TWI732529B - Titanium alloy plate, titanium alloy plate manufacturing method, copper foil manufacturing roller, and copper foil manufacturing roller manufacturing method - Google Patents
Titanium alloy plate, titanium alloy plate manufacturing method, copper foil manufacturing roller, and copper foil manufacturing roller manufacturing method Download PDFInfo
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- TWI732529B TWI732529B TW109113054A TW109113054A TWI732529B TW I732529 B TWI732529 B TW I732529B TW 109113054 A TW109113054 A TW 109113054A TW 109113054 A TW109113054 A TW 109113054A TW I732529 B TWI732529 B TW I732529B
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- 229910001069 Ti alloy Inorganic materials 0.000 title claims abstract description 278
- 238000004519 manufacturing process Methods 0.000 title claims description 126
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 118
- 239000011889 copper foil Substances 0.000 title claims description 106
- 239000013078 crystal Substances 0.000 claims abstract description 251
- 239000010936 titanium Substances 0.000 claims abstract description 87
- 239000000203 mixture Substances 0.000 claims abstract description 39
- 238000009826 distribution Methods 0.000 claims abstract description 38
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 31
- 239000000126 substance Substances 0.000 claims abstract description 29
- 239000012535 impurity Substances 0.000 claims abstract description 24
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 12
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 104
- 229910052719 titanium Inorganic materials 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 64
- 238000003466 welding Methods 0.000 claims description 61
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 238000004220 aggregation Methods 0.000 claims description 27
- 230000002776 aggregation Effects 0.000 claims description 27
- 229910052718 tin Inorganic materials 0.000 claims description 26
- 238000004458 analytical method Methods 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- 239000000523 sample Substances 0.000 claims description 14
- 238000001887 electron backscatter diffraction Methods 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000005096 rolling process Methods 0.000 description 72
- 238000010438 heat treatment Methods 0.000 description 39
- 239000000463 material Substances 0.000 description 28
- 238000005098 hot rolling Methods 0.000 description 27
- 230000009467 reduction Effects 0.000 description 26
- 238000005498 polishing Methods 0.000 description 20
- 238000012545 processing Methods 0.000 description 17
- 230000000087 stabilizing effect Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 230000007797 corrosion Effects 0.000 description 13
- 238000005260 corrosion Methods 0.000 description 13
- 238000012937 correction Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 238000000137 annealing Methods 0.000 description 11
- 239000002585 base Substances 0.000 description 10
- 238000005097 cold rolling Methods 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 230000009466 transformation Effects 0.000 description 9
- 238000004070 electrodeposition Methods 0.000 description 8
- 238000000227 grinding Methods 0.000 description 8
- 239000011162 core material Substances 0.000 description 7
- 238000005242 forging Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000005204 segregation Methods 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000011324 bead Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910000365 copper sulfate Inorganic materials 0.000 description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000011362 coarse particle Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- 229910052758 niobium Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000002050 diffraction method Methods 0.000 description 3
- 150000004678 hydrides Chemical class 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000010313 vacuum arc remelting Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000012733 comparative method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 230000029052 metamorphosis Effects 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(II) oxide Inorganic materials [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B3/02—Rolling special iron alloys, e.g. stainless steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
- C22F1/183—High-melting or refractory metals or alloys based thereon of titanium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
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Abstract
本發明鈦合金板,具有以下化學組成:以質量%計含有由Sn:0%以上且2.0%以下、Zr:0%以上且5.0%以下及Al:0%以上且7.0%以下所構成群組中之1種或2種以上:合計0.2%以上且7.0%以下、N:0.100%以下、C:0.080%以下、H:0.015%以下、O:0.700%以下及Fe:0.500%以下,且剩餘部分包含Ti及不純物;平均結晶粒徑為40μm以下;根據結晶粒徑(μm)的對數之粒徑分布的標準差為0.80以下;包含結晶結構為六方最密堆積結構之α相;並且前述α相之[0001]方向相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率為70%以上。The titanium alloy plate of the present invention has the following chemical composition: Sn: 0% or more and 2.0% or less, Zr: 0% or more and 5.0% or less, and Al: 0% or more and 7.0% or less by mass%. One or more of two types: a total of 0.2% or more and 7.0% or less, N: 0.100% or less, C: 0.080% or less, H: 0.015% or less, O: 0.700% or less, and Fe: 0.500% or less, with the remainder The part contains Ti and impurities; the average crystal grain size is 40μm or less; the standard deviation of the particle size distribution according to the logarithm of the crystal grain size (μm) is 0.80 or less; it contains the α phase whose crystal structure is the hexagonal closest-packed structure; and the aforementioned α The area ratio of the crystal grains whose angle formed by the [0001] direction relative to the plate thickness direction is 0° or more and 40° or less is 70% or more.
Description
本發明涉及鈦合金板、鈦合金板之製造方法、製造銅箔的滾筒及製造銅箔的滾筒之製造方法。 本案係依據2019年4月17日於日本提申之特願2019-078824號、及2019年4月17日於日本提申之特願2019-078828號主張優先權,並於此援引其內容。The invention relates to a titanium alloy plate, a method of manufacturing a titanium alloy plate, a roller for manufacturing copper foil, and a method for manufacturing a roller for manufacturing copper foil. This case is based on Special Application No. 2019-078824 filed in Japan on April 17, 2019 and Special Application No. 2019-078828 filed in Japan on April 17, 2019, and its content is cited here.
發明背景 多層配線基板、撓性配線板等配線基板之配線或鋰離子電池之集電體等電子零件的導電部位,多數情況下係利用銅箔作為原料。Background of the invention In most cases, copper foil is used as the raw material for the wiring of wiring substrates such as multilayer wiring boards and flexible wiring boards or the current collectors of lithium-ion batteries and other electronic components.
利用於所述用途之銅箔可藉由製造銅箔的裝置來製造,該製造銅箔的裝置具備製造銅箔的滾筒。圖7係製造銅箔的裝置之示意圖。製造銅箔的裝置1,譬如係如圖7所示具備:蓄有硫酸銅溶液之電解槽10、以一部分會浸漬於硫酸銅溶液中之方式設於電解槽10內之電沉積滾筒2、及在電解槽10內以浸漬於硫酸銅溶液中並與電沉積滾筒2之外周面按預定間隔相對向之方式設置之電極板30。藉由在電沉積滾筒2與電極板30之間施加電壓,銅箔A會電沉積於電沉積滾筒2之外周面而生成。成為預定厚度之銅箔A係利用捲取部40從電沉積滾筒2剝離,並以導輥50一邊引導一邊捲取於捲取輥60。The copper foil used for the above-mentioned application can be manufactured by an apparatus for manufacturing copper foil, and the apparatus for manufacturing copper foil is provided with a roller for manufacturing copper foil. Fig. 7 is a schematic diagram of an apparatus for manufacturing copper foil. The
滾筒(電沉積滾筒)的材料,從耐蝕性優異、銅箔之剝離性優異等觀點來看,在其表面(外周面)一般係使用鈦。然而,即便在使用了耐蝕性優異之鈦材時,若長期進行銅箔之製造,則在硫酸銅溶液中構成滾筒之鈦材表面會逐漸受到腐蝕。然後,受到腐蝕之滾筒表面的狀態可能在製造銅箔時被轉印至銅箔。As the material of the roller (electrodeposition roller), from the viewpoints of excellent corrosion resistance and excellent peelability of the copper foil, titanium is generally used on the surface (outer peripheral surface). However, even when a titanium material with excellent corrosion resistance is used, if the copper foil is manufactured for a long time, the surface of the titanium material constituting the drum in the copper sulfate solution will gradually be corroded. Then, the state of the corroded roller surface may be transferred to the copper foil when the copper foil is manufactured.
金屬材料的腐蝕已知係依該金屬材料所具有的結晶組織、結晶方位、缺陷、偏析、加工應變及殘留應變等因金屬組織所致之各種內質因素之不同,而導致腐蝕狀態及腐蝕的程度不同。使用有在部位間金屬組織不均質的金屬材料之滾筒,在隨著銅箔之製造而受到腐蝕時,會變得無法維持滾筒之均質的面狀態,而於滾筒表面產生不均質的面。於滾筒表面產生之不均質的面可辨識為模樣。如上述之因不均質的金屬組織所致模樣中,因面積較大的巨觀組織所致且能以肉眼判別之模樣稱為「巨觀模樣」。並且,於滾筒表面產生之巨觀模樣可能在製造銅箔時轉印至銅箔。It is known that the corrosion of metal materials is caused by the different internal factors caused by the metal structure, such as the crystal structure, crystal orientation, defects, segregation, processing strain, and residual strain of the metal material, which lead to the corrosion state and corrosion. The degree is different. Rollers using metal materials with inhomogeneous metal structure between parts will not be able to maintain the uniform surface state of the roller when it is corroded with the manufacture of copper foil, and an uneven surface will be produced on the surface of the roller. The uneven surface produced on the surface of the drum can be recognized as a pattern. Among the above-mentioned patterns caused by the inhomogeneous metal structure, the pattern that is caused by the macroscopic structure with a larger area and can be distinguished by the naked eye is called "the macroscopic pattern." In addition, the macro pattern produced on the surface of the roller may be transferred to the copper foil when the copper foil is manufactured.
因此,為了製造高精度且均質厚度之銅箔,重要的係使構成滾筒之鈦材的巨觀組織成為均質,並使滾筒表面之腐蝕成為均質,藉此來減低因不均質的巨觀組織所致之巨觀模樣。Therefore, in order to manufacture high-precision and uniform thickness of copper foil, it is important to make the macrostructure of the titanium material constituting the drum homogeneous, and to make the corrosion of the drum surface homogeneous, so as to reduce the macrostructure caused by the inhomogeneity. To the look of the giant view.
專利文獻1中提案有一種用於一製造電解Cu箔的滾筒之鈦板,其特徵在於:其以質量%計含有Cu:0.15%以上且小於0.5%、氧:大於0.05%且在0.20%以下及Fe:0.04%以下,且剩餘部分由鈦與無法避免之不純物所構成,並且該鈦板係由平均結晶粒徑小於35µm之α相均質微細再結晶組織所構成。
專利文獻2中提案有一種用於一製造電解Cu箔的滾筒之鈦板,其特徵在於:其以質量%計含有Cu:0.3~1.1%、Fe:0.04%以下、氧:0.1%以下及氫:0.006%以下,平均結晶粒徑為8.2以上,且維氏硬度為115以上且在145以下;在該鈦板之平行於板面的部位中,集合組織在令存在於以下橢圓範圍內之晶粒的總面積為A且令在其之外的晶粒的總面積為B時,面積比A/B為0.3以上,該橢圓範圍係在從軋延面且從法線方向(ND軸)之α相的(0001)面極圖中,以(0001)面之法線的傾倒角度係在軋延寬度方向TD方向上±45°為長軸,且以在最終軋延方向RD方向上±25°為短軸之範圍。
專利文獻3中提案有一種鈦合金厚板,其含有Al:0.4~1.8%且板厚在4mm以上;在表面下1.0mm及1/2板厚部之平行於板面的部位中,平均結晶粒徑為8.2以上且維氏硬度為115以上且在145以下;並且,在橫跨從表面下1mm至1/2板厚部之平行於板面的部位中,集合組織在令最終軋延方向為RD、軋延面之法線為ND、軋延寬度方向為TD且令(0001)面的法線為c軸時,令c軸存在於以下橢圓區域之晶粒的總面積為A且令在其之外的晶粒的總面積為B,面積比A/B為3.0以上,該橢圓區域係在從軋延面且從法線方向之α相的(0001)面極圖中,c軸往TD方向的傾倒角度為-45~45°且c軸往RD方向的傾倒角度為-25~25°之區域。Patent Document 3 proposes a titanium alloy thick plate, which contains Al: 0.4 to 1.8% and has a plate thickness of 4 mm or more; the average crystallinity is in the 1.0 mm and 1/2 plate thickness part parallel to the plate surface under the surface The particle size is 8.2 or more and the Vickers hardness is 115 or more and 145 or less; and, in the part parallel to the plate surface that spans from 1mm to 1/2 the thickness of the plate below the surface, the aggregate structure is in the final rolling direction Is RD, the normal of the rolling surface is ND, the rolling width direction is TD, and the normal of the (0001) surface is the c-axis, let the total area of the crystal grains with the c-axis in the following elliptical region be A and let The total area of the other crystal grains is B, and the area ratio A/B is 3.0 or more. This elliptical region is in the polar figure of the (0001) plane of the α phase from the rolling plane and from the normal direction, with the c axis The tilting angle to the TD direction is -45~45° and the tilting angle of the c-axis to the RD direction is -25~25°.
專利文獻4中提案有一種具有均一微細的巨觀模樣之鈦及鈦合金板之製造方法,其特徵在於:在以包含依序施行分塊鍛造、粗熱軋及精整熱軋的步驟的方法來製造鈦及鈦合金板時,將分塊鍛造及粗熱軋之加熱溫度設為950℃以上,且將精整熱軋之加熱溫度設為700℃以下,並且實施變換了粗熱軋與精整熱軋之軋延方向的交叉熱軋。Patent Document 4 proposes a method for manufacturing titanium and titanium alloy plates with a uniform and fine macroscopic appearance. The method is characterized in that it includes the steps of sequentially performing block forging, rough hot rolling, and finishing hot rolling. When manufacturing titanium and titanium alloy plates, the heating temperature of block forging and rough hot rolling is set to 950℃ or higher, and the heating temperature of finishing hot rolling is set to 700℃ or lower, and the rough hot rolling and finishing are changed. Cross hot rolling in the rolling direction of the whole hot rolling.
專利文獻5中提案有一種電解銅箔製造用之鈦製陰極電極,係在使用銅電解液來獲得電解銅箔時所用之由鈦材構成之鈦製陰極電極;其特徵在於:鈦材的結晶粒度編號為7.0以上,且初始氫含量在35ppm以下。在專利文獻5中揭示有:若使用該鈦製陰極電極,則相較於以往,在製造電解銅箔時可在極長期間中使用而能有效減少保養次數,並且可長期製造高品質之電解銅箔。Patent Document 5 proposes a titanium cathode electrode for the production of electrolytic copper foil, which is a titanium cathode electrode made of titanium material used when copper electrolyte is used to obtain electrolytic copper foil; it is characterized by: crystallization of titanium material The particle size number is above 7.0, and the initial hydrogen content is below 35 ppm. Patent Document 5 discloses that if the titanium cathode electrode is used, it can be used for a very long period of time when manufacturing electrolytic copper foil compared with the past, which can effectively reduce the number of maintenance, and can produce high-quality electrolysis for a long time. Copper foil.
專利文獻6中提案有一種製造電解Cu箔的滾筒用之鈦板,其特徵在於:其以質量%計含有Cu:0.5~2.1%、Ru:0.05~1.00%、Fe:0.04%以下及氧:0.10%以下,且剩餘部分由鈦與無法避免之不純物所構成,並且具有均質微細再結晶組織。Patent Document 6 proposes a titanium plate for rollers for producing electrolytic Cu foil, which is characterized in that it contains Cu: 0.5 to 2.1%, Ru: 0.05 to 1.00%, Fe: 0.04% or less, and oxygen in mass%: 0.10% or less, and the remainder is composed of titanium and unavoidable impurities, and has a homogeneous fine recrystallized structure.
然而,伴隨著現今電子零件之小型化及高密度化,對銅箔係要求更進一步的薄化及表面品質之提升。在此種狀況下,亦要求更進一步減低上述巨觀模樣。以如專利文獻1~6中記載的習知技術而言,並無法充分減低巨觀模樣。However, with the current miniaturization and high density of electronic components, the copper foil system requires further thinning and improvement of surface quality. Under such circumstances, it is also required to further reduce the above-mentioned macroscopic appearance. With the conventional technologies described in
另外,用於製造銅箔的滾筒由於係藉由使鈦板等不溶性金屬之板材收縮配合(shrink fit)在成為製造銅箔的滾筒的芯體之芯材的表面而製造,故從製造銅箔的滾筒之生產性的觀點來看,收縮配合在芯材表面的板材宜為收縮配合性優異之板材。
然而,以專利文獻1~6之技術而言,需費工在芯材與鈦板之收縮配合作業上,而就製造銅箔的滾筒之生產性尚有改善的餘地。In addition, the roller used for the manufacture of copper foil is manufactured by shrink-fitting a plate of insoluble metal such as a titanium plate on the surface of the core material that becomes the core of the roller for manufacturing copper foil. From the viewpoint of the productivity of the roller, the sheet material that shrink fits on the surface of the core material is preferably a sheet material with excellent shrink fit.
However, with the techniques of
又,上述製造銅箔的滾筒除了以環狀鍛造來製造外,還可藉由將鈦板彎曲加工成圓筒狀並將相鄰的端部熔接來製造。後者的方法因易於控制鈦板的金屬組織,故適於製造高品質之製造銅箔的滾筒。藉由使構成製造銅箔的滾筒之鈦材的巨觀組織成為均質,來達成滾筒的均質腐蝕,可減低因不均質的巨觀組織所致之巨觀模樣。然而,關於以熔接製造之滾筒的熔接部,其金屬組織無法避免地會與其他部位相異,因而即便使鈦材的巨觀組織成為均質,仍會有容易產生因熔接部所致之巨觀模樣的課題,該鈦材係成為製造銅箔的滾筒的表面的胚料。 雖然在製造銅箔的滾筒的表面上熔接部的比例不大,但近年來對於減低熔接部的巨觀模樣的要求逐漸高漲。In addition, the roller for manufacturing the copper foil can be manufactured by forging in a ring shape, but also by bending a titanium plate into a cylindrical shape and welding adjacent ends. The latter method is suitable for manufacturing high-quality copper foil rolls because it is easy to control the metal structure of the titanium plate. By homogenizing the macrostructure of the titanium material that constitutes the roller for manufacturing copper foil, the uniform corrosion of the roller is achieved, and the macroscopic appearance caused by the inhomogeneous macrostructure can be reduced. However, regarding the welded part of the roller manufactured by welding, the metal structure will inevitably be different from other parts. Therefore, even if the macrostructure of the titanium material is made homogeneous, the macrostructure caused by the welded part will still be easily generated. As for the problem of the appearance, the titanium material is used as the blank of the surface of the roller for manufacturing the copper foil. Although the proportion of welded parts on the surface of the copper foil roll is not large, the demand for reducing the macroscopic appearance of the welded parts has gradually increased in recent years.
關於鈦材之熔接,專利文獻7中提案有一種形成熔融金屬用之Ti系線材,其在線材長度方向上具有預定拉伸強度,並且在線材本體的表面形成有1μm以上且5μm以下厚度的Ti系氧化膜。另外,專利文獻8中提案有一種由Ti或Ti合金所構成之熔接金屬線,其於表面具有氧濃化層,且更具有金屬化合物,該金屬化合物具有選自於鹼金屬及鹼土族金屬之群組之至少一種金屬。Regarding the welding of titanium materials, Patent Document 7 proposes a Ti-based wire for forming molten metal, which has a predetermined tensile strength in the longitudinal direction of the wire, and the surface of the wire body is formed with Ti with a thickness of 1 μm or more and 5 μm or less. Department of oxide film. In addition, Patent Document 8 proposes a welding wire composed of Ti or Ti alloy, which has an oxygen-concentrated layer on the surface, and further has a metal compound selected from alkali metals and alkaline earth metals. At least one metal of the group.
然而,專利文獻7、8中記載的技術並非用以在製造銅箔的鈦滾筒之製造中改善熔接及熔接部的組織之技術。因此,難以利用該技術來抑制巨觀模樣。亦即,在製造一製造銅箔的鈦滾筒中所用且可抑制在製造銅箔的鈦滾筒的熔接部中產生巨觀模樣之熔接用鈦棒線材,迄今仍未被充分研討。However, the techniques described in Patent Documents 7 and 8 are not techniques for improving the weld and the structure of the welded portion in the manufacture of a titanium roller for manufacturing copper foil. Therefore, it is difficult to use this technology to suppress the macroscopic appearance. That is, the titanium rod and wire for welding, which is used in the manufacture of a titanium roller for manufacturing copper foil and which can suppress the generation of a macroscopic appearance in the welding part of the titanium roller for manufacturing copper foil, has not been fully studied so far.
先前技術文獻 專利文獻 專利文獻1:日本特開2009-41064號公報 專利文獻2:日本特開2012-112017號公報 專利文獻3:日本特開2013-7063號公報 專利文獻4:日本特開昭60-9866號公報 專利文獻5:日本特開2002-194585號公報 專利文獻6:日本特開2005-298853號公報 專利文獻7:日本特開2005-21983號公報 專利文獻8:日本特開2006-291267號公報Prior art literature Patent literature Patent Document 1: Japanese Patent Application Publication No. 2009-41064 Patent Document 2: Japanese Patent Application Publication No. 2012-112017 Patent Document 3: JP 2013-7063 A Patent Document 4: Japanese Patent Application Laid-Open No. 60-9866 Patent Document 5: Japanese Patent Laid-Open No. 2002-194585 Patent Document 6: Japanese Patent Laid-Open No. 2005-298853 Patent Document 7: Japanese Patent Laid-Open No. 2005-21983 Patent Document 8: Japanese Patent Application Laid-Open No. 2006-291267
發明概要 發明欲解決之課題 本發明係有鑑於上述問題而作成者,本發明目的在於提供一種鈦合金板及使用該鈦合金板製造之製造銅箔的滾筒,該鈦合金板在使用於銅箔製造用之滾筒時可抑制產生巨觀模樣。 並且,本發明之較佳目的在於提供一種鈦合金板及使用該鈦合金板製造之製造銅箔的滾筒,該鈦合金板在使用於銅箔製造用之滾筒時可抑制產生巨觀模樣,且收縮配合性優異。Summary of the invention The problem to be solved by the invention The present invention was made in view of the above-mentioned problems. The object of the present invention is to provide a titanium alloy plate and a copper foil roller manufactured using the titanium alloy plate, which can suppress the use of the titanium alloy plate in the copper foil manufacturing roller Produce a giant look. In addition, a preferred object of the present invention is to provide a titanium alloy plate and a copper foil drum manufactured using the titanium alloy plate, which can suppress the appearance of macroscopic appearance when the titanium alloy plate is used in the copper foil manufacturing drum, and Excellent shrink fit.
此外,本發明之另一較佳目的在於提供一種製造銅箔的滾筒之製造方法、及製造銅箔的滾筒,該製造銅箔的滾筒之製造方法使用有熔接用鈦棒線材,其係在製造一製造銅箔的鈦滾筒中所用且可抑制在製造銅箔的鈦滾筒的熔接部中產生巨觀模樣。In addition, another preferred object of the present invention is to provide a method for manufacturing a copper foil roller and a copper foil roller. The method for manufacturing the copper foil roller uses a titanium rod wire for welding, which is used in the manufacture of It is used in the titanium roller for the manufacture of copper foil and can suppress the appearance of macroscopic appearance in the welded part of the titanium roller for the manufacture of copper foil.
用以解決課題之手段 本發明人等為解決上述問題,進行了精闢研討。結果得到以下知識見解:僅憑著使鈦板中集合組織的結晶粒徑縮小、或使結晶的(0001)面的法線接近垂直於軋延面(板面),無法抑制產生巨觀模樣到現今要求的水準。Means to solve the problem In order to solve the above-mentioned problems, the inventors of the present invention conducted incisive research. As a result, we have obtained the following knowledge: only by reducing the crystal grain size of the aggregate structure in the titanium plate, or making the normal line of the crystal (0001) plane close to perpendicular to the rolling surface (plate surface), it is impossible to suppress the macroscopic appearance. The level required today.
本發明人等進一步進行研討,結果發現藉由以下可抑制產生巨觀模樣:將化學組成設成可抑制β相析出之化學組成,在組織中使晶粒不僅微細還成為均一大小,並使組織包含結晶結構為六方最密堆積結構之α相,使α相之[0001]方向(c軸)相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率在70%以上,並且較佳係更以成為以下集合組織的方式來控制:在從板面的法線方向的(0001)極圖中,晶粒的聚集度的尖峰存在於從板面的法線方向起30°以內且最大聚集度在4.0以上。並且還發現到一種可同時達成如上述之化學組成及集合組織之鈦合金板之製造方法,終至完成本發明。The inventors of the present invention conducted further studies and found that macroscopic appearance can be suppressed by setting the chemical composition to a chemical composition that can suppress the precipitation of the β phase, making the crystal grains not only fine but also uniform in size, and making the structure Including the α phase whose crystal structure is the hexagonal closest-packed structure, the area ratio of the crystal grains whose angle formed by the [0001] direction (c axis) of the α phase with respect to the plate thickness direction is 0° or more and 40° or less is 70% or more, and it is better to control it in the following way: in the (0001) pole figure from the normal direction of the plate surface, the peak of the degree of aggregation of crystal grains exists from the normal line of the plate surface Within 30° from the direction and the maximum concentration is above 4.0. In addition, a method for manufacturing a titanium alloy plate that can achieve the above-mentioned chemical composition and aggregate structure at the same time was found, and the present invention was finally completed.
另外,本發明人等亦針對在製造一製造銅箔的滾筒時鈦合金板對芯材之收縮配合性進行了研討。結果得知鈦合金板的楊格率會影響收縮配合性。 本發明人等根據此見解,著眼於鈦合金板的硬度、晶粒尺寸、結晶方位、第二相及元素分布進行了研討。結果發現:若較一般的用於銅箔製造用之滾筒的鈦合金板含有更大量的Al,晶粒成長就會被抑制而變得容易形成微細組織,從而鈦合金板的硬度變大且鈦合金板的楊格率提升。In addition, the inventors of the present invention also studied the shrinkage fit of the titanium alloy plate to the core material when manufacturing a copper foil roll. As a result, it was found that the Younger ratio of the titanium alloy sheet affects the shrinkage fit. Based on this knowledge, the inventors of the present invention focused on the hardness, crystal grain size, crystal orientation, second phase, and element distribution of the titanium alloy sheet. As a result, it was found that if the titanium alloy plate used for the copper foil manufacturing roller contains a larger amount of Al, the growth of the crystal grains will be suppressed and it becomes easy to form a fine structure. As a result, the hardness of the titanium alloy plate increases and the titanium alloy plate becomes harder. The Younger rate of alloy plates has been increased.
又,本發明人等針對抑制熔接部中產生巨觀模樣一事進行了研討。結果發現:使熔接部的金屬組織為α相主體,並且在使晶粒微細化的同時控制硬度,此舉動可抑制熔接部中產生巨觀模樣。並且發現:為了獲得所述熔接部組織,有效作法係使熔接用鈦線材含有適量選自於由Sn、Zr及Al所構成群組中之1種以上與O。In addition, the inventors of the present invention conducted studies on suppressing the appearance of macroscopic appearance in the welded portion. As a result, it was found that by making the metal structure of the welded part the main α-phase, and controlling the hardness while making the crystal grains finer, this action can suppress the macroscopic appearance in the welded part. It was also found that in order to obtain the structure of the welded part, it is effective to make the titanium wire for welding contain an appropriate amount of one or more selected from the group consisting of Sn, Zr, and Al, and O.
基於上述知識見解而完成之本發明,其主旨如下。 [1]本發明一態樣之鈦合金板,具有以下化學組成:以質量%計含有由Sn:0%以上且2.0%以下、Zr:0%以上且5.0%以下及Al:0%以上且7.0%以下所構成群組中之1種或2種以上:合計0.2%以上且7.0%以下、N:0.100%以下、C:0.080%以下、H:0.015%以下、O:0.700%以下及Fe:0.500%以下,且剩餘部分包含Ti及不純物;平均結晶粒徑為40μm以下;根據以單位μm計之結晶粒徑的對數之粒徑分布的標準差為0.80以下;包含結晶結構為六方最密堆積結構之α相;並且前述α相之[0001]方向相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率為70%以上。 [2]上述[1]之鈦合金板亦可具有以下集合組織:在從板面的法線方向之(0001)極圖中,將電子背向散射繞射法之採用球諧函數法所得極圖的展開指數設為16並將高斯半值寬設為5°時,利用織構(Texture)解析算出之聚集度的尖峰存在於從前述板面的前述法線方向起30°以內,並且最大聚集度在4.0以上。 [3]上述[1]或[2]之鈦合金板在將前述平均結晶粒徑以單位μm計且設為D時,前述粒徑分布的標準差亦可在(0.35×lnD-0.42)以下。 [4]上述[1]至[3]中任一項之鈦合金板在觀察板厚方向截面時,在從表面起算板厚1/4的位置上,雙晶晶界長度相對於板厚截面之總結晶晶界長度的比率亦可在5.0%以下。 [5]上述[1]至[4]中任一項之鈦合金板在前述化學組成中,亦可含有合計0.2%以上且5.0%以下之由以下所構成群組中之1種或2種以上元素:Sn:0.2%以上且2.0%以下、Zr:0.2%以上且5.0%以下及Al:0.2%以上且3.0%以下。 [6]上述[1]至[4]中任一項之鈦合金板在前述化學組成中,亦可含有Al:大於1.8%且在7.0%以下,並且維氏硬度在350Hv以下。 [7]上述[6]之鈦合金板在以質量%計令Al含量為[Al%]、Zr含量為[Zr%]、Sn含量為[Sn%]且令O含量為[O%]時,下述式(1)所示Al當量Aleq亦可在7.0以下。 Aleq=[Al%]+[Zr%]/6+[Sn%]/3+10×[O%] 式(1) [8]上述[6]或[7]之鈦合金板係使用電子探針顯微分析儀,在從表面起算板厚1/4的位置上,對垂直於板厚方向的面20mm×20mm以上之分析區域進行組成分析時,令Al的平均含量為[Al%],Al濃度為([Al%]-0.2)質量%以上且在([Al%]+0.2)質量%以下之區域相對於前述分析區域面積的面積率亦可在90%以上。 [9]上述[1]至[8]中任一項之鈦合金板亦可含有98.0體積%以上之前述α相。 [10]上述[1]~[9]中任一項之鈦合金板亦可為用於一製造銅箔的滾筒之鈦合金板。 [11]本發明另一態樣之製造銅箔的滾筒,具有:圓筒狀之內滾筒;如[1]至[10]中任一項之鈦合金板,係接著於前述內滾筒的外周面;及熔接部,係設於前述鈦合金板的對接部;其中前述熔接部的金屬組織以體積率計具有98.0%以上的α相,並且以依據JIS G 0551:2013之粒度編號計,在6以上且在11以下。 [12]本發明另一態樣之製造銅箔的滾筒之製造方法,具有熔接步驟,該步驟係使用熔接用鈦線材來熔接經加工成圓筒狀之鈦合金板之鄰接的2個端部;其中前述熔接用鈦線材具有以下化學組成:以質量%計含有:選自於由Sn、Zr及Al所構成群組中之1種以上:合計0.2%以上且6.0%以下、O:0.01%以上且0.70%以下、N:0.100%以下、C:0.080%以下、H:0.015%以下及Fe:0.500%以下,且剩餘部分包含Ti及不純物。 [13]上述[12]之製造銅箔的滾筒之製造方法,其中在前述熔接用鈦線材中,前述O的至少一部分亦可以選自於由Ti、Sn、Zr及Al所構成群組中之1種以上元素的氧化物的形態存在。The gist of the present invention completed based on the above knowledge is as follows. [1] The titanium alloy plate of one aspect of the present invention has the following chemical composition: Sn: 0% or more and 2.0% or less, Zr: 0% or more and 5.0% or less, and Al: 0% or more and One or two or more of the group consisting of 7.0% or less: a total of 0.2% or more and 7.0% or less, N: 0.100% or less, C: 0.080% or less, H: 0.015% or less, O: 0.700% or less, and Fe : 0.500% or less, and the remainder contains Ti and impurities; the average crystal grain size is 40μm or less; the standard deviation of the particle size distribution according to the logarithm of the crystal grain size in unit μm is 0.80 or less; the crystal structure is the densest hexagon The alpha phase of the stacked structure; and the angle formed by the [0001] direction of the aforementioned alpha phase with respect to the plate thickness direction is 0° or more and 40° or less, and the area ratio of the crystal grains is 70% or more. [2] The titanium alloy plate of [1] above may also have the following aggregate structure: In the (0001) pole figure from the normal direction of the plate surface, the electron backscatter diffraction method is used to obtain the pole by the spherical harmonic function method. When the expansion index of the graph is set to 16 and the Gaussian half-value width is set to 5°, the peak of the concentration calculated by the texture analysis exists within 30° from the normal direction of the aforementioned board surface, and the maximum The aggregation degree is above 4.0. [3] For the titanium alloy plate of [1] or [2] above, when the average crystal grain size is in the unit of μm and is set as D, the standard deviation of the grain size distribution may also be (0.35×lnD-0.42) or less . [4] When observing the cross section of the titanium alloy plate in any one of the above [1] to [3] in the thickness direction, at a position of 1/4 of the plate thickness from the surface, the length of the twin grain boundary is relative to the thickness of the cross section The ratio of the total crystal grain boundary length can also be below 5.0%. [5] The titanium alloy plate of any one of [1] to [4] above may contain 0.2% or more and 5.0% in total in the aforementioned chemical composition of one or two of the following groups The above elements: Sn: 0.2% or more and 2.0% or less, Zr: 0.2% or more and 5.0% or less, and Al: 0.2% or more and 3.0% or less. [6] The titanium alloy plate of any one of the above [1] to [4] may contain Al in the aforementioned chemical composition: more than 1.8% and 7.0% or less, and the Vickers hardness is 350 Hv or less. [7] For the titanium alloy plate of [6] above, when the Al content is [Al%], the Zr content is [Zr%], the Sn content is [Sn%], and the O content is [O%] in terms of mass% , The Al equivalent Aleq represented by the following formula (1) may be 7.0 or less. Aleq=[Al%]+[Zr%]/6+[Sn%]/3+10×[O%] formula (1) [8] The titanium alloy plate of [6] or [7] mentioned above uses an electron probe microanalyzer. At a position of 1/4 of the plate thickness from the surface, the surface perpendicular to the plate thickness direction is 20mm×20mm or more. When analyzing the composition of the analysis area, let the average content of Al be [Al%], the Al concentration is ([Al%]-0.2) mass% or more and the area below ([Al%]+0.2) mass% is relative to The area ratio of the aforementioned analysis area can also be above 90%. [9] The titanium alloy sheet of any one of [1] to [8] above may also contain 98.0 vol% or more of the aforementioned α phase. [10] The titanium alloy plate of any one of [1] to [9] above may also be a titanium alloy plate used for a roller for manufacturing copper foil. [11] A roller for manufacturing copper foil in another aspect of the present invention has: a cylindrical inner roller; such as the titanium alloy plate of any one of [1] to [10] attached to the outer circumference of the aforementioned inner roller The surface; and the welded part are set at the butt part of the aforementioned titanium alloy plate; wherein the metal structure of the aforementioned welded part has an alpha phase of 98.0% or more in volume ratio, and is based on the particle size number according to JIS G 0551:2013. 6 or more and 11 or less. [12] A method of manufacturing a copper foil roller according to another aspect of the present invention has a welding step in which a titanium wire for welding is used to weld adjacent two ends of a titanium alloy plate processed into a cylindrical shape ; Wherein the aforementioned titanium wire for welding has the following chemical composition: Contains in mass %: one or more selected from the group consisting of Sn, Zr and Al: a total of 0.2% or more and 6.0% or less, O: 0.01% Above and below 0.70%, N: below 0.100%, C: below 0.080%, H: below 0.015%, and Fe: below 0.500%, and the remainder contains Ti and impurities. [13] The method for manufacturing a copper foil roller of [12], wherein in the titanium wire for welding, at least a part of the O may be selected from the group consisting of Ti, Sn, Zr, and Al Exist in the form of oxides of one or more elements.
發明效果 根據本發明上述態樣,可提供一種鈦合金板及使用該鈦合金板來製造之製造銅箔的滾筒,前述鈦合金板在使用於銅箔製造用之滾筒時可抑制產生巨觀模樣。 並且,根據本發明之較佳態樣可提供一種鈦合金板,其在使用於銅箔製造用之滾筒時可抑制產生巨觀模樣,且收縮配合性優異。 另外,根據本發明之較佳態樣,可提供一種製造銅箔的滾筒之製造方法、及製造銅箔的滾筒,該製造方法可抑制在製造銅箔的滾筒的熔接部中產生巨觀模樣。Invention effect According to the above aspect of the present invention, it is possible to provide a titanium alloy plate and a copper foil drum manufactured using the titanium alloy plate. The titanium alloy plate can be used in a copper foil manufacturing drum to suppress the appearance of macroscopic appearance. In addition, according to a preferred aspect of the present invention, a titanium alloy plate can be provided, which can suppress the appearance of macroscopic appearance when used in a roll for manufacturing copper foil, and has excellent shrink fit. In addition, according to a preferred aspect of the present invention, it is possible to provide a method for manufacturing a copper foil roller and a copper foil roller, which can suppress the appearance of macroscopic patterns in the welded portion of the copper foil roller.
用以實施發明之形態 以下詳細說明本發明之較佳實施形態。 <1.鈦合金板> 首先,說明本實施形態之鈦合金板。本實施形態之鈦合金板係設想作為銅箔製造用之滾筒(製造銅箔的滾筒)之材料來加以利用。因此,本實施形態之鈦合金板亦可說是用於一製造銅箔的滾筒之鈦合金板。在製造銅箔的滾筒中使用時,鈦合金板之一面係構成滾筒之圓筒表面。The form used to implement the invention The preferred embodiments of the present invention will be described in detail below. <1. Titanium alloy plate> First, the titanium alloy sheet of this embodiment will be described. The titanium alloy plate of this embodiment is supposed to be used as a material for a roller for manufacturing copper foil (a roller for manufacturing copper foil). Therefore, the titanium alloy plate of this embodiment can also be said to be a titanium alloy plate used for a roll for manufacturing copper foil. When used in the production of copper foil rollers, one surface of the titanium alloy plate constitutes the cylindrical surface of the roller.
(1.1 化學組成) 首先,說明本實施形態之鈦合金板的化學組成。本實施形態之鈦合金板以質量%計含有:由Sn:0%以上且2.0%以下、Zr:0%以上且5.0%以下及Al:0%以上且7.0%以下所構成群組中之1種或2種以上:合計0.2%以上且7.0%以下、N:0.100%以下、C:0.080%以下、H:0.015%以下、O:0.700%以下及Fe:0.500%以下,且剩餘部分包含Ti及不純物。以下若無特別指明,則有關化學組成的「%」之標記設為表示「質量%」。(1.1 Chemical composition) First, the chemical composition of the titanium alloy sheet of this embodiment will be explained. The titanium alloy plate of this embodiment contains in mass%: 1 of the group consisting of Sn: 0% or more and 2.0% or less, Zr: 0% or more and 5.0% or less, and Al: 0% or more and 7.0% or less One or two or more types: a total of 0.2% or more and 7.0% or less, N: 0.100% or less, C: 0.080% or less, H: 0.015% or less, O: 0.700% or less, and Fe: 0.500% or less, and the remainder contains Ti And impurity. If there is no special indication below, the mark of "%" related to the chemical composition is set to mean "mass%".
工業用純鈦的添加元素極為少量,其組織實質上為α相單相。只要將以此種工業用純鈦製造的鈦合金板用於滾筒,則將該滾筒浸漬於硫酸銅溶液時,滾筒會均勻腐蝕。從而會抑制因α相、β相的腐蝕速度不同所致巨觀模樣的產生。Industrial pure titanium has a very small amount of added elements, and its structure is essentially an α-phase single-phase. As long as the titanium alloy plate made of such industrial pure titanium is used for the roller, when the roller is immersed in the copper sulfate solution, the roller will be uniformly corroded. Thereby, the generation of macroscopic appearance due to the different corrosion rates of the α phase and β phase can be suppressed.
本實施形態之鈦合金板實質上係以下合金板:在α相單相的工業用純鈦中,以質量%計,以成為合計0.2%以上且7.0%以下的方式含有由Sn:0%以上且2.0%以下、Zr:0%以上且5.0%以下及Al:0%以上且7.0%以下所構成群組中之1種或2種以上元素。 針對限定各元素含量的理由加以說明。The titanium alloy sheet of this embodiment is essentially the following alloy sheet: In the α-phase single-phase industrial pure titanium, Sn: 0% or more is contained in a mass% of 0.2% or more and 7.0% or less in total And 2.0% or less, Zr: 0% or more and 5.0% or less, and Al: 0% or more and 7.0% or less in the group consisting of one or more elements. The reasons for limiting the content of each element are explained.
<由Sn:0%以上且2.0%以下、Zr:0%以上且5.0%以下及Al:0%以上且7.0%以下所構成群組中之1種或2種以上:合計0.2%以上且7.0%以下> 只要選自於由Sn、Zr及Al所構成群組中之1種或2種以上元素的含量合計在0.2%以上,便可穩定抑制晶粒成長。 另一方面,藉由使選自於由Sn、Zr及Al所構成群組中之1種或2種以上元素的含量合計在7.0%以下,便會成為上述之熱軋延後的鈦合金板不會發生變形的程度的高溫強度。從高溫強度的觀點看來,較佳係Al含量在0.2%以上且在3.0%以下,並且選自於由Sn、Zr及Al所構成群組中之1種或2種以上元素的含量合計在0.5%以上且在5.0%以下。選自於由Sn、Zr及Al所構成群組中之1種或2種以上元素的含量合計在0.5%以上且在4.0%以下更佳。<Sn: 0% or more and 2.0% or less, Zr: 0% or more and 5.0% or less, and Al: 0% or more and 7.0% or less in the group consisting of one or two or more types: a total of 0.2% or more and 7.0 % Or less> As long as the total content of one or more elements selected from the group consisting of Sn, Zr, and Al is 0.2% or more, the growth of crystal grains can be stably suppressed. On the other hand, by making the total content of one or more elements selected from the group consisting of Sn, Zr, and Al less than 7.0%, it becomes the aforementioned hot-rolled titanium alloy sheet High temperature strength to the extent that it will not deform. From the viewpoint of high temperature strength, it is preferable that the Al content is 0.2% or more and 3.0% or less, and the content of one or more elements selected from the group consisting of Sn, Zr, and Al is added in total 0.5% or more and 5.0% or less. The total content of one or two or more elements selected from the group consisting of Sn, Zr, and Al is more preferably 0.5% or more and 4.0% or less.
Sn為中性元素,係藉由在鈦中固溶而會抑制晶粒成長的元素。只要Sn含量在0.2%以上,便可穩定抑制晶粒成長。因此,Sn含量宜為0.2%以上。Sn含量較佳係在0.3%以上。 另外,Sn藉由在鈦中的α相及β相固溶,會使各相穩定化。Sn含量若過多,則高溫強度變高,而容易因熱軋延時的反作用力造成熱軋延後的板形狀歪曲成為波浪形狀。呈波浪形狀的鈦合金板會因用以矯正形狀的加工而被賦予應變,從而在鈦合金板的結晶導入差排。該差排會成為原因,導致變得容易產生巨觀模樣。此外,Sn含量若過多,則鈦合金板的韌性變小,在製造一製造銅箔的滾筒時收縮配合性就降低,進而生產性降低。因此,Sn含量宜為2.0%以下,在1.5%以下較佳。Sn在鈦合金板中不一定需要,因而在含有合計0.2%以上的Zr及/或Al時,Sn含量可為0%。Sn is a neutral element and is an element that inhibits the growth of crystal grains by solid solution in titanium. As long as the Sn content is 0.2% or more, the growth of crystal grains can be stably suppressed. Therefore, the Sn content should be 0.2% or more. The Sn content is preferably above 0.3%. In addition, Sn stabilizes each phase by solid dissolving in the α phase and β phase in titanium. If the Sn content is too large, the high-temperature strength becomes high, and the plate shape after the hot rolling is likely to be distorted into a wave shape due to the reaction force of the hot rolling. The wave-shaped titanium alloy plate is given strain due to the processing to correct the shape, so that the crystals of the titanium alloy plate are introduced into the row. This disparity will become the cause, making it easy to produce a macroscopic appearance. In addition, if the Sn content is too large, the toughness of the titanium alloy sheet will decrease, and the shrinkage compatibility during the manufacture of a copper foil roll will decrease, and the productivity will decrease. Therefore, the Sn content is preferably 2.0% or less, preferably 1.5% or less. Sn is not necessarily required in the titanium alloy sheet, so when Zr and/or Al are contained in a total of 0.2% or more, the Sn content may be 0%.
Zr係與Sn同樣為中性元素,且係藉由在鈦中固溶而會抑制晶粒成長的元素。只要Zr含量在0.2%以上,便可穩定抑制晶粒成長。因此,Zr含量宜為0.2%以上。Zr含量較佳係在0.3%以上。 另一方面,Zr係藉由在鈦中的α相及β相固溶而會使各相穩定化的元素。Zr含量若過多,α相及β相之2相在熱方面穩定存在的溫度範圍變廣,在加熱時β相變得容易析出。由於β相會較α相更優先腐蝕,在將表面具有包含β相之鈦合金板的滾筒用於製造銅箔時,β相會優先腐蝕而造成滾筒表面產生巨觀模樣。其結果,該巨觀模樣可能會轉印到銅箔。並且會因凝固偏析導致鈦合金板的部位間產生強度差,而在研磨所得鈦合金板時產生巨觀模樣。因此,Zr含量為5.0%以下。Zr含量宜為4.5%以下,較佳係4.0%。Zr含量在2.5%以下更佳,在2.0%以下又更佳。Zr在鈦合金板中不一定需要,因而在含有合計0.2%以上的Sn及/或Al時,Zr含量可為0%。Zr is a neutral element like Sn, and it is an element that inhibits crystal grain growth by being dissolved in titanium. As long as the Zr content is 0.2% or more, the growth of crystal grains can be stably suppressed. Therefore, the Zr content should be 0.2% or more. The Zr content is preferably 0.3% or more. On the other hand, Zr is an element that stabilizes each phase by solid solution in the α phase and β phase in titanium. If the Zr content is too large, the temperature range in which the two phases of the α phase and the β phase are thermally stable becomes wider, and the β phase becomes easy to precipitate during heating. Since the β phase is corroded more preferentially than the α phase, when a roller with a titanium alloy plate containing the β phase on the surface is used to manufacture copper foil, the β phase will corrode preferentially and cause a macroscopic appearance on the surface of the roller. As a result, the macro image may be transferred to the copper foil. In addition, due to solidification segregation, the strength difference between the parts of the titanium alloy plate may occur, and a macroscopic appearance may be produced when the obtained titanium alloy plate is polished. Therefore, the Zr content is 5.0% or less. The Zr content is preferably 4.5% or less, preferably 4.0%. The Zr content is more preferably 2.5% or less, and even more preferably 2.0% or less. Zr is not necessarily required in the titanium alloy sheet, and therefore, when Sn and/or Al are contained in a total of 0.2% or more, the Zr content may be 0%.
Al為α相穩定化元素,其在α相單相的溫度區下之熱處理中,與Sn或Zr同樣會抑制晶粒成長。只要Al含量在0.2%以上,便可穩定抑制晶粒成長。因此,Al含量宜為0.2%以上。Al含量較佳係在0.5%以上。 另外,Al亦為會使鈦合金板的楊格率增加的元素。藉由楊格率增大,在製造一製造銅箔的滾筒時,在收縮配合芯材與鈦合金板時的收縮配合性提升。藉此,製造銅箔的滾筒的生產性提升。並且,藉由楊格率增大而可均勻地收縮配合,鈦合金板的研磨性提升。結果便可更抑制產生巨觀模樣。 從提高楊格率來提高收縮配合性的觀點看來,宜將Al含量設為大於1.8%。 另一方面,相較於Sn或Zr,Al更會增大鈦合金板的高溫強度。如後所述,在製造本實施形態之鈦合金板時,以控制集合組織為目的而會實施熱軋延直到較低溫度為止。因此,若高溫強度變得過高,熱軋延時之反作用力會變得過大,造成熱軋後鈦合金板的形狀大幅歪曲而鈦合金板變成波浪形狀。因而對於鈦合金板會需要較多後續的矯正,但若在此時被賦予應變則會導入許多差排。結果在將鈦合金板用於滾筒時就變得容易產生巨觀模樣。Al含量若大於7.0%,韌性及加工性便降低,難以製造滾筒。其結果,製造銅箔的滾筒的生產性降低。因此,Al含量要設為7.0%以下。以上述觀點而言,Al含量宜設為3.0%以下,設為2.5%以下較佳。Al在鈦合金板中不一定需要,因而在含有合計0.2%以上的Sn及/或Zr時,Al含量可為0%。Al is an α-phase stabilizing element, and it inhibits crystal grain growth in the same way as Sn or Zr in the heat treatment in the temperature region of the α-phase single phase. As long as the Al content is 0.2% or more, grain growth can be stably suppressed. Therefore, the Al content should be 0.2% or more. The Al content is preferably above 0.5%. In addition, Al is also an element that increases the Young's ratio of the titanium alloy sheet. With the increase in the Young's ratio, the shrink fit of the core material and the titanium alloy plate is improved when manufacturing a copper foil roll. Thereby, the productivity of the roller for manufacturing copper foil is improved. In addition, by increasing the Young's ratio, uniform shrink fit can be achieved, and the abrasiveness of the titanium alloy sheet is improved. As a result, it can be more restrained to produce a macro appearance. From the viewpoint of increasing the Younger ratio to improve the shrinkage compatibility, it is preferable to set the Al content to more than 1.8%. On the other hand, compared to Sn or Zr, Al will increase the high temperature strength of the titanium alloy sheet. As described later, when manufacturing the titanium alloy sheet of the present embodiment, hot rolling is performed to a lower temperature for the purpose of controlling the aggregate structure. Therefore, if the high-temperature strength becomes too high, the reaction force of the hot rolling delay time will become too large, causing the shape of the titanium alloy sheet after hot rolling to be greatly distorted and the titanium alloy sheet to become a wave shape. Therefore, more follow-up corrections are required for the titanium alloy plate, but if strain is applied at this time, many differences will be introduced. As a result, when the titanium alloy plate is used for the drum, it becomes easy to produce a macroscopic appearance. If the Al content is more than 7.0%, toughness and workability are reduced, making it difficult to manufacture the roller. As a result, the productivity of the roller for manufacturing copper foil is reduced. Therefore, the Al content should be 7.0% or less. From the above viewpoint, the Al content is preferably 3.0% or less, and more preferably 2.5% or less. Al is not necessarily required in the titanium alloy sheet, and therefore, when Sn and/or Zr are contained in a total of 0.2% or more, the Al content may be 0%.
此外,Al含量若高,便有Al發生偏析的疑慮。若Al發生偏析,在鈦合金板的部位間硬度及電阻便產生差異。硬度產生了參差的鈦合金板在研磨時於鈦合金板會形成較大凹凸,有時會產生巨觀模樣。並且,會因電阻的參差導致腐蝕速度產生差異,有時會產生巨觀模樣。因此,Al濃度分布以小為佳。 本實施形態之鈦合金板在Al含量大於1.8%的情況下,令Al含量(平均含量)為[Al%]時,Al濃度為([Al%]-0.2)質量%以上且在([Al%]+0.2)質量%以下之區域的面積率宜為90%以上。藉此,可穩定抑制巨觀模樣。In addition, if the Al content is high, there are doubts about Al segregation. If Al segregates, there will be differences in hardness and electrical resistance between parts of the titanium alloy plate. The titanium alloy plate with uneven hardness will form large irregularities on the titanium alloy plate during grinding, and sometimes produce a macroscopic appearance. In addition, the difference in resistance may cause differences in the corrosion rate, sometimes resulting in a macroscopic appearance. Therefore, the Al concentration distribution is preferably small. In the titanium alloy plate of this embodiment, when the Al content is greater than 1.8%, when the Al content (average content) is [Al%], the Al concentration is ([Al%]-0.2) mass% or more and in ([Al %]+0.2) The area ratio of the area below mass% should be 90% or more. Thereby, the macroscopic appearance can be stably suppressed.
Al之偏析的評估係藉由以下方式進行:利用電子探針顯微分析儀(EPMA;Electron Probe Microanalyzer),將光束直徑設為500μm、步距尺寸設為與光束直徑相同的500μm,在從垂直於板厚方向之面的表面起算板厚的1/4位置中,對20mm×20mm以上的區域進行組成分析。並且,為了將組成分析結果換算為合金元素濃度,係分析JIS1種工業用純鈦及作為對象之鈦合金板的平均化學組成與Kα線強度,根據該結果進行線形近似而採用所獲得之檢量線。The evaluation of Al segregation is carried out by the following method: using an electron probe microanalyzer (EPMA; Electron Probe Microanalyzer), the beam diameter is set to 500 μm, the step size is set to 500 μm, which is the same as the beam diameter. In the 1/4 position of the plate thickness from the surface of the plate thickness direction, the composition analysis is performed on the area of 20mm×20mm or more. In addition, in order to convert the composition analysis results into alloy element concentrations, the average chemical composition and Kα line strength of JIS1 industrial pure titanium and the target titanium alloy plate are analyzed, and the linear approximation is performed based on the results, and the obtained inspection quantity is used. line.
另外,在本實施形態之鈦合金板中,令Al含量為[Al%](質量%)、Zr含量為[Zr%](質量%)、Sn含量為[Sn%](質量%)且令O含量為[O%](質量%)時,下述式(1)所示Al當量Aleq宜在7.0(質量%)以下。 Aleq=[Al%]+[Zr%]/6+[Sn%]/3+10×[O%] 式(1) Al當量係表示α相的穩定化程度的指標,Al當量增加則硬度變高,而另一方面韌性降低。藉由使Al當量在7.0質量%以下,可維持韌性且可提升收縮配合性。In addition, in the titanium alloy sheet of this embodiment, the Al content is [Al%] (mass%), the Zr content is [Zr%] (mass%), the Sn content is [Sn%] (mass%), and When the O content is [O%] (mass%), the Al equivalent Aleq represented by the following formula (1) is preferably 7.0 (mass%) or less. Aleq=[Al%]+[Zr%]/6+[Sn%]/3+10×[O%] formula (1) The Al equivalent is an index indicating the degree of stabilization of the α phase. As the Al equivalent increases, the hardness increases, but on the other hand, the toughness decreases. By setting the Al equivalent to 7.0% by mass or less, toughness can be maintained and shrinkage compatibility can be improved.
<O:0.700%以下> O係有助於提升鈦合金板強度且有助於增加表面硬度的元素。然而,若鈦合金板強度變得過高,在矯正時就需要較大的加工而變得容易產生雙晶。並且,表面硬度若變得過大,在將鈦合金板製成滾筒時就難以進行研磨。因此,鈦合金板含有O時,O含量設為0.700%以下。O含量設為0.400%以下為佳。O含量較佳係在0.150%以下,在0.120%以下更佳。由於O在鈦合金板中不一定需要,故其含量下限為0%。然而,難以防止其從熔解原料之海綿鈦或添加元素混入,而實質下限為0.020%。 要利用O含量來獲得提升強度之效果時,O含量宜在0.030%以上。<O: 0.700% or less> O series is an element that helps increase the strength of the titanium alloy plate and helps increase the surface hardness. However, if the strength of the titanium alloy plate becomes too high, a large amount of processing is required during correction, and twin crystals are likely to be produced. In addition, if the surface hardness becomes too large, it becomes difficult to polish when the titanium alloy plate is used as a roller. Therefore, when the titanium alloy sheet contains O, the O content is set to 0.700% or less. The O content is preferably 0.400% or less. The O content is preferably 0.150% or less, more preferably 0.120% or less. Since O is not necessarily required in the titanium alloy plate, the lower limit of its content is 0%. However, it is difficult to prevent it from being mixed in from the sponge titanium of the molten raw material or additional elements, and the actual lower limit is 0.020%. When the O content is to be used to increase the strength, the O content should be above 0.030%.
<Fe:0.500%以下> Fe係會強化β相的元素。在鈦合金板中,若β相的析出量變多就會影響巨觀模樣的生成,故鈦合金板含有Fe時Fe含量上限設為0.500%。Fe含量在0.100%以下為佳,較佳係在0.080%以下。由於Fe在鈦合金板中不一定需要,故其含量下限為0%。然而,在實際製造中難以防止Fe混入,而實質下限為0.001%。<Fe: 0.500% or less> Fe-based elements strengthen the β phase. In the titanium alloy sheet, if the precipitation amount of the β phase increases, it will affect the formation of the macroscopic appearance. Therefore, when the titanium alloy sheet contains Fe, the upper limit of Fe content is set to 0.500%. The Fe content is preferably 0.100% or less, preferably 0.080% or less. Since Fe is not necessarily required in the titanium alloy plate, the lower limit of its content is 0%. However, it is difficult to prevent Fe from mixing in actual production, and the actual lower limit is 0.001%.
<N:0.100%以下> <C:0.080%以下> <H:0.015%以下> 本實施形態之鈦合金板中,可更含有N、C或H作為不純物。 N係會與Ti形成氮化物的元素。若形成氮化物,有時鈦合金板會硬化或脆化。因此,宜極力抑制含有N。在本實施形態之鈦合金板中,N含量設為0.100%以下。N含量在0.080%以下為佳。由於N在鈦合金板中不一定需要,故其含量下限為0%。然而,N係在製造過程中混入的不純物,而亦可將實質的N含量下限設為0.0001%。<N: 0.100% or less> <C: Below 0.080%> <H: 0.015% or less> The titanium alloy plate of this embodiment may further contain N, C, or H as impurities. N is an element that forms nitrides with Ti. If nitrides are formed, sometimes the titanium alloy plate will harden or become brittle. Therefore, it is advisable to suppress N content as much as possible. In the titanium alloy sheet of this embodiment, the N content is set to 0.100% or less. The N content is preferably 0.080% or less. Since N is not necessarily required in the titanium alloy plate, the lower limit of its content is 0%. However, N is an impurity mixed in during the manufacturing process, and the actual lower limit of the N content can also be set to 0.0001%.
C係會與Ti形成碳化物,而與氮化物同樣會使鈦合金板硬化或脆化的元素。為了抑制鈦合金板的硬化或脆化,宜極力減低C含量。在本實施形態之鈦合金板中,C含量設為0.080%以下。C含量在0.050%以下為佳。由於C在鈦合金板中不一定需要,故其含量下限為0%。然而,C係在製造過程中混入的不純物,而亦可將實質的C含量下限設為0.0005%。The C series will form carbides with Ti and, like nitrides, will harden or embrittle the titanium alloy plate. In order to suppress the hardening or embrittlement of the titanium alloy plate, it is advisable to reduce the C content as much as possible. In the titanium alloy sheet of this embodiment, the C content is set to 0.080% or less. The content of C is preferably below 0.050%. Since C is not necessarily required in the titanium alloy plate, the lower limit of its content is 0%. However, C is an impurity mixed in during the manufacturing process, and the actual lower limit of the C content can also be set to 0.0005%.
H係會與Ti形成氫化物的元素。若形成氫化物,有時鈦合金板會脆化。並且有時會因氫化物而產生巨觀模樣。因此,宜極力抑制H含量。在本實施形態之鈦合金板中,H含量設為0.015%以下。H含量在0.010%以下為佳。由於H在鈦合金板中不一定需要,故其含量下限為0%。然而,H係在製造過程中混入的不純物,而亦可將實質的H含量下限設為0.0005%。H is an element that forms a hydride with Ti. If a hydride is formed, the titanium alloy plate may become embrittled. And sometimes due to the hydride, it will produce a huge appearance. Therefore, it is advisable to suppress the H content as much as possible. In the titanium alloy sheet of this embodiment, the H content is set to 0.015% or less. The H content is preferably below 0.010%. Since H is not necessarily required in the titanium alloy plate, the lower limit of its content is 0%. However, H is an impurity mixed in during the manufacturing process, and the actual lower limit of the H content can also be set to 0.0005%.
本實施形態之鈦合金板的化學組成中,剩餘部分包含Ti及不純物,亦可由Ti及不純物所構成。不純物除上述元素以外,若要具體示例則有在精煉步驟中混入的Cl、Na、Mg、Si、Ca及從廢料混入的Mo、Nb、Ta、V、Cr、Mn、Co、Ni、Cu等。不純物只要合計含量在0.50%以下則無問題。 惟,上述不純物中可能包含β相穩定化元素。β相的析出量若變多則會影響巨觀模樣的產生,故β相穩定化元素以少為佳。β相穩定化元素可列舉譬如:V、Mo、Ta、Nb、Cr、Mn、Co、Ni及Cu等。在本實施形態之鈦合金板中,在使不純物含量合計在0.50%以下後,鈦合金板所含β相穩定化元素各自的含量在0.10%以下較佳。In the chemical composition of the titanium alloy plate of this embodiment, the remainder contains Ti and impurities, and may also be composed of Ti and impurities. In addition to the above elements, specific examples of impurities include Cl, Na, Mg, Si, Ca mixed in the refining step and Mo, Nb, Ta, V, Cr, Mn, Co, Ni, Cu, etc. mixed from scrap . As long as the total content of impurities is less than 0.50%, there is no problem. However, the aforementioned impurities may contain β-phase stabilizing elements. If the amount of precipitation of β phase increases, it will affect the production of macroscopic appearance, so it is better to use less β phase stabilizing elements. Examples of β-phase stabilizing elements include V, Mo, Ta, Nb, Cr, Mn, Co, Ni, and Cu. In the titanium alloy sheet of this embodiment, after the total impurity content is made 0.50% or less, the content of each β-phase stabilizing element contained in the titanium alloy sheet is preferably 0.10% or less.
化學組成係利用以下方法求算。 Al、Zr、Sn或Fe、V、Mo、Ta、Nb、Cr、Mn、Co、Ni及Cu等β穩定化元素可利用IPC發光分光分析來測定。O及N可使用氧及氮同時分析裝置,利用非活性氣體熔融、熱傳導率及紅外線吸收法來測定。C可使用碳硫同時分析裝置,利用紅外線吸收法來測定。H則可利用非活性氣體熔融、紅外線吸收法來測定。The chemical composition is calculated by the following method. Β-stabilizing elements such as Al, Zr, Sn or Fe, V, Mo, Ta, Nb, Cr, Mn, Co, Ni, and Cu can be measured by IPC emission spectroscopy. O and N can be measured using an oxygen and nitrogen simultaneous analysis device, using inert gas melting, thermal conductivity, and infrared absorption methods. C can be measured by an infrared absorption method using a simultaneous carbon and sulfur analyzer. H can be measured by inert gas melting and infrared absorption method.
(1.2 金屬組織) 接著,說明本實施形態之鈦合金板的金屬組織。 本實施形態之鈦合金板,其平均結晶粒徑為40μm以下,根據結晶粒徑(μm)的對數之粒徑分布的標準差為0.80以下,且包含結晶結構為六方最密堆積結構之α相,並且α相之[0001]方向相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率為70%以上。 以下,依序詳細說明本實施形態之鈦合金板的金屬組織。(1.2 Metal structure) Next, the metal structure of the titanium alloy sheet of this embodiment will be described. The titanium alloy plate of this embodiment has an average crystal grain size of 40 μm or less, and the standard deviation of the particle size distribution based on the logarithm of the crystal grain size (μm) is 0.80 or less, and contains the α phase whose crystal structure is the hexagonal closest packing structure. And the area ratio of the crystal grains whose angle formed by the [0001] direction of the α phase with respect to the plate thickness direction is 0° or more and 40° or less is 70% or more. Hereinafter, the metal structure of the titanium alloy sheet of this embodiment will be explained in detail in order.
(1.2.1 金屬組織之相構成) 本實施形態之鈦合金板的金屬組織包含具有六方最密堆積結構之α相。本實施形態之鈦合金板的金屬組織除α相以外有時還包含β相。然而,β相會較α相更優先腐蝕。因此,在將表面具有包含β相之鈦合金板的鈦滾筒用於製造銅箔時,β相會優先腐蝕而造成滾筒表面產生巨觀模樣,該巨觀模樣可能會轉印到銅箔。另外,β相凝集而生成時,鈦合金板的集合組織可能會改變。因此,β相以少為佳。 本實施形態之鈦合金板中,α相的體積率宜為98.0%以上,較佳為99.0%以上,100%(α相單相)更佳。(1.2.1 Phase composition of metal structure) The metal structure of the titanium alloy sheet of this embodiment includes an α phase having a hexagonal closest packing structure. The metal structure of the titanium alloy sheet of this embodiment may include a β phase in addition to the α phase. However, the β phase will corrode more preferentially than the α phase. Therefore, when a titanium roller with a titanium alloy plate containing β phase on the surface is used to manufacture copper foil, the β phase will preferentially corrode and cause a macroscopic appearance on the surface of the drum, which may be transferred to the copper foil. In addition, when the β phase is aggregated and formed, the aggregate structure of the titanium alloy sheet may change. Therefore, less β phase is better. In the titanium alloy sheet of this embodiment, the volume ratio of the α phase is preferably 98.0% or more, more preferably 99.0% or more, and more preferably 100% (α-phase single phase).
另外,鈦合金板的金屬組織宜不包含未再結晶部。所述未再結晶部一般而言較粗大而可能成為巨觀模樣的原因。故,鈦合金板的金屬組織宜為完全再結晶組織。所謂「再結晶組織」設為由長寬比小於2.0之晶粒所構成的組織。未再結晶晶粒之有無可利用以下方法來確認。亦即,以長寬比在2.0以上之晶粒作為未再結晶晶粒並確認其有無。具體而言,係將經裁切鈦合金板而成之截面進行化學研磨後,利用電子背向散射繞射法(EBSD(Electron Back Scattering Diffraction Pattern)),在1~2mm×1~2mm之區域中以1~2µm步距進行測定並測定2~10視野左右。然後,以藉由EBSD測得之5°以上方位差的邊界作為結晶晶界,並以該結晶晶界包圍之範圍作為晶粒,求算晶粒之長軸及短軸後,算出將長軸除以短軸而得之值(長軸/短軸)作為長寬比。長軸係指在連結α相之晶界上任意2點的線條當中長度最長者,短軸則指與長軸正交且連結晶界上任意2點的線條當中長度最長者。 如上述之α相單相金屬組織可藉由如上所述之鈦合金板的化學組成來達成。In addition, the metal structure of the titanium alloy sheet preferably does not include non-recrystallized parts. The unrecrystallized part is generally coarse and may cause the macroscopic appearance. Therefore, the metal structure of the titanium alloy sheet is preferably a completely recrystallized structure. The so-called "recrystallized structure" is defined as a structure composed of crystal grains with an aspect ratio of less than 2.0. The presence or absence of unrecrystallized grains can be confirmed by the following method. That is, crystal grains with an aspect ratio of 2.0 or more are regarded as unrecrystallized crystal grains and the presence or absence of the crystal grains is confirmed. Specifically, the cross section of the titanium alloy plate is chemically polished, and then the electron backscattering diffraction method (EBSD (Electron Back Scattering Diffraction Pattern)) is used in the area of 1~2mm×1~2mm. Measured in 1~2µm steps and measured about 2~10 field of view. Then, the boundary of the upper level difference of 5° measured by EBSD is used as the crystal grain boundary, and the range surrounded by the crystal grain boundary is used as the crystal grain. After calculating the long axis and the short axis of the crystal grain, the long axis is calculated The value obtained by dividing by the minor axis (major axis/minor axis) is used as the aspect ratio. The long axis refers to the longest line connecting any two points on the grain boundary of the α phase, and the short axis refers to the longest line perpendicular to the long axis and connecting any two points on the crystal boundary. The α-phase single-phase metal structure as described above can be achieved by the chemical composition of the titanium alloy plate as described above.
構成鈦合金板的金屬組織之各相的體積率,可利用附屬於SEM(Scaning Electron Microscopy)之EPMA(Electron Probe Microanalyzer)(SEM/EPMA)容易地測定及算出。詳細來說,對於板材之任意截面,在研磨至鏡面後,利用SEM/EPMA以100倍之倍率在從表面起算板厚的1/4位置的1mm×1mm之區域中以1~2µm步距進行測定並測定2~5視野左右,來測定Fe或其他β相穩定化元素之濃度分布。將該Fe濃度或β相穩定化元素的合計濃度較測定範圍的平均濃度高1質量%以上的點(濃化部)定義為β相,求算面積率。將面積率與體積率視為相等,而以所得面積率作為β相的體積率,且以未有β相穩定化元素濃化的部分(濃化部以外)的面積率作為α相的體積率。The volume ratio of each phase of the metal structure constituting the titanium alloy plate can be easily measured and calculated using EPMA (Electron Probe Microanalyzer) (SEM/EPMA) attached to SEM (Scaning Electron Microscopy). In detail, for any section of the board, after grinding to the mirror surface, use SEM/EPMA at a magnification of 100 times in the area of 1mm×1mm at the 1/4 position of the board thickness from the surface in 1~2μm steps. Measure and measure around 2~5 fields of view to determine the concentration distribution of Fe or other β-phase stabilizing elements. The point (concentrated part) where the Fe concentration or the total concentration of β-phase stabilizing elements is higher than the average concentration of the measurement range by 1% by mass or more is defined as the β phase, and the area ratio is calculated. The area ratio and the volume ratio are considered equal, and the obtained area ratio is taken as the volume ratio of the β phase, and the area ratio of the portion where the β phase stabilizing element is not concentrated (other than the concentrated part) is taken as the volume ratio of the α phase .
(1.2.2 晶粒的平均粒徑及粒徑分布) 接下來,說明本實施形態之鈦合金板的金屬組織中所含晶粒的平均粒徑及粒徑分布。 首先,鈦合金板的金屬組織中晶粒的粒徑(結晶粒徑)若粗大,該晶粒本身就會成為模樣而模樣會轉印至銅箔,故結晶粒徑宜微細。鈦合金板的金屬組織中晶粒的平均結晶粒徑若大於40µm,該晶粒本身便成為模樣而模樣就轉印至銅箔。因此,鈦合金板的金屬組織中晶粒的平均結晶粒徑設為40µm以下。藉此,晶粒會變得夠微細而可抑制產生巨觀模樣。鈦合金板的金屬組織中晶粒的平均結晶粒徑宜為38µm以下,較佳係在35µm以下。 另一方面,鈦合金板的金屬組織中晶粒的平均結晶粒徑之下限值並無特別限定。然而,在晶粒非常小的情況下,在熱處理時恐會產生未再結晶部。因此,晶粒的平均結晶粒徑宜為3µm以上,較佳係在5µm以上,在10µm以上更佳。(1.2.2 ``Average particle size and particle size distribution of crystal grains) Next, the average particle size and particle size distribution of the crystal grains contained in the metallic structure of the titanium alloy sheet of this embodiment will be described. First, if the grain size (crystal grain size) of the crystal grains in the metallic structure of the titanium alloy sheet is coarse, the grain itself will become a pattern and the pattern will be transferred to the copper foil, so the crystal grain size is preferably fine. If the average crystal grain size of the crystal grains in the metallic structure of the titanium alloy plate is greater than 40 µm, the crystal grains themselves become a pattern and the pattern is transferred to the copper foil. Therefore, the average crystal grain size of the crystal grains in the metallic structure of the titanium alloy sheet is set to 40 µm or less. In this way, the crystal grains become fine enough to suppress the appearance of macroscopic appearance. The average crystal grain size of the crystal grains in the metallic structure of the titanium alloy plate is preferably 38 µm or less, preferably 35 µm or less. On the other hand, the lower limit of the average crystal grain size of the crystal grains in the metallic structure of the titanium alloy sheet is not particularly limited. However, in the case where the crystal grains are very small, unrecrystallized parts may be generated during the heat treatment. Therefore, the average crystal grain size of the crystal grains is preferably 3 μm or more, preferably 5 μm or more, and more preferably 10 μm or more.
另外,金屬組織中存在β相時,β相的平均結晶粒徑宜為0.5μm以下。β相粒徑大時,可能會因腐蝕或研磨造成鈦合金板形成較大凹凸。藉由使β相的平均結晶粒徑在0.5μm以下,可抑制因腐蝕或研磨所致凹凸的形成。In addition, when the β phase is present in the metal structure, the average crystal grain size of the β phase is preferably 0.5 μm or less. When the β phase particle size is large, the titanium alloy plate may form large unevenness due to corrosion or grinding. By setting the average crystal grain size of the β phase to 0.5 μm or less, the formation of unevenness due to corrosion or polishing can be suppressed.
此外,本發明人等理解到:單憑鈦合金板的金屬組織的晶粒微細,並無法充分抑制巨觀模樣。亦即,即便鈦合金板的金屬組織的晶粒微細,當粒徑分布較廣時仍會存在粗大晶粒。若存在如上述粗大晶粒與微細晶粒混合存在之部位,便可能因粒徑的差而產生巨觀模樣。因此,本發明人等發現在抑制產生巨觀模樣之方面,重要的係鈦合金板的金屬組織的晶粒不僅要微細且粒徑分布要窄、亦即晶粒粒徑均一。In addition, the inventors of the present invention have understood that the fine crystal grains of the metallic structure of the titanium alloy sheet alone cannot sufficiently suppress the macroscopic appearance. That is, even if the crystal grains of the metallic structure of the titanium alloy sheet are fine, coarse crystal grains still exist when the particle size distribution is wide. If there are places where the coarse crystal grains and the fine crystal grains are mixed as described above, a macroscopic appearance may be produced due to the difference in particle size. Therefore, the inventors of the present invention found that in order to suppress the generation of macroscopic appearances, it is important that the crystal grains of the metallic structure of the titanium alloy plate should not only be fine, but also have a narrow particle size distribution, that is, a uniform crystal grain size.
具體而言,在本實施形態之鈦合金板中,根據各個結晶粒徑(µm)的對數之粒徑分布的標準差為0.80以下。藉由晶粒滿足如上所述之平均粒徑及所述粒徑分布的標準差,金屬組織中之晶粒會變得夠微細且均一。結果在將鈦合金板用於滾筒時就會抑制產生巨觀模樣。Specifically, in the titanium alloy sheet of this embodiment, the standard deviation of the particle size distribution based on the logarithm of each crystal particle size (µm) is 0.80 or less. As the crystal grains satisfy the above-mentioned average particle size and the standard deviation of the particle size distribution, the crystal grains in the metal structure become sufficiently fine and uniform. As a result, when the titanium alloy plate is used for the drum, the macroscopic appearance is suppressed.
相對於此,若根據結晶粒徑(µm)的對數之粒徑分布的標準差大於0.80,則即便在滿足如上述之平均結晶粒徑的情況下仍會產生粗大晶粒,而在將鈦合金板用於滾筒時變得容易產生巨觀模樣。On the other hand, if the standard deviation of the particle size distribution based on the logarithm of the crystal grain size (µm) is greater than 0.80, coarse crystal grains will still be produced even when the average crystal grain size as described above is satisfied, and the titanium alloy When the plate is used in the roller, it becomes easy to produce a macro look.
根據結晶粒徑(µm)的對數之粒徑分布的標準差,在令平均結晶粒徑為D(µm)時,宜為界限值(0.35×lnD-0.42)以下。According to the standard deviation of the logarithm of the crystal grain size (µm), when the average grain size is D (µm), it should be less than the limit value (0.35×lnD-0.42).
鈦合金板的金屬組織中結晶的平均結晶粒徑及粒徑分布的標準差,可如以下方式進行測定並算出。具體而言,係將經裁切鈦合金板而成之截面進行化學研磨後,利用電子背向散射繞射法(EBSD(Electron Back Scattering Diffraction Pattern)),在1~2mm×1~2mm之區域中以1~2µm步距進行測定並測定2~10視野左右。針對結晶粒徑,係以藉由EBSD測得之5°以上方位差的邊界作為晶界,並以該晶界包圍之範圍作為晶粒,從晶粒面積求算圓等效粒徑(面積A=π×(粒徑D/2)2 ),以該個數基準的平均值作為平均結晶粒徑。並且,可從結晶粒徑分布算出對數常態分布之標準差σ。此時,將各晶粒之圓等效粒徑D轉換成自然對數lnD,求算所得轉換值的分布的標準差σ。 一般已知金屬材料的結晶粒徑分布係遵循對數常態分布。因此,在算出如上述之粒徑分布的標準差時,亦可將所得粒徑分布正規化為對數常態分布,再從經正規化之對數常態分布算出標準差。The average crystal grain size and the standard deviation of the grain size distribution of the crystals in the metallic structure of the titanium alloy sheet can be measured and calculated as follows. Specifically, the cross-section of the titanium alloy plate is chemically polished, and the electron backscattering diffraction method (EBSD (Electron Back Scattering Diffraction Pattern)) is used in the area of 1~2mm×1~2mm. Measured in 1~2µm steps and measured about 2~10 field of view. Regarding the crystal grain size, the boundary of 5° above the height difference measured by EBSD is used as the grain boundary, and the range surrounded by the grain boundary is taken as the crystal grain, and the circle equivalent grain size (area A) is calculated from the grain area. =π×(particle diameter D/2) 2 ), and the average value based on the number is regarded as the average crystal particle diameter. In addition, the standard deviation σ of the logarithmic normal distribution can be calculated from the crystal particle size distribution. At this time, the circle-equivalent particle diameter D of each crystal grain is converted into a natural logarithm lnD, and the standard deviation σ of the distribution of the obtained conversion value is calculated. It is generally known that the crystal particle size distribution of metallic materials follows a logarithmic normal distribution. Therefore, when calculating the standard deviation of the particle size distribution as described above, the obtained particle size distribution can also be normalized to a logarithmic normal distribution, and then the standard deviation can be calculated from the normalized logarithmic normal distribution.
(1.2.3 集合組織) <α相之[0001]方向相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率為70%以上> 鈦的α相的結晶結構具有六方最密堆積結構(hexagonal close-packed;hcp)。關於hcp結構的鈦,由結晶方位所致之物性的各向異性大。具體而言,在hcp結構的鈦中,在平行於[0001]方向(以下亦稱為c軸方向)之方向上強度高,越接近垂直於c軸方向之方向,強度就越低。因此,即使鈦合金板滿足如上述之晶粒的粒徑分布,譬如若產生結晶方位不同之結晶的集合體,在兩集合體之間加工性不同,因而在製造一製造銅箔的滾筒時仍會有研磨時的加工性不同的情況。在此情況下,恐會在所得滾筒中以接近晶粒之尺寸的巨觀模樣被辨識出來。故,宜藉由盡可能使鈦合金板之集合組織的結晶方位聚集,來抑制產生巨觀模樣。(1.2.3 collective organization) <The area ratio of the crystal grains whose angle formed by the [0001] direction of the α phase with respect to the plate thickness direction is 0° or more and 40° or less is 70% or more> The crystal structure of the α phase of titanium has a hexagonal close-packed structure (hexagonal close-packed; hcp). Regarding titanium of the hcp structure, the physical anisotropy due to the crystal orientation is large. Specifically, in titanium with the hcp structure, the strength is high in the direction parallel to the [0001] direction (hereinafter also referred to as the c-axis direction), and the closer to the direction perpendicular to the c-axis direction, the lower the strength. Therefore, even if the titanium alloy plate satisfies the above-mentioned crystal grain size distribution, for example, if an aggregate of crystals with different crystal orientations is produced, the workability between the two aggregates is different, so it is still possible to manufacture a roll for manufacturing copper foil. The workability during grinding may be different. In this case, it may be recognized in the resulting roller as a macroscopic appearance close to the size of the crystal grain. Therefore, it is advisable to gather the crystal orientation of the assembled structure of the titanium alloy plate as much as possible to suppress the macroscopic appearance.
並且,hcp結構的鈦在平行於c軸方向之方向上強度高。因此,若研磨相對於c軸呈垂直的面,便不易產生研磨後的模樣。由上述觀點看來,針對鈦合金板之集合組織的結晶方位,宜將鈦合金板的晶格的c軸配置成垂直於研磨面,亦即配置成與垂直於鈦合金板表面之厚度方向(板面的法線方向:ND)並行。In addition, titanium with the hcp structure has high strength in a direction parallel to the c-axis direction. Therefore, if a surface that is perpendicular to the c-axis is polished, it is difficult to produce a polished appearance. From the above point of view, for the crystal orientation of the aggregate structure of the titanium alloy plate, it is advisable to arrange the c-axis of the crystal lattice of the titanium alloy plate to be perpendicular to the polishing surface, that is, to arrange it to be perpendicular to the thickness direction of the surface of the titanium alloy plate ( The normal direction of the board surface: ND) parallel.
在本實施形態之鈦合金板中,板面的法線方向(ND)與α相的c軸([0001]方向)所構成之角度θ為40°以下之晶粒的面積率,相對於所有晶粒的面積為70%以上。角度θ係圖4所示角度。 藉由ND與α相的c軸所構成之角度θ為40°以下之晶粒的面積率為70%以上,結晶方位就會聚集,可縮小相鄰接之結晶間的結晶方位差。其結果,可抑制巨觀模樣。角度θ為40°以下之晶粒的面積率相對於所有晶粒的面積率宜在72%以上。上述面積率越高越好。因此,不特別訂定面積率的上限,然實質上可製造至95%左右。In the titanium alloy plate of this embodiment, the area ratio of crystal grains whose angle θ formed by the normal direction (ND) of the plate surface and the c-axis ([0001] direction) of the α phase is 40° or less is relative to all The area of the crystal grain is more than 70%. The angle θ is the angle shown in FIG. 4. The area ratio of crystal grains with an angle θ of 40° or less formed by the ND and the c-axis of the α phase is 70% or more, and the crystal orientations are gathered, and the crystal orientation difference between adjacent crystals can be reduced. As a result, macroscopic appearance can be suppressed. The area ratio of crystal grains with an angle θ of 40° or less is preferably 72% or more relative to the area ratio of all crystal grains. The higher the above-mentioned area ratio, the better. Therefore, the upper limit of the area ratio is not specifically set, but it can be manufactured to about 95%.
α相的c軸相對於板厚方向所構成之角度θ,可利用從板面的法線方向(ND)之(0001)極圖算出。(0001)極圖可藉由將鈦合金板之試樣的觀察表面進行化學研磨後,使用EBSD進行結晶方位解析而獲得。具體而言,例如使用EBSD以1~2μm之間隔掃描1~2mm×1~2mm之區域,藉此獲得如圖5所示之結晶方位分布圖。 例如,圖5中白色所示區域G1顯示ND與α相的c軸所構成之角度θ為40°以下之晶粒,黑色所示區域G2顯示與α相的c軸所構成之角度θ大於40°且小於60°之晶粒,灰色所示區域G3則顯示與α相的c軸所構成之角度θ大於60°且在90°以下之晶粒。然後,藉由結晶方位解析可作成(0001)極圖。如圖6所示,在(0001)極圖中,虛線b1所包圍的區域R1係板厚方向(ND)與晶粒的c軸所構成之角度θ為40°以下之區域,虛線b1與虛線b2所包圍的區域R2係角度θ大於40°且小於60°之區域,較虛線b2更外側的區域則係角度θ為60°以上且在90°以下之區域。The angle θ formed by the c-axis of the α phase with respect to the plate thickness direction can be calculated from the (0001) pole figure in the normal direction (ND) of the plate surface. The (0001) pole figure can be obtained by chemically polishing the observation surface of a titanium alloy plate sample, and then performing crystal orientation analysis using EBSD. Specifically, for example, using EBSD to scan an area of 1~2mm×1~2mm at intervals of 1~2μm, thereby obtaining the crystal orientation distribution map as shown in FIG. 5. For example, the white area G1 in FIG. 5 shows crystal grains whose angle θ formed by the ND and the c axis of the α phase is less than 40°, and the black area G2 shows the angle θ formed by the c axis of the α phase greater than 40°. ° and less than 60°, the gray area G3 shows the angle θ formed by the c axis of the α phase is greater than 60° and less than 90°. Then, the (0001) pole figure can be created by analyzing the crystal orientation. As shown in Figure 6, in the (0001) pole figure, the area R1 surrounded by the dotted line b1 is the area where the angle θ formed by the thickness direction (ND) and the c-axis of the crystal grain is less than 40°, the dotted line b1 and the dotted line The area R2 surrounded by b2 is an area where the angle θ is greater than 40° and less than 60°, and the area outside of the dotted line b2 is an area where the angle θ is 60° or more and 90° or less.
鈦合金板的板厚方向(ND)與α相的c軸所構成之角度θ為40°以下之晶粒的面積率,可如以下方式算出。將經裁切鈦合金板而成之截面進行化學研磨後,利用EBSD進行結晶方位解析。並且分別針對鈦合金板表面下部及板厚中央部,在1~2mm×1~2mm之區域中以1~2μm步距進行測定並測定2~10視野左右。關於該數據,使用TSL Solutions製之OIM Analysis軟體選出ND與c軸所構成之角度在40°以下之測定點數據。並根據以上,算出鈦合金板的板厚方向(ND)與α相的c軸所構成之角度θ為40°以下之晶粒的面積率。The area ratio of crystal grains where the angle θ formed by the thickness direction (ND) of the titanium alloy sheet and the c axis of the α phase is 40° or less can be calculated as follows. After chemically polishing the cross section of the cut titanium alloy plate, EBSD is used to analyze the crystal orientation. And for the lower part of the surface of the titanium alloy plate and the central part of the thickness of the titanium alloy plate, the measurement is performed in a 1~2mm×1~2mm area with a step of 1~2μm and a field of view of about 2~10 is measured. Regarding the data, use OIM Analysis software manufactured by TSL Solutions to select the measurement point data whose angle formed by the ND and the c axis is below 40°. Based on the above, the area ratio of crystal grains where the angle θ formed by the thickness direction (ND) of the titanium alloy sheet and the c axis of the α phase is 40° or less is calculated.
<具有在從板面的法線方向之(0001)極圖中,聚集度的尖峰存在於從板面的法線方向起30°以內且(0001)面之最大聚集度在4.0以上的集合組織,該聚集度的尖峰係藉由電子背向散射繞射(EBSD)法之採用球諧函數法所得極圖的織構(Texture)解析(展開指數=16、高斯半值寬=5°)算出><With in the (0001) pole figure from the normal direction of the plate surface, the peak of the concentration exists within 30° from the normal direction of the plate surface and the maximum concentration of the (0001) surface is 4.0 or more. , The concentration peak is calculated by the texture analysis of the pole figure obtained by the spherical harmonic function method of the electron backscatter diffraction (EBSD) method (expansion index=16, Gaussian half-value width=5°) >
本實施形態之鈦合金板宜具有以下集合組織:在從板面(若為軋延材則係軋延面)的法線方向(ND)之(0001)極圖中,晶粒的聚集度的尖峰存在於從板面的法線方向(TD)起30°以內,且最大聚集度在4.0以上之集合組織。藉此,可充分使晶粒的c軸更聚集在接近鈦合金板厚度方向(ND)的部分,而在將鈦合金板用於製造銅箔的滾筒時會更抑制產生因結晶方位差所致之模樣。 藉由軋延等,晶粒的聚集度的尖峰容易往與最終軋延方向呈直角的方向(最終軋延寬度方向(TD))傾斜。因此,在最終軋延方向明確的情況下,在從板面的法線方向(ND)之(0001)極圖中,晶粒的聚集度的尖峰只要從板面的法線方向(ND)起算存在於在最終軋延寬度方向(TD)上30°以內即可。The titanium alloy sheet of this embodiment preferably has the following aggregate structure: in the (0001) pole figure from the normal direction (ND) of the sheet surface (or the rolled surface if it is a rolled material), the degree of aggregation of crystal grains The sharp peaks exist in the collective tissue within 30° from the normal direction (TD) of the board surface, and the maximum concentration is above 4.0. As a result, the c-axis of the crystal grains can be more concentrated in the part close to the thickness direction (ND) of the titanium alloy plate, and when the titanium alloy plate is used for the production of copper foil rolls, the occurrence of crystal orientation differences can be more suppressed. What it looks like. By rolling or the like, the peak of the degree of aggregation of crystal grains tends to be inclined in a direction (final rolling width direction (TD)) at right angles to the final rolling direction. Therefore, when the final rolling direction is clear, in the (0001) pole figure from the normal direction (ND) of the plate surface, the peak of the degree of crystal grain aggregation only needs to be calculated from the normal direction (ND) of the plate surface. It is sufficient to exist within 30° in the final rolling width direction (TD).
(0001)極圖可藉由將鈦合金板之試樣的觀察表面進行化學研磨後,使用EBSD進行結晶方位解析而獲得。譬如,可如上述以1~2µm間隔(步距)掃描1~2mm×1~2mm之區域,來作成(0001)極圖。此時,等高線最高的位置係聚集度的尖峰位置,以尖峰位置當中聚集度最大的值作為最大聚集度。The (0001) pole figure can be obtained by chemically polishing the observation surface of a titanium alloy plate sample, and then performing crystal orientation analysis using EBSD. For example, you can scan an area of 1~2mm×1~2mm at 1~2µm intervals (steps) as described above to create a (0001) pole figure. At this time, the position with the highest contour line is the peak position of the concentration degree, and the maximum concentration value among the peak positions is taken as the maximum concentration degree.
圖1顯示從本實施形態之鈦合金板之軋延面且從法線方向(ND)之(0001)極圖之一例。在圖1中,所檢測出之極點會依據最終軋延方向(RD)及往最終軋延寬度方向(TD)之傾斜來聚集,並且在(0001)極圖中繪製有聚集度的等高線。並且,圖1中,等高線變得最高的部位會係晶粒的聚集度的尖峰P1、P2。因此,在本實施形態中,晶粒的尖峰P1、P2分別存在於從ND(中心)起算30°以內。譬如當係尖峰P1時,圖中a即在30°以內(如圖1之P1,有時尖峰位置會稍微偏離TD方向,但只要係偏離10°以內則可容許,且a在30°以內即可)。此外,最大聚集度為4.0以上。通常,最大聚集度會係晶粒的尖峰P1或P2的聚集度。Fig. 1 shows an example of the (0001) pole figure from the rolling surface of the titanium alloy sheet of this embodiment and from the normal direction (ND). In Figure 1, the detected poles will be gathered according to the final rolling direction (RD) and the inclination to the final rolling width direction (TD), and a contour line of concentration is drawn in the (0001) pole map. In addition, in FIG. 1, the locations where the contour lines become the highest are the peaks P1 and P2 of the degree of aggregation of crystal grains. Therefore, in this embodiment, the peaks P1 and P2 of the crystal grains respectively exist within 30° from ND (center). For example, when the peak is P1, a in the figure is within 30° (P1 in Figure 1, sometimes the peak position will deviate slightly from the TD direction, but as long as the deviation is within 10°, it can be tolerated, and a is within 30°. can). In addition, the maximum aggregation degree is 4.0 or more. Generally, the maximum degree of aggregation will be the degree of aggregation of the peaks P1 or P2 of the crystal grains.
相對於此,在(0001)極圖中,晶粒的聚集度的尖峰相對於最終軋延寬度方向(TD)不存在於30°以內時,結晶方位不同的晶粒變得容易相鄰接,而變得容易產生可視辨的巨觀模樣。具體而言,譬如在通常之單軸軋延之鈦熱軋延板中,通常係形成聚集度在以下部位達尖峰之集合組織:相對於ND,hcp結構之c軸在最終軋延寬度方向(TD)上傾斜35~40°左右之部位。然而,尖峰在此位置的情況下,結晶方位會分布到更傾斜15~20°的位置,因此會有結晶方位不同的晶粒相鄰接的情形,而變得容易產生巨觀模樣。In contrast, in the (0001) pole figure, when the peak of the degree of crystal grain aggregation does not exist within 30° with respect to the final rolling width direction (TD), the crystal grains with different crystal orientations are likely to be adjacent to each other. And it becomes easy to produce a visually distinguishable look. Specifically, for example, in the normal uniaxially rolled titanium hot-rolled sheet, the aggregate structure is usually formed with the concentration reaching the peak at the following position: relative to ND, the c-axis of the hcp structure is in the final rolling width direction ( TD) The position with an upward incline of about 35~40°. However, when the peak is at this position, the crystal orientation will be more inclined by 15-20°, so there will be cases where crystal grains with different crystal orientations are adjacent to each other, and it becomes easy to produce a macroscopic appearance.
較佳之最大聚集度為4.0以上。藉此,結晶方位會充分聚集,可縮小相鄰接之結晶間的結晶方位差。最大聚集度宜為4.0以上,而以更加抑制產生巨觀模樣為目的時較佳係在5.0以上,在6.0以上更佳。 最大聚集度越大越好,因此上限並未限定,而例如在透過熱軋延來控制結晶方位時15~20左右可成為上限。Preferably, the maximum degree of aggregation is 4.0 or more. In this way, the crystal orientations are fully gathered, and the crystal orientation difference between adjacent crystals can be reduced. The maximum aggregation degree is preferably 4.0 or more, and for the purpose of suppressing the generation of macroscopic appearance, it is preferably 5.0 or more, and more preferably 6.0 or more. The larger the maximum degree of aggregation, the better, so the upper limit is not limited, and for example, about 15-20 may be the upper limit when the crystal orientation is controlled by hot rolling.
(0001)極圖之特定方位的聚集度表示:具有該方位之晶粒的存在頻率相對於具有完全隨機方位分布之組織(聚集度1)為多少倍。該聚集度可利用電子背向散射繞射(EBSD)法之採用球諧函數法所得極圖之織構(Texture)解析來算出(展開指數=16,高斯半值寬=5°)。具體而言,係將經裁切鈦合金板而成之截面進行化學研磨後,利用EBSD法在1~2mm×1~2mm之區域中以1~2µm步距進行測定並測定2~10視野左右。使用TSL Solutions製之OIM Analysis軟體,藉由採用球諧函數法之極圖之織構(Texture)解析來算出該數據。(0001) The degree of aggregation of a specific orientation of the pole figure indicates: how many times the frequency of existence of crystal grains with this orientation is relative to the organization with a completely random orientation distribution (degree of aggregation 1). The degree of aggregation can be calculated using the texture analysis of the pole figure obtained by the spherical harmonic function method of the electron backscatter diffraction (EBSD) method (expansion index=16, Gaussian half-value width=5°). Specifically, after chemically polishing the cross section of the cut titanium alloy plate, the EBSD method is used to measure in a 1~2mm×1~2mm area with a step of 1~2μm, and the field of view is about 2~10. . Use the OIM Analysis software manufactured by TSL Solutions to calculate the data by analyzing the texture of the pole figure using the spherical harmonic function method.
(1.2.4 雙晶) 鈦在塑性變形時有時會發生雙晶變形。雙晶變形除化學組成以外也與結晶粒徑相關,粒徑越大越容易發生。因此,藉由產生雙晶,會有外觀的晶粒分布變得均一的情形。 另一方面,若發生雙晶變形,結晶方位差會變大,進而結晶方位差異甚大之晶粒就會鄰接,在該邊界上研磨性改變而會被辨識為模樣。因此,宜盡可能抑制雙晶。(1.2.4 Double crystal) Titanium sometimes undergoes twin-crystal deformation during plastic deformation. In addition to the chemical composition, twin deformation is also related to the crystal grain size, and the larger the grain size, the more likely it is to occur. Therefore, by generating twin crystals, the grain distribution of the appearance may become uniform. On the other hand, if the twin crystals are deformed, the crystal orientation difference will increase, and the crystal grains with a large difference in crystal orientation will be adjacent, and the abrasiveness will be changed at the boundary, and the pattern will be recognized. Therefore, it is advisable to suppress twin crystals as much as possible.
具體而言,關於本實施形態之鈦合金板,在觀察板厚方向截面時,在從表面起算板厚1/4的位置上,雙晶晶界長度相對於板厚截面之總結晶晶界長度的比率宜為5.0%以下。藉此,可將起因於雙晶之巨觀模樣減低至無法辨識之水準。雙晶晶界長度相對於總結晶晶界長度的比率較佳在3.0%以下,在1.0%以下更佳。上述比率之下限可為0%,但因鈦合金板之矯正等加工而無法避免地會發生雙晶變形,故要完全排除雙晶實為難事。為了減少雙晶,重要的係要減少矯正量,譬如盡可能地使完工之板形狀平坦即為有效之舉。Specifically, regarding the titanium alloy plate of the present embodiment, when observing the cross section in the thickness direction, the double crystal grain boundary length is relative to the total crystal grain boundary length of the plate thickness section at a position of 1/4 of the plate thickness from the surface The ratio should be less than 5.0%. In this way, the macroscopic appearance caused by the twin crystals can be reduced to an unrecognizable level. The ratio of the twin grain boundary length to the total crystal grain boundary length is preferably 3.0% or less, and more preferably 1.0% or less. The lower limit of the above ratio can be 0%, but due to the correction of the titanium alloy plate and other processing, the twin crystal deformation will inevitably occur, so it is difficult to completely eliminate the twin crystal. In order to reduce twin crystals, it is important to reduce the amount of correction. For example, it is effective to make the finished plate shape as flat as possible.
要算出上述比率時,板厚截面之總結晶晶界長度及雙晶晶界長度可如以下方式求算。首先,將鈦合金板之試樣的觀察截面(厚度方向截面)進行化學研磨後,使用電子背向散射繞射法進行結晶方位解析。在從試樣之鈦合金板表面起算板厚的1/4位置中,以1~2µm之間隔掃描1~2mm×1~2mm之區域,並使用TSL Solutions製之OIM Analysis軟體作成反極圖分布圖(IPF:inverse pole figure)。此時,將以下視為雙晶界面:在鈦產生的(10-12)雙晶、(10-11)雙晶、(11-21)雙晶及(11-22)雙晶之旋轉軸、及從結晶方位差(旋轉角)的理論值起2°以內(例如,若為(10-12)雙晶,旋轉軸及結晶方位差(旋轉角)的理論值分別為<11-20>及85°)。然後,以結晶方位差(旋轉角)在2°以上之晶界作為總結晶晶界長度,算出雙晶晶界長度相對於總結晶晶界長度之比率。觀察從表面起算板厚的1/4位置中之雙晶晶界的原因在於:該位置可充分代表鈦合金板之組織。並且還因為鈦合金板表面可能因研磨等而無法充分代表組織。To calculate the above ratio, the total crystal grain boundary length and the twin crystal grain boundary length of the thickness section can be calculated as follows. First, after chemically polishing the observation cross section (thickness direction cross section) of the sample of the titanium alloy plate, the crystal orientation analysis was performed using the electron backscatter diffraction method. Scan the area of 1~2mm×1~2mm at intervals of 1~2μm in the 1/4 position of the plate thickness from the surface of the titanium alloy plate of the sample, and use the OIM Analysis software made by TSL Solutions to create the inverse pole map distribution Figure (IPF: inverse pole figure). At this time, consider the following as the twin crystal interface: the rotation axis of (10-12) twin crystal, (10-11) twin crystal, (11-21) twin crystal and (11-22) twin crystal produced in titanium, And within 2° from the theoretical value of the crystal orientation difference (rotation angle) (for example, if it is a (10-12) twin crystal, the theoretical values of the rotation axis and the crystal orientation difference (rotation angle)) are respectively <11-20> and 85°). Then, the grain boundary with a crystal orientation difference (rotation angle) of 2° or more was taken as the total crystal grain boundary length, and the ratio of the twin grain boundary length to the total crystal grain boundary length was calculated. The reason for observing the twin grain boundary in the 1/4 position of the plate thickness from the surface is that the position can fully represent the structure of the titanium alloy plate. And because the surface of the titanium alloy plate may not be able to fully represent the structure due to grinding or the like.
(1.3 表面硬度) 鈦合金板之成為滾筒表面之面的表面硬度(維氏硬度)並無特別限定,以HV110以上為佳。藉此,在利用鈦合金板來製造滾筒並研磨表面時,可進行均勻的研磨而能夠更加抑制巨觀模樣。鈦合金板的表面硬度(維氏硬度)較佳係在HV112以上,在HV115以上則更佳。 另外,鈦合金板之成為滾筒表面之面的表面硬度(維氏硬度)的上限並無特別限定,然而若表面硬度大於HV350,研磨次數就會增加而較費時,從而滾筒的生產性降低。因此,宜在350HV以下。較佳係在300HV以下,在250HV以下更佳。又,在將矯正鈦合金板時所需之加工量充分縮小時,係以在HV160以下為佳。較佳係在HV155以下,在HV150以下更佳。(1.3 surface hardness) The surface hardness (Vickers hardness) of the surface of the titanium alloy plate that becomes the surface of the drum is not particularly limited, but HV110 or more is preferred. Thereby, when the titanium alloy plate is used to manufacture the drum and polish the surface, uniform polishing can be performed, and the macroscopic appearance can be more suppressed. The surface hardness (Vickers hardness) of the titanium alloy plate is preferably above HV112, and more preferably above HV115. In addition, the upper limit of the surface hardness (Vickers hardness) of the surface of the titanium alloy plate that becomes the surface of the drum is not particularly limited. However, if the surface hardness is greater than HV350, the number of polishing times will increase and it will take more time, thereby reducing the productivity of the drum. Therefore, it should be below 350HV. It is preferably below 300 HV, more preferably below 250 HV. In addition, when the amount of processing required to correct the titanium alloy plate is sufficiently reduced, it is better to be HV160 or less. It is preferably HV155 or less, more preferably HV150 or less.
鈦合金板的表面硬度可在將鈦合金板表面研磨至成為鏡面後,依據JIS Z 2244:2009使用維氏硬度試驗機以荷重1kg測定3~5點而設為其平均值。The surface hardness of the titanium alloy plate can be measured at 3 to 5 points with a load of 1 kg using a Vickers hardness tester in accordance with JIS Z 2244:2009 after polishing the surface of the titanium alloy plate to a mirror surface, and set it as an average value.
(1.4 厚度) 本實施形態鈦合金板的厚度並無特別限定,可配合所製造之滾筒的用途、規格等適宜設定。在作為製造銅箔的滾筒的材料使用時,由於板厚係隨著製造銅箔的滾筒的使用而減少,因此鈦合金板厚度宜設為4.0mm以上,亦可設為6.0mm以上。鈦合金板厚度的上限並無特別限定,例如為15.0mm。(1.4 thickness) The thickness of the titanium alloy plate of the present embodiment is not particularly limited, and can be appropriately set according to the purpose, specifications, and the like of the roller to be manufactured. When used as a material for a roller for manufacturing copper foil, since the plate thickness decreases with the use of the roller for manufacturing copper foil, the thickness of the titanium alloy plate is preferably 4.0 mm or more, and may also be 6.0 mm or more. The upper limit of the thickness of the titanium alloy plate is not particularly limited, and is, for example, 15.0 mm.
在以上說明之本實施形態中,係將鈦合金板的化學組成設為會抑制晶粒成長且會使熱軋延後的變形減輕的化學組成,使結晶不僅微細且還成為落在預定標準差內的均一大小,包含結晶結構為六方最密堆積結構之α相,並且使α相之[0001]方向相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率在70%以上。從而,在使用於銅箔製造用之滾筒時,可充分抑制產生巨觀模樣。In the embodiment described above, the chemical composition of the titanium alloy sheet is set to suppress the growth of crystal grains and reduce the deformation after hot rolling, so that the crystals are not only fine, but also fall within a predetermined standard deviation. The uniform size within, including the crystal structure of the α phase of the hexagonal closest-packed structure, and the angle formed by the [0001] direction of the α phase with respect to the thickness direction of the plate is 0° or more and the area of the crystal grains below 40° The rate is above 70%. Therefore, when it is used in a roll for manufacturing copper foil, the appearance of a macroscopic appearance can be sufficiently suppressed.
又,本實施形態之鈦合金板含有大於1.8%且在7.0%以下之Al時,鈦合金板的楊格率提升。結果在製造一製造銅箔的滾筒時,鈦合金板對芯材表面的收縮配合性提升,而製造銅箔的滾筒之生產性提升。In addition, when the titanium alloy sheet of the present embodiment contains more than 1.8% and 7.0% or less of Al, the Younger ratio of the titanium alloy sheet increases. As a result, when manufacturing a copper foil roller, the shrink fit of the titanium alloy plate to the surface of the core material is improved, and the productivity of the copper foil roller is improved.
於圖2顯示鈦合金板表面的巨觀模樣的照片作為一例。所謂「巨觀模樣」如圖2所示,係指以平行於軋延方向的方式產生數mm長度的筋條狀且顏色不同之部位者(為了參考,於圖3中顯示以可知圖2之巨觀模樣的位置的方式強調出巨觀模樣之圖)。若大量產生如上述之模樣,則模樣最後會轉印至所製造之銅箔。 雖然巨觀模樣係在銅箔的製造步驟中產生,但針對鈦合金板之容易產生巨觀模樣的程度(在相同條件下之巨觀模樣的產生比率),可利用#800之砂紙研磨鈦合金板表面後,使用硝酸10%及氫氟酸5%溶液腐蝕表面並觀察,藉此來評估。As an example, Fig. 2 shows a photograph of the macroscopic appearance of the surface of the titanium alloy plate. The so-called "macro-view" is shown in Figure 2, which refers to the part of ribs with a length of several mm and different colors generated in a manner parallel to the rolling direction (for reference, it is shown in Figure 3 to see that Figure 2 The location of the macro view emphasizes the map of the macro view). If a large amount of the above-mentioned pattern is produced, the pattern will finally be transferred to the manufactured copper foil. Although the macro pattern is produced in the copper foil manufacturing process, the titanium alloy plate is prone to produce the macro pattern (the rate of generation of the macro pattern under the same conditions), and the titanium alloy can be polished with #800 sandpaper After the surface of the board, use 10% nitric acid and 5% hydrofluoric acid to corrode the surface and observe for evaluation.
<製造銅箔的滾筒>
如以上所說明,本實施形態之鈦合金板在用於銅箔製造用之滾筒時可充分抑制產生巨觀模樣,而適合作為一製造銅箔的滾筒的材料。
參照圖8,本實施形態之製造銅箔的滾筒20具有:屬電沉積滾筒之一部分且為圓筒狀之內滾筒21、被接著於前述內滾筒21的外周面之鈦合金板22、及設於前述鈦合金板22的對接部之熔接部23,並且前述鈦合金板22係上述本實施形態之鈦合金板。
亦即,本實施形態之製造銅箔的滾筒20係使用本實施形態之鈦合金板而製出之製造銅箔的滾筒。本實施形態之製造銅箔的滾筒20係在析出銅箔之滾筒表面使用本實施形態之鈦合金板,因此可抑制產生巨觀模樣而可製造高品質的銅箔。
本實施形態之製造銅箔的滾筒,其尺寸無特別限制,滾筒直徑例如係1~5m。
內滾筒21為周知之物即可,其胚料亦可不係鈦合金板且亦可為例如軟鋼或不鏽鋼。
鈦合金板22係被捲附在圓筒狀之內滾筒21的外周面並將對接部熔接,從而接著於內滾筒。因此,於對接部存在熔接部23。<Copper foil rolls>
As explained above, the titanium alloy plate of the present embodiment can sufficiently suppress the appearance of macroscopic appearance when used in a roller for manufacturing copper foil, and is suitable as a material for a roller for manufacturing copper foil.
8, the copper
本實施形態之製造銅箔的滾筒,其熔接部的金屬組織以體積率計具有98.0%以上的α相,並且以依據JIS G 0551:2013之粒度編號計,在6以上且在11以下。並且,粒度編號在7以上且在10以下為佳。 熔接部的金屬組織中晶粒的粒徑(結晶粒徑)若粗大,該晶粒本身就會成為模樣而模樣會轉印至銅箔。藉由在熔接部的金屬組織中晶粒如上述地微細,便會抑制產生因晶粒所致模樣。In the copper foil manufacturing roller of this embodiment, the metal structure of the welded portion has an α phase of 98.0% or more in volume ratio, and is 6 or more and 11 or less in terms of the particle size number in accordance with JIS G 0551:2013. In addition, the particle size number is preferably 7 or more and 10 or less. If the grain size (crystal grain size) of the crystal grains in the metal structure of the welded portion is coarse, the crystal grains themselves become a pattern and the pattern is transferred to the copper foil. As the crystal grains in the metal structure of the welded portion are as fine as described above, the appearance due to the crystal grains can be suppressed.
熔接部的金屬組織中晶粒的粒度編號可依據JIS G 0551:2013,利用比較法、計數方法及裁切法來測定。The grain size number of the crystal grains in the metal structure of the welded part can be measured by the comparison method, the counting method and the cutting method in accordance with JIS G 0551:2013.
本實施形態之製造銅箔的滾筒20中,熔接部23具有譬如以下金屬組織。
熔接部的金屬組織為α相主體,亦即主要包含α相。β相會較α相更優先腐蝕。故從達成均勻的腐蝕來抑制產生巨觀模樣之觀點來看,β相越少越好。另一方面,當存在少量β相時可抑制熱處理時之晶粒成長,從而可獲得均一且微細的結晶粒徑。從上述觀點看來,熔接部的金屬組織中β相的體積率在2.0%以下較理想。而在此情況下,鈦合金板的金屬組織的剩餘部分即為α相。β相的體積率較佳係在1.0%以下,更佳的係熔接部的集合組織為α單相。又,本實施形態之熔接部的金屬組織中,α相的體積率宜為98.0%以上,較佳為99.0%以上,100%更佳。In the
構成熔接部的金屬組織中各相的體積率可藉由與母材部同樣的方法求算。The volume fraction of each phase in the metal structure constituting the welded portion can be calculated by the same method as the base material portion.
此外,若熔接部與滾筒母材的硬度差大,在研磨時有時會產生高低差。因此,熔接部與滾筒母材的硬度(維氏硬度)之差宜在±25以下。更佳係在±15以下。藉此,在利用鈦合金板來製造滾筒並研磨表面時,可進行均勻的研磨而能夠更加抑制巨觀模樣。熔接部的硬度例如係在HV110以上,較佳係在HV112以上,在HV115以上更佳。In addition, if the hardness difference between the welded portion and the base material of the drum is large, a difference in height may occur during polishing. Therefore, the difference between the hardness (Vickers hardness) of the welded part and the base material of the drum is preferably ±25 or less. More preferably, it is below ±15. Thereby, when the titanium alloy plate is used to manufacture the drum and polish the surface, uniform polishing can be performed, and the macroscopic appearance can be more suppressed. The hardness of the welded portion is, for example, HV110 or higher, preferably HV112 or higher, and more preferably HV115 or higher.
熔接部的硬度可在將熔接部表面研磨至成為鏡面後,依據JIS Z 2244:2009使用維氏硬度試驗機以荷重1kg測定3~5點而設為其平均值。The hardness of the welded portion can be measured at 3 to 5 points with a load of 1 kg using a Vickers hardness tester in accordance with JIS Z 2244:2009 after polishing the surface of the welded portion to a mirror surface, and set it as an average value.
另外,所形成之熔接部的結晶粒徑與鈦合金板的結晶粒徑之差(粒度編號之差)宜在-1.0以上且在1.0以下。藉由熔接部與其他部位之結晶粒徑之差變小,會更確實抑制產生巨觀模樣。In addition, the difference between the crystal grain size of the formed welded portion and the crystal grain size of the titanium alloy plate (the difference in the grain size number) is preferably -1.0 or more and 1.0 or less. By reducing the difference in the crystal grain size between the welded part and other parts, it is possible to more reliably suppress the appearance of macroscopic appearance.
<2.本實施形態之鈦合金板之製造方法> 以上說明之本實施形態之鈦合金板可利用任何方法來製造,例如可利用以下說明之本實施形態鈦合金板之製造方法來製造。 本實施形態之鈦合金板之較佳製造方法具有以下步驟: (I)第1步驟(加熱步驟),將具有上述化學組成之鈦合金加熱至750℃以上且950℃以下的溫度; (II)第2步驟(軋延步驟),在加熱步驟後進行軋延,製成鈦合金板;及 (III)第3步驟(退火步驟),將軋延步驟後之鈦合金退火。以下,說明各步驟。<2. The manufacturing method of the titanium alloy plate of this embodiment> The titanium alloy plate of the present embodiment described above can be manufactured by any method, for example, it can be manufactured by the method of manufacturing the titanium alloy plate of the present embodiment described below. The preferred manufacturing method of the titanium alloy plate of this embodiment has the following steps: (I) The first step (heating step), heating the titanium alloy with the above chemical composition to a temperature above 750°C and below 950°C; (II) In the second step (rolling step), rolling is performed after the heating step to produce a titanium alloy plate; and (III) The third step (annealing step), annealing the titanium alloy after the rolling step. Hereinafter, each step will be explained.
(2.1 準備鈦合金板胚料) 首先,在上述各步驟前,準備鈦合金板胚料。胚料可使用上述化學組成者且可使用藉由周知方法製出者。舉例來說,係藉由真空電弧再熔解法、電子束熔解法或電漿熔解法等爐膛熔解法等的各種熔解法來從海綿鈦製作鑄錠。接著,在α相高溫區或β相單相區的溫度下將所得鑄錠進行熱鍛造或軋延,從而可獲得胚料。對於胚料亦可視需要施行洗淨處理、切削等前處理。又,在經以爐膛熔解法製造出可熱軋之矩形扁胚形狀的情況下,亦可不進行熱鍛造等而直接供於下述第1步驟及第2步驟(加熱、熱軋延)。(2.1 Prepare titanium alloy sheet blank) First, before the above steps, prepare titanium alloy sheet blanks. The blank can be made of the above-mentioned chemical composition and can be made by a well-known method. For example, ingots are produced from sponge titanium by various melting methods such as a furnace melting method such as a vacuum arc remelting method, an electron beam melting method, or a plasma melting method. Then, the obtained ingot is hot forged or rolled at the temperature of the α-phase high-temperature zone or the β-phase single-phase zone, thereby obtaining a blank. The blank may also be subjected to pre-processing such as washing and cutting as needed. In addition, when a rectangular flat blank shape that can be hot-rolled is manufactured by the furnace melting method, it may be directly supplied to the following first step and second step (heating, hot rolling) without hot forging or the like.
(2.2 第1步驟) 本步驟係在鈦材之熱軋延前進行的加熱步驟。在本步驟中,將鈦合金板胚料加熱至750℃以上且950℃以下之溫度。藉由加熱溫度在750℃以上,可防止在第2步驟之熱軋延中發生鈦合金板的破裂。並且,藉由加熱溫度在950℃以下,可防止在第2步驟之熱軋延中生成hcp結構之c軸定向於板寬方向之集合組織(T-texture)。 相對於此,加熱溫度若低於750℃,則例如在熱鍛造、鑄造等中產生有粗大粒子時,有時會在第2步驟之熱軋延中以該粗大粒子為起點於鈦合金板發生破裂。(2.2 Step 1) This step is a heating step performed before the hot rolling of the titanium material. In this step, the titanium alloy plate blank is heated to a temperature above 750°C and below 950°C. With the heating temperature above 750°C, the titanium alloy sheet can be prevented from cracking during the hot rolling in the second step. In addition, by heating the temperature below 950°C, it is possible to prevent the formation of a T-texture in which the c-axis of the hcp structure is oriented in the width direction of the plate during the hot rolling in the second step. On the other hand, if the heating temperature is lower than 750°C, for example, when coarse particles are generated during hot forging, casting, etc., the coarse particles may be generated in the titanium alloy sheet starting from the coarse particles in the second step of hot rolling. rupture.
又,加熱溫度若超過950℃,在第2步驟之熱軋延中就會生成hcp結構之c軸定向於板寬方向之粗大集合組織(T-texture)。此時,就無法獲得如上述之α相之[0001]方向相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率為70%以上之組織。藉由加熱溫度在950℃以下,可防止生成T-texture。因此,加熱溫度為950℃以下。加熱溫度在β變態點以下為佳,且較佳係在900℃以下或(β變態點-10℃)以下。 並且,為了獲得在從板面的法線方向之(0001)極圖中,晶粒的聚集度的尖峰相對於最終軋延寬度方向存在於30°以內,且最大聚集度在4.0以上之集合組織,加熱溫度宜在900℃以下,尤其當Al含量在3.0%以下時加熱溫度在880℃以下為佳。In addition, if the heating temperature exceeds 950°C, a coarse aggregate structure (T-texture) with the c-axis of the hcp structure oriented in the width direction of the sheet will be generated during the hot rolling in the second step. In this case, it is impossible to obtain a structure in which the angle formed by the [0001] direction of the α phase with respect to the plate thickness direction is 0° or more and 40° or less and the area ratio of the crystal grains is 70% or more. By heating the temperature below 950℃, the formation of T-texture can be prevented. Therefore, the heating temperature is 950°C or less. The heating temperature is preferably below the β transformation point, and preferably below 900°C or (β transformation point-10°C) or less. And, in order to obtain the (0001) pole figure from the normal direction of the plate surface, the peak of the crystal grain aggregation degree exists within 30° with respect to the final rolling width direction, and the aggregation structure with the maximum aggregation degree above 4.0 , The heating temperature should be below 900℃, especially when the Al content is below 3.0%, the heating temperature should be below 880℃.
在本實施形態中,「β變態點」意指在將鈦合金從β相單相區冷卻時會開始生成α相之境界溫度。β變態點可從狀態圖取得。狀態圖則可藉由例如CALPHAD(Computer Coupling of Phase Diagrams and Thermochemistry)法取得。具體而言,可使用Thermo-Calc Sotware AB公司之整合型熱力學計算系統Thermo-Calc及預定資料庫(TI3),藉由CALPHAD法取得鈦合金的狀態圖來算出β變態點。In the present embodiment, the "β transformation point" means the boundary temperature at which the α phase starts to be generated when the titanium alloy is cooled from the β phase single-phase region. The β metamorphosis point can be obtained from the state diagram. The state diagram can be obtained by, for example, the CALPHAD (Computer Coupling of Phase Diagrams and Thermochemistry) method. Specifically, Thermo-Calc Sotware AB's integrated thermodynamic calculation system Thermo-Calc and a predetermined database (TI3) can be used to obtain the state diagram of the titanium alloy by the CALPHAD method to calculate the β transformation point.
(2.3 第2步驟) 在本步驟中,軋延(熱軋延)經加熱後之鈦合金板胚料。並且,在本步驟中,宜將合計軋縮率設為80%以上,並且將合計軋縮率當中在200℃以上且650℃以下時之軋延的軋縮率所占比率設為5%以上且在70%以下。藉此,可獲得晶粒如上述被均一地微細化且hcp結構之c軸沿板厚方向高度聚集之集合組織。本步驟中熱軋延開始溫度基本上會係上述加熱溫度。 藉由合計軋縮率在80%以上,可使在熱鍛造、鑄造等中產生的粗大晶粒充分微細化,同時可防止產生T-texture。合計軋縮率若小於80%,在熱鍛造、鑄造等中產生的組織便會殘留,有時會形成粗大晶粒或者產生T-texture。若產生此種組織,在所製造之滾筒就會產生巨觀模樣。 在Al含量3.0%以下的情況下,本步驟之合計軋縮率宜為85%以上。又,軋縮率愈高,組織就變得愈佳,故只要配合所需之製品尺寸及製造磨機的特性來訂定即可。(2.3 Step 2) In this step, the heated titanium alloy sheet blank is rolled (hot rolled). Also, in this step, it is advisable to set the total reduction ratio to 80% or more, and set the ratio of the rolling reduction ratio at 200°C or higher and 650°C or less to 5% or more in the total rolling reduction ratio. And below 70%. Thereby, an aggregate structure in which the crystal grains are uniformly refined as described above and the c-axis of the hcp structure is highly concentrated in the plate thickness direction can be obtained. The start temperature of hot rolling in this step is basically the above heating temperature. With a total reduction ratio of 80% or more, the coarse grains produced in hot forging, casting, etc. can be sufficiently refined, and at the same time, T-texture can be prevented. If the total reduction ratio is less than 80%, the structure produced in hot forging, casting, etc. will remain, and coarse grains may be formed or T-texture may be formed. If this kind of structure is produced, a huge appearance will be produced in the manufactured roller. When the Al content is 3.0% or less, the total rolling reduction ratio in this step is preferably 85% or more. In addition, the higher the reduction ratio, the better the structure, so it only needs to be determined in accordance with the required product size and the characteristics of the manufacturing mill.
此外,在本實施形態之鈦合金之製造方法中,合計軋縮率當中,在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率宜設為5%以上且在70%以下。尤其在Al含量少(例如3.0%以下)的情況下,以滿足上述為佳。 若係在高於650℃下進行所有軋延的情況等,合計軋縮率當中在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率小於5%的情況,則該溫度區下的軋縮量不足,在後續的冷卻時會發生回復而產生應變量較少的部分。從而,透過熱軋後的熱處理,結晶粒徑參差就變大。結晶粒徑的參差在可抑制晶粒成長之Al含量少時尤其容易產生。 並且,藉由將在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率設為5%以上且在70%以下,會變得容易獲得以下組織及/或集合組織:包含結晶結構為六方最密堆積結構之α相,且α相之[0001]方向相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率在70%以上之組織;在從板面的法線方向之(0001)極圖中,晶粒的聚集度的尖峰相對於最終軋延寬度方向存在於30°以內,且最大聚集度在4.0以上之集合組織。 另一方面,若係在低於200℃下進行所有軋延等,而合計軋縮率當中在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率小於5%的情況,板形狀就不穩定。在此情況下,在後續的矯正中加工量變大而導入應變,在矯正部與其以外的部分中應變量的差變大,進而在後續的熱處理中結晶粒徑之參差變大。並且,於熱處理後若還進行矯正,應變就會影響而僅該部分變得容易腐蝕,恐會成為巨觀模樣之原因。合計軋縮率當中在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率在10%以上為佳,在15%以上較佳。In addition, in the method of manufacturing the titanium alloy of this embodiment, among the total rolling reduction ratios, the ratio of the rolling reduction ratio of the titanium alloy sheet at 200°C or more and 650°C or less is preferably set to 5% or more and Below 70%. In particular, when the Al content is small (for example, 3.0% or less), it is better to satisfy the above. If it is the case where all rolling is performed at a temperature higher than 650°C, etc., the rolling shrinkage ratio of the titanium alloy sheet at 200°C or higher and 650°C or lower among the total rolling shrinkage ratio is less than 5%, Therefore, the amount of shrinkage in this temperature zone is insufficient, and recovery occurs during subsequent cooling, resulting in a portion with a smaller amount of strain. Therefore, through the heat treatment after hot rolling, the crystal grain size variation becomes larger. Variations in crystal grain size are particularly likely to occur when the Al content that can suppress the growth of crystal grains is small. In addition, by setting the rolling reduction ratio of the titanium alloy sheet at 200°C or higher and 650°C or lower to 5% or more and 70% or less, it becomes easy to obtain the following structures and/or aggregates Microstructure: Including the α phase whose crystal structure is the most densely packed hexagonal structure, and the angle formed by the [0001] direction of the α phase with respect to the plate thickness direction is 0° or more and 40° or less, and the area ratio of the crystal grains is 70% The above structure; in the (0001) pole figure from the normal direction of the plate surface, the peak of the crystal grain aggregation degree exists within 30° relative to the final rolling width direction, and the aggregation structure with the maximum aggregation degree above 4.0 . On the other hand, if all rolling and the like are carried out at less than 200°C, and the total rolling shrinkage ratio is between 200°C and 650°C, the rolling shrinkage ratio of the titanium alloy sheet is less than 5% In the case, the shape of the board becomes unstable. In this case, in the subsequent correction, the amount of processing becomes large and strain is introduced, and the difference in the amount of strain between the corrected portion and the other parts becomes larger, and further, the variation in the crystal grain size in the subsequent heat treatment becomes larger. In addition, if correction is performed after the heat treatment, the strain will be affected and only this part will be easily corroded, which may be the cause of the macroscopic appearance. Among the total rolling reduction ratios, the rolling reduction ratio of the titanium alloy sheet at 200° C. or more and 650° C. or less is preferably 10% or more, and more preferably 15% or more.
另一方面,在650℃以下進行所有軋延等,合計軋縮率當中在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率若大於70%,板形狀就不穩定。在此情況下,在後續的矯正中加工量變大而導入應變,在矯正部與其以外的部分中應變量的差變大,進而在後續的熱處理中結晶粒徑之參差變大。並且,於熱處理後若還進行矯正,應變就會影響而僅該部分變得容易腐蝕,恐會成為巨觀模樣之原因。 因此,合計軋縮率當中在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率宜在70%以下。較佳係65%以下,60%以下更佳。On the other hand, all rolling and the like are performed below 650°C, and if the total rolling reduction ratio is between 200°C and 650°C, the rolling reduction ratio of the titanium alloy sheet is greater than 70%, the plate shape will be Unstable. In this case, in the subsequent correction, the amount of processing becomes large and strain is introduced, and the difference in the amount of strain between the corrected portion and the other parts becomes larger, and further, the variation in the crystal grain size in the subsequent heat treatment becomes larger. In addition, if correction is performed after the heat treatment, the strain will be affected and only this part will be easily corroded, which may be the cause of the macroscopic appearance. Therefore, it is preferable that the rolling reduction ratio of the titanium alloy sheet when the rolling reduction ratio is between 200° C. and 650° C. be 70% or less in the total rolling reduction ratio. Preferably it is 65% or less, more preferably 60% or less.
完成本步驟之熱軋延時鈦合金板的表面溫度宜在200℃以上。藉由將完成熱軋延時鈦合金板的表面溫度設為200℃以上,可以抑制鈦合金板形狀不穩定的情形,進而可減低由後續之矯正所致加工量。藉此,導入鈦合金板的應變量會變少,後續的熱處理中可能產生的結晶粒徑參差就變小。另外,若導入應變,則僅該部分變得容易腐蝕而恐會成為巨觀模樣之原因,然藉由使完成熱軋延時鈦合金板的表面溫度在200℃以上,可減低矯正時的加工量,導入鈦合金板的應變量減少而可抑制巨觀模樣。完成熱軋延時鈦合金板的表面溫度在300℃以上較佳。The surface temperature of the hot-rolled delayed titanium alloy sheet after this step should be above 200°C. By setting the surface temperature of the titanium alloy sheet after the completion of the hot rolling to 200°C or higher, the unstable shape of the titanium alloy sheet can be suppressed, and the amount of processing caused by the subsequent correction can be reduced. As a result, the amount of strain introduced into the titanium alloy sheet is reduced, and the crystal grain size variation that may occur in the subsequent heat treatment is reduced. In addition, if strain is introduced, only this part becomes easy to be corroded, which may cause the macroscopic appearance. However, by making the surface temperature of the titanium alloy sheet after the completion of the hot rolling to be 200°C or more, the amount of processing during correction can be reduced. , The amount of strain introduced into the titanium alloy plate is reduced and the macroscopic appearance can be suppressed. The surface temperature of the titanium alloy sheet after the completion of the hot rolling is preferably above 300°C.
又,在本步驟中,軋延可為沿鈦合金板之長邊方向延伸之單方向軋延,而除了在長邊方向上的軋延之外,亦可還在與該長邊方向正交之方向上進行軋延。藉此,可在所得鈦合金板中更進一步提高集合組織之聚集度。 具體而言,令最終軋延方向上的軋延之軋縮率為L(%)、在與最終軋延方向正交之方向上的軋延之軋縮率為T(%)時,L/T宜為1.0以上且在10.0以下。藉此,可在所得鈦合金板中更進一步提高集合組織之聚集度。L/T為1.0以上且在5.0以下更佳。In addition, in this step, rolling can be unidirectional rolling extending along the long side direction of the titanium alloy sheet, and in addition to rolling in the long side direction, it can also be perpendicular to the long side direction. Rolling in the direction of. Thereby, the degree of aggregation of the aggregate structure can be further improved in the obtained titanium alloy sheet. Specifically, when the rolling reduction ratio in the final rolling direction is L (%), and the rolling reduction ratio in the direction orthogonal to the final rolling direction is T (%), L/ T is preferably 1.0 or more and 10.0 or less. Thereby, the degree of aggregation of the aggregate structure can be further improved in the obtained titanium alloy sheet. L/T is 1.0 or more and more preferably 5.0 or less.
本步驟中在實施200℃以上且650℃以下時之軋延時,亦可進行維持一段時間來等待鈦合金板冷卻。In this step, the rolling delay is performed when the temperature is above 200°C and below 650°C, and it can also be maintained for a period of time to wait for the titanium alloy plate to cool.
在本實施形態之鈦合金板之製造方法中,於第2步驟中宜不進行再加熱並軋延。藉此,可防止在軋延中產生的應變因再加熱而被釋放,而可穩定地對鈦合金板賦予應變。其結果,可提高鈦合金板之集合組織之聚集度,並且可抑制後述熱處理時局部性的異常晶粒成長。In the manufacturing method of the titanium alloy sheet of this embodiment, it is preferable not to perform reheating and rolling in the second step. Thereby, the strain generated during rolling can be prevented from being released by reheating, and the strain can be stably applied to the titanium alloy sheet. As a result, the degree of aggregation of the aggregate structure of the titanium alloy sheet can be increased, and local abnormal grain growth during the heat treatment described later can be suppressed.
於第2步驟後亦可進行冷軋延。冷軋延係在200℃以下之溫度下的軋延,可藉由單方向軋延或交叉軋延來進行。軋縮率宜設為10%以上。藉由使軋縮率在10%以上可均勻導入應變,而可縮小後續的熱處理中可能產生的結晶粒徑參差。 若要進行冷軋延,事先會去除熱軋延後的鈦合金板表面的氧化皮膜。氧化皮膜之去除可藉由例如噴珠並在噴珠後接著進行酸洗,亦可利用切削等機械加工來進行。在去除氧化皮膜前,亦可視需要而在低於β變態點的溫度下進行退火。所述退火較佳係在(β變態點-50)℃以下進行。 在進行冷軋延時,若鈦合金板的Al含量過多,則冷軋性貧乏而鈦合金板可能會破裂。因此,在進行冷軋延時鈦合金板的Al含量宜為3.5%以下。 另外,要縮小雙晶晶界長度相對於總結晶晶界長度的比率時,宜不進行冷軋延。Cold rolling can also be performed after the second step. Cold rolling is rolling at a temperature below 200°C and can be performed by unidirectional rolling or cross rolling. The reduction ratio is preferably set to 10% or more. The strain can be introduced uniformly by making the rolling shrinkage rate above 10%, and the crystal grain size variation that may be generated in the subsequent heat treatment can be reduced. If cold rolling is required, the oxide film on the surface of the hot rolled titanium alloy sheet will be removed in advance. The oxide film can be removed by, for example, bead spraying followed by pickling, or machining such as cutting. Before removing the oxide film, annealing may be performed at a temperature lower than the β transformation point if necessary. The annealing is preferably performed at (β transformation point-50)°C or lower. When the cold rolling is delayed, if the Al content of the titanium alloy sheet is too large, the cold rollability is poor and the titanium alloy sheet may be cracked. Therefore, the Al content of the titanium alloy sheet after cold rolling is preferably 3.5% or less. In addition, to reduce the ratio of the twin grain boundary length to the total crystal grain boundary length, cold rolling should not be performed.
(2.4 第3步驟) 在本步驟中,係在600℃以上且β變態點℃以下之溫度下將鈦合金板熱處理(退火)20分鐘以上的時間。藉此,可使未再結晶晶粒析出為微細再結晶晶粒,而可使所得鈦合金板之金屬組織中的結晶均一且成為微粒。其結果,可更確實抑制產生巨觀模樣。(2.4 Step 3) In this step, the titanium alloy sheet is heat-treated (annealed) at a temperature of 600°C or higher and β transformation point°C or lower for 20 minutes or longer. Thereby, the non-recrystallized crystal grains can be precipitated as fine recrystallized crystal grains, and the crystals in the metallic structure of the obtained titanium alloy sheet can be made uniform and become fine particles. As a result, it is possible to more reliably suppress the appearance of macroscopic appearance.
具體而言,藉由在600℃以上之溫度下將鈦合金板熱處理20分鐘以上,可使未再結晶晶粒充分析出為再結晶晶粒。退火溫度宜為650℃以上。並且,從抑制晶粒粗大化的觀點看來,宜將退火溫度設為β變態點以下。較佳係在800℃以下。 退火時間的上限並無特別限定,會在例如5小時以下。尤其,在具有抑制晶粒成長效果的Al含量少的情況等,從抑制晶粒粗大化的觀點看來,退火時間設為90分鐘以下為佳。Specifically, by heat-treating the titanium alloy plate at a temperature of 600° C. or higher for 20 minutes or longer, the unrecrystallized grains can be fully analyzed into recrystallized grains. The annealing temperature is preferably above 650°C. In addition, from the viewpoint of suppressing the coarsening of crystal grains, it is preferable to set the annealing temperature to be below the β transformation point. Preferably it is below 800°C. The upper limit of the annealing time is not particularly limited, and may be, for example, 5 hours or less. In particular, when the Al content that has the effect of suppressing the growth of crystal grains is small, etc., from the viewpoint of suppressing the coarsening of crystal grains, the annealing time is preferably set to 90 minutes or less.
熱處理在大氣環境、非活性氣體環境或真空環境之任一種下進行皆可。惟,若於鈦合金板形成氧化皮膜則要進行氧化皮膜之去除。氧化皮膜之去除並無特別限制,可藉由例如噴珠並在噴珠後接著進行酸洗,亦可利用切削等機械加工來進行。惟,噴珠可能會在鈦合金板導入應變,故宜避免藉由噴珠去除氧化皮膜。 另外,退火方法不特別限制,可為連續式的加熱方式亦可為批次式的加熱方式。The heat treatment can be performed in any of an atmospheric environment, an inert gas environment, or a vacuum environment. However, if an oxide film is formed on the titanium alloy plate, the oxide film must be removed. The removal of the oxide film is not particularly limited, and it can be performed by, for example, bead spraying followed by pickling, or machining such as cutting. However, bead spraying may introduce strain into the titanium alloy plate, so it is advisable to avoid removing the oxide film by bead spraying. In addition, the annealing method is not particularly limited, and it may be a continuous heating method or a batch heating method.
(2.5 後處理步驟) 後處理可舉例藉由酸洗或切削去除氧化皮膜等、或洗凈處理等,可視需要來適當應用。或者,亦可進行鈦合金板的矯正加工作為後處理。矯正加工則可藉由例如真空潛變矯正(VCF;Vacuum creep flattening)來進行。 以上,已說明了本實施形態之鈦合金板之製造方法。(2.5 Post-processing steps) The post-treatment can be, for example, pickling or cutting to remove oxide film, etc., or washing treatment, etc., and can be appropriately applied as needed. Alternatively, the correction processing of the titanium alloy plate may be performed as a post-processing. The correction processing can be performed by, for example, vacuum creep flattening (VCF; Vacuum creep flattening). In the above, the manufacturing method of the titanium alloy sheet of this embodiment has been demonstrated.
接著,說明本實施形態之製造銅箔的滾筒之製造方法。 本實施形態之製造銅箔的滾筒之製造方法具有以下步驟:使用後述熔接用鈦線材(本實施形態之熔接用鈦線材)來熔接經加工成圓筒狀之本實施形態鈦合金板之鄰接的2個端部的步驟(熔接步驟)。 鈦合金板之加工為圓筒狀之方法、熔接條件等可設為周知方法。 在熔接時,例如係使用上述熔接用鈦線材將經加工成圓筒狀之鈦合金板之鄰接的2個端部堆焊熔接,而形成熔接部(堆焊熔接部)。在此,由於會對熔接部進行冷或溫加工,故宜在堆焊部施行堆高。堆高厚度可設為例如鈦合金板厚度的10~50%。 又,針對堆焊熔接部,亦可在冷的狀態或200℃以下的溫的狀態下進行軋縮。藉此可使堆焊部的凝固組織成為均一的微細等軸組織。為了防止由高加工率導致產生破裂,並確實使凝固組織成為均一的微細等軸組織,軋縮率宜為10%以上且在50%以下。 另,熔接後亦可進行熱處理(退火)。熱處理例如可在500℃以上且850℃以下的溫度下進行1分鐘以上且10分鐘以下。藉由在850℃以下進行熱處理10分鐘以下,可防止晶粒粗大化或一部分晶粒粗大化,而能獲得均一的微粒結晶組織。Next, the manufacturing method of the roll for manufacturing copper foil of this embodiment is demonstrated. The method of manufacturing the copper foil roller of the present embodiment has the following steps: use the titanium wire for welding (the titanium wire for welding of this embodiment) to be described later to weld the adjacent titanium alloy plate of the present embodiment that has been processed into a cylindrical shape. Two end steps (welding step). The method of processing the titanium alloy plate into a cylindrical shape, welding conditions, etc. can be known methods. At the time of welding, for example, the two adjacent ends of the titanium alloy plate processed into a cylindrical shape are surfacing and fused using the titanium wire for welding described above to form a welded portion (surfacing welded portion). Here, since cold or warm processing is performed on the welded part, it is advisable to pile up the welded part. The stack height can be set to, for example, 10 to 50% of the thickness of the titanium alloy plate. In addition, the surfacing welded part may be rolled in a cold state or a temperature of 200°C or less. Thereby, the solidified structure of the surfacing part can be made into a uniform fine equiaxed structure. In order to prevent the occurrence of cracks due to the high processing rate and ensure that the solidified structure becomes a uniform fine equiaxed structure, the rolling reduction ratio is preferably 10% or more and 50% or less. In addition, heat treatment (annealing) may be performed after welding. The heat treatment can be performed, for example, at a temperature of 500° C. or more and 850° C. or less for 1 minute or more and 10 minutes or less. By performing the heat treatment at 850°C or less for 10 minutes or less, coarsening of crystal grains or part of the crystal grains can be prevented, and a uniform fine grain crystal structure can be obtained.
接著,說明本實施形態之熔接用鈦線材,其用於製造一製造銅箔的滾筒。Next, a description will be given of the titanium wire for welding of this embodiment, which is used to manufacture a roll for manufacturing copper foil.
<熔接用鈦線材> 本實施形態之熔接用鈦線材可用來製造一製造銅箔的鈦滾筒,更具體而言係用來將經彎曲加工成圓筒狀之鈦合金板之鄰接的端部進行熔接。<Titanium wire for welding> The titanium wire for welding of this embodiment can be used to manufacture a titanium roller for making copper foil, and more specifically, to weld adjacent ends of a titanium alloy plate that has been bent into a cylindrical shape.
本實施形態之熔接用鈦線材宜具有以下化學組成: 以質量%計含有: 選自於由Sn、Zr及Al所構成群組中之1種以上:合計0.2%以上且6.0%以下、 O:0.01%以上且0.70%以下、 N:0.100%以下、 C:0.080%以下、 H:0.015%以下及 Fe:0.500%以下,且 剩餘部分包含Ti及不純物。The titanium wire for welding of this embodiment should have the following chemical composition: Contains in mass%: One or more selected from the group consisting of Sn, Zr and Al: a total of 0.2% or more and 6.0% or less, O: 0.01% or more and 0.70% or less, N: 0.100% or less, C: Below 0.080%, H: 0.015% or less and Fe: 0.500% or less, and The remainder contains Ti and impurities.
選自於由Sn、Zr及Al所構成群組中之1種以上元素的含量合計為0.2質量%以上且在6.0質量%以下。藉此,可使所得熔接部的金屬組織成為α相主體且可抑制生成β相,從而可提升熔接部的耐腐蝕性。並且,可使所得熔接部的金屬組織中晶粒充分變得微細,而可抑制產生因晶粒所致之巨觀模樣。The total content of one or more elements selected from the group consisting of Sn, Zr, and Al is 0.2% by mass or more and 6.0% by mass or less. Thereby, the metal structure of the obtained welded part can be made into an α-phase main body and the generation of β phase can be suppressed, so that the corrosion resistance of the welded part can be improved. In addition, the crystal grains in the metal structure of the obtained welded portion can be sufficiently fined, and the generation of macroscopic appearance due to the crystal grains can be suppressed.
相對於此,選自於由Sn、Zr及Al所構成群組中之1種以上元素的含量合計小於0.2質量%時,所得熔接部的金屬組織中晶粒有時會產生粗大粒子,而無法抑制產生巨觀模樣。選自於由Sn、Zr及Al所構成群組中之1種以上元素的含量合計宜在0.3質量%以上,合計在0.4質量%以上更佳。On the other hand, when the total content of one or more elements selected from the group consisting of Sn, Zr, and Al is less than 0.2% by mass, the resulting metal structure of the welded part may produce coarse particles in the crystal grains, which may not Suppresses the appearance of a giant. The content of one or more elements selected from the group consisting of Sn, Zr, and Al is preferably 0.3% by mass or more in total, and more preferably 0.4% by mass or more in total.
又,若選自於由Sn、Zr及Al所構成群組中之1種以上元素的含量合計大於6.0質量%,便會因上述含有過量Sn、Zr及Al導致產生不良影響,並由該不良影響導致無法抑制在所得熔接部中產生巨觀模樣。選自於由Sn、Zr及Al所構成群組中之1種以上元素的含量合計宜在5.5質量%以下,合計在5.0質量%以下更佳。In addition, if the total content of one or more elements selected from the group consisting of Sn, Zr, and Al is greater than 6.0% by mass, the above-mentioned excessive Sn, Zr, and Al content may cause adverse effects, and the adverse effects The influence makes it impossible to suppress the macroscopic appearance in the resulting welded portion. The total content of one or more elements selected from the group consisting of Sn, Zr, and Al is preferably 5.5% by mass or less, and more preferably 5.0% by mass or less in total.
上述元素當中,Sn為中性元素,係藉由含有於熔接用鈦線材中而可抑制熔接部之晶粒成長的元素。為了穩定抑制晶粒成長,Sn含量宜為0.2質量%以上,較佳係在0.3質量%以上。 另一方面,若添加過多Sn,則依化學組成之不同,有時會在熔接用鈦線材的長度方向上偏析而在焊珠熔接部形成由濃度所造成的巨觀模樣。因此,Sn含量宜為6.0質量%以下,較佳係在5.5質量%以下。Among the above-mentioned elements, Sn is a neutral element and is an element that can suppress the growth of crystal grains in the welded portion by being contained in the titanium wire for welding. In order to stably suppress the growth of crystal grains, the Sn content is preferably 0.2% by mass or more, preferably 0.3% by mass or more. On the other hand, if too much Sn is added, depending on the chemical composition, it may segregate in the longitudinal direction of the titanium wire for welding and form a macroscopic pattern caused by the concentration in the welded part of the bead. Therefore, the Sn content is preferably 6.0% by mass or less, and more preferably 5.5% by mass or less.
Zr亦為中性元素,係藉由含有於熔接用鈦線材中而可抑制晶粒成長的元素。為了穩定抑制晶粒成長,Zr含量宜為0.2質量%以上,較佳係在0.3質量%以上。 另一方面,若添加過多Zr,則依化學組成之不同,變態溫度附近的α+β區會變廣,在製造一製造銅箔的鈦滾筒時在熱處理中變得容易析出β相。又,因凝固偏析導致表面強度產生差異,結果有時在表面研磨一製造銅箔的鈦滾筒時會產生巨觀模樣。因此,Zr含量宜為5.5質量%以下,較佳係在5.0質量%以下。Zr is also a neutral element, and is an element that can suppress crystal grain growth by being contained in the titanium wire for welding. In order to stably suppress the growth of crystal grains, the Zr content is preferably 0.2% by mass or more, preferably 0.3% by mass or more. On the other hand, if too much Zr is added, depending on the chemical composition, the α+β region near the transformation temperature will be widened, and the β phase will be easily precipitated during the heat treatment when manufacturing a titanium roll for manufacturing copper foil. In addition, the surface strength is different due to solidification segregation, and as a result, a large appearance may be produced when the surface is polished on a titanium roller for manufacturing copper foil. Therefore, the Zr content is preferably 5.5% by mass or less, and more preferably 5.0% by mass or less.
Al為α穩定化元素,係與Sn、Zr同樣可藉由含有於熔接用鈦線材中來抑制晶粒成長,並且有助於提升熔接用鈦線材及使用其來形成之熔接部的強度。為了穩定抑制晶粒成長,Al含量宜為0.2質量%以上,較佳係在0.3質量%以上。 另一方面,Al含量若過多,則依化學組成之不同,高溫強度的上升變大,熔接用鈦線材之凝固組織(熔接部)在熱處理前的加工中反作用力變得過大而可能發生加工破裂,並且熔接部與母材之硬度差變大,而可能在製造銅箔的鈦滾筒之研磨及整面時產生高低差。因此,Al含量宜為5.0質量%以下,較佳係在4.5質量%以下。Al is an α-stabilizing element. Like Sn and Zr, it can suppress crystal grain growth by being contained in the titanium wire for welding, and contributes to enhancing the strength of the titanium wire for welding and the welded part formed using it. In order to stably suppress the growth of crystal grains, the Al content is preferably 0.2% by mass or more, preferably 0.3% by mass or more. On the other hand, if the Al content is too large, depending on the chemical composition, the increase in high temperature strength increases, and the solidified structure (welded portion) of the titanium wire for welding becomes too large in the processing before heat treatment, and processing cracks may occur. And the difference in hardness between the welded part and the base material becomes larger, and the height difference may occur during the polishing and the whole surface of the titanium roller used to manufacture the copper foil. Therefore, the Al content is preferably 5.0% by mass or less, and more preferably 4.5% by mass or less.
如上所述,Al係可有助於提升熔接部強度的元素,而會使熔接部的硬度上升。因此,要抑制熔接部的硬度上升時,宜一同含有Sn及/或Zr。 在所述情況下,例如Sn與Al之合計含量為0.2質量%以上且在6.0質量%以下,較佳係在0.3質量%以上且在5.5質量%以下。又,例如Zr與Al之合計含量為0.2質量%以上且在6.0質量%以下,較佳係在0.3質量%以上且在5.5質量%以下。As described above, Al-based elements can contribute to increasing the strength of the welded portion, and increase the hardness of the welded portion. Therefore, in order to suppress the increase in the hardness of the welded part, it is preferable to contain Sn and/or Zr together. In this case, for example, the total content of Sn and Al is 0.2% by mass or more and 6.0% by mass or less, preferably 0.3% by mass or more and 5.5% by mass or less. Moreover, for example, the total content of Zr and Al is 0.2% by mass or more and 6.0% by mass or less, preferably 0.3% by mass or more and 5.5% by mass or less.
上述Sn、Zr及Al只要合計含有上述的量即可,任1種或2種不含於熔接用鈦線材中亦可。The above-mentioned Sn, Zr, and Al may be contained in the above-mentioned amounts in total, and any one or two of them may not be included in the titanium wire for welding.
O為α穩定化元素,其可抑制高溫強度上升並提升常溫下之強度,並且可提升熔接部的硬度。為了獲得該效果,O含量設為0.01質量%以上。從控制熔接部硬度的觀點看來,O含量宜為0.015質量%以上,較佳係在0.02質量%以上。 另一方面,O含量若大於0.70質量%,熔接時便會發生在堆焊加工中之破裂。因此,O含量係在0.70質量%以下。O含量宜為0.60質量%以下,較佳係在0.50質量%以下。O is an alpha stabilizing element, which can suppress the increase in high temperature strength and increase the strength at room temperature, and can increase the hardness of the welded part. In order to obtain this effect, the O content is set to 0.01% by mass or more. From the viewpoint of controlling the hardness of the welded portion, the O content is preferably 0.015 mass% or more, and more preferably 0.02 mass% or more. On the other hand, if the O content is greater than 0.70% by mass, cracks will occur during the surfacing process during welding. Therefore, the O content is 0.70% by mass or less. The O content is preferably 0.60% by mass or less, and more preferably 0.50% by mass or less.
O的至少一部分宜在熔接用鈦線材中以粒狀的Ti、Sn、Zr及/或Al的氧化物的形態,例如以TiO2 、SnO、SnO2 、ZrO2 、Al2 O3 的形態存在。該等氧化物在熔接時係由電弧而解離,經解離的O在被熔接部形成氧化膜,抑制電弧局部性撞擊並穩定下來,而熔接部便會均質化。藉此,在熔接時可改善堆焊形狀及作業性。O可認為會在滾筒熔接部均質地固溶。At least a part of O is preferably present in the form of granular oxides of Ti, Sn, Zr and/or Al in the titanium wire for welding, for example, in the form of TiO 2 , SnO, SnO 2 , ZrO 2 , Al 2 O 3 . These oxides are dissociated by the arc during welding, and the dissociated O forms an oxide film on the welded part, which prevents the arc from locally impacting and stabilizes, and the welded part will be homogenized. Thereby, the surfacing shape and workability can be improved during welding. O is considered to be homogeneously dissolved in the welded part of the roller.
更具體而言,令對熔接用鈦線材藉由X射線繞射法獲得的α-鈦的波峰強度為A,且令TiO2 (110)、ZrO2 (111)、SnO2 (110)及Al2 O3 (104)的波峰強度之合計為B,此時B/A(射線強度比)宜在0.01以上。藉此,充分的量的氧化物就會被含於熔接用鈦線材中,而可充分獲得上述效果。B/A較佳係在0.015以上且在0.10以下,更佳係在0.02以上且在0.09以下。More specifically, let the peak intensity of α-titanium obtained by the X-ray diffraction method for the titanium wire for welding be A, and let TiO 2 (110), ZrO 2 (111), SnO 2 (110) and Al The sum of the peak intensities of 2 O 3 (104) is B. In this case, B/A (radiation intensity ratio) should be 0.01 or more. Thereby, a sufficient amount of oxide is contained in the titanium wire for welding, and the above-mentioned effects can be sufficiently obtained. B/A is preferably greater than 0.015 and less than 0.10, more preferably greater than 0.02 and less than 0.09.
本實施形態之熔接用鈦線材的X射線繞射,係對垂直於長度方向的截面使用Cu管球以電流40mA、電壓40kV及2θ的範圍10~110°來實施。測定係以0.01°的間隔、1s/點來實施,並可藉由在各測定點使試樣旋轉360°來進行。The X-ray diffraction of the titanium wire for welding of this embodiment is implemented using a Cu tube for a cross section perpendicular to the longitudinal direction at a current of 40 mA, a voltage of 40 kV, and a range of 2θ from 10 to 110°. The measurement is performed at 0.01° intervals, 1 s/point, and can be performed by rotating the sample 360° at each measurement point.
Fe係會強化β相的元素。在熔接部中,若β相的析出量變多就會影響巨觀模樣的生成,故熔接用鈦線材中Fe含量上限設為0.500%。Fe含量在0.100%以下為佳,較佳係在0.080%以下。Fe-based elements strengthen the β phase. In the welded part, an increase in the precipitation amount of the β phase will affect the formation of a macroscopic pattern, so the upper limit of Fe content in the titanium wire for welding is set to 0.500%. The Fe content is preferably 0.100% or less, preferably 0.080% or less.
N、C及H皆係若大量含有則會使延性與加工性降低的元素。因此,分別將N含量限制在0.100%以下,C含量限制在0.080%以下且H含量限制在0.015%以下。 N、C及H為不純物,其含量分別係越低越好。然而,該等元素有時會在製造過程中混入,而亦可將實質的含量下限設成N為0.0001%、C為0.0005%、H為0.0005%。N, C, and H are all elements that reduce ductility and workability if contained in large amounts. Therefore, the N content is limited to 0.100% or less, the C content is limited to 0.080% or less, and the H content is limited to 0.015% or less. N, C, and H are impurities, and the lower the content, the better. However, these elements may be mixed during the manufacturing process, and the actual lower limits of the content may be set to 0.0001% for N, 0.0005% for C, and 0.0005% for H.
本實施形態之熔接用鈦線材的化學組成中,剩餘部分含有鈦(Ti)及不純物,亦可由Ti及不純物所構成。不純物若要具體例示,則有在精煉步驟中混入之Cl、Na、Mg、Si及Ca、及從廢料混入之Cu、Mo、Nb、Ta及V等。含有該等不純物元素時,其含量例如只要各自為0.10質量%以下且總量更在0.50質量%以下則係無問題的程度。In the chemical composition of the titanium wire for welding of this embodiment, the remainder contains titanium (Ti) and impurities, and may be composed of Ti and impurities. If the impurity needs to be specifically exemplified, there are Cl, Na, Mg, Si, and Ca mixed in the refining step, and Cu, Mo, Nb, Ta, and V mixed from scrap. When these impurity elements are contained, for example, as long as the content is each 0.10% by mass or less and the total amount is 0.50% by mass or less, it is a level of no problem.
本實施形態之熔接用鈦線材的線徑並無特別限定,例如係0.8mm以上且在3.4mm以下。 本實施形態之熔接用鈦線材的截面形狀只要能供於熔接則亦無特別限定,可設為任意形狀。The wire diameter of the titanium wire for welding of this embodiment is not particularly limited, and for example, it is 0.8 mm or more and 3.4 mm or less. The cross-sectional shape of the titanium wire for welding of this embodiment is not particularly limited as long as it can be used for welding, and can be any shape.
熔接用鈦線材之製造可藉由例如以下方式來進行:利用孔模拉線、滾筒模拉線、型縫(Caliber)軋延等所行冷、溫及熱的塑性加工及粉末冶金。The production of the titanium wire for welding can be carried out by, for example, the following methods: cold, warm and hot plastic processing and powder metallurgy using hole die drawing, drum die drawing, and caliber rolling.
以上,根據本實施形態,藉由使熔接用鈦線材含有適量選自於由Sn、Zr及Al所構成群組中之1種以上元素,可使熔接部組織成為α相主體並將晶粒微細化。並且,藉由使熔接用鈦線材含有適量O,可控制熔接部硬度。其結果,在製造銅箔的鈦滾筒中便會抑制產生因熔接部所致之巨觀模樣。As described above, according to the present embodiment, by making the titanium wire for welding contain at least one element selected from the group consisting of Sn, Zr, and Al in an appropriate amount, the structure of the welded part can be made into the α-phase main body and the crystal grains can be fine.化. In addition, by containing a proper amount of O in the titanium wire for welding, the hardness of the welded portion can be controlled. As a result, in the titanium roller for manufacturing copper foil, the appearance of the macroscopic appearance due to the welded portion is suppressed.
尤其,要在熔接用鈦線材中含有粒狀的Ti、Sn、Zr及/或Al的氧化物時,可利用以下方法來製造熔接用鈦線材:以粉末冶金使其等含於線材中之方法、藉由使氧化物附著於棒線表面並進行拉線,來將氧化物壓接於表面之方法、及使氧化物附著於棒線表面並在750~1000℃下進行真空退火,來使其擴散並接合之方法等。雖然也有在中空鈦管插入粉狀氧化物來製造熔接用鈦線材之方法,但氧化物的分布容易產生參差,此時便會成為熔接部中之組成變動的一個因素,而在該部位之硬度及結晶粒徑產生變動。因此,本實施形態不採用在鈦管中插入粉狀氧化物之方法,視為不適用之方法。 實施例In particular, when the titanium wire for welding contains granular oxides of Ti, Sn, Zr, and/or Al, the following method can be used to manufacture the titanium wire for welding: a method of making it into the wire by powder metallurgy , By attaching oxides to the surface of the rod and wire, the oxide is crimped on the surface, and the oxide is attached to the surface of the rod and wire is vacuum-annealed at 750~1000℃ to make it Diffusion and bonding methods, etc. Although there is also a method of inserting powdered oxide into a hollow titanium tube to manufacture titanium wire for welding, the distribution of oxides is prone to unevenness. In this case, it will become a factor in the composition change in the welded part, and the hardness at this part And the crystal grain size changes. Therefore, this embodiment does not adopt the method of inserting powdery oxide into the titanium tube, and is regarded as an unsuitable method. Example
以下,顯示實施例並且具體說明本發明實施形態。以下所示實施例僅為本發明之一案例,本發明並不限於下述案例。Hereinafter, examples are shown and embodiments of the present invention are specifically described. The embodiment shown below is only one case of the present invention, and the present invention is not limited to the following cases.
1.製造鈦合金板 首先,藉由真空電弧再熔解法來製作具有表1、表2之化學組成的鑄錠後,將其進行熱鍛造,從而獲得預定組成的鈦合金板胚料。1. Manufacturing Titanium Alloy Plate First, an ingot with the chemical composition of Table 1 and Table 2 is produced by the vacuum arc remelting method, and then it is hot forged to obtain a titanium alloy sheet stock with a predetermined composition.
接著,將所得鈦合金板胚料加熱至表3及表4所示溫度(第1步驟)後,以表3及表4所示條件進行了熱軋延(第2步驟)。表中「200~650℃之軋縮率比率」係指合計軋縮率當中在200℃以上且650℃以下時之鈦合金板的軋延的軋縮率所占比率,「軋延比(L/T)」則在令最終軋延方向上的軋延之軋縮率為L(%)、在與最終軋延方向正交之方向上的軋延之軋縮率為T(%)時,表示L/T之值。另外,在表1及表2所示各發明例及比較例中,除比較例1外,為了在200℃以上且650℃以下進行鈦合金板的軋延,而暫時停止熱軋延,等到冷卻至650℃以下後再次開始熱軋延。 關於一部分案例,進行了冷軋延前退火及冷軋延。Next, the obtained titanium alloy sheet blank was heated to the temperature shown in Table 3 and Table 4 (first step), and then hot rolled under the conditions shown in Table 3 and Table 4 (second step). In the table, "Ratio of rolling reduction ratio at 200~650℃" refers to the ratio of rolling reduction ratio of titanium alloy sheet when the total rolling reduction ratio is above 200℃ and below 650℃. "Rolling ratio (L /T)” when the reduction ratio of rolling in the final rolling direction is L (%), and the reduction ratio of rolling in the direction orthogonal to the final rolling direction is T (%), Indicates the value of L/T. In addition, in each of the invention examples and comparative examples shown in Table 1 and Table 2, except for Comparative Example 1, in order to roll the titanium alloy sheet at 200°C or higher and 650°C or lower, the hot rolling was temporarily stopped and waited until cooling. After the temperature is below 650°C, the hot rolling is started again. In some cases, annealing before cold rolling and cold rolling were carried out.
接下來,在大氣環境下,按表3、表4中記載之溫度及時間進行熱處理(第3步驟),製得厚度8.0~15.0mm之鈦合金板。Next, in an atmospheric environment, heat treatment is performed at the temperature and time described in Table 3 and Table 4 (the third step) to produce a titanium alloy plate with a thickness of 8.0 to 15.0 mm.
[表1] [Table 1]
[表2] [Table 2]
[表3] [table 3]
[表4] [Table 4]
2. 分析及評估 針對各發明例及比較例之鈦合金板,就以下項目進行了分析及評估。2. Analysis and Evaluation The following items were analyzed and evaluated for the titanium alloy sheets of the invention examples and comparative examples.
2.1 結晶粒徑 各發明例及比較例之鈦合金板的金屬組織中結晶的平均結晶粒徑D及粒徑分布之標準差係如以下方式測定並算出。將經裁切鈦合金板而成之截面進行化學研磨後,利用電子背向散射繞射法,在2mm×2mm之區域中以2µm步距進行測定並測定10視野。然後,針對結晶粒徑,依據以EBSD測得之晶粒面積求算等效圓粒徑(面積A=π×(粒徑D/2)2 ),以其個數基準的平均值作為平均結晶粒徑D,並且依據結晶粒徑分布算出對數常態分布之標準差σ。2.1 Crystal grain size The average crystal grain size D and the standard deviation of the grain size distribution of the crystals in the metallic structure of the titanium alloy plates of the invention examples and comparative examples are measured and calculated as follows. After chemically polishing the cross section of the cut titanium alloy plate, the electron backscattering diffraction method is used to measure in a 2mm×2mm area with 2μm steps and measure 10 fields of view. Then, for the crystal grain size, calculate the equivalent circle size (area A=π×(grain size D/2) 2 ) based on the crystal grain area measured by EBSD, and take the average value based on the number as the average crystal Particle size D, and calculate the standard deviation σ of the logarithmic normal distribution based on the crystal size distribution.
2.2 集合組織 按以下方法,算出鈦合金板的板厚方向(ND)與α相之[0001]方向(c軸)所構成之角度θ為40°以下之晶粒的面積率。 將經裁切鈦合金板而成之截面進行化學研磨後,利用EBSD進行結晶方位解析。並且分別針對鈦合金板表面下部及板厚中央部,在2mm×2mm之區域中以步距2μm進行測定並測定10視野。關於該數據,使用TSL Solutions製之OIM Analysis軟體選出ND與c軸所構成之角度在40°以下之測定點數據。2.2 Collective Organization According to the following method, calculate the area ratio of crystal grains whose angle θ formed by the thickness direction (ND) of the titanium alloy plate and the [0001] direction (c-axis) of the α phase is 40° or less. After chemically polishing the cross section of the cut titanium alloy plate, EBSD is used to analyze the crystal orientation. In addition, the lower part of the surface of the titanium alloy plate and the central part of the thickness of the titanium alloy plate were measured in a 2 mm×2 mm area with a step of 2 μm, and 10 fields of view were measured. Regarding the data, use OIM Analysis software manufactured by TSL Solutions to select the measurement point data whose angle formed by the ND and the c axis is below 40°.
將各發明例及比較例之鈦材試樣之觀察表面進行化學研磨後,使用電子背向散射繞射法進行結晶方位解析,從而獲得(0001)極圖。更具體而言,係以2μm之間隔掃描2mm×2mm之區域,並使用TSL Solutions製之OIM Analysis軟體作成(0001)極圖。此時,以等高線最高的位置作為聚集度的尖峰位置,並以尖峰位置當中聚集度最大的值作為最大聚集度。最大聚集度係利用採用球諧函數法所得極圖之織構(Texture)解析而算出(展開指數=16,高斯半值寬=5°)。After chemically polishing the observation surface of the titanium material sample of each invention example and comparative example, the crystal orientation analysis was performed using the electron backscatter diffraction method to obtain a (0001) pole figure. More specifically, a 2mm×2mm area was scanned at 2μm intervals, and a (0001) pole figure was created using OIM Analysis software manufactured by TSL Solutions. At this time, the position with the highest contour line is taken as the peak position of the concentration degree, and the value of the maximum concentration degree among the peak positions is taken as the maximum concentration degree. The maximum concentration is calculated by using the texture analysis of the pole figure obtained by the spherical harmonic function method (expansion index=16, Gaussian half-value width=5°).
2.3 Al偏析 針對有無Al偏析(Al均勻性),如以下方式進行了確認。利用EPMA且將光束直徑設為500μm、步距尺寸設為與光束直徑相同的500μm,在從鈦合金板表面起算板厚的1/4位置中,對垂直於板厚方向的面20mm×20mm以上的區域進行組成分析。並且,為了將組成分析結果換算為合金元素濃度,係分析JIS1種工業用純鈦及作為對象之鈦合金板,根據該結果進行線形近似而採用所獲得之檢量線。然後,求算Al濃度為([Al%]-0.2)質量%以上且在([Al%]+0.2)質量%以下之區域的面積率。2.3 Al segregation The presence or absence of Al segregation (Al uniformity) was confirmed as follows. Use EPMA and set the beam diameter to 500μm and the step size to 500μm, which is the same as the beam diameter. In the 1/4 position of the plate thickness from the surface of the titanium alloy plate, the surface perpendicular to the plate thickness direction is 20mm×20mm or more Analysis of the composition of the area. In addition, in order to convert the composition analysis results into alloy element concentrations, JIS1 industrial pure titanium and target titanium alloy plates are analyzed, and linear approximation is performed based on the results, and the obtained calibration curve is adopted. Then, the area ratio of the region where the Al concentration is ([Al%]-0.2) mass% or more and ([Al%]+0.2) mass% or less is calculated.
2.4 雙晶 將各發明例及比較例之鈦合金板試樣之厚度方向截面進行化學研磨後,使用電子背向散射繞射法進行結晶方位解析。具體而言,在從試樣之鈦合金板表面起算板厚的1/4位置中,以2µm間隔掃描2mm×2mm之區域,並作成了反極圖分布圖(IPF:inverse pole figure)。此時,將以下視為雙晶界面:所產生的(10-12)雙晶、(10-11)雙晶、(11-21)雙晶及(11-22)雙晶之旋轉軸、及從結晶方位差(旋轉角)的理論值起2°以內。然後,以結晶方位差(旋轉角)在2°以上之晶界作為總結晶晶界長度,算出了雙晶晶界長度相對於總結晶晶界長度之比率。2.4 Double crystal After chemically polishing the thickness-direction cross-sections of the titanium alloy plate samples of the respective invention examples and comparative examples, the crystal orientation analysis was performed using the electron backscatter diffraction method. Specifically, in the 1/4 position of the plate thickness from the surface of the titanium alloy plate of the sample, an area of 2mm×2mm was scanned at 2μm intervals, and an inverse pole figure (IPF: inverse pole figure) was created. At this time, consider the following as the twin crystal interface: the rotation axis of the (10-12) twin crystal, (10-11) twin crystal, (11-21) twin crystal and (11-22) twin crystal produced, and Within 2° from the theoretical value of the crystal orientation difference (rotation angle). Then, the grain boundary with a crystal orientation difference (rotation angle) of 2° or more was taken as the total crystal grain boundary length, and the ratio of the twin grain boundary length to the total crystal grain boundary length was calculated.
2.5 α相的面積率 將各發明例及比較例之鈦合金板之厚度方向截面進行鏡面研磨後,藉由SEM/EPMA在從表面起算板厚的1/4位置中測定該截面之β相穩定化元素的濃度分布,並算出未有β相穩定化元素濃化的部分作為α相的面積率。2.5 α phase area ratio After mirror-polishing the thickness-direction cross-sections of the titanium alloy plates of each invention example and comparative example, the concentration distribution of β-phase stabilizing elements in the cross-section was measured by SEM/EPMA at a position of 1/4 of the plate thickness from the surface. And calculate the area ratio of the α phase where the β phase stabilizing element is not concentrated.
2.6 表面硬度 關於各發明例及比較例之鈦合金板的表面硬度,係在將鈦合金板表面研磨至成為鏡面後,依據JIS Z 2244:2009使用維氏硬度試驗機以荷重1kg測定3~5點,將所得之值平均作為表面硬度。2.6 surface hardness Regarding the surface hardness of the titanium alloy plate of each invention example and comparative example, after the surface of the titanium alloy plate is polished to a mirror surface, 3 to 5 points are measured using a Vickers hardness tester with a load of 1 kg in accordance with JIS Z 2244:2009. The obtained value is averaged as the surface hardness.
2.7 巨觀模樣 關於巨觀模樣,對各5~10片左右之50×100mm尺寸的各發明例及比較例之鈦合金板表面,利用#800之砂紙進行研磨後,使用硝酸10%及氫氟酸5%溶液腐蝕表面,藉此進行了觀察。接著,以產生有3mm以上長度的筋條狀模樣作為巨觀模樣,並且視產生比例的平均按下述方式進行評估。2.7 Major appearance Regarding the macroscopic appearance, the surface of the titanium alloy plate of each invention example and comparative example with a size of about 5 to 10 pieces of 50×100mm each was polished with #800 sandpaper, and then a solution of 10% nitric acid and 5% hydrofluoric acid was used. Corroded the surface and observed it. Next, a rib-like pattern with a length of 3 mm or more was used as a macro pattern, and the average of the generation ratio was evaluated in the following manner.
A:產生比例在1.0個/片以下(非常良好,在50×100mm中為1.0個以下) B:產生比例大於1.0個/片且在5.0個/片以下(良好,在50×100mm中大於1.0個且在5.0個以下) C:產生比例大於5.0個/片且在10.0個/片以下(稍微良好,在50×100mm中大於5.0個且在10.0個以下) D:產生比例大於10.0個/片(不合格,在50×100mm中大於10.0個) 將所得分析結果及評估結果列示於表5、表6。A: The production ratio is 1.0 pieces/piece or less (very good, 1.0 pieces or less in 50×100mm) B: The production ratio is greater than 1.0 pcs/sheet and 5.0 pcs/sheet or less (good, greater than 1.0 and 5.0 pcs or less in 50×100mm) C: The production ratio is more than 5.0 pieces/piece and 10.0 pieces/piece or less (slightly good, more than 5.0 pieces and 10.0 pieces or less in 50×100mm) D: The production ratio is greater than 10.0 pieces/piece (unqualified, more than 10.0 pieces in 50×100mm) The obtained analysis results and evaluation results are shown in Table 5 and Table 6.
2.8 研磨性 在上述用以觀察巨觀模樣之利用#800之砂紙所行研磨中,將研磨時間設為1分鐘來進行了研磨。在研磨時間1分鐘內去除了表面層時,判斷為可維持製造滾筒的生產性而評為研磨性良好(OK),無法在1分鐘內去除表面層時則判斷為製造滾筒的生產性降低,而評為不佳(NG)。2.8 abrasiveness In the above-mentioned grinding with #800 sandpaper for observing the macroscopic appearance, the grinding time was set to 1 minute for grinding. When the surface layer is removed within 1 minute of the polishing time, it is judged that the productivity of the manufacturing drum can be maintained and the abrasiveness is evaluated as good (OK), and when the surface layer cannot be removed within 1 minute, it is judged that the productivity of the manufacturing drum is reduced. And rated as bad (NG).
2.9 收縮配合性 收縮配合性係如以下方式進行了評估。收縮配合性會影響楊格率、形狀比(例如,若為管板則係內管的外徑與外管的內徑之比)。尤其,為了獲得要固定鈦所需之應力,鈦的楊格率越大越能以較小的變形量達成,因而可使加熱溫度降低,作業性提升。因此,將以楊格率計為135GPa以上的情況評為收縮配合性優異。2.9 shrink fit The shrink fit was evaluated in the following manner. The shrink fit will affect the Young's ratio and shape ratio (for example, if it is a tube sheet, it is the ratio of the outer diameter of the inner tube to the inner diameter of the outer tube). In particular, in order to obtain the stress required to fix the titanium, the larger the Young's rate of titanium, the smaller the amount of deformation can be achieved, so the heating temperature can be lowered and the workability can be improved. Therefore, the case where the Younger ratio is 135 GPa or more is rated as excellent in shrinkage compatibility.
將所得分析結果及評估結果列示於表5、表6。表5、表6所示「角度θ為0°以上且在40°以下之晶粒的面積率(%)」係α相的c軸相對於板厚方向所構成之角度為0°以上且在40°以下之晶粒的面積率。 另外,表2所示「Al均勻性(%)」係Al濃度為([Al%]-0.2)質量%以上且在([Al%]+0.2)質量%以下之區域的面積率。並且表2所示「冷軋延步驟」之「RT」意指室溫。The obtained analysis results and evaluation results are shown in Table 5 and Table 6. The "area ratio (%) of crystal grains with an angle θ of 0° or more and 40° or less" shown in Table 5 and Table 6 means that the angle formed by the c axis of the α phase with respect to the thickness direction is 0° or more and The area ratio of crystal grains below 40°. In addition, the "Al uniformity (%)" shown in Table 2 refers to the area ratio of a region where the Al concentration is ([Al%]-0.2) mass% or more and ([Al%]+0.2) mass% or less. In addition, the "RT" in the "cold rolling step" shown in Table 2 means room temperature.
[表5] [table 5]
[表6] [Table 6]
如表5、表6所示,發明例1~16及發明例101~115之鈦合金板已抑制了巨觀模樣。相對於此,比較例1~5之鈦合金板產生了許多巨觀模樣。 又,相較於Al含量高的發明例101~發明例115,Al含量低的發明例1~16更抑制了巨觀模樣的產生。另一方面,Al含量高的發明例101~發明例115之楊格率高,收縮配合性優異。As shown in Table 5 and Table 6, the titanium alloy plates of Invention Examples 1 to 16 and Invention Examples 101 to 115 have suppressed the macroscopic appearance. In contrast, the titanium alloy plates of Comparative Examples 1 to 5 produced many macroscopic appearances. In addition, compared with Invention Examples 101 to 115 with a high Al content, Invention Examples 1 to 16 with a low Al content suppressed the occurrence of macroscopic appearance. On the other hand, Inventive Example 101 to Inventive Example 115 having a high Al content had a high Younger ratio and excellent shrinkage compatibility.
<實施例2> 以鈦合金板作為母材,在加工成直徑1m的圓筒狀後使用表7所示熔接用鈦線材將對接部(鄰接的2個端部)熔接,該鈦合金板係設想會應用在製造銅箔的滾筒並且係表7所示之以與上述實施例1之發明例相同方法獲得者。熔接係將堆高厚度設為母材板厚的25%以下。接著,堆高後在200℃以下的溫度下將僅堆高分量減厚至母材厚度。最後將熔接部以600~800℃、20~90分鐘的條件進行熱處理,而獲得利用各發明例及各比較例之熔接用鈦線材之熔接試樣。<Example 2> The titanium alloy plate is used as the base material and processed into a cylindrical shape with a diameter of 1m, and then the butting parts (two adjacent ends) are welded using the titanium wire for welding shown in Table 7. This titanium alloy plate system is expected to be used in manufacturing The copper foil roll is obtained by the same method as the invention example of the above-mentioned Example 1 as shown in Table 7. The welding system sets the stack height to 25% or less of the base material thickness. Then, after the stacking, the thickness of only the stacking height is reduced to the thickness of the base material at a temperature below 200°C. Finally, the welding part was heat-treated under the conditions of 600 to 800°C for 20 to 90 minutes to obtain welding samples of the titanium wires for welding using the invention examples and the comparative examples.
[表7] [Table 7]
依據JIS G 0551:2013,根據比較法測定所得熔接部的金屬組織中的結晶粒徑,獲得粒度編號(GSN)。 並且,對熔接部的金屬組織使用SEM/EPMA來測定Fe或β相穩定化元素的濃度分布,將Fe濃度或β相穩定化元素的合計濃度係較測定範圍的平均濃度高1質量%以上的點(濃化部)定義為β相,並求算面積率。將面積率與體積率視為相等,而以所得面積率作為β相的體積率,且以未有β相穩定化元素濃化的部分(濃化部以外)的面積率作為α相的體積率,求算α相的體積率。 另外,以荷重1kg測定3~5點並藉由其平均值算出所得各發明例及各比較例之熔接試樣中熔接部及母材的維氏硬度(Hv)。並且使用接觸式粗度計,依據JISB0633:2001以λc:0.8mm、λs:2.5μm、rtip:2μm測定熔接部與母材部之境界的高低差(μm)。 針對所得各熔接試樣中熔接部的巨觀模樣,對5~10片左右50×100mm尺寸的各鈦合金板表面,利用#800的擦光輪進行研磨,並使用硝酸10%及氫氟酸5%溶液腐蝕表面後,進行觀察。接著,以產生有在3mm以上長度的筋條狀模樣作為巨觀模樣,並且視產生比例的平均按下述方式進行評估。According to JIS G 0551:2013, the crystal grain size in the metal structure of the obtained welded part was measured according to the comparative method, and the grain size number (GSN) was obtained. In addition, SEM/EPMA was used to measure the concentration distribution of Fe or β-phase stabilizing elements on the metal structure of the welded part, and the total concentration of Fe or β-phase stabilizing elements was higher than the average concentration of the measurement range by 1% by mass or more. The point (concentrated part) is defined as the β phase, and the area ratio is calculated. The area ratio and the volume ratio are considered equal, and the obtained area ratio is taken as the volume ratio of the β phase, and the area ratio of the portion where the β phase stabilizing element is not concentrated (other than the concentrated part) is taken as the volume ratio of the α phase , Calculate the volume ratio of α phase. In addition, the Vickers hardness (Hv) of the welded portion and the base material in the welded samples of each invention example and each comparative example was calculated by measuring 3 to 5 points with a load of 1 kg and calculating the average value. In addition, a contact roughness meter was used to measure the height difference (μm) of the boundary between the welded part and the base material part in accordance with JISB0633:2001 with λc: 0.8 mm, λs: 2.5 μm, and rtip: 2 μm. For the macroscopic appearance of the welded part in each welded sample, the surface of each titanium alloy plate with a size of about 5-10 pieces of 50×100mm was polished with a #800 buffing wheel, and 10% nitric acid and hydrofluoric acid were used. After the% solution corrodes the surface, observe it. Next, a rib-like pattern with a length of 3 mm or more was generated as a macro pattern, and the average of the generation ratio was evaluated in the following manner.
A:產生比例在1.0個/片以下(非常良好,在50×100mm中為1.0個以下) B:產生比例大於1.0個/片且在5.0個/片以下(良好,在50×100mm中大於1.0個且在5.0個以下) C:產生比例大於5.0個/片且在10.0個/片以下(稍微良好,在50×100mm中大於5.0個且在10.0個以下) D:產生比例大於10.0個/片(不合格,在50×100mm中大於10.0個) 並且,在熔接部與母材部的境界產生有5μm以上高低差時,在巨觀模樣欄位中亦評為D。A: The production ratio is 1.0 pieces/piece or less (very good, 1.0 pieces or less in 50×100mm) B: The production ratio is greater than 1.0 pcs/sheet and 5.0 pcs/sheet or less (good, greater than 1.0 and 5.0 pcs or less in 50×100mm) C: The production ratio is more than 5.0 pieces/piece and 10.0 pieces/piece or less (slightly good, more than 5.0 pieces and 10.0 pieces or less in 50×100mm) D: The production ratio is greater than 10.0 pieces/piece (unqualified, more than 10.0 pieces in 50×100mm) In addition, when there is a height difference of 5 μm or more between the welded part and the base material part, it is also rated as D in the macro pattern column.
另外,利用測深規測定藉由熔接獲得的熔接焊珠中任意的50cm區間之凸部、凹部各10點,令凸部排名前3點的平均高度為h、凹部倒數3點的平均高度為D且令測定點20點的平均高度為A時,(h-A)/A、(A-D)/A之值若皆在0.3以下則評為OK,在0.1以下時則評為Ex。 於表8列示結果。In addition, use a depth gauge to measure 10 points each of the convex and concave parts of any 50cm interval in the welded bead obtained by welding, and make the average height of the top 3 points of the convex part be h, and the average height of the bottom 3 points of the concave part as D And when the average height of the 20 measuring points is A, if the values of (hA)/A and (AD)/A are all below 0.3, it is rated as OK, and when the value is below 0.1, it is rated as Ex. The results are shown in Table 8.
[表8] [Table 8]
如表8所示,發明例201~205抑制了熔接部的巨觀模樣的生成。另一方面,比較例201及202產生了許多熔接部的巨觀模樣。As shown in Table 8, Inventive Examples 201 to 205 suppressed the formation of the macroscopic appearance of the welded part. On the other hand, Comparative Examples 201 and 202 produced many macroscopic appearances of welded parts.
產業上之可利用性 根據本發明,可提供一種鈦合金板及使用該鈦合金板來製造之製造銅箔的滾筒,前述鈦合金板在使用於銅箔製造用之滾筒時可抑制產生巨觀模樣。Industrial availability According to the present invention, it is possible to provide a titanium alloy plate and a copper foil roll manufactured by using the titanium alloy plate. When the titanium alloy plate is used in a copper foil manufacturing roll, it is possible to suppress the appearance of macroscopic appearance.
1:製造銅箔的裝置 2:電沉積滾筒 10:電解槽 20:製造銅箔的滾筒 21:內滾筒 22:鈦合金板 23:熔接部 30:電極板 40:捲取部 50:導輥 60:捲取輥 A:銅箔 b,b1,b2:虛線 G1,G2,G3,R1,R2:區域 ND,RD,TD:方向 P1,P2:尖峰 θ:角度1: Device for manufacturing copper foil 2: Electrodeposition roller 10: Electrolyzer 20: Roller for manufacturing copper foil 21: inner drum 22: Titanium alloy plate 23: Welding part 30: Electrode plate 40: Coiling section 50: guide roller 60: take-up roller A: Copper foil b, b1, b2: dotted line G1, G2, G3, R1, R2: area ND, RD, TD: direction P1, P2: spikes θ: Angle
圖1係從本發明一實施形態之鈦合金板之軋延面且從法線方向(ND)之(0001)極圖之一例。 圖2係顯微鏡照片,其顯示在腐蝕後的鈦合金板表面觀察到的巨觀模樣之一例。 圖3係參考圖,其為了顯示巨觀模樣的位置而強調出巨觀模樣。 圖4係用以說明α相之結晶方位的說明圖。 圖5係結晶方位分布圖之一例,其顯示結晶方位解析之一例。 圖6係從軋延面的法線方向(ND)之(0001)極圖的說明圖,其係用以說明本發明一實施形態之鈦合金板的結晶方位。 圖7係製造銅箔的裝置之示意圖。 圖8係本實施形態之製造銅箔的滾筒之示意圖。Fig. 1 is an example of the (0001) pole figure from the rolling surface of a titanium alloy sheet according to an embodiment of the present invention and from the normal direction (ND). Figure 2 is a micrograph showing an example of the macroscopic appearance observed on the surface of the corroded titanium alloy plate. Fig. 3 is a reference diagram, which emphasizes the macro appearance in order to show the position of the macro appearance. Fig. 4 is an explanatory diagram for explaining the crystal orientation of the α phase. Fig. 5 is an example of a crystal orientation distribution map, which shows an example of crystal orientation analysis. 6 is an explanatory diagram of the (0001) pole figure from the normal direction (ND) of the rolling surface, which is used to illustrate the crystal orientation of the titanium alloy sheet according to an embodiment of the present invention. Fig. 7 is a schematic diagram of an apparatus for manufacturing copper foil. Fig. 8 is a schematic diagram of the roller for manufacturing copper foil of the present embodiment.
P1,P2:尖峰 P1, P2: spikes
RD,TD:方向 RD, TD: direction
b:虛線 b: dotted line
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