CN206250571U - A kind of VCSEL lasers - Google Patents
A kind of VCSEL lasers Download PDFInfo
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- CN206250571U CN206250571U CN201621281668.9U CN201621281668U CN206250571U CN 206250571 U CN206250571 U CN 206250571U CN 201621281668 U CN201621281668 U CN 201621281668U CN 206250571 U CN206250571 U CN 206250571U
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- vcsel
- ladder platform
- chip arrays
- plate
- heat sink
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Abstract
The utility model belongs to field of laser device technology.The purpose of this utility model is to provide a kind of fabulous VCSEL lasers of heat dispersion.The technical scheme of use is：A kind of VCSEL lasers, Laser emission component including mounting assembly and in mounting assembly, Laser emission component includes the VCSEL chip arrays and heat sink that are made up of multiple VCSEL chips, the one side of VCSEL chip arrays is the front setting optical concentrating component of exiting surface and exiting surface, VCSEL chip arrays another side and radiating plate weld, heat sink set radiator away from the one side of VCSEL chip arrays.The one side of heat sink is metallic heat radiating plate, and another side is insulating radiation plate.Metallic heat radiating plate and the relative plate face of insulating radiation plate are respectively provided with the first ladder platform and the second ladder platform.First ladder platform sets plurality of rods body towards the one side of the second ladder platform.Multiple through holes are correspondingly arranged in second ladder platform, in body of rod insertion through hole.The utility model can greatly improve the heat dispersion of VCSEL lasers, reduce encapsulation difficulty.
Description
Technical field
The utility model belongs to field of laser device technology, and in particular to a kind of VCSEL lasers.
Background technology
In field of semiconductor lasers, the relation of extension plate plane, laser according to where light emission direction and laser chip
Vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, abbreviation VCSEL) can be divided into
With edge-emission semiconductor laser (Edge Emitting Laser Diode) two classes.Wherein, vertical cavity surface emitting laser
Light emission direction is projected perpendicular to epitaxial wafer direction from the top surface of reaction zone, and the light emission direction of edge-emission semiconductor laser is flat
Row is projected in epitaxial wafer direction from the edge of reaction zone.
Edge-emission semiconductor laser and VCSEL have following features respectively：Edge-emission semiconductor laser is linear light
Source, it is very big in angle of divergence difference both vertically and horizontally, and its far field light intensity is presented Gaussian Profile；And VCSEL
It is sphere shape light, its angle of divergence is smaller, its approximate flat-top distribution of far field light intensity, energy is uniform.Therefore, swash with edge-emission semiconductor
Light device is compared, and the light of VCSEL transmittings is easier to converge, and Energy distribution is uniform on far field objects thing, so as to realize height
The transmitting of power.
Along with the raising of transmission power, the heat dissipation problem of VCSEL lasers is always puzzlement this area staff
One great difficult problem.Chip temperature is too high, by the service behaviour of serious influence laser.Prior art is directly to weld chip
It is connected on the substrate that copper, tungsten etc. are made, then retells substrate bond on the insulating heat-conductive piece that ceramics, diamond etc. are made.One
Aspect is single-contact due to substrate and insulating heat-conductive piece, causes its radiating efficiency relatively low；On the other hand due to ceramics and metal
Welding is more difficult, to ensure that ceramics carry out shaping burning with the welding of metal, it is necessary to first mix metallic particles in Production of Ceramics
Knot, this also undoubtedly also increases cost, wastes time and energy.
The content of the invention
The purpose of this utility model is to provide a kind of fabulous VCSEL lasers of heat dispersion.
For achieving the above object, the technical scheme that the utility model is used is：A kind of VCSEL lasers, including
Mounting assembly and the Laser emission component in mounting assembly, the Laser emission component are included by multiple VCSEL chips
The VCSEL chip arrays and heat sink of composition, the one side of the VCSEL chip arrays is the front setting of exiting surface and exiting surface
Optical concentrating component, VCSEL chip arrays another side with radiating plate weld, the heat sink away from VCSEL chip arrays one
Face sets radiator.
The one side of the heat sink is metallic heat radiating plate, and another side is insulating radiation plate, the metallic heat radiating plate and VCSEL
Chip array is welded, and the radiator is towards insulating radiation plate.
The metallic heat radiating plate and the relative plate face of insulating radiation plate are respectively provided with the first ladder platform and the second ladder platform, institute
The matching size of the size and the second ladder platform of stating the first ladder platform is closed.One side of first ladder platform towards the second ladder platform
Plurality of rods body is uniformly arranged along the width of metallic heat radiating plate, the body of rod extends along the length direction of metallic heat radiating plate.Institute
State and multiple through holes being engaged with the body of rod are correspondingly arranged in the second ladder platform, in the body of rod insertion through hole.
Preferably, the mounting assembly includes two square mounting bars being arranged side by side, the rib of the mounting bar one
Portion sets notch, and the notch on two mounting bar is relative.The edge of the heat sink both sides is respectively positioned at the groove of two mounting grooves
Intraoral and compressed by pressing plate, the side of the pressing plate is the press section protruded towards heat sink, opposite side by bolt with install
Bar is locked.
Preferably, the optical focusing components are the mirror barrel of the taper of inwall polishing, the big chi of the mirror barrel
Very little end is relative with VCSEL chip arrays.
Preferably, the optical focusing components are convex lens.
Preferably, the body of rod is rounded or square.
The beneficial effects of the utility model are embodied a concentrated reflection of, and can greatly improve heat dispersion, the drop of VCSEL lasers
Low encapsulation difficulty.Specifically, the utility model in use, constitutes the insulating radiation plate and metallic heat radiating plate of heat sink
Relative plate face is stepped, which increases heat exchange area therebetween, while by the way of in body of rod insertion through hole,
On the one hand further increase insulating radiation plate and become big with the contact area of metallic heat radiating plate so that VCSEL chip arrays work
When the heat that sends can quickly be transferred to insulating radiation plate, on the other hand cause between insulating radiation plate and metallic heat radiating plate
Connection is extremely stablized.Metallic heat radiating plate is compared with the mode of insulating radiation plate weld with traditional, encapsulation difficulty is lower.So as to
The production cost that VCSEL lasers greatly reduce and the service life that improve VCSEL lasers.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is A portions enlarged drawing in Fig. 1；
Fig. 3 is the structural representation of mounting bar；
Fig. 4 is the B-B direction view of structure shown in Fig. 1.
Specific embodiment
A kind of VCSEL lasers with reference to shown in Fig. 1-4, including mounting assembly and the hair of the laser in mounting assembly
Component is penetrated, the Laser emission component includes the VCSEL chip arrays 1 and heat sink that are made up of multiple VCSEL chips, described
The one side of VCSEL chip arrays 1 is the front setting optical concentrating component of exiting surface and exiting surface, and VCSEL chip arrays 1 are another
Face and radiating plate weld, the heat sink set radiator 3 away from the one side of VCSEL chip arrays 1.As shown in fig. 1,
The one side upward of VCSEL chip arrays 1 i.e. exiting surface, the exiting surface phase of optical concentrating component and VCSEL chip arrays 1
Right, one side directed downwardly is directly welded with heat sink.Optical concentrating component can be converged the laser that VCSEL chip arrays 1 are launched
Poly-, so as to improve transmission power density of the present utility model, conventional optical concentrating component is such as：Convex lens, guide-lighting cone etc., convex lens
The matching size of mirror, the size of guide-lighting cone and VCSEL chip arrays 1 is closed, and can completely be covered the exiting surface of VCSEL chip arrays 1
Lid, it is to avoid laser is escaped.Certainly, optical concentrating component can also be the mirror barrel 12 of the taper of inwall polishing, the reflection
The large scale end of lens barrel 12 is relative with VCSEL chip arrays 1.
The one side of the heat sink be metallic heat radiating plate 4, another side be insulating radiation plate 5, the metallic heat radiating plate 4 with
VCSEL chip arrays 1 are welded, and the radiator 3 is towards insulating radiation plate 5.The heat sink is by metal with reference to shown in Fig. 1 and 2
Heat sink 4 and insulating radiation plate 5 are collectively formed, and metallic heat radiating plate 4 is welded with VCSEL chip arrays 1, and insulating radiation plate 5 passes through
Radiator 3 is radiated, as shown in figure 1, radiator 3 is generally toward the fan of insulating radiation plate 5.
The metallic heat radiating plate 4 and the relative plate face of insulating radiation plate 5 are respectively provided with the first ladder platform 6 and the second ladder platform
7, the size of first ladder platform 6 is closed with the matching size of the second ladder platform 7.That is metallic heat radiating plate 4 and insulation dissipates
Hot plate 5 can realize complete fastening by the first ladder platform 6 and the second ladder platform 7.First ladder platform 6 is towards the second ladder
The one side of platform 7 is uniformly arranged plurality of rods body 8 along the width of metallic heat radiating plate 4, the body of rod 8 along metallic heat radiating plate 4 length
Degree direction extends.Left and right directions shown in the width i.e. Fig. 4 of described metallic heat radiating plate 4, length direction is also
It is the left and right directions shown in Fig. 1.Multiple through holes being engaged with the body of rod 8, the bar are correspondingly arranged in second ladder platform 7
In the insertion through hole of body 8, the body of rod 8 is rounded or square, and through hole is engaged with the body of rod 8, and when the body of rod 8 is rounded, metal dissipates
Area of dissipation between hot plate 4 and insulating radiation plate 5 is bigger, when the body of rod 8 is square, metallic heat radiating plate 4 and insulating radiation plate 5
Between connection it is spacing more stablize.
The utility model in use, constitutes the insulating radiation plate 5 and the relative plate face of metallic heat radiating plate 4 of heat sink
It is stepped, which increases heat exchange area therebetween, while by the way of in the insertion through hole of the body of rod 8, on the one hand entering
One step increases insulating radiation plate 5 and becomes big with the contact area of metallic heat radiating plate 4 so that VCSEL chip arrays 1 send when working
Heat can quickly be transferred to insulating radiation plate 5, on the other hand cause the company between insulating radiation plate 5 and metallic heat radiating plate 4
Connect and extremely stablize.The mode that metallic heat radiating plate 4 is welded with insulating radiation plate 5 is compared with traditional, encapsulation difficulty is lower.So as to
The production cost that VCSEL lasers greatly reduce and the service life that improve VCSEL lasers.
Mounting assembly of the present utility model is used to install Laser emission component, and described mounting assembly can be two notches
Relative U-lag, the edge of heat sink both sides is located in two U-lags, and the two ends of U-lag are blocked by plug.In order to improve peace
The versatility of arrangement, more preferable way is, as shown in figure 3, the mounting assembly include two be arranged side by side it is square
Mounting bar 9, the rib portion of the mounting bar 9 one sets notch 10, and the notch 10 on two mounting bar 9 is relative.The heat sink
The edge of both sides is compressed in the notch 10 of two mounting grooves and by pressing plate 11 respectively, and the side of the pressing plate 11 is towards radiating
The press section that plate is protruded, opposite side is locked by bolt with mounting bar 9.So, in encapsulation, installation of the present utility model
On the one hand component just adapts to the heat sink of various thickness, on the other hand reduces the requirement of heat sink machining accuracy.
It is of the present utility model in an assembling process, VCSEL chip arrays 1 are typically first welded on metallic heat radiating plate 4, so
Transversely the through hole in the ladder platform 7 of insulating radiation plate 5 second is socketed in afterwards complete heat sink is constituted on the body of rod 8, then will
The edge of heat sink both sides is placed in notch 10, finally tightens pressing plate 11 using bolt, pressing plate 11 is compressed heat sink.
Claims (5)
1. a kind of VCSEL lasers, it is characterised in that：Laser emission group including mounting assembly and in mounting assembly
Part, the Laser emission component includes the VCSEL chip arrays (1) and heat sink that are made up of multiple VCSEL chips, described
The one side of VCSEL chip arrays (1) is the front setting optical concentrating component of exiting surface and exiting surface, VCSEL chip arrays (1)
Another side and radiating plate weld, the heat sink set radiator (3) away from the one side of VCSEL chip arrays (1)；
The one side of the heat sink be metallic heat radiating plate (4), another side be insulating radiation plate (5), the metallic heat radiating plate (4) with
VCSEL chip arrays (1) are welded, and the radiator (3) is towards insulating radiation plate (5)；
The metallic heat radiating plate (4) and the relative plate face of insulating radiation plate (5) are respectively provided with the first ladder platform (6) and the second ladder
Platform (7), the size of first ladder platform (6) is closed with the matching size of the second ladder platform (7)；First ladder platform (6) court
To the one side of the second ladder platform (7) plurality of rods body (8), the body of rod (8) are uniformly arranged along the width of metallic heat radiating plate (4)
Length direction along metallic heat radiating plate (4) extends；Multiple is correspondingly arranged on second ladder platform (7) to be engaged with the body of rod (8)
Through hole, in the body of rod (8) insertion through hole.
2. VCSEL lasers according to claim 1, it is characterised in that：The mounting assembly is arranged side by side including two
Square mounting bar (9), the rib portion of the mounting bar (9) set notch (10), the notch on two mounting bar (9)
(10) it is relative；Pressed in the notch (10) of two mounting bars (9) and by pressing plate (11) respectively at the edge of the heat sink both sides
Tightly, the side of the pressing plate (11) is the press section protruded towards heat sink, and opposite side is locked by bolt with mounting bar (9).
3. VCSEL lasers according to claim 2, it is characterised in that：The body of rod (8) is rounded or square.
4. VCSEL lasers according to claim 3, it is characterised in that：The optical focusing components are inwall polishing
The mirror barrel (12) of taper, the large scale end of the mirror barrel (12) is relative with VCSEL chip arrays (1).
5. VCSEL lasers according to claim 3, it is characterised in that：The optical focusing components are convex lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621281668.9U CN206250571U (en) | 2016-11-25 | 2016-11-25 | A kind of VCSEL lasers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621281668.9U CN206250571U (en) | 2016-11-25 | 2016-11-25 | A kind of VCSEL lasers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206250571U true CN206250571U (en) | 2017-06-13 |
Family
ID=59002769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621281668.9U Active CN206250571U (en) | 2016-11-25 | 2016-11-25 | A kind of VCSEL lasers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206250571U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110398876A (en) * | 2018-04-25 | 2019-11-01 | 三赢科技（深圳）有限公司 | Bearing structure and forming method thereof and optical projection mould group |
| CN110429465A (en) * | 2019-07-03 | 2019-11-08 | 江苏天元激光科技有限公司 | A kind of semiconductor laser hierarchic structure is heat sink |
-
2016
- 2016-11-25 CN CN201621281668.9U patent/CN206250571U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110398876A (en) * | 2018-04-25 | 2019-11-01 | 三赢科技（深圳）有限公司 | Bearing structure and forming method thereof and optical projection mould group |
| CN110429465A (en) * | 2019-07-03 | 2019-11-08 | 江苏天元激光科技有限公司 | A kind of semiconductor laser hierarchic structure is heat sink |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: The 245000 Anhui Economic Development Zone of Huangshan City province with Yun Road No. 4 Patentee after: Huangshan City Rui Rui Communications Limited by Share Ltd Address before: The 245000 Anhui Economic Development Zone of Huangshan City province with Yun Road No. 4 Patentee before: The sharp communication of Huangshan light Co., Ltd |
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| CP01 | Change in the name or title of a patent holder |