CN111916379A - Inflation system - Google Patents
Inflation system Download PDFInfo
- Publication number
- CN111916379A CN111916379A CN201911116127.9A CN201911116127A CN111916379A CN 111916379 A CN111916379 A CN 111916379A CN 201911116127 A CN201911116127 A CN 201911116127A CN 111916379 A CN111916379 A CN 111916379A
- Authority
- CN
- China
- Prior art keywords
- inflation
- positioning portion
- gas
- inflation system
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 241001270131 Agaricus moelleri Species 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 239000013013 elastic material Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920001973 fluoroelastomer Polymers 0.000 claims 1
- 239000012858 resilient material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 8
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
Abstract
The invention discloses an inflation system which comprises a disc surface, at least one inflation assembly, at least one gas channel and at least two positioning pins. The tray surface includes a receiving area for receiving a semiconductor container. Each inflation assembly comprises a gas inlet and outlet part and a flat-top positioning part, and the flat-top positioning part is connected with the gas inlet and outlet part. The at least one gas channel is connected with the gas inlet and outlet part, and the at least two positioning pins are arranged on the accommodating area. The flat-top positioning portion and the semiconductor container form a first sealing surface.
Description
Technical Field
The present invention provides an inflation system, and more particularly, to an inflation system having a flat top positioning portion to prevent the semiconductor container from leaking due to vibration or poor dimension.
Background
The recent rapid development of semiconductor technology, and photolithography plays an important role. The application of lithography is required whenever a specific Pattern (Pattern) is to be formed on a semiconductor substrate or device. The application of masks is the essence of photolithography.
Generally, a mask uses an exposure principle to project a light source and a shadow with a corresponding pattern onto a semiconductor device, thereby etching a semiconductor layer with a desired pattern. Therefore, any particles adhering to the mask may deteriorate the quality of the semiconductor device pattern. Therefore, the requirement of the photomask for the semiconductor manufacturing process is strict. In a typical semiconductor process, a dust-free environment is provided to prevent micro particles in the air from contaminating the mask.
In addition, the mask box for storing or transferring the mask is a more important role for the requirement of cleanliness. Therefore, in the prior art, an inflation device is externally connected to the mask box, so that gas is introduced into the mask box through the inflation device, thereby preventing the mask from being polluted due to the adhesion of fine particles in the mask box. However, in order to prevent external gas from entering the mask box, the conventional gas filling device mostly adopts the principle of a check valve, so that the mask box can only give gas flow possibility when the mask box is engaged with the gas filling device. However, there are still many problems to be solved in the currently existing inflator devices.
Because of the variety and size of the existing mask boxes, various inflation devices cannot effectively perform automatic inflation operation on mask boxes of different manufacturers or sizes. In addition, the degree of sealing between the mask box and the inflation device, and the degree of airtightness of the gas valve itself on the inflation device are also considerably improved. The conventional inflation device often causes poor air tightness due to impact or non-conformity of the dimension of the mask box carried by the conventional inflation device, and the external air flows in, so that the micro particles pollute the mask carried in the mask box.
Disclosure of Invention
To solve the above-mentioned problems, the present invention provides an inflation system, which comprises a panel, at least one inflation assembly, at least one gas channel, and at least two positioning pins.
The disc surface comprises an accommodating area, and the accommodating area is used for accommodating a semiconductor container. Each inflation assembly comprises a gas inlet and outlet part and a flat-top positioning part, and the flat-top positioning part is connected with the gas inlet and outlet part.
The at least one gas channel is connected with the gas inlet and outlet part, and the at least two positioning pins are arranged on the accommodating area. The flat-top positioning portion and the semiconductor container form a first sealing surface.
The foregoing summary of the invention is provided to introduce a basic description of several aspects and features of the present invention. This summary is not an extensive overview of the invention, and is intended to neither identify key or critical elements of the invention nor delineate the scope of the invention, but to present some concepts of the invention in a simplified form.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of an inflation system according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of an inflation system according to an embodiment of the present invention.
Fig. 3 is a schematic structural view of an inflation system for carrying a semiconductor container according to an embodiment of the present invention.
FIG. 4 is a schematic structural view of an inflation assembly of the inflation system of the present invention.
The reference numbers illustrate:
10 inflation system
100 disc surface
101 accommodation area
102a inflation assembly
102b inflation assembly
1021 flat top positioning part
10211 gas seal ring
1022a first sealing surface
1022b second sealing surface
1023 gas inlet and outlet
1024 elastic component
103 gas channel
1031 Wide channel
1032 narrow channel
104 positioning pin
105 first positioning part
106 second positioning part
107 expansion connection part
200 light shield box
Arrow A
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 2 and 4, fig. 1 is a schematic structural diagram of an inflation system according to an embodiment of the present invention; FIG. 2 is a schematic cross-sectional view of an inflation system according to an embodiment of the present invention; FIG. 4 is a schematic structural view of an inflation assembly of the inflation system of the present invention.
As shown in FIG. 1, the present embodiment provides an inflation system 10 comprising a panel 100, at least one inflation assembly (102a, 102b), at least one gas channel 103, and at least two alignment pins 104. The disk surface 100 includes a receiving area 101, and the receiving area 101 receives a semiconductor container 200 (refer to fig. 3).
The semiconductor container 200 in this embodiment is a Reticle Pod, which may be a Reticle SMIF Pod (RSP) that carries a 150 millimeter (mm) or 200 mm-sized Reticle. Of course, in other possible embodiments, the semiconductor container 200 may be a Front Opening Unified Pod (FOUP), etc., and the invention is not limited thereto.
Next, as shown in fig. 4, in the present embodiment, each inflation assembly (102a, 102b) includes a gas inlet and outlet portion 1023 and a flat-top positioning portion 1021, and the flat-top positioning portion 1021 is connected with the gas inlet and outlet portion 1023; the flat-top positioning part 1021 is further provided with an elastic component 1024 for controlling the opening and closing of the inflation components (102a, 102b) to automatically reset.
Therefore, as shown in fig. 1, in the present embodiment, whether the inflation assemblies (102a, 102b) start to ventilate can be identified by the action of whether the flat top positioning portion 1021 presses downward. In the state of the inflation assembly 102a, the flat positioning part 1021 is bounced up due to the reset of the elastic assembly 1024, and the air cannot flow through; in the inverted state of the inflator 102b, the flat top positioning portion 1021 is depressed due to the semiconductor container 200 being loaded, and the like, so that the gas can enter and exit. Thus, the inflation assemblies (102a, 102b) of the present embodiment are check valves that regulate the ingress and egress of gas. Of course, in other possible embodiments of the present invention, the inflation assembly (102a, 102b), whether or not having a mechanical actuation mechanism, is only provided with the function of a check valve, and should also be included in the scope of the present invention as the inflation assembly (102a, 102b), and the present invention is not limited thereto.
As for the at least one gas passage 103, a gas inlet and outlet portion 1023 is connected. As shown in fig. 2, the gas passages 103 in the present embodiment are buried in the disk surface 100. In the practical application of the present embodiment, when the gas channel 103 is embedded in the disk surface 100, the effect of saving the space of the disk surface 100 can be achieved. The reason for this is that the conventional inflator mostly arranges the gas inlet below the disk surface 100, which causes the thickness of the disk surface 100 to be greatly increased; however, the disk surface 100 of the present embodiment has the gas channel 103 embedded in the disk surface 100, so that the thickness of the disk surface 100 and the occupied vertical space can be greatly reduced, thereby achieving the effect of saving space.
Referring to fig. 2 and 4, the cross-sectional view of fig. 4 shows that the gas channel 103 is communicated with the side of the gas inlet/outlet portion 1023 when viewed in cross-section along the direction of arrow a in fig. 2. In the embodiment of fig. 2, the gas channel 103 is used to fill a gas into the semiconductor container 200. Referring to fig. 3, fig. 3 is a schematic structural view of an inflation system for carrying a semiconductor container according to an embodiment of the present invention.
As shown in fig. 2 and 3, the gas passage 103 is composed of two parts, a wide passage 1031 and a narrow passage 1032. The gas tightness between the pipeline and the gas channel can be further ensured when the gas is input through the planar ring-jointed structure of the wide channel 1031 to the narrow channel 1032, and the effect of preventing the clean gas from being polluted by the external air is further achieved.
At least two positioning pins 104 are disposed on the accommodating area 101. The positioning pins 104 are engaged with the semiconductor container 200 to prevent the semiconductor container 200 from being displaced horizontally and affecting the quality of the gas filling. The number of the positioning pins 104 in this embodiment is three, and the positions of the positioning pins arranged on the accommodating area 101 form an isosceles triangle, so that the semiconductor container 200 can be uniformly positioned to the correct inflation position. Regarding how the semiconductor container 200 is loaded at the correct inflation position, the periphery of the accommodating area 101 of the embodiment shown in fig. 1 further includes a first positioning portion 105 and a second positioning portion 106, and the first positioning portion 105 is connected to the second positioning portion 106.
In the present embodiment, the first positioning portion 105 is an inclined surface with a lower slope, and primarily guides the position of the semiconductor container 200; the second positioning portion 106 is an inclined surface continuously connected to the first positioning portion 105, and has a slope greater than that of the first positioning portion 105, so that the semiconductor container 200 can be further guided and slid into the accommodating area 101 to be engaged with the positioning pin 104. The panel 100 further has at least one expansion connection 107, which allows the inflation system 10 to be assembled with other inflation systems 10 in a modular manner, thereby expanding or changing the application of the entire inflation system.
Next, after the semiconductor container 200 is successfully positioned, as shown in fig. 3 and 4, the flat-top positioning portion 1021 and the semiconductor container 200 form a first sealing surface 1022 a. The first sealing surface 1022a, in addition to being airtight to prevent external air from affecting the cleaning effect of the inflation gas, can form a wear-resistant translatable plane. When the semiconductor container 200 is slightly out of size or is subject to shaking or the like, a certain face-shifting airtight effect can be provided. The air-tightness maintenance is more excellent compared to the conventional line contact structure.
In addition, as shown in fig. 4, the side edge of the flat top positioning portion 1021 in this embodiment further includes a ring-joint airtight portion 10211. By providing the ring seal 10211, the ring seal 10211 and the receiving area 101 will form a second sealing surface 1022b during inflation. In addition, in an embodiment of the present invention, the flat positioning portion 1021 is made of an elastic material, and further, may be selected from a silicone or a fluorine-containing elastomer. Through the application of the elastic material, the air-tight effect of the embodiment of the invention is better.
In summary, the gas filling system 10 provided in the present embodiment can provide a gas-tight gas filling effect with a better semiconductor container 200 and a higher fault tolerance. In the present embodiment, the first sealing surface 1022a and the second sealing surface 1022b sequentially formed by the flat positioning portion 1021 and the annular airtight portion 10211 achieve a double-layer safety airtight protection effect, and further avoid the problem of pollution generated when the semiconductor container 200 is inflated with clean gas in the present embodiment.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An inflation system, comprising:
the disc surface comprises an accommodating area, and the accommodating area is used for accommodating a semiconductor container;
at least one inflation assembly, locate on the holding area, every inflation assembly includes:
a gas inlet and outlet part;
a flat top positioning part connected with the gas inlet and outlet part;
at least one gas channel connected with the gas inlet and outlet part; and
the at least two positioning pins are arranged on the accommodating area;
the flat-top positioning portion and the semiconductor container form a first sealing surface.
2. The inflatable system of claim 1, wherein the semiconductor container is a reticle pod.
3. The inflation system of claim 1, wherein the at least one inflation component is a check valve.
4. The inflation system of claim 3, wherein an elastic element is further disposed within the flat top positioning portion.
5. The inflation system of claim 1, wherein the at least one gas channel is further embedded in the tray face and the at least one gas channel is in communication with a side of the gas access portion.
6. The inflation system of claim 1, wherein the skirt of the flat top positioning portion further comprises an annular airtight portion, and the annular airtight portion and the receiving area form a second sealing surface.
7. The inflation system of claim 1, wherein the periphery of the receiving area further comprises a first positioning portion and a second positioning portion, and the first positioning portion is connected to the second positioning portion.
8. The inflation system of claim 1, wherein the panel further comprises at least one expansion connection.
9. The inflation system of claim 1, wherein the flat top positioning portion is made of an elastic material.
10. The inflatable system of claim 9, wherein the resilient material is silicone or a fluoroelastomer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108116115 | 2019-05-09 | ||
| TW108116115A TWI735874B (en) | 2019-05-09 | 2019-05-09 | Gas filling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111916379A true CN111916379A (en) | 2020-11-10 |
Family
ID=73242322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911116127.9A Pending CN111916379A (en) | 2019-05-09 | 2019-11-15 | Inflation system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111916379A (en) |
| TW (1) | TWI735874B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201134420Y (en) * | 2007-08-10 | 2008-10-15 | 廖莉雯 | System for keeping light shield clean |
| CN101364558A (en) * | 2007-08-09 | 2009-02-11 | 亿尚精密工业股份有限公司 | Cycling airflow structure of load moving container |
| US20090194197A1 (en) * | 2008-01-31 | 2009-08-06 | Yung-Shun Pan | Gas filling apparatus and gas filling port thereof |
| US20090260331A1 (en) * | 2008-04-17 | 2009-10-22 | Yung-Shun Pan | Gas Filling Apparatus and Gas Filling Port Thereof |
| TW201111244A (en) * | 2009-09-25 | 2011-04-01 | Gudeng Prec Industral Co Ltd | Reticle pod |
| TWM471027U (en) * | 2013-04-12 | 2014-01-21 | Ming-Sheng Chen | Structure of gas guide valve of gas charging base |
| CN104071464A (en) * | 2013-03-26 | 2014-10-01 | 家登精密工业股份有限公司 | Light shield box with gas guiding device |
| CN204011384U (en) * | 2014-03-25 | 2014-12-10 | 家登精密工业股份有限公司 | Wafer receiver |
| CN105960704A (en) * | 2014-02-07 | 2016-09-21 | 村田机械株式会社 | Gas injection device and auxiliary member |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM584983U (en) * | 2019-05-09 | 2019-10-11 | 呂保儀 | Gas filling system |
-
2019
- 2019-05-09 TW TW108116115A patent/TWI735874B/en active
- 2019-11-15 CN CN201911116127.9A patent/CN111916379A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101364558A (en) * | 2007-08-09 | 2009-02-11 | 亿尚精密工业股份有限公司 | Cycling airflow structure of load moving container |
| CN201134420Y (en) * | 2007-08-10 | 2008-10-15 | 廖莉雯 | System for keeping light shield clean |
| US20090194197A1 (en) * | 2008-01-31 | 2009-08-06 | Yung-Shun Pan | Gas filling apparatus and gas filling port thereof |
| US20090260331A1 (en) * | 2008-04-17 | 2009-10-22 | Yung-Shun Pan | Gas Filling Apparatus and Gas Filling Port Thereof |
| TW201111244A (en) * | 2009-09-25 | 2011-04-01 | Gudeng Prec Industral Co Ltd | Reticle pod |
| CN104071464A (en) * | 2013-03-26 | 2014-10-01 | 家登精密工业股份有限公司 | Light shield box with gas guiding device |
| TWM471027U (en) * | 2013-04-12 | 2014-01-21 | Ming-Sheng Chen | Structure of gas guide valve of gas charging base |
| CN105960704A (en) * | 2014-02-07 | 2016-09-21 | 村田机械株式会社 | Gas injection device and auxiliary member |
| CN204011384U (en) * | 2014-03-25 | 2014-12-10 | 家登精密工业股份有限公司 | Wafer receiver |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202042326A (en) | 2020-11-16 |
| TWI735874B (en) | 2021-08-11 |
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