樹脂組成物中。 　　另外，在本說明書中，對於上述(D)遮光材料之使用量，可定義為還包含該存在之分散劑之值。 　　[0212] ＜(E)環氧化合物＞ 　　樹脂組成物包含後述之以式(E1)表示之(E)環氧化合物。 　　以下，對以式(E1)表示之環氧化合物進行說明。 　　[0213]

式(E1)中，OGly為環氧丙氧基，R^e1 是鹵素原子或碳原子數1～8之1價基，a為0～4之整數，b為括弧內之單元之重複數，在a為2以上之整數之情況下，苯環上相鄰之2個R^e1 也可相互地鍵結而形成環，R^e2 為2價之脂肪族環式基，或以下述式(E1-1)表示之基，

式(E1-1)中，OGly為環氧丙氧基，R^e3 是芳香族烴基，R^e4 為鹵素原子或碳原子數1～4之烷基，c為0或者1，d為0～8之整數，R^e5 為氫原子或者以下述式(E1-2)表示之基，

式(E1-2)中，OGly為環氧丙氧基，R^e6 是鹵素原子、碳原子數1～4之烷基或苯基，e為0～4之整數。 　　[0214] 以上述式(E1)表示之環氧化合物之平均分子量為800以上。經由使用具有上述平均分子量之化合物作為以式(E1)表示之環氧化合物，容易獲得可形成高阻抗且耐水性或強度優良之黑色基質之樹脂組成物。 　　以式(E1)表示之環氧化合物之平均分子量較佳為1000以上，更佳為1200以上，特別佳為1500以上。此外，從使得顯影時之殘渣不易產生之觀點來看，以式(E1)表示之環氧化合物之平均分子量較佳為50000以下，更佳為20000以下。 　　[0215] 式(E1)中，R^e1 為鹵素原子或碳原子數1～8之1價基。作為碳原子數1～8之1價基之具體例子，可列舉烷基、烷氧基、苯氧基、脂肪族醯基、脂肪族醯基氧基、苯甲醯基、苄基、苯乙基及不飽和脂肪族烴基。 　　烷基、烷氧基、脂肪族醯基、脂肪族醯基氧基及不飽和脂肪族烴基可為直鏈狀，亦可為支鏈狀。 　　[0216] 作為R^e1 之鹵素原子較佳之例子可列舉氟原子、氯原子、溴原子及碘原子。作為R^e1 之烷基較佳之例子較佳甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基及叔丁基，更佳甲基及乙基。 　　[0217] 在R^e1 為碳原子數1～8之1價基之情況下，作為該1價基，較佳烷基及烷氧基。 　　作為烷基之具體例子，可列舉：甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、正己基、正庚基、正辛基及2-乙基己基。 　　作為烷氧基之具體例子，可列舉：甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、仲丁氧基、叔丁氧基、正戊氧基、正己氧基、正庚氧基、正辛氧基及2-乙基己氧基。 　　[0218] 此外，在a為2～4之整數之情況下，多個R^e1 之中在苯環上鄰接之2個R^e1 亦可相互地鍵結形成環。2個R^e1 鍵結而形成之環可為芳香族環，亦可為脂肪族環，可為烴環，亦可為雜環。 　　在2個R^e1 鍵結而形成之環為雜環之情況下，作為該環所含之雜原子，可列舉N、O、S及Se等。 　　經由2個R^e1 鍵結，作為與苯環一起形成之基之較佳之例子，可列舉萘環及四氫化萘環。 　　[0219] 式(E1)中，作為R^e2 之2價之脂肪族環式基沒有特別地限定，可為單環式基，亦可為2環以上之多環式基。另外，2價之脂肪族環式基通常在其構造中不包含環氧基，較佳不含環氧基。 　　具體而言，作為2價之脂肪族環式基，可例示從單環烷烴、雙環烷烴、三環烷烴、四環烷烴等多環烷烴除去2個氫原子而得到之基等。更具體而言，可列舉從環戊烷、環己烷等單環烷烴或金剛烷、降冰片烷、異冰片烷、三環癸烷、四環十二烷等多環烷烴除去2個氫原子而得到之基等。 　　2價之脂肪族環式基之碳原子數較佳為3～50，更佳為3～30，特別佳為3～20。最佳為3～15。 　　[0220] 作為R^e2 之2價之脂肪族環式基之具體例子可列舉以下所示基。

[0221] R^e3 為芳香族烴基。作為R^e3 之芳香族烴基之價數為2+c+d。作為芳香族烴基，並沒有特別地限定。典型之構成芳香族烴基之芳香族烴環為六元芳香族烴環(苯環)，或者2個以上之苯環相互地縮合或介隔單鍵而鍵結得到之環。 　　構成芳香族烴基之芳香族烴環較佳之具體例子為苯、萘、蒽、菲、聯苯及三聯苯。從此等芳香族烴環除去2+c+d個氫原子而得到之基適合作為R^e3 之芳香族烴基。 　　[0222] 在以式(E1-1)表示之基中，c為0或者1。即，作為芳香族烴基之R^e3 可以不鍵結環氧丙氧基，亦可以鍵結1個環氧丙氧基。 　　[0223] 在以式(E1-1)表示之基中，R^e4 為鹵素原子或碳原子數1～4之烷基，d為0～8之整數。即，R^e4 為作為芳香族烴基之R^e3 上之、環氧丙氧基以外之取代基，R^e3 上之取代基之數量為0～8。d較佳為0～4之整數，更佳為0～2之整數，特別佳為0或者1。 　　作為R^e4 之鹵素原子較佳之例子可列舉氟原子、氯原子、溴原子及碘原子。作為R^e4 之烷基較佳之例子較佳甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基及叔丁基，更佳甲基及乙基。 　　[0224] 在以式(E1-1)表示之基中，R^e5 為氫原子或者前述以式(E1-2)表示之基。 　　式(E1-2)中之R^e6 為鹵素原子、碳原子數1～4之烷基或苯基。鹵素原子及碳原子數1～4之烷基之具體例子與R^e4 相同。 　　[0225] 對於以上說明之以式(E1)表示之環氧化合物，較佳R^e2 為2價之脂肪族環式基，或前述以式(E1-1)表示之c為0、且R^e5 為氫原子之2價基。 　　在該情況下，在以式(E1)表示之環氧化合物所含之多個環氧基之間存在適度之距離，由此對於黑色基質而言，可實現更良好之耐水性。 　　[0226] 以式(E1)表示之環氧化合物可作為市售品而獲得。市售品之具體例子可列舉日本化藥株式會社製造之NC-系列、XD-系列等。此外，也可從DIC株式會社、昭和電工股份有限公司獲得具有特定構造之同等產品。 　　[0227] 以式(E1)表示之環氧化合物較佳之具體例子之化學構造記載如下。下述式中，OGly表示環氧丙氧基，p表示括弧內之單元之重複數。

[0228] 在不妨礙本發明之目的之範圍內，以上說明之(E)環氧化合物在包含以式(E1)表示之環氧化合物之同時，亦可包含其他之環氧化合物。 　　作為其他之環氧化合物，雖然沒有特別地限定，但作為較佳之化合物，可列舉對於所述環氧化合物(a-3a)作為具體例子列舉之環氧化合物。 　　以式(E1)表示之環氧化合物之質量相對於(E)環氧化合物之質量之比例較佳為70質量%以上，更佳為80質量%以上，特別佳為90質量%以上，最佳為100質量%。 　　[0229] 在將所述(A)鹼可溶性樹脂所具有之活性氫基之總量(莫耳數)記作Am、將(E)環氧化合物具有之環氧基之總量(莫耳數)記作Em時，以上說明之(E)環氧化合物之使用量較佳Am/Em在0.25以上4.0以下之範圍內，更佳為0.5以上2.0以下之範圍內。 　　經由使用所述範圍內之量之(E)環氧化合物，容易形成耐水性及強度優良之黑色基質。 　　[0230] 樹脂組成物之全部固態成分中之(E)環氧化合物之含量較佳為0.5質量%以上10質量%以下， 更佳為1質量%以上5質量%以下。 　　此外，樹脂組成物之全部固態成分中之、前述以式(E1)表示之環氧化合物之含量較佳為0.5質量%以上10質量%以下，更佳為1質量%以上5質量%以下。 　　[0231] ＜(S)有機溶劑＞ 　　為了改善塗佈性或調整黏度，樹脂組成物較佳包含(S)有機溶劑。 　　[0232] 作為有機溶劑(S)，具體而言，可舉出乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單正丙基醚、乙二醇單正丁基醚、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇單正丙基醚、二乙二醇單正丁基醚、三乙二醇單甲基醚、三乙二醇單乙基醚、丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單正丙基醚、丙二醇單正丁基醚、二丙二醇單甲基醚、二丙二醇單乙基醚、二丙二醇單正丙基醚、二丙二醇單正丁基醚、三丙二醇單甲基醚、三丙二醇單乙基醚等(聚)亞烷基二醇單烷基醚類；乙二醇單甲基醚乙酸酯、乙二醇單乙基醚乙酸酯、二乙二醇單甲基醚乙酸酯、二乙二醇單乙基醚乙酸酯、丙二醇單甲基醚乙酸酯(PGMEA)、丙二醇單乙基醚乙酸酯等(聚)亞烷基二醇單烷基醚乙酸酯類；二乙二醇二甲基醚、二乙二醇甲基乙基醚、二乙二醇二乙基醚、四氫呋喃等其他醚類；甲基乙基酮、環己酮、2-庚酮、3-庚酮等酮類；2-羥基丙酸甲酯、2-羥基丙酸乙酯等乳酸烷基酯類；2-羥基-2-甲基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙氧基乙酸乙酯、羥基乙酸乙酯、2-羥基-3-甲基丁酸甲酯、乙酸3-甲氧基丁酯、乙酸3-甲基-3-甲氧基丁酯、丙酸3-甲基-3-甲氧基丁酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸異丁酯、甲酸正戊酯、乙酸異戊酯、乙酸苯甲酯、丙酸正丁酯、丁酸乙酯、丁酸正丙酯、丁酸異丙酯、丁酸正丁酯、丙酮酸甲酯、丙酮酸乙酯、丙酮酸正丙酯、乙醯乙酸甲酯、乙醯乙酸乙酯、2-氧代丁酸乙酯等其他酯類；甲苯、二甲苯等芳香族烴類；N-甲基-2-吡咯烷酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N,N-二甲基-異丁醯胺、N,N-二乙基乙醯胺、N,N-二乙基甲醯胺、N-甲基己內醯胺、1,3-二甲基-2-咪唑啉酮、吡啶及N,N,N’,N’-四甲基脲等含氮極性有機溶劑等。 　　[0233] 其中，較佳亞烷基二醇單烷基醚類、亞烷基二醇單烷基醚乙酸酯類、上述之其他醚類、乳酸烷基酯類、上述之其他酯類，更佳亞烷基二醇單烷基醚乙酸酯類、上述之其他醚類、乙酸苄酯等上述之其他酯類。 　　此外，從各成分之溶解性或(D)遮光材料之分散性等觀點來看，(S)有機溶劑較佳包含含氮極性有機溶劑。作為含氮極性有機溶劑，可使用N,N,N’,N’-四甲基脲等。 　　此等溶劑可單獨使用或組合2種以上使用。 　　[0234] (S)有機溶劑成分之含量沒有特別限制，可藉由能在基板等上進行塗佈之濃度根據塗佈膜厚適當設定。樹脂組成物之黏度較佳為5～500cp，更佳為10～50cp，進一步較佳為20～30cp。另外，固態成分濃度較佳為5～100質量%，更佳為15～50質量%。 　　[0235] ＜其他成分＞ 　　在樹脂組成物中，根據需要，可含有(E)環氧化合物以外之環氧化合物、表面活性劑、密著性提高劑、熱聚合抑制劑、消泡劑、矽烷偶合劑等添加劑。所有添加劑均可使用目前公知之物質。 　　從容易形成形狀良好、對基板之密著性優良之黑色基質之觀點來看，樹脂組成物較佳包含矽烷偶合劑。作為矽烷偶合劑，沒有特別地限制，可使用目前公知之物質。 　　作為表面活性劑，可舉出陰離子系、陽離子系、非離子系等之化合物。作為熱聚合抑制劑，可舉出氫醌、氫醌單乙基醚等。作為消泡劑，可舉出矽氧烷系、氟系化合物等。 　　[0236] 若使用以上說明之樹脂組成物，則可形成體積電阻率較低、光學濃度(OD值)較高之硬化膜。 　　具體而言，樹脂組成物可提供體積電阻率較佳為1.0×10¹⁰ Ω·cm以上、更佳為1.0×10¹¹ Ω·cm以上之硬化膜。此外，本實施方式之樹脂組成物可提供光學濃度(OD值)較佳為2.5/μm以上，更佳為3.0/μm以上，進一步較佳為3.5/μm以上之硬化膜。 　　在黑色基質中，一般此等物性值容易呈二律背反，但是在本實施方式中，可同時滿足這兩種物性。 　　[0237] ＜樹脂組成物之調製方法＞ 　　以上說明之樹脂組成物可經由將分別為規定量之上述各成分混合之後，利用攪拌機均勻地混合而得到。另外，為了使得到之樹脂組成物更均勻，亦可使用過濾器進行過濾。 　　[0238] 《黑色基質之製造方法》 　　作為黑色基質之製造方法，並沒有特別地限定，可採用使用包含(B)光聚合性化合物之黑色基質形成用之感光性樹脂組成物之目前公知之方法。 　　[0239] 作為黑色基質較佳之製造方法，可列舉包含以下步驟之方法： 　　藉由塗佈前述之樹脂組成物形成塗膜之步驟、 　　選擇位置對塗膜進行曝光之步驟、 　　使經曝光後之塗膜顯影，形成圖案化之硬化膜之步驟與 　　烘烤圖案化之硬化膜之步驟。 　　[0240] 為了使用樹脂組成物形成黑色基質，首先，在根據圖像顯示裝置之方式或構成等選擇之基板上塗佈樹脂組成物，形成塗膜。塗膜之形成方法沒有特別地限定，例如，可使用輥塗機、逆轉塗佈機、棒塗機等接觸轉印型塗佈裝置，或旋轉塗佈機(旋轉式塗佈裝置)、幕塗機等非接觸型塗佈裝置進行。 　　[0241] 塗佈之樹脂組成物根據需要進行乾燥，構成塗膜。乾燥方法沒有特別限制，例如，可列舉以下方法：(1)利用加熱板，於80～120℃、較佳90～100℃之溫度，乾燥60～120秒之方法；(2)在室溫下放置數小時～數天之方法；(3)放入到熱風加熱器或紅外線加熱器中數十分鐘～數小時而除去溶劑之方法等。 　　[0242] 接著，對塗膜進行曝光。曝光經由照射紫外線、准分子雷射等活性能量射線進行。曝光經由例如介隔負型掩膜進行曝光之方法等以可形成期望圖案之黑色基質之方式選擇位置進行。照射之能量射線量因樹脂組成物之組成而不同，例如較佳為40～200mJ/cm² 左右。 　　另外，在對塗膜整面進行曝光時，形成具有與塗膜之形狀對應之形狀之未圖案化之硬化膜。 　　[0243] 在選擇位置對塗膜進行曝光之情況下，將曝光後之膜經由顯影液進行顯影，未曝光部分溶解於顯影液從而被除去，形成圖案化之硬化膜。顯影方法沒有特別地限定，可使用例如浸漬法、噴霧法等。顯影液可根據樹脂組成物之組成適當地選擇。作為顯影液，可使用例如氫氧化鈉、氫氧化鉀、碳酸鈉、氨、季銨鹽等之鹼性水溶液。 　　[0244] 接著，對圖案化後之硬化膜進行烘烤(後烘烤)。烘烤之溫度沒有特別地限定，但較佳為180～250℃，更較佳220～230℃。烘烤時間典型地為10～90分鐘，較佳為20～60分鐘。 　　經由像以上那樣地進行烘烤，可得到可作為黑色基質較佳使用之樹脂組成物之硬化膜。 　　[0245] 像這樣形成之黑色基質可較佳地用於例如以液晶顯示裝置為代表之各種圖像顯示裝置。 [實施例] 　　[0246] 以下示出實施例對本發明進一步具體地進行說明，但是本發明之範圍並不由此等實施例限定。 　　[0247] [調製例1] 　　首先，在500ml之四口燒瓶中，加入雙酚芴型環氧樹脂235g(環氧當量235)、四甲基氯化銨110mg、2,6-二叔丁基-4-甲基苯酚100mg及丙烯酸72.0g，一邊向其中以25ml/分之速度通入空氣，一邊在90～100 ℃下加熱溶解。接著，溶液在呈乳濁狀態下緩緩升溫，加熱至120℃ 使其完全溶解。這時，溶液逐漸變成透明黏稠狀，該狀態下繼續進行攪拌。這期間，測定其酸值，繼續加熱攪拌直到其低於1.0mgKOH/g為止。酸值達到目標值花了12小時。然後冷卻至室溫，從而得到無色透明固體狀之以下式表示之雙酚芴型環氧丙烯酸酯。

[0248] 接著，在如此得到之上述雙酚芴型環氧丙烯酸酯307.0g中加入乙酸-3-甲氧基丁基酯600g並溶解之後，混合80.5g二苯酮四羧酸二酐及1g四乙基溴化銨，緩慢加溫並使之在110～115℃下反應4小時。 在確定酸酐基消失之後，混合38.0g之1,2,3,6-四氫苯二甲酸酐，使其在90℃下反應6小時，得到樹脂A-1。經由紅外光譜確認酸酐基之消失。 　　[0249] [實施例1、比較例1～4] 　　在實施例及比較例中，使用卡多樹脂、酚醛清漆樹脂作為(A)鹼可溶性樹脂。 　　使用上述調製例1得到之樹脂A-1作為卡多樹脂。 　　使用住友電木株式會社製之TO-547(商品名稱)作為酚醛清漆樹脂。TO-547為在間甲酚90莫耳%與2,3,5-三甲基苯酚10莫耳%之混合物中添加草酸與濃度為37質量%之福馬林，經由常規方法進行縮合反應得到之Mw30000之甲酚酚醛清漆樹脂。 　　在比較例2中，使用苯乙烯-甲基丙烯酸共聚物作為(A)鹼可溶性樹脂。 　　在比較例3中，使用藉由以下之製備方法得到之含乙烯基之丙烯酸類樹脂作為(A)鹼可溶性樹脂。 　　[0250] [含乙烯基之丙烯酸類樹脂之調製方法] 　　使甲基丙烯酸與甲基丙烯酸苄酯以45莫耳%：55莫耳%進行共聚，得到共聚物，進而使該共聚物與3,4‑環氧環己基甲基甲基丙烯酸酯反應，得到含乙烯基之丙烯酸類樹脂。另外，在甲基丙烯酸為45莫耳%時，於此使用之3,4‑環氧環己基甲基甲基丙烯酸酯為15莫耳%。 　　[0251] 在實施例及比較例中，使用了DPHA (二季戊四醇六丙烯酸酯)作為(B)光聚合性化合物。 　　[0252] 在實施例及比較例中，使用OXE-02(商品名稱，BASF公司制，O-乙醯基-1-[6-(2-甲基苯甲醯基)-9-乙基-9H-哢唑-3-基]乙酮肟)作為(C)光聚合引發劑。 　　[0253] 在實施例及比較例中，使用碳黑作為(D)遮光材料。 　　使用御國色素株式會社製之碳黑(顏料A(分散液))作為碳黑。 　　另外，在本實施例項之表1中，記載了該顏料及分散劑之固態成分之合計值之數值。 　　[0254] 在實施例1中，使用了下述構造之環氧化合物E1(NC-2000-L，日本化藥股份有限公司製，環氧當量為229～244)作為(E)環氧化合物。另外，下式中之p表示括弧內之單元之重複數，在本實施例中，使用了平均分子量為1700之環氧化合物。

[0255] 將分別為表1記載之量之(A)鹼可溶性樹脂、(B)光聚合性化合物、(C)光聚合引發劑、(D)遮光材料與(E)環氧化合物溶解分散在(S)有機溶劑中，使固態成分濃度為15質量%，獲得實施例1之樹脂組成物。 　　此外，將分別為表1記載之量之(A)鹼可溶性樹脂、(B)光聚合性化合物、(C)光聚合引發劑與(D)遮光材料溶解分散在(S)有機溶劑中，使固態成分濃度為15質量%，獲得比較例1～4之樹脂組成物。 　　使用乙酸3-甲氧基丁酯: 丙二醇單甲基醚乙酸酯:環己酮=40：35：25(質量比)之混合溶劑作為(S)有機溶劑。 　　使用得到之樹脂組成物，根據以下之方法，對阻抗評估、靈敏度評估、溶解性評估、耐水性評估、膜強度評估進行評估。 　　[0256] ＜阻抗評估＞ 　　首先，用純水清洗100mm見方之玻璃基板，並在160℃之烤箱中乾燥。將在實施例及比較例中獲得之樹脂組成物塗佈在乾燥後之玻璃基板上，利用100℃之加熱板加熱2分鐘使溶劑揮發。接著，立即使用沒有遮光圖案之掩膜以30mJ/cm² 之曝光量進行曝光，使用濃度為0.04質量%之KOH水溶液作為顯影液顯影70秒。 　　將製造之基板在加熱到230℃之烤箱中保持180分鐘後冷卻，得到黑色膜。另外，實施例及比較例得到之黑色膜之光學濃度(OD值)均超過4.0/μm。 　　對得到之黑色膜進行體積電阻率之測量，基於以下之基準，對使用樹脂組成物而形成之黑色基質之阻抗進行評估。 　　在本項目中，基於以下之基準進行了評估。 　　○：體積電阻率為1.0×10¹⁰ Ω·cm以上。 　　×：體積電阻率小於1.0×10¹⁰ Ω·cm以上。 　　[0257] ＜靈敏度評估＞ 　　首先，用純水清洗100mm見方之玻璃基板，並在160℃之烤箱中乾燥。利用旋轉式塗佈機將在實施例及比較例中獲得之樹脂組成物塗佈在乾燥後之玻璃基板上，獲得膜厚1.3μm之塗佈膜。然後，立即使用5μm線之掩膜，在30～50mJ/cm² 之曝光量之範圍進行曝光，使用濃度為0.04質量%之KOH水溶液作為顯影液顯影70秒。另外，曝光是利用Topcon公司製Proximity曝光機採用間距70μm、照度20mw之條件而進行之。 　　在本項目中，基於以下之基準進行了評估。 　　◎：為了得到5μm之圖案需要30mJ/cm² 以上低於35mJ/cm² 之曝光量。 　　○：為了得到5μm之圖案需要35mJ/cm² 以上低於40mJ/cm² 之曝光量。 　　×：為了得到5μm之圖案需要40mJ/cm² 以上之曝光量。 　　[0258] ＜溶解性評估＞ 　　首先，用純水清洗100mm見方之玻璃基板，並在160℃之烤箱中乾燥。利用旋轉式塗佈機將在實施例及比較例中獲得之樹脂組成物塗佈在乾燥後之玻璃基板上，獲得膜厚1.3μm之塗佈膜。然後，立即使用5μm線之掩膜，在30mJ/cm² 之曝光量下進行曝光，使用濃度為0.04質量%之KOH水溶液作為顯影液顯影70秒。另外，曝光利用Topcon公司製Proximity曝光機採用間距70μm、照度20mw之條件而進行。 　　在本項目中，基於以下之基準進行了評估。 　　○：中斷點(未曝光之一部分溶解之時間)為35秒以上且小於45秒。 　　×：中斷點為35秒以下，或者45秒以上。 　　[0259] ＜耐水性評估＞ 　　通過與阻抗評估相同之方法，在玻璃基板上進行樹脂組成物之塗佈、曝光、顯影液之接觸。之後，將基板在加熱到230℃之烤箱中保持60分鐘。對其進行放冷，得到具備黑色膜之基板。將形成之黑色膜浸泡在純水中，在2大氣壓、120℃、濕度100%之環境下保管12h，對耐水性進行評估。 　　在本專案中，基於JIS5600-5-6(1999)所規定之十字切割法，對黑色膜之黏著性進行了評估。具體之評估基準如下。 　　◎：基板上之黑色膜被剝離之部位之面積為10%以下。 　　○：基板上之黑色膜被剝離之部位之面積為大於10%且在30%以下。 　　×：基板上之黑色膜被剝離之部位之面積大於30%。 　　[0260] ＜膜強度評估＞ 　　利用與耐水性評估相同之方法形成黑色膜。將基板切為20mm見方，在其背面黏上陶瓷製之防撓曲板。在黑色膜一側黏上帶有環氧樹脂膠之鋁製銷件。利用工具固定銷件後，在加熱到200℃之烤箱中加熱5分鐘，使銷件固定於黑色膜。之後，利用股份有限公司島津製作所製之Ez-test進行拉伸試驗，對膜強度進行評估。 　　在本項目中，基於以下之基準進行了評估。另外，進行了5次測量，基於除去了最小值與最大值之3次測量結果之平均值進行了評估。 　　◎：拉伸試驗之值為320N以上。 　　○：拉伸試驗之值為300N以上且小於320N。 　　△：拉伸試驗之值為280N以上且小於300N。 　　×：拉伸試驗之值小於280N。 　　[0261]

[0262] 根據實施例可知，如果是包含：(A)鹼可溶性樹脂、(B)光聚合性化合物、(C)光聚合引發劑、(D)遮光材料與滿足規定之條件之(E)環氧化合物之樹脂組成物，可形成高阻抗且耐水性優良之黑色基質，且靈敏度優良。此外，若使用該樹脂組成物，則可形成膜強度優良之黑色基質。 　　另一方面，根據比較例1可知，樹脂組成物在不包含滿足規定條件之(E)環氧化合物之情況下，難以形成耐水性優良之黑色基質。 　　此外，根據比較例2及比較例3可知，樹脂組成物在含有苯乙烯-甲基丙烯酸共聚物或含乙烯基之丙烯酸樹脂那樣之丙烯樹脂來代替滿足規定條件之(E)環氧化合物之情況下，難以形成高阻抗之黑色基質。此外，在使用該樹脂組成物之情況下，難以形成膜強度優良之黑色基質。 　　另外，根據比較例4可知，樹脂組成物在含有酚醛清漆樹脂來代替滿足規定條件之(E)環氧化合物之情況下，即便可形成高阻抗之黑色基質，樹脂組成物之靈敏度與對顯影液之溶解性也較差。[Best Mode for Carrying Out the Invention] [0015] Hereinafter, the present invention will be described based on the preferred embodiments. In addition, unless otherwise specified, "～" in this manual means from above (lower limit) to below (upper limit). [0016] "Resin composition" The resin composition of this embodiment includes (A) alkali-soluble resin, (B) photopolymerizable compound, (C) photopolymerization initiator, (D) light-shielding material, and (E) epoxy Compound. In this embodiment, (A) the alkali-soluble resin contains a resin containing an aromatic ring in the main chain. Moreover, (E) epoxy compound contains the epoxy compound of the specific structure represented by Formula (E1) mentioned later. Moreover, the average molecular weight of the epoxy compound represented by formula (E1) is 800 or more. In this embodiment, the resin composition contains a resin containing an aromatic ring in the main chain as (A) an alkali-soluble resin, and contains (E) an epoxy compound having a predetermined structure and a predetermined average molecular weight described later, thereby A photosensitive resin composition that can form a black matrix with high impedance and excellent water resistance and excellent sensitivity can be obtained. [0017] Hereinafter, the necessary or optional components contained in the resin composition and the preparation method of the resin composition will be described. [0018] <(A) Alkali-soluble resin> The resin composition of this embodiment contains (A) alkali-soluble resin (also referred to as "(A) component" in this specification). As (A) alkali-soluble resin, except It is a resin containing an aromatic ring in the main chain, and is not particularly limited. A resin containing an aromatic ring in the main chain can be appropriately selected from the alkali-soluble resins blended with various conventional photosensitive resin compositions. It is used as (A) alkali-soluble resin. (A) In alkali-soluble resin, as an alkali-soluble resin containing an aromatic ring in the main chain, it is preferable to contain the resin (a-1) which has a cardo structure, for example. In (A) the alkali-soluble resin, as an alkali-soluble resin containing an aromatic ring in the main chain, it is also preferable to include a novolak resin (a-2) or a modified epoxy resin (a-3) described later. In addition to these, alkali-soluble resins containing an aromatic ring in the main chain include, for example, aromatic polyamide acid or alkali-soluble aromatic polyester resins. In addition, in the resin composition of this embodiment, As (A) the alkali-soluble resin, it is also preferable to use the resin (a-1) having a cardo structure in combination with at least one of the novolak resin (a-2) or the modified epoxy resin (a-3). Here, in this specification, (A) alkali-soluble resin means a resin having functional groups (for example, phenolic hydroxyl groups, carboxyl groups, sulfonic acid groups, etc.) that make it alkali-soluble in the molecule. [0019] Examples of the resin of alkali-soluble resin having an aromatic ring in the main chain include resin (a-1) having a cardo structure (hereinafter, also referred to as "cardo resin (a-1)"). When (A1) a resin having a cardo structure is used as the alkali-soluble resin, a resin composition with excellent resolution is easily obtained, and the use of the resin composition is easy to form a cured film that does not flow excessively due to heating. [0020] [Resin (a-1) having a Cado structure] As (A1) a resin having a Cado structure, a resin having a Cado structure in its structure and having predetermined alkali solubility can be used. The cardo skeleton refers to a skeleton in which the second ring structure and the third ring structure are bonded to one ring carbon atom constituting the first ring structure. In addition, the skeletons of the second ring structure and the third ring structure may have the same structure or different structures. As a representative example of the cardo skeleton, a skeleton in which two aromatic rings (for example, a benzene ring) are bonded to the carbon atom at the 9th position of the fluorene ring can be cited. [0021] The (A1) Cado structure resin is not particularly limited, and currently known resins can be used. Among them, a resin represented by the following formula (a-1) is preferred. [0022]

[0023] In the formula (a-1), X ^a It represents a group represented by the following formula (a-2). m1 represents an integer of 0-20. [0024]

[0025] In the above formula (a-2), R ^a1 Each independently represents a hydrogen atom, a hydrocarbon group with 1 to 6 carbon atoms or a halogen atom, R ^a2 Each independently represents a hydrogen atom or a methyl group, R ^a3 Each independently represents a linear or branched alkylene group, m2 represents 0 or 1, W ^a It represents a group represented by the following formula (a-3). [0026]

[0027] In the formula (a-2), as R ^a3 , Preferably an alkylene group with 1 to 20 carbon atoms, more preferably an alkylene group with 1 to 10 carbon atoms, particularly preferably an alkylene group with 1 to 6 carbon atoms, most preferably ethane-1,2- Diyl, propane-1,2-diyl and propane-1,3-diyl. [0028] Ring A in the formula (a-3) represents an aliphatic ring, which may be condensed with an aromatic ring, or may have a substituent. The aliphatic ring may be an aliphatic hydrocarbon ring or an aliphatic heterocyclic ring. Examples of the aliphatic ring include monocycloalkanes, bicycloalkanes, tricycloalkanes, and tetracycloalkanes. Specifically, monocyclic alkanes such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, or adamantane, norbornane, isobornane, tricyclodecane, and tetracyclododecane can be cited. The aromatic ring that can be condensed with the aliphatic ring may be an aromatic hydrocarbon ring or an aromatic heterocyclic ring, and an aromatic hydrocarbon ring is preferred. Specifically, a benzene ring and a naphthalene ring are preferable. [0029] As preferred examples of the divalent group represented by the formula (a-3), the following groups can be cited.

[0030] The divalent group X in the formula (a-1) ^a Provide residue Z by making ^a The tetracarboxylic dianhydride reacts with the diol compound represented by the following formula (a-2a), and is introduced into (A1) cardo resin.

[0031] In the formula (a-2a), R ^a1 , R ^a2 , R ^a3 And m2 is the same as the description of formula (a-2). The ring A in formula (a-2a) is the same as the description of formula (a-3). [0032] The diol compound represented by the formula (a-2a) can be produced by, for example, the following method. First, the hydrogen atom in the phenolic hydroxyl group of the diol compound represented by the following formula (a-2b) is replaced with -R according to a conventional method as needed ^a3 After the group represented by -OH, it is glycidylated using epichlorohydrin or the like to obtain an epoxy compound represented by the following formula (a-2c). Next, by reacting the epoxy compound represented by the formula (a-2c) with acrylic acid or methacrylic acid, the diol compound represented by the formula (a-2a) is obtained. In formula (a-2b) and formula (a-2c), R ^a1 , R ^a3 And m2 is the same as the description of formula (a-2). The ring A in general formula (a-2b) and formula (a-2c) is the same as the description of formula (a-3). In addition, the manufacturing method of the diol compound represented by formula (a-2a) is not limited to the above-mentioned method.

[0033] As a preferable example of the diol compound represented by the formula (a-2b), the following diol compounds can be cited.

[0034] In the above formula (a-1), R ^a0 Is a hydrogen atom or -CO-Y ^a -COOH said the base. Here, Y ^a Represents the residue after removing the acid anhydride group (-CO-O-CO-) from the dicarboxylic anhydride. Examples of dicarboxylic anhydrides include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methyl bridge methylene tetrahydro Phthalic anhydride, chlorobacteric acid anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, etc. [0035] In addition, in the above formula (a-1), Z ^a Represents the residue after removing two acid anhydride groups from tetracarboxylic dianhydride. Examples of tetracarboxylic dianhydrides include tetracarboxylic dianhydride, pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, and biphenyl tetracarboxylic dianhydride represented by the following formula (a-4) , Diphenyl ether tetracarboxylic dianhydride, etc. In addition, in the above formula (a-1), m represents an integer of 0-20. [0036]

In formula (a-4), R ^a4 , R ^a5 And R ^a6 Each independently represents one selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and a fluorine atom, and m3 represents an integer of 0-12. [0037] Optional R in formula (a-4) ^a4 The alkyl group is an alkyl group having 1 to 10 carbon atoms. By setting the number of carbon atoms of the alkyl group to this range, the heat resistance of the obtained carboxylic acid ester can be further improved. In R ^a4 In the case of an alkyl group, the number of carbon atoms is preferably from 1 to 6, more preferably from 1 to 5, and even more preferably from 1 to 4, from the viewpoint of easily obtaining a cardo resin with excellent heat resistance. For 1～3. In R ^a4 In the case of an alkyl group, the alkyl group may be linear or branched. [0038] From the standpoint of easily obtaining cardo resin with excellent heat resistance, as R in formula (a-4) ^a4 , And more preferably each independently are a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R in formula (a-4) ^a4 More preferably, it is a hydrogen atom, a methyl group, an ethyl group, n-propyl group, or an isopropyl group, Especially preferably, it is a hydrogen atom or a methyl group. Because it is easy to prepare high-purity tetracarboxylic dianhydride, multiple R in formula (a-4) ^a4 It is preferably the same base. [0039] In formula (a-4), m3 represents an integer of 0-12. By making the value of m3 12 or less, the purification of tetracarboxylic dianhydride can be made easy. From the viewpoint of easy purification of tetracarboxylic dianhydride, the upper limit of m3 is preferably 5, more preferably 3. From the viewpoint of the chemical stability of tetracarboxylic dianhydride, the lower limit of m3 is preferably 1, and more preferably 2. In formula (a-4), m3 is particularly preferably 2 or 3. [0040] Optional as R in formula (a-4) ^a5 And R ^a6 The alkyl group with 1～10 carbon atoms and optional R ^a4 The alkyl groups with 1 to 10 carbon atoms are the same. From the viewpoint of easy purification of tetracarboxylic dianhydride, R ^a5 And R ^a6 Preferably it is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms (preferably 1 to 6, more preferably 1 to 5, still more preferably 1 to 4, particularly preferably 1 to 3), particularly preferably hydrogen Atom or methyl. [0041] The tetracarboxylic dianhydride represented by the formula (a-4) includes, for example, norbornane-2-spiro-α-cyclopentanone-α'-spiro-2"-norbornane-5 ,5”,6,6”-tetracarboxylic dianhydride (alias "norbornane-2-spiro-2'-cyclopentanone-5'-spiro-2"-norbornane-5,5”,6 ,6”-tetracarboxylic dianhydride”), methylnorbornane-2-spiro-α-cyclopentanone-α'-spiro-2”-(methylnorbornane)-5,5”,6 ,6”-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclohexanone-α'-spiro-2”-norbornane-5,5”,6,6”-tetracarboxylic acid two Anhydride” (alias “norbornane-2-spiro-2'-cyclohexanone-6'-spiro-2”-norbornane-5,5”,6,6”-tetracarboxylic dianhydride”), Methylnorbornane-2-spiro-α-cyclohexanone-α'-spiro-2” -(methylnorbornane)-5,5”,6,6”-tetracarboxylic dianhydride, norbornane Alkyl-2-spiro-α-cycloacetone-α'-spiro-2”-norbornane-5,5”,6,6”-tetracarboxylic dianhydride, norbornane-2-spiro-α-ring Butanone-α'-spiro-2”-norbornane-5,5”,6,6”-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclobutanone-α'-spiro- 2"-Norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclooctanone-α'-spiro-2" -norbornane-5 ,5”,6,6”-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclonononone-α'-spiro-2”-norbornane-5,5”,6,6” -Tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclodecanone-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane Bornane-2-spiro-α-cycloundecone-α'-spiro-2” -norbornane-5,5”,6,6”-tetracarboxylic dianhydride, norbornane-2-spiro- α-Cyclododecanone-α'-spiro-2"-Norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclotridecone- α'-Spiro-2” -Norbornane-5,5”,6,6”-tetracarboxylic dianhydride, Norbornane-2-spiro-α-cyclotetradecone-α'-spiro-2” -Norbornane-5,5”,6,6”-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclopentadecone-α'-spiro-2”-norbornane-5, 5”,6,6”-tetracarboxylic dianhydride, norbornane-2-spiro-α-(methylcyclopentanone)-α'-spiro-2”-norbornane-5,5”,6 ,6”-Tetracarboxylic dianhydride, norbornane-2-spiro-α-(methylcyclohexanone)-α'-spiro-2” -norbornane-5,5”,6,6”- Tetracarboxylic dianhydride and so on. [0042] (A1) The weight average molecular weight of the cardo resin is preferably 1,000 to 40,000, more preferably 1,500 to 30,000, and still more preferably 2,000 to 10,000. By setting the weight average molecular weight of (A1) cardo resin within the above range, good developability can be obtained, and sufficient heat resistance and film strength can be obtained. [0043] [Novolak resin (a-2)] As an alkali-soluble resin containing an aromatic ring in the main chain, it is preferable from the viewpoint of suppressing excessive heat flow of the black matrix due to heating during post-baking Contains novolac resin (a-2). As the novolak resin (a-2), various novolak resins blended with conventional photosensitive resin compositions can be used. The novolak resin (a-2) is preferably obtained by addition condensation of an aromatic compound having a phenolic hydroxyl group (hereinafter referred to as "phenols") and aldehydes under an acid catalyst. [0044] (Phenols) Examples of phenols used in the production of novolak resin (a-2) include phenol; cresols such as o-cresol, m-cresol, and p-cresol; 2,3-di Xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol and other xylenols; o-ethyl Ethyl phenols such as base phenol, m-ethyl phenol, p-ethyl phenol; 2-isopropyl phenol, 3-isopropyl phenol, 4-isopropyl phenol, o-butyl phenol, m-butyl phenol, p- Alkylphenols such as butylphenol and p-tert-butylphenol; trialkylphenols such as 2,3,5-trimethylphenol and 3,4,5-trimethylphenol; resorcinol, o-benzene Polyphenols such as diphenol, hydroquinone, hydroquinone monomethyl ether, pyrogallol and phloroglucinol; alkyl resorcinol, alkyl catechol and alkyl terephthalene Alkyl polyphenols such as phenols (the number of carbon atoms of all alkyl groups is 1 to 4); α-naphthol; β-naphthol; hydroxybiphenyl and bisphenol A, etc. These phenols can be used individually or in combination of 2 or more types. [0045] Among these phenols, m-cresol and p-cresol are preferred, and m-cresol and p-cresol are more preferably used in combination. In this case, by adjusting the blending ratio of the two, the heat resistance and many other characteristics of the black matrix formed using the resin composition can be adjusted. Although the blending ratio of m-cresol and p-cresol is not particularly limited, it is preferably 3/7 or more and 8/2 or less in terms of the molar ratio of m-cresol/p-cresol. By using m-cresol and p-cresol in the above-mentioned range, it is easy to obtain a resin composition that can form a black matrix with excellent heat resistance. [0046] In addition, it is also preferable to use a novolac resin produced by using m-cresol and 2,3,5-trimethylphenol in combination. In the case of using the novolak resin, it is particularly easy to obtain a resin composition that can form a black matrix that is not easy to flow excessively due to heating during post-baking. Although the blending ratio of cresol and 2,3,5-trimethylphenol is not particularly limited, it is preferably 70/30 based on the molar ratio of m-cresol/2,3,5-trimethylphenol Above 95/5. [0047] (Aldehydes) As the aldehydes used in the production of the novolak resin (a-2), for example, formaldehyde, paraformaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, and acetaldehyde can be cited. These aldehydes can be used alone or in combination of two or more kinds. [0048] (Acid catalyst) The acid catalyst used in the production of novolak resin (a-2) includes, for example, inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and phosphorous acid; formic acid, oxalic acid, acetic acid, and diethyl Organic acids such as sulfuric acid and p-toluenesulfonic acid; and metal salts such as zinc acetate. These acid catalysts may be used alone or in combination of two or more kinds. [0049] (Molecular weight) From the viewpoint of the resistance of the black matrix formed using the resin composition to the flow caused by heating, the polystyrene conversion weight average molecular weight (Mw; (Referred to as "weight average molecular weight") the lower limit is preferably 2000, more preferably 5000, particularly preferably 10000, further preferably 15000, most preferably 20000, and the upper limit is preferably 50000, more preferably 45000 , Further preferably 40,000, most preferably 35,000. [0050] As the novolak resin (a-2), at least two types of novolak resins having different polystyrene conversion weight average molecular weights can be used in combination. By using resins with different weight average molecular weights in combination of sizes, the developability of the resin composition can be balanced with the heat resistance of the black matrix formed by the resin composition. [0051] [Modified epoxy resin (a-3)] From the viewpoint of achieving higher fluidity resistance during baking and higher water resistance of the cured film, the main chain contains an aromatic ring ( A) Alkali-soluble resins may also contain polybasic acid anhydrides (a-3c) adducts (a-3) as the reaction products of epoxy compounds (a-3a) and unsaturated group-containing carboxylic acids (a-3b) ). The adduct (a-3) is also referred to as "modified epoxy resin (a-3)". In addition, in the specification and claims of this application, a compound that meets the above definition and does not belong to the aforementioned resin (a-1) with a Cado structure is referred to as a modified epoxy resin (a-3). [0052] Hereinafter, the epoxy compound (a-3a), the unsaturated group-containing carboxylic acid (a-3b), and the polybasic acid anhydride (a-3c) will be described. [0053] <Epoxy compound (a-3a)> The epoxy compound (a-3a) is not particularly limited as long as it is a compound having an epoxy group, and it may be an aromatic epoxy compound having an aromatic group. It may be an aliphatic epoxy compound not containing an aromatic group, and an aromatic epoxy compound having an aromatic group is preferred. However, when the polybasic acid anhydride (a-3c) does not contain an aromatic group, in order to introduce an aromatic ring into the main chain, an aromatic epoxy compound having an aromatic group is used as the epoxy compound (a-3a). The epoxy compound (a-3a) may be a monofunctional epoxy compound or a multifunctional epoxy compound having two or more functions, and a multifunctional epoxy compound is preferred. [0054] As specific examples of the epoxy compound (a-3a), bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, Bifunctional epoxy resins such as naphthalene type epoxy resin and biphenyl type epoxy resin; glycidyl ester type epoxy resin such as dimer acid glycidyl ester and triglycidyl ester; tetraglycidyl amino diphenyl Glycidyl methane, triglycidyl p-aminophenol, tetraglycidyl metaxylylenediamine and tetraglycidyl diaminomethyl cyclohexane and other glycidyl amine epoxy resins; triglycidyl isocyanate Heterocyclic epoxy resins such as urate esters; phloroglucinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, trihydroxyphenylmethane triglycidyl ether, glycerol triglycidyl ether, 2 -[4-(2,3-glycidoxy)phenyl]-2-[4-[1,1-bis[4-(2,3-glycidoxy)phenyl]ethyl] Phenyl]propane and 1,3-bis[4-[1-[4-(2,3-epoxypropoxy)phenyl]-1-[4-[1-[4-(2,3- Glycidyloxy)phenyl]-1-methylethyl]phenyl]ethyl]phenoxy]-2-propanol and other trifunctional epoxy resins; tetrahydroxyphenylethane tetraglycidyl Four functional epoxy resins such as ether, tetraglycidyl benzophenone, bisresorcinol tetraglycidyl ether, and tetraglycidoxy biphenyl. [0055] In addition, as the epoxy compound (a-3a), an epoxy compound having a biphenyl skeleton is preferable. The epoxy compound having a biphenyl skeleton preferably has at least one biphenyl skeleton represented by the following formula (a-3a-1) in the main chain. The epoxy compound having a biphenyl skeleton is preferably a polyfunctional epoxy compound having two or more epoxy groups. By using an epoxy compound having a biphenyl skeleton, it is easy to obtain a resin composition that has an excellent balance between sensitivity and developability, and can form a black matrix with excellent adhesion to the substrate. [0056]

In formula (a-3a-1), R ^a7 Each is independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a halogen atom, or a phenyl group which may have a substituent, and j is an integer of 1 to 4. [0057] In R ^a7 In the case of an alkyl group having 1 to 12 carbon atoms, specific examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and tert Butyl, n-pentyl, isopentyl, sec-pentyl, t-pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, t-octyl, n-nonyl, isononyl, N-decyl, isodecyl, n-undecyl and n-dodecyl. [0058] In R ^a7 In the case of a halogen atom, specific examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. [0059] In R ^a7 In the case of a phenyl group which may have a substituent, the number of substituents on the phenyl group is not particularly limited. The number of substituents on the phenyl group is 0-5, preferably 0 or 1. Examples of the substituent include alkyl groups having 1 to 4 carbon atoms, alkoxy groups having 1 to 4 carbon atoms, aliphatic acyl groups having 2 to 4 carbon atoms, halogen atoms, cyano groups, and nitro groups. [0060] The epoxy compound (a-3a) having a biphenyl skeleton represented by the above formula (a-3a-1) is not particularly limited, and examples thereof include those represented by the following formula (a-3a-2) Represents the epoxy compound.

In formula (a-3a-2), R ^a7 And j is the same as the formula (a-3a-1), k is the average repeating number of the unit in parentheses, which is 0-10. [0061] Among the epoxy compounds represented by the formula (a-3a-2), since it is particularly easy to obtain a resin composition having an excellent balance between sensitivity and developability, the following formula (a-3a-3) is preferred The compound represented.

In formula (a-3a-3), k is the same as formula (a-3a-2). [0062] <Unsaturated group-containing carboxylic acid (a-3b)> When preparing the modified epoxy compound (a-3), the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a -3b) Reaction. The unsaturated group-containing carboxylic acid (a-3b) is preferably a monocarboxylic acid having a reactive unsaturated double bond such as an acrylic group or a methacrylic group in the molecule. Examples of the unsaturated group-containing carboxylic acid include acrylic acid, methacrylic acid, β-styryl acrylic acid, β-furfuryl acrylic acid, α-cyanocinnamic acid, and cinnamic acid. In addition, the unsaturated group-containing carboxylic acid (a-3b) can be used alone or in combination of two or more kinds. [0063] The epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b) can be reacted by a known method. As a preferable reaction method, for example, the following method can be mentioned: tertiary amine such as triethylamine and benzylethylamine, dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride , Quaternary ammonium salts such as benzyltriethylammonium chloride, pyridine or triphenylphosphine, etc. as a catalyst to make epoxy compound (a-3a) and unsaturated group-containing carboxylic acid (a-3b) in an organic solvent React at a reaction temperature of 50-150°C for several hours to tens of hours. [0064] The ratio of the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b) used in the reaction is based on the epoxy equivalent of the epoxy compound (a-3a) and the unsaturated group-containing The ratio of the carboxylic acid (a-3b) to the carboxylic acid equivalent is usually 1:0.5 to 1:2, preferably 1:0.8 to 1:1.25, particularly preferably 1:0.9 to 1:1.1. If the ratio of the used amount of epoxy compound (a-3a) to the used amount of unsaturated group-containing carboxylic acid (a-3b) is 1:0.5 to 1:2 based on the aforementioned equivalent ratio, the crosslinking efficiency will be improved. The tendency is thus better. [0065] (Polybasic acid anhydride (a-3c)) Polybasic acid anhydride (a-3c) is an anhydride of a carboxylic acid having two or more carboxyl groups. The polybasic acid anhydride (a-3c) is not particularly limited, and examples thereof include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, Methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride, 3-methylhexahydrophthalic anhydride Acid anhydride, 4-methylhexahydrophthalic anhydride, 3-ethylhexahydrophthalic anhydride, 4-ethylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, 3-methyl Tetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, 4-ethyltetrahydrophthalic anhydride, in the following formula (a- The compound represented by 3c-1) and the compound represented by the following formula (a-3c-2). Moreover, polybasic acid anhydride (a-3c) can be used individually or in combination of 2 or more types. [0066]

In formula (a-3a-2), R ^a8 It represents an alkylene group which may have a substituent having 1 to 10 carbon atoms. [0067] As the polybasic acid anhydride (a-3c), since it is easy to obtain a resin composition having an excellent balance between sensitivity and developability, it is preferably a compound having two or more benzene rings. In addition, the polybasic acid anhydride (a-3c) more preferably contains at least one of the compound represented by the above formula (a-3c-1) and the compound represented by the above formula (a-3c-2). [0068] The method of reacting the epoxy compound (a-3a) with the unsaturated group-containing carboxylic acid (a-3b) and then reacting the polybasic acid anhydride (a-3c) can be appropriately selected from known methods. In addition, the usage ratio is based on the molar number of the OH group in the component after the reaction of the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b) and the anhydride of the polybasic acid anhydride (a-3c) The base equivalent ratio is usually 1:1 to 1:0.1, preferably 1:0.8 to 1:0.2. By making the said usage-amount ratio into the said range, it becomes easy to obtain the resin composition with good developability. [0069] In addition, the acid value of the modified epoxy resin (a-3) is preferably 10 mgKOH/g or more and 150 mgKOH/g or less, and more preferably 70 mgKOH/g or more and 110 mgKOH/g or less in terms of resin solid content. By setting the acid value of the resin to 10 mgKOH/g or more, sufficient solubility in the developer can be obtained, and by setting the acid value of the resin to 150 mgKOH/g or less, sufficient curability can be obtained and the surface properties can be improved. [0070] In addition, the weight average molecular weight of the modified epoxy resin (a-3) is preferably 1,000 or more and 40,000 or less, more preferably 2,000 or more and 30,000 or less. By making the weight average molecular weight 1000 or more, it is easy to form a black matrix with excellent heat resistance and strength. In addition, by setting the weight average molecular weight to 40,000 or less, it is easy to obtain a resin composition exhibiting sufficient solubility in the developer. [Acrylic resin (a-4)] The (A) alkali-soluble resin may also contain acrylic resin (a-4) within the range that does not interfere with the purpose of the present invention. In addition, the acrylic resin usually does not contain an aromatic ring in the main chain, and therefore (A) the alkali-soluble resin preferably does not contain the acrylic resin (a-4). [0072] As the acrylic resin (a-4), acrylic resins containing structural units derived from (meth)acrylic acid and/or structural units derived from other monomers such as (meth)acrylate can be used. (Meth)acrylic acid is acrylic acid or methacrylic acid. The (meth)acrylate is a substance represented by the following formula (a-4-1), and is not particularly limited as long as it does not interfere with the purpose of the present invention. [0073]

[0074] In the above formula (a-4-1), R ^a9 Is a hydrogen atom or a methyl group, R ^a10 It is a monovalent organic base. The organic group may include a bond or substituent other than a hydrocarbon group such as a hetero atom in the organic group. In addition, the organic group may be any of linear, branched, and cyclic. [0075] As R ^a10 The substituents other than the hydrocarbon group in the organic group are not particularly limited as long as they do not impair the effect of the present invention. Examples include halogen atoms, hydroxyl groups, mercapto groups, thioether groups, cyano groups, isocyano groups, cyano groups, and isocyano groups. Cyanosyl, thiocyano, isothiocyano, silyl, silanol, alkoxy, alkoxycarbonyl, aminomethyl, thioaminomethyl, nitro, Nitroso group, carboxyl group, carboxylate group, acyl group, acyloxy group, sulfinyl group, sulfo group, sulfonato (sulfonato), phosphino group, phosphinyl group, phosphinyl group, phosphonato group (phosphonato), hydroxyl group Amine group, alkyl ether group, alkyl sulfide group, aryl ether group, aryl sulfide group, amine group (-NH ₂ , -NHR, -NRR': R and R'each independently represent a hydrocarbon group) and the like. The hydrogen atoms contained in the above substituents may also be substituted by hydrocarbon groups. In addition, the hydrocarbon group contained in the above-mentioned substituent may be any of linear, branched, and cyclic. [0076] As R ^a10 , Preferably an alkyl group, an aryl group, an aralkyl group or a heterocyclic group, and these groups may be substituted by a halogen atom, a hydroxyl group, an alkyl group or a heterocyclic group. In addition, in the case where these groups include an alkylene moiety, the alkylene moiety may be interrupted by an ether bond, a thioether bond, or an ester bond. [0077] When the alkyl group is linear or branched, the number of carbon atoms is preferably 1-20, more preferably 1-15, and particularly preferably 1-10. Examples of preferred alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, and sec-pentyl. Base, tert-pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, n-decyl, isodecyl, etc. [0078] When the alkyl group is an alicyclic group or a group containing an alicyclic group, preferred alicyclic groups contained in the alkyl group include monocyclic aliphatic groups such as cyclopentyl and cyclohexyl. Cyclic groups, or polycyclic alicyclic groups such as adamantyl, norbornyl, isobornyl, tricyclononyl, tricyclodecyl and tetracyclododecyl, etc. [0079] In addition, the acrylic resin (a-4) may be obtained by polymerizing monomers other than (meth)acrylate. Examples of such monomers include (meth)acrylamides, unsaturated carboxylic acids, allyl compounds, vinyl ethers, vinyl esters, styrenes, and the like. These monomers can be used alone or in combination of two or more kinds. [0080] Examples of (meth)acrylamides include (meth)acrylamide, N-alkyl(meth)acrylamide, N-aryl(meth)acrylamide, N,N -Dialkyl(meth)acrylamide, N,N-aryl(meth)acrylamide, N-methyl-N-phenyl(meth)acrylamide, N-hydroxyethyl-N -Methyl (meth)acrylamide and the like. [0081] Examples of unsaturated carboxylic acids include monocarboxylic acids such as crotonic acid; dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, and itaconic acid; and anhydrides of these dicarboxylic acids Wait. [0082] Examples of allyl compounds include allyl acetate, allyl hexanoate, allyl octoate, allyl laurate, allyl palmitate, allyl stearate, and allyl benzoate. Allyl esters such as esters, allyl acetate, allyl lactate, etc.; allyloxyethanol, etc. [0083] Examples of vinyl ethers include hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxyethyl vinyl ether, and ethoxyethyl ethylene. Base ether, chloroethyl vinyl ether, 1-methyl-2,2-dimethylpropyl vinyl ether, 2-ethylbutyl vinyl ether, hydroxyethyl vinyl ether, diethylene glycol ethylene Alkyl ether, dimethylaminoethyl vinyl ether, diethylaminoethyl vinyl ether, butylaminoethyl vinyl ether, benzyl vinyl ether, tetrahydrofurfuryl vinyl ether, etc. Vinyl ether; vinyl phenyl ether, vinyl tolyl ether, vinyl chlorophenyl ether, vinyl-2,4-dichlorophenyl ether, vinyl naphthyl ether, vinyl anthracenyl ether and other ethylene Aryl ether and so on. [0084] Examples of vinyl esters include vinyl butyrate, vinyl isobutyrate, trimethyl vinyl acetate, diethyl vinyl acetate, vinyl valerate, vinyl caproate, and vinyl chloroacetate. , Vinyl dichloroacetate, methoxy vinyl acetate, butoxy vinyl acetate, phenyl vinyl acetate, acetyl vinyl acetate, vinyl lactate, β-phenyl butyrate vinyl ester, vinyl benzoate , Vinyl salicylate, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, vinyl naphthoate, etc. [0085] Examples of styrenes include styrene; methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, isopropyl styrene, and butyl benzene Ethylene, hexyl styrene, cyclohexyl styrene, decyl styrene, benzyl styrene, chloromethyl styrene, trifluoromethyl styrene, ethoxy methyl styrene, acetoxy methyl styrene Alkylstyrenes such as methoxystyrene, 4-methoxy-3-methylstyrene, dimethoxystyrene and other alkoxystyrenes; chlorostyrene, dichlorostyrene, trichlorobenzene Ethylene, tetrachlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluorostyrene, trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, 4-fluorostyrene -3-Trifluoromethylstyrene and other halogenated styrenes. [0086] The amount of the structural unit derived from (meth)acrylic acid and the amount of structural unit derived from other monomers in the acrylic resin (a-4) is not particularly limited within the scope of not impairing the purpose of the present invention. . The amount of the structural unit derived from (meth)acrylic acid in the acrylic resin (a-4) is preferably 5-50% by mass, more preferably 10-30% by mass relative to the mass of the acrylic resin. [0087] The weight average molecular weight of the acrylic resin (a-4) is preferably 2,000 to 50,000, more preferably 5,000 to 30,000. By setting the weight average molecular weight of the acrylic resin (a-4) within the above-mentioned range, there is a tendency to easily obtain a balance between the film forming performance of the resin composition and the developability after exposure. [0088] With respect to the total mass of the solid content of the resin composition, the content of (A) alkali-soluble resin is preferably 10 to 65% by mass, more preferably 15 to 50% by mass. By setting the content of (A) alkali-soluble resin within the above range, it is easy to obtain a resin composition having excellent developability. [0089] In the case of using Cardo resin (a-1), its content relative to the total mass of the solid content of the resin composition is preferably 5-40% by mass, more preferably 8-35% by mass, and furthermore It is preferably 10 to 30% by mass. The content of the novolak resin (a-2) is preferably 0.2 to 12% by mass, more preferably 0.5 to 8% by mass, and still more preferably 1 to 4% by mass relative to the total mass of the solid components of the resin composition. The content of the modified epoxy resin (a-3) is preferably 0.2-20% by mass, more preferably 1-15% by mass, and still more preferably 2-12% by mass relative to the total mass of the solid content of the resin composition . By using the above-mentioned resin in an amount within the above-mentioned range, it is easy to obtain a resin composition having desired characteristics. [0090] <(B) Photopolymerizable compound> The resin composition contains (B) a photopolymerizable compound. (B) The photopolymerizable compound is preferably a monomer having an ethylenically unsaturated group. There are monofunctional monomers and multifunctional monomers in the monomers. [0091] Examples of monofunctional monomers include (meth)acrylamide, methylol (meth)acrylamide, methoxymethyl (meth)acrylamide, and ethoxymethyl (meth)acrylamide. Base) acrylamide, propoxymethyl (meth) acrylamide, butoxy methoxymethyl (meth) acrylamide, N-methylol (meth) acrylamide, N- Hydroxymethyl (meth)acrylamide, (meth)acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, crotonic acid, 2 -Acrylamin-2-methylpropanesulfonic acid, tert-butylacrylamide sulfonic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, (meth) 2-ethylhexyl acrylate, cyclohexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-phenoxy-2-hydroxypropyl (meth)acrylate, 2-(meth)acryloxy-2-hydroxypropyl phthalate, glycerol mono(meth)acrylate , Tetrahydrofurfuryl (meth)acrylate, dimethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate , (Meth)acrylic acid 2,2,3,3-tetrafluoropropyl ester, phthalic acid derivative half (meth)acrylate, etc. These monofunctional monomers can be used alone or in combination of two or more kinds. [0092] On the other hand, as multifunctional monomers, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, Propylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate (Meth)acrylate, trimethylolpropane tri(meth)acrylate, glycerol di(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexa Acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 2,2-bis(4-(meth)acryloyloxydiethoxyphenyl)propane, 2,2-bis(4-(meth)acryloyloxypolyethoxyphenyl)propane, 2-Hydroxy-3-(meth)acryloxypropyl(meth)acrylate, ethylene glycol diglycidyl ether di(meth)acrylate, diethylene glycol diglycidyl ether di( Meth) acrylate, diglycidyl phthalate di(meth)acrylate, glycerol triacrylate, glycerol polyglycidyl ether poly(meth)acrylate, urethane ( Meth) acrylic acid (ie, the reaction product of toluene diisocyanate, trimethylhexamethylene diisocyanate or hexamethylene diisocyanate and 2-hydroxyethyl (meth)acrylate), methylene bis(meth) (Methyl)acrylamide, (meth)acrylamide methylene ether, polyol and N-methylol (meth)acrylamide condensate and other polyfunctional monomers, triacrylamide hexahydro Oxazine and so on. These polyfunctional monomers can be used individually or in combination of 2 or more types. [0093] Among these monomers having an ethylenically unsaturated group, in view of the tendency to improve the adhesion of the resin composition to the substrate and the strength of the resin composition after curing, a polyfunctionality of trifunctional or higher is preferred The monomer is more preferably a polyfunctional monomer with more than 4 functions, and more preferably a multifunctional monomer with more than 5 functions. Specifically, it is preferable to use a polyfunctional monomer having a function of 5 or more, and it is more preferable to use dipentaerythritol penta(meth)acrylate and/or dipentaerythritol hexa(meth)acrylate. [0094] The content of the (B) photopolymerizable compound in the resin composition is preferably 1-50% by mass, more preferably 5-40% by mass relative to the total mass of the solid content of the resin composition. By setting the content of the (B) photopolymerizable compound in the resin composition within the above-mentioned range, there is a tendency to easily obtain a balance of sensitivity, developability, and resolution. [0095] <(C) Photoinitiator> The (C) photoinitiator is not particularly limited, and conventionally known photoinitiators can be used. [0096] Specifically, as the (C) photopolymerization initiator, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, 1-[4- (2-Hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propanone, 1-(4-isopropylphenyl)-2-hydroxy-2-methyl-1-propanone, 1-(4-Dodecylphenyl)-2-hydroxy-2-methyl-1-propanone, 2,2-dimethoxy-1,2-diphenyl-1-ethanone, bis( 4-dimethylaminophenyl) ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-propanone, 2-benzyl-2-di Methylamino-1-(4-morpholinylphenyl)-1-butanone, O-acetyl-1-[6-(2-methylbenzyl)-9-ethyl-9H -Zolazol-3-yl] ethyl ketoxime, (9-ethyl-6-nitro-9H-azol-3-yl) [4-(2-methoxy-1-methylethoxy) -2-Methylphenyl]methanone O-acetoxyimino, 2-(benzyloxyimino)-1-[4-(phenylthio)phenyl]-1-octanone , 2,4,6-trimethylbenzyl diphenyl phosphine oxide, 4-benzyl-4'-methyl dimethyl sulfide, 4-dimethylamino benzoic acid, 4-di Methyl methylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate, 4-dimethylamino-2-ethylhexyl benzoic acid, 4 -Dimethylamino-2-isopentylbenzoic acid, benzyl-β-methoxyethyl acetal, benzyl dimethyl ketal, 1-phenyl-1,2-propanedione -2-(O-ethoxycarbonyl)oxime, methyl phthalate, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone Ketone, 1-chloro-4-propoxythioxanthone, thioxanthene, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2-methylthioxanthene, 2-isopropylthioxanthone, 2 -Ethylanthraquinone, octamethylanthraquinone, 1,2-benzoanthraquinone, 2,3-diphenylanthraquinone, azobisisobutyronitrile, benzyl peroxide, cumene hydroperoxide , 2-Mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2-(o-chlorophenyl)-4,5-bis(m-methoxyphenyl)-imidazolyl dimer Compounds, benzophenone, 2-chlorobenzophenone, p,p'-bisdimethylaminobenzophenone, 4,4'-bisdiethylaminobenzophenone, 4,4'-dichloro Benzophenone, 3,3-dimethyl-4-methoxybenzophenone, benzoin, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether , Benzoin n-butyl ether, benzoin isobutyl ether, benzoin butyl ether, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethyl acetophenone Methylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, p-tert-butylacetophenone, p-dimethylaminoacetophenone, p-tert-butyl trichloroacetophenone, p-tert-butyl Dichloroacetophenone, α,α-dichloro-4-phenoxyacetophenone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzocycloheptanone Pentyl-4-dimethyl Amino benzoate, 9-phenylacridine, 1,7-bis-(9-acridinyl)heptane, 1,5-bis-(9-acridinyl)pentane, 1,3 -Bis-(9-acridinyl)propane, p-methoxytriazine, 2,4,6-tris(trichloromethyl)s-triazine, 2-methyl-4,6-bis(trichloromethyl) Yl)s-triazine, 2-[2-(5-methylfuran-2-yl)vinyl]-4,6-bis(trichloromethyl)s-triazine, 2-[2-(furan-2 -Yl)vinyl]-4,6-bis(trichloromethyl)s-triazine, 2-[2-(4-diethylamino-2-methylphenyl)vinyl]-4,6 -Bis(trichloromethyl)s-triazine, 2-[2-(3,4-dimethoxyphenyl)vinyl]-4,6-bis(trichloromethyl)s-triazine, 2- (4-Methoxyphenyl)-4,6-bis(trichloromethyl)s-triazine, 2-(4-ethoxystyryl)-4,6-bis(trichloromethyl) Triazine, 2-(4-n-butoxyphenyl)-4,6-bis(trichloromethyl)s-triazine, 2,4-bis-trichloromethyl-6-(3-bromo-4 -Methoxy) phenyl s-triazine, 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)phenyl s-triazine, 2,4-bis-trichloromethyl 6-(3-bromo-4-methoxy)styrylphenyl s-triazine, 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)styrene Phenyl s-triazine and so on. These photoinitiators can be used individually or in combination of 2 or more types. [0097] Among them, from the viewpoint of sensitivity, it is particularly preferable to use an oxime-based photopolymerization initiator. Among the oxime-based photopolymerization initiators, particularly preferred oxime-based photopolymerization initiators include O-acetyl-1-[6-(2-methylbenzyl)-9-ethyl- 9H-oxazol-3-yl]ethanone oxime, 1-[9-ethyl-6-(pyrrol-2-ylcarbonyl)-9H-oxazol-3-yl] ethyl ketone-1-O-acetin Oxime and 2-(benzyloxyimino)-1-[4-(phenylthio)phenyl]-1-octanone. [0098] As the photopolymerization initiator, an oxime compound represented by the following formula (c1) is also preferably used.

R ^C1 Is a group selected from monovalent organic groups, amine groups, halogens, nitro groups and cyano groups, n1 is an integer of 0-4, n2 is 0 or 1, R ^C2 Is a phenyl group which may have a substituent or an azolyl group which may have a substituent, R ^C3 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. [0099] In the formula (c1), R ^C1 It is not particularly limited, and can be appropriately selected from various organic groups. In R ^C1 In the case of an organic group, preferred examples include alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyloxy groups, saturated aliphatic acyloxy groups, and alkoxycarbonyl groups. A substituted phenyl group, a phenoxy group which may have a substituent, a benzyloxy group which may have a substituent, a phenoxycarbonyl group which may have a substituent, a benzyloxy group which may have a substituent, may have Substituent phenylalkyl, optionally substituted naphthyl, optionally substituted naphthyloxy, optionally substituted naphthyloxy, optionally substituted naphthyloxycarbonyl, optionally substituted Naphthyloxy, naphthylalkyl which may have substituents, heterocyclic group which may have substituents, amino groups, amino groups substituted by one or two organic groups, morpholin-1-yl and quaternary groups Azin-1-yl, halogen, nitro and cyano, etc. When n1 is an integer from 2 to 4, R ^C1 Can be the same or different. In addition, the number of carbon atoms of a substituent does not include the number of carbon atoms of a substituent further possessed by the substituent. [0100] In R ^C1 In the case of an alkyl group, the number of carbon atoms is preferably 1-20, more preferably 1-6. In addition, in R ^C1 In the case of an alkyl group, it may be a straight chain or a branched chain. As R ^C1 Specific examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec Pentyl, tert-pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, n-decyl and isodecyl, etc. In addition, in R ^C1 In the case of an alkyl group, the alkyl group may include an ether bond (-O-) in the carbon chain. Examples of alkyl groups having ether bonds in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxyethyl. Oxyethyl and methoxypropyl, etc. [0101] In R ^C1 In the case of an alkoxy group, the number of carbon atoms is preferably 1-20, more preferably 1-6. In addition, in R ^C1 In the case of an alkoxy group, it may be a straight chain or a branched chain. As in R ^C1 Specific examples of alkoxy groups include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy, tert-butoxy, n-butoxy Pentyloxy, isopentyloxy, sec-pentyloxy, tert-pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy, n-nonyl Oxy, isononyloxy, n-decyloxy and isodecyloxy, etc. In addition, in R ^C1 In the case of an alkoxy group, the alkoxy group may include an ether bond (-O-) in the carbon chain. Examples of alkoxy groups having ether bonds in the carbon chain include methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, and ethoxyethoxyethoxy. , Propoxyethoxyethoxy and methoxypropoxy, etc. [0102] In R ^C1 In the case of a cycloalkyl group or a cycloalkoxy group, the number of carbon atoms is preferably 3-10, more preferably 3-6. As R ^C1 Specific examples in the case of cycloalkyl include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and the like. As R ^C1 Specific examples in the case of cycloalkoxy include cyclopropoxy, cyclobutoxy, cyclopentyloxy, cyclohexyloxy, cycloheptyloxy, cyclooctyloxy and the like. [0103] In R ^C1 In the case of a saturated aliphatic acyl group or a saturated aliphatic acyloxy group, the number of carbon atoms is preferably 2-20, more preferably 2-7. As R ^C1 When it is a saturated aliphatic group, specific examples include acetyl group, propionyl group, n-butyryl group, 2-methylpropionyl group, n-pentanyl group, 2,2-dimethylpropionyl group, n-hexyl group N-heptanyl, n-octyl, n-nonanyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-decyl Pentadecyl and n-hexadecyl and so on. As R ^C1 When it is a saturated aliphatic oxy group, specific examples include acetoxy group, propoxy group, n-butoxy group, 2-methylpropoxy group, n-pentoxy group, 2 , 2-Dimethylpropanyloxy, n-hexyloxy, n-heptanyloxy, n-octyloxy, n-nonanyloxy, n-decanoyloxy, n-undecyloxy Oxy, n-dodecyloxy, n-tridecyloxy, n-tetradecyloxy, n-pentadecyloxy, n-hexadecyloxy and the like. [0104] In R ^C1 In the case of an alkoxycarbonyl group, the number of carbon atoms is preferably 2-20, more preferably 2-7. As R ^C1 Specific examples of the alkoxycarbonyl group include methoxycarbonyl, ethoxycarbonyl, n-propyloxycarbonyl, isopropyloxycarbonyl, n-butyloxycarbonyl, isobutyloxycarbonyl, S-butyloxycarbonyl, tert-butyloxycarbonyl, n-pentyloxycarbonyl, isopentyloxycarbonyl, sec-pentyloxycarbonyl, tert-pentyloxycarbonyl, n-hexyloxycarbonyl, n-heptyloxycarbonyl, n-pentoxycarbonyl, Octyloxycarbonyl, isooctyloxycarbonyl, sec-octyloxycarbonyl, tert-octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, isodecyloxycarbonyl, etc. [0105] In R ^C1 In the case of a phenylalkyl group, the number of carbon atoms is preferably 7-20, more preferably 7-10. In addition, in R ^C1 In the case of naphthylalkyl, the number of carbon atoms is preferably 11-20, more preferably 11-14. As R ^C1 Specific examples in the case of phenylalkyl include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. As R ^C1 Specific examples in the case of naphthylalkyl include α-naphthylmethyl, β-naphthylmethyl, 2-(α-naphthyl)ethyl, and 2-(β-naphthyl)ethyl. In R ^C1 When it is phenylalkyl or naphthylalkyl, R ^C1 The phenyl group or the naphthyl group may further have a substituent. [0106] In R ^C1 In the case of a heterocyclic group, the heterocyclic group is a five-membered or six-membered monocyclic ring containing more than one N, S, O, or a heterocyclic group formed by condensing the monocyclic rings with each other, or the monocyclic ring and benzene A heterocyclic group formed by ring condensation. When the heterocyclic group is a condensed ring, the number of rings is 3 or less. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrazine, pyrimidine, Pyridazine, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, oxazole, purine, quinoline, isoquine Quinoline, quinazoline, phthalazine, cinnoline and quinoxaline, etc. In R ^C1 When it is a heterocyclic group, the heterocyclic group may further have a substituent. [0107] In R ^C1 When it is an amine group substituted with one or two organic groups, preferable examples of the organic group include alkyl groups with 1 to 20 carbon atoms, cycloalkyl groups with 3 to 10 carbon atoms, and 2 to 20 carbon atoms. The saturated aliphatic aliphatic group, the optionally substituted phenyl group, the optionally substituted benzyl group, the optionally substituted C7-20 phenylalkyl group, the optionally substituted naphthyl group, An optionally substituted naphthyl methanoyl group, an optionally substituted naphthyl alkyl group having 11 to 20 carbon atoms, a heterocyclic group, and the like. Specific examples of these better organic bases and R ^C1 same. As specific examples of amino groups substituted with one or two organic groups, methylamino groups, ethylamino groups, diethylamino groups, n-propylamino groups, di-n-propylamino groups, and isopropylamino groups can be cited. N-butylamino, n-butylamino, di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decylamine Group, phenylamino group, naphthylamino group, acetylamino group, propionylamino group, n-butyrylamino group, n-pentanylamino group, n-hexylamino group, n-heptanylamino group, n Octylamino, n-decylamino, benzylamino, α-naphthylamino, β-naphthylamino, etc. [0108] As R ^C1 When the phenyl group, naphthyl group and heterocyclic group contained therein further have a substituent, the substituent includes an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and 2 to 7 carbon atoms. Saturated aliphatic acyl group, alkoxycarbonyl group with 2 to 7 carbon atoms, saturated aliphatic acyloxy group with 2 to 7 carbon atoms, monoalkylamino group with alkyl group of 1 to 6 carbon atoms , Dialkylamino groups, morpholin-1-yl, piperazin-1-yl, halogen, nitro and cyano groups with alkyl groups of 1 to 6 carbon atoms. In R ^C1 When the phenyl group, naphthyl group and heterocyclic group contained therein further have substituents, the number of the substituents is not limited within a range that does not interfere with the purpose of the present invention, but it is preferably 1 to 4. R ^C1 When the phenyl group, the naphthyl group, and the heterocyclic group contained in it have multiple substituents, the multiple substituents may be the same or different. [0109] R ^C1 Among them, it is preferably selected from alkyl groups with 1 to 6 carbon atoms, alkoxy groups with 1 to 6 carbon atoms, and carbon atoms from the viewpoints of stable chemical properties, low steric hindrance, and easy synthesis of oxime ester compounds. 2-7 saturated aliphatic aliphatic groups, more preferably C1-6 alkyl groups, particularly preferably methyl groups. [0110] For R ^C1 For the bonded phenyl group, the bonding position between the phenyl group and the main skeleton of the oxime ester compound is regarded as position 1, and the position of methyl group is regarded as position 2, R ^C1 The bonding position on the phenyl group is preferably the 4-position or the 5-position, and more preferably the 5-position. In addition, n1 is preferably an integer of 0-3, more preferably an integer of 0-2, and particularly preferably 0 or 1. [0111] R ^C2 It is a phenyl group which may have a substituent, or an azolyl group which may have a substituent. In addition, in R ^C2 In the case of a azole group which may have a substituent, the nitrogen atom on the azole group may be substituted with an alkyl group having 1 to 6 carbon atoms. [0112] In R ^C2 Among them, the substituents of the phenyl group or the azole group are not particularly limited within the scope that does not interfere with the purpose of the present invention. Examples of preferable substituents that the phenyl group or azolazole group may have on the carbon atom include an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, and 3 to 10 carbon atoms. Cycloalkyl groups, cycloalkoxy groups with 3 to 10 carbon atoms, saturated aliphatic acyl groups with 2 to 20 carbon atoms, alkoxycarbonyl groups with 2 to 20 carbon atoms, saturated aliphatic groups with 2 to 20 carbon atoms Aliphatic acyloxy group, optionally substituted phenyl group, optionally substituted phenoxy group, optionally substituted phenylthio group, optionally substituted benzyloxy group, optionally substituted benzene group Oxycarbonyl, optionally substituted benzyloxy, optionally substituted phenylalkyl with 7 to 20 carbon atoms, optionally substituted naphthyl, optionally substituted naphthyloxy, The naphthyl group which may have a substituent, the naphthyloxycarbonyl group which may have a substituent, the naphthyloxy group which may have a substituent, the naphthylalkyl group with 11 to 20 carbon atoms which may have a substituent, Heterocyclic groups with substituents, heterocyclic carbonyl groups which may have substituents, amine groups, amino groups substituted by one or two organic groups, morpholin-1-yl and azizin-1-yl, halogen, Nitro and cyano, etc. [0113] In R ^C2 In the case of azazolyl, examples of preferable substituents that azazolyl may have on the nitrogen atom include an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, and carbon atoms. Saturated aliphatic acyl group with 2-20 atoms, alkoxycarbonyl group with 2-20 carbon atoms, phenyl group which may have substituents, benzyl group which may have substituents, phenoxy group which may have substituents Carbonyl, optionally substituted phenylalkyl with 7 to 20 carbon atoms, optionally substituted naphthyl, optionally substituted naphthoyl, optionally substituted naphthoxycarbonyl, optionally substituted The group is a naphthylalkyl group having 11 to 20 carbon atoms, a heterocyclic group which may have a substituent, a heterocyclic carbonyl group which may have a substituent, and the like. Among these substituents, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 6 carbon atoms is more preferred, and an ethyl group is particularly preferred. [0114] Specific examples of substituents that a phenyl group or a azole group may have include alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyl groups, alkoxycarbonyl groups, and saturated aliphatic groups. Aminooxy group, optionally substituted phenylalkyl group, optionally substituted naphthylalkyl group, optionally substituted heterocyclic group and aminoamino group substituted by one or two organic groups, and R ^C1 same. [0115] In R ^C2 Among them, examples of the substituent when the phenyl group, naphthyl group, and heterocyclic group contained in the substituent group of the phenyl group or the azole group further have a substituent group include an alkyl group having 1 to 6 carbon atoms; carbon Alkoxy group with 1 to 6 atoms; saturated aliphatic acyl group with 2 to 7 carbon atoms; alkoxycarbonyl group with 2 to 7 carbon atoms; saturated aliphatic acyloxy group with 2 to 7 carbon atoms; Phenyl; naphthyl; benzyl; naphthyl; substituted by a group selected from the group consisting of alkyl having 1 to 6 carbon atoms, morpholin-1-yl, pyrazine-1-yl and phenyl Benzoyl; monoalkylamino group having an alkyl group with 1 to 6 carbon atoms; dialkylamino group having an alkyl group with 1 to 6 carbon atoms; morpholin-1-yl; piperazine-1 -Base; halogen; nitro; cyano. When the phenyl, naphthyl, and heterocyclic groups contained in the substituents of the phenyl or azazolyl group further have substituents, the number of the substituents is not limited within the range that does not interfere with the purpose of the present invention, but is more Preferably, it is 1～4. When the phenyl group, the naphthyl group, and the heterocyclic group have multiple substituents, the multiple substituents may be the same or different. [0116] In R ^C2 Among them, from the viewpoint of easily obtaining a photopolymerization initiator with excellent sensitivity, the group represented by the following formula (c2) or (c3) is preferred, the group represented by the following formula (c2) is more preferred, and the following formula is particularly preferred (c2) means that and A is the base of S. [0117]

R ^c4 It is a group selected from a monovalent organic group, an amino group, a halogen, a nitro group, and a cyano group, A is S or O, and n3 is an integer of 0-4. [0118]

R ^c5 And R ^c6 Each is a monovalent organic group. [0119] R in formula (c2) ^c4 In the case of an organic group, it can be selected from various organic groups within a range that does not interfere with the purpose of the present invention. In formula (c2), as R ^c4 Preferred examples of organic groups include alkyl groups with 1 to 6 carbon atoms; alkoxy groups with 1 to 6 carbon atoms; saturated aliphatic acyl groups with 2 to 7 carbon atoms; and 2 to 7 carbon atoms. Alkoxycarbonyl of 7; saturated aliphatic aliphatic oxy with 2-7 carbon atoms; phenyl; naphthyl; benzyl; naphthyl; selected from alkyls with 1 to 6 carbon atoms , Morpholin-1-yl, piperazin-1-yl, and benzyl substituted with phenyl groups; monoalkylamino groups having an alkyl group having 1 to 6 carbon atoms; having 1 to 6 carbon atoms Dialkylamino group of 6 alkyl; morpholin-1-yl; piperazin-1-yl; halogen; nitro; cyano. [0120] In R ^c4 Among them, benzyl; naphthyl; benzyl substituted with a group selected from alkyl groups having 1 to 6 carbon atoms, morpholin-1-yl, pazizin-1-yl and phenyl An acyl group, a nitro group, more preferably a benzyl group; naphthyl group; 2-methylphenylcarbonyl group; 4-(piperazine-1-yl)phenylcarbonyl group; 4-(phenyl)phenylcarbonyl group. [0121] In addition, in the formula (c2), n3 is preferably an integer of 0 to 3, more preferably an integer of 0 to 2, and particularly preferably 0 or 1. In the case where n3 is 1, R ^c4 The position of the bond is relative to R ^c4 The position at which the bonded phenyl group is bonded to an oxygen atom or a sulfur atom is preferably a para position. [0122] Within the scope that does not interfere with the purpose of the present invention, R in formula (c3) ^c5 Can choose from a variety of organic bases. As R ^c5 Preferred examples include alkyl groups with 1 to 20 carbon atoms, cycloalkyl groups with 3 to 10 carbon atoms, saturated aliphatic acyl groups with 2 to 20 carbon atoms, and alkoxy groups with 2 to 20 carbon atoms. A carbonyl group, a phenyl group which may have a substituent, a benzyl group which may have a substituent, a phenoxycarbonyl group which may have a substituent, a phenylalkyl group with 7 to 20 carbon atoms which may have a substituent, Substituent naphthyl, optionally substituted naphthylmethyl, optionally substituted naphthyloxycarbonyl, optionally substituted naphthylalkyl with 11 to 20 carbon atoms, optionally substituted heterocycle Group and optionally substituted heterocyclic carbonyl group and the like. [0123] In R ^c5 Among them, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 6 carbon atoms is more preferred, and an ethyl group is particularly preferred. [0124] There is no particular limitation within the scope that does not interfere with the purpose of the present invention, R in formula (c3) ^c6 Can choose from a variety of organic bases. As R ^c6 Specific examples of preferable groups include an alkyl group having 1 to 20 carbon atoms, a phenyl group which may have a substituent, a naphthyl group which may have a substituent, and a heterocyclic group which may have a substituent. As R ^c6 Among these groups, phenyl which may have a substituent is more preferred, and 2-methylphenyl is particularly preferred. [0125] As R ^c4 , R ^c5 Or R ^c6 When the phenyl group, naphthyl group and heterocyclic group contained therein further have a substituent, the substituent includes an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and 2 to 7 carbon atoms. Saturated aliphatic acyl group, alkoxycarbonyl group with 2 to 7 carbon atoms, saturated aliphatic acyloxy group with 2 to 7 carbon atoms, monoalkylamino group with alkyl group of 1 to 6 carbon atoms , Dialkylaminoamino groups, morpholin-1-yl, azizin-1-yl, halogen, nitro and cyano groups with alkyl groups of 1 to 6 carbon atoms. R ^c4 , R ^c5 Or R ^c6 When the phenyl group, naphthyl group, and heterocyclic group contained in further have substituents, the number of the substituents is not limited as long as it does not interfere with the purpose of the present invention, but it is preferably 1 to 4. R ^c4 , R ^c5 Or R ^c6 When the phenyl group, the naphthyl group, and the heterocyclic group contained in it have multiple substituents, the multiple substituents may be the same or different. R in formula (c1) ^c3 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. As R ^c3 , A methyl group or an ethyl group is preferred, and a methyl group is particularly preferred. [0127] Among the oxime ester compounds represented by the formula (c1), particularly preferable compounds include the following PI-1 to PI-42.

[0128]

[0129]

[0130]

[0131]

[0132]

[0133] In addition, an oxime ester compound represented by the following formula (c4) is also preferable as a photopolymerization initiator. [0134]

R ^c7 Is a hydrogen atom, a nitro group or a monovalent organic group, R ^c8 And R ^c9 Each is a chain alkyl group which may have a substituent, a cyclic organic group which may have a substituent or a hydrogen atom, R ^c8 With R ^c9 Can be bonded to each other to form a ring, R ^c10 It is a monovalent organic group, R ^c11 It is a hydrogen atom, an optionally substituted alkyl group having 1 to 11 carbon atoms, or an optionally substituted aryl group, n4 is an integer of 0 to 4, and n5 is 0 or 1. [0135] Here, as the oxime compound used in the production of the oxime ester compound of the formula (c4), a compound represented by the following formula (c5) is preferred. [0136]

R ^c7 , R ^c8 , R ^c9 , R ^c10 , N4 and n5 are the same as formula (c4). In formulas (c4) and (c5), R ^c7 It is a hydrogen atom, a nitro group or a monovalent organic group. R ^c7 On the fluorene ring in formula (c4) and with -(CO) _n5 -The 6-membered aromatic ring to which the indicated group is bonded is different from the 6-membered aromatic ring. In formula (c4), R ^c7 The bonding position with respect to the fluorene ring is not particularly limited. The compound represented by formula (c4) has more than 1 R ^c7 In this case, from the viewpoints of easy synthesis of the compound represented by formula (c4), etc., more than one R is preferred ^c7 One of them is bonded to position 2 in the fluorene ring. In R ^c7 In the case of multiple, multiple R ^c7 It can be the same or different. [0138] In R ^c7 In the case of organic base, R ^c7 It is not particularly limited as long as it does not interfere with the purpose of the present invention, and it can be appropriately selected from various organic groups. As R ^c7 Preferred examples of organic groups include alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyloxy groups, saturated aliphatic acyloxy groups, alkoxycarbonyl groups, which may have substituents The phenyl group, the phenoxy group which may have a substituent, the benzyl group which may have a substituent, the phenoxycarbonyl group which may have a substituent, the benzyloxy group which may have a substituent, the benzyloxy group which may have a substituent Phenylalkyl, naphthyl which may have substituents, naphthyloxy which may have substituents, naphthyloxy which may have substituents, naphthoxycarbonyl which may have substituents, naphthyl which may have substituents Group oxy, naphthyl alkyl which may have substituents, heterocyclic group which may have substituents, heterocyclic carbonyl which may have substituents, amino groups substituted by one or two organic groups, morpholine-1 -Base and azizin-1-yl, etc. [0139] In R ^C7 In the case of an alkyl group, the number of carbon atoms of the alkyl group is preferably 1-20, more preferably 1-6. In addition, in R ^C7 In the case of an alkyl group, it may be a straight chain or a branched chain. As R ^C7 Specific examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec-pentyl Base, tert-pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, n-decyl and isodecyl, etc. In addition, in R ^C7 In the case of an alkyl group, the alkyl group may include an ether bond (-O-) in the carbon chain. Examples of alkyl groups having ether bonds in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxyethyl. Oxyethyl and methoxypropyl, etc. [0140] In R ^C7 In the case of an alkoxy group, the number of carbon atoms of the alkoxy group is preferably 1-20, more preferably 1-6. In addition, in R ^C7 In the case of an alkoxy group, it may be a straight chain or a branched chain. As R ^C7 Specific examples of alkoxy groups include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy, tert-butoxy, n-butoxy Pentyloxy, isopentyloxy, sec-pentyloxy, tert-pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy, n-nonyl Oxy, isononyloxy, n-decyloxy and isodecyloxy, etc. In addition, in R ^C7 In the case of an alkoxy group, the alkoxy group may include an ether bond (-O-) in the carbon chain. Examples of alkoxy groups having ether bonds in the carbon chain include methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, and ethoxyethoxyethoxy. , Propoxyethoxyethoxy and methoxypropoxy, etc. [0141] In R ^C7 In the case of a cycloalkyl group or a cycloalkoxy group, the number of carbon atoms of the cycloalkyl group or the cycloalkoxy group is preferably 3-10, more preferably 3-6. As R ^C7 Specific examples in the case of cycloalkyl include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and the like. As R ^C7 Specific examples in the case of cycloalkoxy include cyclopropoxy, cyclobutoxy, cyclopentyloxy, cyclohexyloxy, cycloheptyloxy, cyclooctyloxy and the like. [0142] In R ^C7 In the case of a saturated aliphatic acyl group or an aliphatic acyloxy group, the number of carbon atoms of the saturated aliphatic acyl group or aliphatic acyloxy group is preferably 2-21, more preferably 2-7. As R ^C7 When it is a saturated aliphatic group, specific examples include acetyl group, propionyl group, n-butyryl group, 2-methylpropionyl group, n-pentanyl group, 2,2-dimethylpropionyl group, n-hexyl group N-heptanyl, n-octyl, n-nonanyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-decyl Pentadecyl and n-hexadecyl and so on. As R ^C7 When it is a saturated aliphatic oxy group, specific examples include acetoxy group, propoxy group, n-butoxy group, 2-methylpropoxy group, n-pentoxy group, 2 , 2-Dimethylpropanyloxy, n-hexyloxy, n-heptanyloxy, n-octyloxy, n-nonanyloxy, n-decanoyloxy, n-undecyloxy Oxy, n-dodecyloxy, n-tridecyloxy, n-tetradecyloxy, n-pentadecyloxy, n-hexadecyloxy and the like. [0143] In R ^C7 In the case of an alkoxycarbonyl group, the number of carbon atoms of the alkoxycarbonyl group is preferably 2-20, more preferably 2-7. As R ^C7 Specific examples of the alkoxycarbonyl group include methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, n-butoxycarbonyl, isobutoxycarbonyl, sec-butoxy Carbonyl, tert-butoxycarbonyl, n-pentoxycarbonyl, isopentoxycarbonyl, sec-pentoxycarbonyl, tert-pentoxycarbonyl, n-hexoxycarbonyl, n-heptoxycarbonyl, n-octyloxycarbonyl, iso Octyloxycarbonyl, sec-octyloxycarbonyl, tert-octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, isodecyloxycarbonyl, etc. [0144] In R ^C7 In the case of a phenylalkyl group, the number of carbon atoms of the phenylalkyl group is preferably 7-20, more preferably 7-10. In addition, in R ^C7 When it is a naphthylalkyl group, the number of carbon atoms of the naphthylalkyl group is preferably 11-20, more preferably 11-14. As R ^C7 Specific examples in the case of phenylalkyl include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. As R ^C7 Specific examples in the case of naphthylalkyl include α-naphthylmethyl, β-naphthylmethyl, 2-(α-naphthyl)ethyl, and 2-(β-naphthyl)ethyl. In R ^C7 When it is phenylalkyl or naphthylalkyl, R ^C7 The phenyl group or the naphthyl group may further have a substituent. [0145] In R ^C7 In the case of a heterocyclic group, the heterocyclic group is a five-membered or six-membered monocyclic ring containing more than one N, S, O, or a heterocyclic group formed by condensing the monocyclic rings with each other, or the monocyclic ring and benzene A heterocyclic group formed by ring condensation. When the heterocyclic group is a condensed ring, the number of rings is 3 or less. The heterocyclic group may be an aromatic group (heteroaryl) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrazine, pyrimidine, Pyridazine, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, oxazole, purine, quinoline, isoquine Pyridine, quinazoline, phthalazine, quinoxaline, pyridine, pyrazine, morpholine, pyridine, tetrahydropyran, tetrahydrofuran, etc. In R ^C7 When it is a heterocyclic group, the heterocyclic group may further have a substituent. [0146] In R ^C7 When it is a heterocyclic carbonyl group, the heterocyclic group contained in the heterocyclic carbonyl group and R ^C7 It is the same when it is a heterocyclic group. [0147] In R ^C7 When it is an amine group substituted with one or two organic groups, preferable examples of the organic group include alkyl groups having 1 to 20 carbon atoms, cycloalkyl groups having 3 to 10 carbon atoms, and 2 to 21 carbon atoms. Saturated aliphatic aliphatic group, optionally substituted phenyl group, optionally substituted benzyl group, optionally substituted C7-20 phenylalkyl group, optionally substituted naphthyl group, An optionally substituted naphthyl methanoyl group, an optionally substituted naphthyl alkyl group having 11 to 20 carbon atoms, a heterocyclic group, and the like. Specific examples of these better organic bases and R ^C7 same. As specific examples of amino groups substituted with one or two organic groups, methylamino groups, ethylamino groups, diethylamino groups, n-propylamino groups, di-n-propylamino groups, and isopropylamino groups can be cited. N-butylamino, n-butylamino, di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decylamine Group, phenylamino group, naphthylamino group, acetylamino group, propionylamino group, n-butyrylamino group, n-pentanylamino group, n-hexylamino group, n-heptanylamino group, n Octylamino, n-decylamino, benzylamino, α-naphthylamino, β-naphthylamino, etc. [0148] As R ^C7 When the phenyl group, naphthyl group and heterocyclic group contained therein further have a substituent, the substituent includes an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and 2 to 7 carbon atoms. Saturated aliphatic acyl group, alkoxycarbonyl group with 2 to 7 carbon atoms, saturated aliphatic acyloxy group with 2 to 7 carbon atoms, monoalkylamino group with alkyl group of 1 to 6 carbon atoms , Dialkylamino groups, morpholin-1-yl, piperazin-1-yl, halogen, nitro and cyano groups with alkyl groups of 1 to 6 carbon atoms. In R ^C7 When the phenyl group, naphthyl group and heterocyclic group contained therein further have substituents, the number of the substituents is not limited within a range that does not interfere with the purpose of the present invention, but it is preferably 1 to 4. R ^C7 When the phenyl group, the naphthyl group, and the heterocyclic group contained in it have multiple substituents, the multiple substituents may be the same or different. [0149] In the basis of the above description, if R ^C7 As nitro or as R ^c12 The base represented by -CO- has a tendency to increase sensitivity, which is better. Within the scope that does not interfere with the purpose of the present invention, R ^c12 It is not particularly limited, and it can be selected from various organic groups. As R ^c12 Examples of preferable groups include an alkyl group having 1 to 20 carbon atoms, a phenyl group which may have a substituent, a naphthyl group which may have a substituent, and a heterocyclic group which may have a substituent. As R ^c12 Among these groups, 2-methylphenyl, thiophen-2-yl and α-naphthyl are particularly preferred. In addition, if R ^C7 A hydrogen atom tends to have good transparency, which is preferable. In addition, if R ^C7 Is a hydrogen atom and R ^C10 If it is the base represented by the formula (c4a) or (c4b) described later, the transparency tends to be better. In the formula (c4), R ^c8 And R ^c9 Each is a chain alkyl group which may have a substituent, a cyclic organic group which may have a substituent, or a hydrogen atom. R ^c8 With R ^c9 They may also be bonded to each other to form a ring. Among these bases, as R ^c8 And R ^c9 , A chain alkyl group which may have a substituent is preferred. In R ^c8 And R ^c9 In the case of a chain alkyl group which may have a substituent, the chain alkyl group may be a straight chain alkyl group or a branched chain alkyl group. [0151] In R ^c8 And R ^c9 In the case of a chain alkyl group having no substituent, the number of carbon atoms of the chain alkyl group is preferably from 1 to 20, more preferably from 1 to 10, and particularly preferably from 1 to 6. As R ^c8 And R ^c9 Specific examples of chain alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, Sec-pentyl, t-pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, s-octyl, t-octyl, n-nonyl, isononyl, n-decyl and isodecyl, etc. In addition, in R ^c8 And R ^c9 In the case of an alkyl group, the alkyl group may include an ether bond (-O-) in the carbon chain. Examples of alkyl groups having ether bonds in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propyloxy. Ethoxyethyl and methoxypropyl, etc. [0152] In R ^c8 And R ^c9 In the case of a chain alkyl group having a substituent, the number of carbon atoms of the chain alkyl group is preferably 1-20, more preferably 1-10, and particularly preferably 1-6. In this case, the carbon number of the chain alkyl does not include the carbon number of the substituent. The chain alkyl group having a substituent is preferably linear. The substituent that the alkyl group may have is not particularly limited within the scope that does not hinder the purpose of the present invention. Preferable examples of the substituent include a cyano group, a halogen atom, a cyclic organic group, and an alkoxycarbonyl group. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these atoms, a fluorine atom, a chlorine atom, and a bromine atom are preferable. Examples of cyclic organic groups include cycloalkyl groups, aromatic hydrocarbon groups, and heterocyclic groups. As a specific example of cycloalkyl, and R ^c7 Preferred examples for cycloalkyl are the same. Specific examples of aromatic hydrocarbon groups include phenyl, naphthyl, biphenyl, anthracenyl, and phenanthryl. As a specific example of a heterocyclic group, and R ^c7 When it is a heterocyclic group, preferable examples are the same. In R ^c7 In the case of an alkoxycarbonyl group, the alkoxy group contained in the alkoxycarbonyl group may be linear or branched, and is preferably linear. The number of carbon atoms of the alkoxy group contained in the alkoxycarbonyl group is preferably 1-10, more preferably 1-6. In the case where the chain alkyl group has a substituent, the number of substituents is not particularly limited. The number of preferred substituents varies according to the number of carbon atoms of the chain alkyl group. The number of substituents is typically 1-20, preferably 1-10, more preferably 1-6. [0154] In R ^c8 And R ^c9 In the case of a cyclic organic group, the cyclic organic group may be an alicyclic group or an aromatic group. Examples of the cyclic organic group include aliphatic cyclic hydrocarbon groups, aromatic hydrocarbon groups, and heterocyclic groups. In R ^c8 And R ^c9 In the case of a cyclic organic group, the substituents that the cyclic organic group may have and R ^c8 And R ^c9 It is the same when it is a chain alkyl group. [0155] In R ^c8 And R ^c9 In the case of an aromatic hydrocarbon group, the aromatic hydrocarbon group is preferably a phenyl group, or a group formed by bonding a plurality of benzene rings via a carbon-carbon bond, or a group formed by condensation of a plurality of benzene rings. When the aromatic hydrocarbon group is a phenyl group or a group formed by bonding or condensation of multiple benzene rings, the number of benzene rings contained in the aromatic hydrocarbon group is not particularly limited, but is preferably 3 or less, more preferably 2 Below, 1 is particularly preferable. Preferred specific examples of the aromatic hydrocarbon group include phenyl, naphthyl, biphenyl, anthracenyl, and phenanthryl. [0156] In R ^c8 And R ^c9 In the case of an aliphatic cyclic hydrocarbon group, the aliphatic cyclic hydrocarbon group may be monocyclic or polycyclic. The number of carbon atoms of the aliphatic cyclic hydrocarbon group is not particularly limited, but is preferably 3-20, more preferably 3-10. Examples of monocyclic cyclic hydrocarbon groups include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, norbornyl, isobornyl, tricyclononyl, tricyclic nonyl Cyclodecyl, tetracyclododecyl, adamantyl, etc. [0157] In R ^c8 And R ^c9 In the case of a heterocyclic group, the heterocyclic group is a five-membered or six-membered monocyclic ring containing at least one N, S, O, or a heterocyclic group formed by condensing the monocyclic rings, or the monocyclic ring Heterocyclic group condensed with benzene ring. When the heterocyclic group is a condensed ring, the number of rings is 3 or less. The heterocyclic group may be an aromatic group (heteroaryl) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrazine, pyrimidine, Pyridazine, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, oxazole, purine, quinoline, isoquine Pyridine, quinazoline, phthalazine, quinoxaline, pyridine, pyrazine, morpholine, pyridine, tetrahydropyran, tetrahydrofuran, etc. [0158] R ^c8 And R ^c9 They can also be bonded to each other to form a ring. By R ^c8 With R ^c9 The group constituting the ring formed is preferably a cycloalkylene group. In R ^c8 With R ^c9 In the case of bonding to form a cycloalkylene group, the ring constituting the cycloalkylene group is preferably a five-membered ring to a six-membered ring, and more preferably a five-membered ring. [0159] In R ^c8 With R ^c9 When the group formed by bonding is a cycloalkylene group, the cycloalkylene group may be condensed with one or more other rings. Examples of the ring that can be condensed with the cycloalkylene ring include a benzene ring, a naphthalene ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, a furan ring, and a thiophene ring. Ring, pyrrole ring, pyridine ring, pyrazine ring and pyrimidine ring, etc. [0160] As the R described above ^c8 And R ^c9 Among the better examples of the base, you can cite the formula -A ¹ -A ² The base of expression. In the formula, A ¹ Is straight chain alkylene, A ² Examples include an alkoxy group, a cyano group, a halogen atom, a halogenated alkyl group, a cyclic organic group, and an alkoxycarbonyl group. [0161] A ¹ The number of carbon atoms of the linear alkylene group is preferably 1-10, more preferably 1-6. At A ² In the case of an alkoxy group, the alkoxy group may be linear or branched, and is preferably linear. The number of carbon atoms of the alkoxy group is preferably 1-10, more preferably 1-6. At A ² In the case of a halogen atom, a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom are preferable, and a fluorine atom, a chlorine atom, and a bromine atom are more preferable. At A ² In the case of a halogenated alkyl group, the halogen atom contained in the halogenated alkyl group is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and more preferably a fluorine atom, a chlorine atom, or a bromine atom. The halogenated alkyl group may be linear or branched, and is preferably linear. At A ² In the case of a cyclic organic group, the examples of the cyclic organic group are the same as R ^c8 And R ^c9 The cyclic organic groups possessed as substituents are the same. At A ² In the case of an alkoxycarbonyl group, examples of the alkoxycarbonyl group are the same as R ^c8 And R ^c9 The alkoxycarbonyl group possessed as a substituent is the same. [0162] As R ^c8 And R ^c9 Preferred specific examples include alkyl groups such as ethyl, n-propyl, n-butyl, n-hexyl, n-heptyl and n-octyl; 2-methoxyethyl, 3-methoxy n-propyl, 4 -Methoxy n-butyl, 5-methoxy n-pentyl, 6-methoxy n-hexyl, 7-methoxy n-heptyl, 8-methoxy n-octyl, 2-ethoxyethyl , 3-ethoxy n-propyl, 4-ethoxy n-butyl, 5-ethoxy n-pentyl, 6-ethoxy n-hexyl, 7-ethoxy n-heptyl and 8-ethoxy Alkoxyalkyl groups such as n-octyl; 2-cyanoethyl, 3-cyano n-propyl, 4-cyano n-butyl, 5-cyano n-pentyl, 6-cyano n-hexyl, 7- Cyanoalkyl such as cyano-n-heptyl and 8-cyano-n-octyl; 2-phenylethyl, 3-phenyl-n-propyl, 4-phenyl-n-butyl, 5-phenyl-n-pentyl, Phenyl alkyl such as 6-phenyl n-hexyl, 7-phenyl n-heptyl and 8-phenyl n-octyl; 2-cyclohexyl ethyl, 3-cyclohexyl n-propyl, 4-cyclohexyl n-butyl , 5-cyclohexyl n-pentyl, 6-cyclohexyl n-hexyl, 7-cyclohexyl n-heptyl, 8-cyclohexyl n-octyl, 2-cyclopentyl ethyl, 3-cyclopentyl n-propyl, 4 -Cyclopentyl n-butyl, 5-cyclopentyl n-pentyl, 6-cyclopentyl n-hexyl, 7-cyclopentyl n-heptyl and 8-cyclopentyl n-octyl and other cycloalkyl alkyl groups; 2 -Methoxycarbonylethyl, 3-methoxycarbonyl n-propyl, 4-methoxycarbonyl n-butyl, 5-methoxycarbonyl n-pentyl, 6-methoxycarbonyl n-hexyl, 7-methyl Oxycarbonyl n-heptyl, 8-methoxycarbonyl n-octyl, 2-ethoxycarbonylethyl, 3-ethoxycarbonyl n-propyl, 4-ethoxycarbonyl n-butyl, 5-ethoxy Alkoxycarbonyl alkyl groups such as n-pentyl carbonyl, n-hexyl 6-ethoxycarbonyl, n-heptyl 7-ethoxycarbonyl, and n-octyl 8-ethoxycarbonyl; 2-chloroethyl, 3- Chloro-n-propyl, 4-chloro-n-butyl, 5-chloro-n-pentyl, 6-chloro-n-hexyl, 7-chloro-n-heptyl, 8-chloro-n-octyl, 2-bromoethyl, 3-bromo-n-propyl 4-bromo-n-butyl, 5-bromo-n-pentyl, 6-bromo-n-hexyl, 7-bromo-n-heptyl, 8-bromo-n-octyl, 3,3,3-trifluoropropyl and 3,3 ,4,4,5,5,5-Heptafluoro-n-pentyl and other halogenated alkyl groups. [0163] As R ^c8 And R ^c9 , The preferred groups above are ethyl, n-propyl, n-butyl, n-pentyl, 2-methoxyethyl, 2-cyanoethyl, 2-phenylethyl, 2-cyclohexylethyl , 2-Methoxycarbonylethyl, 2-chloroethyl, 2-bromoethyl, 3,3,3-trifluoropropyl and 3,3,4,4,5,5,5-heptafluoro Amyl. [0164] As R ^c10 Examples of preferred organic groups, such as R ^c7 Similarly, examples include alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyl groups, alkoxycarbonyl groups, saturated aliphatic acyloxy groups, optionally substituted phenyl groups, and may have Substituent phenoxy group, optionally substituted benzyl group, optionally substituted phenoxycarbonyl group, optionally substituted benzyloxy group, optionally substituted phenylalkyl group, available Substituent naphthyl, optionally substituted naphthyloxy, optionally substituted naphthyloxycarbonyl, optionally substituted naphthyloxycarbonyl, optionally substituted naphthyloxy, may have Substituent naphthylalkyl, optionally substituted heterocyclic group, optionally substituted heterocyclic carbonyl group, amino group substituted by one or two organic groups, morpholin-1-yl and piperazine- 1-based etc. Specific examples of these bases and R ^c7 The description is the same. In addition, as R ^c10 Also preferred are cycloalkylalkyl groups, phenoxyalkyl groups which may have substituents on the aromatic ring, and phenylthioalkyl groups which may have substituents on the aromatic ring. Phenoxyalkyl and phenylthioalkyl may have substituents and R ^c7 The phenyl groups contained may have the same substituents. In the organic group, as R ^c10 , An alkyl group, a cycloalkyl group, a phenyl group which may have a substituent, or a cycloalkylalkyl group, and a phenylthioalkyl group which may have a substituent on the aromatic ring are preferable. As the alkyl group, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 8 carbon atoms is more preferred, an alkyl group having 1 to 4 carbon atoms is particularly preferred, and a methyl group is most preferred. Among the phenyl groups which may have a substituent, a methylphenyl group is preferred, and a 2-methylphenyl group is more preferred. The number of carbon atoms of the cycloalkyl group contained in the cycloalkylalkyl group is preferably 5-10, more preferably 5-8, and particularly preferably 5 or 6. The number of carbon atoms of the alkylene group contained in the cycloalkylalkyl group is preferably 1-8, more preferably 1-4, and particularly preferably 2. Among cycloalkylalkyls, cyclopentylethyl is preferred. The number of carbon atoms of the alkylene group contained in the phenylthioalkyl group which may have a substituent on the aromatic ring is preferably from 1 to 8, more preferably from 1 to 4, and particularly preferably 2. Among the phenylthioalkyl groups which may have a substituent on the aromatic ring, 2-(4-chlorophenylthio)ethyl is preferred. [0166] In addition, as R ^c10 , It is also better to use -A ³ -CO-OA ⁴ The base of expression. A ³ It is a divalent organic group, preferably a divalent hydrocarbon group, and preferably an alkylene group. A ⁴ It is a monovalent organic group, preferably a monovalent hydrocarbon group. [0167] At A ³ In the case of an alkylene group, the alkylene group may be linear or branched, and is preferably linear. At A ³ In the case of an alkylene group, the number of carbon atoms of the alkylene group is preferably 1-10, more preferably 1-6, and particularly preferably 1-4. [0168] As A ⁴ Preferred examples include an alkyl group having 1 to 10 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, and an aromatic hydrocarbon group having 6 to 20 carbon atoms. As A ⁴ Preferred specific examples include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, n-hexyl, phenyl, naphthyl , Benzyl, phenethyl, α-naphthylmethyl and β-naphthylmethyl, etc. [0169] As with -A ³ -CO-OA ⁴ Preferred specific examples of the represented group include 2-methoxycarbonylethyl, 2-ethoxycarbonylethyl, 2-n-propoxycarbonylethyl, 2-n-butoxycarbonylethyl, 2 -N-pentyloxycarbonylethyl, 2-n-hexoxycarbonylethyl, 2-benzyloxycarbonylethyl, 2-phenoxycarbonylethyl, 3-methoxycarbonyl n-propyl, 3-ethoxy N-propyl carbonyl group, 3-n-propoxycarbonyl n-propyl group, 3-n-butoxycarbonyl n-propyl group, 3-n-pentoxycarbonyl n-propyl group, 3-n-hexoxycarbonyl n-propyl group, 3 -Benzyloxycarbonyl n-propyl and 3-phenoxycarbonyl n-propyl, etc. [0170] Above, although for R ^c10 Is explained, but as R ^c10 , Preferably a base represented by the following formula (c4a) or (c4b).

In formulas (c4a) and (c4b), R ^c13 And R ^c14 Respectively organic groups, n6 is an integer from 0 to 4, in R ^c13 And R ^c8 When existing in adjacent positions on the benzene ring, R ^c13 With R ^c14 It can be bonded to each other to form a ring, n7 is an integer from 1 to 8, n8 is an integer from 1 to 5, n9 is an integer from 0 to (n8+3), R ^c15 For the organic base. [0171] Regarding R in formula (c4a) ^c13 And R ^c14 Examples of organic bases and R ^c7 same. As R ^c13 , Preferably alkyl or phenyl. In R ^c13 In the case of an alkyl group, the number of carbon atoms is preferably 1-10, more preferably 1-5, particularly preferably 1-3, most preferably 1. That is, R ^c13 The most preferred is methyl. In R ^c13 With R ^c14 When a ring is formed by bonding, the ring may be an aromatic ring or an aliphatic ring. As expressed by formula (c4a) and R ^c13 With R ^c14 Preferred examples of the ring-forming group include naphth-1-yl, 1,2,3,4-tetrahydronaphthalen-5-yl and the like. In the above formula (c4a), n6 is an integer of 0-4, preferably 0 or 1, and more preferably 0. In the above formula (c4b), R ^c15 For the organic base. As the organic group, it can be exemplified by R ^c7 The organic base described is the same base. Among the organic groups, an alkyl group is preferred. The alkyl group may be linear or branched. The number of carbon atoms of the alkyl group is preferably 1-10, more preferably 1-5, and particularly preferably 1-3. As R ^c15 , Preferably exemplified by methyl, ethyl, propyl, isopropyl, butyl, etc., among these groups, methyl is more preferred. In the above formula (c4b), n8 is an integer of 1 to 5, preferably an integer of 1 to 3, and more preferably 1 or 2. In the above formula (c4b), n9 is 0 to (n8+3), preferably an integer of 0 to 3, more preferably an integer of 0 to 2, and particularly preferably 0. In the above formula (c4b), n7 is an integer of 1-8, preferably an integer of 1-5, more preferably an integer of 1-3, and particularly preferably 1 or 2. In the formula (c4), R ^c11 It is a hydrogen atom, an alkyl group having 1 to 11 carbon atoms which may have a substituent, or an aryl group which may have a substituent. As R ^c11 The substituent which may be possessed when it is an alkyl group may preferably include a phenyl group, a naphthyl group, and the like. In addition, as R ^c7 The substituent which may be possessed in the case of an aryl group may preferably include an alkyl group having 1 to 5 carbon atoms, an alkoxy group, a halogen atom, and the like. In the formula (c4), as R ^c11 , Preferably exemplified by hydrogen atom, methyl, ethyl, n-propyl, isopropyl, n-butyl, phenyl, benzyl, methylphenyl, naphthyl, etc., more preferred among these groups Methyl or phenyl. [0176] The compound represented by the formula (c4) is produced by a method including the following steps: the oxime group (>C=N-OH) contained in the compound represented by the formula (c5) is converted into a compound represented by>C= NO-COR ^c11 Represents the oxime ester group. R ^c11 And R in formula (c4) ^c11 same. [0177] From oxime group (>C=N-OH) to>C=NO-COR ^c11 The conversion of the indicated oxime ester group is carried out by reacting the aforementioned compound represented by the formula (c5) with an acylating agent. As provided by -COR ^c11 Representation of the acylating agent of the base, which can be listed as (R ^c11 C0) ₂ Anhydride represented by O, represented by R ^c11 COHal (Hal is a halogen atom) represented by halides. [0178] Preferred specific examples of the compound represented by the formula (c4) include the following PI-43 to PI-83.

[0179]

[0180] With respect to the total mass of the solid content of the resin composition, the content of the (C) photopolymerization initiator is preferably 0.5 to 30% by mass, more preferably 1 to 20% by mass. By setting the content of the (C) photopolymerization initiator within the above range, a resin composition in which pattern shape defects are less likely to occur can be obtained. [0181] In addition, the (C) photopolymerization initiator may be combined with a photoinitiation assistant. As the photoinitiator, triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoate Isoamyl aminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N,N-dimethyl-p-toluidine, 4, 4'-bis(dimethylamino)benzophenone, 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-Ethyl-9,10-diethoxyanthracene, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2-mercaptobenzimidazole, 2-mercapto-5-methoxybenzothiazole, Thiol compounds such as 3-mercaptopropionic acid, methyl 3-mercaptopropionate, pentaerythritol tetramercaptoacetate, 3-mercaptopropionate, etc. These photoinitiation assistants can be used alone or in combination of two or more kinds. [0182] <(D) Light-shielding material> The resin composition contains (D) light-shielding material because it is used for the black matrix. Typically (D) the light-shielding material preferably contains black pigments. By using a resin composition containing a black pigment, it is possible to impart light-shielding properties to the formed cured film. Therefore, the resin composition containing black pigment is preferably used to form a black matrix in an image display panel such as a liquid crystal display panel. [0183] Examples of black pigments include metal oxides such as carbon black, perylene-based pigments, internal amide-based pigments, titanium black, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, and silver, Various pigments such as composite oxides, metal sulfides, metal sulfates, or metal carbonates can be organic or inorganic. Among these black pigments, carbon black is preferred from the viewpoint of easy availability and easy formation of a cured film with excellent light-shielding properties and high electrical resistance. In addition, the hue of the black pigment is not limited to the achromatic color theory, that is, black, it can also be purple-black, blue-black, red-black. [0184] As the carbon black, known carbon blacks such as channel black, furnace black, thermal black, and lamp black can be used. In addition, resin-coated carbon black can also be used. [0185] As carbon black, carbon black that has been subjected to a treatment for introducing acidic groups is also preferable. The acidic group introduced into carbon black is a functional group showing acidity based on the definition of Bronsted. Specific examples of acidic groups include carboxyl groups, sulfonic acid groups, phosphoric acid groups, and the like. The acidic group introduced into carbon black can also form a salt. The cation forming a salt with an acidic group is not particularly limited within a range that does not hinder the purpose of the present invention. Examples of cations include various metal ions, cations of nitrogen-containing compounds, ammonium ions, etc., and alkali metal ions such as sodium ions, potassium ions, and lithium ions, or ammonium ions are preferred. [0186] Among the carbon blacks subjected to the treatment of introducing the acidic groups described above, from the viewpoint of achieving high resistance of the light-shielding cured film formed using the resin composition, it is preferable to have a carboxylic acid group, a carboxylic acid group, and a carboxyl group. Carbon black with one or more functional groups of acid salt group, sulfonic acid group and sulfonic acid salt group. [0187] The method of introducing acidic groups into carbon black is not particularly limited. As a method of introducing an acidic group, the following methods can be mentioned, for example. 1) A method of introducing sulfonic acid groups into carbon black through the direct substitution method using concentrated sulfuric acid, oleum, chlorosulfonic acid, etc., or the indirect substitution method using sulfite, bisulfite, etc. 2) A method of diazo coupling an organic compound with an amine group and an acid group and carbon black. 3) A method of reacting organic compounds with halogen atoms and acidic groups with carbon black with hydroxyl groups through Williamson etherification. 4) A method of reacting an organic compound having a halogenated carbonyl group and an acidic group protected by a protective group with a carbon black having a hydroxyl group. 5) Using an organic compound with a halogenated carbonyl group and an acidic group protected by a protective group, the carbon black is subjected to Friedel-Crafts reaction and then deprotected. [0188] Among these methods, from the viewpoint of easy and safe introduction of acidic groups, method 2) is preferred. As the organic compound having an amine group and an acidic group used in the method 2), a compound in which an amine group and an acidic group are bonded to an aromatic group is preferred. Examples of the compound include aminobenzenesulfonic acid such as p-aminobenzenesulfonic acid, or aminobenzoic acid such as 4-aminobenzoic acid. [0189] The number of moles of acidic groups introduced into carbon black is not particularly limited within a range that does not hinder the purpose of the present invention. The number of moles of acidic groups introduced into the carbon black is preferably 1 to 200 mmol, and more preferably 5 to 100 mmol, relative to 100 g of carbon black. [0190] Carbon black introduced with acidic groups can also be coated with resin. When a resin composition containing carbon black coated with resin is used, it is easy to form a light-shielding cured film with excellent light-shielding and insulating properties and low surface reflectance. In addition, the coating treatment with resin does not have a significant adverse effect on the dielectric constant of the light-shielding cured film formed using the resin composition. Examples of resins that can be used for coating carbon black include phenolic resins, melamine resins, xylene resins, diallyl phthalate resins, glycolphthalein resins, epoxy resins, and alkylbenzene resins. Resin, or polystyrene, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, modified polyphenylene ether, polycarbonate, polyterephthalate terephthalate Thermoplastic resins such as amines, polyamide imines, polyimines, polyamino bismaleimides, polyether sulfides, polyphenylene sulfides, polyarylates, and polyether ether ketones. The coating amount of the resin with respect to the carbon black is preferably 1 to 30% by mass relative to the total of the mass of the carbon black and the mass of the resin. [0191] In addition, as the black pigment, a perylene-based pigment can also be preferably used. Specific examples of perylene pigments include perylene pigments represented by the following formula (d-1), perylene pigments represented by the following formula (d-2), and perylene pigments represented by the following formula (d-3) pigment. Among the commercially available products, the product names KOO84 and K0086 manufactured by BASF Corporation, or pigment black 21, 30, 31, 32, 33 and 34, etc. can be preferably used as perylene pigments. [0192]

In formula (d-1), R ^d1 And R ^d2 Each independently represents an alkylene group having 1 to 3 carbon atoms, R ^d3 And R ^d4 Each independently represents a hydrogen atom, a hydroxyl group, a methoxy group, or an acetyl group. [0193]

In formula (d-2), R ^d5 And R ^d6 Each independently represents an alkylene group having 1 to 7 carbon atoms. [0194]

In formula (d-3), R ^d7 And R ^d8 Each independently represents a hydrogen atom, an alkyl group having 1 to 22 carbon atoms, and may include heteroatoms such as N, O, S, or P. In R ^d7 And R ^d8 In the case of an alkyl group, the alkyl group may be linear or branched. The above-mentioned compound represented by the formula (d-1), the compound represented by the formula (d-2) and the compound represented by the formula (d-3) can be used, for example, in Japanese Patent Application Laid-Open No. 62-1753, It was synthesized by the method described in Japanese Patent Publication No. 63-26784. That is, using perylene-3,5,9,10-tetracarboxylic acid or perylene-3,5,9,10-tetracarboxylic dianhydride and amines as raw materials, a heating reaction is carried out in water or an organic solvent. Then, the obtained crude product is reprecipitated in sulfuric acid, or recrystallized in water, an organic solvent, or a mixed solvent of water and an organic solvent, so that the target substance can be obtained. [0196] In order to disperse the perylene-based pigment in the resin composition well, the average particle diameter of the perylene-based pigment is preferably 10 to 1000 nm. [0197] In addition, as the (D) light-shielding material, internal amide-based pigments may also be included. Examples of internal amide-based pigments include compounds represented by the following formula (d-4). [0198]

[0199] In the formula (d-4), X ^d Represents a double bond, as geometric isomers independently E form or Z form, R ^d9 Each independently represents a hydrogen atom, a methyl group, a nitro group, a methoxy group, a bromine atom, a chlorine atom, a fluorine atom, a carboxyl group or a sulfo group, R ^d10 Each independently represents a hydrogen atom, a methyl group or a phenyl group, R ^d11 Each independently represents a hydrogen atom, a methyl group, or a chlorine atom. The compound represented by formula (d-4) can be used singly or in combination of two or more kinds. From the viewpoint of easy manufacture of the compound represented by formula (d-4), R ^d9 Preferably, it is bonded to the 6 position of the indolinone ring, R ^d11 The bond is preferably at the 4-position of the indolinone ring. From the same point of view, R ^d9 , R ^d10 And R ^d11 Preferably it is a hydrogen atom. Although the compound represented by formula (d-4) has EE form, ZZ form, and EZ form as geometric isomers, it may be a single compound among them, or a mixture of these geometric isomers. The compound represented by the formula (d-4) can be produced by the method described in International Publication No. 2000/24736 and International Publication No. 2010/081624, for example. [0200] In order to disperse the internal amide-based pigment in the resin composition well, the average particle diameter of the internal amide-based pigment is preferably 10 to 1000 nm. [0201] In addition, it is also preferable to use fine particles containing silver tin (AgSn) alloy as a main component (hereinafter referred to as "AgSn alloy fine particles") as the black pigment. The AgSn alloy fine particles only need AgSn alloy as a main component, and as other metal components, for example, Ni, Pd, Au, etc. may be contained. The average particle size of the AgSn alloy particles is preferably 1 to 300 nm. [0202] When the AgSn alloy is represented by the chemical formula AgxSn, the range of x for obtaining a chemically stable AgSn alloy is 1≤x≤10, and the range of x for obtaining chemical stability and blackness is 3≤x≤ 4. Here, if the mass ratio of Ag in the AgSn alloy is obtained within the range of x, when X=1, Ag/AgSn=0.4762 X=3, 3·Ag/Ag3Sn=0.7317 X=4, 4. When Ag/Ag4Sn=0.7843 X=10, 10·Ag/Ag10Sn=0.9008. Therefore, when the AgSn alloy contains 47.6 to 90% by weight of Ag, the chemical properties are stable, and when it contains 73.17 to 78.43% by weight of Ag, it can effectively obtain chemical stability and blackness corresponding to the amount of Ag. [0203] The AgSn alloy particles can be produced by a common particle synthesis method. Examples of the microparticle synthesis method include a gas phase reaction method, a spray thermal decomposition method, an atomization method, a liquid phase reaction method, a freeze-drying method, a hydrothermal synthesis method, and the like. [0204] Although the AgSn alloy particles are highly insulating, in order to further improve the insulation of the black matrix, the surface of the AgSn alloy particles may be covered with an insulating film. As the material of the insulating film, metal oxides or organic polymer compounds are preferred. As the metal oxide, metal oxides with insulating properties are preferably used, such as silicon oxide (silica), aluminum oxide (aluminum oxide), zirconium oxide (zirconia), and yttrium oxide (yttrium oxide). , Titanium oxide (titanium dioxide), etc. In addition, as the organic polymer compound, it is preferable to use an insulating resin, such as polyimide, polyether, polyacrylate, and polyamine compound. [0205] In order to sufficiently improve the insulating properties of the surface of the AgSn alloy particles, the thickness of the insulating film is preferably 1 to 100 nm, and more preferably 5 to 50 nm. The insulating film can be easily formed by surface modification technology or surface coating technology. In particular, if alkoxy compounds such as tetraethoxysilane and triethoxyaluminum are used, an insulating film with uniform film thickness can be formed at a relatively low temperature, so it is preferable. [0206] As the black pigment, the above-mentioned perylene-based pigments, internal amide-based pigments, and AgSn alloy particles may be used alone, and these may be used in combination. In addition, for the purpose of adjusting the hue, etc., the black pigment may also contain pigments of red, blue, green, yellow and other hues. The pigments of other hues as black pigments can be appropriately selected from well-known pigments. For example, as pigments of other hues of black pigments, the above-mentioned various pigments can be used. The usage amount of the pigments of other hues of the black pigment relative to the total mass of the black pigment is preferably 15% by mass or less, more preferably 10% by mass or less. [0207] In order to uniformly disperse the light-shielding material (D) described above in the resin composition, a dispersant may be further used. As such a dispersing agent, polyethyleneimine-based, polyurethane resin-based, and acrylic resin-based polymer dispersing agents are preferably used. In particular, when carbon black is used as the (D) light-shielding material, it is preferable to use an acrylic resin-based dispersant or a polyurethane resin-based dispersant as the dispersant. In addition, there are cases where corrosive gas is generated from the cured film due to the dispersant. Therefore, it is also an example of a preferable solution that (D) the light-shielding material is dispersed without using a dispersant. [0208] In addition, as (D) the light-shielding material, an inorganic pigment and an organic pigment may be used alone, or two or more types may be used in combination. When used in combination, relative to 100 parts by mass of the total amount of the inorganic pigment and the organic pigment, Preferably, the organic pigment is used in the range of 10 to 80 parts by mass, and more preferably the organic pigment is used in the range of 20 to 40 parts by mass. [0209] In addition, in the resin composition, as the (D) light-shielding material, a combination of a pigment and a dye may also be used. The dye may be appropriately selected from known materials. The dyes that can be used in the resin composition include, for example, azo dyes, metal complex salt azo dyes, anthraquinone dyes, triphenylmethane dyes, xanthene dyes, cyanine dyes, naphthoquinone dyes, quinoneimine dyes, and secondary dyes. Methyl dyes, phthalocyanine dyes, etc. In addition, these dyes can be used as (D) light-shielding materials by dispersing them in an organic solvent or the like through lake formation (salt formation). In addition to these dyes, for example, Japanese Patent Application Publication No. 2013-225132, Japanese Patent Application Publication No. 2014-178477, Japanese Patent Application Publication No. 2013-137543, Japanese Patent Application Publication No. 2011-38085, Japanese Patent Application Publication No. Published the dyes etc. recorded in the 2014-197206 Bulletin. [0210] The amount of (D) light-shielding material used in the resin composition can be appropriately selected within a range that does not interfere with the purpose of the present invention. Typically, it is preferably 2 to the total mass of the solid components of the resin composition. 75% by mass, more preferably 3 to 70% by mass. [0211] (D) The light-shielding material is preferably added to the resin composition after being prepared as a dispersion liquid dispersed at an appropriate concentration in the presence or absence of a dispersant. In addition, in this specification, the usage amount of the aforementioned (D) light-shielding material can be defined as a value that also includes the existing dispersant. [0212] <(E) Epoxy Compound> The resin composition contains the (E) epoxy compound represented by the formula (E1) described later. Hereinafter, the epoxy compound represented by formula (E1) will be described. [0213]

In formula (E1), OGly is glycidoxy, R ^e1 It is a halogen atom or a monovalent group with 1 to 8 carbon atoms, a is an integer of 0 to 4, b is the repeating number of the unit in parentheses, and when a is an integer of 2 or more, the adjacent benzene ring 2 R ^e1 It can also be bonded to each other to form a ring, R ^e2 Is a divalent aliphatic cyclic group or a group represented by the following formula (E1-1),

In formula (E1-1), OGly is glycidoxy, R ^e3 Is an aromatic hydrocarbon group, R ^e4 Is a halogen atom or an alkyl group with 1 to 4 carbon atoms, c is 0 or 1, d is an integer of 0 to 8, R ^e5 Is a hydrogen atom or a group represented by the following formula (E1-2),

In formula (E1-2), OGly is glycidoxy, R ^e6 It is a halogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl group, and e is an integer of 0-4. [0214] The epoxy compound represented by the above formula (E1) has an average molecular weight of 800 or more. By using a compound having the above-mentioned average molecular weight as the epoxy compound represented by the formula (E1), it is easy to obtain a resin composition that can form a black matrix with high resistance and excellent water resistance or strength. The average molecular weight of the epoxy compound represented by the formula (E1) is preferably 1,000 or more, more preferably 1,200 or more, and particularly preferably 1,500 or more. In addition, from the viewpoint of making it difficult to generate residues during development, the average molecular weight of the epoxy compound represented by the formula (E1) is preferably 50,000 or less, and more preferably 20,000 or less. [0215] In the formula (E1), R ^e1 It is a halogen atom or a monovalent group with 1 to 8 carbon atoms. Specific examples of monovalent groups with 1 to 8 carbon atoms include alkyl groups, alkoxy groups, phenoxy groups, aliphatic acyl groups, aliphatic acyloxy groups, benzyl groups, benzyl groups, and phenethyl groups. Group and unsaturated aliphatic hydrocarbon group. The alkyl group, alkoxy group, aliphatic acyl group, aliphatic acyloxy group, and unsaturated aliphatic hydrocarbon group may be linear or branched. [0216] As R ^e1 Preferable examples of the halogen atom include fluorine atom, chlorine atom, bromine atom and iodine atom. As R ^e1 Preferred examples of the alkyl group are methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl and tert-butyl, more preferably methyl and ethyl. [0217] In R ^e1 In the case of a monovalent group having 1 to 8 carbon atoms, the monovalent group is preferably an alkyl group and an alkoxy group. Specific examples of the alkyl group include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, n-hexyl, n-heptyl , N-octyl and 2-ethylhexyl. Specific examples of alkoxy groups include: methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy, tert-butoxy, n-butoxy Pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy and 2-ethylhexyloxy. [0218] In addition, when a is an integer of 2 to 4, a plurality of R ^e1 Among the 2 R adjacent to the benzene ring ^e1 They can also be bonded to each other to form a ring. 2 R ^e1 The ring formed by bonding may be an aromatic ring, an aliphatic ring, a hydrocarbon ring, or a heterocyclic ring. In 2 R ^e1 When the ring formed by bonding is a heterocyclic ring, examples of the hetero atom contained in the ring include N, O, S, Se, and the like. Via 2 R ^e1 For the bonding, preferred examples of the group formed together with the benzene ring include a naphthalene ring and a tetralin ring. In the formula (E1), as R ^e2 The divalent aliphatic cyclic group is not particularly limited, and may be a monocyclic group or a polycyclic group having two or more rings. In addition, the divalent aliphatic cyclic group usually does not contain an epoxy group in its structure, and preferably does not contain an epoxy group. Specifically, as a divalent aliphatic cyclic group, a group obtained by removing two hydrogen atoms from a polycyclic alkane such as a monocycloalkane, a bicycloalkane, a tricycloalkane, and a tetracycloalkane, etc. can be exemplified. More specifically, the removal of two hydrogen atoms from monocyclic alkanes such as cyclopentane and cyclohexane or polycyclic alkanes such as adamantane, norbornane, isobornane, tricyclodecane, and tetracyclododecane And get the basis and so on. The number of carbon atoms of the divalent aliphatic cyclic group is preferably 3-50, more preferably 3-30, and particularly preferably 3-20. The best is 3-15. [0220] As R ^e2 Specific examples of the divalent aliphatic cyclic group include the groups shown below.

[0221] R ^e3 It is an aromatic hydrocarbon group. As R ^e3 The valence of the aromatic hydrocarbon group is 2+c+d. The aromatic hydrocarbon group is not particularly limited. A typical aromatic hydrocarbon ring constituting an aromatic hydrocarbon group is a six-membered aromatic hydrocarbon ring (benzene ring), or a ring obtained by condensing two or more benzene rings with each other or bonding through a single bond. Preferred specific examples of the aromatic hydrocarbon ring constituting the aromatic hydrocarbon group are benzene, naphthalene, anthracene, phenanthrene, biphenyl and terphenyl. The radical obtained by removing 2+c+d hydrogen atoms from these aromatic hydrocarbon rings is suitable as R ^e3 The aromatic hydrocarbon group. In the group represented by the formula (E1-1), c is 0 or 1. That is, R as an aromatic hydrocarbon group ^e3 The glycidoxy group may not be bonded, or one glycidoxy group may be bonded. In the group represented by the formula (E1-1), R ^e4 It is a halogen atom or an alkyl group with 1 to 4 carbon atoms, and d is an integer of 0 to 8. That is, R ^e4 R as an aromatic hydrocarbon group ^e3 Above, substituents other than glycidoxy group, R ^e3 The number of substituents on the above is 0-8. d is preferably an integer of 0-4, more preferably an integer of 0-2, and particularly preferably 0 or 1. As R ^e4 Preferable examples of the halogen atom include fluorine atom, chlorine atom, bromine atom and iodine atom. As R ^e4 Preferred examples of the alkyl group are methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl and tert-butyl, more preferably methyl and ethyl. In the group represented by the formula (E1-1), R ^e5 It is a hydrogen atom or the group represented by the aforementioned formula (E1-2). R in formula (E1-2) ^e6 It is a halogen atom, an alkyl group with 1 to 4 carbon atoms, or a phenyl group. Specific examples of halogen atoms and alkyl groups with 1 to 4 carbon atoms and R ^e4 same. [0225] For the epoxy compound represented by the formula (E1) described above, R is preferred ^e2 Is a divalent aliphatic cyclic group, or the aforementioned formula (E1-1) represented by c is 0, and R ^e5 It is a divalent group of hydrogen atom. In this case, there is a moderate distance between the epoxy groups contained in the epoxy compound represented by the formula (E1), thereby achieving better water resistance for the black matrix. [0226] The epoxy compound represented by the formula (E1) can be obtained as a commercially available product. Specific examples of commercially available products include NC-series and XD-series manufactured by Nippon Kayaku Co., Ltd. In addition, equivalent products with specific structures are also available from DIC Co., Ltd. and Showa Denko Co., Ltd. [0227] The chemical structure of a preferred specific example of the epoxy compound represented by the formula (E1) is described below. In the following formula, OGly represents a glycidoxy group, and p represents the repeating number of the unit in parentheses.

[0228] To the extent that the purpose of the present invention is not hindered, the (E) epoxy compound described above may include the epoxy compound represented by the formula (E1), and may also include other epoxy compounds. Although it is not specifically limited as other epoxy compounds, as a preferable compound, the epoxy compound mentioned as a specific example for the said epoxy compound (a-3a) can be mentioned. The ratio of the mass of the epoxy compound represented by the formula (E1) to the mass of the epoxy compound (E) is preferably 70% by mass or more, more preferably 80% by mass or more, particularly preferably 90% by mass or more, most preferably It is 100% by mass. [0229] When the total amount of active hydrogen groups (number of moles) of the (A) alkali-soluble resin is recorded as Am, and the total amount of epoxy groups (number of moles) of the epoxy compound (E) When) is denoted as Em, the usage amount of the epoxy compound (E) described above is preferably Am/Em in the range of 0.25 or more and 4.0 or less, and more preferably in the range of 0.5 or more and 2.0 or less. By using the epoxy compound (E) in the amount within the above range, it is easy to form a black matrix with excellent water resistance and strength. [0230] The content of the (E) epoxy compound in the total solid components of the resin composition is preferably 0.5% by mass to 10% by mass, and more preferably 1% by mass to 5% by mass. In addition, the content of the epoxy compound represented by the formula (E1) in the total solid content of the resin composition is preferably 0.5% by mass to 10% by mass, and more preferably 1% by mass to 5% by mass. [0231] <(S) Organic Solvent> In order to improve coatability or adjust viscosity, the resin composition preferably contains (S) an organic solvent. [0232] As the organic solvent (S), specifically, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether , Diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethyl Glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono N-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether and other (poly)alkylene glycol monoalkyl ethers; ethylene glycol monomethyl ether acetic acid Ester, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol Monoethyl ether acetate and other (poly)alkylene glycol monoalkyl ether acetates; diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl Ether, tetrahydrofuran and other ethers; methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone and other ketones; 2-hydroxypropionic acid methyl ester, 2-hydroxypropionic acid ethyl ester and other lactate alkyl Esters; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxy Ethyl propionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutyrate, 3-methoxybutyl acetate, 3-methyl-3-methoxy acetate Butyl butyl ester, 3-methyl-3-methoxybutyl propionate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isoacetate Amyl ester, benzyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-butyl pyruvate Propyl ester, methyl acetylacetate, ethyl acetylacetate, ethyl 2-oxobutyrate and other esters; aromatic hydrocarbons such as toluene and xylene; N-methyl-2-pyrrolidone, N,N -Dimethylformamide, N,N-dimethylacetamide, N,N-dimethyl-isobutyramide, N,N-diethylacetamide, N,N-diethyl Formamide, N-methylcaprolactam, 1,3-dimethyl-2-imidazolinone, pyridine and N,N,N',N'-tetramethylurea and other nitrogen-containing polar organic solvents, etc. . [0233] Among them, alkylene glycol monoalkyl ethers, alkylene glycol monoalkyl ether acetates, the above-mentioned other ethers, the alkyl lactate, and the above-mentioned other esters are preferred, and Alkylene glycol monoalkyl ether acetates, other ethers mentioned above, benzyl acetate and other esters mentioned above. In addition, from the viewpoints of the solubility of each component or the dispersibility of (D) the light-shielding material, the (S) organic solvent preferably contains a nitrogen-containing polar organic solvent. As the nitrogen-containing polar organic solvent, N,N,N',N'-tetramethylurea or the like can be used. These solvents can be used alone or in combination of two or more kinds. [0234] (S) The content of the organic solvent component is not particularly limited, and the concentration that can be coated on a substrate or the like can be appropriately set according to the coating film thickness. The viscosity of the resin composition is preferably 5 to 500 cp, more preferably 10 to 50 cp, and still more preferably 20 to 30 cp. In addition, the solid content concentration is preferably from 5 to 100% by mass, more preferably from 15 to 50% by mass. [0235] <Other components> The resin composition may contain (E) epoxy compounds other than epoxy compounds, surfactants, adhesion improvers, thermal polymerization inhibitors, defoamers, and silanes as needed. Coupling agent and other additives. All additives can use currently known substances. From the viewpoint of easy formation of a black matrix with good shape and excellent adhesion to the substrate, the resin composition preferably contains a silane coupling agent. The silane coupling agent is not particularly limited, and currently known substances can be used. Examples of surfactants include anionic, cationic, and nonionic compounds. Examples of thermal polymerization inhibitors include hydroquinone, hydroquinone monoethyl ether, and the like. Examples of the defoaming agent include silicone-based and fluorine-based compounds. [0236] If the resin composition described above is used, a cured film having a low volume resistivity and a high optical density (OD value) can be formed. Specifically, the resin composition can provide a volume resistivity of preferably 1.0×10 ¹⁰ Ω·cm or more, more preferably 1.0×10 ¹¹ Hardened film above Ω·cm. In addition, the resin composition of this embodiment can provide a cured film with an optical density (OD value) of preferably 2.5/μm or more, more preferably 3.0/μm or more, and still more preferably 3.5/μm or more. In a black matrix, generally these physical properties tend to be antithetical, but in this embodiment, both physical properties can be satisfied at the same time. [0237] <Preparation method of resin composition> The resin composition described above can be obtained by mixing the above-mentioned components in predetermined amounts, and then uniformly mixing them with a mixer. In addition, in order to make the obtained resin composition more uniform, a filter can also be used for filtration. [0238] "Method for manufacturing black matrix" As a method for manufacturing a black matrix, there is no particular limitation, and a currently known method using a photosensitive resin composition for forming a black matrix containing (B) a photopolymerizable compound can be used . [0239] As a preferable manufacturing method of the black matrix, a method including the following steps: a step of forming a coating film by applying the aforementioned resin composition, a step of exposing the coating film by selecting a position, and a coating after exposure Film development, a step of forming a patterned hardened film and a step of baking the patterned hardened film. [0240] In order to form a black matrix using the resin composition, first, the resin composition is applied to a substrate selected according to the mode or configuration of the image display device, etc., to form a coating film. The method of forming the coating film is not particularly limited. For example, a roll coater, a reverse coater, a bar coater, etc. contact transfer type coating device, or a spin coater (rotary coating device), curtain coater, etc. can be used. Machine and other non-contact coating equipment. [0241] The coated resin composition is dried as necessary to form a coating film. The drying method is not particularly limited. For example, the following methods can be cited: (1) Using a hot plate, drying at a temperature of 80 to 120°C, preferably 90 to 100°C, for 60 to 120 seconds; (2) At room temperature Place it for several hours to several days; (3) Put it in a hot air heater or infrared heater for tens of minutes to several hours to remove the solvent, etc. [0242] Next, the coating film is exposed. Exposure is performed by irradiating active energy rays such as ultraviolet rays and excimer lasers. Exposure is performed by selecting a position such as a method of exposure through a negative mask, etc., in such a way that a black matrix of a desired pattern can be formed. The amount of energy ray irradiated varies with the composition of the resin composition, for example, it is preferably 40-200mJ/cm ² about. In addition, when the entire surface of the coating film is exposed, an unpatterned cured film having a shape corresponding to the shape of the coating film is formed. [0243] In the case of exposing the coating film at a selected position, the exposed film is developed with a developer, and the unexposed part is dissolved in the developer to be removed to form a patterned cured film. The development method is not particularly limited, and, for example, a dipping method, a spray method, etc. can be used. The developer can be appropriately selected according to the composition of the resin composition. As the developer, for example, an alkaline aqueous solution of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, quaternary ammonium salt, etc. can be used. [0244] Next, the patterned cured film is baked (post-baking). The baking temperature is not particularly limited, but is preferably 180 to 250°C, more preferably 220 to 230°C. The baking time is typically 10 to 90 minutes, preferably 20 to 60 minutes. By baking as described above, a cured film of a resin composition that can be preferably used as a black matrix can be obtained. [0245] The black matrix formed in this way can be preferably used for various image display devices represented by, for example, liquid crystal display devices. [Examples] [0246] Examples are shown below to further specifically describe the present invention, but the scope of the present invention is not limited by these examples. [Preparation Example 1] First, in a 500 ml four-necked flask, 235 g of bisphenol fluorene type epoxy resin (epoxy equivalent 235), 110 mg of tetramethylammonium chloride, and 2,6-di-tert-butyl were added 100 mg of -4-methylphenol and 72.0 g of acrylic acid were heated and dissolved at 90 to 100°C while air was blown thereinto at a rate of 25 ml/min. Next, the solution was gradually heated in a milky state, and heated to 120°C to completely dissolve it. At this time, the solution gradually became transparent and viscous, and stirring was continued in this state. During this period, the acid value was measured, and heating and stirring were continued until it was less than 1.0 mgKOH/g. It took 12 hours for the acid value to reach the target value. Then, it was cooled to room temperature to obtain a bisphenol fluorene type epoxy acrylate represented by the following formula in the form of a colorless and transparent solid.

[0248] Next, after adding 600 g of 3-methoxybutyl acetate to 307.0 g of the bisphenol fluorene type epoxy acrylate thus obtained and dissolving it, 80.5 g of benzophenone tetracarboxylic dianhydride and 1 g of benzophenone tetracarboxylic dianhydride were mixed. Tetraethylammonium bromide is slowly heated and allowed to react at 110-115°C for 4 hours. After confirming the disappearance of the acid anhydride group, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was mixed and reacted at 90°C for 6 hours to obtain resin A-1. The disappearance of the acid anhydride group was confirmed by infrared spectroscopy. [Example 1, Comparative Examples 1 to 4] In Examples and Comparative Examples, cardo resins and novolac resins were used as (A) alkali-soluble resins. The resin A-1 obtained in the above preparation example 1 was used as the cardo resin. As the novolak resin, TO-547 (trade name) manufactured by Sumitomo Bakelite Co., Ltd. was used. TO-547 is obtained by adding oxalic acid and formalin at a concentration of 37% by mass to a mixture of 90 mol% of m-cresol and 10 mol% of 2,3,5-trimethylphenol, and carrying out a condensation reaction by a conventional method Mw30000 cresol novolac resin. In Comparative Example 2, a styrene-methacrylic acid copolymer was used as (A) the alkali-soluble resin. In Comparative Example 3, the vinyl-containing acrylic resin obtained by the following preparation method was used as (A) the alkali-soluble resin. [0250] [Method for preparing vinyl-containing acrylic resin] Copolymerization of methacrylic acid and benzyl methacrylate at 45 mol%:55 mol% to obtain a copolymer was further combined with 3, 4‑Epoxycyclohexyl methyl methacrylate is reacted to obtain vinyl-containing acrylic resin. In addition, when methacrylic acid is 45 mol%, the 3,4-epoxycyclohexyl methacrylate used here is 15 mol%. [0251] In the examples and comparative examples, DPHA (dipentaerythritol hexaacrylate) was used as the (B) photopolymerizable compound. [0252] In Examples and Comparative Examples, OXE-02 (trade name, manufactured by BASF Corporation, O-acetyl-1-[6-(2-methylbenzyl)-9-ethyl- 9H-Zazol-3-yl]ethanone oxime) was used as (C) photopolymerization initiator. [0253] In the Examples and Comparative Examples, carbon black was used as the (D) light-shielding material. Carbon black (Pigment A (dispersion)) manufactured by Mikuni Color Co., Ltd. was used as carbon black. In addition, in Table 1 of this example section, the numerical value of the total value of the solid content of the pigment and the dispersant is described. [0254] In Example 1, an epoxy compound E1 (NC-2000-L, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent of 229 to 244) of the following structure was used as the (E) epoxy compound. In addition, p in the following formula represents the repeating number of the unit in parentheses. In this embodiment, an epoxy compound with an average molecular weight of 1700 is used.

[0255] (A) Alkali-soluble resin, (B) photopolymerizable compound, (C) photopolymerization initiator, (D) light-shielding material, and (E) epoxy compound were dissolved and dispersed in the amounts described in Table 1. (S) In the organic solvent, the solid content concentration was 15% by mass, and the resin composition of Example 1 was obtained. In addition, (A) alkali-soluble resin, (B) photopolymerizable compound, (C) photopolymerization initiator, and (D) light-shielding material in the amounts described in Table 1 were dissolved and dispersed in (S) organic solvent to make The solid content concentration was 15% by mass, and the resin compositions of Comparative Examples 1 to 4 were obtained. A mixed solvent of 3-methoxybutyl acetate: propylene glycol monomethyl ether acetate: cyclohexanone=40:35:25 (mass ratio) was used as the (S) organic solvent. Using the obtained resin composition, the impedance evaluation, sensitivity evaluation, solubility evaluation, water resistance evaluation, and film strength evaluation were evaluated according to the following methods. [0256] <Impedance Evaluation> First, a 100mm square glass substrate was cleaned with pure water and dried in an oven at 160°C. The resin composition obtained in the examples and comparative examples was coated on the dried glass substrate, and heated with a hot plate at 100° C. for 2 minutes to volatilize the solvent. Then, immediately use the mask without shading pattern at 30mJ/cm ² Exposure was performed at the exposure level, and a KOH aqueous solution with a concentration of 0.04% by mass was used as the developer for development for 70 seconds. The manufactured substrate was kept in an oven heated to 230°C for 180 minutes and then cooled to obtain a black film. In addition, the optical density (OD value) of the black films obtained in the Examples and Comparative Examples both exceeded 4.0/μm. The volume resistivity of the obtained black film was measured, and the impedance of the black matrix formed using the resin composition was evaluated based on the following criteria. In this project, the evaluation was based on the following benchmarks. ○: The volume resistivity is 1.0×10 ¹⁰ Ω·cm or more. ×: Volume resistivity is less than 1.0×10 ¹⁰ Ω·cm or more. [0257] <Sensitivity Evaluation> First, a 100mm square glass substrate was cleaned with pure water and dried in an oven at 160°C. The resin composition obtained in the Examples and Comparative Examples was coated on the dried glass substrate by a spin coater to obtain a coating film with a film thickness of 1.3 μm. Then, immediately use the 5μm line mask, at 30～50mJ/cm ² Exposure is performed within the range of the exposure amount, and a KOH aqueous solution with a concentration of 0.04% by mass is used as the developer for development for 70 seconds. In addition, the exposure was performed using a Proximity exposure machine manufactured by Topcon Corporation with a pitch of 70 μm and an illuminance of 20 mw. In this project, the evaluation was based on the following benchmarks. ◎: In order to obtain a 5μm pattern, 30mJ/cm is required ² The above is less than 35mJ/cm ² The amount of exposure. ○: 35mJ/cm is required to obtain a 5μm pattern ² Above is less than 40mJ/cm ² The amount of exposure. ×: 40mJ/cm is required to obtain a 5μm pattern ² The above exposure. [0258] <Solubility Evaluation> First, a 100 mm square glass substrate was washed with pure water and dried in an oven at 160°C. The resin composition obtained in the Examples and Comparative Examples was coated on the dried glass substrate by a spin coater to obtain a coating film with a film thickness of 1.3 μm. Then, immediately use the 5μm line mask, at 30mJ/cm ² Exposure was carried out at the exposure level, and a KOH aqueous solution with a concentration of 0.04% by mass was used as the developer for development for 70 seconds. In addition, exposure was performed using a Proximity exposure machine manufactured by Topcon Corporation under conditions of a pitch of 70 μm and an illuminance of 20 mw. In this project, the evaluation was based on the following benchmarks. ○: The interruption point (the time for the unexposed part to dissolve) is 35 seconds or more and less than 45 seconds. ×: The interruption point is 35 seconds or less, or 45 seconds or more. [0259] <Water resistance evaluation> By the same method as the impedance evaluation, coating of the resin composition, exposure, and contact with the developer were performed on the glass substrate. After that, the substrate was kept in an oven heated to 230°C for 60 minutes. Let it cool to obtain a substrate with a black film. The formed black film was immersed in pure water, and stored for 12 hours in an environment of 2 atmospheres, 120°C, and humidity 100%, and the water resistance was evaluated. In this project, the adhesion of the black film was evaluated based on the cross cutting method specified in JIS5600-5-6 (1999). The specific evaluation criteria are as follows. ◎: The area of the part where the black film is peeled off on the substrate is less than 10%. ○: The area of the part where the black film on the substrate is peeled off is greater than 10% and less than 30%. ×: The area of the part where the black film on the substrate is peeled off is greater than 30%. [0260] <Film Strength Evaluation> A black film was formed by the same method as the water resistance evaluation. Cut the substrate into 20mm squares, and stick a ceramic flexure board on the back. Stick an aluminum pin with epoxy glue on one side of the black film. After fixing the pin with a tool, heat it in an oven heated to 200°C for 5 minutes to fix the pin on the black film. After that, a tensile test was performed using the Ez-test manufactured by Shimadzu Corporation to evaluate the film strength. In this project, the evaluation was based on the following benchmarks. In addition, 5 measurements were performed, and evaluation was made based on the average value of the 3 measurements excluding the minimum and maximum values. ⊚: The value of the tensile test is 320N or more. ○: The value of the tensile test is 300N or more and less than 320N. △: The value of the tensile test is 280N or more and less than 300N. ×: The value of the tensile test is less than 280N. [0261]

[0262] According to the examples, if it contains: (A) alkali-soluble resin, (B) photopolymerizable compound, (C) photopolymerization initiator, (D) light-shielding material, and (E) ring that meets the specified conditions The oxygen compound resin composition can form a black matrix with high impedance and excellent water resistance, and excellent sensitivity. In addition, if this resin composition is used, a black matrix with excellent film strength can be formed. On the other hand, according to Comparative Example 1, it is difficult to form a black matrix with excellent water resistance when the resin composition does not contain the (E) epoxy compound that satisfies the prescribed conditions. In addition, according to Comparative Example 2 and Comparative Example 3, it can be seen that the resin composition contains acrylic resin such as styrene-methacrylic acid copolymer or vinyl-containing acrylic resin instead of the (E) epoxy compound that satisfies the prescribed conditions. Under the circumstances, it is difficult to form a high-impedance black matrix. In addition, when the resin composition is used, it is difficult to form a black matrix with excellent film strength. In addition, according to Comparative Example 4, it can be seen that when the resin composition contains novolak resin instead of the (E) epoxy compound that satisfies the specified conditions, even if a high-impedance black matrix can be formed, the sensitivity of the resin composition and the resistance to the developer The solubility is also poor.

Claims (11)

A resin composition for forming a black matrix, characterized by comprising (A) alkali-soluble resin, (B) photopolymerizable compound, (C) photopolymerization initiator, (D) light-shielding material, and (E) epoxy Compound; The aforementioned (A) alkali-soluble resin contains a resin containing an aromatic ring in the main chain; the aforementioned (E) epoxy compound contains an epoxy compound represented by the following formula (E1),

In the formula (E1), OGly is a glycidoxy group, R ^e1 is a halogen atom or a monovalent group with 1 to 8 carbon atoms, a is 0, b is the repeating number of the unit in parentheses, and R ^e2 is from more A divalent group obtained by removing two hydrogen atoms from a cycloalkane, or a group represented by the following formula (E1-1),

In formula (E1-1), OGly is a glycidoxy group, R ^e3 is at least one aromatic hydrocarbon group selected from the group consisting of benzene, naphthalene, anthracene, phenanthrene and terphenyl, and R ^e4 is a halogen atom or An alkyl group with 1 to 4 carbon atoms, c is 0, d is an integer of 0 to 8, R ^e5 is a hydrogen atom or a group represented by the following formula (E1-2),

In the formula (E1-2), OGly epoxy propoxy, R ^e6 is a halogen atom, an alkyl group having 1 to 4 carbon atoms or the phenyl group, e is an integer of 0 to 4; represented by the formula (E1) The average molecular weight of the epoxy compound is above 800. The resin composition according to claim 1, wherein the aforementioned (A) alkali-soluble resin includes a resin (a-1) having a Cado structure in its structure. The resin composition of claim 1 or 2, wherein, in the aforementioned formula (E1), R ^e2 is a divalent group obtained by removing two hydrogen atoms from a polycyclic alkane or represented by the aforementioned formula (E1-1) The above-mentioned c is 0 and the above-mentioned R ^e5 is a hydrogen atom group. The resin composition according to any one of claim 1 or 2, wherein the aforementioned (A) alkali-soluble resin comprises a phenol novolak resin (a-2) or an epoxy compound (a-3a) and an unsaturated group-containing carboxylate The adduct (a-3) of the polybasic acid anhydride (a-3c), the reaction product of the acid (a-3b). The resin composition according to any one of claim 1 or 2, wherein the total amount of active hydrogen groups (number of moles) possessed by the alkali-soluble resin (A) is referred to as Am, and the (E) epoxy resin When the total amount (number of moles) of epoxy groups possessed by the compound is denoted as Em, Am/Em is in the range of 0.25 or more and 4.0 or less. The resin composition according to any one of claim 1 or 2, wherein the content of the epoxy compound represented by the formula (E1) in the total solid content of the resin composition is 0.5% by mass or more and 10% by mass the following. The resin composition according to any one of claim 1 or 2, wherein the aforementioned (D) light-shielding material contains carbon black. The resin composition of any one of claim 1 or 2, wherein, in the cured film formed by curing the resin composition, the volume resistivity of the cured film is 1.0×10 ¹⁰ Ω. cm or more, the optical density (OD value) of the aforementioned cured film is 2.5/μm or more. A black matrix characterized by being hardened from the resin composition of any one of claims 1 to 8. A display device characterized by having a black matrix as claimed in claim 9. A method for producing a black matrix, characterized by comprising the following steps: a step of forming a coating film by coating the resin composition of any one of claims 1 to 8, and selecting a position to expose the coating film The steps are the steps of developing the exposed coating film and forming a patterned hardened film and baking the patterned hardened film.