CN113745205A - Glass substrate structure of light-emitting diode - Google Patents
Glass substrate structure of light-emitting diode Download PDFInfo
- Publication number
- CN113745205A CN113745205A CN202010673917.3A CN202010673917A CN113745205A CN 113745205 A CN113745205 A CN 113745205A CN 202010673917 A CN202010673917 A CN 202010673917A CN 113745205 A CN113745205 A CN 113745205A
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- China
- Prior art keywords
- glass substrate
- flexible substrate
- side surfaces
- emitting diode
- metal wiring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses a glass substrate structure of a light-emitting diode, which comprises a glass substrate, a flexible base material, a metal wiring and a plurality of light-emitting diode chips. The glass substrate comprises a first surface, a second surface and a plurality of side surfaces. The soft base material is arranged on the glass substrate, and the soft base material is arranged on the first surface, at least one surface of the side surfaces and the second surface. The metal wiring is arranged on the flexible substrate. The plurality of light emitting diode chips are arranged on the first surface and electrically connected with the metal wiring. The metal wiring is manufactured on the flexible base material, and then the flexible base material is adhered to the glass substrate, so that the metal wiring is bent to the side edge and the back surface of the glass, and the front surface of the glass is a full-plate LED.
Description
Technical Field
The present invention relates to a glass substrate structure of light emitting diode, and more particularly, to a glass substrate structure of light emitting diode in which metal wires are bent to the side and back of the glass.
Background
Light-emitting diode (LED) display screens have been developed so far, and a single display with a large size (e.g. 80 inches or 85 inches) has gradually appeared, but it is still insufficient to be applied to a wall surface outside a building as an electronic advertisement wall, so in the background art, a plurality of LED display screens (for example, 16 displays are arranged in a rectangle) are spliced into a display group with a large size, and the picture is divided into corresponding images and then the images are sent to each display screen for display.
However, in the display in the background art, the connection area of the metal wiring is usually disposed at the frame of the display, so that the front of the display has a non-display area, and although the single display does not clearly constitute a trouble in use, when the display is applied to an electronic advertisement wall, the non-display area causes the discontinuity between the plurality of divided frames, thereby reducing the viewing quality.
In view of the foregoing, the present inventors have devised a glass substrate structure of a light emitting diode to overcome the shortcomings of the prior art and further enhance the industrial application.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a glass substrate structure of an led in which metal wires are bent to the side and back of the glass, so as to solve the problem of having a non-display area due to the connection of the metal wires in the frame.
According to an aspect of the present invention, a glass substrate structure for an led comprises a glass substrate, a flexible substrate, a metal wire and a plurality of led chips. The glass substrate comprises a first surface, a second surface and a plurality of side surfaces, wherein the first surface faces a first direction, the second surface faces a second direction opposite to the first direction, and each of the side surfaces is adjacent to the first surface and the second surface. The soft base material is arranged on the glass substrate, and the soft base material is arranged on the first surface, at least one surface of the side surfaces and the second surface. The metal wiring is arranged on the flexible substrate. And a plurality of light emitting diode chips arranged on the first surface and electrically connected with the metal wiring.
Preferably, the flexible substrate may be disposed on one of the plurality of side surfaces and extend to at least a portion of the second surface.
Preferably, the flexible substrate can also cover the whole surface of the second surface.
Preferably, the flexible substrate may be disposed on two opposite side surfaces among the plurality of side surfaces and extend to at least a portion of the second surface.
Preferably, the flexible substrate can also cover the whole surface of the second surface.
Preferably, the flexible substrate may be disposed on all side surfaces among the plurality of side surfaces and extend to at least a portion of the second surface.
Preferably, the flexible substrate can also cover the whole surface of the second surface.
Preferably, the flexible substrate may be composed of polyimide.
In summary, the glass substrate structure of the light emitting diode according to the present invention has the following advantages:
the metal wiring is arranged on the flexible base material, and then the flexible base material (including the circuit) is adhered to the glass substrate to cover the side surface and the back surface of the glass substrate, so that the metal wiring is connected on the side surface and the back surface, and the front surface of the glass substrate is a full-plate LED.
Drawings
FIG. 1 is a schematic view of a first embodiment of a glass substrate structure for a light emitting diode according to the present invention;
FIG. 2 is an oblique view of a first embodiment of a glass substrate structure for a light emitting diode according to the present invention;
FIG. 3 is a cross-sectional view of a second embodiment of a glass substrate structure for a light emitting diode according to the present invention;
FIG. 4 is a cross-sectional view of a third embodiment of a glass substrate structure for a light emitting diode according to the present invention;
FIG. 5 is a cross-sectional view of a fourth embodiment of a glass substrate structure for a light emitting diode according to the present invention;
fig. 6 is an oblique view of a fourth embodiment of a glass substrate structure for a light emitting diode according to the present invention.
Detailed Description
For the purpose of understanding the technical features, contents and advantages of the present invention and the efficacy achieved thereby, the present invention will be described in detail with reference to the accompanying drawings and embodiments, and the drawings used therein are for illustrative purposes and are not necessarily to scale and precise arrangements after the present invention is implemented, and therefore, the scope of the present invention is not to be read in and limited by the scale and arrangement of the attached drawings.
In the drawings, the thickness or width of the components is exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element is referred to as being "on" or "connected to" or "disposed" to another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" or "disposed," can refer to physical and/or electrical connections or arrangements. Moreover, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or order relationship.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
FIG. 1 is a schematic view of a first embodiment of a glass substrate structure for a light emitting diode according to the present invention; fig. 2 is an oblique view of a first embodiment of a glass substrate structure for a light emitting diode according to the present invention.
As shown in the figure, the led glass substrate structure 1 of the present invention includes a glass substrate 40, a flexible substrate 30A, a metal wire 20A, and a plurality of led chips 10. The glass substrate 40 is rectangular in shape in the embodiment, and includes a first surface 41, a second surface 42 and a plurality of side surfaces 43 (the glass substrate 40 is rectangular, so four side surfaces are all), the first surface 41 faces the first direction DR1, and the second surface 42 faces the second direction DR2 opposite to the first direction DR1, i.e., the first surface 41 and the second surface 42 are parallel. The side surfaces 43 are adjacent to the first surface 41 and the second surface 42, and the side surfaces 43 may be parallel to each other or not, for example, when the surface areas of the first surface 41 and the second surface 42 are the same and overlap each other in the first direction DR1, the side surfaces 43 are parallel to each other. However, depending on the actual application, the plurality of side surfaces 43 may also be angled with respect to the first surface 41 to form a specific three-dimensional structure.
The flexible substrate 30A is made of Polyimide (PI), and has the advantages of wide application temperature, chemical resistance, high strength, and the like. However, the present invention is not limited thereto, and the main purpose of the flexible substrate 30A is to carry the metal wiring 20A and to be able to be bent to adhere to the plurality of side surfaces 43 of the glass substrate 40, so in other embodiments, the bendable organic polymer may also be used as the material of the flexible substrate 30A.
More specifically, the flexible substrate 30A of the present invention has a total surface area larger than the first surface 41 of the glass substrate 40, so that the flexible substrate 30A can cover at least one of the side surface 43 and the second surface 42 after covering the first surface 41. In the embodiment, since the number of the side surfaces is 4, the flexible substrate 30A may cover one of the side surfaces, but the invention is not limited thereto, and the flexible substrate 30A may also cover two side surfaces 43 or four side surfaces 43 and further extend to the second surface 42, which will be further described in the following paragraphs.
The metal wiring 20A is used to control the plurality of led chips 10, and the metal wiring 20A may be disposed on the flexible substrate 30A not yet covered with the glass substrate 40 using integrated circuit and printed circuit board methods, materials and procedures. The metal wiring 20A described here may be composed of a conductive material such as copper, chromium, molybdenum alloy, aluminum, or aluminum alloy. More specifically, the metal wiring 20A may include an insulating layer as well as circuit components. The circuit components may include a driving circuit, a signal line, a signal pad, and a pixel driving circuit. After the metal wiring 20A is disposed on the flexible substrate 30A, the flexible substrate 30A is adhered to the glass substrate 40, so that the metal wiring 20 is bent to the side surface 43 and the second surface 42 of the glass substrate 40 along with the flexible substrate 30A.
After the flexible base material 30A including the metal wiring 20A is covered on the glass substrate 40, the light emitting diode chip 10 is disposed above the metal wiring 20A and electrically connected to the metal wiring 20A. In the present embodiment, the plurality of led chips 10 are arranged in sequence according to the arrangement of emitting blue, green and red lights. However, the invention is not limited thereto, for example, the plurality of led chips 10 may be alternatively arranged in the first direction DR1 (i.e., stacked upward). Further, the thicknesses of the led chips 10 may be different from each other.
In addition, the light emitting diode capable of emitting red light is composed of one of AlGaAs, GaAsP, AlGaInP and GaP: ZnO; the light emitting diode capable of emitting green light is composed of one of InGaN/GaN, GaP, AlGaInP, and AlGaP; and the light emitting diode capable of emitting blue light is composed of one of ZnSe and InGaN. However, other semiconductor materials can be used as the light emitting diode of the present embodiment, i.e., the present invention is not limited by the above-mentioned examples.
The practical preparation method of this embodiment is to dispose the metal wiring 20A on the flexible substrate 30A, adhere and cover a part of the first surface 41, one of the side surfaces 43 and the second surface 42 of the glass substrate 40 with the flexible substrate 30A, connect the metal wiring 20A at the side of the glass substrate 40, finally bend to the back of the glass substrate 10, and finally dispose a plurality of light emitting diode chips 10 on the metal wiring 20A, so that the related control circuits, chips and other structures can be hidden at the back of the glass substrate 40, thereby avoiding the generation of non-display areas due to the arrangement on the first surface 41, and reducing the influence of the frame during the splicing to realize the full-format LED display device.
FIG. 3 is a cross-sectional view of a second embodiment of a glass substrate structure for a light emitting diode according to the present invention. In the drawings, the same components are denoted by the same reference numerals, and reference may be made to the description of the above embodiments, and the description of the same technical features will not be repeated.
As shown in the figure, the led glass substrate 2 includes a glass substrate 40, a flexible substrate 30B, a metal wire 20B, and a plurality of led chips 10. Compared with the first embodiment, the flexible substrate 30B is disposed along the two opposite side surfaces 43, such that the two ends of the glass substrate 40 are both attached to the flexible substrate 30B and respectively extend to at least a portion of the second surface 42. In this embodiment, the glass substrate 40 is bonded on both sides, and the balance of the structure can be maintained by the symmetry. On the other hand, the flexible substrate 30B does not need to be aligned with one side of the glass substrate 40 during the bonding process, and the process complexity can be reduced in the actual manufacturing process. According to the arrangement of the flexible substrate 30B, the metal wiring 20B included therein can extend to the second surface 42 along both sides, that is, the metal wiring 20B can be provided with a related control circuit or chip on the back surface of the glass substrate 40, so as to achieve the effect of reducing the area of the first surface 41.
FIG. 4 is a cross-sectional view of a third embodiment of a glass substrate structure for a light-emitting diode according to the present invention. In the drawings, the same components are denoted by the same reference numerals, and reference may be made to the description of the above embodiments, and the description of the same technical features will not be repeated.
As shown in the figure, the led glass substrate 3 includes a glass substrate 40, a flexible substrate 30C, a metal wire 20C, and a plurality of led chips 10. The flexible substrate 30C has a total surface area larger than the first surface 41 of the glass substrate 40, so that the flexible substrate 30C can cover the side surface 43 and the second surface 42 opposite to the first surface 41, and compared with the second embodiment, the flexible substrate 30C covers 100% of the total area of the second surface 42, so that both the first surface 41 and the second surface 42 of the glass substrate 40 can be covered and protected by the flexible substrate 30C, and the area of the metal wiring 20C is also expanded.
FIG. 5 is a cross-sectional view of a fourth embodiment of a glass substrate structure for a light-emitting diode according to the present invention; FIG. 6 is an oblique view of a fourth embodiment of a glass substrate structure for a light emitting diode according to the present invention. In the drawings, the same components are denoted by the same reference numerals, and reference may be made to the description of the above embodiments, and the description of the same technical features will not be repeated.
As shown in the figure, the led glass substrate structure 4 includes a glass substrate 40, a flexible substrate 30D, a metal wire 20D, and a plurality of led chips 10. In the present embodiment, the flexible substrate 30D has a total surface area larger than the first surface 41 of the glass substrate 40, so that the flexible substrate 30D can cover each of the first surface 41, the four side surfaces 43 and the second surface 42. Unlike the previous embodiments, the flexible substrate 30D covers 100% of the total area of the glass substrate 40, and the glass substrate 40 is sealed in the flexible substrate 30D. Since the flexible substrate 30D completely covers the glass substrate 40, the problem of light leakage can be avoided in reflection or refraction of light, and the metal wires 20D included in the flexible substrate 30D can extend to the back surface along the four side surfaces 43 of the glass substrate 40, similar to the previous embodiment, so as to increase the space and selectivity of the circuit configuration.
It should be noted that the rectangular substrate is exemplified in the above embodiments, i.e. the substrate has four side surfaces, however, the invention is not limited thereto, and the side surfaces may have more than four side surfaces according to the substrate shape, which depends on the actual process or product. Accordingly, the embodiments described above are illustrative in nature and not restrictive.
With the glass substrate structure of the LED described in the above embodiments, the metal wires 20A-20D can be connected to the second surface 42 along the side surface 43 of the glass substrate 40, so as to reduce the non-display area on the first surface 41, thereby achieving a full-panel LED, so as to overcome the disadvantages of the prior art.
The foregoing is by way of example only, and not limiting. It is intended that all equivalent modifications or variations not departing from the spirit and scope of the present invention be included in the claims.
Claims (8)
1. A glass substrate structure of a Light Emitting Diode (LED), comprising:
a glass substrate comprising a first surface facing a first direction, a second surface facing a second direction opposite the first direction, and a plurality of side surfaces, each of the plurality of side surfaces being adjacent to the first surface and the second surface;
a flexible substrate disposed on the glass substrate, the flexible substrate being disposed on the first surface, on at least one of the plurality of side surfaces, and on the second surface;
a metal wiring disposed on the flexible substrate; and
and the plurality of light emitting diode chips are arranged on the first surface and are electrically connected with the metal wiring.
2. The LED glass substrate structure of claim 1, wherein the flexible substrate is disposed on one of the side surfaces and extends to at least a portion of the second surface.
3. The glass substrate structure of claim 2, wherein the flexible substrate further covers the entire surface of the second surface.
4. The LED glass substrate structure of claim 1, wherein the flexible substrate is disposed on two opposite side surfaces of the plurality of side surfaces and extends to at least a portion of the second surface.
5. The glass substrate structure of claim 4, wherein the flexible substrate further covers the entire surface of the second surface.
6. The LED glass substrate structure of claim 1, wherein the flexible substrate is disposed on all of the side surfaces and extends to at least a portion of the second surface.
7. The glass substrate structure of claim 6, wherein the flexible substrate further covers the entire surface of the second surface.
8. The glass substrate structure of claim 1, wherein the flexible substrate is comprised of polyimide.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109117707A TWI727813B (en) | 2020-05-27 | 2020-05-27 | Glass substrate structure of light-emitting diode |
| TW109117707 | 2020-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113745205A true CN113745205A (en) | 2021-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010673917.3A Pending CN113745205A (en) | 2020-05-27 | 2020-07-14 | Glass substrate structure of light-emitting diode |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113745205A (en) |
| TW (1) | TWI727813B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007233349A (en) * | 2006-01-31 | 2007-09-13 | Semiconductor Energy Lab Co Ltd | Display device |
| US20140043734A1 (en) * | 2012-08-09 | 2014-02-13 | Samsung Display Co., Ltd. | Flexible display apparatus and method of manufacturing the same |
| CN110308579A (en) * | 2018-03-22 | 2019-10-08 | 上海和辉光电有限公司 | A kind of rigidity display panel and preparation method thereof |
| CN110379322A (en) * | 2019-07-15 | 2019-10-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display module and display device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8395746B2 (en) * | 2006-01-31 | 2013-03-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| WO2011010542A1 (en) * | 2009-07-23 | 2011-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5701532B2 (en) * | 2010-07-23 | 2015-04-15 | オリンパス株式会社 | Manufacturing method of imaging apparatus |
-
2020
- 2020-05-27 TW TW109117707A patent/TWI727813B/en active
- 2020-07-14 CN CN202010673917.3A patent/CN113745205A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007233349A (en) * | 2006-01-31 | 2007-09-13 | Semiconductor Energy Lab Co Ltd | Display device |
| US20140043734A1 (en) * | 2012-08-09 | 2014-02-13 | Samsung Display Co., Ltd. | Flexible display apparatus and method of manufacturing the same |
| CN110308579A (en) * | 2018-03-22 | 2019-10-08 | 上海和辉光电有限公司 | A kind of rigidity display panel and preparation method thereof |
| CN110379322A (en) * | 2019-07-15 | 2019-10-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202145610A (en) | 2021-12-01 |
| TWI727813B (en) | 2021-05-11 |
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