TWI727813B - Glass substrate structure of light-emitting diode - Google Patents

Glass substrate structure of light-emitting diode Download PDF

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TWI727813B
TWI727813B TW109117707A TW109117707A TWI727813B TW I727813 B TWI727813 B TW I727813B TW 109117707 A TW109117707 A TW 109117707A TW 109117707 A TW109117707 A TW 109117707A TW I727813 B TWI727813 B TW I727813B
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glass substrate
emitting diode
flexible substrate
light
side surfaces
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TW109117707A
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Chinese (zh)
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TW202145610A (en
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禹慶槿
楊志方
林俊興
吳明坤
黃隆健
謝俊瑩
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富元精密科技股份有限公司
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Priority to TW109117707A priority Critical patent/TWI727813B/en
Priority to CN202010673917.3A priority patent/CN113745205A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A glass substrate structure of light-emitting diode includes a glass substrate, a flexible substrate, a metal wiring, and a plurality of light-emitting diode chips. The glass substrate includes a first surface, a second surface, and a plurality of side surfaces. The flexible substrate is disposed on the glass substrate, and the flexible substrate is disposed on the first surface, on the at least one of the plurality of side surfaces and on the second surface. The metal wiring is disposed on a flexible substrate. The plurality of light emitting diode chips are disposed on the first surface and are electrically connected to the metal wiring. By disposing the metal wiring on the flexible substrate, and then adhesing the flexible substrate (including the metal wring) on the glass (substrate), the metal wring is bent to the side surface and the back surface of the glass, so that the upper surface of the glass can be a full-board LED.

Description

發光二極體玻璃基板結構 Light-emitting diode glass substrate structure

本揭露是關於一種發光二極體玻璃基板結構，特別是關於一種金屬佈線彎折到玻璃側邊及背面的發光二極體玻璃基板結構。 The disclosure relates to a light emitting diode glass substrate structure, in particular to a light emitting diode glass substrate structure in which metal wiring is bent to the sides and back of the glass.

發光二極體(light-emitting diode，LED)顯示螢幕發展至今，已逐漸出現大尺寸(例如，80吋或是85吋)的單體顯示器，但想要應用於像是建築物外面的牆面上以作為電子廣告牆仍是有所不足，因此先前技術中係將複數個LED顯示螢幕(舉例而言，使用16個顯示器排列成矩形)拼接而成為一個巨大尺寸的顯示器群組，並將畫面分割成對應的影像並交由各顯示螢幕分別顯示。 Since the development of light-emitting diode (LED) display screens, large-size (for example, 80-inch or 85-inch) single-cell displays have gradually appeared, but they want to be applied to walls like buildings The above is still inadequate as an electronic advertising wall. Therefore, in the prior art, multiple LED display screens (for example, 16 displays are arranged in a rectangle) are spliced into a huge size display group, and the pictures Split into corresponding images and display them on each display screen.

然而，由於先前技術中的顯示器通常是將金屬佈線的連接區域設置於顯示器的邊框處，使得顯示器的正面會具有非顯示區域，對單體顯示器而言，雖然不會明確地構成使用上的困擾，但應用在電子廣告牆時，非顯示區域會導致複數個分割畫面之間的不連貫，進而降低觀影品質。 However, since the display in the prior art usually arranges the connection area of the metal wiring at the frame of the display, the front of the display will have a non-display area. For a single display, although it will not clearly constitute a trouble in use , But when applied to an electronic advertising wall, the non-display area will cause discontinuities between multiple split screens, thereby reducing the viewing quality.

綜觀前所述，本發明的發明人設計了一種發光二極體玻璃基板結構，以針對現有技術的缺失加以改善，進而增進產業上之實施利用。 In summary, the inventor of the present invention designed a light-emitting diode glass substrate structure to improve on the shortcomings of the existing technology, thereby enhancing the industrial application.

鑑於上述問題，本發明之目的就是提供一種金屬佈線彎折到玻璃側邊及背面的發光二極體玻璃基板結構，以解決金屬佈線在邊框連接導致具有非顯示區域的問題。 In view of the above problems, the object of the present invention is to provide a light emitting diode glass substrate structure in which metal wiring is bent to the sides and back of the glass, so as to solve the problem of non-display area caused by metal wiring connected to the frame.

根據本發明之目的，提供一種發光二極體玻璃基板結構，其包含玻璃基板、軟性基材、金屬佈線以及複數個發光二極體晶片。玻璃基板包含第一表面、第二表面以及複數個側表面，第一表面朝向第一方向，第二表面朝向相反於第一方向的第二方向，且複數個側表面中的每一個相鄰於第一表面以及第二表面。軟性基材設置在玻璃基板上，軟性基材設置於第一表面上、複數個側表面的至少一個表面上以及第二表面上。金屬佈線設置在軟性基材上。以及複數個發光二極體晶片設置在第一表面上，並電性連接金屬佈線。 According to the objective of the present invention, a light emitting diode glass substrate structure is provided, which includes a glass substrate, a flexible substrate, metal wiring, and a plurality of light emitting diode chips. The glass substrate includes a first surface, a second surface, and a plurality of side surfaces. The first surface faces a first direction, the second surface faces a second direction opposite to the first direction, and each of the plurality of side surfaces is adjacent to The first surface and the second surface. The soft base material is arranged on the glass substrate, and the soft base material is arranged on the first surface, on at least one surface of the plurality of side surfaces, and on the second surface. The metal wiring is arranged on the flexible substrate. And a plurality of light-emitting diode chips are arranged on the first surface, and are electrically connected to the metal wiring.

較佳地，軟性基材可設置於複數個側表面當中之一，且延伸至第二表面上的至少一部份。 Preferably, the flexible substrate can be disposed on one of the plurality of side surfaces and extend to at least a part of the second surface.

較佳地，軟性基材可進一步覆蓋第二表面的整個表面。 Preferably, the flexible substrate can further cover the entire surface of the second surface.

較佳地，軟性基材可設置於複數個側表面當中的兩個相對側表面，且延伸至第二表面的至少一部份。 Preferably, the flexible substrate may be disposed on two opposite side surfaces among the plurality of side surfaces, and extend to at least a part of the second surface.

較佳地，軟性基材可進一步覆蓋第二表面的整個表面。 Preferably, the flexible substrate can further cover the entire surface of the second surface.

較佳地，軟性基材可設置於複數個側表面當中的所有側表面，且延伸至第二表面的至少一部份。 Preferably, the flexible substrate can be arranged on all the side surfaces among the plurality of side surfaces and extend to at least a part of the second surface.

較佳地，軟性基材可進一步覆蓋第二表面的整個表面。 Preferably, the flexible substrate can further cover the entire surface of the second surface.

較佳地，軟性基材可由聚醯亞胺組成。 Preferably, the flexible substrate may be composed of polyimide.

承上所述，依本發明之發光二極體玻璃基板結構，其可具有下述優點： 藉由將金屬佈線設置於軟性基材上，再將軟性基材(含線路)黏貼至玻璃基板來覆蓋住玻璃基板的側表面及背表面，使金屬佈線在側表面及背表面進行連接，以達到玻璃基板的正面為全板LED。 In summary, according to the light-emitting diode glass substrate structure of the present invention, it can have the following advantages: By placing the metal wiring on the flexible substrate, and then pasting the flexible substrate (including circuits) to the glass substrate to cover the side surface and back surface of the glass substrate, the metal wiring is connected on the side surface and the back surface. The front surface of the glass substrate is a full-board LED.

1、2、3、4:發光二極體玻璃基板結構 1, 2, 3, 4: Light-emitting diode glass substrate structure

10:發光二極體晶片 10: LED chip

20A、20B、20C、20D:金屬佈線 20A, 20B, 20C, 20D: metal wiring

30A、30B、30C、30D:軟性基材 30A, 30B, 30C, 30D: flexible substrate

40:玻璃基板 40: glass substrate

41:第一表面 41: The first surface

42:第二表面 42: second surface

43:側表面 43: side surface

DR1:第一方向 DR1: First direction

DR2:第二方向 DR2: Second direction

為使本發明之技術特徵、內容與優點及其所能達成之功效更為顯而易見，茲將本發明配合附圖，並以實施例之表達形式詳細說明如下：第1圖是根據本發明之發光二極體玻璃基板結構之第一實施例的示意圖；第2圖是根據本發明之發光二極體玻璃基板結構之第一實施例的斜視圖；第3圖是根據本發明之發光二極體玻璃基板結構之第二實施例的橫截面圖；第4圖是根據本發明之發光二極體玻璃基板結構之第三實施例的橫截面圖；第5圖是根據本發明之發光二極體玻璃基板結構之第四實施例的橫截面圖；第6圖是根據本發明之發光二極體玻璃基板結構之第四實施例的斜視圖。 In order to make the technical features, content and advantages of the present invention and its achievable effects more obvious, the present invention is combined with the accompanying drawings and described in detail in the form of embodiments as follows: Figure 1 is a light emitting device according to the present invention A schematic diagram of the first embodiment of a glass substrate structure of a diode; Fig. 2 is an oblique view of the first embodiment of a glass substrate structure of a light emitting diode according to the present invention; Fig. 3 is a light emitting diode according to the present invention The cross-sectional view of the second embodiment of the glass substrate structure; Figure 4 is the cross-sectional view of the third embodiment of the light-emitting diode glass substrate structure according to the present invention; Figure 5 is the light-emitting diode according to the present invention A cross-sectional view of the fourth embodiment of the glass substrate structure; FIG. 6 is an oblique view of the fourth embodiment of the light-emitting diode glass substrate structure according to the present invention.

為利瞭解本發明之技術特徵、內容與優點及其所能達成之功效，茲將本發明配合附圖，並以實施例之表達形式詳細說明如下，而其中所使用之圖式，其主旨僅為示意及輔助說明書之用，未必為本發明實施後之真實比例與精確配置，故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的權利範圍，合先敘明。 In order to understand the technical features, content and advantages of the present invention as well as the effects that can be achieved, the present invention is described in detail with the accompanying drawings and in the form of embodiment expressions as follows, and the figures used therein are only For the purpose of illustration and auxiliary description, it is not necessarily the true scale and precise configuration after the implementation of the present invention. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted, and the scope of rights of the present invention in actual implementation should not be interpreted. Narrate.

在附圖中，為了淸楚起見，放大元件的厚度或寬度。在整個說明書中，相同的附圖標記表示相同的元件。應當理解，當元件被稱為在另一元件 「上」或「連接到」或「設置於」另一元件時，其可以直接在另一元件上或與 另一元件連接，或者中間元件可以也存在。相反地，當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時，不存在中間元件。如本文所使用的「連接」或「設置」，其可以指物理及/或電性的連接或設置。此外，若使用術語「第一」、「第二」、「第三」僅用於描述目的，而不能理解為指示或暗示相對重要性或者其順序關係。 In the drawings, the thickness or width of the element is enlarged for the sake of clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element is referred to as another element When "on" or "connected to" or "set to" another component, it can be directly on the other component or with Another element is connected, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, “connection” or “setting” can refer to a physical and/or electrical connection or setting. In addition, if the terms "first", "second", and "third" are used for descriptive purposes only, they cannot be understood as indicating or implying relative importance or their order relationship.

除非另有定義，本文所使用的所有術語(包括技術和科學術語)具有與本發明所屬技術領域的通常知識者通常理解的含義。將進一步理解的是，諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義，並且將不被解釋為理想化的或過度正式的意義，除非本文中明確地如此定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have meanings commonly understood by ordinary knowledge in the technical field to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

第1圖是根據本發明之發光二極體玻璃基板結構之第一實施例的示意圖；第2圖是根據本發明之發光二極體玻璃基板結構之第一實施例的斜視圖。 Fig. 1 is a schematic diagram of the first embodiment of the light emitting diode glass substrate structure according to the present invention; Fig. 2 is a perspective view of the first embodiment of the light emitting diode glass substrate structure according to the present invention.

如圖所示，本發明之發光二極體玻璃基板結構1包含玻璃基板40、軟性基材30A、金屬佈線20A以及複數個發光二極體晶片10。玻璃基板40在本實施例中是矩形形狀，其包含第一表面41、第二表面42以及複數個側表面43(玻璃基板40為矩形形狀，因此共四個側表面)，第一表面41朝向第一方向DR1，而第二表面42則是朝向相反於第一方向DR1的第二方向DR2，亦即，第一表面41與第二表面42平行。複數個側表面43相鄰於第一表面41以及第二表面42，所述的複數個側表面43可以彼此平行，也可以彼此不平行，舉例而言，當第一表面41以及第二表面42的表面積相同且在第一方向DR1上彼此重疊時，這些複數個側 表面43彼此平行。但根據實際上的使用，複數個側表面43也可以與第一表面41具有夾角，以做成特殊的立體結構。 As shown in the figure, the light-emitting diode glass substrate structure 1 of the present invention includes a glass substrate 40, a flexible substrate 30A, a metal wiring 20A, and a plurality of light-emitting diode chips 10. The glass substrate 40 has a rectangular shape in this embodiment, which includes a first surface 41, a second surface 42 and a plurality of side surfaces 43 (the glass substrate 40 has a rectangular shape, so there are four side surfaces in total), and the first surface 41 faces The first direction DR1 and the second surface 42 are facing the second direction DR2 opposite to the first direction DR1, that is, the first surface 41 and the second surface 42 are parallel. The plurality of side surfaces 43 are adjacent to the first surface 41 and the second surface 42, and the plurality of side surfaces 43 may be parallel to each other or non-parallel to each other. For example, when the first surface 41 and the second surface 42 When the surface areas are the same and overlap each other in the first direction DR1, these plural sides The surfaces 43 are parallel to each other. However, according to actual use, a plurality of side surfaces 43 may also have an angle with the first surface 41 to form a special three-dimensional structure.

軟性基材30A是由聚醯亞胺(Polyimide，PI)組成，其具有適用溫度廣、耐化學腐蝕、高強度等優點。然而，本發明不限於此，軟性基材30A主要目的為承載金屬佈線20A且本身能夠彎折以貼合於玻璃基板40的複數個側表面43，因此，在其他實施例中，能夠彎折的有機聚合物亦可以做為軟性基材30A的材質。 The flexible substrate 30A is composed of polyimide (PI), which has the advantages of wide application temperature, chemical resistance, and high strength. However, the present invention is not limited to this. The main purpose of the flexible substrate 30A is to carry the metal wiring 20A and can be bent to be attached to the plurality of side surfaces 43 of the glass substrate 40. Therefore, in other embodiments, the flexible substrate 30A can be bent. Organic polymers can also be used as the material of the flexible substrate 30A.

更具體地，本發明的軟性基材30A具有大於玻璃基板40的第一表面41的總表面積，使軟性基材30A可以覆蓋住第一表面41後更進一步覆蓋至少一個側表面43及第二表面42中的至少一部分。在本實施例中，由於側表面的數量為4個，軟性基材30A可覆蓋於其中的一個側表面上，但本揭露不侷限於此，軟性基材30A也可覆蓋於兩個側表面43或四個側表面43上，並進一步延伸至第二表面42上，這些實施例將於後續段落進一步說明。 More specifically, the flexible substrate 30A of the present invention has a total surface area larger than the first surface 41 of the glass substrate 40, so that the flexible substrate 30A can cover the first surface 41 and then further cover at least one side surface 43 and the second surface. At least part of 42. In this embodiment, since the number of side surfaces is 4, the flexible substrate 30A can cover one of the side surfaces, but the present disclosure is not limited to this, and the flexible substrate 30A can also cover both side surfaces 43 Or on the four side surfaces 43, and further extend to the second surface 42, these embodiments will be further described in subsequent paragraphs.

金屬佈線20A是用於控制複數個發光二極體晶片10，且金屬佈線20A可以使用積體電路及印刷電路板方法、材料及程序來設置在尚未覆蓋玻璃基板40的軟性基材30A上。這裡所述的金屬佈線20A可以由銅、鉻、鉬、鉬合金、鋁、或鋁合金等導電材料組成。更具體地，金屬佈線20A可以包含絕緣層以及電路元件。電路元件可以包含驅動電路、訊號線、訊號焊墊以及像素驅動電路。 待金屬佈線20A設置在軟性基材30A上後，再將軟性基材30A黏貼至玻璃基板40，使金屬佈線20隨軟性基材30A一起彎折至玻璃基板40的側表面43及第二表面42。 The metal wiring 20A is used to control a plurality of light-emitting diode chips 10, and the metal wiring 20A can be disposed on the flexible substrate 30A that has not covered the glass substrate 40 using integrated circuit and printed circuit board methods, materials, and procedures. The metal wiring 20A described here may be composed of conductive materials such as copper, chromium, molybdenum, molybdenum alloy, aluminum, or aluminum alloy. More specifically, the metal wiring 20A may include an insulating layer and circuit elements. The circuit elements may include driving circuits, signal lines, signal pads, and pixel driving circuits. After the metal wiring 20A is placed on the flexible substrate 30A, the flexible substrate 30A is adhered to the glass substrate 40, so that the metal wiring 20 is bent along with the flexible substrate 30A to the side surface 43 and the second surface 42 of the glass substrate 40 .

在包含金屬佈線20A的軟性基材30A覆蓋至玻璃基板40後，發光二極體晶片10被設置在金屬佈線20A的上方並電性連接金屬佈線20A。在本實施例中，複數個發光二極體晶片10依據其本身是發射藍色、綠色以及紅色的排列方式依序排列。然而，本發明不限於此，舉例而言，複數個發光二極體晶片10也可以在第一方向DR1上(亦即，向上堆疊)交錯排列。更進一步地，複數個發光二極體晶片10的厚度亦可以彼此不相同。 After the flexible substrate 30A including the metal wiring 20A is covered on the glass substrate 40, the light emitting diode chip 10 is placed above the metal wiring 20A and electrically connected to the metal wiring 20A. In this embodiment, the plurality of light-emitting diode chips 10 are arranged in order according to the arrangement in which they emit blue, green, and red. However, the present invention is not limited to this. For example, a plurality of light-emitting diode chips 10 may also be arranged in a staggered manner in the first direction DR1 (that is, stacked upward). Furthermore, the thickness of the plurality of light-emitting diode chips 10 may also be different from each other.

另外，能夠發出紅光的發光二極體是由AlGaAs、GaAsP、AlGaInP以及GaP：ZnO中的一個組成；能夠發出綠光的發光二極體是由InGaN/GaN、GaP、AlGaInP以及AlGaP中的一個組成；以及能夠發出藍光的發光二極體是由ZnSe以及InGaN中的一個組成。然而，其他的半導體材料皆可以作為本實施例之發光二極體，即本發明不被上述所舉的示例所侷限。 In addition, the light emitting diode capable of emitting red light is composed of one of AlGaAs, GaAsP, AlGaInP, and GaP: ZnO; the light emitting diode capable of emitting green light is composed of one of InGaN/GaN, GaP, AlGaInP, and AlGaP Composition; and the light-emitting diode capable of emitting blue light is composed of one of ZnSe and InGaN. However, other semiconductor materials can be used as the light-emitting diode of this embodiment, that is, the present invention is not limited by the above-mentioned examples.

本實施例的實際製備方式為將金屬佈線20A配置在軟性基材30A上，並將軟性基材30A黏貼並覆蓋住玻璃基板40的第一表面41、其中一側表面43及第二表面42中的一部分，使金屬佈線20A在玻璃基板40的側邊進行連接，最後彎折到玻璃基板10的背面，最後在金屬佈線20A上配置複數個發光二極體晶片10，使得相關控制電路、晶片等結構能隱藏於玻璃基板40的背面，避免在第一表面41上設置而產生非顯示區域，將低拼接時邊框的影響以實現全版LED的顯示裝置。 The actual preparation method of this embodiment is to arrange the metal wiring 20A on the flexible substrate 30A, and paste the flexible substrate 30A to cover the first surface 41, one side surface 43 and the second surface 42 of the glass substrate 40. Part of the metal wiring 20A is connected on the side of the glass substrate 40, and finally bent to the back of the glass substrate 10, and finally a plurality of light-emitting diode chips 10 are arranged on the metal wiring 20A to make related control circuits, chips, etc. The structure can be hidden on the back of the glass substrate 40 to avoid the non-display area being set on the first surface 41, and the influence of the frame during splicing is reduced to realize a full-size LED display device.

第3圖是根據本發明之發光二極體玻璃基板結構之第二實施例的橫截面圖。圖示中，相同的元件是由相同的元件符號表示，其可參考上述實施例的描述，相同技術特徵不再重複說明。 Figure 3 is a cross-sectional view of the second embodiment of the light emitting diode glass substrate structure according to the present invention. In the figure, the same elements are represented by the same element symbols, which can refer to the description of the above embodiments, and the same technical features will not be repeated.

如圖所示，發光二極體玻璃基板2結構包含玻璃基板40、軟性基材30B、金屬佈線20B以及複數個發光二極體晶片10。軟性基材30B具有大於玻璃基板40的第一表面41的總表面積，使軟性基材30B可以覆蓋住第一表面41以、相對的兩個側表面43以及第二表面42中的一部分，與第一實施例相比，軟性基材30B延著兩個相對的側表面43設置，使得玻璃基板40兩端均貼附軟性基材30B，且分別延伸至第二表面42的至少一部份。在本實施例中，對於玻璃基板40兩側進行貼合，可藉由其對稱性來維持結構的平衡。另一方面，軟性基材30B在貼合時不需準確對齊玻璃基板40的其中一側邊界，在實際製作上也可降低製程的複雜度。依據軟性基材30B的設置，其包含的金屬佈線20B可沿著兩側延伸到第二表面42，也就是金屬佈線20B可以在玻璃基板40的背面上設置相關的控制電路或晶片，達到降低第一表面41面積的效果。 As shown in the figure, the structure of the light-emitting diode glass substrate 2 includes a glass substrate 40, a flexible substrate 30B, a metal wiring 20B, and a plurality of light-emitting diode wafers 10. The flexible substrate 30B has a total surface area greater than the first surface 41 of the glass substrate 40, so that the flexible substrate 30B can cover the first surface 41, the two opposite side surfaces 43 and a part of the second surface 42, and the first surface 41 Compared with an embodiment, the flexible substrate 30B is arranged along two opposite side surfaces 43, so that both ends of the glass substrate 40 are attached with the flexible substrate 30B and extend to at least a part of the second surface 42 respectively. In this embodiment, the two sides of the glass substrate 40 are bonded together, and the balance of the structure can be maintained by its symmetry. On the other hand, the flexible substrate 30B does not need to be accurately aligned with one side of the glass substrate 40 during bonding, and the complexity of the manufacturing process can also be reduced in actual production. According to the arrangement of the flexible substrate 30B, the metal wiring 20B contained therein can extend to the second surface 42 along both sides, that is, the metal wiring 20B can be provided with related control circuits or chips on the back of the glass substrate 40 to reduce the The effect of a surface area of 41.

第4圖是根據本發明之發光二極體玻璃基板結構之第三實施例的橫截面圖。圖示中，相同的元件是由相同的元件符號表示，其可參考上述實施例的描述，相同技術特徵不再重複說明。 FIG. 4 is a cross-sectional view of the third embodiment of the light emitting diode glass substrate structure according to the present invention. In the figure, the same elements are represented by the same element symbols, which can refer to the description of the above embodiments, and the same technical features will not be repeated.

如圖所示，發光二極體玻璃基板3結構包含玻璃基板40、軟性基材30C、金屬佈線20C以及複數個發光二極體晶片10。軟性基材30C具有大於玻璃基板40的第一表面41的總表面積，使軟性基材30C可以覆蓋住第一表面41相對的側側表面43以及第二表面42，與第二實施例相比，軟性基材30C覆蓋第二表面42的總面積的100%，使得玻璃基板40的第一表面41及第二表面42都能得到軟性基材30C的包覆及保護，同時也擴展了金屬佈線20C的區域。 As shown in the figure, the structure of the light-emitting diode glass substrate 3 includes a glass substrate 40, a flexible substrate 30C, a metal wiring 20C, and a plurality of light-emitting diode wafers 10. The flexible substrate 30C has a larger total surface area than the first surface 41 of the glass substrate 40, so that the flexible substrate 30C can cover the side surfaces 43 and the second surface 42 opposite to the first surface 41. Compared with the second embodiment, The flexible substrate 30C covers 100% of the total area of the second surface 42, so that the first surface 41 and the second surface 42 of the glass substrate 40 can be covered and protected by the flexible substrate 30C, and the metal wiring 20C is also expanded. Area.

第5圖是根據本發明之發光二極體玻璃基板結構之第四實施例的橫截面圖；第6圖是根據本發明之發光二極體玻璃基板結構之第四實施例的斜視 圖。圖示中，相同的元件是由相同的元件符號表示，其可參考上述實施例的描述，相同技術特徵不再重複說明。 Figure 5 is a cross-sectional view of the fourth embodiment of the light-emitting diode glass substrate structure according to the present invention; Figure 6 is a perspective view of the fourth embodiment of the light-emitting diode glass substrate structure according to the present invention Figure. In the figure, the same elements are represented by the same element symbols, which can refer to the description of the above embodiments, and the same technical features will not be repeated.

如圖所示，發光二極體玻璃基板結構4包含玻璃基板40、軟性基材30D、金屬佈線20D以及複數個發光二極體晶片10。在本實施例中，軟性基材30D具有大於玻璃基板40的第一表面41的總表面積，使軟性基材30D可以覆蓋住第一表面41、四個側表面43以及第二表面42中的每一個。與前述實施例不同之處，軟性基材30D包覆整個玻璃基板40的總面積的100%，將玻璃基板40密封於軟性基材30D當中。由於軟性基材30D是完整包覆玻璃基板40，在光線的反射或折射上可避免相關漏光的問題產生，與前述實施例類似地，軟性基材30D所包含的金屬佈線20D，可沿著玻璃基板40的四個側表面43延伸到背表面，增加線路配置的空間及選擇性。 As shown in the figure, the light-emitting diode glass substrate structure 4 includes a glass substrate 40, a flexible substrate 30D, a metal wiring 20D, and a plurality of light-emitting diode wafers 10. In this embodiment, the flexible substrate 30D has a total surface area larger than the first surface 41 of the glass substrate 40, so that the flexible substrate 30D can cover each of the first surface 41, the four side surfaces 43, and the second surface 42. One. The difference from the foregoing embodiment is that the flexible substrate 30D covers 100% of the total area of the entire glass substrate 40, and the glass substrate 40 is sealed in the flexible substrate 30D. Since the flexible substrate 30D completely covers the glass substrate 40, the related light leakage problems can be avoided in the reflection or refraction of light. Similar to the previous embodiment, the metal wiring 20D included in the flexible substrate 30D can be along the glass substrate. The four side surfaces 43 of the substrate 40 extend to the back surface, which increases the space and selectivity of circuit configuration.

應當注意的是，在上述的實施例中是以矩形基板為例來說明，即具有四個側表面，然而本發明不限於此，側表面可依據基板外型而有四個以上的複數個側表面，其根據實際製程或是產品而定。因此，上述的實施例為例示性質，而非限制性質。 It should be noted that in the above embodiments, a rectangular substrate is used as an example to illustrate, that is, it has four side surfaces. However, the present invention is not limited to this. The side surfaces may have four or more sides depending on the shape of the substrate. The surface depends on the actual manufacturing process or product. Therefore, the above-mentioned embodiments are illustrative rather than restrictive.

藉由上述實施例中所述之發光二極體玻璃基板結構，能夠使金屬佈線20A-20D沿著玻璃基板40的側表面43連接到第二表面42，進而降低第一表面41上的非顯示區域，達成全板LED，以克服習知技術中的缺點。 With the light-emitting diode glass substrate structure described in the above embodiment, the metal wiring 20A-20D can be connected to the second surface 42 along the side surface 43 of the glass substrate 40, thereby reducing non-display on the first surface 41. Area, to achieve full-board LED to overcome the shortcomings of the conventional technology.

以上所述僅為舉例性，而非為限制性者。任何未脫離本發明之精 神與範疇，而對其進行之等效修改或變更，均應包含於後附之申請專利範圍中。 The above description is only illustrative, and not restrictive. Anything that does not depart from the essence of the invention God and category, and equivalent amendments or changes to them, should be included in the attached scope of patent application.

1:發光二極體玻璃基板結構 1: Light-emitting diode glass substrate structure

10:發光二極體晶片 10: LED chip

20A:金屬佈線 20A: Metal wiring

30A:軟性基材 30A: Flexible substrate

40:玻璃基板 40: glass substrate

41:第一表面 41: The first surface

42:第二表面 42: second surface

43:側表面 43: side surface

DR1:第一方向 DR1: First direction

DR2:第二方向 DR2: Second direction

Claims (7)

一種發光二極體玻璃基板結構，其包含：一玻璃基板，包含一第一表面、一第二表面以及複數個側表面，該第一表面係朝向一第一方向，該第二表面係朝向相反於該第一方向的一第二方向，且該複數個側表面中的每一個相鄰於該第一表面以及該第二表面；一軟性基材，設置在該玻璃基板上，該軟性基材設置於該第一表面上、該複數個側表面當中的至少一個表面上以及該第二表面上；一金屬佈線，設置在該軟性基材上；以及複數個發光二極體晶片，設置在該第一表面上，並電性連接該金屬佈線；其中該軟性基材設置於該複數個側表面當中之一，且延伸至該第二表面上的至少一部份。 A light emitting diode glass substrate structure, comprising: a glass substrate including a first surface, a second surface and a plurality of side surfaces, the first surface is facing a first direction, and the second surface is facing opposite In a second direction of the first direction, and each of the plurality of side surfaces is adjacent to the first surface and the second surface; a flexible substrate disposed on the glass substrate, the flexible substrate Arranged on the first surface, on at least one of the plurality of side surfaces, and on the second surface; a metal wiring arranged on the flexible substrate; and a plurality of light emitting diode chips arranged on the On the first surface, the metal wiring is electrically connected; wherein the flexible substrate is disposed on one of the plurality of side surfaces and extends to at least a part of the second surface. 如請求項1所述之發光二極體玻璃基板結構，其中該軟性基材進一步覆蓋該第二表面的整個表面。 The light emitting diode glass substrate structure of claim 1, wherein the flexible substrate further covers the entire surface of the second surface. 如請求項1所述之發光二極體玻璃基板結構，其中該軟性基材設置於該複數個側表面當中的兩個相對側表面，且延伸至該第二表面的至少一部份。 The light-emitting diode glass substrate structure according to claim 1, wherein the flexible substrate is disposed on two opposite side surfaces among the plurality of side surfaces, and extends to at least a part of the second surface. 如請求項3所述之發光二極體玻璃基板結構，其中該軟性基材進一步覆蓋該第二表面的整個表面。 The light emitting diode glass substrate structure of claim 3, wherein the flexible substrate further covers the entire surface of the second surface. 如請求項1所述之發光二極體玻璃基板結構，其中該軟性基材設置於該複數個側表面當中的所有側表面，且延伸至該第 二表面的至少一部份。 The light-emitting diode glass substrate structure according to claim 1, wherein the flexible substrate is disposed on all side surfaces among the plurality of side surfaces, and extends to the first At least a part of the two surfaces. 如請求項5所述之發光二極體玻璃基板結構，其中該軟性基材進一步覆蓋該第二表面的整個表面。 The light emitting diode glass substrate structure of claim 5, wherein the flexible substrate further covers the entire surface of the second surface. 如請求項1所述之發光二極體玻璃基板結構，其中該軟性基材係由聚醯亞胺組成。 The light-emitting diode glass substrate structure according to claim 1, wherein the flexible substrate is composed of polyimide.
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