TWI732951B - Cutting method to overcome the lack of crystal of liquid crystal panel - Google Patents

Abstract

A cutting method for overcoming the lack of crystals of a liquid crystal panel. It is used to cut a slice of liquid crystal panel and includes the steps of providing the liquid crystal panel, applying pressure to the removal area, and cutting. In the step of providing the liquid crystal panel, the position of a cutting line is determined. The liquid crystal panel has a reserved area and a removal area located on the opposite side of the cutting line, and the step of applying pressure to the removal area is to move the removal area. The removal area applies pressure to allow the liquid crystal in the removal area to move to the retention area. The cutting step is to cut along the cutting line and divide the liquid crystal panel into a retention block and a removal block. The cutting method can avoid the phenomenon of lack of crystals in the reserved area during the cutting process of the liquid crystal panel.

Description

Cutting method to overcome the lack of crystal of liquid crystal panel

The present invention relates to a cutting method, in particular to a cutting method used to cut liquid crystal panels and suitable for manufacturing liquid crystal panels of special sizes to overcome crystal lack of liquid crystal panels.

Generally, LCD panels usually have several mainstream sizes. The aspect ratios of common mainstream sizes are 4:3 and 16:9. These mainstream size LCD panels are manufactured in the factory and can be used, but some products need to use special size LCD panels. In order to achieve the purpose of customization, the conventional special size LCD panels are usually remanufactured Processing to complete.

In order to produce a liquid crystal panel with a special size, Figures 1 and 2 disclose a conventional cutting method of a liquid crystal panel. The cutting method first provides a liquid crystal panel 11 having two spaced apart substrates 111 and a packaged substrate 111. The liquid crystal layer 112 in the substrates 111. Next, the liquid crystal panel 11 is placed on a cutting platform 12, and the liquid crystal panel 11 is divided into a reserved area 114 and a removal area 115 on the opposite side of the cutting line 113 by a cutting line 113. The cutting line 113 and Corresponds to a gap 121 of the cutting platform 12.

Then, a weight 13 is pressed against the reserved area 114, and a cutting tool 14 corresponding to the cutting line 113 of the liquid crystal panel 11 is used to cut the reserved area 114 of the liquid crystal panel 11. The removal area 115 is separated, and finally the cut of the reserved area 114 is sealed to form a remanufactured panel with a special size.

In the conventional cutting method of the liquid crystal panel 11, gravity is applied above the reserved area 114 during the cutting process, so as to move the liquid crystal in the reserved area 114 toward the removal area 115. When the cutting tool 14 passes over the liquid crystal layer 112 of the liquid crystal panel 11, dust and gas generated by cutting can be prevented from entering the reserved area 114, so as to ensure that the liquid crystal in the reserved area 114 will not be contaminated. Although this cutting method has the above-mentioned advantages, relatively, before cutting, part of the liquid crystal originally located in the reserved area 114 will move to the removed area 115 due to the downward pressure of gravity. Therefore, when When gravity disappears and the reserved area 114 returns to an unpressurized state, since a small part of the liquid crystal originally stored in the reserved area 114 is pressed to the removal area 115, the reserved area 114 is prone to insufficient liquid crystal content. The problem is that remade panels made by conventional cutting methods are prone to lack of crystals.

The purpose of the present invention is to provide a method that can overcome the prior art at least One of the shortcomings is the cutting method to overcome the lack of crystals in the liquid crystal panel.

The cutting method of the present invention is used to cut a slice of liquid crystal panel, and the cutting method includes the steps of providing the liquid crystal panel, applying pressure to the removal area, and cutting. In the step of providing the liquid crystal panel, the position of a cutting line is determined. The liquid crystal panel has a reserved area and a removal area on the opposite side of the cutting line, and the step of pressing the removal area is in the removal area. Pressure is applied to move the liquid crystal located in the removal area to the reserved area. The cutting step is to cut along the cutting line and divide the liquid crystal panel into a reserved block and a removed block.

The effect of the present invention is that by applying pressure on the removal area, the liquid crystal in the removal area can be pressed to the reserved area. In this way, it can be ensured that sufficient liquid crystal is stored in the reserved block, and therefore Overcome the problem that the liquid crystal panel is prone to lack of crystals in the processing process.

2: LCD panel

2’: Remake panel

21: Cutting line

22: reserved area

23: Remove area

24: reserved block

241: cut

25: Remove the block

3: Stage unit

31: Pedestal

331: First Stoma

34: second direction

35: movable stage

351: Second Stoma

352: Groove

36: Auxiliary stage

361: Third Stoma

4: heavy objects

5: Cutting tool

51: Rail seat

311: Gap

32: First direction

33: fixed stage

52: The first tool

53: second tool

9: Cutting equipment

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic view of a cut of a conventional liquid crystal panel; FIG. 2 is a cut of the conventional liquid crystal panel Rear schematic diagram; Figure 3 is a processing flowchart of a first embodiment of the cutting method of the present invention; 4 is a schematic diagram of the device of the first embodiment, illustrating the relative relationship between a cutting device and a liquid crystal panel; FIG. 5 is a schematic diagram of the processing of the first embodiment; and FIG. 6 is a first cutting method of the present invention A processing flow chart of the second embodiment.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

Referring to FIGS. 3, 4, and 5, a first embodiment of the cutting method of the present invention is to cut a liquid crystal panel 2 by a cutting device 9 and make the liquid crystal panel 2 into a remade panel 2'of a special size. , The cutting device 9 has a stage unit 3, a cutter unit 5, and a weight 4. The stage unit 3 has a base 31 with a slit 311 extending along a first direction 32, and the stage unit 3 also has a fixed stage 33 mounted on the base 31 , A movable carrier 35 mounted on the base 31 that can move along a second direction 34, and an auxiliary carrier 36, the second direction 34 is perpendicular to the first direction 32.

The fixed carrier 33 and the movable carrier 35 are respectively located on opposite sides of the gap 311, the fixed carrier 33 has a plurality of first air holes 331, and the movable carrier 35 has a plurality of second air holes 351, and one The groove 352 facing the gap 311, the auxiliary The carrier 36 corresponds to the groove 351 and can move along the second direction 34, and has a plurality of third air holes 361. The movable carrier 35 and the auxiliary carrier 36 are all cooperated with the transmission mechanism of the transmission track, conveyor belt, chain or other structure, and move on the base 31 relative to the fixed carrier 33, because in the mechanical equipment The reciprocating movement of the driving element is a known technology, and it is not the focus of the present invention, so it will not be described in detail.

The tool unit 5 has a rail base 51 that straddles the platform unit 3, a first tool 52 mounted on the rail base 51 that can move along the first direction 32, and a first tool 52 mounted on the platform In the unit 3 and corresponding to the second cutter 53 of the gap 311, the second cutter 53 also moves along the first direction 32. Since driving the first tool 52 and the second tool 53 to reciprocate along the first direction 32 is a conventional technology, the description is omitted. The weight 4 is installed directly above the fixed stage 33 to move up and down. There are no special restrictions on its shape and size, preferably the same shape, but the area is slightly smaller than the removal area 23 of the liquid crystal panel 2 the size of.

The cutting method of this embodiment includes: a step of providing a liquid crystal panel, a step of pressing the removal area, a step of cutting, and a step of sealing. In the step of providing the liquid crystal panel, the position of a cutting line 21 is determined on the liquid crystal panel 2, and the cutting line 21 is used as a distinction. The liquid crystal panel 2 has a reserved area prepared for making the remade panel 2' 22, and a removal area 23 corresponding to the weight 4, the retention area 22 and the removal area 23 are respectively located on opposite sides of the cutting line 21.

Then the liquid crystal panel 2 is placed flat on the fixed stage of the stage unit 3 33. Above the movable stage 35 and the auxiliary stage 36, the cutting line 21 of the liquid crystal panel 2 corresponds to the gap 311 of the base 31 when the stage unit is placed. Adjust the width of the auxiliary stage 36 into the groove 352 of the movable stage 35, so that the liquid crystal panel 2 can be placed horizontally on the fixed stage 33, the movable stage 35, and the auxiliary stage. Above the carrier 36. Next, use an air pump not shown in the figure, and connect the air pump, the first air hole 331, the second air hole 351, and the third air hole 361 through a pipeline, and perform pumping. The air can generate negative pressure inside the first air hole 331, the second air hole 351, and the third air hole 361, so as to hold the liquid crystal panel 2 firmly.

The step of pressurizing the removal zone in this embodiment is to apply a pressure to the removal zone 23. The source of the pressure is not particularly limited. In this embodiment, the pressure comes from the weight 4, which is The purpose of pressing on the removal area 23 of the liquid crystal panel 2 is to push the liquid crystal in the removal area 23 toward the reserved area 22 so that the liquid crystal in the reserved area 22 can be as close as possible to saturation. As mentioned above, the form of the pressure source applied to the removal zone 23 is not particularly limited. It can be a solid as disclosed in the embodiment, or a liquid or gas, as long as pressure can be applied to the removal zone 23. , Which is suitable for use in the present invention. In this embodiment, the weight 4 is preferably pressed against the middle of the removal zone 23, in order to improve the effect of liquid crystal flowing to the retention zone 22. In order to prevent the liquid crystal from leaking out due to pressure in this step, this embodiment For example, a plastic frame can be added around the reserved area 22.

In addition, the present invention can also use a clamping method to apply clamping pressure to the removal area 23 of the liquid crystal panel 2. For example, the present invention can use a clamp to clamp the liquid crystal panel 2 upright. The clamp is clamped on the removal area 23, and the removal area 23 is located above the retention area 22. With the clamping force and the gravity of the liquid crystal itself, the liquid crystal in the removal area 23 can be moved to the retention area. The liquid crystal in the reserved area 22 can be as close to saturation as possible, that is, the present invention can use different pressure methods to pressurize the removal area 23. In this embodiment, the pressure applied to the removal zone 23 in this step is preferably not more than 10 kgf.

The cutting step uses the cutter unit 5 and cuts along the cutting line 21 of the liquid crystal panel 2. Specifically, the general liquid crystal panel 2 has two glass substrates spaced apart, and a liquid crystal layer encapsulated in the glass substrates. In the step of pressurizing the removal area, the liquid crystal layer will mainly flow. The liquid crystal is pressed against the reserved area 22, and the cutting step is to use the first cutter 52 and the second cutter 53 of the cutter unit 5 to respectively cut the glass substrate of the liquid crystal panel 2. , The liquid crystal panel 2 will form a reserved block 24 corresponding to the reserved area 22 and a removal block 25 corresponding to the removed area 23, and the reserved block 24 has a cutout 241 corresponding to the liquid crystal layer.

The crystal sealing step is used to close the cutout 241 of the retaining block 24, thereby forming the remade panel 2'with a special size according to the present invention. In addition, there are many ways to close the incision 241. In this embodiment, the first cutter 52 and the One of the second cutters 53 coats the sealant at the cut 241.

A second embodiment of the cutting method of the present invention is similar to the first embodiment, except that: the cutting method further includes a heating treatment step, and the heating treatment step only needs to be before the cutting step, that is, the heating treatment step It can be carried out before or at the same time when the step of pressing the removal area is carried out, with the purpose of further enhancing the effect of liquid crystal movement.

Specifically, the heating treatment step of this embodiment is to place the liquid crystal panel 2 in a heating chamber for heating. The heating time is preferably 3 to 5 minutes, and the heating temperature is 80 to 90°C. Because the liquid crystal changes from a liquid crystal state to The critical temperature of the liquid state is generally about 90°C, so raising the temperature of the liquid crystal to 80~90°C and liquefying before cutting will help move the liquid crystal in the removal zone 23 (see Figure 5) to the retention zone 22 ( See FIG. 5) to assist the liquid crystal in the reserved area 22 (see FIG. 5) to reach saturation. It’s just that if the liquid crystal remains at an excessively high temperature (for example, over 100°C) for a long time, the structure of the liquid crystal panel 2 will be destroyed and the liquid crystal panel 2 cannot be displayed. Therefore, the heating temperature and heating time of this step are limited to maintain the Reproduce the quality of panel 2'(see Figure 5).

It should be noted that the so-called "liquefaction" of liquid crystal does not limit the liquid crystal to be 100% liquid. In fact, as long as the liquid crystal is brought close to liquid through heating treatment, the fluidity can be improved and the purpose of assisting the flow of the liquid crystal is achieved.

It can be seen from the above description that the cutting method of the present invention mainly changes the application object of gravity, that is, the present invention applies pressure to the removal area 23 that is about to be discarded. The change of the process can prevent damage to the glass substrate of the remanufactured panel 2'during the pressing process, and secondly, before cutting, the liquid crystal in the removal area 23 can be pressed to the retention area 22 to The storage capacity of the liquid crystal in the reserved area 22 is increased. Therefore, after the cutting step and the crystal sealing step, the liquid crystal content inside the remade panel 2'can be close to saturation. Therefore, the cutting method of the present invention is not only a process innovation, but also It can indeed overcome the defect that the conventional remade panels are prone to lack of crystals after cutting.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope covered by the patent of the present invention.

2‧‧‧LCD Panel

2’‧‧‧Remade panel

21‧‧‧Cutting line

22‧‧‧Reserved Area

23‧‧‧Remove area

24‧‧‧Reserved block

241‧‧‧Cut

25‧‧‧Remove block

3‧‧‧Carrier unit

311‧‧‧Gap

33‧‧‧Fixed Stage

35‧‧‧Activity Stage

36‧‧‧Auxiliary carrier

4‧‧‧Heavy

5‧‧‧Tool Unit

51‧‧‧rail seat

52‧‧‧First tool

53‧‧‧Second Tool

31‧‧‧Pedestal

Claims (8)

A cutting method for overcoming the lack of crystals of a liquid crystal panel, used to cut a piece of liquid crystal panel, and includes: providing a liquid crystal panel step: determining the position of a cutting line on the liquid crystal panel, and the liquid crystal panel has a cutting line on the opposite side of the cutting line. A retention area and a removal area; the step of applying pressure to the removal area: moving the liquid crystal in the removal area to the retention area, and the pressure applied to the removal area is preferably not more than 10 kgf; and Cutting step: cutting along the cutting line of the liquid crystal panel, and dividing the liquid crystal panel into a retaining block and a removing block. The cutting method for overcoming the lack of crystal of a liquid crystal panel as described in claim 1 further includes a crystal sealing step, which is to close an incision of the reserved block to form a remade panel. The cutting method for overcoming the lack of crystals of a liquid crystal panel as described in claim 1 further includes a heat treatment step before the cutting step and assisting the liquid crystal in the liquid crystal panel to liquefy. The cutting method for overcoming the lack of crystals of the liquid crystal panel as described in claim 2 further includes a heat treatment step before the cutting step and assisting the liquid crystal in the liquid crystal panel to liquefy. The cutting method for overcoming the lack of crystals of a liquid crystal panel according to claim 4, wherein the heating temperature of the heating treatment step is between 80°C and 90°C. The cutting method for overcoming the lack of crystals of a liquid crystal panel according to claim 4, wherein the heating time of the heating treatment step is 3 to 5 minutes. The cutting method for overcoming the lack of crystal of a liquid crystal panel as described in claim 4, wherein: The heating temperature of the heat treatment step is 80-90°C, and the heating time is 3 to 5 minutes. The cutting method for overcoming the lack of crystal of a liquid crystal panel according to any one of claim 1 to claim 7, wherein, before the step of pressurizing the pair of removal areas, a plastic frame is added around the reserved area.

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