CN112077067B - Spray set and semiconductor cleaning equipment among semiconductor cleaning equipment - Google Patents

Spray set and semiconductor cleaning equipment among semiconductor cleaning equipment Download PDF

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Publication number
CN112077067B
CN112077067B CN202010871785.5A CN202010871785A CN112077067B CN 112077067 B CN112077067 B CN 112077067B CN 202010871785 A CN202010871785 A CN 202010871785A CN 112077067 B CN112077067 B CN 112077067B
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rotating shaft
spray
assembly
pipe
adjusting
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CN112077067A (en
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马宏帅
王锐廷
张敬博
赵宏宇
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
    • B08B9/0936—Cleaning containers, e.g. tanks by the force of jets or sprays using rotating jets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a spraying device in semiconductor cleaning equipment, which comprises a rotating shaft, a base assembly and a spraying pipe assembly, wherein the rotating shaft is arranged in the base assembly and can rotate around the axis of the rotating shaft, and a flow guide pipeline is arranged in the rotating shaft; the base assembly is fixedly arranged at the top of the process chamber of the semiconductor cleaning equipment, is used for accommodating the rotating shaft and is also used for guiding a cleaning agent into the flow guide pipeline; the spray pipe assembly is connected with the rotating shaft and communicated with the flow guide pipeline; the shower assembly includes at least one driving shower for driving the shower assembly and the rotary shaft to rotate based on a reaction force generated when the cleaning agent is sprayed. In the invention, the rotating shaft can be driven to rotate automatically by the reverse acting force of the spray head only by injecting the cleaning agent into the driving spray pipe, so that the process chamber is cleaned by rotary spraying, the structure is simple, the safety is high, and the maintenance cost for arranging the movable sealing element in the spray device can be saved. The invention also provides semiconductor cleaning equipment.

Description

Spray set and semiconductor cleaning equipment among semiconductor cleaning equipment
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a spraying device in semiconductor cleaning equipment and the semiconductor cleaning equipment.
Background
As the integration density of Integrated Circuits (ICs) increases, semiconductor devices have placed higher demands on semiconductor processing equipment. The quartz tube and the quartz boat are commonly used parts in diffusion furnaces and vertical furnaces for oxidizing substrates (wafers), and the quartz tube and the quartz boat are in direct contact with the substrates during a semiconductor process, so that the granularity of the surfaces of the quartz tube and the quartz boat directly affects the processing effect of the substrates in the oxidation and diffusion processes.
In order to improve the cleanliness of the surfaces of the quartz tube and the quartz boat, the quartz tube and the quartz boat are often cleaned by a cleaning machine. At present, cleaning equipment for cleaning quartz tubes and quartz boats is mainly divided into vertical quartz boat cleaning machines and horizontal quartz tube boat cleaning machines. The horizontal quartz tube boat cleaning machine is used for soaking and cleaning a quartz tube and a quartz boat by using liquid medicine in a process tank, a filter is used for circularly filtering the liquid medicine, the liquid medicine is replaced after the liquid medicine in the process tank reaches the life cycle, the process tank of the cleaning machine cannot be cleaned after the soaking and cleaning process is completed every time, and particles may be bred in the process tank to influence the subsequent cleaning process. And vertical quartz capsule boat cleaning machine sprays the washing with quartz capsule and quartz boat, and the liquid medicine that has washd is retrieved and is stored after filtering with the filter, and after the cleaning process, can also spray the washing and dry to the process chamber of cleaning machine to avoid breeding of granule.
At present, a spraying device in a vertical quartz boat cleaning machine is generally driven by a motor to rotate, and in order to meet the sealing requirement of a process chamber, the spraying device is complex in overall structure, high in cost and easy to damage.
Disclosure of Invention
The invention aims to provide a spraying device in semiconductor cleaning equipment and the semiconductor cleaning equipment, wherein the spraying device is simple in structure and high in safety.
To achieve the above objects, as one aspect of the present invention, there is provided a shower device in a semiconductor cleaning apparatus, including a rotary shaft, a susceptor assembly, and a shower assembly, wherein,
the rotating shaft is arranged in the base assembly, can rotate around the axis of the rotating shaft relative to the base assembly, and is internally provided with a flow guide pipeline;
the base assembly is fixedly arranged at the top of the process chamber of the semiconductor cleaning equipment, is used for accommodating the rotating shaft and is also used for guiding a cleaning agent into the flow guide pipeline;
the spray pipe assembly is connected with the rotating shaft and communicated with the flow guide pipeline; the spray pipe assembly comprises at least one driving spray pipe, and the driving spray pipe is used for driving the spray pipe assembly and the rotating shaft to rotate based on the generated reaction force when the cleaning agent is sprayed.
Preferably, the shower subassembly still includes the adapter, the adapter with the swivelling joint, the drive shower with the adapter is connected, the drive shower passes through the adapter with the water conservancy diversion pipeline intercommunication.
Preferably, the driving spray pipe comprises a straight pipe, a bent pipe and a spray head, the straight pipe is connected with the adapter, the bent pipe is connected with the straight pipe, and the spray head is connected with the bent pipe;
an included angle exists between the orientations of the two ends of the bent pipe, so that the included angle also exists between the spraying direction of the spray head and the extending direction of the straight pipe.
Preferably, the drive shower still includes wide angle shower nozzle, wide angle shower nozzle sets up on the straight tube, wide angle shower nozzle the spray direction with drive shower nozzle's spray direction all faces same one side of drive shower.
Preferably, the shower assembly includes at least one pair of said driven showers, each pair of said driven showers being symmetrically disposed.
Preferably, the shower assembly further comprises at least one pair of balance showers, and the balance showers are connected with the adapter and symmetrically arranged;
the balance spray pipe comprises a balance straight pipe and a balance spray head, the balance straight pipe is connected with the adapter, the balance spray head is connected with the balance straight pipe, and the spray direction of the balance spray head faces to a process area in the process chamber.
Preferably, the base assembly comprises a base body, a rotating shaft bushing, a rotating shaft adjusting mechanism and an end cover, wherein,
the pedestal body is fixedly arranged at the top of the process chamber, the rotating shaft bushing is arranged in the pedestal body, and the rotating shaft is rotatably arranged in the rotating shaft bushing and extends out of one end of the rotating shaft bushing to be connected with the spray pipe assembly; the end cover seals an opening at the other end of the rotating shaft bushing, one side of the end cover facing the rotating shaft is provided with a flow guide nozzle, the flow guide nozzle extends into the flow guide pipeline, one side of the end cover far away from the rotating shaft is provided with a flow guide joint, and the flow guide joint is communicated with the flow guide nozzle; the rotating shaft adjusting mechanism is arranged in the rotating shaft bushing and used for limiting the position of the rotating shaft in the rotating shaft bushing.
Preferably, the rotating shaft comprises a ball head part and a column part, the ball head part is arranged in the rotating shaft bushing, and the column part extends out of one end of the rotating shaft bushing and is connected with the shower assembly;
the pivot guiding mechanism includes pivot adjusting block, regulating part, the pivot adjusting block is located the bulb portion with between the end cover, be formed with the adjustment groove on the pivot adjusting block, the shape in adjustment groove with the shape of bulb portion matches, be formed with the pivot fitting surface on the inner wall of pivot bush, the shape of pivot fitting surface with the shape of bulb portion matches, the regulating part is used for adjusting the pivot adjusting block with distance between the end cover.
Preferably, the adjusting member includes an adjusting screw and an adjusting nut, an adjusting hole is formed on a surface of the rotating shaft adjusting block facing the end cover, the adjusting nut is sleeved on the adjusting screw, and the adjusting screw is screwed into the adjusting hole.
As a second aspect of the present invention, there is provided a semiconductor cleaning apparatus, comprising a process chamber and a spraying device disposed at the top of the process chamber, wherein the spraying device is used for spraying a cleaning agent to a process region in the process chamber, and the spraying device is the aforementioned spraying device.
In the spray device and the semiconductor cleaning equipment provided by the invention, the automatic rotation of the rotating shaft and the spray pipe assembly can be realized by the reverse acting force of the spray head only by injecting the cleaning agent into the flow guide pipeline of the rotating shaft, so that the 360-degree dead-angle-free spray cleaning of the process chamber of the semiconductor cleaning equipment is completed. The cleaning device has the advantages that the motor and the corresponding driving mechanism are removed, the structure of the spraying device is simplified, meanwhile, the potential safety hazard that the motor and the corresponding driving mechanism are corroded by the cleaning agent is eliminated, and the safety of the spraying device and the semiconductor cleaning equipment applying the spraying device is improved. And, corresponding cleaner provides the subassembly and directly provides the cleaner to drive the shower through the honeycomb duct way in the rotation axis, need not to set up the passageway of sealing member fluid on the outer wall of rotation axis and carries out the action seal, has reduced the maintenance cost who changes sealing member in the spray set.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a spray apparatus provided by the present invention;
FIG. 2 is a schematic structural view of a shower assembly provided by the present invention;
FIG. 3 is a top view of a rotating shaft adjusting block and an adjusting mechanism in the spraying device provided by the present invention;
FIG. 4 is a schematic view of the connection relationship between the rotating shaft adjusting block and the adjusting mechanism in the spraying device provided by the invention;
fig. 5 is a schematic view showing the flowing direction of the cleaning agent and the direction of the force generated by the nozzle in the structure shown in fig. 2.
Description of the reference numerals
1: the base component 2: shower assembly
100: rotation shaft 110: diversion pipeline
120: the ball head portion 130: columnar part
140: connection port 10: driving shower
210: straight tube 211: spray head
212: bending the tube 213: wide-angle spray head
214: drive tube cap 20: balanced spray pipe
220: balance straight pipe 221: balance spray head
222: balance tube cap 230: adapter
310: shaft bushing 311: matching surface of rotating shaft
320: shaft adjusting block 321: adjusting groove
322: avoidance hole 330: end cap
332: flow guiding joint 331: flow guiding nozzle
340: the adjusting member 341: adjusting screw
342: adjusting the nut 350: base seat
410: draft tube 500: sealing ring
30: rotating shaft adjusting mechanism
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are given by way of illustration and explanation only, not limitation.
The existing semiconductor cleaning equipment generally adopts corrosive liquid such as acid liquor to spray and clean a quartz tube, a quartz boat and a process chamber of the semiconductor cleaning equipment, the process chamber needs to be kept closed, and a spraying device is generally driven by a motor to rotate. Therefore, the sealing port (such as a chamber door) of the process chamber is inevitably required to be additionally provided with a connecting device for supplying power to the motor and detecting the motion state and other functions, and the sealing performance and the ventilation and heat dissipation capacity of the motor are also required to be ensured, so that the complexity of the equipment structure is increased, the cost of the equipment is increased, and the risk of safety accidents of the equipment caused by corrosion failure of the motor, corrosion of corresponding structures such as a transmission chain or an electrode connecting wire and the like is also existed.
In order to solve the above-mentioned technical problems, as one aspect of the present invention, there is provided a shower apparatus in a semiconductor cleaning apparatus for performing a shower cleaning of a process chamber of the semiconductor cleaning apparatus, as shown in fig. 1 to 2, the shower apparatus including a rotary shaft 100, a susceptor assembly 1, and a shower assembly 2, wherein,
the rotating shaft 100 is arranged in the base assembly 1, the rotating shaft 100 can rotate around the axis of the rotating shaft 100 relative to the base assembly 1, and a flow guide pipeline is arranged in the rotating shaft 100;
the base assembly 1 is fixedly arranged at the top of a process chamber of the semiconductor cleaning equipment, is used for accommodating the rotating shaft 100 and is also used for guiding a cleaning agent into the flow guide pipeline 110;
the spray pipe assembly 2 is connected with the rotating shaft 100 and communicated with the guide pipeline 110; the shower assembly 2 includes at least one driving shower 10 for driving the shower assembly 2 and the rotary shaft 100 to rotate based on a reaction force generated when the cleaning agent is sprayed.
The type of the cleaning agent is not particularly limited in the embodiments of the present invention, for example, when the spraying device is used for spraying and cleaning a process chamber of a semiconductor cleaning apparatus, the cleaning agent may include acid solution, deionized water (DIW), and nitrogen (N) gas 2 ) And so on.
In the shower apparatus provided by the present invention, at least one driving shower 10 is connected to the rotary shaft 100, and the shower head 211 on the driving shower 10 can spray the cleaning agent in a direction different from the extending direction of the driving shower 10. The spray head 211 can apply a reverse acting force to the driving spray pipe 10 while realizing a spray cleaning function, thereby pushing the driving spray pipe 10 to move to a side opposite to a spray direction of the spray head 211, and further driving the rotating shaft 100 to automatically rotate.
That is, in the present invention, only the cleaning agent is injected into the flow guiding pipeline 110 of the rotating shaft 100 through the corresponding cleaning agent providing assembly, the automatic rotation of the rotating shaft 100 and the shower assembly 2 can be realized through the reverse acting force of the shower head 211, and the 360-degree dead-angle-free spray cleaning of the process chamber of the semiconductor cleaning apparatus is completed. The cleaning device has the advantages that the motor and the corresponding driving mechanism are removed, the structure of the spraying device is simplified, meanwhile, the potential safety hazard that the motor and the corresponding driving mechanism are corroded by the cleaning agent is eliminated, and the safety of the spraying device and the semiconductor cleaning equipment applying the spraying device is improved.
Moreover, in the present invention, the corresponding cleaning agent supply assembly directly supplies the cleaning agent to the driving shower pipe 10 through the guide pipeline 110 in the rotating shaft 100, and it is not necessary to provide a sealing member on the outer wall of the rotating shaft 100 to perform dynamic sealing on the fluid passage (only static sealing is performed on the base assembly 1), thereby reducing the maintenance cost for replacing the sealing member in the shower apparatus.
In order to increase the rotation speed of the rotary shaft 100 as much as possible, it is preferable that the spraying direction of the spray head 211 is located on a plane perpendicular to the axis of the rotary shaft 100, and the extending direction of the driving shower 10 is also located on a plane where the spraying direction of the spray head 211 is at a predetermined angle, for example, 90 ° to the extending direction of the driving shower 10, so that a large moment can be formed.
In order to improve the stability of the movement of the moving parts in the spraying device, it is preferable that the spraying pipe assembly 2 includes at least one pair of driving spraying pipes 10, as shown in fig. 2, two driving spraying pipes 10 in each pair of driving spraying pipes 10 are symmetrically disposed, and it is further preferable that the positions of the spraying heads 211 on the two driving spraying pipes 10 are opposite to each other and the spraying directions are opposite, so as to reduce the bending moment applied to the rotating shaft 100, improve the stability of the central axis of the rotating shaft 100 during the movement, further reduce the vibration amplitude of the driving spraying pipes 10, and improve the stability of the cleaning process.
For example, as shown in fig. 1, in order to reduce the maintenance cost of the spraying device, it is preferable that the shower assembly 2 further includes an adapter 230, the adapter 230 is connected to the rotating shaft 100, the driving shower 10 is connected to the adapter 230, and the driving shower 10 is communicated with the diversion pipeline 110 through the adapter 230.
In the embodiment of the present invention, the driving spray pipe 10 may be connected to the rotating shaft 100 through a thread (preferably, NPT thread) on the adapter 230, and when the driving spray pipe 10 is damaged, the driving spray pipe only needs to be detached from the adapter 230 and replaced with a new spray pipe, and the rotating shaft 100 may be used continuously, thereby reducing the operation difficulty of maintaining the spray device and the maintenance cost of the spray device.
In the embodiment of the present invention, how the plurality of adapters 230 communicate with the diversion pipeline 110 is not particularly limited, for example, as an implementation manner of simplifying the fluid path, as shown in fig. 1, a plurality of connection ports 140 are formed at the lower end of the rotating shaft 100, the plurality of connection ports 140 are all communicated with the diversion pipeline 110, and one end of the driving shower pipe 10 facing the rotating shaft 100 is connected to the corresponding connection ports 140 through the adapters 230, respectively.
The embodiment of the present invention does not specifically limit how the adapter 230 communicates the diversion pipeline 110 with the driving shower pipe 10, for example, as shown in fig. 1, one end of the adapter 230 is used for inserting the driving shower pipe 10, the other end of the adapter has an external thread, the connection port 140 on the rotating shaft 100 has an internal thread, and one end of the adapter 230 having the external thread is screwed into the corresponding connection port 140.
The structure of the driving spray pipe 10 is not particularly limited in the embodiment of the present invention, for example, as shown in fig. 2, the driving spray pipe 10 includes a straight pipe 210, a bent pipe 212, and a nozzle 211, one end of the straight pipe 210 is connected to the adapter, the bent pipe 212 is connected to the other end of the straight pipe 210, and the nozzle 211 is connected to the bent pipe 212;
an included angle exists between the orientations of the two ends of the bent pipe 212, so that an included angle also exists between the spraying direction of the spray head 211 and the extending direction of the straight pipe 210.
As shown in fig. 5, the spray head 211 sprays the cleaning agent at a speed V1, and applies a reverse force F1 to the driving shower pipe 10 through the bent pipe 212, thereby applying a corresponding torque to the lower end of the rotary shaft 100 and driving the rotary shaft 100 to rotate.
The embodiment of the present invention is not particularly limited as to how the nozzle 211 is connected to the bending pipe 212, for example, as shown in fig. 2, an end of the bending pipe 212 away from the rotating shaft 100 is sleeved with a driving pipe cap 214, and the nozzle 211 is disposed on the driving pipe cap 214. To improve the sealing of the structure, the driving cap 214 is preferably connected to the bending tube 212 by means of PVC socket welding.
The angle between the directions of the openings at the two ends of the bending tube 212 is not particularly limited in the embodiments of the present invention, for example, as shown in fig. 2, the angle between the directions of the openings at the two ends of the bending tube 212 may be 135 °.
As a preferred embodiment of the present invention, as shown in fig. 2, the driving spray pipe 10 further includes a wide-angle nozzle 213, the wide-angle nozzle 213 is disposed on the straight pipe 210, and the spraying direction of the wide-angle nozzle 213 and the spraying direction of the nozzle 211 both face the same side of the driving spray pipe 10. Wide angle showerhead 213 is capable of spraying cleaning agent into the tapered range of its orientation to improve the uniformity of cleaning of the process chamber. At the same time, it can assist in driving the rotation shaft 100 and the shower assembly 2 to rotate.
As shown in fig. 5, the wide-angle nozzle 213 sprays the cleaning agent at a speed V2 and applies a reverse force F2 to the drive shower 10, thereby applying a corresponding torque to the lower end of the rotary shaft 100 and driving the rotary shaft 100 to rotate.
Assuming that the distance between the nozzle 211 and the axis of the rotating shaft 100 is L1 and the distance between the wide-angle nozzle 213 and the axis of the rotating shaft 100 is L2, when the spraying device includes a pair of driving spray pipes 10, the moment T applied by the nozzle 211 and the driving spray pipes 10 together to the rotating shaft can be calculated by the following calculation formula:
Figure BDA0002651353260000081
the resistance of the base assembly 1 to the rotation axis 100 is F f The radius of the rotating shaft 100 is R, and the resisting torque T applied to the rotating shaft 100 can be obtained f Comprises the following steps:
T f ＝F f R
since the distances L1, L2 are much greater than the radius R of the rotating shaft 100, the moment T of the rotating shaft 100 from the reaction force of the showerhead is much greater than the resisting moment T f The rotation shaft 100 and the driving shower 10 may be automatically rotated.
In the present invention, in addition to the spray head for spraying the cleaning agent along the horizontal plane, the cleaning agent can be sprayed in other directions through other spray heads, for example, as a preferred embodiment of the present invention, as shown in fig. 1 and 2, the shower assembly 2 further includes at least one pair of balance spray pipes 20, and the balance spray pipes 20 are connected to the adapter 230 provided on the rotating shaft 100 and symmetrically provided. The balance spray pipe 20 comprises a balance straight pipe 220 and a balance spray head 221, the balance straight pipe 220 is connected with the adapter 230, the balance spray head 221 is connected with the balance straight pipe 220, and the spray direction of the balance spray head 221 faces to the process area in the process chamber (for example, downward spray in the vertical direction).
In the embodiment of the invention, the balance spray head 221 can spray cleaning agent downwards to longitudinally wash the side wall of the quartz tube, so that the washing efficiency of the quartz tube is improved. As shown in fig. 5, the cleaning agent flows to the two balance nozzles 221 at a speed V3 and is sprayed out at the same speed, so as to generate two longitudinal reaction forces with the same magnitude, and apply torques with the same magnitude and opposite directions to the rotating shaft 100, thereby improving the stability of the axis of the rotating shaft 100, reducing the vibration range of the driving shower pipe 10 and the balance shower pipe 20, and improving the stability of the cleaning process.
The embodiment of the present invention is not limited to how the balance spray nozzle 221 is connected to the balance spray pipe 20, for example, as shown in fig. 2, one end of the balance spray pipe 20 away from the rotating shaft 100 is sleeved with a balance pipe cap 222, and the balance spray nozzle 221 is disposed on the balance pipe cap 222. To improve the sealing of the structure, the balance pipe cap 222 is preferably connected to the balance shower pipe 20 by means of PVC socket welding.
In order to further increase the spray cleaning surface of the nozzle and improve the cleaning efficiency, the balance nozzle 221 may be a wide-angle nozzle.
The embodiment of the present invention is not particularly limited to how the rotating shaft 100 is disposed in the base assembly 1, for example, as shown in fig. 1 to 4, the base assembly 1 includes a base body 350, a shaft bushing 310, a shaft adjusting mechanism 30, and an end cover 330, wherein,
the base body 350 is fixedly disposed at the top of the process chamber, the spindle bushing 310 is disposed in the base body 350, the rotation shaft 100 is rotatably disposed in the spindle bushing 310, and extends out from one end of the spindle bushing 310 to be connected with the shower assembly 2; the end cover 330 seals the opening at the other end of the rotating shaft bushing 310, a flow guide nozzle 331 is arranged on one side of the end cover 330 facing the rotating shaft 100, the flow guide nozzle 331 extends into the flow guide pipeline 110, a flow guide joint 332 is arranged on one side of the end cover 330 far away from the rotating shaft 100, and the flow guide joint 332 is communicated with the flow guide nozzle 331; the rotation shaft adjusting mechanism 30 is provided in the rotation shaft bushing 310 to limit the position of the rotation shaft 100 in the rotation shaft bushing 310.
The embodiment of the present invention is not limited to how to introduce the cleaning agent into the guiding pipe 110 in the rotating shaft 100, for example, as shown in fig. 5, a guiding pipe 410 of the cleaning agent may be inserted into the guiding joint 332 of the end cap 330 to provide the cleaning agent to the guiding pipe 110 through the guiding joint 332.
As a preferred embodiment of the present invention, as shown in fig. 5, the rotation shaft 100 includes a ball head portion 120 and a column portion 130, the ball head portion 120 is disposed in a shaft bushing 310, and the column portion 130 is protruded from one end of the shaft bushing 310 and coupled to the shower assembly 2.
The rotating shaft adjusting mechanism 30 comprises a rotating shaft adjusting block 320 and an adjusting piece 340, wherein the rotating shaft adjusting block 320 is positioned between the ball head part 120 and the end cover 330, an adjusting groove 321 is formed on the rotating shaft adjusting block 320, the shape of the adjusting groove 321 is matched with the shape of the ball head part 120, a rotating shaft matching surface 311 is formed on the inner wall of the rotating shaft bushing 310, the shape of the rotating shaft matching surface 311 is matched with the shape of the ball head part 120, and the adjusting piece 340 is used for adjusting the distance between the rotating shaft adjusting block 320 and the end cover 330.
In the embodiment of the present invention, the rotating shaft 100 has the ball head portion 120, and the ball head portion 120 is clamped between the adjusting groove 321 of the rotating shaft adjusting block 320 and the rotating shaft matching surface 311 of the rotating shaft bushing 310, and the height of the rotating shaft adjusting block 320 is adjusted by the adjusting member 340 to position the rotating shaft 100. Compared with the scheme that the rotating shaft is fixed through structures such as a bearing and the like in the prior art, the structure does not need lubrication of a lubricant, so that sealing elements for preventing the lubricant from leaking are reduced, the structure of the device is simplified, and meanwhile, the maintenance cost for replacing the movable sealing elements is reduced.
To reduce the resisting moment T to which the rotating shaft 100 is subjected f To increase the rotation speed of the rotating shaft 100, it is preferable that, as shown in fig. 5, a plurality of annular grooves are formed on the ball head portion 120 around the axis of the rotating shaft 100 to reduce the contact area between the ball head portion 120 and the adjustment groove 321 and the rotating shaft engagement surface 311.
The embodiment of the present invention does not specifically limit how the end cap 330 is sealingly coupled to the upper opening of the rotary shaft bushing 310, and for example, as shown in fig. 5, the shower apparatus further includes a seal ring 500, a seal surface of the rotary shaft bushing 310 for contacting the end cap 330 is formed with a seal ring groove around the upper opening of the rotary shaft bushing 310, and the seal ring 500 is disposed in the seal ring groove.
The embodiment of the present invention does not specifically limit how the end cap 330 is fixedly connected to the upper opening of the spindle bushing 310, for example, the end cap 330 may be fixedly connected to the upper opening of the spindle bushing 310 by a fastener (e.g., a screw, etc.).
In the embodiment of the invention, static sealing is only needed through the sealing ring 500, so that the maintenance cost of the device is greatly reduced compared with a dynamic sealing scheme in the prior art. The embodiment of the present invention does not specifically limit the type of the sealing ring 500, and for example, the sealing ring 500 may be an O-ring.
The rotation axis adjusting block 320 is formed with an avoiding hole 322 penetrating the rotation axis adjusting block 320 along the height direction, the avoiding hole 322 matches with the position of the guide pipeline 110 on the rotation axis 100, the guide nozzle 331 avoids the hole 322 and is inserted into the guide pipeline 110 to provide the cleaning agent to the guide pipeline 110.
The structure of the adjusting member 340 in the embodiment of the present invention is not particularly limited, for example, as shown in fig. 1, 3, and 4, the adjusting member 340 includes an adjusting screw 341 and an adjusting nut 342, an adjusting hole is formed on a surface of the rotating shaft adjusting block 320 facing the end cover 330, the adjusting nut 342 is sleeved on the adjusting screw 341, and the adjusting screw 341 is screwed into the adjusting hole.
In the embodiment of the present invention, the top of the adjusting screw 341 is preferably hemispherical, and the adjusting screw 341 is used to abut against the end cap 330, so that the spindle adjusting block 320 presses the ball head 120 of the rotating spindle 100. When adjusting the pressing force of the shaft adjusting block 320 on the ball head 120, the adjusting screw 341 is first adjusted to a proper length to be screwed into the adjusting hole, the adjusting nut 342 is then screwed down to fix the position of the adjusting screw 341, and finally the end cap 330 is covered on the adjusting screw 341 and the end cap 330 is connected with the upper opening of the shaft bushing 310.
As a second aspect of the present invention, there is also provided a semiconductor cleaning apparatus comprising a process chamber and a spray device disposed at the top of the process chamber for spraying a cleaning agent to a process area in the process chamber, wherein the spray device is the spray device provided in the previous embodiment.
In the semiconductor cleaning equipment provided by the invention, cleaning agent is injected into the driving spray pipe 10 only through the corresponding cleaning agent supply assembly, so that the automatic rotation of the rotating shaft 100 and the spray pipe assembly 2 can be realized through the reverse acting force of the spray head, and the 360-degree dead-angle-free spray cleaning of the process chamber of the semiconductor cleaning equipment is completed. The cleaning agent has the advantages that the motor and the corresponding driving mechanism are removed, the structure of the equipment is simplified, meanwhile, the potential safety hazard that the motor and the corresponding driving mechanism are corroded by the cleaning agent is eliminated, and the safety of the semiconductor cleaning equipment is improved.
Moreover, in the present invention, the corresponding cleaning agent supply assembly directly supplies the cleaning agent to the driving shower pipe 10 through the guide pipeline 110 in the rotating shaft 100, and it is not necessary to provide a sealing member on the outer wall of the rotating shaft 100 to perform dynamic sealing on the fluid passage (only static sealing is performed on the base assembly 1), thereby reducing the maintenance cost for replacing the sealing member in the shower apparatus.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (9)

1. A shower device in a semiconductor cleaning apparatus, comprising a rotary shaft, a susceptor assembly and a shower assembly, wherein,
the rotating shaft is arranged in the base assembly and can rotate around the axis of the rotating shaft relative to the base assembly, and a flow guide pipeline is arranged in the rotating shaft;
the base assembly is fixedly arranged at the top of the semiconductor cleaning equipment process chamber, is used for accommodating the rotating shaft and is also used for guiding a cleaning agent into the flow guide pipeline;
the spray pipe assembly is connected with the rotating shaft and communicated with the flow guide pipeline; the spray pipe assembly comprises at least one driving spray pipe and is used for driving the spray pipe assembly and the rotating shaft to rotate based on the generated reaction force when the cleaning agent is sprayed;
the base component comprises a base body, a rotating shaft bushing, a rotating shaft adjusting mechanism and an end cover, wherein,
the pedestal body is fixedly arranged at the top of the process chamber, the rotating shaft bushing is arranged in the pedestal body, and the rotating shaft is rotatably arranged in the rotating shaft bushing and extends out of one end of the rotating shaft bushing to be connected with the spray pipe assembly; the end cover seals an opening at the other end of the rotating shaft bushing, one side of the end cover facing the rotating shaft is provided with a flow guide nozzle, the flow guide nozzle extends into the flow guide pipeline, one side of the end cover far away from the rotating shaft is provided with a flow guide joint, and the flow guide joint is communicated with the flow guide nozzle; the rotating shaft adjusting mechanism is arranged in the rotating shaft bushing and used for limiting the position of the rotating shaft in the rotating shaft bushing.
2. The spray device of claim 1, wherein said spray tube assembly further comprises an adapter, said adapter being connected to said rotatable shaft, said drive spray tube being connected to said adapter, said drive spray tube being in communication with said flow directing line through said adapter.
3. The spray device of claim 2, wherein the drive spray tube comprises a straight tube, a bent tube, and a spray head, wherein the straight tube is connected to the adapter, the bent tube is connected to the straight tube, and the spray head is connected to the bent tube;
an included angle exists between the orientations of the two ends of the bent pipe, so that the included angle also exists between the spraying direction of the spray head and the extending direction of the straight pipe.
4. The spray device of claim 3, wherein the drive spray pipe further comprises a wide-angle nozzle, the wide-angle nozzle is arranged on the straight pipe, and the spray direction of the wide-angle nozzle and the spray direction of the nozzle of the drive spray pipe both face to the same side of the drive spray pipe.
5. The spray device of claim 1 or 2 wherein said spray tube assembly includes at least one pair of said drive spray tubes, each pair of said drive spray tubes being symmetrically disposed.
6. The spray device of claim 2 wherein said spray tube assembly further comprises at least one pair of balanced spray tubes connected to said adapter and symmetrically disposed;
the balance spray pipe comprises a balance straight pipe and a balance spray head, the balance straight pipe is connected with the adapter, the balance spray head is connected with the balance straight pipe, and the spray direction of the balance spray head faces to a process area in the process chamber.
7. The spray device of claim 1, wherein said rotatable shaft includes a ball portion disposed in said spindle bushing, a post portion extending from one end of said spindle bushing for connection to said spray tube assembly;
the pivot guiding mechanism includes pivot adjusting block, regulating part, the pivot adjusting block is located the bulb portion with between the end cover, be formed with the adjustment groove on the pivot adjusting block, the shape in adjustment groove with the shape of bulb portion matches, be formed with the pivot fitting surface on the inner wall of pivot bush, the shape of pivot fitting surface with the shape of bulb portion matches, the regulating part is used for adjusting the pivot adjusting block with distance between the end cover.
8. The spraying device of claim 7, wherein the adjusting member comprises an adjusting screw and an adjusting nut, an adjusting hole is formed on a surface of the rotating shaft adjusting block facing the end cover, the adjusting nut is sleeved on the adjusting screw, and the adjusting screw is screwed into the adjusting hole.
9. Semiconductor cleaning equipment, comprising a process chamber and a spraying device arranged at the top of the process chamber, wherein the spraying device is used for spraying cleaning agent to a process area in the process chamber, and is characterized in that the spraying device is the spraying device in any one of claims 1 to 8.
CN202010871785.5A 2020-08-26 2020-08-26 Spray set and semiconductor cleaning equipment among semiconductor cleaning equipment Active CN112077067B (en)

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CN112808720B (en) * 2020-12-24 2023-04-14 北京北方华创微电子装备有限公司 Furnace tube cleaning device and furnace tube cleaning equipment

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CN210546830U (en) * 2019-09-24 2020-05-19 江苏芯梦半导体设备有限公司 Full-automatic vertical quartz tube cleaning machine
CN210753968U (en) * 2019-07-16 2020-06-16 上海必为机电有限公司 Rotary liquid outlet spray brush

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US2574874A (en) * 1950-03-17 1951-11-13 Scovill Manufacturing Co Calibrated two-arm sprinkler
US2933093A (en) * 1954-08-18 1960-04-19 British Miller Hydro Company L Apparatus for cleansing liquid containing tanks or vessels
CN1840314A (en) * 2005-04-02 2006-10-04 Ls电线有限公司 Mold adjustment device of injection molding machine provided with spherical bearings
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