TWI718270B - Container storage facility - Google Patents
Container storage facility Download PDFInfo
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- TWI718270B TWI718270B TW106108142A TW106108142A TWI718270B TW I718270 B TWI718270 B TW I718270B TW 106108142 A TW106108142 A TW 106108142A TW 106108142 A TW106108142 A TW 106108142A TW I718270 B TWI718270 B TW I718270B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0407—Storage devices mechanical using stacker cranes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
發明領域 本發明是關於一種容器收納設備,其具備在收納區域設置有複數個以收納容器之收納部,及將前述收納區域中的前述複數個收納部的一部分或全部設為供給收納部,且對收納於前述供給收納部的前述容器之內部供給氣體的氣體供給裝置,前述氣體供給裝置具備有複數個相對於複數個前述供給收納部的每一個來設置且被連接至收納在前述供給收納部的前述容器之連接部、將從設置在前述收納區域之外部的供給源所供給的氣體分歧供給至前述複數個連接部之配管、及控制於前述配管內流通之氣體的流量的質量流控制器。FIELD OF THE INVENTION The present invention relates to a container storage device, which includes a storage area provided with a plurality of storage sections for storing containers, and a part or all of the plurality of storage sections in the storage area are used as supply storage sections, and A gas supply device for supplying gas to the inside of the container housed in the supply accommodating part, wherein the gas supply device is provided with a plurality of gas supply devices provided for each of the plurality of supply accommodating parts and connected to the supply accommodating part. The connection part of the container, the piping supplying the gas supplied from the supply source provided outside the storage area to the plurality of connection parts, and the mass flow controller that controls the flow rate of the gas flowing in the piping .
發明背景 所述之容器收納設備的以往例已揭示在日本專利特開2013-133193號公報(專利文獻1)中。在專利文獻1的容器收納設備中,是由屬於1個區劃區的複數個供給收納部來構成供給收納部群組。氣體供給裝置是相對於構成供給收納部群組的2個以上之供給收納部的每一個而具備有2個以上的第1配管。並且,專利文獻1的氣體供給裝置,是使從第2配管供給的氣體藉由分歧配管分歧到2個以上之第1配管,且藉由2個以上的第1配管,對構成供給收納部群組的2個以上之供給收納部的每一個來供給氣體。 並且,在專利文獻1的容器收納設備中,氣體供給裝置中的質量流控制器,是設置在2個以上的第1配管之每一個中的流路上。又,質量流控制器是設置在設置有收納部的收納區域中。具體來說,質量流控制器是設置在以下位置:在收納部中收納有容器的情況下相鄰於該容器的橫向側邊之位置。BACKGROUND OF THE INVENTION The conventional example of the container storage facility described above is disclosed in Japanese Patent Laid-Open No. 2013-133193 (Patent Document 1). In the container storage facility of
發明概要 課題、用以解決課題之手段 在上述之習知的容器收納設備中,由於是將質量流控制器設置在設置有收納部的收納區域中,因此在質量流控制器的溫度上升的情況下,其溫度上升的影響會有對收納於收納部的容器,特別是收容在容器的收容物造成影響之可能性。 又,第1配管是對應於複數個供給收納部的每一個而設置,且在複數個第1配管的每一個上設置有質量流控制器。因此,質量流控制器的設置數量多,而使氣體供給裝置的製造成本變高。SUMMARY OF THE INVENTION Problems and Means to Solve the Problems In the above-mentioned conventional container storage equipment, since the mass flow controller is installed in the storage area where the storage section is provided, the temperature of the mass flow controller rises Under the influence of the temperature rise, there is a possibility that the container stored in the storage part, especially the contents stored in the container, may be affected. In addition, the first piping is provided for each of the plurality of supply storage sections, and a mass flow controller is provided for each of the plurality of first piping. Therefore, the number of mass flow controllers installed is large, which increases the manufacturing cost of the gas supply device.
於是,所需求的是使收納區域的容器難以受到質量流控制器的溫度上升之影響,而且可以壓低氣體供給裝置的製造成本之容器收納設備。 用以解決課題之手段Therefore, what is needed is a container storage device that makes the container in the storage area hard to be affected by the temperature rise of the mass flow controller and can reduce the manufacturing cost of the gas supply device. Means to solve the problem
本揭示之容器收納設備的特徵構成在於下述之點:一種容器收納設備,其具備在收納區域設置有複數個以收納容器之收納部、及將前述收納區域中的前述複數個收納部的一部分或全部設為供給收納部,且對收納於前述供給收納部的前述容器之內部供給氣體的氣體供給裝置,前述氣體供給裝置具備有複數個相對於複數個前述供給收納部的每一個而設置且連接至收納在前述供給收納部的前述容器之連接部、將從設置在前述收納區域之外部的供給源所供給的氣體分歧供給至前述複數個連接部之配管、及控制於前述配管內流通之氣體的流量的質量流控制器, 在該容器收納設備中, 前述配管是相對於由前述複數個供給收納部的一部分或全部所構成的供給收納部群組而具備: 2個以上之第1配管,對構成前述供給收納部群組的2個以上之前述供給收納部的每一個而設置; 第2配管,形成單一的流路,該單一的流路是設置在氣體的流通方向上比前述2個以上之第1配管更上游側;及 分歧配管,使從前述第2配管供給的氣體分歧到前述2個以上之第1配管, 前述質量流控制器是設置在前述第2配管中的前述單一的流路上,且設置在被設定於前述收納區域之外部的設置區域中。The characteristic structure of the container storage device of the present disclosure lies in the following points: a container storage device having a storage area provided with a plurality of storage portions for storing containers, and a portion of the plurality of storage portions in the storage area Or all of them are provided as a supply accommodating portion and a gas supply device that supplies gas to the inside of the container accommodated in the supply accommodating portion, wherein the gas supply device is provided with a plurality of gas supply devices provided for each of the plurality of supply accommodating portions The connection part connected to the container accommodated in the supply accommodating part, the gas supplied from the supply source provided outside the accommodating area is branched and supplied to the piping of the plurality of connection parts, and the piping that controls the circulation in the piping A mass flow controller for the flow rate of gas. In this container storage facility, the piping is provided with respect to the supply storage section group formed by part or all of the plurality of supply storage sections: 2 or more first piping , Is provided for each of the two or more supply storage sections constituting the supply storage section group; the second piping forms a single flow path, and the single flow path is set in the gas flow direction than the above 2 More than one first piping on the upstream side; and a branch piping that diverges the gas supplied from the second piping to the two or more first piping, and the mass flow controller is the single one installed in the second piping And installed in the installation area set outside the aforementioned storage area.
根據此特徵構成,藉由在第2配管上設置質量流控制器,變得可相對於構成供給收納部群組的複數個供給收納部設置1個質量流控制器。因此,可以減少質量流控制器的設置數量,且可以壓低氣體供給裝置的製造成本。又,藉由在位於比第1配管更上游側之第2配管上設置質量流控制器,即可輕易地將質量流控制器設置在遠離收納部的位置。藉由在被設定於具備複數個收納部的收納區域之外部的區域中設置質量流控制器,可以使收容於該收納部的容器難以受到質量流控制器的溫度上升之影響。According to this characteristic configuration, by installing the mass flow controller on the second pipe, it becomes possible to install one mass flow controller for a plurality of supply storage sections constituting the supply storage section group. Therefore, the number of mass flow controllers installed can be reduced, and the manufacturing cost of the gas supply device can be reduced. In addition, by installing the mass flow controller on the second piping located on the upstream side of the first piping, the mass flow controller can be easily installed at a position away from the accommodating part. By providing the mass flow controller in an area outside the storage area provided with the plurality of storage sections, the container stored in the storage section can be made less affected by the temperature rise of the mass flow controller.
用以實施發明之形態 [第1實施形態] 以下根據圖式來說明容器收納設備之第1實施形態。 如圖1所示,容器收納設備具備有收納容器W之收納架1、搬送容器W之堆高式起重機2、及氣體供給裝置3。又,容器收納設備中具備有壁體K與搬送輸送帶4,該壁體K將設置有收納架1及堆高式起重機2之收納區域E1的側周圍包覆,該搬送輸送帶4是以貫穿壁體K的狀態設置並搬送容器W。Modes for Carrying Out the Invention [First Embodiment] The first embodiment of the container storage facility will be described below based on the drawings. As shown in FIG. 1, the container storage facility includes a
收納架1中具備有可收納容器W的複數個收納部1a。氣體供給裝置3是構成為對收納部1a所收納的容器W之內部,供給作為氣體之清潔乾燥空氣(以下,簡稱為乾燥空氣)。也就是說,藉由氣體供給裝置3而被供給到容器W的內部之氣體,相較於收納部1a中的氣體會成為濕度較低的氣體。 容器W是構成為可收容1片基板。在本實施形態中,是將基板設為光罩,又,將容器W設為收納光罩的容器W。The
搬送輸送帶4是設置成在位於壁體K的外側之外部地點與位於壁體K的內側之內部地點之間搬送容器W。搬送輸送帶4會設置在較高的位置與較低的位置。在對應於設置在較高的位置之搬送輸送帶4的外部地點上,是使天花板搬送車(圖中未示)進行容器W的裝載卸下。在對應於設置在較低的位置之搬送輸送帶4的外部地點上,是讓作業者進行容器W的裝載卸下。此外,圖中並未顯示設置在較低的位置之搬送輸送帶4。 而且,堆高式起重機2會在對應於搬送輸送帶4的內部地點與收納架1的收納部1a之間搬送容器W。The
容器收納設備是設置在使空氣(氣體)於內部區域E從天花板側朝向地板側向下方流動之降流式的無塵室內。進一步說明,於收納區域E1的正上方設置有使氣體朝向下方流動的送風風扇5。藉由此送風風扇5的送風作用,以使氣體在收納區域E1及設置區域E2從天花板側朝向地板側向下方流動。再者,送風風扇5相當於涵蓋收納區域E1與設置區域E2使設備內的氣體向下方流動的氣流產生裝置。The container storage facility is installed in a downflow type clean room in which air (gas) flows downward from the ceiling side to the floor side in the internal area E. To further explain, a
無塵室的地板部F,是由下地板部F2以及配設在比下地板部F2更上側的上地板部F1所構成。下地板部F2是沒有通氣孔的地板,在本實施形態中是由無孔狀的混凝土所構成。堆高式起重機2是在這個下地板部F2上行走。上地板部F1是格子地板,且形成有複數個朝上下方向Y貫穿的通氣孔。作業者是在這個上地板部F1上步行。再者,上地板部F1相當於作業地板,且該作業地板是設置在比下天花板部C2(參照圖5)更下方且設置在比下地板部F2更上方,並以可在上下方向Y上使氣體通氣的方式構成。The floor part F of the clean room is composed of a lower floor part F2 and an upper floor part F1 arranged above the lower floor part F2. The lower floor part F2 is a floor without vent holes, and is made of non-porous concrete in this embodiment. The
以下,從收納架1的長度方向(堆高式起重機2行走的行走方向)來看,將收納架1與堆高式起重機2排列的方向設為前後方向X,且將相對於收納架1而存在有堆高式起重機2的方向設為內側方向X1,並將其相反方向設為外側方向X2來進行說明。再者,前後方向X會成為地板上壁31的厚度方向。又,內側方向X1會成為相對於地板上壁31而存在有收納區域E1的方向之第1方向,且外側方向X2是成為與第1方向為相反方向之第2方向。又,由壁體K包覆的區域以及比上地板部F1更下方的區域為內部區域E。Hereinafter, from the perspective of the length direction of the storage rack 1 (the traveling direction in which the
壁體K會包覆收納區域E1。藉此,限制使空氣從流入口33以外的部分流通到收納區域E1之情形。壁體K具備有地板上壁31與地板下壁32。地板上壁31是位在比上地板部F1的上表面更上方且比天花板C更下方的位置。地板下壁32是位在比上地板部F1的上表面更下方且比下地板部F2更上方的位置。 如圖1所示,地板下壁32是形成為具備有4面地板下壁部32a的四角筒狀。於地板下壁部32a上形成有使空氣從地板下壁部32a的內側方向X1流出到外側方向X2的流出口(圖中未示)。The wall K covers the storage area E1. This restricts the flow of air from the portion other than the
地板上壁31也是形成為具備4面地板上壁部31a的四角筒狀。地板上壁31除了地板上壁部31a之外,還具備有形成該地板上壁31的上表面之上壁部31b。地板上壁部31a是以限制空氣從流入口33以外的部分流通到收納區域E1之狀態被設置。再者,在圖1中所顯示的是,將前後方向X的其中一個方向堵塞之地板上壁部31a、將前後方向X的另一個方向堵塞之地板上壁部31a、以及形成上表面之上壁部31b。The floor
地板上壁31的上端形成有使空氣從地板上壁31的上方流入至收納區域E1的流入口33。進一步說明,於地板上壁31的上端具備有形成地板上壁31的上表面之上壁部31b,且在此上壁部31b的一部分上形成有在上下方向Y上容許空氣的流通的流入口33。送風風扇5是在上壁部31b設置成堵塞該流入口33。再者,地板上壁31相當於相對於下地板部F2在上方隔著間隔的位置上以沿著上下方向Y的形態而被設置之主壁部。 並且,藉由送風風扇5的送風作用而從形成在壁體K的上端之流入口33流入到壁體K的內部的空氣,會形成為在壁體K內的收納區域E1從上方流動到下方後,從形成在壁體K的地板下壁部32a之流出口流出到壁體K的外部。The upper end of the upper-
[容器] 如圖4所示,於容器W的底部設有供氣部6與排氣部7。供氣部6是用於將從氣體供給裝置3的連接部18吐出的乾燥空氣供給至容器W的內部之部分。於供氣部6具備有供氣用開關閥(圖中未示)。排氣部7是用於將容器W的內部之氣體排氣到容器W的外部之部分。於排氣部7具備有排氣用開關閥(圖中未示)。[Container] As shown in FIG. 4, an
供氣部6的供氣用開關閥是藉由彈簧等賦與勢能體而被賦與勢能成關閉狀態。在對供氣部6連接有氣體供給裝置3的連接部18之狀態下,當從該連接部18噴出乾燥空氣時,會藉由該噴出的乾燥空氣之壓力對供給用開關閥進行開啟操作,而將乾燥空氣從供氣部6供給到容器W的內部。又,排氣部7的排氣用開關閥是藉由彈簧等賦與勢能體而被賦與勢能成關閉狀態。藉由氣體供給裝置3的乾燥空氣之供給而使容器W內部之壓力升高時,會藉由該壓力對排氣用開關閥進行開啟操作,而將容器W的內部之氣體從排氣部7進行排氣。The on-off valve for air supply of the
[收納架] 如圖1所示,於收納架1上以在上下方向Y及橫向方向(架子的延伸方向)上排列的狀態配置有收納部1a。 如圖1及圖3所示,複數個收納部1a的每一個上均具備有從下方支撐容器W之支撐部9。收納部1a是構成為在藉由支撐部9從下方支撐容器W的狀態下,收納該容器W。於支撐部9具備有用於將在水平方向上的容器W的規定位置定位的突起9a。又,支撐部9支撐有與收納部1a所收納的容器W連接之連接部18。此連接部18會在已將容器W支撐在支撐部9的規定位置之狀態下,連接至該容器W的供氣部6。連接部18是配置在可相對於在規定位置上被支撐部9支撐的狀態之容器W,來連接到該容器W的供氣部6之位置。[Storage Rack] As shown in Fig. 1, the
也就是說,當容器W被收納部1a收納且被支撐部9支撐時,該容器W是藉由突起9a而被定位在規定位置,並且可將連接部18連接到供氣部6。 並且,構成為在將容器W支撐於支撐部9的狀態下,藉由從連接部18吐出乾燥空氣,將乾燥空氣從供氣部6供給到容器W的內部,並且將容器W的內部之氣體從排氣部7進行排氣。 在複數個收納部1a的每一個所具備有的支撐部9的全部均支撐有連接部18。因此,可將收納架1中的複數個收納部1a的全部都設為藉由氣體供給裝置3供給乾燥空氣之供給收納部。 因此,在以下的說明中,對於供給收納部會單純地稱為收納部1a來進行說明。That is, when the container W is received by the
收納架1是設置在下地板部F2上。將收納架1中的複數個收納部1a的全部都配置成位在比上地板部F1更上方。因此,將在上下方向Y上排列的收納部1a當中的位於最下方的收納部1a作為最下段之收納部1a,於該最下段之收納部1a所具備的支撐部9是設置在比上地板部F1更上方。 將內部區域E之中,在比上地板部F1更上方且被壁體K所包圍的區域設為收納區域E1。將收納架1所具備的複數個收納部1a的全部都設置在收納區域E1中。又,在內部區域E之中,將比上地板部F1更下方的區域設為設置區域E2。此設置區域E2是位在比最下段之收納部1a所具備的支撐部9更下方的位置。也就是說,內部區域E是由收納區域E1與設置區域E2所構成,該收納區域E1是位在比上地板部F1更上方且被壁體K所包圍的區域,該設置區域E2是比上地板部F1更下方的區域。 再者,在本實施形態中,由於是將收納架1中的複數個收納部1a(供給收納部)的全部都設置在比上地板部F1更上方,因此將比上地板部F1更上方且被壁體K所包圍的區域設為收納區域E1。但是,在將收納架1中的收納部1a之一部分設置在比上地板部F1更下方的情況下,也可以將比上地板部F1更下方且被壁體K所包圍的區域之一部分或全部作為收納區域E1的一部分。例如,也可以做成將收納區域E1朝下方延伸到最下段之收納部1a(供給收納部)中的支撐部9之下端為止。在此情況下,成為主壁部會延伸到比上地板部F1更下方之情形。The
於收納架1所具備的複數個收納部1a是屬於複數個供給收納部群組G的任一個。如圖1及圖2所示,供給收納部群組G是由僅在上下方向Y上排列的2個以上之收納部1a所構成。又,可將在收納架1中從最上段一直排列到最下段之1列上的複數個收納部1a區分為複數個供給收納部群組G。藉由在上下方向上排列的複數個供給收納部組群G,而形成有收納架1的1列。在本實施形態中,如圖1所示,在收納架1中於上下方向Y上排列有33個收納部1a,且供給收納部群組G是由排列於上下方向Y上的11個收納部1a所構成。也就是說,將在上下方向Y上排列為1列的33個收納部1a區分成3個供給收納部群組G。像這樣,供給收納部群組G是由於收納架1上所具備有的複數個收納部1a之一部分所構成,且構成供給收納部群組G的2個以上之收納部1a僅在上下方向Y上排列而配置。The plurality of
[堆高式起重機] 如圖1所示,堆高式起重機2具備有:行走台車11,在收納架1的前方且朝行走方向(橫向方向:架子的延伸方向)行走;桅桿12,豎立設置在行走台車11上;升降體13,沿著桅桿12而升降;及移載裝置14,被升降體13支撐。 移載裝置14是藉由行走台車11行走而沿著行走方向移動,且藉由升降體13升降而沿著桅桿12在上下方向Y上移動。又,雖然省略詳細的說明,但於移載裝置14上具備有支撐容器W之支撐體、及使該支撐體沿著前後方向(與上下方向及橫向方向正交的方向)移動之連桿機構。移載裝置14是構成為可在自身與收納部1a之間、或自身與搬送輸送帶4之間移載容器W。 並且,堆高式起重機2是藉由行走台車11的行走、升降體13的升降及移載裝置14的移載動作,而將容器W從搬送輸送帶4搬送到收納部1a、或者將容器W從收納部1a搬送到搬送輸送帶4。[Stacker Crane] As shown in Fig. 1, the
行走台車11是在設置於下地板部F2上的行走軌道15上沿著該行走軌道15而行走。行走台車11的至少一部分位在比最下段之收納部1a所具備有的支撐部9更下方。在本實施形態中,行走台車11整體是位於比最下段之收納部1a所具備有的支撐部9更下方,且比上地板部F1更下方。The traveling
[氣體供給裝置] 氣體供給裝置3會將乾燥空氣供給到收納部1a所收納的容器W之內部。 氣體供給裝置3具備有連接部18、配管19及質量流控制器20。連接部18會在氣體供給裝置3上具備有複數個。又,連接部18是相對於複數個收納部1a的每一個而設置。此連接部18是連接到收納部1a所收納之容器W。配管19會將從設置在收納區域E1的外部之供給源21所供給的乾燥空氣分歧供給至複數個連接部18。質量流控制器20是控制於配管19內流通的乾燥空氣之流量的控制器。質量流控制器20會在氣體供給裝置3上具備有複數個。又,質量流控制器20是相對於供給收納部群組G的每一個而設置。順道一提,在圖2中,所顯示的僅是關於在複數個第1配管23及第2配管24當中,對於在橫向方向上相鄰的2列收納部1a之第1配管23及第2配管24。[Gas Supply Device] The
配管19具備有第1配管23、第2配管24、第3配管25、第1分歧配管26及第2分歧配管27。第1配管23是相對於複數個收納部1a的每一個而設置。第2配管24是相對於複數個供給收納部群組G的每一個而設置。第3配管25是連接到乾燥空氣的供給源21。第1分歧配管26是沿著收納架1的上下方向Y而設置。The
第1分歧配管26會連接1個第2配管24、與對應於構成1個供給收納部群組G的複數個收納部1a(為2個以上之收納部1a,在本實施形態中為11個收納部1a)的複數個第1配管23(為2個以上之第1配管23,在本實施形態中為11個第1配管23),並使從第2配管24所供給的乾燥空氣分歧到複數個第1配管23。第2分歧配管27會連接1個第3配管25、與複數個第2配管24(在圖2之例中為6個第2配管24),且使從第3配管25所供給的乾燥空氣分歧到複數個第2配管24。再者,第1分歧配管26相當於分歧配管。The
在第2配管24的每一個上均設置有質量流控制器20。換句話說,質量流控制器20是設置在第2配管24中的單一的流路上。質量流控制器20會測量流通於第2配管24的乾燥空氣之質量流量,以控制流通於第2配管24的乾燥空氣之流量。 複數個第1配管23的每一個上均設置有孔口(orifice)29與過濾器30。藉由在連接到1個第2配管24的複數個第1配管23的每一個上均設置孔口29之作法可將第1配管23的管徑縮小,因此可謀求從第2配管24供給到複數個收納部1a的乾燥空氣之流量的均一化。又,藉由過濾器30可以去除流通於第1配管23的塵埃。A
像這樣,藉由不在按每個收納部1a而設置的第1配管23上,而是在按每個供給收納部群組G而設置的第2配管24的每一個上設置質量流控制器20之作法,可以將其配置在遠離收納部1a的位置。也就是說,可以容易地將質量流控制器20設置在被設定於收納區域E1的外部之設置區域E2中。藉由將質量流控制器20設置在設置區域E2中,可以抑制容器W受到質量流控制器20的發熱之影響的情形。也就是說,在本實施形態中,質量流控制器20是設置在第2配管24中的單一的流路上且在被設定於收納區域E1的外部之設置區域E2中。In this way, instead of the
設置質量流控制器20的設置區域E2會延伸到比最下段之收納部1a所具備的支撐部9更下方、或者超過在上下方向Y上排列的複數個收納部1a之外側方向X2之端並朝外側方向X2延伸。在本實施形態中,設置區域E2是在比最下段之收納部1a所具備的支撐部9更下方,且相對於在上下方向Y上排列的複數個收納部1a的外側方向X2之端涵蓋前後方向X而設定。 並且,質量流控制器20是設置在地板上壁31的下端與下地板部F2之間。又,質量流控制器20是以在前後方向X上貫穿地板下壁32的地板下壁部32a的狀態而設置,並且設置成朝上下方向Y來看使質量流控制器20的一部分比地板下壁部32a更位於外側方向X2。由於地板上壁部31a與地板下壁部32a是在前後方向X上設置於相同的位置上,因此相對於地板上壁部31a,也是設置成朝上下方向Y來看使質量流控制器20的一部分位於外側方向X2。The installation area E2 where the
從形成在地板上壁31的上端之流入口33流入到壁體K的內部之空氣,會依收納區域E1、設置區域E2的順序於壁體K的內部向下方流動,且從形成在地板下壁32的流出口流出到壁體K的外部。質量流控制器20是設置在空氣的流動方向上比收納區域E1更下游側。因此,可使因質量流控制器20而受熱的空氣難以於收納區域E1流動。The air flowing into the interior of the wall K from the
[第2實施形態] 接著,根據圖式說明本發明之物品搬送設備的第2實施形態。 再者,在說明第2實施形態時,關於壁體K的形狀及質量流控制器20的配置等,主要是針對與第1實施形態的不同點來說明,針對與第1實施形態同樣的構成則省略說明。[Second Embodiment] Next, a second embodiment of the article conveying equipment of the present invention will be described based on the drawings. In the description of the second embodiment, the shape of the wall body K, the arrangement of the
無塵室的天花板C是由上天花板部C1、以及設置在比上天花板部C1更下方的下天花板部C2所構成。上天花板部C1是不具有通氣孔的天花板,且限制空氣的流通。下天花板部C2是可在上下方向Y上通氣的天花板。在本實施形態中,上天花板部C1是由無孔狀的混凝土所構成。下天花板部C2是由HEPA過濾器等的過濾器所構成。 再者,具備有過濾器的下天花板部C2相當於具備有使清淨空氣向下方流出之流出部的天花板。下地板部F2相當於在上下方向Y上限制氣體的流通的設置地板。The ceiling C of the clean room is composed of an upper ceiling portion C1 and a lower ceiling portion C2 provided below the upper ceiling portion C1. The upper ceiling part C1 is a ceiling without ventilation holes, and restricts the circulation of air. The lower ceiling portion C2 is a ceiling that can ventilate in the vertical direction Y. In this embodiment, the upper ceiling portion C1 is made of non-porous concrete. The lower ceiling portion C2 is composed of a filter such as a HEPA filter. In addition, the lower ceiling part C2 provided with a filter is equivalent to the ceiling provided with the outflow part which makes clean air flow out downward. The lower floor portion F2 corresponds to an installation floor that restricts the flow of gas in the vertical direction Y.
如圖5所示,壁體K是設置在下天花板部C2的正下方。壁體K具備有地板上壁31與地板下壁32。地板上壁31位於比上地板部F1更上方且比下天花板部C2更下方的位置。地板下壁32位於比上地板部F1更下方且比下地板部F2更上方的位置。地板下壁32相較於地板上壁31會在前後方向X上形成得較寬。壁體K是作為整體而形成為從長度方向來看是使其上下翻轉的T字形。As shown in FIG. 5, the wall body K is installed directly below the lower ceiling part C2. The wall body K includes an
地板上壁31是形成為上方為開放的四角筒狀。也就是說,在第2實施形態中,和第1實施形態同樣地,地板上壁31是形成為具備4面地板上壁部31a的四角筒狀。但是,並不具備有第1實施形態所示的上壁部31b。再者,在圖5中所顯示的是將前後方向X的其中一個方向堵塞之地板上壁部31a、以及將前後方向X的另一個方向堵塞的地板上壁部31a。The floor
地板下壁32是形成為上表面的一部分為開口之四角箱狀。進一步說明,地板下壁32具備有4面的地板下壁部32a、形成該地板下壁32的上表面之一對遮斷壁部32b、形成該地板下壁32的下表面之底壁部32c。在圖5中所顯示的是將收納區域E1中的前後方向X的其中一個方向堵塞的地板下壁部32a、將前後方向X的另一個方向堵塞的地板下壁部32a、形成地板下壁32的上表面之一對遮斷壁部32b、與形成下表面之底壁部32c。形成地板下壁32中的上表面之一對遮斷壁部32b是成為相對於下地板部F2而在上方隔著間隔的位置上,沿著下地板部F2而設置並且限制空氣的流通之構成。再者,遮斷壁部32b相當於副壁部。The floor
遮斷壁部32b中的內側方向X1之端部,是在前後方向X上位在地板下壁部32a的內表面與支撐部9的外側方向X2之端部之間。遮斷壁部32b中的外側方向X2之端部,比地板下壁部32a的外表面更位在外側方向X2之側。 於地板下壁32的外側方向X2之端部上,形成有朝向外側方向X2開口的流出口34。此流出口34可藉由可使空氣在前後方向X上通氣的地板下壁部32a而被關閉。更具體地來說,於地板下壁32的外側方向X2之端部上,形成有空氣流出的流出口34,並可將該流出口34藉由地板下壁部32a而局部地關閉。The end portion of the blocking
形成在地板上壁31的下端之開口與形成在地板下壁32的上表面之開口,會在上下方向Y中的上地板部F1的位置上連接。被地板上壁31所包圍的收納區域E1與遮斷壁部32b的正下方之設置區域E2是連通的。又,於地板上壁31的上端形成有使空氣從地板上壁31的上方流入至收納區域E1的流入口33。又,地板下壁32的外側方向X2之端部上形成有使空氣從設置區域E2流出到地板下壁32的外側方向X2側的流出口34。這個流出口34是形成在從遮斷壁部32b中的外側方向X2之端部朝下方遠離的位置上。The opening formed on the lower end of the floor
並且,遮斷壁部32b中的內側方向X1之部分,是以限制遮斷壁部32b與地板上壁31之間之空氣的流通的狀態相鄰於地板上壁31中的下端而配置。 進一步說明,遮斷壁部32b是連結於上地板部F1的下表面,且地板上壁31的地板上壁部31a之下端是連結於上地板部F1的上表面。像這樣,以在地板上壁部31a的下端與遮斷壁部32b的上表面之間夾著上地板部F1的狀態,來設置地板上壁31及遮斷壁部32b。藉此,在本實施形態中,成為在地板上壁31與遮斷壁部32b之間上地板部F1為限制空氣的流通的狀態。 再者,遮斷壁部32b中的內側方向X1之部分,是設為從遮斷壁部32b中的內側方向X1之端到1/3的部分。In addition, the part of the blocking
在本實施形態中,設置區域E2是設定在比最下段之收納部1a所具備的支撐部9更下方,且比在上下方向Y上排列的複數個收納部1a之外側方向X2的端部更位在外側方向X2之側。質量流控制器20是設置在設置區域E2中。質量流控制器20的整體是比遮斷壁部32b的內側方向X1之端部更位於外側方向X2之側,且比遮斷壁部32b的外側方向X2之端部更位於內側方向X1之側。又,質量流控制器20是相對於支撐部9而在外側方向X2側設置成朝上下方向Y來看與支撐部9不重疊。In this embodiment, the installation area E2 is set below the
在對應於壁體K的位置上從下天花板部C2向下方流出的空氣,會從形成在地板上壁31的上端之流入口33流入到壁體K的內部。並且,已流入地板上壁31內的空氣會在收納區域E1向下方流動後,在設置區域E2中朝外側方向X2流動,之後,從流出口34流出至壁體K的外部。 質量流控制器20是設置在空氣的流動方向上比收納區域E1更下游側。因此,可使因質量流控制器20而受熱的空氣難以於收納區域E1流動。The air flowing downward from the lower ceiling portion C2 at a position corresponding to the wall K flows into the wall K from the
[其他實施形態] (1)在上述第1及第2實施形態中,雖然是將設置區域設定在比複數個收納部中的最下段之收納部所具備的支撐部更下方處,但設定設置區域的位置並不限定於此。也就是說,也可以將設置區域設定在比複數個收納部中的最上段之收納部更上方處、或者在包覆收納架的壁體之外部,具體來說,只要將設置區域以設定在上下方向中的下地板部與上地板部之間,且在前後方向上比地板下壁部更位於外側方向的方式進行設置亦可。[Other Embodiments] (1) In the first and second embodiments described above, although the installation area is set below the support portion provided in the lowermost storage portion of the plurality of storage portions, the installation is set The location of the area is not limited to this. In other words, the installation area may be set higher than the uppermost storage section of the plurality of storage sections, or outside the wall covering the storage rack. Specifically, the installation area may be set at It may be installed between the lower floor part and the upper floor part in the up-and-down direction, and in the front-rear direction than the floor lower wall part may be located in the outer direction.
(2)在上述第1及第2實施形態中,構成供給收納部群組的2個以上之供給收納部僅在上下方向上排列。但是,將構成供給收納部群組的2個以上之供給收納部僅在橫向方向上排列亦可、或者在上下方向上及橫向方向上排列亦可。又,在上述實施形態中,是用以下的例子進行說明:將在收納架中從最上段一直到最下段的1列上排列的複數個收納部區分為複數個供給收納部群組。但是,以在收納架的1列上排列之全部的收納部,來形成1個供給收納部群組G亦可。(2) In the first and second embodiments described above, the two or more supply storage sections constituting the supply storage section group are arranged only in the vertical direction. However, two or more supply storage sections constituting the supply storage section group may be arranged only in the horizontal direction, or may be arranged in the vertical direction and the horizontal direction. In addition, in the above-mentioned embodiment, the following example is used for description: a plurality of storage sections arranged in a row from the top to the bottom of the storage rack are divided into a plurality of supply storage section groups. However, all the storage sections arranged in one row of the storage rack may form one supply storage section group G.
(3)在上述第1及第2實施形態中,是將容器設為收納光罩(reticle、Photomask)的容器來說明。但是,容器也可以是收容FOUP等半導體晶圓的容器,也可以是收容食品的容器。(3) In the above-mentioned first and second embodiments, the description is made assuming that the container is a container that houses a reticle (photomask). However, the container may be a container for storing semiconductor wafers such as FOUP, or a container for storing food.
(4)在上述第1及第2實施形態中,是將藉由氣體供給裝置而供給到容器內部的氣體設為乾燥空氣。但是,藉由氣體供給裝置而供給到容器內部的氣體,也可以是乾燥空氣以外的氣體,例如,氮氣或氬氣等惰性氣體亦可。(4) In the first and second embodiments described above, the gas supplied into the container by the gas supply device is dry air. However, the gas supplied into the container by the gas supply device may be a gas other than dry air, for example, an inert gas such as nitrogen or argon.
(5)在上述實施形態中,是將收納架所具備的複數個收納部的全部均設為供給收納部。但是,也可以只將收納架所具備的複數個收納部的一部分設為供給收納部。 也就是說,將複數個收納部當中的一部分設為藉由氣體供給裝置供給氣體之供給收納部,並將複數個收納部當中的剩餘部分設為不藉由氣體供給裝置供給氣體之普通的收納部亦可。(5) In the above-mentioned embodiment, all of the plurality of storage sections included in the storage rack are used as supply storage sections. However, only a part of the plurality of storage sections included in the storage rack may be used as the supply storage section. In other words, a part of the plurality of storage sections is set as a supply storage section where gas is supplied by a gas supply device, and the rest of the plurality of storage sections is set as an ordinary storage section that does not supply gas by a gas supply device. Department can also be.
[上述實施形態的概要] 以下,針對在上述所說明之容器收納設備的概要進行說明。[Outline of the above-mentioned embodiment] Hereinafter, an outline of the container storage facility described above will be described.
一種容器收納設備,要點在於其具備在收納區域設置有複數個以收納容器之收納部、及將前述收納區域中的前述複數個收納部的一部分或全部設為供給收納部,且對收納於前述供給收納部的前述容器之內部供給氣體的氣體供給裝置,前述氣體供給裝置具備有複數個相對於複數個前述供給收納部的每一個而設置且連接至收納在前述供給收納部的前述容器之連接部、將從設置在前述收納區域之外部的供給源所供給的氣體分歧供給至前述複數個連接部之配管、及控制於前述配管內流通之氣體的流量的質量流控制器,在該容器收納設備中,前述配管是相對於由前述複數個供給收納部的一部分或全部所構成的供給收納部群組而具備: 2個以上之第1配管,對構成前述供給收納部群組的2個以上之前述供給收納部的每一個而設置; 第2配管,形成單一的流路,該單一的流路是設置在氣體的流通方向上比前述2個以上之第1配管更上游側;及 分歧配管,使從前述第2配管供給的氣體分歧到前述2個以上之第1配管, 前述質量流控制器是設置在為前述第2配管中的前述單一的流路上,且設置在被設定於前述收納區域之外部的設置區域中。A container storage device, the main point is that it has a storage area provided with a plurality of storage portions for storing containers, and a part or all of the plurality of storage portions in the storage area are used as supply storage portions, and the pair is stored in the storage area. A gas supply device for supplying gas to the inside of the container of the supply accommodating portion, the gas supply device is provided with a plurality of connections provided for each of the plurality of supply accommodating portions and connected to the container accommodated in the supply accommodating portion Part, the gas supplied from the supply source provided outside the storage area is branched and supplied to the piping of the plurality of connection parts, and the mass flow controller that controls the flow rate of the gas flowing in the piping is accommodated in the container In the equipment, the piping is provided with respect to the supply storage section group consisting of part or all of the plurality of supply storage sections: Two or more first pipings for two or more of the supply storage section group The second piping forms a single flow path, and the single flow path is provided on the upstream side of the two or more first pipings in the gas flow direction; and branch piping , The gas supplied from the second pipe is branched to the two or more first pipes, and the mass flow controller is installed in the single flow path in the second pipe, and is installed in the storage In the setting area outside the area.
根據此特徵構成,藉由在第2配管上設置質量流控制器,變得可相對於構成供給收納部群組的複數個供給收納部設置1個質量流控制器。因此,可以減少質量流控制器的設置數量,且可以壓低氣體供給裝置的製造成本。又,藉由在位於比第1配管更上游側之第2配管上設置質量流控制器,即可輕易地將質量流控制器設置在遠離收納部的位置。藉由在被設定於具備複數個收納部的收納區域之外部之區域中設置質量流控制器,可以使收容於該收納部的容器難以受到質量流控制器的溫度上升之影響。According to this characteristic configuration, by installing the mass flow controller on the second pipe, it becomes possible to install one mass flow controller for a plurality of supply storage sections constituting the supply storage section group. Therefore, the number of mass flow controllers installed can be reduced, and the manufacturing cost of the gas supply device can be reduced. In addition, by installing the mass flow controller on the second piping located on the upstream side of the first piping, the mass flow controller can be easily installed at a position away from the accommodating part. By providing a mass flow controller in an area outside the storage area provided with a plurality of storage sections, it is possible to make the container housed in the storage section less affected by the temperature rise of the mass flow controller.
在此,較理想的是將前述複數個收納部在上下方向上排列而配置,前述複數個收納部的每一個均具備從下方支撐前述容器的底面部之支撐部,且前述設置區域是設定在比前述複數個收納部中的最下段之前述收納部所具備的前述支撐部更下方。Here, it is preferable to arrange the plurality of storage portions in an up-down direction, each of the plurality of storage portions is provided with a support portion that supports the bottom surface of the container from below, and the installation area is set at It is lower than the said support part provided with the said storage part of the lowermost stage among the said several storage part.
根據此構成,可以利用比於最下段之收納部所具備的支撐部更下方之空出的空間,並在該空出的空間設置質量流控制器。進一步說明,在例如堆高式起重機相對於收納部搬送容器的情況下,可將於最下段之收納部所具備的支撐部設置在可以使該堆高式起重機相對於最下段之收納部搬送容器的高度上。在這種情況下,在最下段之收納部所具備的支撐部之下方大多為形成有空出的空間之情況。因此,可以利用此空出的空間,並在該空出的空間設置質量流控制器。 又,在容器收納設備中,藉由使收納區域內的氣體向下方流動的氣流產生裝置而有產生下向流(downflow)的情況。在產生有下向流的情況下,因質量流控制器的溫度上升而溫度已上升之周圍的氣體會變得難以向上方流動。因此,可使設置在比質量流控制器更上方的收納部中所收納之容器,變得難以受到質量流控制器的溫度上升所造成的熱之影響。According to this structure, it is possible to utilize the empty space below the support part provided in the lowermost storage part, and to install the mass flow controller in this empty space. To further explain, for example, in the case where a stacker crane transports the container to the storage section, the support section provided in the bottom storage section can be installed so that the stacker crane can transport the container to the bottom storage section. Height. In this case, there are many cases where a free space is formed below the support part provided in the lowermost storage part. Therefore, the vacated space can be used, and a mass flow controller can be installed in the vacated space. In addition, in the container storage facility, a downflow may be generated by an airflow generating device that causes the gas in the storage area to flow downward. When downward flow occurs, the surrounding gas whose temperature has risen due to the temperature rise of the mass flow controller becomes difficult to flow upward. Therefore, it is possible to make it difficult for the container accommodated in the accommodating part provided above the mass flow controller to be affected by the heat caused by the temperature rise of the mass flow controller.
又,較理想的是具備有涵蓋前述收納區域與前述設置區域來使設備內的氣體向下方流動的氣流產生裝置。In addition, it is desirable to include an airflow generating device that covers the storage area and the installation area and causes the gas in the equipment to flow downward.
根據此構成,可藉由氣流產生裝置,涵蓋收納區域與設置區域來產生使設備內的氣體向下方流動之下向流。因此,因質量流控制器的溫度上升而溫度已上升之周圍的氣體會變得難以向上方流動,並使設置在比質量流控制器更上方的收納部中所收納之容器變得難以受到質量流控制器的溫度上升所造成的熱之影響。According to this configuration, the airflow generating device can cover the storage area and the installation area to generate the downward flow of the gas in the equipment. Therefore, the surrounding gas whose temperature has risen due to the temperature rise of the mass flow controller becomes difficult to flow upwards, and it becomes difficult for the container accommodated in the storage part arranged above the mass flow controller to receive quality. The influence of heat caused by the temperature rise of the flow controller.
又,較理想的是構成前述供給收納部群組的前述2個以上之供給收納部僅在上下方向上排列而配置。In addition, it is preferable that the two or more supply storage sections constituting the supply storage section group are arranged only in a line in the vertical direction.
根據此構成,可將藉由配管而被供給氣體的2個以上之供給收納部在上下方向上排列。並且,由於對該2個以上之供給收納部供給氣體的配管,主要是以在上下方向上延伸的狀態設置,因此配管中的在水平方向上延伸的部分是比較少的。因此,使配管難以遮斷下向流,而易於藉由氣流產生裝置適當地使氣體流動。According to this configuration, two or more supply storage parts to which gas is supplied by the piping can be arranged in the vertical direction. In addition, since the pipes for supplying gas to the two or more supply accommodating parts are mainly installed in a state of extending in the vertical direction, the portion of the pipe extending in the horizontal direction is relatively small. Therefore, it is difficult for the pipe to block the downward flow, and it is easy to appropriately flow the gas by the airflow generating device.
又,較理想的是,前述複數個收納部在上下方向上及與該上下方向正交的橫向方向上排列而配置,前述複數個收納部的每一個均具備從下方支撐前述容器的底面部之支撐部,且具備將前述容器搬送到前述收納部之堆高式起重機,前述堆高式起重機具備在前述橫向方向上行走的行走台車、豎立設置在前述行走台車上的桅桿、及沿著前述桅桿而在上下方向上移動且將前述容器從自身移載到前述收納部的移載裝置,並且前述行走台車的至少一部分位於比於最下段之收納部所具備的前述支撐部更下方。Furthermore, it is more desirable that the plurality of storage portions are arranged in an up-down direction and in a lateral direction orthogonal to the vertical direction, and each of the plurality of storage portions has a bottom surface that supports the container from below. The supporting part is provided with a stacker crane that transports the container to the storage portion, and the stacker crane is provided with a traveling trolley that travels in the lateral direction, a mast erected on the traveling trolley, and along the mast A transfer device that moves in the vertical direction and transfers the container from itself to the storage section, and at least a part of the traveling trolley is located below the support section provided in the storage section at the lowermost stage.
根據此構成,由於在最下段之收納部所具備的支撐部是設置在可以使堆高式起重機的行走台車之至少一部分位於其下方的高度上,因此容易在最下段之收納部所具備的支撐部下方形成空出的空間。因此,可以利用該空出的空間,將質量流控制器設置在該空出的空間。According to this structure, since the support part provided in the lowermost storage part is provided at a height where at least a part of the traveling trolley of the stacker crane can be located below it, it is easy to support the support provided in the lowermost storage part An empty space is formed below the part. Therefore, the vacated space can be used to install the mass flow controller in the vacated space.
又,較理想的是,前述氣體供給裝置在前述第1配管的每一個上均具備有孔口。Furthermore, it is preferable that the gas supply device has an orifice in each of the first pipes.
根據此構成,變得可輕易地將由第2配管所供給的氣體相對於構成供給收納部群組的2個以上之供給收納部的每一個均等地供給。According to this configuration, it becomes possible to easily supply the gas supplied from the second pipe equally to each of the two or more supply storage sections constituting the supply storage section group.
又,較理想的是,前述容器是收納光罩的容器,且藉由前述氣體供給裝置供給到前述容器的內部之氣體,和前述收納部中的氣體相比為濕度較低的氣體。Furthermore, it is preferable that the container is a container that houses a mask, and the gas supplied to the inside of the container by the gas supply device is a gas with a lower humidity than the gas in the container.
根據此構成,可以使收容在容器的光罩難以受到質量流控制器發出之熱的影響。又,藉由在第2配管設置質量流控制器以形成為對複數個供給收納部設置1個質量流控制器的情況下,和藉由在第1配管設置質量流控制器而形成為對複數個供給收納部的每一個都設置質量流控制器的情況相比,易於使供給到複數個供給收納部的氣體供給量之變動變大。但是,一般而言,在容器中收容有光罩的情況下,和收容有半導體晶圓等的情況相比,對於容器之氣體供給量的變動之容許值較大。因此,即使在相對於複數個供給收納部設置1個質量流控制器的情況下,仍易於使氣體供給量的變動落在容許值以內。According to this configuration, it is possible to make the photomask contained in the container hard to be affected by the heat generated by the mass flow controller. In addition, when a mass flow controller is installed in the second pipe to form one mass flow controller for a plurality of supply storage parts, and a mass flow controller is installed in the first pipe to form a plurality of mass flow controllers. Compared with the case where a mass flow controller is installed in each of the supply storage sections, it is easy to increase the fluctuation of the gas supply amount supplied to the plurality of supply storage sections. However, generally speaking, when a photomask is accommodated in a container, the allowable value for the variation of the gas supply amount of the container is larger than when a semiconductor wafer or the like is accommodated. Therefore, even in the case where one mass flow controller is provided for a plurality of supply storage parts, it is easy to make the fluctuation of the gas supply amount fall within the allowable value.
又,較理想的是,具備包覆前述收納區域而限制該收納區域之周圍的氣體的流通的壁體,前述壁體具備主壁部,該主壁部是相對於限制氣體的流通的設置地板而在上方隔著間隔的位置上以沿著上下方向的形態設置,並且限制氣體的流通,將朝上下方向來看在前述主壁部的厚度方向上相對於前述主壁部而存在有前述收納區域的方向設為第1方向,並將與前述第1方向相反的方向設為第2方向,前述主壁部的上端形成有使氣體從前述主壁部的上方流入到前述收納區域的流入口,前述質量流控制器是設置成位在前述主壁部的下端與前述設置地板之間,且朝上下方向來看前述質量流控制器的至少一部分比前述主壁部更位於前述第2方向側。Furthermore, it is preferable to include a wall body covering the storage area to restrict the flow of gas around the storage area, and the wall body includes a main wall portion that is opposed to an installation floor that restricts the flow of gas. It is installed in the vertical direction at a spaced position above, and restricts the flow of gas. When viewed from the vertical direction, the main wall section has the above-mentioned storage relative to the main wall section in the thickness direction. The direction of the area is set as the first direction, and the direction opposite to the first direction is set as the second direction. The upper end of the main wall portion is formed with an inflow port that allows gas to flow into the storage area from above the main wall portion The mass flow controller is installed between the lower end of the main wall and the installation floor, and at least a part of the mass flow controller is located on the second direction side than the main wall when viewed from the top and bottom. .
根據此構成,從形成在主壁部的上端之流入口流入到壁體的內部之氣體,會在壁體內部中的收納區域中朝下方流動後,在主壁部與設置地板之間朝第2方向流動並流出到壁體的外部。並且,將質量流控制器設置成位在主壁部的下端與設置地板之間且朝上下方向來看該質量流控制器的至少一部分比主壁部更位在第2方向側。藉此,可以相對於收納區域在氣體流動的下游側設置質量流控制器。因此,使因質量流控制器而受熱之質量流控制器的周圍的氣體難以流動到收納區域,而可以抑制以因質量流控制器而受熱的氣體將收納於收納部的容器加熱之情形。According to this structure, the gas flowing into the interior of the wall from the inflow port formed at the upper end of the main wall will flow downward in the storage area in the interior of the wall, and then move toward the first between the main wall and the installation floor. Flow in 2 directions and flow out to the outside of the wall. In addition, the mass flow controller is installed between the lower end of the main wall and the installation floor, and at least a part of the mass flow controller is positioned on the second direction side than the main wall when viewed in the vertical direction. Thereby, a mass flow controller can be installed on the downstream side of the gas flow with respect to the storage area. Therefore, it is difficult for the gas around the mass flow controller heated by the mass flow controller to flow to the storage area, and it is possible to prevent the container contained in the storage portion from being heated by the gas heated by the mass flow controller.
又,較理想的是,前述壁體除了前述主壁部之外還具備副壁部,該副壁部是相對於前述設置地板而在上方隔著間隔的位置上沿著前述設置地板設置,並且限制氣體的流通,前述收納區域與比前述副壁部更下方的前述設置區域連通,且前述副壁部中的前述第2方向之端部的下方形成有使氣體從前述設置區域流出到比前述副壁部更靠近前述第2方向側的流出口,使前述副壁部中的前述第1方向之部分以限制前述副壁部與前述主壁部之間之氣體的流通的狀態連接於前述主壁部的下端,前述質量流控制器是設置在前述副壁部與前述設置地板之間,且設置成前述質量流控制器的至少一部分比前述主壁部更位於前述第2方向、且前述質量流控制器的至少一部分比前述副壁部中的前述第1方向之端部更位於前述第2方向。Furthermore, it is preferable that the wall body includes a sub-wall portion in addition to the main wall portion, and the sub-wall portion is provided along the installation floor at a space above the installation floor, and The flow of gas is restricted, the storage area communicates with the installation area below the sub-wall portion, and a formation is formed below the end of the second direction in the sub-wall portion to allow the gas to flow out of the installation area to less than the The sub-wall portion is closer to the outflow port on the second direction side, and the portion of the sub-wall portion in the first direction is connected to the main wall in a state restricting the flow of gas between the sub-wall portion and the main wall portion At the lower end of the wall, the mass flow controller is installed between the secondary wall and the installation floor, and is installed such that at least a part of the mass flow controller is located in the second direction and the mass is greater than the main wall. At least a part of the flow controller is located in the second direction than the end in the first direction in the auxiliary wall portion.
根據此構成,在壁體的內部之收納區域中向下方流動的氣體會在主壁部與設置地板之間朝第2方向流動,且在流經形成在副壁部的正下方之設置區域後,從形成在副壁部的端部下方之流出口流出到壁體的外部。也就是說,並不是使壁體內的空氣直接地從主壁部流出到壁體的外部,而是使空氣在藉由設置副壁部而形成的設置區域中流動後,流出到壁體的外部,藉此可在設置區域中流動的期間攪拌氣體。 進一步說明,例如,收納架所收納的物品是收容半導體基板的容器之情況下,會有充滿於容器內的氮氣等惰性氣體從容器中流出的情況。像這樣從容器產生氣體的情況下,有時會使該氣體的濃度局部地變高,換句話說,有時會使氧氣的濃度局部地變低。但是,藉由使壁體內的空氣在藉由設置副壁部而形成的設置區域中流動,且在此設置區域中使氣體攪拌後使其流出到壁體的外部,可以謀求從流出口流出的氣體之氧氣濃度的均一化。According to this structure, the gas flowing downward in the storage area inside the wall flows in the second direction between the main wall and the installation floor, and then flows through the installation area formed directly under the auxiliary wall. , Flows out of the wall from the outlet formed below the end of the secondary wall. In other words, it is not that the air in the wall directly flows out from the main wall to the outside of the wall, but the air flows in the installation area formed by the installation of the auxiliary wall, and then flows out to the outside of the wall. By this, the gas can be stirred while flowing in the installation area. To further explain, for example, in the case where the article contained in the storage rack is a container for storing semiconductor substrates, there may be cases where inert gas such as nitrogen gas filled in the container flows out of the container. When a gas is generated from the container in this way, the concentration of the gas may locally increase, in other words, the concentration of oxygen may locally decrease. However, by allowing the air in the wall to flow in the installation area formed by the installation of the auxiliary wall, and by stirring the gas in this installation area to flow out to the outside of the wall, it is possible to achieve the flow out from the outflow port. The homogenization of the oxygen concentration of the gas.
又,較理想的是,前述壁體除了前述主壁部之外,還具備副壁部,該副壁部是相對於前述設置地板而在上方隔著間隔的位置上沿著前述設置地板設置,並且限制氣體的流通,前述壁體是設置在具備有使清淨空氣朝向下方流出的流出部之天花板的正下方,且在比前述副壁部更上方處更具備可供作業者步行且在上下方向上可通氣之作業地板,前述副壁部是以在上下方向上與前述作業地板並列的狀態設置,前述作業地板中的在上下方向上與前述副壁部並列的部分是藉由前述副壁部來限制往上下方向的通氣。Furthermore, it is preferable that the wall body is provided with a sub-wall portion in addition to the main wall portion, and the sub-wall portion is provided along the installation floor at a space above the installation floor, and In addition, the flow of gas is restricted. The wall body is installed directly below the ceiling with an outflow part that allows the clean air to flow downward, and is provided above the auxiliary wall part for the operator to walk and in the up and down direction. The upper ventilable work floor, the auxiliary wall part is arranged in a state parallel to the work floor in the vertical direction, and the part of the work floor that is parallel to the auxiliary wall part in the vertical direction is provided by the auxiliary wall part Coming and restricting ventilation in the up and down direction.
根據此構成,由於作業地板是設置在比副壁部更上方,而副壁部是設置在相對於設置地板而在上方隔著間隔的位置上,因此作業者可以對收納架中的較高的部分進行作業。並且,由於可以利用作業地板下方的空間來形成設置區域,因而可以在難以成為周圍的障礙物之狀態下形成設置區域。 此外,由於作業地板中的在上下方向上與副壁部並列的部分可藉由副壁部的存在而限制通氣,因此可以抑止在收納架附近從作業地板流出氣體之情形。因此,對收納架進行物品的取出放入作業之作業者即使存在於壁體的附近,由於會形成使氣體在比該作業者所存在的地點更位於第2方向之側的地點上朝上方流動,因此可以抑制流出的氣體對作業者的影響。According to this structure, since the working floor is installed above the secondary wall, and the secondary wall is installed at a space above the installation floor, the operator can check the taller storage racks. Part of the homework. In addition, since the space under the work floor can be used to form the installation area, the installation area can be formed in a state where it is difficult to become a surrounding obstacle. In addition, since the portion of the work floor that is juxtaposed with the sub-wall in the vertical direction can restrict ventilation due to the presence of the sub-wall, it is possible to suppress the outflow of gas from the work floor in the vicinity of the storage rack. Therefore, even if the operator who takes out and puts the items into the storage rack exists near the wall, it will cause the gas to flow upward at a point on the second direction side than the place where the operator exists. Therefore, the influence of the outflowing gas on the operator can be suppressed.
1‧‧‧收納架1a‧‧‧收納部2‧‧‧堆高式起重機3‧‧‧氣體供給裝置4‧‧‧搬送輸送帶5‧‧‧送風風扇(氣流產生裝置)6‧‧‧供氣部7‧‧‧排氣部9‧‧‧支撐部9a‧‧‧突起11‧‧‧行走台車12‧‧‧桅桿13‧‧‧升降體14‧‧‧移載裝置15‧‧‧行走軌道18‧‧‧連接部19‧‧‧配管20‧‧‧質量流控制器21‧‧‧供給源23‧‧‧第1配管24‧‧‧第2配管25‧‧‧第3配管26‧‧‧第1分歧配管(分歧配管)27‧‧‧第2分歧配管29‧‧‧孔口30‧‧‧過濾器31‧‧‧地板上壁(主壁部)31a‧‧‧地板上壁部31b‧‧‧上壁部32‧‧‧地板下壁32a‧‧‧地板下壁部32b‧‧‧遮斷壁部(副壁部)32c‧‧‧底壁部33‧‧‧流入口34‧‧‧流出口C‧‧‧天花板C1‧‧‧上天花板部C2‧‧‧下天花板部E‧‧‧內部區域E1‧‧‧收納區域E2‧‧‧設置區域F‧‧‧地板部F1‧‧‧上地板部(作業地板)F2‧‧‧下地板部(設置地板)G‧‧‧供給收納部群組K‧‧‧壁體W‧‧‧容器X‧‧‧前後方向X1‧‧‧內側方向X2‧‧‧外側方向Y‧‧‧上下方向1‧‧‧Storage rack 1a‧‧‧Storage section 2‧‧‧Stacker crane 3‧‧‧Gas supply device 4‧‧‧Transfer conveyor belt 5‧‧‧Air supply fan (air generating device) 6‧‧‧Supply Air part 7‧‧‧Exhaust part 9‧‧‧Support part 9a‧‧‧Protrusion 11‧‧Travel trolley 12‧‧‧Mast 13‧‧‧Elevating body 14‧‧‧Transfer device 15‧‧‧Traveling track 18‧‧‧Connecting part 19‧‧‧Piping 20‧‧‧Mass flow controller 21‧‧‧Supply source 23‧‧‧First piping 24‧‧‧Second piping 25‧‧‧Third piping 26‧‧‧ The first branch piping (branch piping) 27‧‧‧The second branch piping 29‧‧ orifice 30‧‧‧Filter 31‧‧‧Floor upper wall (main wall) 31a‧‧‧Floor upper wall 31b‧ ‧‧Upper wall 32‧‧‧Floor bottom wall 32a‧‧‧Floor bottom wall 32b‧‧‧Blocking wall (secondary wall) 32c‧‧‧Bottom wall 33‧‧‧Inlet 34‧‧‧ Outlet C ‧ ‧ Ceiling C1 ‧ ‧ Upper ceiling C2 ‧ ‧ Lower ceiling E ‧ ‧ Internal area E1 ‧ ‧ Storage area E2 ‧ ‧ Setting area F ‧ ‧ Floor part F1 ‧ ‧ Upper Floor (work floor) F2‧‧‧Lower floor (setting floor) G‧‧‧Supply storage group K‧‧‧Wall W‧‧‧Container X‧‧‧Front and back direction X1‧‧‧Inside direction X2 ‧‧‧Outside direction Y‧‧‧Up and down direction
圖1是第1實施形態中的容器收納設備的側面圖。 圖2是第1實施形態中的容器收納設備的正面圖。 圖3是顯示第1實施形態中相對於供給收納部群組的配管之圖。 圖4是第1實施形態中的容器的正面圖。 圖5是第2實施形態中的容器收納設備的側面圖。Fig. 1 is a side view of the container storage facility in the first embodiment. Fig. 2 is a front view of the container storage facility in the first embodiment. Fig. 3 is a diagram showing piping with respect to the supply storage section group in the first embodiment. Fig. 4 is a front view of the container in the first embodiment. Fig. 5 is a side view of the container storage facility in the second embodiment.
1a‧‧‧收納部 1a‧‧‧Receiving Department
3‧‧‧氣體供給裝置 3‧‧‧Gas supply device
9‧‧‧支撐部 9‧‧‧Support
9a‧‧‧突起 9a‧‧‧Protrusion
18‧‧‧連接部 18‧‧‧Connecting part
19‧‧‧配管 19‧‧‧Piping
20‧‧‧質量流控制器 20‧‧‧Mass Flow Controller
23‧‧‧第1配管 23‧‧‧The first piping
24‧‧‧第2配管 24‧‧‧Second piping
26‧‧‧第1分歧配管(分歧記管) 26‧‧‧The first branch piping (branch recorder)
29‧‧‧孔口 29‧‧‧Orifice
30‧‧‧過濾器 30‧‧‧Filter
E1‧‧‧收納區域 E1‧‧‧Storage area
E2‧‧‧設置區域 E2‧‧‧Setting area
F‧‧‧地板部 F‧‧‧Floor
F1‧‧‧上地板部(作業地板) F1‧‧‧Upper floor (work floor)
G‧‧‧供給收納部群組 G‧‧‧Supply storage department group
W‧‧‧容器 W‧‧‧Container
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