JP2009100168A - Transmission and reception module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transmission and reception module which includes an RF circuit and a control circuit separated from each other, maintains RF circuit characteristics by preventing trouble caused by mixture of unwanted wave and wide area noise generated between the RF circuit and the control circuit and can also be made compact. <P>SOLUTION: The transmission and reception module includes: a high frequency transmission circuit which is fixed to a metal support base and includes a power amplification part; the control circuit which is separated from the high frequency transmission circuit and transmits a control signal for controlling power of a power amplification part; a multilayer substrate which has ground conductors on the front and rear surfaces and is provided with a band prevention circuit in which patterns are formed by open stub in signal lines installed in an inner layer; a pin electrode which is electrically connected to one end side of the signal lines of the multilayer substrate and fixed to the multilayer substrate; a first electric connection means for connecting one of the signal lines including the pin electrode to the high frequency transmission circuit; and a second electric connection means for connecting the other of the signal lines including the pin electrode to the control circuit. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a transmission / reception module used for a transmission / reception unit of a phased array antenna, a transmission / reception radar device, or the like.

  In general, in a transmission / reception module used in a radar device or the like, when two circuit parts of an RF (high frequency) circuit and a control circuit are mounted together in a package or the like, an RF signal is passed through the RF circuit and the control circuit. There is a problem in that unnecessary waves are mixed on the side and RF circuit characteristics become unstable. For example, in FIG. 3 of Japanese Patent Laid-Open No. 2006-14088 (see Patent Document 1), a plurality of conductor pads 15 are provided as external terminals, and control signals are supplied from an external control board. In addition, the internal conductor pad 10 is related to a transmission line substrate and a semiconductor package that suppress the entry of unnecessary waves by forming a plurality of ground vias 30a.

  In FIG. 1 (see Patent Document 2) of Japanese Utility Model Laid-Open No. 5-4592, by suppressing the reflection phenomenon of the radio wave inside the radio wave shielding metal shield box provided in the internal circuit of the high frequency band electronic device, In order to prevent circuit destruction and noise generation, radio waves as an anti-reflective material are placed between the resin insulation layer that covers the radio wave generation source of the oscillation circuit and amplifier circuit and the metal shield box that shields the radio wave. An antireflection structure for an internal circuit of an electronic device for a high frequency band in which an absorber is interposed partially or entirely is disclosed.

Japanese Patent Laying-Open No. 2006-14088 (FIG. 3)

Japanese Utility Model Publication No. 5-4592 (Fig. 1)

  However, since the RF circuit and the control circuit board described in Patent Document 1 are not housed in the same package, there has been a problem of increasing the size when used as a transmission / reception module.

  Moreover, since the thing of patent document 2 needs to apply | coat or paste a radio wave absorber over the surface of a metal shield or a resin mold over a comparatively large surface area, the problem that suppression with respect to an unnecessary wave cannot be comprised cheaply. In addition to this, there is a problem that it is difficult to significantly suppress specific unwanted waves.

  In the present invention, even when the RF circuit and the control circuit are separated from each other, for example, in a layered arrangement, unnecessary waves generated mutually in the RF circuit and the control circuit, and the RF circuit arranged in a layer from the outside are controlled. An object of the present invention is to provide a transmission / reception module capable of maintaining stable RF circuit characteristics and miniaturization by preventing inconvenience due to mixing of unnecessary waves and wide-area noise into the circuit space.

  A transmission / reception module according to claim 1 is fixed to a metal support, and includes a high-frequency transmission circuit including a power amplification unit, and a control circuit for sending a control signal for controlling the power of the power amplification unit apart from the high-frequency transmission circuit And a multilayer substrate having a ground conductor on the front and back surfaces and provided with a band rejection circuit patterned with an open stub on the signal line installed on the inner layer, and electrically connected to one end side of the signal line of the multilayer substrate and A pin electrode fixed to a multilayer substrate, a first electrical connection means for connecting one of the signal lines including the pin electrode to the high-frequency transmission circuit, and a second end of the signal line including the pin electrode connected to the control circuit And a second electric connecting means for blocking unnecessary wave frequencies other than a desired band frequency passing through the signal line by the band blocking circuit.

  The transmission / reception module according to claim 2 is the one according to claim 1, wherein the periphery of the open stub forming surface of the band rejection circuit is formed by a ground conductor pattern commonly connected to the front and back surfaces of the multilayer substrate.

  A transmission / reception module according to claim 3 is fixed to a metal support, and includes a high-frequency transmission circuit including a power amplification unit, and a control circuit that sends a control signal that controls the power of the power amplification unit apart from the high-frequency transmission circuit And a first band stop circuit having a ground conductor on the front and back surfaces and patterned with an open stub on the first signal line installed in the first inner layer adjacent to the ground conductor on the front side, opposite to the first inner layer The second inner layer adjacent to the surface is used as a ground conductor, and the first band stop circuit is opened to a second signal line installed on the third inner layer adjacent to the second inner layer and adjacent to the ground conductor on the back side. A multi-layer board provided with a second band rejection circuit different from the stub length, and a through-hole portion of the multi-layer board commonly connecting the first signal line and the second signal line of the multi-layer board are connected in common. The first signal line and the second signal line A pin electrode electrically connected to one end side and fixed to the multilayer substrate; a first electric connecting means for connecting one of the first signal line and the second signal line including the pin electrode to the high-frequency transmission circuit; A desired band passing through the first signal line and the second signal line, comprising: a second electrical connection means for connecting the other of the first signal line and the second signal line including the pin electrode to the control circuit; The unnecessary wave frequency other than the frequency is band-stopped by the first band-stop circuit and the second band-stop circuit.

  In the transmission / reception module according to claim 4, the periphery of the open stub formation surface of the first band rejection circuit and the second band rejection circuit is formed by a ground conductor pattern commonly connected to the front and back surfaces of the multilayer substrate. Item 3. Item 3.

  The transmission / reception module according to a fifth aspect is the transmission / reception module according to the first to fourth aspects, wherein an outer periphery of the pin electrode is covered with a radio wave absorber.

According to the transmission / reception module according to claim 1, since the multilayer substrate having the band blocking function with the inner layer being an open stub is installed between the high-frequency transmission circuit and the control circuit, the high-frequency transmission circuit, particularly the power amplification unit, etc. Since it is possible to reduce unnecessary waves due to the generated distortion and unnecessary waves mixed in the high-frequency transmission circuit from the control circuit, good high-frequency characteristics can be maintained.

  According to the transmission / reception module according to claim 2, since the periphery of the open stub of the band rejection circuit is covered with the ground conductor, generation of an unnecessary distributed constant circuit is eliminated, and unnecessary waves radiated and mixed through the laminated region of the multilayer substrate are eliminated. As a result, unnecessary interference waves can be suppressed.

  According to the transmission / reception module according to claim 3, since the multilayer substrate having the band blocking function of different frequencies with the inner layer being an open stub is installed between the high frequency transmission circuit and the control circuit, the high frequency transmission circuit, particularly the power amplification It is possible to reduce unnecessary waves having a relatively wide bandwidth due to distortion generated in a part and the like, and unnecessary waves having a wide bandwidth mixed from the control circuit to the high-frequency transmission circuit.

  According to the transmission / reception module according to claim 4, since the periphery of the open stub of the first and second band rejection circuits is covered with the ground conductor, generation of unnecessary distributed constant circuits is eliminated, and radiation / radiation is performed through the laminated region of the multilayer substrate. Unnecessary waves with a relatively wide bandwidth can be removed, and as a result, suppression of unnecessary interference waves can be ensured.

  According to the transmission / reception module according to the fifth aspect, since the outer periphery of the pin electrode is covered with the radio wave absorber, noise in the microwave frequency band radiated and mixed through the surface of the pin electrode or the outer jacket can be removed.

Embodiment 1 FIG.
Hereinafter, the transceiver module according to Embodiment 1 of the present invention will be described. FIG. 1 is a cross-sectional configuration diagram of a transmission / reception module according to the first embodiment. In FIG. 1, reference numeral 1 denotes a high-frequency circuit (high-frequency transmission circuit) on which a power amplification unit, a transmission / reception switching circuit, and the like are mounted. . 2 is a metal support for supporting the high-frequency circuits 1a, 1b and the like, and 3 is a pulse control signal such as transmission / reception power and a transmission / reception switching signal. And a control circuit 3a for supplying power, and reference numeral 3a denotes a printed circuit board, a ceramic substrate, or the like constituting the control circuit 3. Reference numeral 4 denotes a three-layered multilayer board equipped with a filter for passing a control signal transmitted from the control circuit 3 and removes unnecessary waves, 5 a pin electrode extending from a signal line of the multilayer board 4, and 6 a multilayer board 4 1 is a first electrical connection means composed of a gold ribbon or a gold wire for connecting the signal line exposed on the surface of the metal and the high-frequency circuit 1. Reference numeral 7 denotes a second electrical connecting means constituted by a forming wire, a gold wire, a nickel (Ni) ribbon or the like for connecting the pin electrode 5 and the control circuit 3.

  8 is a housing for housing or holding the high-frequency circuit 1 or the control circuit 3, 8a is a middle plate integrated with the housing 8 that divides the high-frequency circuit 1 and the control circuit 3 into layers, and 8b is a middle plate 8a. A through-hole through which the pin electrode 5 is provided, 8c is a through-hole provided in the substrate 3a through which the pin electrode 5 passes, 9 is an electronic component such as a control ASIC or power supply circuit mounted on the control circuit 3, and 10 is A screw for fixing a member to the housing 8.

  FIG. 2 is a functional block diagram of the transmission / reception module according to the first embodiment. In FIG. 2, 11 is a phase shifter that performs phase shift control of an RF signal, 12 is a transmission / reception switching circuit that switches a signal path of transmission / reception, 13 is a transmission power amplification unit that amplifies the power of the transmission signal, and 14 is a reception signal. Received power amplifying unit for amplifying the power of the signal, 15 is a transmission / reception switching unit configured by a passive circuit such as a circulator or a directional coupler, 16 is connected to the signal line of the multilayer substrate 4, and the pin electrode 5 is multilayered with a solder material or the like This is connected to the three-dimensional space in the housing 8 of the high-frequency circuit 1 and the control circuit 3 that are fixed to the substrate 4 and spaced apart from each other, and is called a filter loading connection pin. Reference numeral 17 denotes a transmission / reception antenna provided outside the transmission / reception module. Usually, a large number of phased array antennas and the like are provided for each transmission / reception system RF circuit. 1 and 2, the same reference numerals indicate the same or corresponding parts.

  Next, functions will be described. In FIG. 1, the housing 8 houses the high-frequency circuit 1 and the control circuit 3 in a layered structure, so that the upper layer and the lower layer are partitioned by an intermediate plate 8a. That is, the upper layer houses the high-frequency circuit 1 and the lower layer houses the control circuit 3. Since the high-frequency circuit 1 has a heat generating portion, the high-frequency circuit 1 is bonded to the metal support 2 screwed to the housing 8 with a conductive material in order to enhance the heat dissipation effect, and is fixed to the middle plate 8a position of the housing 8. Further, the control circuit 3 mounted on the board 3 a is also fixed with screws 10 by providing attachment holes at the end of the board 3 a at the position of the middle plate 8 a of the housing 8.

  In addition, the pin electrode 5 extending from the multilayer substrate 4 is provided with a through hole 8b in the middle plate 8a of the housing 8 and a corresponding through hole 8c in the substrate 3a on the control circuit 3 side. Connection to the control circuit 3 is performed.

  In this way, the high-frequency circuit 1 and the control circuit 3 are connected via the pin electrode 5 even if they are spaced apart from each other. In the first embodiment, the connection direction of the filter loading connection pins 16 is such that the side on which the pin electrode 5 is fixed to one surface of the multilayer substrate 4 is a connection destination of the control circuit 3, and the other surface of the multilayer substrate 4 is connected. The high frequency circuit 1 is connected. The metal support 2 and the multilayer substrate 4 are fixed by an adhesive or brazing. Finally, the plurality of connection pads of the high-frequency circuit 1 are connected to the signal lines of the filter loading connection pins 16 by the first electrical connection means 6, and the plurality of control terminals of the control circuit 3 are the pin electrodes 5 exposed only at the tips. The signal line is connected to the second electrical connection means 7.

  FIG. 3 is a diagram for explaining the internal configuration of the filter loading connection pin 16, and 18 is an open stub that is installed in the inner layer of the multilayer substrate 4 and configured by a microstrip line. The open stub 18 is installed in the vicinity of the signal line, and its line length is set to an effective length of 1 / 4λg of the unwanted wave frequency. As shown in FIG. 4, the open stub 18 serves as a band rejection filter (BRF) in the microwave band. The periphery of the formed open stub 18 is a ground conductor pattern.

  FIG. 5 is an external view of the filter loading connection pin 16, and 19 is a signal pattern exposed on the surface of the multilayer substrate 4, and is electrically connected to the pin electrode 5 through the open stub 18.

  6A and 6B are diagrams for explaining the pattern of the multilayer substrate 4 by layer. FIG. 6A shows one surface layer pattern, FIG. 6B shows an inner layer pattern, and FIG. 6C shows the other surface layer pattern. is there. In FIG. 6, reference numeral 20 denotes a through-hole portion that commonly connects the surface layer and inner layer signal lines, and reference numeral 21 denotes a pin connection portion that electrically connects the pin electrode 5 to the multilayer substrate 4, and is also a fixed portion of the pin electrode 5. Reference numeral 22 denotes a ground via that has a ground conductor on the entire surface except for the signal pattern on the surface layer and the pin connection portion 21 and is connected in common with the ground conductor on the inner layer, and is installed along the open stub 18 around the end portion of the multilayer substrate 4. .

  FIG. 7 is a partial cross-sectional view taken along line AA of FIG. 6 of the filter loading connection pin, and the pin electrode 5 is connected to the surface layer pattern land by soldering or brazing.

  Next, the open stub 18 installed in the inner layer of the multilayer substrate 4 will be described. The multilayer substrate 4 has a three-layer structure and is made of a material having a small dielectric loss using BT resin or fluororesin. The effective dielectric constant (εr) of BT resin is 4.2, and the εr of fluororesin is 2.6. When these base materials are used, the thickness of each substrate, strip line width (W), etc. are taken into consideration. The open stub length for forming the triplate line is determined. In addition, it is preferable that the separation distance between the open stub 18 that forms the strip line and the shielded ground conductor with respect to the inner layer pattern surface is larger than the line width (W) of the open stub 18. In addition to the above, if the εr has a high dielectric constant of about 9.0, such as a ceramic substrate, the bandstop circuit can be formed on a ceramic multilayer substrate with a compact structure even in a high microwave frequency region. Can be stored.

  From the above, by using the filter loading connection pin 16, it functions as a filter (choke) circuit that ensures the isolation of the space between the high-frequency circuit 1 and the control circuit 3, and suppresses oscillation due to positive feedback in the housing 8. be able to. In addition, when there are two or more transmission / reception systems in the same housing, interference between systems is suppressed, so that there is an effect of increasing isolation between systems.

Further, since the open stub 18 is installed in the inner layer of the multilayer substrate 4, the open stub 18 is made independent from the high-frequency circuit 1, so that the open stub 18 is shielded by the ground conductor pattern regardless of the structure of the high-frequency circuit 1. It is easy to make a structure.

  Accordingly, since the electromagnetic shielding effect is enhanced, signal emission from the open stub 18 to the space can be prevented. Thereby, even if it is an elongate three-dimensional connection structure like the pin electrode 5 which is easy to generate | occur | produce radiation, there also exists an advantage which stabilizes the high frequency characteristic of a transmission / reception module.

  Further, according to the structure shown in the pin electrode 5, a filter with a lumped constant is usually used for the connection stages before and after the multi-layer substrate with the pin electrode 5 and an open stub 18 with a distributed constant. In the structure in which 4 is combined, there is an effect that a filter characteristic can be obtained without requiring a lumped constant circuit.

  Further, since the circuit mounting can be performed spatially by the mounting method of the three-dimensional arrangement, the module can be downsized and the mounting density can be increased.

Embodiment 2. FIG.
Hereinafter, a transceiver module according to Embodiment 2 of the present invention will be described. FIG. 8 is an external view of the filter loading connection pin in the second embodiment, and 40 is a multi-layer substrate having a five-layer structure.

  9 is a diagram for explaining the pattern of the multilayer substrate 40 by layer. FIG. 9A shows one surface layer pattern, FIG. 9B shows an inner layer pattern adjacent to one surface layer, and FIG. Is an inner layer ground conductor pattern, FIG. 9D is an inner layer pattern adjacent to the inner layer ground conductor pattern, and FIG. 9E is the other surface layer pattern. In FIG. 9, 180 is a first open stub, 181 is a second open stub, and the surface layer pattern and the inner layer ground conductor pattern are ground conductors except for the through-hole portion 20, some signal lines 19, and pin connection portions 21. Each ground conductor is electrically connected by the ground via 22 as in the first embodiment. 6 denote the same or corresponding parts.

  Next, the layer structure will be described in detail. A first band rejection circuit in which an open stub pattern 181 is formed on the first signal line installed in the first inner layer adjacent to the ground conductor on one surface side to which the pin electrode 5 is fixed is provided and adjacent to the opposite surface of the first inner layer What is the stub length of the open stub 181 of the first band rejection circuit on the second signal line installed in the third inner layer, the second inner layer being the ground conductor, adjacent to the second inner layer, and the opposite surface being the back side ground conductor? Different open stubs 180 are formed, and the multilayer substrate 40 is provided with the second band rejection circuit.

  Further, the first signal line and the second signal line of the multilayer substrate 40 are electrically connected by the through-hole portion 20 that is commonly connected. Further, one end of the commonly connected first signal line and second signal line is electrically connected to the pin electrode 5 fixed by the pin connection part 21 of the multilayer substrate 40.

  FIG. 10 is a partial cross-sectional view of the filter loading connection pin taken along line BB shown in FIG. 9, and the pin electrode 5 is connected to the surface layer pattern land by soldering or brazing.

  Next, the open stubs 180 and 181 installed in the inner layer of the multilayer substrate 40 will be described. The multilayer substrate 40 has a five-layer structure. The stub length of the open stub 181 installed in the first inner layer is L2, and the design value of the unnecessary wave frequency is f1. Further, the stub length of the open stub 180 installed in the third inner layer is L1, and the design value of the unnecessary wave frequency is f2. That is, by making the stub length of the first inner layer longer than the stub length of the third inner layer, the stop band of the unnecessary wave frequency band is widened.

  FIG. 11 is a diagram for explaining the transmission loss of the transmission / reception module using the open stubs 180 and 181 in the microwave frequency band, and it is understood that a band rejection filter (BRF) having a transmission loss of 15 dB or more is formed. Karu.

  In the second embodiment, the band stop frequencies f1 and f2 are made close to each other. However, an independent band stop region may be provided in a wide microwave frequency band, and the first embodiment is not required even if the multi-layer substrate 40 is not used. Similarly, as shown in FIG. 12, an open stub having mutually different unwanted wave frequencies is installed on the inner layer as shown in FIG. 12, and a ground conductor pattern that shields the periphery of each open stub is formed using the ground via 22. Even if it is connected to the ground conductor, it has a function as a band rejection circuit and has a corresponding effect.

  From the above, a multilayer substrate with a band rejection function with different frequencies with an inner layer as an open stub was installed between the high-frequency transmission circuit and the control circuit. It is possible to reduce unnecessary waves having a wide bandwidth and unnecessary waves having a relatively wide bandwidth mixed in the high-frequency transmission circuit from the control circuit.

Embodiment 3 FIG.
Hereinafter, a transceiver module according to Embodiment 3 of the present invention will be described. FIG. 13 is an external view of the filter loading connection pin according to the third embodiment, and reference numeral 200 denotes a radio wave absorber disposed around the pin electrode 5 of the multilayer substrate 4 having the three-layer structure described in the first embodiment. In FIG. 13, the radio wave absorber 200 can remove unnecessary noise by dip coating or winding a sheet around the periphery of the pin electrode 5 except the tip. In addition, the radio wave absorber 200 was made into a sheet form by mixing a carbon material or metal powder pulverized to a particle size of 10 μm or less with a synthetic resin binder such as ethyl cellulose and then dispersing it with a roller into a paste or drying. Use things.

  In the third embodiment, since the elongated pin electrode 5 is used as in the first and second embodiments, unnecessary noise mixed in the pin electrode 5 is converted into heat by the radio wave absorber, so that electromagnetic waves from the pin electrode 5 are converted. Prevent radiation. In particular, even after a state in which the high frequency characteristics are unstable is observed, it can be dealt with by adding the radio wave absorber 200 to the pin electrode 5, which is effective against a single noise frequency other than a specific unnecessary wave frequency. Similarly, FIG. 14 shows a case where the multilayer substrate 40 described in the second embodiment is used, and all have the same effect regarding noise.

  In the first to third embodiments, two transmission / reception RF circuits have been described. Normally, an active phased array antenna apparatus uses a large number of transmission / reception RF circuits, but is not limited to this, and can be used as a general high-frequency module such as a single high-frequency circuit.

  In the first to third embodiments, the transmission / reception module has been described. However, when the function of only transmission or reception is applied, the transmission / reception switching circuit 12 and the transmission / reception switching unit 15 other than the power amplification unit are not necessary.

  Further, the elongated pin electrode 5 fixed to the multilayer substrates 4 and 40 may be an elongated metal block, and the elastic function of the multilayer substrates 4 and 40 is obtained by using a phosphor bronze material or the like. The electrical connection and the pin electrode 5 are fixed by being inserted into the pin connection portion 21. In this case, soldering and brazing processes are unnecessary.

It is a section lineblock diagram of a transceiver module concerning Embodiment 1 of this invention. It is a functional block diagram of the transmission / reception module which concerns on Embodiment 1 of this invention. It is a figure explaining the internal structure of the filter loading connection pin of the transmission / reception module which concerns on Embodiment 1 of this invention. It is a figure explaining the band stop filter (BRF) in the microwave band of the transmission / reception module which concerns on Embodiment 1 of this invention. It is an external view of the filter loading connection pin of the transmission / reception module which concerns on Embodiment 1 of this invention. It is a figure explaining the pattern of the multilayer substrate of the transmission / reception module which concerns on Embodiment 1 of this invention according to a layer, FIG.6 (a) is one surface layer pattern, FIG.6 (b) is an inner layer pattern, FIG.6 (c). ) Indicates the other surface layer pattern. It is a fragmentary sectional view of the filter loading connection pin of the transmission / reception module which concerns on Embodiment 1 of this invention. It is an external view of the filter loading connection pin of the transmission / reception module which concerns on Embodiment 2 of this invention. It is a figure explaining the pattern of the multilayer board | substrate of the transmission / reception module which concerns on Embodiment 2 of this invention according to a layer, Fig.9 (a) is one surface layer pattern, FIG.9 (b) is an inner layer pattern, FIG.9 (c). ) Shows the inner layer ground conductor pattern, FIG. 9D shows the inner layer pattern, and FIG. 9E shows the other surface layer pattern. It is a fragmentary sectional view of the filter loading connection pin of the transmission / reception module which concerns on Embodiment 2 of this invention. It is a figure explaining the transmission loss of the transmission / reception module which concerns on Embodiment 2 of this invention. It is an inner layer pattern figure at the time of providing two open stubs in the inner layer of the three-layer multilayer board | substrate of the transmission / reception module which concerns on Embodiment 1 of this invention. It is an external view of the filter loading connection pin using the 3 layer multilayer board | substrate of the transmission / reception module which concerns on Embodiment 3 of this invention. It is an external view of the filter loading connection pin at the time of using the multilayer substrate of 5 layers of the transmission / reception module which concerns on Embodiment 3 of this invention.

Explanation of symbols

1..High frequency transmission circuit (high frequency circuit) 1a..First system transmission / reception system RF circuit 1b..Second system transmission / reception system RF circuit 2..Metal support base 3..Control circuit 3a..Board 4 .. Multi-layer substrate 5 ・ ・ Pin electrode 6 ・ ・ Gold wire (first electrical connecting means) 7 ・ ・ Ni ribbon (second electrical connecting means)
8, casing 8a, middle plate 8b, penetrating part 8c, penetrating part 9, electronic component 10, screw 11, phase shifter 12, transmission / reception switching circuit 13, transmission power amplifying part 14 ..Receiving power amplifier 15 ..Transmission / reception switching unit 16 ..Filter loading connection pin 17 ..Antenna 18 ..Open stub 19 ..Signal pattern 20 ..Through hole portion 21 ..Pin connection portion 22. 40. Multi-layer substrate 180 Open stub 181 Open stub 200 Electromagnetic wave absorber

Claims (5)

A high-frequency transmission circuit that is fixed to a metal support and includes a power amplification unit, a control circuit that sends a control signal to control the power of the power amplification unit apart from the high-frequency transmission circuit, and a ground conductor on the front and back surfaces. A multilayer substrate provided with a band rejection circuit patterned with an open stub on the signal line installed in the inner layer, and a pin electrode electrically connected to one end side of the signal line of the multilayer substrate and fixed to the multilayer substrate; First electrical connection means for connecting one of the signal lines including the pin electrode to the high-frequency transmission circuit, and second electrical connection means for connecting the other of the signal line including the pin electrode to the control circuit. A transmission / reception module for blocking unnecessary wave frequencies other than a desired band frequency passing through the signal line by the band blocking circuit. The transmission / reception module according to claim 1, wherein a periphery of an open stub forming surface of the band rejection circuit is formed by a ground conductor pattern commonly connected to the front and back surfaces of the multilayer substrate. A high-frequency transmission circuit that is fixed to a metal support and includes a power amplification unit, a control circuit that sends a control signal to control the power of the power amplification unit apart from the high-frequency transmission circuit, and a ground conductor on the front and back surfaces. The first signal line placed on the first inner layer adjacent to the ground conductor on the surface side is provided with a first band stop circuit patterned with an open stub, and the second inner layer adjacent to the opposite surface of the first inner layer is grounded. A second band rejection different from the open stub length of the first band rejection circuit on a second signal line installed on a third inner layer adjacent to the second inner layer and having the opposite surface adjacent to the ground conductor on the back side. A multilayer substrate provided with a circuit; a through-hole portion of the multilayer substrate commonly connecting the first signal line and the second signal line of the multilayer substrate; the commonly connected first signal line and the second signal; It is electrically connected to one end of the signal line and A pin electrode fixed to the substrate; a first electrical connection means for connecting one of the first signal line and the second signal line including the pin electrode to the high-frequency transmission circuit; and the first signal including the pin electrode. A second electrical connection means for connecting the other of the second signal line and the second signal line to the control circuit, and an unnecessary wave frequency other than a desired band frequency passing through the first signal line and the second signal line is set in the first signal line. A transmission / reception module for blocking a band by a first band blocking circuit and the second band blocking circuit. The transmission / reception module according to claim 3, wherein the periphery of the open stub forming surface of the first band rejection circuit and the second band rejection circuit is formed by a ground conductor pattern commonly connected to the front and back surfaces of the multilayer substrate. The transmitting / receiving module according to claim 1, wherein an outer periphery of the pin electrode is covered with a radio wave absorber.

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