TWI731348B - Diode laser configuration - Google Patents

Abstract

The present invention relates to a diode laser configuration (1), which has: a diode laser device (3), and at least one heat sink (5, 5', 5"), wherein the diode The laser device (3) is at least partially arranged on the at least one heat dissipation device (5, 5', 5''), wherein the diode laser device (3) is configured to pass through the emitting surface (9) A laser beam is emitted, wherein the at least one heat dissipating device (5, 5', 5") is constructed for dissipating heat from the diode laser device (3). According to the present invention, the at least one heat sink (5, 5', 5'') has a front face (13), and the front face and the emitting face (9) are located on the same side of the diode laser configuration (1) , The at least one heat dissipating device has at least one first end surface section (15, 15', 15", 15"', 15"") on at least the front surface, which is opposite to the emitting surface (9) Language oblique orientation.

Description

Diode laser configuration

The present invention relates to a diode laser configuration.

When a diode laser device with one or several transmitters with a high power range (such as a high-power diode laser bar) is working, it will generate heat loss. In order to ensure the efficiency of the diode laser device To achieve high output power with long service life and high beam quality, loss of heat must be dissipated. Therefore, generally speaking, the configuration of a diode laser with such a diode laser device has a heat dissipation device, which is thermally coupled with the diode laser device and is configured to dissipate heat loss. Such a heat dissipation device usually has a radiator and a heat sink arranged on it. The conventional heat sink is specifically constructed to evenly distribute the heat of the heat source (such as a diode laser device) and/or absorb it through a smaller surface and transfer it to a larger surface, thereby enhancing the heat dissipation effect . This type of heat sink usually has a high thermal conductivity and a thermal expansion coefficient matching the diode laser device. The heat sink used to dissipate heat, for example, to the periphery of the diode laser configuration is usually arranged on the larger surface of the heat sink facing away from the diode laser configuration.

The heat dissipation device of the conventional structure extends laterally from the base surface of the diode laser configuration, thereby enhancing the heat dissipation effect. The front of the heat sink and the emitting surface of the diode laser device for emitting laser beams are on the same side of the diode laser configuration. On the front face, the diode laser device usually does not extend out of the laser beam. Base surface. This will cause the following problem: the laser beam is at least partially shielded by the heat sink protruding from the base surface. This kind of occlusion occurs especially when the divergence angle of the launched laser beam is large. In addition to impeding the propagation of the laser beam, such shielding may also cause the heat sink to heat up further. In this way, the material deposited on the emitting surface of the heat sink may evaporate, thereby causing damage to the diode laser device. Therefore, under normal circumstances, the stacked components of a diode laser configuration, such as a diode laser device, a heat sink, and a heat sink, generally form a block on the side where the laser beam is emitted. In addition, the radiator and/or heat sink are usually made to extend out of the diode laser device by a smaller margin, so as to prevent the laser beam from being interfered by the diode laser device and the radiator or heat sink in the area of the emitting surface. The protruding welding scar of the welding connection is shielded. The end surface of the radiator or heat sink on the front surface is substantially perpendicular to the radiation direction of the laser beam. However, this will limit the dissipation of the heat loss of the diode laser device, especially in the area of the emitting surface, thereby reducing the maximum output power of the diode laser device, for example.

The purpose of the present invention is to provide a diode laser configuration in which the aforementioned shortcomings do not occur.

This purpose is achieved by providing the subject of claim 1. Favorable technical solutions are generated from subsidiary claims.

In particular, the solution of the present invention to achieve this objective is to provide a diode laser configuration, which has a diode laser device and at least one heat dissipation device. The diode laser device is at least partially arranged on the at least one heat dissipation device. The diode laser device is constructed to emit a laser beam through the emitting surface. Among them, the laser beam can also be composed of several sub-laser beams. The at least one heat dissipation device is configured to dissipate heat from the diode laser device. The at least one heat dissipation device has a front face, the front face and the emitting surface are located on the same side of the diode laser configuration, and the at least one heat dissipation device has at least one first end face section on at least the front face, which is opposite to the The emitting surface is oriented obliquely.

Compared with the prior art, the present invention has its advantages. The at least one heat dissipating device has at least one first end surface section oriented obliquely with respect to the emitting surface on the front surface at least, so that it can be prominent in the area of the emitting side of the diode laser device that emits the laser beam Enhance the dissipation of heat loss, thereby greatly reducing the heating of the diode laser device during its working process. In particular, the temperature rise of one or several transmitters is reduced. In addition, the uniform temperature distribution in the diode laser device is realized at a low level. In this way, the output power of the diode laser device can be greatly enhanced. In addition, better beam parameters can be achieved, for example, in terms of divergence angle and polarization. It can also reduce wavelength drift. In addition, the spectrum bandwidth of the emitted radiation can be reduced. In general, the output power of the diode laser device can be greatly enhanced when the current is equal or increased. In addition, the service life and/or beam quality of the diode laser device can be improved.

The diode laser device preferably has at least one emitter, especially a single emitter. Such a transmitter is preferably constructed as an edge transmitter. Such a transmitter is preferably constructed as a high-power transmitter. The diode laser device preferably has several emitters. The diode laser device is specifically constructed as a diode laser bar containing several emitters. The emitters are preferably arranged in one dimension. In rows and columns (array). Such a diode laser bar is preferably constructed as an edge emitter. This type of diode laser bar is preferably constructed as a high-power diode laser bar.

The diode laser device is preferably at least partially arranged on the at least one heat dissipation device, especially on a certain section of the at least one heat dissipation device.

The emitting surface is preferably flat. The emitting surface is arranged in particular on the emitting side of the diode laser device. In addition, in particular, the front surface of the at least one heat sink and the emitting side of the diode laser device are arranged on the same side of the diode laser configuration of the present invention. Therefore, the at least one first end face section is arranged on the same side of the diode laser configuration as the emitting face.

The at least one first end surface section is preferably flat. The at least one first end face section may also-at least in the cross-sectional plane-be concave or convex.

The surface normal of the at least one first end face section is preferably inclined toward the laser beam axis of the laser beam. Preferably, the inclination of the at least one first end face section relative to the emitting surface is adjusted according to the radiation characteristics of the laser beam, especially according to the expansion angle.

In a preferred embodiment of the diode laser configuration of the present invention, the at least one heat dissipation device has at least a plurality of first end face sections on the front surface. In particular, the first end face sections adjoin each other. In particular, the plurality of first end surface sections form a continuous surface. In particular, the plurality of first end surface sections are all oriented obliquely with respect to the emitting surface, and the angles between the plurality of first end surface sections and the emitting surface may be different from each other. In the case where a plurality of first end face sections are connected, the angles preferably have an increasing or decreasing magnitude. The connected first end face sections are particularly preferably-at least viewed in the cross-sectional plane-generally in a concave or convex structure.

In an alternative embodiment of the diode laser configuration of the present invention, the at least one first end face section-at least when viewed in the cross-sectional plane-is concave. In particular, the at least one first end face section forms a section inside the cylindrical face section.

A preferred embodiment of the diode laser configuration is characterized in that the angle between the surface normal of the at least one first end surface section and the surface normal of the emitting surface is greater than 0 degrees and less than 90 degrees. In particular, the corresponding angles between all local surface normals of the at least one first end surface section and the surface normal of the emitting surface are greater than 0 degrees and less than 90 degrees. In this way, the smooth emission of the laser beam can be ensured, thereby significantly enhancing the dissipation of the lost heat.

A preferred embodiment of the diode laser configuration is characterized in that the angle between the surface normal of the at least one first end face section and the surface normal of the emitting surface is at least 40 degrees, and the maximum is 60 degrees. Degree, preferably 50 degrees. This technical solution is particularly beneficial to effective dissipation of heat loss while ensuring the smooth emission of the laser beam.

A preferred embodiment of the configuration of the diode laser is characterized in that the diode laser device is recessed in the region of the emitting surface relative to the foremost end of the at least one heat sink. The foremost end of the at least one heat dissipating device especially refers to a certain area, which is the farthest from the emitting surface relative to the coordinate axis extending along the laser beam axis. That is, the at least one heat dissipating device extends out of the base surface of the diode laser device especially on the front surface. Specifically, the contact area between the diode laser device and the at least one heat sink is at least partially limited by the base surface of the diode laser device. In this way, the size of the at least one heat dissipating device can be significantly increased, especially compared with the diode laser device, so that the enlarged cooling surface can be used to realize very effective dissipation of heat loss.

A preferred embodiment of the diode laser configuration is characterized in that the at least one heat dissipation device has at least one second end surface section parallel to the emitting surface on the front surface. The at least one second end surface section is preferably flat.

In a preferred embodiment of the diode laser configuration, the at least one second end surface section is arranged between the at least one first end surface section and the emitting surface. In this way, it can be ensured that the radiation of the laser beam will not be hindered, especially when the expansion angle is large.

A preferred embodiment of the diode laser configuration is characterized in that the at least one first end surface section or the at least one second end surface section is flush with the emitting surface.

Preferably, the at least one first end surface section and the at least one second end surface section are flush with the emitting surface. Such a solution occurs, for example, in the following situation: the at least one first end surface section is a part of the first heat dissipation device on the first side of the diode laser device, and the at least one second end surface section is the two The polar laser device is a part of the second heat dissipation device on the second side arranged opposite to the first side. For example, the base surface of the diode laser device is arranged on the first side of the diode laser device, wherein the diode laser device is arranged on the second side opposite to the base surface, especially The surface parallel to the base surface. Alternatively, the base surface of the diode laser device can also be arranged on the second side of the diode laser device.

The flush abutment particularly refers to the following situation: the at least one first end surface section and/or the at least one second end surface section abuts against the emitting surface by its edges. That is, the edge of the at least one first end surface section and/or the at least one second end surface area in particular abuts against the edge of the emitting surface, for example against the emitting surface and abuts against the diode laser device On the edge of the contact area with the at least one heat sink. Through this technical solution, the laser beam can be at least partially prevented from being shielded, and at the same time, effective heat dissipation can be ensured.

A preferred embodiment of the diode laser configuration is characterized in that the at least one heat dissipation device has an inclined plane section corresponding to the at least one first end section at least partially surrounding the side. Preferably, the at least one end surface section transitions laterally into the inclined surface section. The at least one end face section continues in the bevel section in particular laterally. The slope section can also have several partitions. In particular, the at least one heat dissipation device protrudes from the base surface of the diode laser device with the at least one first end surface section on the emitting side and the inclined plane section on at least the other side. Preferably, the at least one heat dissipation device protrudes from the base surface of the diode laser device on all sides with the at least one first end surface section and the inclined surface section. The at least one first end surface section and the inclined surface area particularly surround the base surface of the diode laser device. The slope or chamfer of the inclined surface section preferably corresponds to the slope or chamfer of the at least one first end surface section. In this way, heat can be dissipated very efficiently on all sides.

A preferred embodiment of the configuration of the diode laser is characterized in that the at least one heat dissipation device at least partly has a material containing diamond content or is composed of a material containing diamond content. Preferably, the at least one heat dissipation device at least partially has a diamond-silver composite material or is composed of a diamond-silver composite material. Preferably, the heat sink of the type described below has a material containing diamond content, preferably a diamond-silver composite material, or is composed of a material containing diamond content, preferably a diamond-silver composite material.

As an alternative or in addition, the at least one heat sink, especially a heat sink of the type described below, at least partly has a certain material or is composed of a certain material, which is selected from the group consisting of: containing gold content Materials, materials containing copper or carbon content, and nanomaterials. Such materials have excellent thermal conductivity. Preferably, the thermal expansion coefficient of the at least one heat dissipation device, especially the type of heat sink described below, is at least partially matched with the thermal expansion coefficient of the diode laser device by using such materials. For example, the thermal expansion coefficient of the at least one heat dissipation device is at least partially at least 70% of the thermal expansion coefficient of the diode laser device, and at most 130% of the thermal expansion coefficient of the diode laser device. In this way, the temperature-related stress in the diode laser device can be reduced or avoided, thereby ensuring the long-term stability of the diode laser device.

Preferably, the contour or shape of the at least one first end surface section and/or the at least one second end surface section of the at least one heat dissipation device is realized by sintering or laser processing. Through these methods, it is particularly possible to process the above-mentioned types of materials containing diamond content. For example, by using an ultrashort pulse laser to focus or adjust the penetration depth of the laser beam, a number of micro-levels (Mikrostufe) can be placed in the at least one heat sink through material removal, and the micro-levels form this Various types of outlines or shapes. Alternatively, a suitable etching method, such as an argon etching method or an ion beam etching method, can be used to achieve the corresponding material removal. The appropriate shape can be achieved by using a corresponding mold applied to the surface of the at least one heat sink.

A preferred embodiment of the configuration of the diode laser is characterized in that the at least one heat dissipation device has a heat sink or a heat sink, preferably a heat sink and a heat sink. The above-mentioned type of heat sink is especially used for heat distribution and for compensating the different thermal expansion of the diode laser device and the heat sink. The diode laser device is usually arranged on such a radiator. The heat sink can be cooled especially by means of a cooling fluid. Preferably, the heat sink is thin-walled until the heat sink and/or the diode laser device, so that the cooling fluid can be guided as close to the diode laser device as possible, thereby enhancing the heat dissipation effect. Preferably, the heat sink has a cooling channel for guiding the cooling fluid, and in the cooling channel, a plurality of cooling fins are arranged in an area close to the diode laser device.

The at least one heat dissipating device preferably has a heat sink and a heat sink of the above-mentioned type, and in particular, the heat sink is arranged between the diode laser device and the heat sink.

A preferred embodiment of the diode laser configuration is characterized in that the heat sink or the heat sink, preferably the heat sink and the heat sink, respectively have the at least one first end surface section or the at least A second end surface section preferably has the at least one first end surface section and the at least one second end surface section. This technical solution can ensure the smooth launch of the laser beam even when the expansion angle is relatively large while performing effective heat dissipation.

A preferred embodiment of the configuration of the diode laser is characterized in that: the at least one heat dissipation device has a heat sink and a heat sink, wherein the diode laser device is opposite to the heat sink in the region of the emitting surface The foremost end of the heat sink is recessed, and the heat sink is recessed on the foremost end relative to the foremost end of the heat sink. The foremost end of the above-mentioned type especially refers to a certain area of the radiator or heat sink, which is the farthest from the emitting surface relative to the coordinate axis extending along the laser beam axis. This arrangement can ensure the smooth launch of the laser beam even when the expansion angle is large while effective heat dissipation.

A preferred embodiment of the diode laser configuration is characterized in that: the at least one first end face section of the heat sink or the at least one second end face section of the heat sink, or alternatively the heat dissipation The at least one first end surface section of the heat sink and the at least one second end surface section of the heat sink flushly abut the at least one first end surface section of the heat sink or the at least one second end surface of the heat sink Section, or alternatively adjacent to the at least one first end section of the heat sink and the at least one second end section of the heat sink. The above-mentioned type of flush abutment particularly refers to the following situations: the first and/or second end face sections are abutted against each other by their edges. Preferably, the first and/or second end surface sections of the heat sink and/or the heat sink form a continuous surface. This technical solution of the configuration of the diode laser ensures the effective discharge of the loss heat without affecting the emission of the laser beam.

A preferred embodiment of the configuration of the diode laser is characterized in that the connection between the diode laser device and the at least one heat sink, especially the above-mentioned type of heat sink or heat sink, is by Established by welding, bonding, meshing, snapping or sintering. As an alternative or supplementary solution, the connection between the heat sink and the heat sink of the at least one heat sink is preferably established by welding, bonding, meshing, engaging, or sintering. In particular, the above-mentioned type of connection is realized by form-fitting and/or material bonding. These connections are easy to establish and low cost.

A preferred embodiment of the configuration of the diode laser is characterized in that the at least one heat dissipation device is configured to make electrical contact with the diode laser device. More preferably, the diode laser configuration of the present invention has two heat dissipation devices of the above-mentioned type, which respectively make electrical contact with the diode laser device. In this way, the energy source can be combined to power the diode laser device.

A preferred embodiment of the diode laser configuration is characterized in that: the diode laser configuration has two heat dissipation devices of the above-mentioned type, wherein the first heat dissipation device of the two heat dissipation devices is arranged in the second heat dissipation device. On the first side of the polar laser device, and wherein the second heat dissipation device of the two heat dissipation devices is arranged on the second side of the diode laser device opposite to the first side.

Preferably, the first heat dissipation device is constructed as a heat sink, which has a heat sink arranged on a side away from the diode laser device, wherein the second heat dissipation device is constructed as another heat sink.

Alternatively, the first heat sink is preferably constructed as a heat sink with a heat sink arranged on the side facing away from the diode laser device, wherein the second heat sink is constructed as another heat sink with an arrangement Another heat sink on the side facing away from the diode laser device.

Fig. 1 schematically shows a first embodiment of a diode laser arrangement 1 in a perspective oblique view. The diode laser configuration 1 has a diode laser device 3. In the embodiment shown in FIG. 1, the diode laser device 3 is exemplarily square. The diode laser device has one or several emitters. Optionally, the diode laser device 3 has a diode laser bar with a better high power range. The diode laser configuration 1 additionally has at least one heat dissipation device 5, in which exactly one heat dissipation device 5 is provided in the embodiment shown in FIG. 1. The diode laser device 3 is at least partially arranged on the heat sink 5. The diode laser device 3 has a base surface 6. In particular, the diode laser device 3 at least partially abuts on the heat sink 5 in the first contact area 7 through the base surface 6. The first contact area 7 here particularly refers to the area where the diode laser device 3 and the heat dissipation device 5 are adjacent to each other in a plane.

The diode laser device 3 is configured to emit a laser beam through the emitting surface 9 located on the emitting side 10 of the diode laser device 3. The emission direction of the laser beam is schematically indicated by arrow 11. The emitting surface 9 in FIG. 1 is flat. In particular, the laser beam is emitted substantially perpendicular to the emitting surface 9. The laser beam is emitted through at least one section of the emitting surface 9. This section is particularly located near the lower edge 12 of the diode laser device 3 on the emitting side 10-as viewed from the observer's point of view-especially in the p-area of the diode laser device 3. In the embodiment shown in FIG. 1, the lower edge 12 of the diode laser device 3 is substantially equivalent to the lower edge of the emitting surface 9-as viewed from the observer's perspective.

The heat sink 5 is constructed to discharge heat from the diode laser device 3. In particular, the heat transfer from the diode laser device 3 to the heat sink 5 is realized through the first contact area 7. The heat dissipating device 5 has a front surface 13 which is located on the same side of the diode laser configuration 1 as the emitting surface 9. The heat dissipating device has at least one first end surface section 15 on at least the front surface, which is opposite to the emitting surface 9 Language oblique orientation. That is, the front surface 13 and the emitting side 10 are located on the same side of the diode laser configuration 1.

In the embodiment shown in FIG. 1, the heat dissipation device 5 has two first end surface sections 15 on the front surface 13, namely, a first end surface section 15 ′ and another first end surface section 15 ″. This other first end section 15" is indicated by a dashed line in FIG. 1. The first end surface section 15 ′ and the other first end surface section 15 ″ are both planar here by way of example.

The purpose of showing the other first end face section 15" with a dashed line is that it can also be removed as needed. In this case, the heat sink 5 has exactly one first end face section 15 on the front face 13, that is, the The first end face section 15 ′, and wherein in this case, the outline of the heat sink 29 is represented on the front face 13 by a solid line-not a dashed line -. This technical solution is particularly feasible in the following situations: the radiation characteristics of the diode laser device 3 can make the laser beam not shielded by the heat sink 29, which occurs, for example, when the expansion angle of the laser beam is small. Circumstances.

In particular, the surface normal of the at least one first end surface section 15, that is, the first end surface section 15' and the other first end surface section 15" here, and the surface normal of the emitting surface 9 The angle of is greater than 0 degrees and less than 90 degrees. In particular, the surface normal of the at least one first end face section 15, namely the first end face section 15' and the other first end face section 15" here, faces the laser beam extending along the arrow 11 The axis is tilted. Especially in the embodiment shown in FIG. 1, the surface normal and emission of the at least one first end surface section 15, namely the first end surface section 15' and the other first end surface section 15" here, are The angle between the surface normals of the face 9 is at least 40 degrees, and at most 60 degrees, preferably 50 degrees.

In particular, the diode laser device 3 is arranged recessed relative to the foremost end 17 of the heat sink 5 in the region of the emitting surface 9. The foremost end 17 especially refers to a certain area, which is the farthest from the emitting surface 9 in terms of the coordinate axis extending along the laser beam axis, that is, along the arrow 11.

Optionally, in the embodiment shown in FIG. 1, the heat dissipation device 5 has at least one second end surface section 19 on the front surface 13, which is parallel to the emitting surface 9. As shown in FIG. 1, the heat dissipation device 5 has two second end surface sections 19 on the front surface 13, namely, a second end surface section 19 ′ and another second end surface section 19 ″. The second end surface section 19' and the other second end surface section 19" are both planar here. The second end face section 19' and the other second end face section 19" are here adjacent to both sides of the first end face section 15', that is, the first end face section 15'-from the observer's perspective -Upper edge and lower edge.

Optionally, the at least one first end surface section 15 and/or the at least one second end surface section 19 are flush with the emitting surface 9. In the embodiment shown in FIG. 1, the second end surface section 19 ′ flushly adjoins the emitting surface 9. The upper edge 21 of the heat sink 5, which here corresponds to the upper edge of the second end section 19'-from the observer's perspective, abuts against the lower edge 12 of the diode laser device 3 or On the lower edge of the emission surface 9. Therefore, the emitting surface 9 and the heat dissipation device 5, in particular the second end surface section 19', are here against each other by their edges. The diode laser device 3 can also slightly extend from the upper edge 21 of the heat sink 5 by means of its emitting surface 9.

Optionally, the at least one heat dissipating device 5 has an inclined surface section corresponding to the at least one first end surface section 15 that is at least partially surrounded in a lateral direction. This technical solution of the diode laser configuration 1 is not shown in FIG. 1. However, as shown in FIG. 1, the heat sink 5 is not only on the front 13 of the heat sink 5, but also on the back 23 opposite to the front 13 and on the two opposite sides of the heat sink 5 arranged between the front 13 and the back 23. On the side surface 25 of the arrangement, the base surface 6 of the diode laser device 3 protrudes. This solution is particularly beneficial to transfer the loss heat of the diode laser device 3. However, the heat dissipation device 5 does not have a slope corresponding to the at least one first end surface section 15 on the back 23 and the side 25.

Optionally, the at least one heat dissipating device 5 at least partially has a material containing diamond content or is composed of a material containing diamond content.

Optionally, the at least one heat dissipation device 5 has a radiator 27 or a heat sink 29. In the embodiment shown in FIG. 1, the heat dissipation device 5 has a heat sink 27 and a heat sink 29. The diode laser device 3 is at least partially arranged on the radiator 27 through the base 6. In particular, the diode laser device 3 and the heat sink 27 are arranged close to each other in the first contact area 7, and the two are particularly close to each other. In addition, the heat sink 27 and the heat sink 29 are arranged close to each other in the second contact area 31. In particular, the heat sink 27 and the heat sink 29 abut against each other in the second contact area 31. That is, the heat sink 27 is generally arranged in a sandwich type between the diode laser device 3 and the heat sink 29.

The heat sink 27 is here exemplarily constructed as a support for the diode laser device 3. The heat sink 27 is particularly used to transfer and/or distribute the loss heat of the diode laser device 3 to the heat sink 29.

The heat sink 29 can be cooled especially by a cooling fluid. Thus, the heat sink 29 is particularly configured to discharge the lost heat transferred to the heat sink 29 by the radiator 27 by the cooling fluid, for example, through a cooling cycle.

Optionally, the heat sink 27 and/or the heat sink 29 respectively have the at least one first end surface section 15 and/or the at least one second end surface section 19. In the embodiment shown in FIG. 1, the heat sink 27 has the first end surface section 15 ′, the second end surface section 19 ′, and the other second end surface section 19 ″. As shown in FIG. 1, the heat sink 29 has the other first end surface section 15 ″ shown in dashed lines. As an alternative, the heat sink 29 is square and does not have the other first end section 15", wherein this embodiment is represented by a solid line instead of a dashed line.

Optionally, the at least one heat dissipating device 5 has a heat sink 27 and a heat sink 29, wherein the diode laser device 3 is recessed relative to the foremost end 33 of the heat sink 27 in the region of the emitting surface 9, and wherein The radiator 27 is arranged recessed on the foremost end 33 relative to the foremost end 35 of the heat sink 29. In the embodiment shown in FIG. 1, the foremost end 17 of the heat sink 5 corresponds to the foremost end 35 of the heat sink 29. The foremost end 33 especially refers to a certain area of the radiator 27, which is the farthest from the emitting surface 9 with respect to the coordinate axis extending along the laser beam axis, that is, along the arrow 11. In particular, the heat sink 27 protrudes from the base surface 6 on the front surface 13. Similarly, the foremost end 35 especially refers to a certain area of the heat sink 29, which is the farthest from the emitting surface 9 with respect to the coordinate axis.

Optionally, the at least one first end face section 15 of the heat sink 27 and/or the at least one second end face section 19 of the heat sink 27 flushly abuts the at least one first end face section 15 and the at least one first end face section 15 of the heat sink 29 /Or the at least one second end face section 19 of the heat sink 29. As shown in FIG. 1, the other second end surface section 19 ″ of the heat sink 27 flushly abuts the other first end surface section 15 ″ of the heat sink 29. In particular, the lower edge 37 of the heat sink 27-from the observer's perspective-and the upper edge 39 of the heat sink 29-from the observer's perspective-abut against each other. Therefore, the radiator 27 and the heat sink 29 lean against each other by their edges.

In the embodiment shown in FIG. 1, the upper edge of the heat sink 27-as viewed from the observer's perspective-corresponds to the upper edge 21 of the heat sink 5. That is, the upper edge of the radiator 27 abuts on the lower edge 12 of the diode laser device 3 here.

Optionally, the connection between the diode laser device 3 and the at least one heat dissipation device 5 and/or between the heat sink 27 and the heat sink 29 of the at least one heat dissipation device 5 is by welding, bonding, meshing, and clamping Or built by sintering. As shown in FIG. 1, the connection between the diode laser device 3 and the heat sink 27 is particularly established by welding, bonding, meshing, clamping or sintering. In addition, the connection between the heat sink 27 and the heat sink 29 is particularly established by welding, bonding, meshing, snapping, or sintering.

Fig. 2 schematically shows a second embodiment of the diode laser arrangement 1 in a longitudinal sectional view. The same components and components with the same function are marked with the same symbols, so please refer to the foregoing description for related content. The diode laser configuration 1 here has two heat dissipation devices 5, wherein the first heat dissipation device 5'of the two heat dissipation devices 5 is arranged on the first side 41 of the diode laser device 3, and wherein the two heat dissipation devices 5' The second heat dissipation device 5 ″ of the heat dissipation device 5 is arranged on the second side 43 of the diode laser device 3 opposite to the first side 41.

In the embodiment shown in FIG. 2, the first heat dissipation device 5 ′ has the aforementioned type of heat sink 27 and heat sink 29. The diode laser device 3 and the heat sink 27 are arranged close to each other in the first contact area 7. The heat sink 27 and the heat sink 29 are arranged close to each other in the second contact area 31.

In the embodiment shown in FIG. 2, the second heat dissipation device 5" has another heat sink 29' of the aforementioned type. The diode laser device 3 and the other heat sink 29 ′ are arranged close to each other in the third contact area 45. Alternatively, the second heat dissipation device 5" can also have a heat sink similar to the first heat dissipation device 5', but it is not shown here.

That is, the diode laser configuration 1 in FIG. 2 has two heat sinks 29, 29'. The diode laser device 3 is here at least partially arranged on the first side 41 of the heat sink 27 and on the second side 43 of the heat sink 29'. The heat dissipating devices 5 ′, 5 ″ are constructed for dissipating heat from the diode laser device 3 especially through the first contact area 7 and the third contact area 45.

The first heat dissipation device 5 ′ and the second heat dissipation device 5 ″ are separated by a spacer 47. The spacer 47 is arranged in the area of the back 23 of the heat dissipation device 5 (here, the first heat dissipation device 5'and the second heat dissipation device 5"). In particular, the spacer 47 is arranged in an area of the heat sink 5 ′, 5 ″ opposite to the area where the diode laser device 3 is arranged.

The first heat dissipating device 5'has two first end face sections 15 on the front face 13, namely a first end face section 15' and another first end face section 15"', both of which are inclined relative to the emitting surface 9 Directional. As shown in FIG. 2, the heat sink 27 has the first end surface section 15' and the other first end surface section 15"'. The two first end face sections 15', 15'" here adjoin one another flush. The first angle between the surface normal of the first end surface section 15 ′ and the surface normal of the emitting surface 9 is here greater than 0 degrees and less than 90 degrees. In addition, the second angle between the surface normal of the other first end surface section 15 ′″ and the surface normal of the emitting surface 9 is here greater than 0 degrees and less than 90 degrees. In the embodiment shown in Figure 2, the first angle is smaller than the second angle. In this way, a substantially concave structure of the surface formed by the first end face section 15' and the other first end face section 15"' can be realized.

Optionally, both the first angle and the second angle are at least 40 degrees, and the maximum is 60 degrees.

Optionally, the diode laser device 3 is relative to the front end 17 of the heat sink in the area of the emitting surface 9, especially the front end 17' of the first heat sink 5'and the second heat sink 5' The front end of the '17''', recessed arrangement.

As shown in FIG. 2, the first end surface section 15 ′ is flush with the emitting surface 9. In particular, the lower edge 12 of the diode laser device 3 or the lower edge of the emitting surface 9 and the heat sink 27 here correspond to the upper edge of the upper edge 21 of the first heat sink 5', especially adjacent to the first heat sink. The upper edge of the end section 15'.

Optionally, as shown in FIG. 2, the heat dissipation device 5 can be cooled by a cooling fluid. The cooling fluid can be introduced into the first heat dissipation device 5 ′ via the cooling fluid inlet 49, where it is introduced into the cooling channel 50 of the heat sink 29. The cooling fluid can here be guided through the heat sink 29 in the cooling channel 50. The cooling fluid can be discharged from the first heat dissipating device 5 ′ via the cooling fluid outlet 51, here from the cooling channel 50 of the heat sink 29. The flow direction of the cooling fluid is schematically shown, for example, by arrows 53. Similarly, the cooling fluid can be introduced into the second heat dissipation device 5" via another cooling fluid inlet 49', in particular into another cooling channel 50' of another heat sink 29'. The cooling fluid can here be guided through another heat sink 29' in another cooling channel 50'. The cooling fluid can be led out from the second heat sink 5" via another cooling fluid outlet 51', in particular from another cooling channel 50' of the other heat sink 29'. The flow direction of the cooling fluid is schematically shown, for example, by arrow 53'.

In the embodiment shown in FIG. 2, the first heat dissipation device 5 ′ has a heat exchange device 55 which helps to transfer the heat of the diode laser device 3 to the cooling fluid in the heat sink 29. The heat exchange device 55 may have cooling fins arranged in the cooling passage 50. Similarly, the second heat dissipation device 5" here has another heat exchange device 55', which helps to transfer the heat of the diode laser device 3 to the cooling fluid in the other heat sink 29'. The other heat exchange device 55' may also have cooling fins arranged in the other cooling channel 50'. Optionally, the heat sinks 29, 29' are particularly thin-walled in the regions 56, 56' adjacent to the radiator 27 or the diode laser device 3, so as to effectively remove the heat sink from the diode laser device 3. And/or the radiator 27 performs heat transfer.

Optionally, the heat dissipation devices 5 ′, 5 ″ are configured to make electrical contact with the diode laser device 3. Optionally, electrical contact to the diode laser device 3 is achieved through the first contact area 7 on the first side 41 and the third contact area 45 on the second side 43. Specifically, the diode laser device 3 has a p-area in the area of the first side 41 and an n-area in the area of the second side 43.

Fig. 3 schematically shows a third embodiment of the diode laser arrangement 1 in a longitudinal sectional view. The same components and components with the same function are marked with the same symbols, so please refer to the foregoing description for related content. The only difference between the diode laser configuration 1 and the diode laser configuration in the embodiment shown in FIG. 2 is that the other heat sink 29' is relative to the heat sink 29-from the observer's perspective- Move to the left. The heat sinks 29 and 29' adopt similar structures to reduce manufacturing costs. Illustratively, in the view of FIG. 3, the end surface of the other heat sink 29 ′ abuts on the foremost end 35 ′ substantially in the same plane as the emitting surface 9. This is advantageous because it prevents the laser beam from being shielded by the other heat sink 29', especially when the expansion angle is large.

In an alternative solution that is not shown, the other heat sink 29 ′ is flush with the heat sink 29 on the back 23, which is beneficial to reduce the structural space of the diode laser configuration 1.

Fig. 4 schematically shows a fourth embodiment of the diode laser arrangement 1 in a perspective oblique view. The same components and components with the same function are marked with the same symbols, so please refer to the foregoing description for related content. The diode laser configuration 1 in the embodiment shown in FIG. 4 has two heat sinks 5. The first heat dissipation device 5'of the two heat dissipation devices 5 is arranged on the first side 41 of the diode laser device 3, and the second heat dissipation device 5" of the two heat dissipation devices 5 is arranged on the diode laser device 3 on the second side 43. The first heat dissipation device 5'has a heat sink 27, and the second heat dissipation device 5" has another heat sink 27'. That is, in FIG. 4, the diode laser device 3 is arranged between the radiator 27 and the other radiator 27'.

The heat sink 27 has a first end surface section 15 ′, which flushly abuts the emitting surface 9 on the lower edge 12 of the diode laser device 3. A second end surface section 19 ′ is flushly connected to this first end surface section 15 ′, which is arranged on the side of the first end surface section 15 ′ facing away from the diode laser device 3. The other radiator 27' adopts a similar structure. The other heat sink has another first end surface section 15 ″″ which flushly abuts the emitting surface 9 on the upper edge 57 of the diode laser device 3. The upper edge 57 of the diode laser device 3 here corresponds to the upper edge-from the observer's perspective-of the emitting surface 9. The other first end surface section 15"" is flushly connected with another second end surface section 19"', which is arranged on the opposite side of the other first end surface section 15"". Body laser device 3 on one side.

The diode laser device 3 is arranged recessed relative to the foremost end 33 of the radiator 27 and relative to the foremost end 33' of the other radiator 27' in the area of the emitting surface 9.

In general, the diode laser configuration 1 prevents the emission of the laser beam from being obstructed by the at least one heat sink 5, and at the same time, it ensures that the diode laser device 3 is particularly in the region of the emitting side 10. Efficient discharge of lost heat.

1‧‧‧Diode laser configuration 3‧‧‧Diode laser device 5,5',5''‧‧‧heat sink 6‧‧‧Base surface 7‧‧‧First contact area 9‧‧‧Launching surface 10‧‧‧Launching side 11‧‧‧Arrow 12‧‧‧Bottom edge 13‧‧‧Front 15, 15', 15'', 15''', 15''''‧‧‧First end section 17, 17', 17``‧‧‧Foremost 19,19',19``,19'''‧‧‧Second end section 21‧‧‧Upper edge 23‧‧‧Back 25‧‧‧Side 27, 27'‧‧‧Radiator 29, 29'‧‧‧ Heat sink 31‧‧‧Second contact area 33, 33'‧‧‧Foremost 35‧‧‧Front end 37‧‧‧Bottom edge 39‧‧‧Upper edge 41‧‧‧First side 43‧‧‧Second side 45‧‧‧Third contact area 47‧‧‧Spacer 49，49'‧‧‧Cooling fluid inlet 50,50'‧‧‧cooling channel 51‧‧‧Cooling fluid outlet 53‧‧‧Arrow 55, 55'‧‧‧Heat exchange device 56, 56'‧‧‧ area 57‧‧‧Upper edge

The present invention will be described in detail below with reference to the drawings. among them: Fig. 1 is a schematic perspective perspective view of the first embodiment of the diode laser configuration, Fig. 2 is a schematic longitudinal cross-sectional view of a second embodiment of a diode laser configuration, Fig. 3 is a schematic longitudinal cross-sectional view of a third embodiment of a diode laser configuration, and Fig. 4 is a schematic perspective perspective view of a fourth embodiment of a diode laser configuration.

1‧‧‧Diode laser configuration

3‧‧‧Diode laser device

5‧‧‧Heat Dissipation Device

6‧‧‧Base surface

7‧‧‧First contact area

9‧‧‧Launching surface

10‧‧‧Launching side

11‧‧‧Arrow

12‧‧‧Bottom edge

13‧‧‧Front

15, 15', 15"‧‧‧First end section

17‧‧‧Front end

19, 19', 19"‧‧‧Second end section

21‧‧‧Upper edge

23‧‧‧Back

25‧‧‧Side

27‧‧‧Radiator

29‧‧‧Heat sink

31‧‧‧Second contact area

33, 33'‧‧‧Foremost

35‧‧‧Front end

37‧‧‧Bottom edge

39‧‧‧Upper edge

Claims (14)

A diode laser configuration (1), having: a diode laser device (3), and at least one heat dissipation device (5, 5', 5"), wherein the diode laser device (3) At least partially arranged on the at least one heat sink (5, 5', 5"), wherein the diode laser device (3) is configured to emit a laser beam through the emitting surface (9), wherein the At least one heat dissipation device (5, 5', 5") is constructed for dissipating heat from the diode laser device (3), and wherein the at least one heat dissipation device (5, 5', 5") has a front face (13), the front surface and the emitting surface (9) are located on the same side of the diode laser configuration (1), and the at least one heat sink has at least one first end surface section (15 , 15', 15", 15"', 15""), which is oriented obliquely with respect to the emitting surface (9), wherein the diode laser device (3) is on the emitting surface (9) Relative to the foremost end (17, 17') of the at least one heat dissipation device (5, 5', 5"), the area is recessed. For example, the diode laser configuration (1) of claim 1, characterized in that: the surface of the at least one first end face section (15, 15', 15", 15''', 15'''') The angle between the normal line and the surface normal of the emitting surface (9) is greater than 0 degrees and less than 90 degrees. For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one first end face section (15, 15', 15", 15''', 15'''') The surface normal to the surface of the emitting surface (9) The angle between the normals is at least 40 degrees, and the maximum is 60 degrees. For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one heat dissipation device (5, 5', 5") has on the front surface (13) parallel to the emitting surface ( 9) At least one second end face section (19, 19', 19", 19"'). For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one first end face section (15, 15', 15", 15''', 15'''') And/or the at least one second end face section (19, 19', 19", 19"') flushly adjoins the emitting surface (9). For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one heat dissipation device (5, 5', 5") has a first end section (15, 15', 15", 15"', 15"") at least partly surrounding inclined plane section. For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one heat sink (5, 5', 5") at least partly has a material containing diamond content or is made of diamond content The material composition. For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one heat sink (5, 5', 5") has a radiator (27, 27') and/or a heat sink (29, 29'). For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the heat sink (27, 27') and/or the heat sink (29, 29') respectively have the at least one first End section (15, 15', 15", 15"', 15"") and/or the at least one second end face section (19, 19', 19", 19"'). For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one heat sink (5, 5', 5") has a radiator (27, 27') and a heat sink (29) , 29'), wherein the diode laser device (3) is arranged recessed relative to the foremost end (33, 33') of the radiator (27, 27') in the area of the emitting surface (9) , Wherein the radiator (27, 27') is recessed on the foremost end (33, 33') relative to the foremost end (35) of the heat sink (29, 29'). For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one first end surface section (15, 15', 15", 15 of the radiator (27, 27') ''', 15'''') and/or the at least one second end section (19, 19', 19", 19''') of the radiator (27, 27') flushly abuts the heat The at least one first end section (15, 15', 15", 15"', 15"'') of the sink (29, 29') and/or the heat sink (29, 29') At least one second end face section (19, 19', 19", 19'''). For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the diode laser device (3) and the at least one heat sink (5, 5', 5") and/ Or the connection between the heat sink (27, 27') and the heat sink (29, 29') of the at least one heat sink (5, 5', 5") is made by welding, bonding, meshing, clamping or sintering set up. For example, the diode laser configuration (1) of claim 1 or 2, characterized in that: the at least one heat dissipation device (5, 5', 5") is constructed for the diode laser device ( 3) Make electrical contact. Such as claim 1 or 2 of the diode laser configuration (1), which is characterized by two heat sinks (5), wherein the first heat dissipation device (5') of the two heat dissipation devices (5) is arranged on the first side (41) of the diode laser device (3), and wherein the two heat dissipation devices (5) ) The second heat dissipation device (5") is arranged on the second side (43) of the diode laser device (3) opposite to the first side (41).

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