TW202145610A - Glass substrate structure of light-emitting diode - Google Patents

Abstract

A glass substrate structure of light-emitting diode includes a glass substrate, a flexible substrate, a metal wiring, and a plurality of light-emitting diode chips. The glass substrate includes a first surface, a second surface, and a plurality of side surfaces. The flexible substrate is disposed on the glass substrate, and the flexible substrate is disposed on the first surface, on the at least one of the plurality of side surfaces and on the second surface. The metal wiring is disposed on a flexible substrate. The plurality of light emitting diode chips are disposed on the first surface and are electrically connected to the metal wiring. By disposing the metal wiring on the flexible substrate, and then adhesing the flexible substrate (including the metal wring) on the glass (substrate), the metal wring is bent to the side surface and the back surface of the glass, so that the upper surface of the glass can be a full-board LED.

Description

Light Emitting Diode Glass Substrate Structure

The present disclosure relates to a light emitting diode glass substrate structure, and more particularly, to a light emitting diode glass substrate structure in which metal wirings are bent to the sides and back of the glass.

With the development of light-emitting diode (LED) display screens, large-sized (for example, 80-inch or 85-inch) single-unit displays have gradually appeared, but they want to be applied to walls such as outside buildings. It is still insufficient to use the above as an electronic advertising wall, so in the prior art, a plurality of LED display screens (for example, 16 displays are arranged in a rectangle) are spliced together to form a huge-sized display group, and the pictures are combined. It is divided into corresponding images and displayed on each display screen.

However, since the display in the prior art usually sets the connection area of the metal wiring at the frame of the display, the front of the display will have a non-display area. For a single display, although it does not clearly pose a problem in use , but when applied to an electronic advertising wall, the non-display area will cause incoherence between multiple divided screens, thereby reducing the viewing quality.

In view of the foregoing, the inventors of the present invention have designed a light-emitting diode glass substrate structure to improve the deficiencies of the prior art, thereby enhancing industrial application and utilization.

In view of the above problems, the purpose of the present invention is to provide a light emitting diode glass substrate structure in which metal wiring is bent to the side and back of the glass, so as to solve the problem of non-display area caused by the connection of metal wiring on the frame.

According to the purpose of the present invention, a light-emitting diode glass substrate structure is provided, which includes a glass substrate, a flexible substrate, a metal wiring and a plurality of light-emitting diode chips. The glass substrate includes a first surface, a second surface and a plurality of side surfaces, the first surface faces a first direction, the second surface faces a second direction opposite to the first direction, and each of the plurality of side surfaces is adjacent to first surface and second surface. The soft base material is arranged on the glass substrate, and the soft base material is arranged on the first surface, at least one surface of the plurality of side surfaces, and the second surface. Metal wiring is provided on the flexible substrate. and a plurality of light emitting diode chips are arranged on the first surface and are electrically connected to metal wirings.

Preferably, the soft substrate can be disposed on one of the plurality of side surfaces and extend to at least a part of the second surface.

Preferably, the soft substrate can further cover the entire surface of the second surface.

Preferably, the soft substrate can be disposed on two opposite side surfaces among the plurality of side surfaces, and extend to at least a part of the second surface.

Preferably, the soft substrate can further cover the entire surface of the second surface.

Preferably, the soft substrate can be disposed on all the side surfaces among the plurality of side surfaces, and extend to at least a part of the second surface.

Preferably, the soft substrate can further cover the entire surface of the second surface.

Preferably, the soft substrate may be composed of polyimide.

Based on the above, according to the light-emitting diode glass substrate structure of the present invention, it can have the following advantages:

By arranging the metal wiring on the flexible substrate, and then pasting the flexible substrate (including the circuit) to the glass substrate to cover the side surface and the back surface of the glass substrate, the metal wiring is connected on the side surface and the back surface. The front side that reaches the glass substrate is a full-board LED.

In order to facilitate the understanding of the technical features, content and advantages of the present invention and the effects that can be achieved, the present invention is hereby described in detail with the accompanying drawings, and in the form of embodiments as follows, and the drawings used therein are only for the purpose of For the purpose of illustration and auxiliary description, it is not necessarily the real scale and precise configuration after the implementation of the present invention, so the ratio and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of the present invention in actual implementation. Say Ming.

In the drawings, the thickness or width of elements is exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element is referred to as being "on" or "connected to" or "disposed on" another element, it can be directly on or connected to the other element, or intervening elements may also be exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" or "setup" may refer to a physical and/or electrical connection or arrangement. In addition, if the terms "first", "second" and "third" are used for descriptive purposes only, they should not be construed to indicate or imply relative importance or their sequential relationship.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning unless expressly so defined herein.

FIG. 1 is a schematic view of the first embodiment of the light emitting diode glass substrate structure according to the present invention; FIG. 2 is a perspective view of the first embodiment of the light emitting diode glass substrate structure according to the present invention.

As shown in the figure, the light-emitting diode glass substrate structure 1 of the present invention includes a glass substrate 40 , a flexible substrate 30A, a metal wiring 20A and a plurality of light-emitting diode chips 10 . The glass substrate 40 has a rectangular shape in this embodiment, which includes a first surface 41 , a second surface 42 and a plurality of side surfaces 43 (the glass substrate 40 has a rectangular shape, so there are four side surfaces in total). The first surface 41 faces The first direction DR1 and the second surface 42 face the second direction DR2 opposite to the first direction DR1 , that is, the first surface 41 is parallel to the second surface 42 . A plurality of side surfaces 43 are adjacent to the first surface 41 and the second surface 42 , and the plurality of side surfaces 43 may be parallel to each other, or may not be parallel to each other, for example, when the first surface 41 and the second surface 42 The plurality of side surfaces 43 are parallel to each other when the surface areas are the same and overlap each other in the first direction DR1. However, according to the actual use, the plurality of side surfaces 43 may also have an included angle with the first surface 41 to form a special three-dimensional structure.

The soft substrate 30A is composed of polyimide (PI), which has the advantages of wide applicable temperature, chemical corrosion resistance, and high strength. However, the present invention is not limited to this, the main purpose of the flexible substrate 30A is to carry the metal wiring 20A and can be bent to adhere to the plurality of side surfaces 43 of the glass substrate 40. Therefore, in other embodiments, the flexible substrate 30A can be bent Organic polymers can also be used as the material of the soft substrate 30A.

More specifically, the flexible substrate 30A of the present invention has a total surface area larger than that of the first surface 41 of the glass substrate 40 , so that the flexible substrate 30A can cover the first surface 41 and then further cover at least one side surface 43 and the second surface. at least some of 42. In this embodiment, since the number of side surfaces is 4, the soft substrate 30A can cover one of the side surfaces, but the present disclosure is not limited to this, and the soft substrate 30A can also cover the two side surfaces 43 Or the four side surfaces 43, and further extend to the second surface 42, these embodiments will be further described in the following paragraphs.

The metal wiring 20A is used to control the plurality of light emitting diode chips 10 , and the metal wiring 20A can be provided on the flexible substrate 30A that has not covered the glass substrate 40 using integrated circuit and printed circuit board methods, materials and procedures. The metal wiring 20A described here may be composed of conductive materials such as copper, chromium, molybdenum, molybdenum alloy, aluminum, or aluminum alloy. More specifically, the metal wiring 20A may contain an insulating layer and circuit elements. The circuit elements may include driving circuits, signal lines, signal pads, and pixel driving circuits. After the metal wiring 20A is disposed on the flexible substrate 30A, the flexible substrate 30A is then adhered to the glass substrate 40 so that the metal wiring 20 is bent to the side surface 43 and the second surface 42 of the glass substrate 40 together with the flexible substrate 30A .

After the flexible substrate 30A including the metal wiring 20A is covered on the glass substrate 40 , the light emitting diode wafer 10 is disposed over the metal wiring 20A and electrically connected to the metal wiring 20A. In this embodiment, the plurality of light emitting diode chips 10 are arranged in sequence according to the arrangement of emitting blue, green and red. However, the present invention is not limited thereto, for example, a plurality of light emitting diode chips 10 may also be staggered in the first direction DR1 (ie, stacked upward). Furthermore, the thicknesses of the plurality of light emitting diode chips 10 may also be different from each other.

In addition, the light-emitting diode capable of emitting red light is composed of one of AlGaAs, GaAsP, AlGaInP and GaP:ZnO; the light-emitting diode capable of emitting green light is composed of one of InGaN/GaN, GaP, AlGaInP and AlGaP composition; and the light-emitting diode capable of emitting blue light is composed of one of ZnSe and InGaN. However, other semiconductor materials can be used as the light emitting diode of this embodiment, that is, the present invention is not limited by the above examples.

The actual preparation method of this embodiment is to arrange the metal wiring 20A on the flexible substrate 30A, and paste the flexible substrate 30A to cover the first surface 41 , one of the side surfaces 43 and the second surface 42 of the glass substrate 40 . Part of the metal wiring 20A is connected on the side of the glass substrate 40, and finally bent to the back of the glass substrate 10, and finally a plurality of light-emitting diode chips 10 are arranged on the metal wiring 20A, so that the related control circuits, chips, etc. The structure can be hidden on the backside of the glass substrate 40 to avoid non-display area caused by setting on the first surface 41 , and reduce the influence of the frame during splicing to realize a full-page LED display device.

FIG. 3 is a cross-sectional view of a second embodiment of a light-emitting diode glass substrate structure according to the present invention. In the drawings, the same elements are represented by the same element symbols, and reference may be made to the description of the above-mentioned embodiments, and the same technical features will not be repeated.

As shown in the figure, the structure of the light-emitting diode glass substrate 2 includes a glass substrate 40 , a flexible substrate 30B, a metal wiring 20B and a plurality of light-emitting diode chips 10 . The flexible substrate 30B has a total surface area larger than that of the first surface 41 of the glass substrate 40, so that the flexible substrate 30B can cover the first surface 41, the two opposite side surfaces 43 and a part of the second surface 42, which is the same as the first surface 41. Compared with one embodiment, the flexible substrate 30B is disposed along the two opposite side surfaces 43 , so that both ends of the glass substrate 40 are attached to the flexible substrate 30B and extend to at least a part of the second surface 42 respectively. In this embodiment, the two sides of the glass substrate 40 are bonded together, and the balance of the structure can be maintained by its symmetry. On the other hand, the flexible substrate 30B does not need to be precisely aligned with one side boundary of the glass substrate 40 during lamination, which can also reduce the complexity of the process in actual fabrication. According to the setting of the flexible substrate 30B, the metal wiring 20B contained therein can extend to the second surface 42 along both sides, that is, the metal wiring 20B can be provided with a related control circuit or chip on the back of the glass substrate 40 to reduce the The effect of a surface 41 area.

FIG. 4 is a cross-sectional view of a third embodiment of a light-emitting diode glass substrate structure according to the present invention. In the drawings, the same elements are represented by the same element symbols, and reference may be made to the description of the above-mentioned embodiments, and the same technical features will not be repeated.

As shown in the figure, the structure of the light-emitting diode glass substrate 3 includes a glass substrate 40 , a flexible substrate 30C, a metal wiring 20C and a plurality of light-emitting diode chips 10 . The soft substrate 30C has a total surface area larger than that of the first surface 41 of the glass substrate 40, so that the soft substrate 30C can cover the opposite side surfaces 43 and the second surface 42 of the first surface 41. Compared with the second embodiment, The soft base material 30C covers 100% of the total area of the second surface 42, so that the first surface 41 and the second surface 42 of the glass substrate 40 can be covered and protected by the soft base material 30C, and the metal wiring 20C is also extended. Area.

FIG. 5 is a cross-sectional view of the fourth embodiment of the light emitting diode glass substrate structure according to the present invention; FIG. 6 is a perspective view of the fourth embodiment of the light emitting diode glass substrate structure according to the present invention. In the drawings, the same elements are represented by the same element symbols, and reference may be made to the description of the above-mentioned embodiments, and the same technical features will not be repeated.

As shown in the figure, the light emitting diode glass substrate structure 4 includes a glass substrate 40 , a flexible substrate 30D, a metal wiring 20D and a plurality of light emitting diode chips 10 . In this embodiment, the flexible substrate 30D has a total surface area larger than that of the first surface 41 of the glass substrate 40 , so that the flexible substrate 30D can cover each of the first surface 41 , the four side surfaces 43 and the second surface 42 . One. Different from the foregoing embodiments, the flexible substrate 30D covers 100% of the total area of the entire glass substrate 40 , and the glass substrate 40 is sealed in the flexible substrate 30D. Since the flexible substrate 30D completely covers the glass substrate 40, the problem of light leakage can be avoided in terms of reflection or refraction of light. Similar to the foregoing embodiment, the metal wiring 20D included in the flexible substrate 30D can extend along the glass surface. The four side surfaces 43 of the substrate 40 extend to the back surface to increase the space and selectivity of the wiring arrangement.

It should be noted that, in the above-mentioned embodiments, a rectangular substrate is used as an example for illustration, that is, it has four side surfaces, but the present invention is not limited to this, and the side surfaces may have more than four sides according to the shape of the substrate The surface, which depends on the actual process or product. Accordingly, the above-described embodiments are illustrative in nature and not restrictive in nature.

With the light-emitting diode glass substrate structure described in the above embodiment, the metal wirings 20A- 20D can be connected to the second surface 42 along the side surface 43 of the glass substrate 40 , thereby reducing the non-display on the first surface 41 area to achieve full-board LEDs to overcome the shortcomings of the prior art.

The above description is exemplary only, not limiting. Any equivalent modifications or changes that do not depart from the spirit and scope of the present invention shall be included in the appended patent application scope.

1, 2, 3, 4: Light-emitting diode glass substrate structure 10: LED chip 20A, 20B, 20C, 20D: Metal wiring 30A, 30B, 30C, 30D: Soft substrate 40: glass substrate 41: First surface 42: Second Surface 43: Side Surface DR1: first direction DR2: Second direction

In order to make the technical features, content and advantages of the present invention and the effects that can be achieved more obvious, the present invention is hereby described in detail as follows in the form of embodiments in conjunction with the accompanying drawings: FIG. 1 is a schematic diagram of a first embodiment of the structure of the light-emitting diode glass substrate according to the present invention; FIG. 2 is a perspective view of the first embodiment of the structure of the light-emitting diode glass substrate according to the present invention; FIG. 3 is a cross-sectional view of a second embodiment of the structure of the light-emitting diode glass substrate according to the present invention; FIG. 4 is a cross-sectional view of a third embodiment of the structure of the light-emitting diode glass substrate according to the present invention; 5 is a cross-sectional view of a fourth embodiment of the structure of the light-emitting diode glass substrate according to the present invention; FIG. 6 is a perspective view of a fourth embodiment of the structure of the light-emitting diode glass substrate according to the present invention.

1: Light-emitting diode glass substrate structure

10: LED chip

20A: Metal wiring

30A: Soft substrate

40: glass substrate

41: First surface

42: Second Surface

43: Side Surface

DR1: first direction

DR2: Second direction

Claims (8)

A light-emitting diode glass substrate structure, comprising: A glass substrate includes a first surface, a second surface and a plurality of side surfaces, the first surface faces a first direction, the second surface faces a second direction opposite to the first direction, and Each of the plurality of side surfaces is adjacent to the first surface and the second surface; a flexible substrate disposed on the glass substrate, the flexible substrate disposed on the first surface, at least one surface among the plurality of side surfaces, and the second surface; a metal wiring disposed on the flexible substrate; and A plurality of light emitting diode chips are arranged on the first surface and are electrically connected to the metal wiring. The light-emitting diode glass substrate structure as claimed in claim 1, wherein the flexible substrate is disposed on one of the plurality of side surfaces and extends to at least a part of the second surface. The light-emitting diode glass substrate structure as claimed in claim 2, wherein the flexible substrate further covers the entire surface of the second surface. The light-emitting diode glass substrate structure of claim 1, wherein the flexible substrate is disposed on two opposite side surfaces among the plurality of side surfaces, and extends to at least a part of the second surface. The light-emitting diode glass substrate structure as claimed in claim 4, wherein the flexible substrate further covers the entire surface of the second surface. The light-emitting diode glass substrate structure as claimed in claim 1, wherein the flexible substrate is disposed on all side surfaces among the plurality of side surfaces, and extends to at least a part of the second surface. The light-emitting diode glass substrate structure as claimed in claim 6, wherein the flexible substrate further covers the entire surface of the second surface. The light-emitting diode glass substrate structure according to claim 1, wherein the flexible substrate is composed of polyimide.

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