TWI735874B - Gas filling system - Google Patents

Gas filling system Download PDF

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Publication number
TWI735874B
TWI735874B TW108116115A TW108116115A TWI735874B TW I735874 B TWI735874 B TW I735874B TW 108116115 A TW108116115 A TW 108116115A TW 108116115 A TW108116115 A TW 108116115A TW I735874 B TWI735874 B TW I735874B
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Taiwan
Prior art keywords
positioning portion
inflatable
flat
semiconductor container
gas
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TW108116115A
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Chinese (zh)
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TW202042326A (en
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呂保儀
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呂保儀
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Priority to TW108116115A priority Critical patent/TWI735874B/en
Priority to CN201911116127.9A priority patent/CN111916379A/en
Publication of TW202042326A publication Critical patent/TW202042326A/en
Application granted granted Critical
Publication of TWI735874B publication Critical patent/TWI735874B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

Abstract

This invention discloses a gas filling system, comprising a plate, at least one purge, at least one gas channel and at least two pins. The plate comprises a loading area which is used to load a semiconductor container and the semiconductor container is placed on the loading undersurface. On the other hand, every purge is constructed by a gas passing portion and a top-plate portion, and the top-plate portion is connected with the gas passing portion. The at least one gas channel is connected to the gas passing portion, and the at least two pins is configured on the loading area. The top-plate portion engages with the semiconductor container, forming a first sealing surface.

Description

充氣系統 Inflation system

本發明提供了一種充氣系統，尤指一種具有平頂定位部並達到防止半導體容器因震動偏移或尺寸些微不合進而產生漏氣情況的充氣系統。 The present invention provides an inflatable system, in particular an inflatable system with a flat top positioning portion and prevents the semiconductor container from being deviated due to vibration or slightly incompatible in size, thereby causing air leakage.

近代半導體科技發展迅速，其中微影技術扮演重要的角色。只要是在半導體基板或元件上需要形成特定的圖樣(Pattern)，皆需仰賴微影技術的應用。而光罩的應用就是微影技術的精髓所在。 Modern semiconductor technology has developed rapidly, among which lithography technology plays an important role. As long as a specific pattern (Pattern) needs to be formed on a semiconductor substrate or device, it depends on the application of lithography technology. The application of photomask is the essence of lithography technology.

一般來說，光罩可利用曝光原理，使光源和帶有相應圖樣的陰影投影至半導體元件上，藉以蝕刻出需要圖樣的半導體層。也因如此，任何附著於光罩上的微小粒子，都有可能造成半導體元件圖樣的品質劣化。因此用於半導體製程中的光罩對於清潔程度之要求十分嚴謹。在一般的半導體製程中，都提供無塵環境以避免空氣中的微小粒子污染光罩。 Generally speaking, the photomask can use the principle of exposure to project the light source and the shadow with the corresponding pattern onto the semiconductor element, so as to etch the semiconductor layer that needs the pattern. Because of this, any tiny particles attached to the photomask may cause deterioration of the quality of the semiconductor device pattern. Therefore, the photomask used in the semiconductor manufacturing process has strict requirements for cleanliness. In the general semiconductor manufacturing process, a dust-free environment is provided to prevent the tiny particles in the air from polluting the photomask.

除此之外，用以儲存或是傳送光罩的光罩盒，對於潔淨度的要求，更屬於重中之重的腳色。因此，以往的技術乃將光罩盒外接一個充氣設備，使氣體藉由充氣設備導入光罩盒，達到避免光罩在光罩盒中遭受微小粒子附著，產生污染。然而，現有的充氣設備為了防止外部的氣體藉其進入到光罩盒內，多半採用逆止閥的原理，讓光罩盒僅有在與充氣設備嚙合時才給予氣體流動可可能性。但是，目前現有的充氣設備仍有許多問題待解決。 In addition, the reticle box used to store or transmit the reticle has the most important role in terms of cleanliness. Therefore, in the prior art, an inflatable device is connected to the mask box, so that the gas is introduced into the mask box through the inflatable device, so as to prevent the photomask from being attached to the mask box by tiny particles and causing pollution. However, in order to prevent external gas from entering the photomask box through the existing inflator devices, most of them use the principle of a check valve, so that the photomask box only provides the possibility of gas flow when it is engaged with the inflator device. However, the existing inflatable equipment still has many problems to be solved.

由於現有的光罩盒種類和尺寸繁多，因此各種充氣設備並無法有效的對不同廠商或尺寸的光罩盒進行有效的自動化充氣作業。此外，光罩盒和充氣設備之間的密合程度，以及充氣設備上氣閥本身的氣密程度也有相當大的改進空間。傳統的充氣設備時常因為撞擊或是其所承載的光罩盒尺寸不符等原因，進而造成氣密不佳，外部氣體流入，進而使微小粒子汙染承載於光罩盒內的光罩。 Due to the various types and sizes of the existing photomask boxes, various inflating equipment cannot effectively perform effective automatic inflation operations on photomask boxes of different manufacturers or sizes. In addition, there is considerable room for improvement in the tightness between the mask box and the inflatable device, and the air tightness of the air valve on the inflatable device. The traditional inflatable equipment is often due to impacts or the size of the mask box carried by the inflatable device, resulting in poor airtightness and inflow of external air, which in turn causes fine particles to contaminate the mask carried in the mask box.

為解決先前技術中所提及的問題，本發明提供了一種充氣系統，包含一盤面、至少一充氣元件、至少一氣體通道以及至少二定位銷。 In order to solve the problems mentioned in the prior art, the present invention provides an inflation system, which includes a disk surface, at least one inflation element, at least one gas channel, and at least two positioning pins.

其中，該盤面包含一容置區域，該容置區域係容置一半導體容器，該半導體容器係放置於一容置底面。每個該充氣元件包含一氣體進出部及一平頂定位部，該平頂定位部與該氣體進出部連接。 Wherein, the disc surface includes an accommodating area, and the accommodating area accommodates a semiconductor container, and the semiconductor container is placed on a accommodating bottom surface. Each of the inflatable elements includes a gas inlet and outlet part and a flat top positioning part, and the flat top positioning part is connected with the gas inlet and outlet part.

該至少一氣體通道與該氣體進出部連接，至少二定位銷則設於該容置區域中。其中，該平頂定位部與該半導體容器形成一第一密封面。 The at least one gas channel is connected with the gas inlet and outlet, and at least two positioning pins are arranged in the accommodating area. Wherein, the flat top positioning portion and the semiconductor container form a first sealing surface.

以上對本發明的簡述，目的在於對本發明之數種面向和技術特徵作一基本說明。發明簡述並非對本發明的詳細表述，因此其目的不在特別列舉本發明的關鍵性或重要元件，也不是用來界定本發明的範圍，僅為以簡明的方式呈現本發明的數種概念而已。 The above brief description of the present invention aims to provide a basic description of several aspects and technical features of the present invention. The brief description of the invention is not a detailed description of the invention. Therefore, its purpose is not to specifically enumerate the key or important elements of the invention, nor to define the scope of the invention. It merely presents several concepts of the invention in a concise manner.

10:充氣系統 10: Inflatable system

100:盤面 100: Disk

101:容置區域 101: containment area

102a:充氣元件 102a: Inflatable element

102b:充氣元件 102b: Inflatable element

1021:平頂定位部 1021: Flat top positioning part

10211:環接氣密部 10211: Ring connection airtight part

1022a:第一密封面 1022a: The first sealing surface

1022b:第二密封面 1022b: The second sealing surface

1023:氣體進出部 1023: Gas inlet and outlet

1024:彈性元件 1024: elastic element

103:氣體通道 103: gas channel

1031:寬通道 1031: wide channel

1032:窄通道 1032: narrow channel

104:定位銷 104: positioning pin

105:第一定位部 105: The first positioning part

106:第二定位部 106: The second positioning part

107:擴充連接部 107: Expansion connection

108:容置底面 108: accommodating bottom surface

200:光罩盒 200: mask box

A:箭頭 A: Arrow

圖1係本發明實施例充氣系統的結構示意圖。 Figure 1 is a schematic structural diagram of an inflatable system according to an embodiment of the present invention.

圖2係本發明實施例充氣系統的剖面結構示意圖。 Fig. 2 is a schematic cross-sectional structure diagram of an inflatable system according to an embodiment of the present invention.

圖3係本發明實施例充氣系統承載半導體容器時的結構示意圖。 FIG. 3 is a schematic diagram of the structure of the inflatable system carrying the semiconductor container according to the embodiment of the present invention.

圖4係本發明實施例充氣系統充氣元件之結構示意圖。 Fig. 4 is a schematic diagram of the structure of the inflatable element of the inflatable system according to the embodiment of the present invention.

為能瞭解本發明的技術特徵及實用功效，並可依照說明書的內容來實施，茲進一步以如圖式所示的較佳實施例，詳細說明如後：首先請同時參照圖1、2及4，圖1係本發明實施例充氣系統的結構示意圖；圖2係本發明實施例充氣系統的剖面結構示意圖；圖4係本發明實施例充氣系統充氣元件之結構示意圖。 In order to understand the technical features and practical effects of the present invention, and implement it in accordance with the content of the specification, the preferred embodiment shown in the figure is further used, and the detailed description is as follows: First, please refer to Figures 1, 2 and 4 at the same time. , Figure 1 is a schematic structural diagram of an inflatable system according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional structural diagram of an inflatable system according to an embodiment of the present invention;

如圖1所示，本實施例提供了一種充氣系統10，包含盤面100少一充氣元件(102a、102b)、至少一氣體通道103以及至少二定位銷104。其中，盤面100包含容置區域101，而容置區域101係容置半導體容器200(可先參照圖3)。 As shown in FIG. 1, this embodiment provides an inflation system 10, which includes one inflation element (102 a, 102 b) less than the disk surface 100, at least one gas channel 103, and at least two positioning pins 104. Wherein, the disk surface 100 includes a accommodating area 101, and the accommodating area 101 accommodates the semiconductor container 200 (refer to FIG. 3 first).

本實施例中所稱之半導體容器200係以光罩盒為實施例，所述光罩盒可以是乘載150毫米(mm)或200毫米(mm)尺寸光罩的光罩標準機械介面傳送盒(Reticle SMIF Pod,RSP)。當然，在其他可能的實施例中，半導體容器200也可以是前開式晶圓盒(Front Opening Unified Pod,FOUP)等，本發明並不加以限制。 The semiconductor container 200 referred to in this embodiment uses a photomask box as an example. The photomask box may be a photomask standard mechanical interface transport box carrying a 150mm (mm) or 200mm (mm) size photomask. (Reticle SMIF Pod, RSP). Of course, in other possible embodiments, the semiconductor container 200 may also be a Front Opening Unified Pod (FOUP), etc., and the present invention is not limited.

接著如圖4所示，在本實施例中，每個充氣元件(102a、102b)包含氣體進出部1023及平頂定位部1021，該平頂定位部1021與氣體進出部1023連接；而平頂定位部1021內更設有彈性元件1024，據以控制充氣元件(102a、102b)的開閉自動復位。 Next, as shown in Figure 4, in this embodiment, each inflatable element (102a, 102b) includes a gas inlet and outlet portion 1023 and a flat top positioning portion 1021, the flat top positioning portion 1021 is connected to the gas inlet and outlet portion 1023; and the flat top The positioning portion 1021 is further provided with an elastic element 1024 to control the opening and closing of the inflatable elements (102a, 102b) to automatically reset.

因此，如圖1所示，在本實施例中，透過平頂定位部1021是否向下壓抵的動作，即可辨識充氣元件(102a、102b)是否開始通氣。充氣元件102a 的狀態下，平頂定位部1021因彈性元件1024的復位而彈起，氣體無法流通；反之充氣元件102b的狀態下，平頂定位部1021可因承載半導體容器200等原因下壓，致使氣體可進出。因此，本實施例之充氣元件(102a、102b)係可調節氣體進出之逆止閥。當然，在本發明其他可能的實施例中，充氣元件(102a、102b)無論是否具有機械作動的機制，僅要其具備逆止閥的功效，亦應包含在本發明所稱的充氣元件(102a、102b)範圍中，本發明並不加以限制。 Therefore, as shown in FIG. 1, in this embodiment, it can be recognized whether the inflatable element (102a, 102b) starts to ventilate through the action of whether the flat-top positioning portion 1021 is pressed downward. Inflatable element 102a In the state, the flat-top positioning portion 1021 bounces up due to the reset of the elastic element 1024, and gas cannot flow; on the contrary, in the state of the inflatable element 102b, the flat-top positioning portion 1021 can be pressed down due to reasons such as carrying the semiconductor container 200, so that the gas can be In and out. Therefore, the inflatable element (102a, 102b) of this embodiment is a check valve that can adjust the gas in and out. Of course, in other possible embodiments of the present invention, whether the inflatable element (102a, 102b) has a mechanical actuation mechanism or not, as long as it has the function of a check valve, it should also be included in the inflatable element (102a) in the present invention. Within the scope of 102b), the present invention is not limited.

至於該至少一氣體通道103與氣體進出部1023連接。如圖2所示，本實施例中的氣體通道103係埋設於盤面100中。在本實施例的實際應用面上，當氣體通道103埋設於盤面100中時，可達到節省盤面100空間的功效。其原因在於，傳統的充氣設備多半將氣體入口設置於盤面100的下方，如此一來會造成盤面100的厚度大幅增加；然本實施例之盤面100將氣體通道103埋設於盤面100中，可大幅減少盤面100的厚度和佔據的垂直空間，達到節省空間的功效。 As for the at least one gas channel 103 is connected to the gas inlet and outlet 1023. As shown in FIG. 2, the gas channel 103 in this embodiment is buried in the disk surface 100. On the practical application surface of this embodiment, when the gas channel 103 is buried in the disk surface 100, the effect of saving the space of the disk surface 100 can be achieved. The reason is that most of the traditional inflator devices have the gas inlet provided below the disk surface 100, which will greatly increase the thickness of the disk surface 100; however, the disk surface 100 of this embodiment embeds the gas channel 103 in the disk surface 100, which can greatly increase the thickness of the disk surface 100. The thickness of the disk surface 100 and the vertical space occupied are reduced to achieve the space saving effect.

同時參照圖2及圖4後，以圖2中的箭頭A方向觀測剖面，即可看到圖4中的剖面視圖顯示氣體通道103與氣體進出部1023的側邊連通。在圖2的實施例中，氣體通道103係用以將氣體充入半導體容器200中。可參照圖3，圖3係本發明實施例充氣系統承載半導體容器時的結構示意圖。 After referring to FIGS. 2 and 4 at the same time, observing the cross section in the direction of arrow A in FIG. 2, it can be seen that the cross-sectional view in FIG. In the embodiment of FIG. 2, the gas channel 103 is used to fill the semiconductor container 200 with gas. Refer to FIG. 3, which is a schematic diagram of the structure of the inflatable system carrying the semiconductor container according to the embodiment of the present invention.

如圖2及圖3所示，氣體通道103由寬通道1031和窄通道1032兩部份構成。透過寬通道1031變換至窄通道1032的平面環接結構，可進一步確保氣體輸入時，管線與氣體通道間的氣密性，進一步達到讓潔淨氣體不會被外部空氣汙染的功效。 As shown in FIGS. 2 and 3, the gas channel 103 is composed of a wide channel 1031 and a narrow channel 1032. The planar ring connection structure transformed from the wide channel 1031 to the narrow channel 1032 can further ensure the airtightness between the pipeline and the gas channel when the gas is input, and further achieve the effect of preventing the clean gas from being polluted by the outside air.

至於至少二定位銷104則設於容置區域101中。定位銷104的作用係與半導體容器200嵌合，防止半導體容器200產生水平位移，影響到充氣的品質。 本實施例中之定位銷104數量為三個，彼此間設置於容置區域101中(容置底面108上)的位置呈現等腰三角形，可均勻的定位半導體容器200至正確的充氣位置。有關半導體容器200如何承載於正確的充氣位置，如圖1所示本實施例之容置區域101周緣更包含第一定位部105以及第二定位部106，且該第一定位部105與第二定位部106連接。 At least two positioning pins 104 are provided in the accommodating area 101. The function of the positioning pin 104 is to fit the semiconductor container 200 to prevent horizontal displacement of the semiconductor container 200 and affect the quality of inflation. In this embodiment, the number of positioning pins 104 is three, and the positions disposed in the accommodating area 101 (on the accommodating bottom surface 108) present an isosceles triangle, which can uniformly position the semiconductor container 200 to the correct inflation position. Regarding how the semiconductor container 200 is carried in the correct inflatable position, as shown in FIG. The positioning unit 106 is connected.

在本實施例中，第一定位部105為斜率較低的斜面，初步引導半導體容器200的位置；而第二定位部106係與第一定位部105連續連接的斜面，其斜率大於第一定位部105，可更進一步使半導體容器200導正並滑入容置區域101中(容置底面108上)，與定位銷104進行嵌合。而盤面100上更設有至少一擴充連接部107，提供本充氣系統10可以跟其他充氣系統10進行模組式拼接安裝，得以擴大或變換整個充氣系統的應用型態。 In this embodiment, the first positioning portion 105 is a slope with a lower slope, which preliminarily guides the position of the semiconductor container 200; and the second positioning portion 106 is a slope continuously connected with the first positioning portion 105, and its slope is greater than that of the first positioning portion. The portion 105 can further guide the semiconductor container 200 and slide it into the accommodating area 101 (on the accommodating bottom surface 108), and engage with the positioning pin 104. At least one expansion connecting portion 107 is further provided on the disk surface 100, which provides that the inflatable system 10 can be modularly spliced and installed with other inflatable systems 10, so as to expand or change the application form of the entire inflatable system.

接著，半導體容器200成功定位完成後，如圖3及圖4所示，本實施例之平頂定位部1021會與半導體容器200形成第一密封面1022a。所述第一密封面1022a除了構成氣密以避免外部空氣影響充氣之潔淨效果外，更可形成一個耐磨可平移的平面。當半導體容器200因尺寸稍微不合或是受到晃動等意外出現時，可以提供一定的面平移氣密效果。相較於傳統的線接觸結構，氣密保持性更加優秀。 Then, after the positioning of the semiconductor container 200 is successfully completed, as shown in FIGS. 3 and 4, the flat-top positioning portion 1021 of this embodiment will form a first sealing surface 1022 a with the semiconductor container 200. The first sealing surface 1022a is not only airtight to prevent external air from affecting the clean effect of inflation, but also can form a wear-resistant and translatable plane. When the semiconductor container 200 unexpectedly appears due to a slight mismatch or shaking, it can provide a certain surface translation airtight effect. Compared with the traditional line contact structure, the air tightness retention is better.

除此之外，如圖4所示，本實施例平頂定位部1021的側緣更包含環接氣密部10211。透過環接氣密部10211的設置，環接氣密部10211與容置底面108將會在充氣作業進行時形成第二密封面1022b。此外，在本發明可能的實施例中，平頂定位部1021的材質為彈性材料，更進一步來說可選自矽膠或含氟彈性體。透過彈性材料的應用，可讓本發明實施例的氣密效果更佳。 In addition, as shown in FIG. 4, the side edge of the flat-top positioning portion 1021 of this embodiment further includes a ring-connected airtight portion 10211. Through the arrangement of the ring airtight portion 10211, the ring airtight portion 10211 and the accommodating bottom surface 108 will form a second sealing surface 1022b during the inflation operation. In addition, in a possible embodiment of the present invention, the material of the flat-top positioning portion 1021 is an elastic material, and furthermore, it can be selected from silicone or fluoroelastomer. Through the application of elastic materials, the airtight effect of the embodiments of the present invention can be better.

綜上所述，本實施例所提供之充氣系統10可以提供半導體容器200更佳且容錯率更高的氣密充氣效果。本實施例以平頂定位部1021和環接氣密部10211依序形成的第一密封面1022a和第二密封面1022b，達到雙層安全的氣密防護效果，進一步避免本實施例對半導體容器200進行潔淨氣體充氣時，產生污染之問題。 In summary, the inflation system 10 provided in this embodiment can provide the semiconductor container 200 with an airtight inflation effect with better and higher fault tolerance. In this embodiment, the first sealing surface 1022a and the second sealing surface 1022b formed by the flat-top positioning portion 1021 and the ring-connected airtight portion 10211 in sequence can achieve the double-layer safety airtight protection effect, and further avoid the impact of this embodiment on the semiconductor container When the 200 is inflated with clean gas, it will cause pollution problems.

惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即依本發明申請專利範圍及說明內容所作之簡單變化與修飾，皆仍屬本發明涵蓋之範圍內。 However, the above are only the preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple changes and modifications made in accordance with the scope of the patent application and the description of the present invention still belong to the present invention. Covered in the scope.

10:充氣系統 10: Inflatable system

100:盤面 100: Disk

101:容置區域 101: containment area

102a:充氣元件 102a: Inflatable element

102b:充氣元件 102b: Inflatable element

103:氣體通道 103: gas channel

104:定位銷 104: positioning pin

105:第一定位部 105: The first positioning part

106:第二定位部 106: The second positioning part

107:擴充連接部 107: Expansion connection

Claims (9)

一種充氣系統，包含：一盤面，包含一容置區域，該容置區域係容置一半導體容器；該半導體容器係放置於一容置底面上；至少一充氣元件，設於該容置區域中，每個該充氣元件包含：一氣體進出部；一平頂定位部，與該氣體進出部連接；至少一氣體通道，與該氣體進出部連接；以及至少二定位銷，設於該容置區域中；其中，該平頂定位部與該半導體容器形成一第一密封面，其中該平頂定位部的側緣更包含一環接氣密部，該環接氣密部與該容置底面形成一第二密封面；以該平頂定位部和該環接氣密部依序形成的該第一密封面和該第二密封面共同組成兩互相平行之結構；其中，該容置區域的周緣更包含一第一定位部以及一第二定位部，該第一定位部與該第二定位部連接。 An inflatable system, comprising: a disk surface, including an accommodating area, the accommodating area accommodating a semiconductor container; the semiconductor container is placed on a accommodating bottom surface; at least one inflatable element is arranged in the accommodating area , Each of the inflatable elements includes: a gas inlet and outlet; a flat-top positioning part connected with the gas inlet and outlet; at least one gas channel connected with the gas inlet and outlet; and at least two positioning pins arranged in the accommodating area Wherein, the flat-top positioning portion and the semiconductor container form a first sealing surface, wherein the side edge of the flat-top positioning portion further includes a ring-connected airtight portion, the ring-connected airtight portion and the accommodating bottom surface form a first Two sealing surfaces; the first sealing surface and the second sealing surface formed in sequence by the flat-top positioning portion and the ring-connected airtight portion together form two parallel structures; wherein, the periphery of the accommodating area further includes A first positioning portion and a second positioning portion, the first positioning portion is connected with the second positioning portion. 如請求項1所述的充氣系統，其中該半導體容器為光罩盒。 The inflatable system according to claim 1, wherein the semiconductor container is a photomask box. 如請求項1所述的充氣系統，其中該至少一充氣元件為逆止閥。 The inflation system according to claim 1, wherein the at least one inflation element is a check valve. 如請求項3所述的充氣系統，其中該平頂定位部內更設有一彈性元件。 The inflatable system according to claim 3, wherein an elastic element is further provided in the flat-top positioning portion. 如請求項1所述的充氣系統，其中該至少一氣體通道更埋設於該盤面中，且該至少一氣體通道與該氣體進出部的側邊連通。 The inflatable system according to claim 1, wherein the at least one gas channel is further buried in the disk surface, and the at least one gas channel communicates with the side of the gas inlet and outlet portion. 如請求項1所述的充氣系統，其中該第二定位部斜率大於該第一定位部且該第一定位部與該第二定位部共構成連續連接斜面。 The inflatable system according to claim 1, wherein the slope of the second positioning portion is greater than that of the first positioning portion, and the first positioning portion and the second positioning portion together form a continuous connecting slope. 如請求項1所述的充氣系統，其中該盤面上更設有至少一擴充連接部。 The inflatable system according to claim 1, wherein at least one expansion connecting portion is further provided on the disk surface. 如請求項1所述的充氣系統，其中該平頂定位部的材質為一彈性材料。 The inflatable system according to claim 1, wherein the material of the flat-top positioning portion is an elastic material. 如請求項8所述的充氣系統，其中該彈性材料為矽膠或含氟彈性體。 The inflatable system according to claim 8, wherein the elastic material is silicone or fluoroelastomer.
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TW201437116A (en) * 2013-03-26 2014-10-01 Gudeng Prec Ind Co Ltd Photomask box having gas guiding device
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