TWI731376B - Flexible circuit board having rough solder resist layer and manufacturing method thereof - Google Patents
Flexible circuit board having rough solder resist layer and manufacturing method thereof Download PDFInfo
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本發明係有關於軟質線路基板,特別關於可承載半導體晶片的軟質線路基版。 The present invention relates to a flexible circuit substrate, and particularly relates to a flexible circuit substrate capable of carrying semiconductor chips.
承載晶片用的軟質線路基板多為捲軸狀薄膜。在業界軟質線路基板與晶片的結合依不同裝配模式有各種稱呼,例如TCP(Tape Carrier Package捲帶式載體封裝)或COF(Chip On Film薄膜覆晶封裝)。TCP及COF都是運用軟質線路基板作為封裝晶片的載體,透過熱壓合將晶片上的金凸塊(Gold Bump)與位在軟性基板電路上之銅配線圖案的內引腳(Inner Lead)接合。 The flexible circuit substrates used to carry wafers are mostly reel-shaped films. In the industry, the combination of flexible circuit substrates and chips has various names according to different assembly modes, such as TCP (Tape Carrier Package) or COF (Chip On Film). Both TCP and COF use a flexible circuit substrate as the carrier of the packaged chip. The gold bump on the chip is bonded to the inner lead of the copper wiring pattern on the flexible substrate circuit by thermocompression bonding. .
為了使軟性基板電路與晶片之金凸塊連接,必須要有金錫共晶物的存在,其中金由晶片之金凸塊提供,錫就由形成在內引腳表面的錫供應,因此,內引腳的表面鍍有錫層。除了內引腳外,銅配線圖案還有外引腳等與其他電子元件連接的導電端子,這些端子也有鍍錫層。銅配線圖案上沒有鍍錫層的部分會另以防焊油墨覆蓋來加以保護。 In order to connect the flexible substrate circuit with the gold bumps of the chip, there must be a gold-tin eutectic. The gold is provided by the gold bumps of the chip, and the tin is supplied by the tin formed on the surface of the inner pin. Therefore, the inner The surface of the pin is plated with a tin layer. In addition to the inner pins, the copper wiring pattern also has outer pins and other conductive terminals connected to other electronic components. These terminals also have a tin-plated layer. The part of the copper wiring pattern that is not tinned will be covered with solder resist ink to protect it.
習知之軟性基板電路易產生以下問題,其一為鍍錫層表面形成晶鬚,導致相鄰線路短路;其二為防焊油墨及鍍錫層的界面產生凹洞,導致線路斷裂。專利文獻1(日本專利JP3061613)揭示的方案是在銅配線圖案上先全面地形成薄鍍錫層(a),然後於配線圖案之非引腳區塗佈防焊油墨,之後再於引腳區形成厚鍍錫層(b)。專利文獻1認為銅配線圖案全面形成的薄鍍錫層(a)可防止凹洞產 生,厚鍍錫層(b)可防止產生晶鬚。專利文獻2(台灣專利TW531864)揭示另一種方法,係依序形成第一防焊油墨於非引腳區、形成薄鍍錫層於引腳區、再形成第二防焊油墨覆蓋第一防焊油墨及薄錫層之交界處、及最後形成厚鍍錫層於薄錫層上。 Conventional flexible substrate circuits are prone to the following problems. One is that whiskers are formed on the surface of the tin-plated layer, causing short circuits between adjacent circuits; the other is that cavities are generated at the interface between the solder mask and the tin-plated layer, causing the circuit to break. Patent Document 1 (Japanese Patent JP3061613) discloses a solution to form a thin tin-plated layer (a) on the copper wiring pattern first, and then apply solder resist ink to the non-lead area of the wiring pattern, and then apply solder mask to the lead area. A thick tin-plated layer (b) is formed. Patent Document 1 believes that the thin tin-plated layer (a) formed on the entire surface of the copper wiring pattern can prevent the formation of cavities. The thick tinned layer (b) can prevent the generation of whiskers. Patent Document 2 (Taiwan Patent TW531864) discloses another method, which is to sequentially form a first solder mask on the non-lead area, form a thin tin-plated layer on the lead area, and then form a second solder mask ink to cover the first solder mask. At the junction of the ink and the thin tin layer, and finally a thick tin plating layer is formed on the thin tin layer.
本案發明人經研究後發現上述習知技術在實務上仍存在許多問題。舉例而言,專利文獻1於銅配線圖案全面形成的薄鍍錫層,此對需要彎折的產品是不利的,因為鍍錫層的硬度通常偏高。再者,不論是專利文獻1或專利文獻2皆教示在最後塗佈防焊油墨之後形成厚鍍錫層,因此頂層的防焊油墨仍會浸泡在鍍錫槽中一段時間,特別是鍍厚錫的時間又較長,這使得頂層防焊油墨與厚鍍錫層的界面產生凹洞的機會增加。此外,專利文獻2有兩次施作防焊油墨後才進錫槽的製程,造成清洗被防焊油墨汙染錫槽的高成本。又,專利文獻2所教示兩次防焊油墨兩次鍍錫交錯實施製程,其實務上易混淆,造成生產動線安排的困擾。此外,本案發明人更發現,習知塗佈兩次防焊油墨的作法,在實務上容易造成防焊油墨產生肥厚的邊緣。當COF的外引腳要與顯示器導電玻璃基板壓接時,容易受到防焊油墨肥厚邊緣的影響而產生壓接不良。 After research, the inventor of this case found that the above-mentioned conventional technology still has many problems in practice. For example, Patent Document 1 has a thin tin-plated layer formed on the entire surface of the copper wiring pattern, which is disadvantageous for products that need to be bent, because the tin-plated layer usually has a high hardness. Furthermore, both Patent Document 1 and Patent Document 2 teach that a thick tin-plated layer is formed after the solder resist ink is finally applied. Therefore, the solder resist ink on the top layer will still be soaked in the tin-plating bath for a period of time, especially for thick tin plating. The time is longer, which increases the chance of cavities at the interface between the top solder mask and the thick tin-plated layer. In addition, Patent Document 2 has the process of applying solder resist ink twice before entering the tin bath, which results in a high cost of cleaning the tin bath contaminated by the solder resist ink. In addition, patent document 2 teaches two times of solder resist ink and two times of tinning staggered implementation process, in fact, it is easy to confuse, causing troubles in the arrangement of production lines. In addition, the inventor of the present case discovered that the conventional method of applying the solder mask ink twice in practice is likely to cause the solder mask ink to produce thick edges. When the outer pins of the COF are to be crimped with the conductive glass substrate of the display, they are susceptible to the influence of the thick edges of the solder mask ink and cause crimp failure.
有鑑於上述,於一方面,本發明提出一種新穎的軟質線路基板之製造方法,無兩次防焊油墨兩次鍍錫交錯實施製程。本發明也在最後錫層完成後塗佈頂層防焊油墨,以免頂層防焊油墨浸泡在鍍錫槽中。同時本發明也進一步粗化防焊層以降低外引腳與防焊層的高度差,改善壓接不良的現象。 In view of the above, in one aspect, the present invention proposes a novel method for manufacturing a flexible circuit substrate, which does not require two solder mask inks and two tin plating processes. The invention also coats the top solder resist ink after the final tin layer is completed, so as to prevent the top solder resist ink from being immersed in the tin plating tank. At the same time, the present invention also further roughens the solder resist layer to reduce the height difference between the outer lead and the solder resist layer and improve the phenomenon of poor crimping.
依據一實施例,本發明提供一種用於承載晶片之軟質線路基板的製造方法,依序包含以下步驟:(a)提供具有配線圖案的一導電銅層於一絕緣基材上;(b)形成一第一防焊層部分地覆蓋該配線圖案;(c)以該第一防焊層為遮罩形成一第一錫層於該導電銅層上; (d)以該第一防焊層為遮罩形成一第二錫層於該第一錫層上;及(e)形成一第二防焊層部分地覆蓋該第二錫層及至少部分地覆蓋該第一防焊層;及(f)粗化該第二防焊層以使該第二防焊層具有一粗化表面。 According to one embodiment, the present invention provides a method for manufacturing a flexible circuit substrate for carrying a chip, which sequentially includes the following steps: (a) providing a conductive copper layer with a wiring pattern on an insulating substrate; (b) forming A first solder resist layer partially covers the wiring pattern; (c) using the first solder resist layer as a mask to form a first tin layer on the conductive copper layer; (d) using the first solder mask as a mask to form a second tin layer on the first tin layer; and (e) forming a second solder mask to partially cover the second tin layer and at least partially Covering the first solder mask; and (f) roughening the second solder mask so that the second solder mask has a roughened surface.
依據一實施例,本發明提供如前述之製造方法,其中該步驟(c)及該步驟(d)之間沒有形成防焊層的步驟。 According to one embodiment, the present invention provides the aforementioned manufacturing method, wherein there is no step of forming a solder mask between step (c) and step (d).
依據一實施例,本發明提供如前述之製造方法,其中經由該步驟(d)使得該第一防焊層至少部分地覆蓋該第二錫層。 According to an embodiment, the present invention provides the aforementioned manufacturing method, wherein the first solder mask layer at least partially covers the second tin layer through the step (d).
依據一實施例,本發明提供如前述之製造方法,其中經由該步驟(d)使得該第一錫層與該第二錫層之界面共形於該第一錫層與該導電銅層的界面。 According to one embodiment, the present invention provides the aforementioned manufacturing method, wherein the interface between the first tin layer and the second tin layer is made conformal to the interface between the first tin layer and the conductive copper layer through the step (d) .
依據一實施例,本發明提供如前述之製造方法,其中該第二防焊層未與鍍錫液接觸。 According to one embodiment, the present invention provides the aforementioned manufacturing method, wherein the second solder mask is not in contact with the tin plating solution.
於另一方面,本發明提供一種軟質線路基板的製造方法,係縮小第一防焊層或第二防焊層的塗佈面積以降低防焊油墨對錫槽的污染量。舉例而言,第一防焊層可選擇性地只塗佈軟質線路基板於產品應用端時會彎折的區域;或第二防焊層可選擇性地覆蓋住第一防焊層的外緣,而不需要將第一防焊層完全覆蓋。 In another aspect, the present invention provides a method for manufacturing a flexible circuit substrate, which reduces the coating area of the first solder mask layer or the second solder mask layer to reduce the contamination of the solder bath with the solder mask ink. For example, the first solder mask can selectively coat only the area where the flexible circuit substrate will bend when the product is applied; or the second solder mask can selectively cover the outer edge of the first solder mask , Without the need to completely cover the first solder mask.
依據一實施例,本發明提供一種用於承載晶片之軟質線路基板的製造方法,依序包含以下步驟:(a)提供具有配線圖案的一導電銅層於一絕緣基材上,其中該配線圖案具有一測試引腳區,一內引腳區及一外引腳區,;(b)形成一第一防焊層部分地覆蓋該配線圖案,該第一防焊層未覆蓋介於該測試引腳區與該內引腳區之間的配線圖案;(c)以該第一防焊層為遮罩形成一第一錫層於該導電銅層上;(d)以該第一防焊層為遮罩形成一第二錫層於該第一錫層上; (e)形成一第二防焊層部分地覆蓋該第二錫層及至少部分地覆蓋該第一防焊層;及(f)粗化該第二防焊層以使該第二防焊層具有一粗化表面。 According to one embodiment, the present invention provides a method for manufacturing a flexible circuit substrate for carrying a chip, which sequentially includes the following steps: (a) providing a conductive copper layer with a wiring pattern on an insulating substrate, wherein the wiring pattern It has a test lead area, an inner lead area and an outer lead area; (b) a first solder resist layer is formed to partially cover the wiring pattern, and the first solder resist layer does not cover the test lead The wiring pattern between the pin area and the inner pin area; (c) using the first solder mask as a mask to form a first tin layer on the conductive copper layer; (d) using the first solder mask Forming a second tin layer on the first tin layer for the mask; (e) forming a second solder resist layer partially covering the second tin layer and at least partially covering the first solder resist layer; and (f) roughening the second solder resist layer to make the second solder resist layer Has a roughened surface.
依據一實施例,本發明提供如前述之製造方法,其中於該步驟(e)該第二防焊層未完全覆蓋該第一防焊層。 According to one embodiment, the present invention provides the aforementioned manufacturing method, wherein in step (e) the second solder mask does not completely cover the first solder mask.
於更另一方面本發明更包含藉由上述之各種方法所形成之軟質線路基板的各種結構。 In another aspect, the present invention further includes various structures of flexible circuit substrates formed by the above-mentioned various methods.
10:軟質線路基板半成品 10: Semi-finished soft circuit board
100:絕緣基材 100: insulating base material
101:傳動孔 101: Transmission hole
110:導電銅層 110: conductive copper layer
P:配線圖案 P: Wiring pattern
1B:參考圖 1B: Reference diagram
Lo:外引腳區 Lo: Outer pin area
Ps:非引腳區 Ps: non-pin area
Ln:內引腳區 Ln: inner pin area
Lt:測試引腳區 Lt: Test pin area
121:第一防焊層 121: The first solder mask
121a:第一邊緣 121a: first edge
131:第一錫層 131: The first tin layer
131a:第一側邊 131a: first side
Iss:界面 Iss: interface
Isc:界面 Isc: interface
132:第二錫層 132: The second tin layer
122:第二防焊層 122: second solder mask
122’:第二防焊層 122’: The second solder mask
122a:第二邊緣 122a: second edge
132a:第二側邊 132a: second side
X:橫向距離 X: horizontal distance
Y:橫向距離 Y: horizontal distance
161:錫層 161: Tin layer
161a:縱向界面 161a: Portrait interface
162:防焊層 162: Solder mask
162a:邊緣 162a: Edge
163:露出部分 163: Exposed part
Z:橫向距離 Z: horizontal distance
圖1A為本發明依據一實施例之軟質線路基板半成品俯視示意圖。 FIG. 1A is a schematic top view of a semi-finished flexible circuit substrate according to an embodiment of the present invention.
圖1B為圖1A之半成品中某特定區域之剖面示意圖。 Fig. 1B is a schematic cross-sectional view of a specific area in the semi-finished product of Fig. 1A.
圖1B及圖2至圖6顯示本發明依據一實施例之軟質線路基板製造過程各步驟剖面示意圖。 1B and FIGS. 2 to 6 show schematic cross-sectional views of various steps in the manufacturing process of a flexible circuit substrate according to an embodiment of the present invention.
圖7為本發明依據一實施例之軟質線路基板的結構示意圖。 FIG. 7 is a schematic diagram of the structure of a flexible circuit substrate according to an embodiment of the present invention.
以下將參考所附圖式示範本發明之較佳實施例。為避免模糊本發明之內容,以下說明亦省略習知之元件、相關材料、及其相關處理技術。同時,為清楚說明本發明,所附圖式中各元件未必按實際的尺寸或相對比例繪製。 Hereinafter, the preferred embodiments of the present invention will be demonstrated with reference to the accompanying drawings. In order to avoid obscuring the content of the present invention, the following description also omits conventional components, related materials, and related processing techniques. At the same time, in order to clearly illustrate the present invention, the various elements in the accompanying drawings may not be drawn according to actual sizes or relative proportions.
本發明軟質線路基板的製造方法。 The method for manufacturing a flexible circuit substrate of the present invention.
依據第一實施例本發明之用於承載晶片之軟質線路基板的製造方法,依序包含:步驟(a)提供具有配線圖案的一導電銅層於一絕緣基材上;步驟(b)形成一第一防焊層部分地覆蓋該配線圖案;步驟(c)以該第一防焊層為遮罩形成一第一錫層於該導電銅層上;步驟(d)以該第一防焊層為遮罩形成一第二錫層於該第一錫層上; 步驟(e)形成一第二防焊層部分地覆蓋該第二錫層及至少部分地覆蓋該第一防焊層;及步驟(f)粗化該第二防焊層以使該第二防焊層具有一粗化表面。 According to the first embodiment, the method of manufacturing a flexible circuit substrate for carrying a chip of the present invention sequentially includes: step (a) providing a conductive copper layer with a wiring pattern on an insulating substrate; step (b) forming a The first solder resist layer partially covers the wiring pattern; step (c) uses the first solder resist layer as a mask to form a first tin layer on the conductive copper layer; step (d) uses the first solder resist layer Forming a second tin layer on the first tin layer for the mask; Step (e) forming a second solder resist layer partially covering the second tin layer and at least partially covering the first solder resist layer; and step (f) roughening the second solder resist layer to make the second solder resist layer The solder layer has a roughened surface.
步驟(a)提供具有配線圖案的一導電銅層於一絕緣基材上。 Step (a) provides a conductive copper layer with a wiring pattern on an insulating substrate.
圖1A為本發明之軟質線路基板半成品10俯視示意圖。參考圖1A,軟質線路基板半成品10之薄膜帶狀的絕緣基材100之一面上連續地形成有複數個由導電銅層110構成的配線圖案P。絕緣基材100的上下兩側具有移送用的多個傳動孔101。導電銅層110(或配線圖案P)定義一非引腳區Ps(以虛線框起來的部分),此區域將於後續由防焊層所覆蓋以保護線路。配線圖案P之非引腳區Ps以外的區域即引腳區,可再區分成內引腳區Ln、外引腳區Lo及視需要存在的測試引腳區Lt,內引腳區Ln將與晶片相接,外引腳區Lo將外接電路板或其他電子裝置,測試引腳區Lt則用於與量測儀器相接,以檢測封裝晶片的品質。圖1B為圖1A中箭頭1B所指之處(即配線圖案P其中一條線路)的剖面示意圖。參考圖1B,可清楚了解導電銅層110位於絕緣基材100上。絕緣基材100可使用軟性且具有耐藥品性及耐熱性的材料,例如聚酯、聚醯胺、聚醯亞胺等。絕緣基材100的厚度一般為12至85μm,較佳為20至50μm。在絕緣基材100上形成具配線圖案P的導電銅層110是藉由習知的微影法。導電銅層110的厚度例如2至20μm,較佳為5至12μm。
FIG. 1A is a schematic top view of the semi-finished
步驟(b)形成一第一防焊層部分地覆蓋該配線圖案。 Step (b) forming a first solder resist layer partially covering the wiring pattern.
參考圖1A及圖2,形成一第一防焊層121使其至少部分地覆蓋配線圖案P,例如覆蓋非引腳區Ps的一部分或全部。於較佳實施例,第一防焊層121只需施加於非引腳區Ps的某些特定區域,譬如只需施加於此軟質線路基板產品之後端應用時產生的彎折區域。此彎折區域的實際位置視後端應用產品的特性而變化,其中介於內引腳區Ln與外引腳區Lo之間的區域為現有常見的彎折區域。因此,於本發明之較佳實施例,第一防焊層121未覆蓋介於測試引腳區Lt與內引腳區Ln之間的非引腳區Ps,然本發明不以此為限。本發明也有第一防焊層121將所有非引腳區Ps完全覆蓋的實施例。可使用習知之環氧樹脂(o-Cresol
Novalac/Phenol/DGEBA)類型的油墨或其他合適的油墨以網版印刷技術完成此步驟。第一防焊層121的厚度可在3至15μm的範圍。
Referring to FIGS. 1A and 2, a
步驟(c)以該第一防焊層為遮罩形成一第一錫層於該導電銅層上。 Step (c) using the first solder mask as a mask to form a first tin layer on the conductive copper layer.
參考圖3,以第一防焊層121為遮罩形成一第一錫層131於導電銅層110上。藉由習知無電解電鍍(即化學電鍍)技術形成第一錫層131。例如將步驟(b)所形成之半成品浸泡於含硫酸、過硫酸鉀、或氟硼化錫之鍍錫液的錫槽中一段預定時間後水洗再吹乾,之後再入烤箱進行熱處理即可。在此步驟中,第一錫層131除鍍於導電銅層110沒有被第一防焊層121覆蓋的表面外,可進一步使鍍錫液侵入第一防焊層121之第一邊緣121a底下的導電銅層110,因此形成第一防焊層121的第一邊緣121a覆蓋了第一錫層131之第一側邊131a的結構。第一錫層131的厚度可在0.02至0.16μm的範圍,較佳實施例之第一錫層131的厚度為0.10μm。
Referring to FIG. 3, a
步驟(d):以該第一防焊層為遮罩形成一第二錫層於該第一錫層上。 Step (d): using the first solder mask as a mask to form a second tin layer on the first tin layer.
參考圖4,以第一防焊層121為遮罩形成第二錫層132於第一錫層131上。較佳而言,步驟(c)及步驟(d)之間沒有額外形成防焊層的步驟。可如步驟(c),藉由習知無電解電鍍(即化學電鍍)技術形成第二錫層132。例如將步驟(c)所形成之半成品浸泡於含硫酸、過硫酸鉀、或氟硼化錫之鍍錫液的錫槽中一段預定時間後水洗再吹乾,之後再入烤箱進行熱處理即可。步驟(c)第一次鍍錫所獲得之錫銅合金層透過熱處理高溫會生成Cu3Sn,此可減緩步驟(d)第二次鍍錫所產生的錫層之Cu6Sn5的生成擴散速率,進而減緩純錫層減損速率,提高線路與晶片間共晶接合良率,並避免產生錫鬚。在此步驟中,可進一步使鍍錫液侵入第一防焊層121之第一邊緣121a底下,形成第一防焊層121的第一邊緣121a覆蓋了第二錫層132之第二側邊132a的結構。第二錫層132的厚度可在0.12至0.5μm的範圍,較佳實施例之第一錫層132的厚度為0.28μm。因為步驟(c)與(d)都使用無電解電鍍(即化學電鍍)技術,且都以第一防焊層121為遮罩,因此在步驟(d)第一錫層131
會被第二錫層132往銅密度高的區域推進,使得第一錫層131與第二錫層132之界面Iss與第一錫層131與導電銅層110的界面Isc共形(conformal)。
Referring to FIG. 4, a
步驟(e)形成一第二防焊層部分地覆蓋該第二錫層及至少部分地覆蓋該第一防焊層。 Step (e) forming a second solder resist layer partially covering the second tin layer and at least partially covering the first solder resist layer.
參考圖5,形成一第二防焊層122部分地覆蓋第二錫層132及至少部分地覆蓋第一防焊層121。較佳而言,此步驟形成第二防焊層122至少覆蓋於步驟(d)第二錫層132與第一防焊層121所形成之接觸面。在步驟(d),第一防焊層121浸泡在錫槽中,可能因此弱化第一防焊層121與第二錫層132的接觸面,因此利用第二防焊層122將此接觸面覆蓋可避免防焊層從錫層剝離。可使用習知之環氧樹脂(o-Cresol Novalac/Phenol/DGEBA型)類型油墨或其他合適的油墨以網版印刷技術完成此步驟。第二防焊層122的厚度可在3至20μm的範圍。在此實施例,第二防焊層122是對非引腳區Ps全區印刷因此完全覆蓋住第一防焊層121,然本發明不以此為限。本發明也包含第二防焊層122只部分地覆蓋住第一防焊層121(只覆蓋其外緣)及部分地覆蓋住第二錫層132的實施例。
Referring to FIG. 5, a second
(f)粗化該第二防焊層以使該第二防焊層具有一粗化表面。 (f) Roughening the second solder mask so that the second solder mask has a roughened surface.
參考圖6,於完成第二防焊層122之印刷與熱處理固化後,進行表面粗化處理步驟以形成具有粗化表面601的第二防焊層122’。可使用任何合適的方法完成此步驟。例如採用物理粗化方式,如滾珠法、刷磨法或磨砂法。較佳為定位差刷磨法,此方法可透過氧化鋁研磨材或碳化矽研磨材來控制刷磨設備與第二防焊層122表面之間保持連續且恆定的距離範圍,藉此進行彈性刷磨與輕量切削,達到粗化效果。因第二防焊層122與第二錫層132的表面有高低差,研磨時不致磨到錫層或配線圖案。如圖6所示,經粗化後,第二錫層132與第二防焊層122’之高度差下降,可改善壓接不良的現象。而且,第二防焊層122’表面具有高粗糙度,也可增加表面積,強化其與灌封(potting)膠之間的結合程度。灌封膠通常用來包覆內引腳區Ln,其需與防焊層緊密結合以保護IC晶片與內引腳所接合的線路。在此實施例,較佳而言,第二防焊層122’之粗化表面601之表面粗
度Rz範圍為:0.04~5.0μm,較佳範圍為0.16~4.5μm,更佳範圍為0.6~4.0μm。表面粗度Rz的量測係將完成粗化的樣品裁切成約為5cm×5cm大小,以非接觸式形狀測量雷射顯微鏡(KEYENCE台灣基恩斯之型號VK-X100)測定。測定時係使用雷射光點直徑約1μm,物鏡倍率設定10X,視野範圍1350μm x 1012μm、以及物鏡倍率設定20X,視野範圍675μm x 506μm,以掃描時間約10~20秒,線距pitch設定2μm作測定。
Referring to FIG. 6, after the printing and heat treatment curing of the second
本發明軟質線路基板的結構。 The structure of the flexible circuit substrate of the present invention.
同時參考圖1A及圖6,於第一實施例本發明用於承載晶片的軟質線路基板包含具有配線圖案P的導電銅層110於絕緣基材100上;第一錫層131位於導電銅層110上方;第二錫層132位於第一錫層131上方;第一防焊層121覆蓋未被第一錫層131及第二錫層132覆蓋的導電銅層110,且第一防焊層121部分地覆蓋第二錫層132;及第二防焊層122’部分地覆蓋第二錫層132及至少部分地覆蓋第一防焊層121,其中該第二防焊層122’具有一粗化表面601,該粗化表面601之表面粗度Rz範圍為:0.04~5μm,較佳範圍為0.16~4.5μm,更佳範圍為0.6~4.0μm。
Referring to FIGS. 1A and 6 at the same time, in the first embodiment, the flexible circuit substrate for carrying a chip of the present invention includes a
於另一實施例,可參考圖6,本發明提供用於承載晶片的軟質線路基板,其中第一防焊層121具有一第一邊緣121a接觸第二錫層132。
In another embodiment, referring to FIG. 6, the present invention provides a flexible circuit substrate for carrying a chip, wherein the
於另一實施例,可參考圖6,本發明提供用於承載晶片的軟質線路基板,其中第一錫層131具有第一縱向界面131a接觸導電銅層110,第一防焊層121具有第一邊緣121a接觸第二錫層132,第一縱向界面131a與第一邊緣121a之橫向距離X大於第一錫層131的厚度。
In another embodiment, referring to FIG. 6, the present invention provides a flexible circuit substrate for carrying a chip, wherein the
於另一實施例,可參考圖6,本發明提供用於承載晶片的軟質線路基板,其中第二錫層132具有第二縱向界面132a接觸該第一錫層131,第一防焊層121覆蓋第二縱向界面132a。
In another embodiment, referring to FIG. 6, the present invention provides a flexible circuit substrate for carrying a chip, wherein the
於另一實施例,可參考圖6,本發明提供用於承載晶片的軟質線路基板,其中第二錫層132具有第二縱向界面132a接觸第一錫層131,第二防焊
層122’具有第二邊緣122a接觸第二錫層132,第二縱向界面132a與第二邊緣122a之橫向距離Y大於第二錫層132的厚度。
In another embodiment, referring to FIG. 6, the present invention provides a flexible circuit substrate for carrying a chip, wherein the
於另一實施例,可參考圖6,本發明提供用於承載晶片的軟質線路基板,其中第一錫層131與第二錫層132之界面Iss共形於第一錫層131與導電銅層110的界面Isc。
In another embodiment, referring to FIG. 6, the present invention provides a flexible circuit substrate for carrying a chip, wherein the interface Iss between the
圖7顯示將上述第一錫層131及第二錫層132一起視為錫層161,將第一防焊層121及第二防焊層122’一起視為防焊層162時,本發明用於承載晶片的軟質線路基板之結構特徵為包含一導電銅層110具有配線圖案P設置於絕緣基材100上;一錫層161位於導電銅層110上方,其中導電銅層110具有不被錫層161所覆蓋的一露出部分163;及一防焊層162覆蓋露出部分且部分地覆蓋錫層161,其中錫層161具有一縱向界面161a接觸導電銅層110,防焊層162具有一邊緣162a接觸錫層161,其中縱向界面161a與邊緣162a之橫向距離Z大於防焊層162的厚度加上錫層161的厚度。於一較佳實施例,防焊層162之厚度範圍從6μm至35μm。於一較佳實施例,錫層161之厚度範圍從0.1μm至0.6μm。
7 shows that when the
本發明也有只執行步驟(c)而無步驟(d)之一實施例,在此實例錫層之厚度範圍從0.1μm至0.6μm。 The present invention also has an embodiment that only performs step (c) without step (d). In this example, the thickness of the tin layer ranges from 0.1 μm to 0.6 μm.
以上所述僅為本發明之較佳實施例而已,並非用以限定本發明之申請專利範圍;凡其它未脫離本發明所揭示之精神下所完成之等效改變或修飾,均應包含在下述之申請專利範圍內。 The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of patent application of the present invention; all other equivalent changes or modifications made without departing from the spirit of the present invention should be included in the following Within the scope of the patent application.
100:絕緣基材 100: insulating base material
110:導電銅層 110: conductive copper layer
121:第一防焊層 121: The first solder mask
121a:第一邊緣 121a: first edge
122’:第二防焊層 122’: The second solder mask
122a:第二邊緣 122a: second edge
131:第一錫層 131: The first tin layer
131a:第一側邊 131a: first side
132:第二錫層 132: The second tin layer
132a:第二側邊 132a: second side
Ps:非引腳區 Ps: non-pin area
Iss:界面 Iss: interface
Isc:界面 Isc: interface
X:橫向距離 X: horizontal distance
Y:橫向距離 Y: horizontal distance
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TW200834842A (en) * | 2007-02-02 | 2008-08-16 | Phoenix Prec Technology Corp | Substrate structure for semiconductor package and manufacturing method thereof |
TW200838382A (en) * | 2007-03-07 | 2008-09-16 | Phoenix Prec Technology Corp | Circuit board structure and fabrication method thereof |
TW201513758A (en) * | 2013-06-14 | 2015-04-01 | Mitsubishi Paper Mills Ltd | Method for manufacturing wiring board |
TWM596459U (en) * | 2019-07-22 | 2020-06-01 | 頎邦科技股份有限公司 | Flexible circuit board having rough solder resist layer and manufacturing method thereof |
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TW200834842A (en) * | 2007-02-02 | 2008-08-16 | Phoenix Prec Technology Corp | Substrate structure for semiconductor package and manufacturing method thereof |
TW200838382A (en) * | 2007-03-07 | 2008-09-16 | Phoenix Prec Technology Corp | Circuit board structure and fabrication method thereof |
TW201513758A (en) * | 2013-06-14 | 2015-04-01 | Mitsubishi Paper Mills Ltd | Method for manufacturing wiring board |
TWM596459U (en) * | 2019-07-22 | 2020-06-01 | 頎邦科技股份有限公司 | Flexible circuit board having rough solder resist layer and manufacturing method thereof |
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