TWI720884B - Anti-electromagnetic interference antenna - Google Patents

Anti-electromagnetic interference antenna Download PDF

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TWI720884B
TWI720884B TW109114549A TW109114549A TWI720884B TW I720884 B TWI720884 B TW I720884B TW 109114549 A TW109114549 A TW 109114549A TW 109114549 A TW109114549 A TW 109114549A TW I720884 B TWI720884 B TW I720884B
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antenna
circuit
substrate layer
layer
ground
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TW109114549A
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TW202143551A (en
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林怡成
君弘 王
林郃貹
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開酷科技股份有限公司
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Abstract

本發明揭露一種反電磁干擾天線，包含第一基板層、接地層、第一電路層、第二基板層、第二電路層、第三基板層、第三電路層、第四基板層以及第四電路層。接地層安裝於第一基板層的底面上且包含一接地迴路。接地迴路完全地覆蓋第一基板層底面，且由於接地迴路完全地覆蓋第一基板層底面，因此，天線輻射電路可避免電磁波從反電磁干擾天線的底面產生干擾。據此，電磁波可大部分地被隔離，以避免電磁干擾產生的雜訊影響安裝在電子裝置內的天線。The present invention discloses an anti-electromagnetic interference antenna, including a first substrate layer, a ground layer, a first circuit layer, a second substrate layer, a second circuit layer, a third substrate layer, a third circuit layer, a fourth substrate layer, and a fourth substrate layer. Circuit layer. The ground layer is installed on the bottom surface of the first substrate layer and includes a ground loop. The ground loop completely covers the bottom surface of the first substrate layer, and because the ground loop completely covers the bottom surface of the first substrate layer, the antenna radiation circuit can prevent electromagnetic waves from generating interference from the bottom surface of the anti-electromagnetic interference antenna. Accordingly, electromagnetic waves can be largely isolated to prevent noise generated by electromagnetic interference from affecting the antenna installed in the electronic device.

Description

反電磁干擾天線Anti-electromagnetic interference antenna

本發明係有關於一種天線，特別是關於一種反電磁干擾(anti-EMI)天線。The present invention relates to an antenna, in particular to an anti-EMI (anti-EMI) antenna.

電子裝置通常包含無線通訊功能，因此，電子裝置係配備有天線或無線傳輸器，以支援無線通訊功能。Electronic devices usually include wireless communication functions. Therefore, electronic devices are equipped with antennas or wireless transmitters to support wireless communication functions.

然而，電子裝置更包含複數個積體電路(ICs)，當操作電子裝置時，積體電路可能會產生電磁波。由積體電路產生的電磁波可能產生雜訊，進一步干擾安裝在電子裝置內的天線。因此，安裝在電子裝置內的天線仍有需要改進的地方。However, electronic devices further include a plurality of integrated circuits (ICs). When the electronic devices are operated, the integrated circuits may generate electromagnetic waves. The electromagnetic waves generated by the integrated circuit may generate noise, which further interferes with the antenna installed in the electronic device. Therefore, the antenna installed in the electronic device still needs improvement.

鑑於上述問題，本發明之目的在於提供一種反電磁干擾(anti-EMI)天線。本發明揭露之反電磁干擾天線可避免受到電磁干擾。反電磁干擾天線包含第一基板層、接地層、第一電路層、第二基板層、第二電路層、第三基板層、第三電路層、第四基板層以及第四電路層。In view of the above problems, the object of the present invention is to provide an anti-EMI (anti-EMI) antenna. The anti-electromagnetic interference antenna disclosed in the present invention can avoid electromagnetic interference. The anti-electromagnetic interference antenna includes a first substrate layer, a ground layer, a first circuit layer, a second substrate layer, a second circuit layer, a third substrate layer, a third circuit layer, a fourth substrate layer, and a fourth circuit layer.

接地層安裝於第一基板層之底面上，且包含一接地迴路；其中接地迴路完全地覆蓋第一基板層之底面。第一電路層包含一天線訊號電路以及複數個第一接地迴路，第一接地迴路安裝於天線訊號電路周圍。第一電路層安裝於第一基板層頂面以及第二基板層底面之間。The ground layer is installed on the bottom surface of the first substrate layer and includes a ground loop; wherein the ground loop completely covers the bottom surface of the first substrate layer. The first circuit layer includes an antenna signal circuit and a plurality of first ground loops. The first ground loops are installed around the antenna signal circuit. The first circuit layer is installed between the top surface of the first substrate layer and the bottom surface of the second substrate layer.

第二電路層包含第一天線電路、第二天線電路以及複數個第二接地迴路，第二接地迴路安裝於第一天線電路及第二天線電路周圍。The second circuit layer includes a first antenna circuit, a second antenna circuit, and a plurality of second ground loops. The second ground loops are installed around the first antenna circuit and the second antenna circuit.

第三基板層包含第一天線穿孔、第二天線穿孔以及複數個接地穿孔。第二電路層安裝於第二基板層之頂面以及第三基板層之底面之間。接地穿孔安裝於第一天線穿孔以及第二天線穿孔周圍。第一天線電路以及第二天線電路透過第二基板層電性連接天線訊號電路。第二接地迴路透過第二基板層電性連接第一接地迴路。The third substrate layer includes a first antenna through hole, a second antenna through hole, and a plurality of ground through holes. The second circuit layer is installed between the top surface of the second substrate layer and the bottom surface of the third substrate layer. The ground hole is installed around the first antenna hole and the second antenna hole. The first antenna circuit and the second antenna circuit are electrically connected to the antenna signal circuit through the second substrate layer. The second ground loop is electrically connected to the first ground loop through the second substrate layer.

第三電路層包含第三天線電路、第四天線電路以及複數個第三接地迴路。第三電路層安裝於第三基板層之頂面以及第四基板層之底面之間。The third circuit layer includes a third antenna circuit, a fourth antenna circuit, and a plurality of third ground loops. The third circuit layer is installed between the top surface of the third substrate layer and the bottom surface of the fourth substrate layer.

第一天線穿孔的兩端分別電性連接第一天線電路以及第三天線電路。第二天線穿孔兩端分別電性連接第二天線電路以及第四天線電路。Two ends of the first antenna hole are electrically connected to the first antenna circuit and the third antenna circuit, respectively. Both ends of the second antenna hole are electrically connected to the second antenna circuit and the fourth antenna circuit.

第四電路層安裝於第四基板層之頂面上，且包含一天線輻射電路以及複數個第四接地迴路。第四接地迴路安裝於該天線輻射電路周圍。天線輻射電路透過第四基板層電性連接第三天線電路以及第四天線電路。第四接地迴路透過第四基板層電性連接第三接地迴路。The fourth circuit layer is installed on the top surface of the fourth substrate layer and includes an antenna radiation circuit and a plurality of fourth ground loops. The fourth ground loop is installed around the antenna radiation circuit. The antenna radiation circuit is electrically connected to the third antenna circuit and the fourth antenna circuit through the fourth substrate layer. The fourth ground loop is electrically connected to the third ground loop through the fourth substrate layer.

由於接地迴路完全地覆蓋第一基板層底面，因此，天線輻射電路可避免電磁波從反電磁干擾天線的底面產生干擾。再者，由於第一接地迴路、第二接地迴路、接地穿孔以及第四接地迴路分別安裝於天線訊號電路、二第二天線電路、第一天線穿孔、第二天線穿孔以及天線輻射電路周圍，因此可避免電磁干擾。Since the ground loop completely covers the bottom surface of the first substrate layer, the antenna radiation circuit can prevent electromagnetic waves from generating interference from the bottom surface of the anti-electromagnetic interference antenna. Furthermore, since the first ground loop, the second ground loop, the ground through hole, and the fourth ground loop are installed in the antenna signal circuit, the two second antenna circuits, the first antenna through hole, the second antenna through hole, and the antenna radiation circuit, respectively Around, so electromagnetic interference can be avoided.

亦即，接地迴路、第一接地迴路、第二接地迴路、接地穿孔以及第四接地迴路形成一隔離牆。隔離牆包含一空腔，用於容置天線訊號電路、第一天線電路、第二天線電路、第一天線穿孔、第二天線穿孔以及天線輻射電路，因此，電磁波可大部分地被隔絕，以避免電磁干擾產生的雜訊影響。That is, the ground loop, the first ground loop, the second ground loop, the ground perforation, and the fourth ground loop form an isolation wall. The isolation wall contains a cavity for accommodating the antenna signal circuit, the first antenna circuit, the second antenna circuit, the first antenna perforation, the second antenna perforation, and the antenna radiation circuit. Therefore, electromagnetic waves can be mostly Isolation to avoid the influence of noise caused by electromagnetic interference.

請參考圖1至圖3，其係為本發明反電磁干擾天線的示意圖。反電磁干擾天線包含接地層10、第一基板層11、第一電路層12、第二基板層21、第二電路層22、第三基板層31、第三電路層32、第四基板層41以及第四電路層42。Please refer to FIGS. 1 to 3, which are schematic diagrams of the anti-electromagnetic interference antenna of the present invention. The anti-electromagnetic interference antenna includes a ground layer 10, a first substrate layer 11, a first circuit layer 12, a second substrate layer 21, a second circuit layer 22, a third substrate layer 31, a third circuit layer 32, and a fourth substrate layer 41 And the fourth circuit layer 42.

接地層10安裝於第一基板層11的底面上，且包含接地迴路101。接地迴路101完全地覆蓋第一基板層11的底面。第一電路層12安裝於第一基板層11頂面以及第二基板層21底面之間。第一電路層12包含天線訊號電路121以及複數個第一接地迴路122。第一接地迴路122安裝於天線訊號電路121周圍。The ground layer 10 is installed on the bottom surface of the first substrate layer 11 and includes a ground loop 101. The ground loop 101 completely covers the bottom surface of the first substrate layer 11. The first circuit layer 12 is installed between the top surface of the first substrate layer 11 and the bottom surface of the second substrate layer 21. The first circuit layer 12 includes an antenna signal circuit 121 and a plurality of first ground loops 122. The first ground loop 122 is installed around the antenna signal circuit 121.

第二電路層22安裝於第二基板層21頂面以及第三基板層31底面之間。第二電路層22包含第一天線電路221、第二天線電路222以及複數個第二接地迴路223。第二接地迴路223安裝於第一天線電路221以及第二天線電路222周圍。The second circuit layer 22 is installed between the top surface of the second substrate layer 21 and the bottom surface of the third substrate layer 31. The second circuit layer 22 includes a first antenna circuit 221, a second antenna circuit 222 and a plurality of second ground loops 223. The second ground loop 223 is installed around the first antenna circuit 221 and the second antenna circuit 222.

第三基板層31包含第一天線穿孔311、第二天線穿孔312以及複數個接地穿孔313。接地穿孔313安裝於第一天線穿孔311以及第二天線穿孔312周圍。第一天線電路221以及第二天線電路222透過第二基板層21電性連接天線訊號電路121。第二接地迴路223透過第二基板層21電性連接第一接地迴路122。The third substrate layer 31 includes a first antenna through hole 311, a second antenna through hole 312 and a plurality of ground through holes 313. The ground through hole 313 is installed around the first antenna through hole 311 and the second antenna through hole 312. The first antenna circuit 221 and the second antenna circuit 222 are electrically connected to the antenna signal circuit 121 through the second substrate layer 21. The second ground loop 223 is electrically connected to the first ground loop 122 through the second substrate layer 21.

第三電路層32安裝於第三基板層31頂面以及第四基板層41底面之間。第三電路層32包含第三天線電路321、第四天線電路322以及複數個第三接地迴路323。The third circuit layer 32 is installed between the top surface of the third substrate layer 31 and the bottom surface of the fourth substrate layer 41. The third circuit layer 32 includes a third antenna circuit 321, a fourth antenna circuit 322 and a plurality of third ground loops 323.

第一天線穿孔311兩端分別電性連接第一天線電路221以及第三天線電路321。第二天線穿孔312兩端分別電性連接第二天線電路222以及第四天線電路322。Two ends of the first antenna through hole 311 are electrically connected to the first antenna circuit 221 and the third antenna circuit 321 respectively. Two ends of the second antenna through hole 312 are electrically connected to the second antenna circuit 222 and the fourth antenna circuit 322 respectively.

第四電路層42安裝於第四基板層41的頂面上，並包含天線輻射電路421以及複數個第四接地迴路422。第四接地迴路422安裝於天線輻射電路421周圍。天線輻射電路421透過第四基板層41電性連接第三天線電路321以及第四天線電路322。第四接地迴路422透過第四基板層41電性連接第三接地迴路323。The fourth circuit layer 42 is mounted on the top surface of the fourth substrate layer 41 and includes an antenna radiation circuit 421 and a plurality of fourth ground loops 422. The fourth ground loop 422 is installed around the antenna radiation circuit 421. The antenna radiation circuit 421 is electrically connected to the third antenna circuit 321 and the fourth antenna circuit 322 through the fourth substrate layer 41. The fourth ground loop 422 is electrically connected to the third ground loop 323 through the fourth substrate layer 41.

接地迴路101、第一接地迴路122、第二接地迴路223、接地穿孔313以及第四接地迴路422形成一隔離牆。隔離牆包含一空腔，以容置天線訊號電路121、第一天線電路211、第二天線電路212、第一天線穿孔311、第二天線穿孔312以及天線輻射電路421。當反電磁干擾天線安裝於電子裝置內，由電子裝置的積體電路(ICs)產生的電磁波可大部分被隔絕，以避免由電磁干擾產生的雜訊。The ground loop 101, the first ground loop 122, the second ground loop 223, the ground through hole 313, and the fourth ground loop 422 form an isolation wall. The isolation wall includes a cavity to accommodate the antenna signal circuit 121, the first antenna circuit 211, the second antenna circuit 212, the first antenna through hole 311, the second antenna through hole 312, and the antenna radiation circuit 421. When the anti-electromagnetic interference antenna is installed in an electronic device, the electromagnetic waves generated by the integrated circuits (ICs) of the electronic device can be mostly isolated to avoid noise caused by electromagnetic interference.

再者，反電磁干擾天線更包含第五基板層51以及第五電路層52。第四電路層42安裝於第四基板層41頂面以及第五基板層51底面之間。第五電路層52安裝於第五基板層51的頂面上，並包含複數個第五接地迴路521。第五接地迴路521透過第五基板層51電性連接第四接地迴路422。Furthermore, the anti-electromagnetic interference antenna further includes a fifth substrate layer 51 and a fifth circuit layer 52. The fourth circuit layer 42 is installed between the top surface of the fourth substrate layer 41 and the bottom surface of the fifth substrate layer 51. The fifth circuit layer 52 is mounted on the top surface of the fifth substrate layer 51 and includes a plurality of fifth ground loops 521. The fifth ground loop 521 is electrically connected to the fourth ground loop 422 through the fifth substrate layer 51.

由於反電磁干擾天線更包含第五基板層51以及第五電路層52，因此第五接地迴路521可高於天線輻射電路421。因此，隔離牆的邊線可高於天線輻射電路421，以提升反電磁干擾天線的效能。Since the anti-electromagnetic interference antenna further includes the fifth substrate layer 51 and the fifth circuit layer 52, the fifth ground loop 521 can be higher than the antenna radiation circuit 421. Therefore, the side line of the isolation wall can be higher than the antenna radiation circuit 421 to improve the effectiveness of the anti-electromagnetic interference antenna.

此外，貫穿孔60藉由貫穿第五基板層51以及第五電路層52形成，且天線輻射電路421可經由貫穿孔60暴露出。In addition, the through hole 60 is formed by penetrating the fifth substrate layer 51 and the fifth circuit layer 52, and the antenna radiation circuit 421 can be exposed through the through hole 60.

第二基板層21包含二第一連接穿孔211以及二第二連接穿孔222。第一天線電路221透過第二基板層21的二第一連接穿孔211電性連接天線訊號電路121。第二天線電路222透過第二基板層21的二第二連接穿孔212電性連接天線訊號電路121。The second substrate layer 21 includes two first connection through holes 211 and two second connection through holes 222. The first antenna circuit 221 is electrically connected to the antenna signal circuit 121 through the two first connection through holes 211 of the second substrate layer 21. The second antenna circuit 222 is electrically connected to the antenna signal circuit 121 through the two second connection through holes 212 of the second substrate layer 21.

第四基板層41包含二第三連接穿孔411以及二第四連接穿孔412。第三天線電路321透過第四基板層41的二第三連接穿孔411電性連接天線輻射電路421。第四天線電路322透過第四基板層41的二第四連接穿孔412電性連接天線輻射電路421。The fourth substrate layer 41 includes two third connection through holes 411 and two fourth connection through holes 412. The third antenna circuit 321 is electrically connected to the antenna radiation circuit 421 through the two third connection through holes 411 of the fourth substrate layer 41. The fourth antenna circuit 322 is electrically connected to the antenna radiation circuit 421 through the two fourth connection through holes 412 of the fourth substrate layer 41.

請參閱圖2，第四電路層42的天線輻射電路421係為矩形微帶天線，且矩形微帶天線包含二連接部4211。二連接部4211分別從矩形微帶天線的兩長邊向外延伸。Please refer to FIG. 2, the antenna radiation circuit 421 of the fourth circuit layer 42 is a rectangular microstrip antenna, and the rectangular microstrip antenna includes two connecting portions 4211. The two connecting portions 4211 respectively extend outward from the two long sides of the rectangular microstrip antenna.

其中一連接部4211透過第四基板層41的二第三連接穿孔411電性連接第三天線電路321，另一連接部4211透過第四基板層41的二第四連接穿孔412電性連接第四天線電路322。One of the connection portions 4211 is electrically connected to the third antenna circuit 321 through the two third connection through holes 411 of the fourth substrate layer 41, and the other connection portion 4211 is electrically connected to the fourth antenna circuit 321 through the two fourth connection holes 412 of the fourth substrate layer 41 Antenna circuit 322.

再者，二連接部4211分別從矩形微帶天線的兩長邊中間位置向外延伸。Furthermore, the two connecting portions 4211 respectively extend outward from the middle positions of the two long sides of the rectangular microstrip antenna.

天線輻射電路421係為矩形微帶天線，其具有二連接部4211，分別從矩形微帶天線的兩長邊中間位置向外延伸，因此，反電磁干擾天線具有電感電容平衡饋入設計(LC-balanced feeding design)，以增強天線效率及頻寬。The antenna radiation circuit 421 is a rectangular microstrip antenna with two connecting parts 4211 extending outward from the middle of the two long sides of the rectangular microstrip antenna. Therefore, the anti-electromagnetic interference antenna has an inductance-capacitance balanced feed design (LC- balanced feeding design) to enhance antenna efficiency and bandwidth.

綜上所述，由於隔離牆包含空腔，以便於容置天線訊號電路121、第一天線電路211、第二天線電路212、第一天線穿孔311、第二天線穿孔312以及天線輻射電路421，因此，反電磁干擾天線係為背腔天線(cavity backed antenna)，亦即，反電磁干擾天線具有背腔設計，以加強其天線增益。In summary, since the isolation wall contains a cavity, it is convenient to accommodate the antenna signal circuit 121, the first antenna circuit 211, the second antenna circuit 212, the first antenna through hole 311, the second antenna through hole 312, and the antenna The radiation circuit 421, therefore, the anti-electromagnetic interference antenna is a cavity backed antenna, that is, the anti-electromagnetic interference antenna has a cavity backed design to enhance its antenna gain.

此外，接地迴路101包含複數個連接孔。天線訊號電路121安裝於靠近反電磁干擾天線的底部，且天線訊號電路121可透過連接孔電性連接外部印刷電路板(printed circuit board；PCB)，以便於傳輸訊號。因此，天線訊號電路121可電性連接印刷電路板，並與接地迴路101隔離，亦即反電磁干擾天線係為具有縮小尺寸的底部饋入(bottom-fed)設計。In addition, the ground loop 101 includes a plurality of connection holes. The antenna signal circuit 121 is installed near the bottom of the anti-electromagnetic interference antenna, and the antenna signal circuit 121 can be electrically connected to an external printed circuit board (PCB) through the connection hole to facilitate signal transmission. Therefore, the antenna signal circuit 121 can be electrically connected to the printed circuit board and isolated from the ground loop 101, that is, the anti-electromagnetic interference antenna is a bottom-fed design with a reduced size.

以上所述僅是本發明的較佳實施例而已，並非對本發明做任何形式上的限制，雖然本發明已以較佳實施例揭露如上，然而並非用以限定本發明，任何熟悉本專業的技術人員，在不脫離本發明技術方案的範圍內，當可利用上述揭示的技術內容做出些許更動或修飾為等同變化的等效實施例，但凡是未脫離本發明技術方案的內容，依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾，均仍屬於本發明技術方案的範圍內。The above are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above in preferred embodiments, it is not intended to limit the present invention. Anyone familiar with the professional technology Personnel, without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, but any content that does not deviate from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

10:接地層 101:接地迴路 11:第一基板層 12:第一電路層 121:天線訊號電路 122:第一接地迴路 21:第二基板層 211:第一天線電路 212:第二天線電路 22:第二電路層 221:第一天線電路 222:第二天線電路 223:第二接地迴路 31:第三基板層 311:第一天線穿孔 312:第二天線穿孔 313:接地穿孔 32:第三電路層 321:第三天線電路 322:第四天線電路 323:第三接地迴路 41:第四基板層 411:第三連接穿孔 412:第四連接穿孔 42:第四電路層 421:天線輻射電路 4211:連接部 422:第四接地迴路 51:第五基板層 52:第五電路層 521:第五接地迴路 60:貫穿孔10: Ground plane 101: Ground loop 11: The first substrate layer 12: The first circuit layer 121: Antenna signal circuit 122: first ground loop 21: The second substrate layer 211: The first antenna circuit 212: second antenna circuit 22: The second circuit layer 221: first antenna circuit 222: second antenna circuit 223: second ground loop 31: The third substrate layer 311: First antenna perforation 312: second antenna perforation 313: Ground Piercing 32: third circuit layer 321: third antenna circuit 322: fourth antenna circuit 323: third ground loop 41: The fourth substrate layer 411: third connection perforation 412: fourth connection perforation 42: fourth circuit layer 421: Antenna Radiation Circuit 4211: connecting part 422: The fourth ground loop 51: fifth substrate layer 52: Fifth circuit layer 521: Fifth Ground Loop 60: Through hole

圖1係為本發明反電磁干擾天線的示意圖； 圖2係為本發明反電磁干擾天線的上視圖；以及 圖3係為本發明反電磁干擾天線的剖面圖。 Figure 1 is a schematic diagram of the anti-electromagnetic interference antenna of the present invention; Figure 2 is a top view of the anti-electromagnetic interference antenna of the present invention; and Figure 3 is a cross-sectional view of the anti-electromagnetic interference antenna of the present invention.

223:第二接地迴路 223: second ground loop

311:第一天線穿孔 311: First antenna perforation

312:第二天線穿孔 312: second antenna perforation

313:接地穿孔 313: Ground Piercing

321:第三天線電路 321: third antenna circuit

322:第四天線電路 322: fourth antenna circuit

323:第三接地迴路 323: third ground loop

421:天線輻射電路 421: Antenna Radiation Circuit

4211:連接部 4211: connecting part

521:第五接地迴路 521: Fifth Ground Loop

60:貫穿孔 60: Through hole

Claims (8)

一種反電磁干擾天線，包含： 一第一基板層； 一接地層，安裝於該第一基板層之一底面上，且包含一接地迴路；其中該接地迴路完全地覆蓋該第一基板層之該底面； 一第一電路層，包含一天線訊號電路以及複數個第一接地迴路；其中該第一接地迴路安裝於該天線訊號電路周圍； 一第二基板層；其中該第一電路層安裝於該第一基板層之一頂面以及該第二基板層之一底面之間； 一第二電路層，包含一第一天線電路、一第二天線電路以及複數個第二接地迴路；其中該第二接地迴路安裝於該第一天線電路及該第二天線電路周圍； 一第三基板層，包含一第一天線穿孔、一第二天線穿孔以及複數個接地穿孔； 其中該第二電路層安裝於該第二基板層之一頂面以及該第三基板層之一底面之間； 其中該接地穿孔安裝於該第一天線穿孔以及該第二天線穿孔周圍； 其中該第一天線電路以及該第二天線電路透過該第二基板層電性連接該天線訊號電路； 其中該第二接地迴路透過該第二基板層電性連接該第一接地迴路； 一第三電路層，包含一第三天線電路、一第四天線電路以及複數個第三接地迴路； 一第四基板層；其中該第三電路層安裝於該第三基板層之一頂面以及該第四基板層之一底面之間； 其中該第一天線穿孔的兩端分別電性連接該第一天線電路以及該第三天線電路； 其中該第二天線穿孔兩端分別電性連接該第二天線電路以及該第四天線電路； 一第四電路層，安裝於該第四基板層之一頂面上，且包含一天線輻射電路以及複數個第四接地迴路； 其中該第四接地迴路安裝於該天線輻射電路周圍； 其中該天線輻射電路透過該第四基板層電性連接該第三天線電路以及該第四天線電路； 其中該第四接地迴路透過該第四基板層電性連接該第三接地迴路。 An anti-electromagnetic interference antenna, including: A first substrate layer; A ground layer installed on a bottom surface of the first substrate layer and including a ground loop; wherein the ground loop completely covers the bottom surface of the first substrate layer; A first circuit layer, including an antenna signal circuit and a plurality of first ground loops; wherein the first ground loop is installed around the antenna signal circuit; A second substrate layer; wherein the first circuit layer is mounted between a top surface of the first substrate layer and a bottom surface of the second substrate layer; A second circuit layer, including a first antenna circuit, a second antenna circuit, and a plurality of second ground loops; wherein the second ground loop is installed around the first antenna circuit and the second antenna circuit ； A third substrate layer, including a first antenna through hole, a second antenna through hole, and a plurality of ground through holes; The second circuit layer is installed between a top surface of the second substrate layer and a bottom surface of the third substrate layer; The ground through hole is installed around the first antenna through hole and the second antenna through hole; The first antenna circuit and the second antenna circuit are electrically connected to the antenna signal circuit through the second substrate layer; The second ground loop is electrically connected to the first ground loop through the second substrate layer; A third circuit layer, including a third antenna circuit, a fourth antenna circuit, and a plurality of third ground loops; A fourth substrate layer; wherein the third circuit layer is installed between a top surface of the third substrate layer and a bottom surface of the fourth substrate layer; Two ends of the first antenna perforation are respectively electrically connected to the first antenna circuit and the third antenna circuit; Two ends of the second antenna hole are electrically connected to the second antenna circuit and the fourth antenna circuit; A fourth circuit layer, mounted on a top surface of the fourth substrate layer, and including an antenna radiation circuit and a plurality of fourth ground loops; The fourth ground loop is installed around the antenna radiation circuit; The antenna radiation circuit is electrically connected to the third antenna circuit and the fourth antenna circuit through the fourth substrate layer; The fourth ground loop is electrically connected to the third ground loop through the fourth substrate layer. 如請求項1所述之反電磁干擾天線，更包含： 一第五基板層；其中該第四電路層安裝於該第四基板層之該頂面以及該第五基板層之一底面之間；以及 一第五電路層，安裝於該第五基板層之一頂面上，且包含複數個第五接地迴路； 其中該第五接地迴路透過該第五基板層電性連接該第四接地迴路。 The anti-electromagnetic interference antenna described in claim 1, further including: A fifth substrate layer; wherein the fourth circuit layer is mounted between the top surface of the fourth substrate layer and a bottom surface of the fifth substrate layer; and A fifth circuit layer, mounted on a top surface of the fifth substrate layer, and including a plurality of fifth ground loops; The fifth ground loop is electrically connected to the fourth ground loop through the fifth substrate layer. 如請求項1所述之反電磁干擾天線，其中該第二基板層包含： 二第一連接穿孔；其中該第一天線電路透過該第二基板層之該二第一連接穿孔電性連接該天線訊號電路； 二第二連接穿孔；其中該第二天線電路透過該第二基板層之該二第二連接穿孔電性連接該天線訊號電路。 The anti-electromagnetic interference antenna according to claim 1, wherein the second substrate layer includes: Two first connection through holes; wherein the first antenna circuit is electrically connected to the antenna signal circuit through the two first connection through holes of the second substrate layer; Two second connection through holes; wherein the second antenna circuit is electrically connected to the antenna signal circuit through the two second connection through holes of the second substrate layer. 如請求項1所述之反電磁干擾天線，其中該第四基板層包含： 二第三連接穿孔；其中該第三天線電路透過該第四基板層之該二第三連接穿孔電性連接該天線輻射電路；以及 二第四連接穿孔；其中該第四天線電路透過該第四基板層之該二第四連接穿孔電性連接該天線輻射電路。 The anti-electromagnetic interference antenna according to claim 1, wherein the fourth substrate layer includes: Two third connection through holes; wherein the third antenna circuit is electrically connected to the antenna radiation circuit through the two third connection through holes of the fourth substrate layer; and Two fourth connection through holes; wherein the fourth antenna circuit is electrically connected to the antenna radiation circuit through the two fourth connection through holes of the fourth substrate layer. 如請求項2所述之反電磁干擾天線，其中該第四基板層包含： 二第三連接穿孔；其中該第三天線電路透過該第四基板層之該二第三連接穿孔電性連接該天線輻射電路； 二第四連接穿孔；其中該第四天線電路透過該第四基板層之該二第四連接穿孔電性連接該天線輻射電路。 The anti-electromagnetic interference antenna according to claim 2, wherein the fourth substrate layer includes: Two third connection through holes; wherein the third antenna circuit is electrically connected to the antenna radiation circuit through the second and third connection through holes of the fourth substrate layer; Two fourth connection through holes; wherein the fourth antenna circuit is electrically connected to the antenna radiation circuit through the two fourth connection through holes of the fourth substrate layer. 如請求項4所述之反電磁干擾天線，更包含一貫穿孔；其中該貫穿孔藉由貫穿該第五基板層以及該第五電路層形成，以暴露該天線輻射電路。The anti-electromagnetic interference antenna according to claim 4, further comprising a through hole; wherein the through hole is formed by penetrating the fifth substrate layer and the fifth circuit layer to expose the antenna radiation circuit. 如請求項6所述之反電磁干擾天線，其中該第四電路層之該天線輻射電路係為一矩形微帶天線，且該矩形微帶天線包含二連接部； 其中該二連接部分別分別從該矩形微帶天線之二長邊向外延伸； 其中之一該連接部透過該第四基板層之該二第三連接穿孔電性連接該第三天線電路，且另一該連接部透過該第四基板層之該二第四連接穿孔電性連接該第四天線電路。 The anti-electromagnetic interference antenna according to claim 6, wherein the antenna radiation circuit of the fourth circuit layer is a rectangular microstrip antenna, and the rectangular microstrip antenna includes two connecting parts; The two connecting parts respectively extend outward from the two long sides of the rectangular microstrip antenna; One of the connection portions is electrically connected to the third antenna circuit through the two third connection through holes of the fourth substrate layer, and the other connection portion is electrically connected through the two fourth connection through holes of the fourth substrate layer The fourth antenna circuit. 如請求項7所述之反電磁干擾天線，其中該二連接部分別從該矩形微帶天線之該二長邊的中間位置向外延伸。The anti-electromagnetic interference antenna according to claim 7, wherein the two connecting portions respectively extend outward from the middle position of the two long sides of the rectangular microstrip antenna.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140035097A1 (en) * 2012-08-01 2014-02-06 Advanced Semiconductor Engineering, Inc. Semiconductor package having an antenna and manufacturing method thereof
US20150070228A1 (en) * 2013-09-11 2015-03-12 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
US20160049723A1 (en) * 2014-08-13 2016-02-18 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
TW201830643A (en) * 2016-12-13 2018-08-16 台灣積體電路製造股份有限公司 Chip package
TW201943147A (en) * 2018-03-29 2019-11-01 聯發科技股份有限公司 Antenna structure and antenna-in-package
TW202006916A (en) * 2018-07-17 2020-02-01 南韓商三星電子股份有限公司 Antenna module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140035097A1 (en) * 2012-08-01 2014-02-06 Advanced Semiconductor Engineering, Inc. Semiconductor package having an antenna and manufacturing method thereof
US20150070228A1 (en) * 2013-09-11 2015-03-12 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
US20160049723A1 (en) * 2014-08-13 2016-02-18 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
TW201830643A (en) * 2016-12-13 2018-08-16 台灣積體電路製造股份有限公司 Chip package
TW201943147A (en) * 2018-03-29 2019-11-01 聯發科技股份有限公司 Antenna structure and antenna-in-package
TW202006916A (en) * 2018-07-17 2020-02-01 南韓商三星電子股份有限公司 Antenna module

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