TWI741580B - Antenna package structure - Google Patents

Abstract

The present invention discloses an antenna packaging structure, which includes a top substrate, an antenna chip, a bottom substrate, and a plurality of antenna transmission lines. The top substrate contains the antenna. The bottom substrate contains the circuit. The antenna chip is mounted on the bottom substrate, and is electrically connected to the antenna on the top substrate through the circuit of the bottom substrate and the antenna transmission line. Since the antenna chip is directly electrically connected to the processor through the circuit, there is no need to electrically connect multiple transmission lines between the antenna and the circuit. Furthermore, because the antenna transmission line only needs to transmit a simple antenna signal between the antenna and the antenna chip, the number of antenna transmission lines can be less than the number of transmission lines. Accordingly, the overall size of the antenna packaging structure can be reduced accordingly.

Description

Antenna package structure

The present invention relates to a packaging structure, in particular to an antenna packaging structure.

An electronic device usually includes a wireless communication function. Therefore, the electronic device is equipped with an antenna module to support the wireless communication function.

The antenna module includes an antenna, an antenna integrated circuit, and an antenna processor. The antenna integrated circuit can be installed on the antenna to control the antenna to transmit and receive wireless signals. The antenna needs to be installed on a printed circuit board (PCB) to be electrically connected to the antenna processor. Therefore, the antenna processor can communicate with the antenna integrated circuit to perform wireless communication functions. For example, the antenna integrated circuit includes an antenna transmitter such as a radio frequency integrated circuit (RFIC), and the antenna processor includes a digital processor.

Since the antenna processor needs to communicate with the antenna integrated circuit, the antenna needs to be electrically connected to the printed circuit board through a plurality of communication lines to transmit communication signals. Therefore, the antenna processor can be electrically connected to the antenna integrated circuit through the printed circuit board, the communication line and the antenna.

Furthermore, since the antenna is electrically connected to the PCB through the communication line, the antenna and the PCB need to include their respective connection areas to connect to the communication line. Therefore, the size of the antenna corresponds to the number of communication lines. The larger the number of communication lines, the larger the size of the corresponding antenna. For the same reason, the larger the number of communication lines, the larger the corresponding PCB size.

However, as the wireless communication function of the electronic device is becoming more and more complex, the more the number of communication lines increases, so that the total size of the antenna module cannot be reduced in response to the increase in the number of communication lines. Accordingly, how to provide an antenna module to solve the above-mentioned problems has become an urgent research topic.

In view of the above problems, the object of the present invention is to provide an antenna packaging structure. The antenna packaging structure disclosed in the present invention can reduce the overall size of the antenna packaging structure. The antenna packaging structure includes a top substrate, an antenna chip, a bottom substrate, and a plurality of antenna transmission lines.

The top substrate contains the antenna. The bottom substrate includes a circuit and is arranged at a position below the top substrate.

The antenna chip is mounted on the top surface of the bottom substrate, and is electrically connected to the antenna of the top substrate through the circuit of the bottom substrate and the antenna transmission line.

Since the antenna chip is directly mounted on the bottom substrate, the antenna chip can be electrically connected to the processor through the circuit of the bottom substrate. For example, the bottom substrate can be a printed circuit board, and the processor can also be mounted on the bottom substrate. Therefore, there is no need to electrically connect multiple transmission lines between the antenna of the top substrate and the circuit of the bottom substrate. The antenna chip can pass through the bottom substrate. The circuit is directly electrically connected to the processor.

Furthermore, since the antenna chip still needs to be electrically connected to the antenna of the top substrate, a plurality of antenna transmission lines still need to be electrically connected between the antenna of the top substrate and the circuit of the bottom substrate. However, since the antenna chip does not need to communicate with the antenna to perform complex functions, the antenna transmission line only needs to transmit simple antenna signals between the antenna and the antenna chip.

Therefore, the number of antenna transmission lines can be less than the number of transmission lines used to communicate with the antenna chip and the processor, so that the overall size of the antenna package structure can be reduced accordingly.

Please refer to FIG. 1, which is a cross-sectional view of the antenna packaging structure of the present invention. The antenna packaging structure includes a top substrate 100, an antenna chip 200, a bottom substrate 300, and a plurality of antenna transmission lines 400. In one embodiment of the present invention, the antenna chip 200 includes an antenna integrated circuit and an antenna processor. For example, the antenna integrated circuit includes an antenna transmitter such as a radio frequency integrated circuit (RFIC), and the antenna processor includes a digital processor.

The top substrate 100 includes an antenna 1001. The bottom substrate 300 includes a circuit 301 and is disposed at a position below the top substrate 100.

The antenna chip 200 is mounted on the top surface of the bottom substrate 300 and is electrically connected to the antenna 1001 of the top substrate 100 through the circuit 301 of the bottom substrate 300 and the antenna transmission line 400.

Since the antenna chip 200 can be electrically connected to the processor through the circuit 301 of the bottom substrate 300, there is no need to electrically connect multiple transmission lines between the antenna 1001 of the top substrate 100 and the circuit 301 of the bottom substrate 300.

Furthermore, since the antenna chip 200 still needs to be electrically connected to the antenna 1001 of the top substrate 100, a plurality of transmission lines still need to be electrically connected between the antenna 1001 of the top substrate 100 and the circuit 301 of the bottom substrate 300. However, since the antenna chip 200 does not need to communicate with the antenna 1001 to perform complex functions, the antenna transmission line 400 only needs to transmit simple antenna signals between the antenna 1001 and the antenna chip 200.

Therefore, the number of antenna transmission lines 400 may be less than the number of transmission lines used to communicate with the antenna chip 200 and the processor. Furthermore, the overall size of the antenna packaging structure can be reduced accordingly. That is, the antenna packaging structure disclosed in the present invention provides a solution for reducing the size of the antenna packaging structure.

2 to 4, the antenna 1001 includes a ground layer 10, a first substrate layer 11, a first circuit layer 12, a second substrate layer 21, a second circuit layer 22, a third substrate layer 31, and a third circuit layer 32 , The fourth substrate layer 41 and the fourth circuit layer 42.

The ground layer 10 is installed on the bottom surface of the first substrate layer 11 and includes a ground loop 101. The ground loop 101 completely covers the bottom surface of the first substrate layer 11. The first circuit layer 12 is installed between the top surface of the first substrate layer 11 and the bottom surface of the second substrate layer 21. The first circuit layer 12 includes an antenna signal circuit 121 and a plurality of first ground loops 122. The first ground loop 122 is installed around the antenna signal circuit 121.

The second circuit layer 22 is installed between the top surface of the second substrate layer 21 and the bottom surface of the third substrate layer 31. The second circuit layer 22 includes a first antenna circuit 221, a second antenna circuit 222 and a plurality of second ground loops 223. The second ground loop 223 is installed around the first antenna circuit 221 and the second antenna circuit 222.

The third circuit layer 32 is installed between the top surface of the third substrate layer 31 and the bottom surface of the fourth substrate layer 41. The third substrate layer 31 includes a first antenna through hole 311, a second antenna through hole 312 and a plurality of ground through holes 313. The ground through hole 313 is installed around the first antenna through hole 311 and the second antenna through hole 312. The first antenna circuit 221 and the second antenna circuit 222 are electrically connected to the antenna signal circuit 121 through the second substrate layer 21. The second ground loop 223 is electrically connected to the first ground loop 122 through the second substrate layer 21.

The third circuit layer 32 includes a third antenna circuit 321, a fourth antenna circuit 322 and a plurality of third ground loops 323.

Both ends of the first antenna through hole 311 are electrically connected to the first antenna circuit 221 and the third antenna circuit 321 respectively. Two ends of the second antenna hole 312 are electrically connected to the second antenna circuit 222 and the fourth antenna circuit 322 respectively.

The fourth circuit layer 42 is mounted on the top surface of the fourth substrate layer 41 and includes an antenna radiation circuit 421 and a plurality of fourth ground loops 422. The fourth ground loop 422 is installed around the antenna radiation circuit 421. The antenna radiation circuit 421 is electrically connected to the third antenna circuit 321 and the fourth antenna circuit 322 through the fourth substrate layer 41. The fourth ground loop 422 is electrically connected to the third ground loop 323 through the fourth substrate layer 41.

The ground loop 101, the first ground loop 122, the second ground loop 223, the ground through hole 313, and the fourth ground loop 422 form an isolation wall. The isolation wall includes a cavity to accommodate the antenna signal circuit 121, the first antenna circuit 211, the second antenna circuit 212, the first antenna through hole 311, the second antenna through hole 312, and the antenna radiation circuit 421. When the antenna 1001 is installed in an electronic device, the electromagnetic waves generated by the integrated circuits (ICs) of the electronic device can be mostly isolated to avoid the influence of noise caused by electromagnetic interference.

In addition, the antenna 1001 includes a plurality of first through holes 201 formed by penetrating the ground layer 10 and the first substrate layer 11 to expose the antenna signal circuit 121 of the first circuit layer 12.

The antenna transmission line 400 is electrically connected to the antenna signal circuit 121 of the first circuit layer 12 of the antenna 1001 through the first through hole 201, and the antenna transmission line 400 can be isolated by the ground loop 101 of the ground layer 10.

Furthermore, the antenna 1001 further includes a fifth substrate layer 51 and a fifth circuit layer 52. The fourth circuit layer 42 is installed between the top surface of the fourth substrate layer 41 and the bottom surface of the fifth substrate layer 51. The fifth circuit layer 52 is mounted on the top surface of the fifth substrate layer 51 and includes a plurality of fifth ground loops 521. The fifth ground loop 521 is electrically connected to the fourth ground loop 422 through the fifth substrate layer 51.

Since the antenna 1001 further includes a fifth substrate layer 51 and a fifth circuit layer 52, the fifth ground loop 521 can be higher than the antenna radiation circuit 421. Therefore, the side line of the isolation wall can be higher than the antenna radiating circuit 421 to improve the efficiency of the antenna packaging structure.

In addition, the second through hole 60 is formed by penetrating the fifth substrate layer 51 and the fifth circuit layer 52, and the antenna radiation circuit 421 can be exposed through the second through hole 60.

The second substrate layer 21 includes two first connection through holes 211 and two second connection through holes 222. The first antenna circuit 221 is electrically connected to the antenna signal circuit 121 through the two first connection through holes 211 of the second substrate layer 21. The second antenna circuit 222 is electrically connected to the antenna signal circuit 121 through the two second connection through holes 212 of the second substrate layer 21.

The fourth substrate layer 41 includes two third connection through holes 411 and two fourth connection through holes 412. The third antenna circuit 321 is electrically connected to the antenna radiation circuit 421 through the two third connection through holes 411 of the fourth substrate layer 41. The fourth antenna circuit 322 is electrically connected to the antenna radiation circuit 421 through the two fourth connection through holes 412 of the fourth substrate layer 41.

Please refer to FIG. 2, the antenna radiation circuit 421 of the fourth circuit layer 42 is a rectangular microstrip antenna, and the rectangular microstrip antenna includes two connecting portions 4211. The two connecting portions 4211 respectively extend outward from the two long sides of the rectangular microstrip antenna.

One of the connection portions 4211 is electrically connected to the third antenna circuit 321 through the two third connection through holes 411 of the fourth substrate layer 41, and the other connection portion 4211 is electrically connected to the fourth antenna circuit 321 through the two fourth connection through holes 412 of the fourth substrate layer 41. Antenna circuit 322.

Furthermore, the two connecting portions 4211 respectively extend outward from the middle positions of the two long sides of the rectangular microstrip antenna.

The antenna radiation circuit 421 is a rectangular microstrip antenna with two connecting parts 4211 extending outward from the middle of the two long sides of the rectangular microstrip antenna. Therefore, the antenna packaging structure has an inductance-capacitance balanced feed design (LC-balanced). feeding design) to enhance antenna efficiency and bandwidth.

In summary, since the isolation wall contains a cavity, it is convenient to accommodate the antenna signal circuit 121, the first antenna circuit 211, the second antenna circuit 212, the first antenna through hole 311, the second antenna through hole 312, and the antenna The radiating circuit 421, therefore, the antenna 1001 is a cavity backed antenna, that is, the antenna 1001 has a cavity backed design to enhance its antenna gain.

In addition, the ground loop 101 includes a plurality of connection holes. The antenna signal circuit 121 is installed near the bottom of the antenna 1001, and the antenna signal circuit 121 can be electrically connected to an external printed circuit board (PCB) through a connection hole to facilitate signal transmission. Therefore, the antenna signal circuit 121 can be electrically connected to the printed circuit board and isolated from the ground loop 101, that is, the antenna 1001 is a bottom-fed design with a reduced size.

The above are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above in preferred embodiments, it is not intended to limit the present invention. Anyone familiar with the professional technology Personnel, without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, but any content that does not deviate from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

1001: Antenna 100: Top substrate 10: Ground plane 101: Ground loop 11: The first substrate layer 12: The first circuit layer 121: Antenna signal circuit 122: first ground loop 200: antenna chip 201: The first through hole 21: The second substrate layer 211: The first antenna circuit 212: second antenna circuit 22: The second circuit layer 221: first antenna circuit 222: second antenna circuit 223: second ground loop 300: bottom substrate 301: Circuit 31: The third substrate layer 311: First antenna perforation 312: second antenna perforation 313: Ground Piercing 32: third circuit layer 321: third antenna circuit 322: fourth antenna circuit 323: third ground loop 400: Antenna transmission line 41: The fourth substrate layer 411: third connection perforation 412: fourth connection perforation 42: The fourth circuit layer 421: Antenna Radiation Circuit 4211: connecting part 422: fourth ground loop 51: fifth substrate layer 52: Fifth circuit layer 521: Fifth Ground Loop 60: second through hole

Figure 1 is a cross-sectional view of the antenna packaging structure of the present invention; 2 is a cross-sectional view of the antenna of the antenna packaging structure of the present invention; Figure 3 is a schematic diagram of the antenna packaging structure of the present invention; and Fig. 4 is a top view of the antenna packaging structure of the present invention.

223: second ground loop

311: First antenna perforation

312: second antenna perforation

313: Ground Piercing

321: third antenna circuit

322: fourth antenna circuit

323: third ground loop

421: Antenna Radiation Circuit

4211: connecting part

521: Fifth Ground Loop

60: second through hole

Claims (9)

An antenna packaging structure includes: a top substrate including an antenna; an antenna chip; a bottom substrate including a circuit and located below the top substrate; and a plurality of antenna transmission lines electrically connected to the antenna of the top substrate and Between the circuits of the bottom substrate; wherein the antenna chip is mounted on a top surface of the bottom substrate, and is electrically connected to the antenna of the top substrate through the circuit of the bottom substrate and the antenna transmission line; wherein the antenna includes : A first substrate layer; a ground layer, mounted on a bottom surface of the first substrate layer, and including a ground loop; wherein the ground loop completely covers the bottom surface of the first substrate layer; a first circuit layer , Including an antenna signal circuit and a plurality of first ground loops; wherein the first ground loop is installed around the antenna signal circuit; a second substrate layer; wherein the first circuit layer is installed on top of one of the first substrate layers Between the surface and a bottom surface of the second substrate layer; a second circuit layer, including a first antenna circuit, a second antenna circuit, and a plurality of second ground loops; wherein the second ground loop is installed on the Around the first antenna circuit and the second antenna circuit; a third substrate layer including a first antenna through hole, a second antenna through hole and a plurality of ground through holes; wherein the second circuit layer is mounted on the first antenna through hole Between a top surface of the two substrate layers and a bottom surface of the third substrate layer; wherein the ground through hole is installed around the first antenna through hole and the second antenna through hole; The first antenna circuit and the second antenna circuit are electrically connected to the antenna signal circuit through the second substrate layer; wherein the second ground loop is electrically connected to the first ground loop through the second substrate layer; The third circuit layer includes a third antenna circuit, a fourth antenna circuit, and a plurality of third ground loops; a fourth substrate layer; wherein the third circuit layer is mounted on a top surface of the third substrate layer and the Between the bottom surface of a fourth substrate layer; wherein the two ends of the first antenna hole are electrically connected to the first antenna circuit and the third antenna circuit; wherein the two ends of the second antenna hole are respectively electrically connected The second antenna circuit and the fourth antenna circuit; a fourth circuit layer, mounted on a top surface of the fourth substrate layer, and including an antenna radiation circuit and a plurality of fourth ground loops; wherein the fourth circuit layer The ground loop is installed around the antenna radiation circuit; wherein the antenna radiation circuit is electrically connected to the third antenna circuit and the fourth antenna circuit through the fourth substrate layer; wherein the fourth ground loop is electrically connected through the fourth substrate layer Connect the third ground loop. The antenna packaging structure of claim 1, wherein the antenna further comprises: a plurality of first through holes formed by penetrating the ground layer and the first substrate layer to expose the antenna signal circuit of the first circuit layer Wherein the antenna transmission line is electrically connected to the antenna signal circuit of the first circuit layer of the antenna through the first through hole, and the antenna transmission line is isolated by the ground loop of the ground layer. The antenna packaging structure of claim 1, wherein the antenna further comprises: a fifth substrate layer; wherein the fourth circuit layer is mounted on the top surface of the fourth substrate layer and the first Between one of the bottom surfaces of the five substrate layers; and a fifth circuit layer, mounted on a top surface of the fifth substrate layer, and including a plurality of fifth ground loops; wherein the fifth ground loop passes through the fifth substrate layer The fourth ground loop is electrically connected. The antenna packaging structure according to claim 1, wherein the second substrate layer includes: two first connection through holes; wherein the first antenna circuit is electrically connected to the antenna through the two first connection through holes of the second substrate layer Signal circuit; two second connection through holes; wherein the second antenna circuit is electrically connected to the antenna signal circuit through the two second connection through holes of the second substrate layer. The antenna package structure according to claim 1, wherein the fourth substrate layer includes: two third connection through holes; wherein the third antenna circuit is electrically connected to the antenna radiation through the two third connection through holes of the fourth substrate layer And two fourth connection through holes; wherein the fourth antenna circuit is electrically connected to the antenna radiation circuit through the two fourth connection through holes of the fourth substrate layer. The antenna package structure according to claim 3, wherein the fourth substrate layer includes: two third connection through holes; wherein the third antenna circuit is electrically connected to the antenna radiation through the two third connection through holes of the fourth substrate layer Circuit; two fourth connection holes; wherein the fourth antenna circuit is electrically connected to the antenna radiation circuit through the second fourth connection holes of the fourth substrate layer. The antenna packaging structure according to claim 5, wherein the antenna further includes a second through hole; wherein the second through hole is formed by penetrating the fifth substrate layer and the fifth circuit layer to expose the antenna radiation circuit . The antenna packaging structure according to claim 7, wherein the antenna radiation circuit of the fourth circuit layer is a rectangular microstrip antenna, and the rectangular microstrip antenna includes two connecting parts; The two connecting portions respectively extend outward from the two long sides of the rectangular microstrip antenna; one of the connecting portions is electrically connected to the third antenna circuit through the two third connection through holes of the fourth substrate layer, and The other connecting portion is electrically connected to the fourth antenna circuit through the two fourth connection through holes of the fourth substrate layer. The antenna packaging structure according to claim 8, wherein the two connecting portions respectively extend outward from the middle position of the two long sides of the rectangular microstrip antenna.

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