TWI725265B - 研磨裝置、及按壓研磨具之按壓墊 - Google Patents

研磨裝置、及按壓研磨具之按壓墊 Download PDF

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Publication number
TWI725265B
TWI725265B TW106143719A TW106143719A TWI725265B TW I725265 B TWI725265 B TW I725265B TW 106143719 A TW106143719 A TW 106143719A TW 106143719 A TW106143719 A TW 106143719A TW I725265 B TWI725265 B TW I725265B
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TW
Taiwan
Prior art keywords
pressing
polishing
elastic member
wafer
substrate
Prior art date
Application number
TW106143719A
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English (en)
Chinese (zh)
Other versions
TW201829122A (zh
Inventor
中西正行
小寺健治
宮澤康之
Original Assignee
日商荏原製作所股份有限公司
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Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201829122A publication Critical patent/TW201829122A/zh
Application granted granted Critical
Publication of TWI725265B publication Critical patent/TWI725265B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • B24B21/08—Pressure shoes; Pressure members, e.g. backing belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW106143719A 2016-12-15 2017-12-13 研磨裝置、及按壓研磨具之按壓墊 TWI725265B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016243295 2016-12-15
JP2016-243295 2016-12-15
JP2017-210426 2017-10-31
JP2017210426A JP6974117B2 (ja) 2016-12-15 2017-10-31 研磨装置、および研磨具を押圧する押圧パッド

Publications (2)

Publication Number Publication Date
TW201829122A TW201829122A (zh) 2018-08-16
TWI725265B true TWI725265B (zh) 2021-04-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106143719A TWI725265B (zh) 2016-12-15 2017-12-13 研磨裝置、及按壓研磨具之按壓墊

Country Status (3)

Country Link
JP (1) JP6974117B2 (ja)
KR (1) KR102243698B1 (ja)
TW (1) TWI725265B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7355670B2 (ja) * 2020-02-05 2023-10-03 株式会社荏原製作所 研磨ヘッドおよび研磨装置
CN111993205A (zh) * 2020-08-31 2020-11-27 孔彦 汽车碳纤维零件加工带有边缘毛刺处理的修整装置
JP2023130650A (ja) * 2022-03-08 2023-09-21 株式会社荏原製作所 基板研磨方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6558239B2 (en) * 2001-01-09 2003-05-06 Ebara Corporation Polishing apparatus
US20030139049A1 (en) * 2001-11-26 2003-07-24 Kenro Nakamura Method for manufacturing semiconductor device and polishing apparatus
JP2008042220A (ja) * 2007-09-25 2008-02-21 Ebara Corp 基板処理方法及び装置
JP2009018363A (ja) * 2007-07-11 2009-01-29 Ebara Corp 研磨装置
JP5254575B2 (ja) * 2007-07-11 2013-08-07 株式会社東芝 研磨装置および研磨方法
US8517804B2 (en) * 2007-10-16 2013-08-27 Nagel Maschinen- Und Werkzeugfabrik Gmbh Pressing device for cutting means and apparatus and method for finishing circumferential surfaces on cylindrical parts of a workpiece
TWI523092B (zh) * 2011-03-25 2016-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254575Y2 (ja) 1973-05-30 1977-12-10
US7744445B2 (en) * 2004-10-15 2010-06-29 Kabushiki Kaisha Toshiba Polishing apparatus and polishing method
WO2006112532A1 (en) * 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP5663295B2 (ja) * 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6558239B2 (en) * 2001-01-09 2003-05-06 Ebara Corporation Polishing apparatus
US20030139049A1 (en) * 2001-11-26 2003-07-24 Kenro Nakamura Method for manufacturing semiconductor device and polishing apparatus
JP2009018363A (ja) * 2007-07-11 2009-01-29 Ebara Corp 研磨装置
JP5254575B2 (ja) * 2007-07-11 2013-08-07 株式会社東芝 研磨装置および研磨方法
JP2008042220A (ja) * 2007-09-25 2008-02-21 Ebara Corp 基板処理方法及び装置
US8517804B2 (en) * 2007-10-16 2013-08-27 Nagel Maschinen- Und Werkzeugfabrik Gmbh Pressing device for cutting means and apparatus and method for finishing circumferential surfaces on cylindrical parts of a workpiece
TWI523092B (zh) * 2011-03-25 2016-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法

Also Published As

Publication number Publication date
TW201829122A (zh) 2018-08-16
KR20180069713A (ko) 2018-06-25
KR102243698B1 (ko) 2021-04-23
JP2018094715A (ja) 2018-06-21
JP6974117B2 (ja) 2021-12-01

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