TWI727559B - LED packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention belongs to the technical field of LED light sources, and in particular relates to an LED packaging structure and a manufacturing method thereof. The LED packaging structure includes a substrate, a light-emitting chip, a fluorescent sheet and a shielding glue. The light-emitting chip is mounted on the substrate, and the fluorescent sheet is located on the back of the light-emitting chip. On the surface of the substrate, the light-emitting chip and the fluorescent sheet are laminated, and the fluorescent sheet is provided with protrusions, which are arranged around the fluorescent sheet; the shielding glue is arranged on the sides around the light-emitting chip and around the fluorescent sheet On the sides and bumps to achieve the packaging and shielding of the light-emitting chip. Because the phosphor of the LED package structure is provided with bumps, the bumps make the path for external water vapor infiltration longer, increase the difficulty of external water vapor penetration, improve air tightness, and effectively prevent the phosphor and the light-emitting chip The adhesion between the aging and deterioration solves the problem that the existing fluorescent sheet and the light-emitting chip are easy to fall off, ensures the connection reliability of the fluorescent sheet and the light-emitting chip, and prolongs the service life of the LED packaging structure.

Description

LED packaging structure and manufacturing method thereof

The invention belongs to the technical field of LED (Light Emitting Diode) light sources, and in particular relates to an LED packaging structure and a manufacturing method thereof.

LED has the advantages of small size, low power consumption, fast response speed, long life and so on. In recent years, it has become more and more widely used in car lights. For car light products, high reliability is the guarantee of the quality of car light products. At present, a simple LED packaging structure has appeared on the market. As shown in Figure 1, this LED packaging structure includes a substrate 4 and a light-emitting chip 3. , Masking glue 2, Fluorescent sheet 1, Fluorescent sheet 1 and light-emitting chip 3 are bonded through a transparent adhesive, but this kind of adhesive is prone to aging and deterioration during long-term use, resulting in fluorescent sheet 1 and light-emitting chip 3 Falling off directly affects the performance of the LED, which is a fatal defect of the LED.

The purpose of the present invention is to provide an LED packaging structure and a manufacturing method thereof, aiming to solve the technical problem that the fluorescent sheet and the light-emitting chip in the LED in the prior art are easy to fall off.

In order to achieve the above objectives, the technical solution adopted by the present invention is: an LED packaging structure, including a substrate, a light-emitting chip, a phosphor and a shielding glue. The light-emitting chip is mounted on the substrate, and the phosphor is located on the surface of the light-emitting chip that faces away from the substrate. , The light-emitting chip and the phosphor are stacked, and the phosphor is provided with The bumps are arranged around the phosphor; the shielding glue is arranged on the sides around the light-emitting chip, the sides around the light-emitting chip, and the protrusions to realize the packaging and shielding of the light-emitting chip.

Optionally, steps for forming protrusions are provided on all sides of the fluorescent sheet.

Optionally, the phosphor has a first surface and a second surface that are opposed to each other, and the second surface faces the light-emitting chip; the steps include at least one first step, and all the first steps together serve as protrusions. In the direction to the second surface, the distance between each first step and the center line of the phosphor becomes farther or closer.

Optionally, the number of the first steps is one, and the first steps include a first longitudinal surface, a first horizontal surface, and a second longitudinal surface that sequentially connect from the inside of the phosphor to the outside; the first step is close to the second surface Wherein, the first surface is perpendicularly connected with the first longitudinal surface, the second surface is perpendicularly connected with the second longitudinal surface, and the first horizontal surface, the second longitudinal surface and the second surface are jointly enclosed to form a protrusion.

Optionally, the phosphor has a third surface and a fourth surface that are arranged oppositely, the fourth surface faces the light-emitting chip; the steps include at least one second step and at least one third step, and each second step is close to the third surface The third steps are arranged close to the fourth surface, and all the second steps and all the third steps are used as protrusions; in the direction from the third surface to the fourth surface, each of the second steps and the phosphor The distance between the center lines of each step is getting farther and farther, and the distance between each third step and the center line of the phosphor is getting closer and closer.

Optionally, the number of the second steps and the number of the third steps are both one; the second step includes a third longitudinal surface, a second horizontal surface, and a fourth longitudinal surface that are sequentially connected from the inside of the fluorescent sheet to the outside; The three steps include a fifth longitudinal surface, a third horizontal surface, and a sixth longitudinal surface that are sequentially connected from the inside of the phosphor to the outside; the third surface is perpendicular to the third longitudinal surface, and the fourth longitudinal surface is connected to the sixth longitudinal surface. , The fourth surface is perpendicularly connected with the fifth longitudinal surface, and the second horizontal surface, the fourth longitudinal surface, the third horizontal surface and the sixth longitudinal surface are jointly enclosed to form a protrusion.

Optionally, the phosphor has a fifth surface and a sixth surface that are arranged oppositely, the sixth surface faces the light-emitting chip; the convex end surface is a first inclined surface, and opposite ends of the first inclined surface are respectively connected to the fifth surface It is connected to the sixth surface and the protrusion protrudes from the fifth surface toward the sixth surface.

Optionally, the fluorescent sheet has a seventh surface and an eighth surface disposed oppositely, and the eighth surface faces the light-emitting chip; the convex end surface is a second inclined surface, and one end of the second inclined surface is connected to the side surface of the fluorescent sheet. The middle part is connected, the other end of the second inclined surface is connected to the eighth surface and the protrusion protrudes from the middle part of the side surface of the fluorescent sheet toward the eighth surface.

Optionally, the fluorescent sheet covers the light-emitting chip, the protrusions protrude out of the periphery of the light-emitting chip, and the shielding glue is located above the substrate and engages with the protrusions.

The above one or more technical solutions in the LED packaging structure provided by the present invention have at least one of the following technical effects: Compared with the existing LED packaging structure, because the phosphor of the LED packaging structure is provided with protrusions, the protrusions surround It is set on the side surface around the phosphor, and the shielding glue is also coated on the bumps and interlocking with the bumps, so that external moisture penetrates the light-emitting chip and the phosphor from the junction between the shielding glue and the phosphor In the process of corroding and aging the adhesive between the chips, the external water vapor needs to cross the protrusions, and the external water vapor penetration path is longer, which increases the difficulty of external water vapor penetration and improves the air tightness of the LED packaging structure. Effectively prevent the aging and deterioration of the adhesive between the phosphor and the light-emitting chip, solve the problem that the existing phosphor and the light-emitting chip are easy to fall off, ensure the reliability of the connection between the phosphor and the light-emitting chip, and extend the LED package The service life of the structure.

Another technical solution adopted by the present invention is: a method for manufacturing the above-mentioned LED packaging structure, which specifically includes the following steps: providing a fluorescent substrate; cutting or etching the fluorescent substrate to obtain a plurality of fluorescent sheets with protrusions ; After mounting the light-emitting chip on the substrate, take the fluorescent sheet and glue it on the surface of the light-emitting chip that faces away from the substrate; The masking glue is coated on the sides around the light-emitting chip, the sides around the phosphors, and on the protrusions.

10, 4: substrate

20,3: Light-emitting chip

30,1: Fluorescent film

31: raised

32: The first surface

33: second surface

34: The first step

35: third surface

36: fourth surface

37: Second Ladder

38: The third ladder

39: Fifth Surface

40: sixth surface

41: The first inclined plane

42: Seventh Surface

43: Eighth Surface

44: second inclined surface

50,2: Blocking glue

60: Fluorescent substrate

61: The first processing slot

62: The second processing slot

63: The third processing slot

341: First longitudinal plane

342: first level

343: second longitudinal plane

371: third longitudinal plane

372: second level

373: Fourth Longitudinal Plane

381: Fifth longitudinal plane

382: The Third Level

383: Sixth Longitudinal Plane

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some of the present invention. The embodiments, for those with ordinary knowledge in the field, can obtain other drawings based on these drawings without creative work.

Figure 1 is a cross-sectional view of the LED package structure described in the prior art.

Figure 2 is a schematic structural diagram of an LED packaging structure provided by an embodiment of the present invention.

Figure 3 is a cross-sectional view taken along line A-A in Figure 2.

Fig. 4 is a cross-sectional view of the phosphor of the LED package structure shown in Fig. 3.

FIG. 5 is a cross-sectional view of a phosphor of an LED packaging structure provided by another embodiment of the present invention.

Fig. 6 is a cross-sectional view of an LED package structure provided by another embodiment of the present invention.

Fig. 7 is a cross-sectional view of the phosphor of the LED package structure shown in Fig. 6.

FIG. 8 is a cross-sectional view of a phosphor of an LED packaging structure provided by another embodiment of the present invention.

FIG. 9 is a cross-sectional view of an LED package structure provided by another embodiment of the present invention.

FIG. 10 is a cross-sectional view of an LED package structure provided by another embodiment of the present invention.

FIG. 11 is a manufacturing flow chart of the phosphor of the LED package structure provided by another embodiment of the present invention.

The following describes the embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar element symbols from the beginning to the end indicate the same or similar elements or have the same or similar functions. Energy components. The following embodiments described with reference to FIGS. 2 to 11 are exemplary, and are intended to explain the present invention, but should not be understood as a limitation to the present invention.

In the description of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating It may also imply that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For those with ordinary knowledge in this field, the specific meaning of the above terms in the present invention can be understood according to the specific situation.

As shown in FIGS. 2 to 11, in one embodiment of the present invention, an LED package structure is provided, which includes a substrate 10, a light-emitting chip 20, a phosphor 30, and a shielding glue 50. The light-emitting chip 20 is mounted on the substrate 10. Above, the fluorescent sheet 30 is located on the surface of the light-emitting chip 20 facing away from the substrate 10, the light-emitting chip 20 and the fluorescent sheet 30 are laminated, the fluorescent sheet 30 covers the light-emitting chip 20, and the fluorescent sheet 30 is provided with protrusions 31 , The protrusion 31 is surrounded by the phosphor 30 and protrudes from the periphery of the light-emitting chip 20; the shielding glue 50 is located on the substrate 10 Square; the shielding glue 50 is arranged on the sides around the light-emitting chip 20, on the sides around the phosphor 30 and on the bumps 31 to realize the packaging and shielding of the light-emitting chip 20.

Specifically, in the LED packaging structure of the embodiment of the present invention, during production, the light-emitting chip 20 is first mounted on the substrate 10, and then the fluorescent sheet 30 is bonded to the light-emitting chip 20, and finally the shielding glue 50 is simultaneously coated On the side surface around the phosphor 30 and the side surface around the light-emitting chip 20, the packaging and shielding of the light-emitting chip 20 is thus completed; compared with the existing LED packaging structure, the LED packaging structure is provided with the phosphor 30 There are protrusions 31. The protrusions 31 are arranged on the sides around the fluorescent sheet 30, and the shielding glue 50 is also arranged on the protrusions 31, so that external water vapor flows from the connection between the shielding glue 50 and the fluorescent sheet 30 In the process of penetrating into the corrosion and aging adhesive between the light-emitting chip 20 and the phosphor 30, the external water vapor needs to cross the protrusion 31, and the path of the external water vapor penetration is longer, which increases the difficulty of the external water vapor penetration and improves The airtightness of the LED packaging structure is effectively prevented from aging and deterioration of the adhesive between the fluorescent sheet 30 and the light-emitting chip 20, which solves the problem that the existing fluorescent sheet 30 and the light-emitting chip 20 are easy to fall off, and ensures the fluorescent light. The reliability of the connection between the sheet 30 and the light-emitting chip 20 prolongs the service life of the LED packaging structure, and the shielding glue 50 is arranged on the protrusion 31, so that the protrusion 31 and the shielding glue 50 are interlocked with each other to produce a fluorescent sheet 30 is not easy to fall off.

Preferably, the fluorescent sheet 30 can be a fluorescent glass sheet, a fluorescent ceramic sheet, or a fluorescent glue film sheet, and the specific selection thereof is selected according to actual needs.

In another embodiment of the present invention, the fluorescent sheet 30 of the provided LED packaging structure is provided with steps for forming protrusions on all sides. Specifically, water vapor needs to cross the steps before it can penetrate between the light-emitting chip 20 and the phosphor 30 to corrode the aging adhesive, which increases the difficulty of water vapor penetration, thereby increasing the airtightness of the LED packaging structure, and at the same time , The method of making steps around the phosphor 30 is simple, and the surrounding structure is relatively neat, which is convenient for making.

In another embodiment of the present invention, referring to FIG. 5, the phosphor 30 of the LED packaging structure is provided with a first surface 32 and a second surface 33 opposed to each other, and the second surface 33 faces The light-emitting chip 20, specifically, the light-emitting chip 20 is adhered to the second surface; the steps include at least one first step 34, and all the first steps 34 collectively serve as protrusions 31 in the direction from the first surface 32 to the second surface 33 Above, the distance between each first step 34 and the center line of the phosphor 30 is getting farther or closer. Specifically, the number of the first steps 34 may be one or more. Then the external water vapor needs to walk through one or more steps, and the external water vapor needs to bend one or more times to penetrate into the light-emitting chip 20 and the phosphor 30. The more the number of the first steps 34, the more times the external water vapor penetrates into the light-emitting chip 20 and the fluorescent film 30 and the number of bends, that is, the penetration path is tortuous, then the external water vapor penetrates into the light-emitting chip 20 It is more difficult to age the adhesive with the fluorescent sheet 30, which makes the LED packaging structure have better airtightness and reliability. It can also greatly reduce the possibility of adhesive aging, and greatly extend the LED packaging structure. Service life.

In another embodiment of the present invention, referring to FIG. 2, FIG. 3, and FIG. 4, the number of the first steps 34 of the LED packaging structure is one, and the first step 34 is close to the second surface. 33. In another embodiment of the present invention, the first step 34 can be set close to the first surface 32. The two embodiments have similar structures and have the same function. In the following, the first step 34 is set close to the second surface 33. Be explained. The first step 34 includes a first longitudinal surface 341, a first horizontal surface 342, and a second longitudinal surface 343 that are successively connected from the inside of the phosphor 30 to the outside; the first surface 32 is perpendicularly connected to the first longitudinal surface 341, and the second The surface 33 is perpendicularly connected to the second longitudinal surface 343, and the first horizontal surface 342, the second longitudinal surface 343 and the second surface 33 jointly surround the protrusion 31. Specifically, the periphery of the fluorescent sheet 30 is stepped, so that the external water vapor needs to penetrate along the first step 34, and needs to pass through the first longitudinal surface 341, the first horizontal surface 342, and the second longitudinal surface 343 in sequence, which is different from the existing Compared with the LED package structure, the external water vapor needs to take the path of the first horizontal plane 342, which greatly increases the penetration path of the external water vapor into the corroded and aging adhesive between the light-emitting chip 20 and the phosphor 30, and improves the LED The airtightness of the packaging structure improves the reliability of the LED packaging structure, and can also effectively prevent the aging and deterioration of the adhesive between the fluorescent sheet 30 and the light-emitting chip 20, and solves the problem that the existing fluorescent sheet 30 and the light-emitting chip 20 are easy to The problem of falling off; the first surface 32 and the first longitudinal surface 341 Vertically connected, the second surface 33 and the second longitudinal surface 343 are connected vertically, that is, the first horizontal surface 342 and the second surface 33 are arranged in parallel, so that the first horizontal surface 342 directly blocks the penetration of external water vapor, making it more difficult for external water vapor to penetrate Between the light-emitting chip 20 and the fluorescent film 30, the LED packaging structure has better airtightness and better reliability.

In another embodiment of the present invention, referring to FIG. 6, FIG. 7 and FIG. 8, the phosphor 30 of the LED package structure is provided with a third surface 35 and a fourth surface 36 that are arranged oppositely. The fourth surface 36 faces the light-emitting chip 20. Specifically, the fourth surface 36 is bonded to the light-emitting chip 20; further, the steps include at least one second step 37 and at least one third step 38, and each second step 37 is close to The third surface 35 is provided, and each third step 38 is located close to the fourth surface 36. All the second steps 37 and all the third steps 38 together serve as protrusions 31; In the direction, the distance between each second step 37 and the center line of the phosphor sheet 30 is getting farther and farther, and the distance between each third step 38 and the center line of the phosphor sheet 30 is getting closer and closer. Specifically, after the water vapor penetrates in the direction toward the inside of the LED package structure along one or more of the second steps 37, it needs to be turned back and then penetrates along the third step 38 and then toward the inside of the LED package structure, so that the water vapor needs to penetrate. Bending and turning back, the penetration path is more tortuous, the water vapor penetration is more difficult, and the air tightness of the packaging structure can be greatly improved.

Further, referring to Figure 8, the number of the second steps 37 and the number of the third steps 38 can be plural, so the external water vapor needs to pass through the plural second steps 37 and the plural third steps 38, The penetration of external water vapor into the light-emitting chip 20 and the fluorescent sheet 30 requires multiple bends, that is, the penetration path is tortuous, so it is more difficult for the external water vapor to penetrate into the aging adhesive between the light-emitting chip 20 and the fluorescent sheet 30 , So that the LED packaging structure has better airtightness and reliability, can also greatly reduce the possibility of adhesive aging, and greatly extend the service life of the LED packaging structure.

In another embodiment of the present invention, referring to FIGS. 6 and 7, the number of the second steps 37 and the number of the third steps 38 of the LED packaging structure are both one; the second steps 37 include one. Including a third longitudinal surface 371, a second horizontal surface 372, and a fourth longitudinal surface 373 that sequentially connect outward from the inside of the phosphor 30; the third step 38 includes a second longitudinal surface that sequentially connects outward from the inside of the phosphor 30 Five longitudinal planes 381, a third horizontal plane 382, and a sixth longitudinal plane 383; the third surface 35 is perpendicular to the third longitudinal plane 371, the fourth longitudinal plane 373 is connected to the sixth longitudinal plane 383, and the fourth surface 36 is connected to the fifth longitudinal plane. The surfaces 381 are vertically connected, and the second horizontal surface 372, the fourth longitudinal surface 373, the third horizontal surface 382, and the sixth longitudinal surface 383 jointly surround the protrusion 31. Specifically, the periphery of the phosphor 30 is stepped, so that the external water vapor needs to penetrate along the second step 37 and the third step 38 in sequence, and need to pass through the third longitudinal plane 371, the second horizontal plane 372, and the fourth longitudinal plane in sequence. Surface 373, the sixth longitudinal surface 383, the third horizontal surface 382 and the fifth longitudinal surface 381, compared with the existing LED packaging structure, the external water vapor needs to take more paths of the second horizontal surface 372 and the third horizontal surface 382, which greatly increases The external moisture penetrates into the penetration path of the corroded and aged adhesive between the light-emitting chip 20 and the phosphor 30, improves the airtightness of the LED packaging structure, and solves the problem that the existing phosphor 30 and the light-emitting chip 20 are easy to fall off .

In another embodiment of the present invention, referring to FIG. 9, the phosphor 30 of the LED package structure is provided with a fifth surface 39 and a sixth surface 40 opposite to each other, and the sixth surface 40 faces the light-emitting chip. 20. Specifically, the sixth surface 40 is bonded to the light-emitting chip 20; further, the end surface of the protrusion 31 is a first inclined surface 41, and opposite ends of the first inclined surface 41 are respectively connected to the fifth surface 39 and the sixth surface 40 is connected and the protrusion 31 protrudes from the fifth surface 39 toward the sixth surface 40. Specifically, the side surfaces around the phosphor 30 are inclined surfaces, and the external water vapor needs to penetrate along the first inclined surface 41 in sequence. Compared with the existing LED packaging structure, the external water vapor travels the length of the path of the first inclined surface 41. It is greater than the thickness of the fluorescent sheet 30, which increases the penetration path of external water vapor into the corroded and aged adhesive between the light-emitting chip 20 and the fluorescent sheet 30, improves the airtightness of the LED packaging structure, and solves the problem of the existing fluorescent sheet. 30 and the light-emitting chip 20 are easy to fall off.

In another embodiment of the present invention, referring to FIG. 10, the phosphor 30 of the LED packaging structure is provided with a seventh surface 42 and an eighth surface 43 that are arranged oppositely, and the eighth surface 43 faces The light emitting chip 20, specifically, the eighth surface 43 is bonded to the light emitting chip 20; further, the end surface of the protrusion 31 is a second inclined surface 44, and one end of the second inclined surface 44 is connected to the middle of the side surface of the phosphor 30 , The other end of the second inclined surface 44 is connected to the eighth surface 43 and the protrusion 31 protrudes from the middle of the side surface of the phosphor 30 toward the eighth surface 43. Specifically, the external water vapor needs to infiltrate along the side surface of the phosphor 30 and then along the second inclined surface 44. Compared with the existing LED packaging structure, the path length of the external water vapor on the second inclined surface 44 is longer than The thickness corresponding to the second inclined surface 44 on the fluorescent sheet 30 can also increase the penetration path of external water vapor into the corroded and aged adhesive between the light-emitting chip 20 and the fluorescent sheet 30, thereby improving the gas of the LED package structure. The tightness solves the problem that the existing fluorescent sheet 30 and the light-emitting chip 20 are easy to fall off.

In another embodiment of the present invention, referring to FIGS. 3 and 6, the phosphor 30 of the LED package structure is provided to cover the light-emitting chip 20, and the protrusions 31 protrude from the periphery of the light-emitting chip 20 , The shielding glue 50 is located above the substrate 10. Specifically, the fluorescent sheet 30 completely covers the light-emitting chip 20, the fluorescent sheet 30 plays a role of shielding the light-emitting chip 20, can also increase the airtightness of the LED packaging structure, and improve the reliability of the LED packaging structure; , The protrusion 31 protrudes out of the periphery of the light-emitting chip 20, so after the external water vapor crosses the protrusion 31, it needs to bend and extend toward the light-emitting chip 20 in order to penetrate into the light-emitting chip 20 and the phosphor 30 to corrode and age the bond. This further increases the difficulty for external moisture to enter between the light-emitting chip 20 and the fluorescent sheet 30, and further increases the airtightness of the LED packaging structure, and improves the reliability of the LED packaging structure.

In another embodiment of the present invention, a method for manufacturing the above-mentioned LED packaging structure is provided, which specifically includes the following steps: providing a fluorescent substrate 60; cutting or etching the fluorescent substrate 60 to obtain a plurality of protrusions. 31 of the fluorescent sheet 30; after the light-emitting chip 20 is mounted on the substrate 10, the fluorescent sheet 30 is attached to the surface of the light-emitting chip 20 facing away from the substrate 10; the masking glue 50 is coated on the side surface around the light-emitting chip 20 , On the sides around the phosphor 30 and on the protrusions 31.

In another embodiment of the present invention, referring to FIG. 11, a method for manufacturing the above-mentioned LED packaging structure is provided by cutting or etching the fluorescent substrate 60 to obtain a plurality of fluorescent sheets 30. Specifically, It includes the following steps:

a) Cutting or etching is performed on one surface of the fluorescent substrate 60 to obtain a plurality of first processing grooves 61 intersecting horizontally and vertically at parallel intervals. Then, cutting or etching the middle of the groove bottom surface of the first processing groove 61 and making the fluorescent light The substrate 60 is cut, and at the same time, the width of the cutting or etching is smaller than the groove width of the first processing groove 61, so that the phosphor 30 with the first step 34 can be obtained; specifically, the phosphor substrate 60 is obtained by cutting or etching. The fluorescent sheet 30 is easy to process and manufacture.

In another embodiment of the present invention, referring to FIG. 11, a method for manufacturing the above-mentioned LED packaging structure is provided by cutting or etching the fluorescent substrate 60 to obtain a plurality of fluorescent sheets 30. Specifically, It includes the following steps:

b) After cutting or etching the two opposite surfaces of the fluorescent substrate 60, a plurality of second processing grooves 62 intersecting horizontally and vertically and arranged at intervals in parallel and a plurality of third processing grooves 63 intersecting horizontally and vertically at intervals are obtained respectively, And the second processing groove 62 and the third processing groove 63 are arranged in one-to-one correspondence. Then, the middle of the bottom surface of the second processing groove 62 is cut or etched and the fluorescent substrate 60 is cut. At the same time, the second processing groove The groove width of 62 and the groove width of the third processing groove 63 are both larger than the width of cutting or etching, so that the phosphor 30 having the second step 37 and the third step 38 can be obtained; specifically, the fluorescent substrate 60 adopts cutting or The etching processing method obtains the phosphor 30, which is easy to process and manufacture.

The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. Inside.

10: substrate

20: Light-emitting chip

30: Fluorescent film

31: raised

32: The first surface

33: second surface

50: Blocking glue

Claims (7)

An LED packaging structure includes: a substrate, a light-emitting chip, a fluorescent sheet, and a shielding glue. The light-emitting chip is mounted on the substrate, and the fluorescent sheet is located on the surface of the light-emitting chip facing away from the substrate. The chip and the fluorescent sheet are laminated, and the fluorescent sheet is provided with a protrusion, and the protrusion is arranged around the fluorescent sheet; the shielding glue is arranged on the sides of the light emitting chip and the periphery of the fluorescent sheet On the side surface of the luminescent chip and on the protrusion to realize the packaging and shielding of the light-emitting chip; wherein a step for forming the protrusion is provided around the fluorescent sheet, and the step includes outwards from the inside of the fluorescent sheet A longitudinal plane, a horizontal plane and another longitudinal plane that are successively connected. The LED packaging structure according to claim 1, wherein the phosphor has a first surface and a second surface opposite to each other, and the second surface faces the light-emitting chip; the steps include at least one first step, all The first steps are used together to form the protrusion, and in the direction from the first surface to the second surface, the distance between each of the first steps and the centerline of the phosphor becomes farther and farther or closer and closer. The LED packaging structure according to claim 2, wherein the number of the first steps is one, and the first steps include a first longitudinal surface, a first horizontal surface, and A second longitudinal surface; the first step is arranged close to the second surface, the first surface is perpendicularly connected to the first longitudinal surface, the second surface is perpendicularly connected to the second longitudinal surface, the first horizontal plane, the The second longitudinal surface and the second surface jointly surround the protrusion. The LED packaging structure according to claim 1, wherein the phosphor has a third surface and a fourth surface opposite to each other, and the fourth surface faces the light-emitting chip; The steps include at least one second step and at least one third step. Each of the second steps is set close to the third surface, each of the third steps is set close to the fourth surface, all the second steps and all the The third steps are commonly used to form the protrusion; in the direction from the third surface to the fourth surface, the distance between each of the second steps and the center line of the phosphor becomes farther and farther, each The distance between the third step and the center line of the phosphor is getting closer and closer. The LED packaging structure according to claim 4, wherein the number of the second steps and the number of the third steps are both one; the second step includes a third step that connects outward from the inside of the phosphor. A longitudinal plane, a second horizontal plane, and a fourth longitudinal plane; the third step includes a fifth longitudinal plane, a third horizontal plane, and a sixth longitudinal plane that sequentially connect outward from the inside of the phosphor; The third surface is connected perpendicularly to the third longitudinal surface, the fourth longitudinal surface is connected to the sixth longitudinal surface, the fourth surface is connected perpendicularly to the fifth longitudinal surface, the second horizontal surface, the fourth longitudinal surface, the The third horizontal plane and the sixth longitudinal plane jointly enclose the protrusion. The LED packaging structure according to any one of claims 1 to 5, wherein the phosphor covers the light-emitting chip, the protrusion protrudes around the light-emitting chip, and the shielding glue is located above the substrate And it is inter-engaged with the protrusion. A method for manufacturing the LED packaging structure according to any one of claims 1 to 6, which specifically includes the following steps: providing a fluorescent substrate; cutting or etching the fluorescent substrate to obtain a plurality of A protruding phosphor sheet, wherein a step for forming the protrusion is provided around the phosphor sheet, and the step includes a longitudinal surface and a horizontal plane which are successively connected from the inside of the phosphor sheet to the outside And the other longitudinal plane; After mounting a light-emitting chip on a substrate, take the light-emitting chip and glue it on the surface of the light-emitting chip that faces away from the substrate; and apply a masking glue on the side surface around the light-emitting chip. On the sides of the circumference and on the bump.

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