TWI727900B - Display panel - Google Patents

Abstract

The display panel has a display region and a non-display region surrounding the display region. The display panel includes an array substrate, a first electrode, a pixel defining layer, a light emitting layer, a first isolation portion and at least one second isolation portion. The first electrode is on the array substrate and is on the display region. The pixel defining layer is on the first electrode. The pixel defining layer has an opening overlapping the first electrode. The light emitting layer is in the opening. The first isolation portion is on the array substrate and is on the non-display region. The second isolation portion is on the first isolation portion. The second isolation portion has a shape having wide top and narrow bottom. The second isolation portion has a maximum width smaller than a width of the first isolation portion.

Description

Display panel

The present invention relates to a display panel.

Organic light emitting diode (OLED) display panels are widely used because of their high color saturation, fast response speed and high contrast performance. In order to prevent the organic light emitting diode from being affected by moisture and oxygen in the environment, it will be encapsulated. The encapsulation includes covering an organic layer on top of it, and double dams will be used to prevent this organic layer from overflowing to the outside. However, the double embankment limits the size of the frame of the display panel, so that the frame cannot be reduced inward. If you want to change the double dike into a single dike, you will encounter the problem of organic layer overflow. Therefore, how to avoid overflow of the organic layer and reduce the frame is the focus of development in related fields.

The present invention provides a display panel, which can prevent overflow of the organic layer.

The display panel of the present invention has a display area and a non-display area surrounding the display area. The display panel includes an array substrate, a first electrode, a pixel definition layer, a light-emitting layer, a first isolation portion, and at least one second isolation portion. The first electrode is located on the array substrate and located in the display area. The pixel defining layer is located on the first electrode, and the pixel defining layer has an opening overlapping the first electrode. The light-emitting layer is located in the opening. The first isolation part is located on the array substrate and in the non-display area. The second isolation portion is located on the first isolation portion, the shape of the second isolation portion is wide at the top and narrow at the bottom, and the maximum width of the second isolation portion is smaller than the width of the first isolation portion.

The display panel of the present invention has a display area and a non-display area surrounding the display area. The display panel includes an array substrate, a first electrode, a pixel definition layer, a light-emitting layer, a first isolation part, and an inorganic encapsulation layer. The first electrode is located on the array substrate and located in the display area. The pixel defining layer is located on the first electrode, and the pixel defining layer has an opening overlapping the first electrode. The light-emitting layer is located in the opening. The first isolation part is located on the array substrate and in the non-display area. The inorganic encapsulation layer extends from the side surface of the first isolation portion to the top surface of the first isolation portion, and the inorganic encapsulation layer has at least one opening overlapping the top surface of the first isolation portion.

The display panel of the present invention has a display area and a non-display area surrounding the display area. The display panel includes an array substrate, a first electrode, a pixel definition layer, a light-emitting layer, a first isolation portion, and at least one second isolation portion. The first electrode is located on the array substrate and located in the display area. The pixel defining layer is located on the first electrode, and the pixel defining layer has an opening overlapping the first electrode. The light-emitting layer is located in the opening. The first isolation part is located on the array substrate and in the non-display area. The second isolation portion is located on the first isolation portion, the ratio of the maximum width of the second isolation portion to the width of the first isolation portion is 0.1 to 0.95, and the upper surface of the second isolation portion has a wave shape.

Based on the foregoing, in the display panel of an embodiment of the present invention, the display panel includes a first isolation portion and a second isolation portion, and the first isolation portion is located on the array substrate and located in the non-display area. The second isolation part is located on the first isolation part. The shape of the second isolation part is wide at the top and narrow at the bottom, and the maximum width of the second isolation part is smaller than the width of the first isolation part, which can prevent the organic encapsulation layer from overflowing out of the first isolation part and the second isolation part due to capillary phenomenon. The isolation part improves the reliability of the lateral packaging.

In a display panel according to another embodiment of the present invention, the inorganic encapsulation layer extends from the side surface of the first isolation portion to the top surface of the first isolation portion, and the inorganic encapsulation layer has at least one opening overlapping the top surface of the first isolation portion. The opening can confine the organic encapsulation layer to the opening like a gutter, which can prevent the organic encapsulation layer from overflowing out of the first isolation portion and the second isolation portion due to the capillary phenomenon, thereby improving the reliability of the lateral packaging.

In another embodiment of the display panel of the present invention, the ratio of the maximum width of the second isolation portion to the first isolation portion is 0.1 to 0.95, and the upper surface of the second isolation portion has a wavy shape, which can prevent the organic encapsulation layer from being capillary. This phenomenon overflows out of the first isolation part and the second isolation part, which improves the reliability of the lateral packaging.

FIG. 1 is a schematic top view of a display panel 10 according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view taken along the section line I-I' of FIG. Please refer to FIG. 1 and FIG. 2 together, the display panel 10 has a display area AA and a non-display area NA surrounding the display area AA. The array substrate 100 includes a substrate 102 and a pixel array 104 disposed on the substrate 102, and the pixel array 104 is disposed in the display area AA. In this embodiment, the substrate 102 is, for example, a flexible substrate, such as a polymer substrate or a plastic substrate. For example, the material of the substrate 102 is polyimide (PI).

The pixel array 104 includes a plurality of pixels PX. For the convenience of description, the first direction D1 and the second direction D2 are shown in Fig. 1, and the first direction D1 and the second direction D2 are different. For example, the first direction D1 and the second direction D2 are as shown in Fig. 1 respectively. The transverse direction and the longitudinal direction are orthogonal to each other. The pixels PX are arranged along the first direction D1 and the second direction D2. Each pixel PX may include an active element T1. The active device T1 is disposed on the substrate 102 and has a gate G, a source S, a drain D, and a semiconductor pattern SC. The array substrate 100 may further include a buffer layer 105, a gate insulating layer 106, an interlayer insulating layer 108, and a flat layer 112. The gate insulating layer 106 is disposed between the semiconductor pattern SC and the gate electrode G. For example, the gate G of the active device T1 can be selectively disposed above the semiconductor pattern SC to form a top gate TFT, but the invention is not limited to this. According to other embodiments, the gate G of the active device T1 can also be arranged under the semiconductor pattern SC, that is, the gate G is located between the semiconductor pattern SC and the substrate 102 to form a bottom gate TFT (bottom gate TFT). ).

The buffer layer 105 is disposed between the substrate 102 and the active device T1. The material of the buffer layer 105 is, for example, silicon nitride (SiN) or silicon oxide (SiO). For example, the buffer layer 105 is a stacked structure of silicon nitride, silicon oxide, silicon nitride, and silicon oxide from bottom to top.

In this embodiment, the semiconductor pattern SC may include a source region SR, a channel region CH, and a drain region DR. In other embodiments, the semiconductor pattern SC may further include a lightly doped source region (not shown) between the source region SR and the channel region CH, and a lightly doped source region (not shown) between the drain region DR and the channel region CH Drain region (not shown). In addition, the gate electrode G overlaps the channel region CH of the semiconductor pattern SC, but the invention is not limited to this. According to other embodiments, the semiconductor pattern SC may only include the source region SR, the channel region CH, and the drain region DR.

The interlayer insulating layer 108 is disposed on the gate insulating layer 106 and covers the gate G of the active device T1. The source S and the drain D of the active device T1 are disposed on the interlayer insulating layer 108, and overlap the source region SR and the drain region DR of the semiconductor pattern SC, respectively. For example, the source S and the drain D of the active device T1 both penetrate the interlayer insulating layer 108 and the gate insulating layer 106 to respectively electrically connect the source region SR and the drain region DR of the semiconductor pattern SC.

In this embodiment, the material of the semiconductor pattern SC is, for example, a low temperature poly silicon (LTPS) semiconductor, that is, the active device T1 may be a low temperature poly silicon thin film transistor. However, the present invention is not limited to this. In other embodiments, the active device T1 may also be an amorphous silicon TFT (a-Si TFT), a micro Si TFT, or a metal oxide. Metal oxide transistor.

The flat layer 112 covers the source S, the drain D of the active device T1 and part of the surface of the interlayer insulating layer 108, and may optionally have an opening overlapping the drain D of the active device T1. The flat layer 112 covers part of the surface of the interlayer insulating layer 108 and the drain electrode D. The material of the flat layer 112 includes inorganic materials (for example: silicon oxide, silicon nitride, silicon oxynitride, other suitable materials or stacked layers of at least two of the above), organic materials (for example: polyester (PET), poly Alkenes, polypropylenes, polycarbonates, polyalkylene oxides, polyphenylenes, polyethers, polyketones, polyols, polyaldehydes, other suitable materials or combinations of the above), others Suitable materials or a combination of the above.

The display panel 10 further includes a first electrode E1, a pixel definition layer 114, and a light-emitting layer 116. The first electrode E1 is located on the array substrate 100 and located in the display area AA. The pixel definition layer 114 is located on the flat layer 112, in other words, the flat layer 112 is disposed between the substrate 102 and the pixel definition layer 114. The pixel definition layer 114 has an opening overlapping the first electrode E1, and the light-emitting layer 116 is located in the opening. The display panel 10 further includes a hole transfer layer (HTL) 118, an electron transfer layer (ETL) 120, and a second electrode E2. The first electrode E1, the hole transport layer 118, the light emitting layer 116, the electron transport layer 120, and the second electrode E2 are sequentially stacked on the flat layer 112 and collectively constitute the light emitting unit 122.

In this embodiment, the first electrode E1 can be used as an anode of the light emitting unit 122, and the second electrode E2 can be used as a cathode of the light emitting unit 122, but the invention is not limited thereto. The light-emitting layer 116 includes, for example, a red light-emitting layer, a blue light-emitting layer, and a green light-emitting layer.

The first electrode E1 can be connected to the active element T1 correspondingly. The first electrode E1 penetrates the flat layer 112 and is electrically connected to the drain D of the active device T1. In some embodiments, the first electrode E1 is, for example, a light-transmitting electrode, and the material of the light-transmitting electrode includes metal oxide, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide , Or other suitable oxides, or a stacked layer of at least two of the above, but the present invention is not limited to this. In other embodiments, the first electrode E1 may also be a reflective electrode, and the material of the reflective electrode includes a metal, an alloy, or other suitable materials, or a stacked layer of a metal material and other conductive materials.

The hole transport layer 118 and the light-emitting layer 116 of each light-emitting unit 122 are formed in the opening by, for example, ink jet printing (IJP). In this embodiment, the second electrode E2 is, for example, a light-transmitting electrode. The material of the light-transmitting electrode includes metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, and aluminum zinc oxide. , Or other suitable oxides, or a stacked layer of at least two of the above, but the present invention is not limited to this. In other embodiments, the second electrode E2 may also be a reflective electrode, and the material of the reflective electrode includes a metal, an alloy, or other suitable materials, or a stacked layer of a metal material and other conductive materials.

The display panel 10 may further include a spacer PS. The spacer PS is disposed on the pixel definition layer 114 and the flat layer 112 and configured to support the substrate 102. The second electrode E2 also covers part of the surface of the pixel definition layer 114 and the spacer PS. When the display panel 10 is enabled, a current is generated between the first electrode E1 and the second electrode E2 due to the high potential and the ground potential respectively, so that the light-emitting unit 122 emits an image beam for displaying images.

The display panel 10 also includes an encapsulation structure 124. For example, the encapsulation structure 124 may be a thin film encapsulation (TFE) structure, and includes a first inorganic encapsulation layer 126, an organic encapsulation layer 128, and a second inorganic encapsulation layer 130 sequentially disposed on the array substrate 100. The first inorganic encapsulation layer 126 can block moisture and oxygen from entering the light emitting unit 122 and the array substrate 100. The vertical projection area of the first inorganic encapsulation layer 126 on the substrate 102 is larger than the vertical projection area of the organic encapsulation layer 128 on the substrate 102, and the vertical projection area of the second inorganic encapsulation layer 130 on the substrate 102 is larger than that of the organic encapsulation layer 128 on the substrate 102. The area of the vertical projection can prevent lateral moisture from invading the light-emitting unit 122 from the organic encapsulation layer 128.

The first inorganic encapsulation layer 126 and the second inorganic encapsulation layer 130 may be formed by chemical vapor deposition (CVD), and the organic encapsulation layer 128 may be formed by ink jet printing (IJP). In this embodiment, the border 126a of the first inorganic encapsulation layer 126 and the border 130a of the second inorganic encapsulation layer 130 are defined by an etching process, so that the border 126a of the first inorganic encapsulation layer 126 and the second inorganic encapsulation layer 126 The boundary 130a of the encapsulation layer 130 is reduced inwardly. In other words, the length of the first inorganic encapsulation layer 126 and the second inorganic encapsulation layer 130 in the non-display area NA of the display panel 10 can be greatly shortened, so that the display panel 10 has a narrow frame, which is beneficial to The display panel 10 is applied to a stretchable display panel.

In this embodiment, the display panel 10 further includes a first isolation portion 132 and at least one second isolation portion 134. The first isolation portion 132 is located on the array substrate 100 and located in the non-display area NA. The second isolation portion 134 is located on the first isolation portion 132. The first isolation portion 132 may be used to define the spraying range of the organic encapsulation layer 128. The distance between the first isolation portion 132 and the boundary 126a of the first inorganic encapsulation layer 126 and the boundary 130a of the second inorganic encapsulation layer 130 is 1 micrometer to 1000 micrometers. In one embodiment, the distance between the boundary 126a of the first isolation portion 132 and the first inorganic encapsulation layer 126 and the boundary 130a of the second inorganic encapsulation layer 130 is 1 micrometer to 240 micrometers.

In this embodiment, the first isolation portion 132 has a sub-portion 132A and a sub-portion 132B located on the sub-portion 132A, and the material of the sub-portion 132A and the sub-portion 132B includes a positive photoresist. For example, the sub-portion 132A and the pixel definition layer 114 may be the same film layer, in other words, the sub-portion 132A and the pixel definition layer 114 have the same thickness and the same material. The sub-part 132B and the spacer PS may be the same film layer, in other words, the sub-part 132B and the spacer PS have the same thickness and the same material. In this embodiment, the materials of the first isolation portion 132 and the second isolation portion 134 are different.

As the boundary 126a of the first inorganic encapsulation layer 126 and the boundary 130a of the second inorganic encapsulation layer 130 shrink inward, the distance between the boundary 126a and the boundary 130a and the organic encapsulation layer 128 is shortened. In this embodiment, the shape of the second isolation portion 134 is wide at the top and narrow at the bottom, and the maximum width 134w1 of the second isolation portion 134 is smaller than the width 132w of the first isolation portion. The organic encapsulation layer 128 spans the obstacle (ie The position of the first isolation portion 132 and the second isolation portion 134) can be increased to offset the cohesion of the organic encapsulation layer 128 and the first inorganic encapsulation layer 126, which can prevent the organic encapsulation layer 128 from overflowing due to capillary phenomena. An isolation portion 132 and a second isolation portion 134 improve the reliability of the lateral packaging. For example, the maximum width 134w1 of the second isolation portion 134 is 10 micrometers to 100 micrometers. The width 132w of the first isolation portion 132 is 10 micrometers to 100 micrometers, for example, the width 132w is 50 micrometers. The ratio of the maximum width 134w1 of the second isolation portion 134 to the minimum width 134w2 of the second isolation portion 134 is 1.1 to 2.

The material of the first inorganic encapsulation layer 126 includes inorganic materials, such as silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or a stacked layer of at least two of the foregoing materials.

The material of the organic encapsulation layer 128 includes organic materials, such as polyesters (PET), polyolefins, polypropylenes, polycarbonates, polyalkylene oxides, polyphenylenes, polyethers, polyketones, Polyols, polyaldehydes, other suitable materials or a combination of the above.

The cross-sectional shape of the second isolation portion 134 is chimney-shaped. In other words, the width of the second isolation portion 134 first assumes a constant value (for example, the minimum width 134w2) from bottom to top, then gradually increases and then assumes a constant value (for example, the maximum width 134w1). Such a multi-barrier design can effectively block the occurrence of capillary phenomena.

In this embodiment, the material of the pixel definition layer 114, the spacer PS, and the first isolation portion 132 includes a positive photoresist, and the material of the second isolation portion 134 includes a negative photoresist. For example, the second isolation portion 134 is formed by depositing a negative photoresist material on the entire surface, and then through exposure and development, so that the shape of the second isolation portion 134 can be controlled by the exposure time. In this embodiment, the number of the second isolation portion 134 is single.

FIGS. 3 and 4 are schematic cross-sectional views of other aspects of the first isolation portion 132 and the second isolation portion 134 according to an embodiment of the present invention. Please refer to FIG. 3 first, the number of the second isolation portions 134 is large For example, in Figure 3, the number of second isolation portions 134 is two. A trench 136 is formed between two adjacent second isolation portions 134. The trench 136 is like a reservoir. The organic encapsulation layer 128 is confined in the trench 136, which can prevent the organic encapsulation layer 128 from overflowing out of the first isolation portion 132 and the second isolation portion 134 due to capillary phenomena, thereby improving the reliability of the lateral packaging. In other embodiments, the number of the second isolation portion 134 is three (see FIG. 4). However, the present invention is not limited to this. In other embodiments, the number of the second isolation portion 134 may be greater than three.

In this embodiment, the width of the trench 136 is set from bottom to top (for example, the maximum width 136w1), gradually becomes smaller and then becomes a fixed value (for example, the minimum width 136w2).

As mentioned above, the second isolation portion 134 can be formed through exposure and development, and the shape of the second isolation portion 134 can be controlled by the exposure time. In this way, the second isolation portion 134 can have other shapes.

FIG. 5 is a schematic cross-sectional view of a display panel 10a according to another embodiment of the present invention. Please refer to FIG. 5. The cross-sectional shape of the second isolation portion 134 is an inverted trapezoid. In other words, the width of the second isolation portion 134 is from bottom to top It gradually becomes larger, that is, the width of the second isolation portion 134 changes from the minimum width 134w2 to the maximum width 134w1 from bottom to top. In this embodiment, the number of the second isolation portion 134 is single.

FIGS. 6 and 7 are schematic cross-sectional views of other aspects of the first isolation portion 132 and the second isolation portion 134 according to an embodiment of the present invention. Please refer to FIG. 6, the number of the second isolation portions 134 is large For example, Figure 6 shows that the number of second isolation portions 134 is two. A trench 136 is formed between two adjacent second isolation portions 134, and the width of the trench 136 gradually increases from bottom to top. Decrease, that is, the width of the trench 136 gradually decreases from the maximum width 136w1 to the minimum width 136w2 from bottom to top. The trench 136 acts like a reservoir to confine the organic encapsulation layer 128 in the trench 136 and avoid organic encapsulation. The layer 128 overflows out of the first isolation portion 132 and the second isolation portion 134 due to the capillary phenomenon, which improves the reliability of the lateral packaging. In other embodiments, the number of the second isolation portion 134 is three (see FIG. 7). However, the present invention is not limited to this. In other embodiments, the number of the second isolation portion 134 may be greater than three.

FIG. 8 is a schematic cross-sectional view of a display panel 10b according to another embodiment of the present invention. Please refer to FIG. 8. The main difference between the display panel 10b of this embodiment and the display panel 10 of FIG. 2 lies in the second isolation portion 134 The shapes are different. In this embodiment, the second isolation portion 134 is located on the first isolation portion 132, and the width 132w of the first isolation portion 132 is 10 micrometers to 100 micrometers. For example, the width 132w is 50 micrometers, and the width 132w of the second isolation portion 134 is 50 micrometers. The ratio of the maximum width 134w1 to the width 132w of the first isolation portion 132 is 0.1 to 0.95, and the upper surface 134T of the second isolation portion 134 has a wave shape.

In this embodiment, the materials of the first isolation portion 132 and the second isolation portion 134 are the same, and the materials of the two are, for example, positive photoresist, where the second isolation portion 134 and the first isolation portion 132 can pass through the first deposition of positive light. The resist material is then subjected to a first exposure to form the first isolation portion 132, and then a second exposure is performed to form the second isolation portion 134, wherein the width of the exposure range of the second exposure is smaller than that of the first exposure The width, for example, the width of the exposure range of the first exposure is 10 μm to 100 μm, and the width of the exposure range of the second exposure is 10 μm to 95 μm.

The first isolation portion 132 and the second isolation portion 134 together form a double-layer stepped side wall, and the position of the organic encapsulation layer 128 across the barrier (ie, the first isolation portion 132 and the second isolation portion 134) can increase the resistance Pin the cohesion between the organic encapsulation layer 128 and the first inorganic encapsulation layer 126 to prevent the organic encapsulation layer 128 from overflowing out of the first isolation portion 132 and the second isolation portion 134 due to capillary phenomena, thereby improving the reliability of lateral packaging . The distance between the first isolation portion 132 and the boundary 126a of the first inorganic encapsulation layer 126 and the boundary 130a of the second inorganic encapsulation layer 130 is 1 micrometer to 1000 micrometers. In one embodiment, the distance between the boundary 126a of the first isolation portion 132 and the first inorganic encapsulation layer 126 and the boundary 130a of the second inorganic encapsulation layer 130 is 1 micrometer to 240 micrometers. In this embodiment, the number of the second isolation portion 134 is single.

Fig. 9 is a schematic cross-sectional view of a display panel 10c according to another embodiment of the present invention. Please refer to Fig. 9. The main difference between the display panel 10c of this embodiment and the display panel 10b of Fig. 8 lies in the second isolation portion 134 The number is multiple. For example, in Figure 9, the number of the second isolation portion 134 is two, the maximum width 134w1 of the second isolation portion 134 is 10 microns, and two adjacent second isolation portions 134 A trench 136 is formed therebetween. The trench 136 can confine the organic encapsulation layer 128 in the trench 136 like a reservoir, and can prevent the organic encapsulation layer 128 from overflowing out of the first isolation portion 132 and the first isolation portion 132 and due to capillary phenomenon. The second isolation portion 134 improves the reliability of the lateral packaging. In other embodiments, the number of the second isolation portion 134 is three (see FIG. 10). However, the present invention is not limited to this. In other embodiments, the number of the second isolation portion 134 may be greater than three.

FIG. 11 is a schematic cross-sectional view of a display panel 10d according to another embodiment of the present invention. Please refer to FIG. 11. The main difference between the display panel 10d of this embodiment and the display panel 10 of FIG. 2 is: the first inorganic encapsulation layer 126 extends from the side surface of the first isolation portion 132 to the top surface of the first isolation portion 132, and the first inorganic encapsulation layer 126 has at least one opening 138 overlapping the top surface of the first isolation portion 132. The opening 138 of the first inorganic encapsulation layer 126 can be made by a mask process or an etching process. The opening 138 can confine the organic encapsulation layer 128 in the opening 138 like a gutter, which can prevent the organic encapsulation layer 128 from overflowing out of the first isolation portion 132 due to the capillary phenomenon, and improve the reliability of the lateral packaging. In this embodiment, the width 132w of the first isolation portion 132 is 10 micrometers to 100 micrometers, for example, the width 132w is 50 micrometers. The two sidewalls of the opening 138 are perpendicular to the top surface of the first isolation portion 132, that is, the gap of the opening 138 has no gentle slope. In other words, the opening 138 has a vertical surface, which can increase the difficulty of overflow of the organic encapsulation layer 128. In this embodiment, the number of openings 138 is single.

In this embodiment, the first isolation portion 132 has a sub-portion 132A and a sub-portion 132B, and the related description is the same as that in FIG. 2, so it will not be repeated here.

12 and 13 are schematic cross-sectional views of other aspects of the first inorganic encapsulation layer 126 and the first isolation portion 132 according to an embodiment of the present invention. Please refer to FIG. 12 first. The number of openings 138 is multiple. For example, FIG. 12 shows that the number of openings 138 is two. Next, referring to Figure 13, the number of openings 138 is three. However, the present invention is not limited to this. In other embodiments, the number of openings 138 may be greater than three.

In summary, in the display panel of an embodiment of the present invention, the display panel includes a first isolation portion and a second isolation portion, and the first isolation portion is located on the array substrate and located in the non-display area. The second isolation part is located on the first isolation part. The shape of the second isolation portion is wide at the top and narrow at the bottom, and the maximum width of the second isolation portion is smaller than the width of the first isolation portion. The organic encapsulation layer crosses the barrier (ie, the first isolation portion and the second isolation portion). Potential energy increases to offset the cohesion between the organic encapsulation layer and the first inorganic encapsulation layer, which can prevent the organic encapsulation layer from overflowing out of the first isolation part and the second isolation part due to capillary phenomenon, and improve the reliability of lateral packaging . In another embodiment of the display panel of the present invention, the ratio of the maximum width of the second isolation portion to the first isolation portion is 0.1 to 0.95, and the upper surface of the second isolation portion has a wave shape, so that the first isolation portion and the first isolation portion The two isolations together form a double-layer stepped sidewall. The position of the organic encapsulation layer across the barriers (ie, the first isolation portion and the second isolation portion) can be increased to offset the cohesion of the organic encapsulation layer and the first inorganic encapsulation layer Therefore, the organic encapsulation layer can be prevented from overflowing out of the first isolation part and the second isolation part due to the capillary phenomenon, and the reliability of the lateral packaging can be improved. In a display panel according to another embodiment of the present invention, the inorganic encapsulation layer extends from the side surface of the first isolation portion to the top surface of the first isolation portion, and the inorganic encapsulation layer has at least one opening overlapping the top surface of the first isolation portion. The opening of the inorganic encapsulation layer can be made by a mask process or an etching process. The opening can confine the organic encapsulation layer to the opening like a gutter, which can prevent the organic encapsulation layer from overflowing out of the first isolation portion and the second isolation portion due to the capillary phenomenon, thereby improving the reliability of the lateral packaging.

10, 10a, 10b, 10c, 10d: display panel

100: Array substrate

102: substrate

104: pixel array

105: buffer layer

106: gate insulation

108: Interlayer insulation layer

112: Flat layer

114: Pixel Definition Layer

116: luminescent layer

118: hole transport layer

120: electron transport layer

122: light-emitting unit

124: Package structure

126: The first inorganic encapsulation layer

126a: boundary

128: organic encapsulation layer

130: second inorganic encapsulation layer

130a: boundary

132: First Isolation Department

132w: width

134: Second Isolation Department

134T: upper surface

134w1: Maximum width

134w2: minimum width

136: Groove

138: Open

AA: Display area

CH: Channel area

D: Dip pole

D1: First direction

D2: second direction

DR: Drain region

E1: Electrode

E2: second electrode

G: Gate

I-I’: Sectional line

NA: non-display area

PS: Spacer

PX: pixel

S: source

SC: Semiconductor pattern

SR: Source region

T1: Active component

Read the following detailed description and match the corresponding diagrams to understand many aspects of this disclosure. It should be noted that many of the features in the drawing are not drawn in actual proportions according to the standard practice in the industry. In fact, the size of the features can be increased or decreased arbitrarily to facilitate the clarity of the discussion. FIG. 1 is a schematic top view of a display panel according to an embodiment of the invention. Fig. 2 is a schematic cross-sectional view taken along the section line I-I' of Fig. 1. FIG. 3 is a schematic cross-sectional view of other aspects of the first isolation portion and the second isolation portion according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of other aspects of the first isolation portion and the second isolation portion according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. FIG. 6 is a schematic cross-sectional view of other aspects of the first isolation portion and the second isolation portion according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of other aspects of the first isolation portion and the second isolation portion according to an embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. FIG. 9 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. FIG. 10 is a schematic cross-sectional view of other aspects of the first isolation portion and the second isolation portion according to another embodiment of the present invention. FIG. 11 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. FIG. 12 is a schematic cross-sectional view of another aspect of the first isolation portion and the first inorganic encapsulation layer according to another embodiment of the present invention. FIG. 13 is a schematic cross-sectional view of another aspect of the first isolation portion and the first inorganic encapsulation layer according to another embodiment of the present invention.

Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date, and number) no

10: Display panel

100: Array substrate

102: substrate

105: buffer layer

106: gate insulation

108: Interlayer insulation layer

112: Flat layer

114: Pixel Definition Layer

116: luminescent layer

118: hole transport layer

120: electron transport layer

122: light-emitting unit

124: Package structure

126: The first inorganic encapsulation layer

126a: boundary

128: organic encapsulation layer

130: second inorganic encapsulation layer

130a: boundary

132: First Isolation Department

132A: Subsection

132B: Subsection

132w: width

134: Second Isolation Department

134w1: Maximum width

134w2: minimum width

AA: Display area

CH: Channel area

D: Dip pole

DR: Drain region

E1: first electrode

E2: second electrode

G: Gate

I-I’: Sectional line

NA: non-display area

PS: Spacer

S: source

SC: Semiconductor pattern

SR: Source region

T1: Active component

Claims (10)

A display panel has a display area and a non-display area surrounding the display area, and includes: an array substrate; a first electrode located on the array substrate and located in the display area; and a pixel definition layer located in On the first electrode, the pixel definition layer has an opening overlapping the first electrode; a light-emitting layer is located in the opening; a first isolation portion is located on the array substrate and located in the non-display area; and At least one second isolation portion is located on the first isolation portion, the shape of the second isolation portion is wide at the top and narrow at the bottom, and the maximum width of the second isolation portion is smaller than the width of the first isolation portion. The display panel according to claim 1, wherein the number of the second isolation portions is multiple, and a trench is formed between two adjacent second isolation portions. The display panel according to claim 2, wherein the width of the groove gradually decreases from bottom to top. The display panel according to claim 2, wherein the width of the groove gradually decreases from a first constant value from bottom to top, and then becomes a second constant value. The display panel according to claim 1, wherein the ratio of the maximum width of the second isolation portion to the minimum width of the second isolation portion is 1.1 to 2. The display panel according to claim 1, wherein the material of the second isolation portion includes a negative photoresist. A display panel has a display area and a non-display area surrounding the display area, and includes: an array substrate; a first electrode located on the array substrate and located in the display area; and a pixel definition layer located in On the first electrode, the pixel definition layer has an opening overlapping the first electrode; a light-emitting layer located in the opening; a first isolation portion located on the array substrate and located in the non-display area; The first inorganic encapsulation layer extends from the side surface of the first isolation portion to the top surface of the first isolation portion, the first inorganic encapsulation layer has at least one opening overlapping the top surface of the first isolation portion, and the first The at least one opening of the inorganic encapsulation layer extends from the top surface of the first inorganic encapsulation layer to the bottom surface of the first inorganic encapsulation layer; and a second inorganic encapsulation layer located on the first inorganic encapsulation layer and filled in the at least An opening, and the second inorganic encapsulation layer extends from the non-display area to the display area. The display panel according to claim 7, wherein the two side walls of the opening are perpendicular to the top surface of the first isolation portion. A display panel has a display area and a non-display area surrounding the display area, and includes: an array substrate; a first electrode located on the array substrate and located in the display area; and a pixel definition layer located in On the first electrode, the pixel definition layer has an opening overlapping the first electrode; a light-emitting layer is located in the opening; a first isolation portion is located on the array substrate and located in the non-display area; and at least A second isolation portion located on the first isolation portion, wherein the ratio of the maximum width of the second isolation portion to the width of the first isolation portion is 0.1 to 0.95, and the upper surface of the second isolation portion has a wave shape . The display panel according to claim 9, further comprising: an inorganic encapsulation layer located on the array substrate and in the non-display area, wherein the distance between the first isolation portion and the boundary of the inorganic encapsulation layer is 1 μm to 1000 μm .

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