TWI738427B - Apparatus capable of local polishing and plasma-electrolytic polishing system - Google Patents

Abstract

A apparatus capable of local polishing being suitable for performing a plasma-electrolytic polishing process to an object is provided. The apparatus capable of local polishing includes a fixed seat, a motion mechanism and a jet module. The fixing seat is suitable for fixing the object. The jet module is connected to the motion mechanism. The jet module has an electrolyte communication port, a gas communication port, a power connection area, and a jet flow outlet. The electrolyte communication port is adapted for being connected to an electrolyte supply source. The gas communication port is adapted for being connected to a gas supply source. The power connection area is adapted for being connected to a power source. The jet flow outlet faces the fixing seat. The jet flow outlet is connected to the electrolyte communication port and the gas communication port, which is suitable for performing the plasma-electrolytic polishing process to the object fixed on the fixing seat. A plasma-electrolytic polishing system including a apparatus capable of local polishing is also provided.

Description

Local polishing device and plasma electrolytic polishing system

The present invention relates to a polishing device and system, and more particularly to a partial polishing device and a plasma electrolytic polishing system including the same.

Plasma electrolytic polishing is a green process, which can polish complex-shaped workpieces, and can also reduce the pollution that may be caused by chemical polishing and electrolytic polishing.

However, the traditional plasma electrolytic polishing needs to immerse the polished part in the electrolytic bath, which may cause some restrictions on the application range of the plasma electrolytic polishing.

The invention provides a partial polishing device and a plasma electrolytic polishing system including the same, which is suitable for performing a plasma electrolytic polishing process on an object.

The locally possible polishing device of the present invention is suitable for performing plasma electrolytic polishing processes on objects. The local polishing device includes a fixed seat, a movement mechanism and a jet module. The fixing seat is suitable for fixing objects. The jet module is connected to the movement mechanism. The jet module has an electrolyte communication port, a gas communication port, a power connection area and a jet port. The electrolyte communication port is suitable for connecting to an electrolyte supply source. The gas communication port is suitable for being connected to a gas supply source. The power connection area is suitable for connecting to a power source. The jet orifice faces the fixing seat. The jet port is connected to the electrolyte communication port and the gas communication port, so as to be suitable for performing the plasma electrolytic polishing process on the object fixed on the fixing seat.

In an embodiment of the present invention, the jet module includes a cylinder, a nozzle, and a kit. The column has a power connection area, an electrolyte communication port, and an electrolyte flow channel connected to the electrolyte communication port. The nozzle has a connection block and a spray block opposite to the connection block. The connecting block is connected to the column, and the spraying block has a spout. The kit fits on the cylinder. The kit has a gas communication port and a gas outlet connected to the gas communication port. Part of the nozzle is located in the gas outlet. There is a gap between the nozzle and the inner wall of the gas outlet. The gas outlet and the spout constitute a spout.

In an embodiment of the present invention, part of the ejection zone is located in the gas outlet. The end of the ejection zone with the largest cross-sectional width is located, and the end of the ejection zone is not located in the gas outlet.

In an embodiment of the present invention, the cross-sectional width of the ejection zone gradually increases toward the end thereof.

In an embodiment of the present invention, the nozzle has a flow channel. The end of the flow channel is a spout, and the flow channel has the smallest cross-sectional width at its end.

In an embodiment of the present invention, the gas outlet has a diameter, and the diameter of the opening gradually increases toward its end.

In an embodiment of the present invention, the jet module further includes a connector. The connecting piece connects the column and the kit, and the connecting piece is an insulator.

In an embodiment of the present invention, there is at least one guide channel on the surface of the fixing seat facing the jet flow module.

The plasma electrolytic polishing system of the present invention includes the partial polishing device and the control system of the foregoing embodiment. The control system is at least signal connected to the movement mechanism of the local polishing device.

In an embodiment of the present invention, the local polishing device further includes an electrolyte control member. The electrolyte supply source is suitable for being connected to the electrolyte communication port via the electrolyte control element, and the control system is further signally connected to the electrolyte control element.

In an embodiment of the present invention, the locally possible polishing device further includes a gas control member. The gas supply source is adapted to be connected to the gas communication port via the gas control element, and the control system is further signally connected to the gas control element.

In an embodiment of the present invention, the locally possible polishing device further includes a power control element. The power supply is adapted to be connected to the power connection area through the power connection area, and the control system is further signal-connected to the power control element.

Based on the above, the local polishing device and the plasma electrolytic polishing system including the same can perform local polishing on a specific position or area of an object by means of an electrolyte jet. In addition, with the electrolyte jet method, the size limit of the object may be reduced, and the space of the polishing area may also be saved. In addition, when polishing is performed by the electrolyte jet, the electrolyte jetted from the nozzle can flow out together with the gas jetted from the gas outlet. In other words, the gas ejected from the gas outlet may generally form a ring-shaped gas wall, and the electrolyte jet may basically be confined to the aforementioned ring-shaped gas wall. In this way, the accuracy of polishing may be improved, and the possibility of over-polishing may also be reduced.

Hereinafter, the present invention will be explained more fully with reference to the drawings of this embodiment. However, the present invention can also be embodied in various different forms and should not be limited to the embodiments described herein. The thickness of the layers and regions in the drawing will be exaggerated for clarity. The same or similar reference numbers indicate the same or similar elements, and the following paragraphs will not repeat them one by one. In addition, the directional terms mentioned in the embodiments, such as: up, down, left, right, front or back, etc., only refer to the directions of the attached drawings. Therefore, unless there are special instructions, the directional terms used are used to illustrate and not to limit the present invention. In addition, in order to clearly show the directional relationship between different patterns, the Cartesian coordinate system (XYZ rectangular coordinate system) is used to indicate the corresponding direction in some of the illustrations. In addition, for clarity, some components may be omitted from the drawings.

The term set used herein is only used for the purpose of describing particular embodiments and is not intended to limit the inventive concept. As used in the present invention, the singular form "one" will also include the plural form, unless explicitly specified otherwise herein. It will also be understood that the term "comprises", when used in this specification, specifies the presence of the described features, wholes, steps, operations, elements and/or elements, but does not exclude one or more features, wholes The existence or addition of, steps, operations, elements, elements, and/or groups thereof.

Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings commonly understood by those with ordinary knowledge in the technical field to which the present invention belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having meaning consistent with the meaning in the relevant technical context, and should not be interpreted in an idealized or overly formal sense, unless in This is clearly defined as such.

Fig. 1A is a partially assembled perspective view of a device capable of partially polishing according to a first embodiment of the present invention. Fig. 1B is a partially exploded perspective view of a device that can be partially polished according to the first embodiment of the present invention. Fig. 1C is a partially exploded perspective view of a device that can be partially polished according to the first embodiment of the present invention. Fig. 1D is a schematic partial exploded cross-sectional view of a device capable of partial polishing according to the first embodiment of the present invention. Fig. 1E is a partially assembled cross-sectional view of a device capable of partially polishing according to the first embodiment of the present invention. Fig. 1F is a partially assembled schematic bottom view of a device that can be partially polished according to the first embodiment of the present invention. For example, FIG. 1C may be a partial exploded perspective view of the jet module corresponding to the local polishing device, FIG. 1D may be a partial exploded cross-sectional view of the jet module corresponding to the local polishing device, and FIG. 1E may be a corresponding A schematic cross-sectional view of a partial assembly of the jet module of the device that can be partially polished. FIG. 1F may be a schematic bottom view of a partial assembly of the jet module of the device that can be partially polished.

Referring to FIGS. 1A to 1F, the partial polishing device 100 is suitable for performing a plasma electrolytic polishing process on an object 199.

Please refer to FIG. 1A first, the local polishing device 100 includes a fixing base 110, a jet module 120 and a movement mechanism 182. The fixing base 110 is suitable for fixing an object 199. The jet module 120 is connected to the movement mechanism 182.

Referring to FIGS. 1B and 1E again, the jet flow module 120 has an electrolyte communication port 131, a gas communication port 151, a power connection area 133 and a jet port 129. The electrolyte communication port 131 is adapted to be connected to an electrolyte supply source 893. The gas communication port 151 is suitable for connecting to a gas supply source 895. The nozzle 129 faces the fixing seat 110, and the nozzle 129 is connected to the electrolyte communication port 131 and the gas communication port 151, so that the nozzle module 120 is suitable for performing plasma plasma on the object 199 fixed to the fixing seat 110 through the nozzle 129. Electrolytic polishing process.

In an embodiment, the fixing base 110 may include a base 112 and at least one fixing member 113. The fixing member 113 is, for example, commonly used screws, bolts, washers, nuts, engaging members, etc., which are not limited in the present invention. The fixing base 110 may have corresponding holes (such as screw holes), grooves (such as card slots), etc., so as to be suitable for fixing the object 199 on the base by the fixing member.

In an embodiment, the material of the main body of the fixing base 110 (for example, the material of the base) may be an insulator. In this way, when the object 199 is subjected to the plasma electrolytic polishing process, the current flowing through the fixing base 110 can be reduced.

In one embodiment, the jet module 120 may be connected to the movement mechanism 182 by a common fixing member. In this way, by controlling the movement mechanism 182, the jet module 120 can be adjusted so that the jet nozzle 129 of the jet module 120 faces a predetermined orientation (orientation), and the jet module 120 can be adapted to be aligned with the jet nozzle 129. The object 199 fixed to the fixing base 110 is subjected to a plasma electrolytic polishing process.

In an embodiment, the movement mechanism 182 may include a movable module commonly used in movable mechanism design (such as: a horizontal movement module, a vertical movement module, a rotation movement module or a combination of the above), which may include corresponding Hardware or software, or further combined with auxiliary parts. For example, the movable module can be composed of a power supply device, a motor, a belt, a gear, and other related components, which are not limited in the present invention. The aforementioned related components include, for example, communication components, power components, display components, etc., which are not limited in the present invention. The aforementioned software includes, for example, spatial position calculation software, error logging software, communication software, etc., which are not limited in the present invention. The aforementioned auxiliary components include, for example, a moving rail, a moving shaft, a shock-absorbing element, a positioning device, etc., which are not limited in the present invention.

In an embodiment, the movement mechanism 182 is, for example, a robotic arm, but the invention is not limited to this.

In this embodiment, the jet module 120 may include a cylinder 130, a nozzle 140, and a kit 150. The material of the column 130 includes a conductor, and the column 130 has a power connection area 133, an electrolyte communication port 131 and an electrolyte flow channel 132. The electrolyte flow channel 132 communicates with the electrolyte communication port 131. The nozzle 140 has a connection block 141 and an ejection block 142. The ejection block 142 is opposite to the connection block 141. The connection block 141 may be connected to the pillar 130. The ejection block 142 has an ejection port 149. The sleeve 150 can be sleeved on the cylinder 130. The sleeve 150 has a gas communication port 151 and a gas outlet 159. The gas outlet 159 communicates with the gas communication port 151. Part of the nozzle 140 is located in the gas outlet 159. In the state where the connecting block 141 is connected to the cylinder 130 and the sleeve 150 is fitted to the cylinder 130 (such as the state shown in 1E), there may be a gap between the nozzle 140 and the inner wall of the gas outlet 159 155, and the gas outlet 159 and the nozzle 149 constitute the nozzle 129 of the jet module 120.

In an embodiment, the sleeve 150 and the cylinder 130 may be connected by sleeves with each other through a connecting member 127 (such as an O-ring, other similar elastic rings, or a ring gasket). In one embodiment, the sleeve 150 and the cylinder 130 may have corresponding fixing holes 128 (such as screw holes), and they may be fitted with each other by corresponding connectors (such as screws or corresponding washers). And connect.

In one embodiment, the connecting member 127 is an insulator. In this way, the sleeve 150 and the column 130 can be insulated from each other; or, the current flowing through the sleeve 150 can be reduced.

In an embodiment, the connecting member used for the connection between the sleeve 150 and the column 130 may be insulated. For example, the connecting member used to connect the sleeve 150 and the column 130 may be an insulating screw or a corresponding insulating gasket.

In one embodiment, an example of a plasma electrolytic polishing process performed on the object 199 fixed on the fixing base 110 by the local polishing device 100 is as follows. However, it is worth noting that the following plasma electrolytic polishing process is only an exemplary example, and the present invention does not limit the actual steps of the plasma electrolytic polishing process performed by the local polishing apparatus 100.

In one embodiment, the object 199 may be fixed on the base by the fixing member first. The object 199 may be electrically connected to the ground terminal by a wire (not shown). In an embodiment, the ground wire electrically connected to the object 199 may be directly connected to the object 199, but the present invention is not limited thereto. In one embodiment, the ground wire electrically connected to the object 199 may be indirectly connected to the object 199 by a conductive fixing member (such as the fixing member 113 or other possible conductive fixing members) that fixes the object 199.

FIG. 1G is a schematic diagram of partial connections of a plasma electrolytic polishing system according to an embodiment of the present invention.

Please refer to FIG. 1G, the localable polishing device 100 and the control system 870 can constitute a plasma electrolytic polishing system 800. That is to say, the plasma electrolytic polishing system 800 may include the local polishing device 100 and the control system 870. In other non-illustrated embodiments, the localized polishing device similar to the localized polishing device 100 can also form a plasma electrolytic polishing system similar to the plasma electrolytic polishing system 800 with the control system 870.

In this embodiment, the control system 870 can be signal-connected to the movement mechanism 182 in a wired signal transmission manner via the signal line 878, but the invention is not limited to this. In an embodiment, the control system 870 may be signal-connected to the motion mechanism 182 by means of wireless signal transmission. In other words, the signal connection mentioned in the present invention can generally refer to the connection mode of wired signal transmission or wireless signal transmission. In addition, the present invention does not limit all signal connection modes to be the same or different.

In this embodiment, the plasma electrolytic polishing system 800 may further include an electrolyte control component 883. The electrolyte supply source 893 is adapted to be connected to the electrolyte communication port 131 via the electrolyte control component 883, and the control system 870 can be connected to the electrolyte control component 883 by a signal.

For example, the electrolyte supply source 893 may be connected to the electrolyte communication port 131 through a corresponding fluid pipeline 894. One end of the aforementioned fluid pipeline 894 can be connected to an electrolyte supply source 893 (eg, a bottle containing electrolyte and a corresponding pump), and the other end of the aforementioned fluid pipeline 894 can be connected to an electrolyte communication port 131. The fluid line 894 may have an electrolyte control part 883. The electrolyte control member 883 is, for example, a liquid solenoid valve, but the present invention is not limited to this. For another example, the electrolyte control component 883 connected to the control system 870 via a signal can set, control or detect the amount, time, or flow rate of the electrolyte flowing through. In addition, the flow lines, types, or numbers of the electrolyte supply source 893 and the corresponding fluid pipelines can be adjusted according to actual needs, and are not limited in the present invention. The control system 870 can be signal-connected to the electrolyte control component 883 in a wired signal transmission manner via the signal line 873, but the present invention is not limited to this.

In this embodiment, the plasma electrolytic polishing system 800 may further include a gas control element 885. The gas supply source 895 is adapted to be connected to the gas communication port 151 via the gas control element 885, and the control system 870 can be connected to the gas control element 885 by a signal.

For example, the gas supply source 895 may be connected to the gas communication port 151 through a corresponding gas pipeline 896. One end of the aforementioned gas pipeline 896 can be connected to a gas supply source 895 (for example, a steel cylinder containing gas and a corresponding pump), and the other end of the aforementioned gas pipeline 896 can be connected to the gas communication port 151. The gas pipeline 896 may have a gas control member 885. The gas control member 885 is, for example, a gas solenoid valve, but the present invention is not limited to this. For another example, the gas control element 885 connected to the control system 870 via a signal can set, control or detect the amount, time, or flow rate of the gas flowing through. In addition, the streamlines, types or numbers of the gas supply source 895 and the corresponding gas pipelines can be adjusted according to actual requirements, which are not limited in the present invention. The control system 870 can be signal-connected to the electrolyte control component 883 via the signal line 875 in a wired signal transmission manner, but the present invention is not limited to this.

In this embodiment, the plasma electrolytic polishing system 800 may further include a power control component 887. The power supply 897 is adapted to be connected to the power connection area 133 via the power control unit 887, and the control system 870 can be connected to the power control unit 887 by a signal.

For example, the power source 897 may be connected to the power connection area 133 through a corresponding circuit 898. One end of the aforementioned circuit 898 can be electrically connected to the power source 897, and the other end of the aforementioned circuit 898 can be electrically connected to the power connection area 133. The circuit 898 may have a power control unit 887 on it. The power control unit 887 is, for example, an electromagnetic switch and/or a corresponding transformer, rectifier, capacitor, etc., but the present invention is not limited thereto. For another example, the power control component 887 connected to the control system 870 via a signal can set, control or detect the current, voltage, frequency, or power supply time input to the power connection area 133. The control system 870 can be signal-connected to the power control element 887 in a wired signal transmission manner via the signal line 877, but the present invention is not limited to this.

In one embodiment, after the object 199 is fixed on the base 112, the movement mechanism 182 can be adjusted by the control system 870 so that the jet nozzle 129 of the jet module 120 faces the area to be polished of the object 199. The area to be polished of the object 199 is substantially above the surface 111 of the base 112. In other words, during the plasma electrolytic polishing process, at least part of the object 199 may be covered by the flowing electrolyte, but the object 199 will not be completely and continuously infiltrated by the electrolyte.

In one embodiment, by adjusting the movement mechanism 182 by the control system 870, the distance between the jet 129 and the object 199 can also be adjusted.

In one embodiment, the gas control element 885, the electrolyte control element 883, and the power control element 887 can be turned on by the control system 870, so that the gas flowing out of the gas supply source 895 flows to the gas communication port 151 through the gas control element 885 Then it is ejected from the gas outlet 159, and the electrolyte from the electrolyte supply source 893 flows to the electrolyte communication port 131 through the electrolyte controller 883, and then is ejected from the nozzle 149 in the ejection direction 140d, and the high-voltage power provided by the power supply 897 It is transmitted to the power connection area 133 via the power control part 887 so that there is a high voltage difference between the nozzle 140 and the object 199.

In one embodiment, the gas control member 885 may be turned on first, then the electrolyte control member 883 may be turned on, and then the power control member 887 may be turned on, but the present invention is not limited to this.

In an embodiment, the high-voltage power provided by the power supply 897 basically has a voltage of 30 volts (V) to 400 volts, but the present invention is not limited thereto.

In one embodiment, the type, temperature, or flow rate of the electrolyte can be adjusted according to design requirements (for example, the type of the object 199 or the polishing specifications). For example, if the object 199 is steel or copper, the electrolyte may be a mixed electrolyte of phosphoric acid and/or its salts (such as sodium phosphate, sodium dihydrogen phosphate, or disodium hydrogen phosphate) at 40°C to 90°C.

In one embodiment, the type or flow rate of the gas can be adjusted according to design requirements (for example, the corresponding electrolyte type). For example, the gas can be nitrogen, carbon dioxide, helium, tritium, argon, other suitable non-reactive gases, or a combination of the above.

With the above-mentioned design of the jet module 120, the specific position or area of the object 199 can be locally polished by the electrolyte jet. In addition, by using the electrolyte jet method, the size limit of the object 199 may be reduced, and the space of the polishing area may also be saved. In addition, when polishing is performed by the electrolyte jet, the electrolyte jetted from the nozzle 149 (may be referred to as electrolyte jet) can flow out together with the gas jetted from the gas outlet 159 (may be referred to as a gas wall). In other words, the gas ejected from the gas outlet 159 may generally form a ring-shaped gas wall, and the electrolyte jet may basically be confined to the aforementioned ring-shaped gas wall. In this way, the accuracy of polishing may be improved, or the possibility of over polished may be reduced.

In this embodiment, part of the ejection block 142 is located in the gas outlet 159. The ejection block 142 has the largest cross-sectional width substantially at its end 147 (that is, the farthest from the connection block 141). For example, on a cross section perpendicular to the ejection direction 140d (eg, a section parallel to the paper surface of FIG. 1F), the end 147 of the ejection block 142 has the largest cross-sectional width. In the state where the connecting block 141 is connected to the cylinder 130 and the sleeve 150 is fitted to the cylinder 130 (such as the state shown in 1E), the end 147 of the ejection block 142 is not located in the gas outlet 159. In this way, when the object 199 is subjected to the plasma electrolytic polishing process, it may be possible to reduce the unexpected interference between the electrolyte jet and the gas wall.

In this embodiment, the cross-sectional width of the ejection block 142 gradually increases toward the end 147 thereof. That is to say, on a longitudinal section parallel to the ejection direction 140d (eg, a section parallel to the paper surface of FIG. 1E), the outline of the outer side wall of the ejection block 142 may basically be a slope. For example, the ejection area 142 may be cone-like or frustum-like. In this way, when the object 199 is subjected to the plasma electrolytic polishing process, the gas wall may be diffused away from the nozzle 129 and the unintended interference between the electrolyte jet and the gas wall may be reduced.

In one embodiment, on the longitudinal section parallel to the ejection direction 140d, the outline of the outer side wall of the ejection block 142 may be basically inclined; and on the cross section perpendicular to the ejection direction 140d, the outer side wall of the ejection block 142 The outline of is basically circular. For example, the ejection block 142 may be similar to a cone shape or a truncated cone shape.

In this embodiment, the nozzle 140 has a flow channel 146. The end of the flow channel 146 is a spout 149. The flow channel 146 has the smallest cross-sectional width at its end. For example, the cross section of the end of the flow channel 146 perpendicular to the ejection direction 140 d (eg, a cross section parallel to the paper surface of FIG. 1F) has the smallest diameter. As a result, when the object 199 is subjected to the plasma electrolytic polishing process, it may be possible to reduce the possibility of turbulence in the electrolyte jet.

In this embodiment, the gas outlet 159 has the largest diameter at its end. For example, in a cross section perpendicular to the ejection direction 140d, the end of the gas outlet 159 has the largest diameter.

In this embodiment, the opening of the gas outlet 159 gradually increases toward its end. That is to say, on a longitudinal section parallel to the ejection direction 140d (for example, a section parallel to the paper surface of FIG. 1E), the contour of the inner side wall of the gas outlet 159 may be basically a slope. For example, the shape of the gas outlet 159 may be similar to a cone shape or a frustum shape.

In an embodiment, the shape of the gas outlet 159 may correspond to the shape of the ejection block 142. In this way, when the object 199 is subjected to the plasma electrolytic polishing process, it may be possible to reduce the possibility of turbulence forming in the gas wall. For example, the shape of the gas outlet 159 may be a cone shape or a truncated cone shape similar to the ejection block 142.

Fig. 2 is a partially assembled perspective view of a device that can be partially polished according to a second embodiment of the present invention. The locally capable polishing device 200 of this embodiment is similar to the partially capable polishing device 100 of the first embodiment, and similar components thereof are denoted by the same reference numerals, and have similar functions, materials, or actions, and descriptions are omitted.

In this embodiment, the surface 111 of the fixing seat 110 of the local polishing device 200 facing the jet module 120 has at least one guide channel 217. In this way, when the object 199 is subjected to the plasma electrolytic polishing process, the electrolyte may be more easily guided away from the surface 111 of the fixing seat 110 through the guide channel 217.

In summary, the locally possible polishing device and the plasma electrolytic polishing system including the same of the present invention can perform partial polishing on a specific position or area of an object by means of an electrolyte jet. In addition, with the electrolyte jet method, the size limit of the object may be reduced, and the space of the polishing area may also be saved. In addition, when polishing is performed by the electrolyte jet, the electrolyte jetted from the nozzle can flow out together with the gas jetted from the gas outlet. In other words, the gas ejected from the gas outlet may generally form a ring-shaped gas wall, and the electrolyte jet may basically be confined to the aforementioned ring-shaped gas wall. In this way, the accuracy of polishing may be improved, and the possibility of over-polishing may also be reduced.

100, 200: Local polishing device 800: Plasma electrolytic polishing system 110: fixed seat 111: Surface 112: Base 113: fixed parts 217: Diversion channel 120: Jet module 127: Connector 128: fixed hole 129: Jet Orifice 130: cylinder 131: Electrolyte connection port 132: Electrolyte flow channel 133: Power connection area 140: Nozzle 141: connection block 142: Spray Block 147: End 149: spout 146: Flow Channel 140d: spray direction 150: kit 151: Gas connection port 159: gas outlet 155: Gap 182: Movement Mechanism 199: Object 870: Control System 873, 875, 877, 878: signal line 883: Electrolyte Control Parts 885: Gas Control Parts 887: Power connector 893: Electrolyte supply source 894: Fluid Line 895: gas supply source 896: Gas Pipeline 897: Power 898: circuit X, Y, Z: direction

Fig. 1A is a partially assembled perspective view of a device capable of partially polishing according to a first embodiment of the present invention. Fig. 1B is a partially exploded perspective view of a device that can be partially polished according to the first embodiment of the present invention. Fig. 1C is a partially exploded perspective view of a device that can be partially polished according to the first embodiment of the present invention. Fig. 1D is a schematic partial exploded cross-sectional view of a device capable of partial polishing according to the first embodiment of the present invention. Fig. 1E is a partially assembled cross-sectional view of a device capable of partially polishing according to the first embodiment of the present invention. Fig. 1F is a partially assembled schematic bottom view of a device that can be partially polished according to the first embodiment of the present invention. FIG. 1G is a schematic diagram of partial connections of a plasma electrolytic polishing system according to an embodiment of the present invention. Fig. 2 is a partially assembled perspective view of a device that can be partially polished according to a second embodiment of the present invention.

100: Local polishing device

110: fixed seat

112: Base

113: fixed parts

120: Jet module

128: fixed hole

140d: spray direction

151: Gas connection port

182: Movement Mechanism

199: Object

X, Y, Z: direction

Claims (10)

A device that can be locally polished is suitable for performing a plasma electrolytic polishing process on an object. The device that can be locally polished includes: A fixing seat suitable for fixing the object; A movement mechanism; and A jet flow module is connected to the movement mechanism, and the jet flow module has: An electrolyte communication port, suitable for connecting to an electrolyte supply source; A gas communication port suitable for connecting to a gas supply source; A power connection area suitable for connecting to a power source; and A jet orifice faces the fixing seat, and the jet orifice is connected to the electrolyte communication opening and the gas communication opening, so as to be suitable for performing the plasma electrolytic polishing process on the object fixed to the fixing seat. The device for local polishing according to claim 1, wherein the jet module includes: A cylinder with the power connection area, the electrolyte communication port, and an electrolyte flow channel connected to the electrolyte communication port; A nozzle having a connecting block and a spraying block opposite to the connecting block, the connecting block is connected to the column, and the spraying block has a spout; and A sleeve sleeved on the cylinder, the sleeve has the gas communication port and a gas outlet communicating with the gas communication port, part of the nozzle is located in the gas outlet, between the nozzle and the inner wall of the gas outlet There is a gap, and the gas outlet and the spout constitute the spout. The local polishing device according to claim 2, wherein a part of the ejection area is located in the gas outlet, and the ejection area has the largest cross-sectional width at its end, and the end of the ejection area is not located at the gas Inside the exit. According to the partial polishing device described in claim 3, the cross-sectional width of the ejection zone gradually increases toward the end thereof. The locally possible polishing device according to claim 2, wherein the nozzle has a flow channel, the end of the flow channel is the nozzle, and the flow channel has the smallest cross-sectional width at its end. According to the local polishing device according to claim 2, the gas outlet has a diameter, and the diameter of the opening gradually increases toward the end. The device for local polishing according to claim 2, wherein the jet flow module further includes: A connecting piece connects the column and the kit, and the connecting piece is an insulator. The partial polishing device according to claim 1, wherein a surface of the fixing seat facing the jet flow module has at least one flow guide. A plasma electrolytic polishing system, including: Such as the device that can be partially polished in claim 1; and; A control system is at least signal connected to the movement mechanism of the local polishing device. The plasma electrolytic polishing system described in claim 9 further includes: An electrolyte control component, wherein the electrolyte supply source is adapted to be connected to the electrolyte communication port via the electrolyte control component, and the control system is further signally connected to the electrolyte control component; A gas control element, wherein the gas supply source is adapted to be connected to the gas communication port via the gas control element, and the control system is further signally connected to the gas control element; or A power control element, wherein the power source is suitable for being connected to the power connection area through the power connection area, and the control system is further signally connected to the power control element.

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