TWI716931B - Taiko wafer ring cut process method - Google Patents
Taiko wafer ring cut process method Download PDFInfo
- Publication number
- TWI716931B TWI716931B TW108124214A TW108124214A TWI716931B TW I716931 B TWI716931 B TW I716931B TW 108124214 A TW108124214 A TW 108124214A TW 108124214 A TW108124214 A TW 108124214A TW I716931 B TWI716931 B TW I716931B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- drum
- tai
- ring
- taiko
- Prior art date
Links
Images
Abstract
Description
本發明是有關於一種太鼓晶圓環形切割製程方法。The invention relates to a process method for circular cutting of Tai drum wafers.
為達到晶圓超薄化的需求,太鼓(Taiko)研磨為目前最關鍵的製程,但對於晶圓封裝來說,因太鼓研磨所產生的太鼓環卻是影響製程的重要因素,太鼓研磨技術並不是對晶圓的整個平面進行薄化製程,而是僅對晶圓的中間部分進行減薄,而晶圓的邊緣部分不進行研磨減薄,讓晶圓的邊緣部分留下與日本太鼓鼓框一樣的一圈環而稱為太鼓環(Taiko Ring),太鼓環能將晶圓之邊緣支撐住,使得晶圓不會翹曲(warpage)。In order to meet the needs of ultra-thin wafers, Taiko polishing is currently the most critical process. However, for wafer packaging, the Taiko ring produced by Taiko polishing is an important factor affecting the process. Taiko polishing technology does not Instead of thinning the entire surface of the wafer, only the middle part of the wafer is thinned, and the edge of the wafer is not polished and thinned, leaving the edge of the wafer with the Japanese drum frame. The same ring is called a Taiko Ring. The Taiko Ring can support the edge of the wafer so that the wafer will not warpage.
習用技術是在薄化製程後,需先將晶圓黏固在切割用框架上的框架貼裝製程(frame mount process),接著再使用切割刀片進行去除太鼓環以利封裝廠作業。由於太鼓環係突出於晶圓之邊緣部分,使得此框架貼裝製程作業會在太鼓環區域造成包覆不全或產生氣泡之現象。再者,於切割過程中因晶圓受刀片高速切割作用影響下容易也會導致在刀片切割過程之中易造成晶圓裂傷及邊緣的破裂、崩角現象(edge chipping),使其良率無法達到最佳化。The conventional technology is a frame mount process (frame mount process) in which the wafer is fixed to the dicing frame after the thinning process, and then the dicing blade is used to remove the Taiko ring to facilitate the packaging plant operations. Because the Taiko ring protrudes from the edge of the wafer, the frame mounting process will cause incomplete coverage or air bubbles in the Taiko ring area. Furthermore, during the cutting process, the wafer is easily affected by the high-speed cutting action of the blade, which can easily cause wafer cracks, edge cracking, and edge chipping during the blade cutting process, making the yield rate impossible. Achieve optimization.
此外,上述切割後需取下太鼓環,由於此時太鼓環依然被膠帶黏附住,自膠帶上取太鼓環時,會連動膠帶拉扯造成晶邊裂痕的異常現象。In addition, the Taiko ring needs to be removed after the above-mentioned cutting. Because the Taiko ring is still stuck by the tape at this time, when the Taiko ring is removed from the tape, the tape will be pulled in conjunction with the abnormal phenomenon of crystal edge cracks.
因此,如何改良並能提供一種『太鼓晶圓環形切割製程方法』來避免上述所遭遇到的問題,係業界所待解決之課題。Therefore, how to improve and provide a "Taiku wafer ring cutting process method" to avoid the above-mentioned problems is a problem to be solved in the industry.
本發明提供一種太鼓晶圓環形切割製程方法,藉由雷射切割方式來改善切割後邊緣微缺角(Micro-chip)及提升太鼓環切良率,並藉由改變製造流程,來藉此避免太鼓環取下時連動膠帶拉扯造成晶邊裂痕的異常現象。The present invention provides a ring-cutting process method for Taiko wafers, which uses laser cutting to improve the micro-chip after cutting and increase the yield rate of Taiko ring-cutting, and by changing the manufacturing process, this Avoid the abnormal phenomenon of crystal edge cracks caused by pulling the tape when the Taiko ring is removed.
本發明之一實施例提出一種太鼓晶圓環形切割製程方法,包括以下步驟:置放一太鼓晶圓於一平台上,其中太鼓晶圓包括一晶圓部分、一邊緣部分以及一太鼓環,邊緣部分位於晶圓部分之外側邊緣處,太鼓環連接於邊緣部分;利用一雷射光束對太鼓晶圓進行環形切割,使得太鼓晶圓之邊緣部分與太鼓環分離於太鼓晶圓之晶圓部分;將太鼓晶圓之晶圓部分黏貼於一框架上。An embodiment of the present invention provides a ring-cutting process method for Tai drum wafers, which includes the following steps: placing a Tai drum wafer on a platform, wherein the Tai drum wafer includes a wafer part, an edge part and a Tai drum ring, The edge part is located at the outer edge of the wafer part, and the Tai drum ring is connected to the edge part; a laser beam is used to cut the Tai drum wafer in a ring shape so that the edge part of the Tai drum wafer and the Tai drum ring are separated from the wafer part of the Tai drum wafer ; Paste the wafer part of the Taiko wafer on a frame.
在本發明之一實施例中,上述置放太鼓晶圓於平台上的步驟中,包括以下步驟:利用真空吸附使太鼓晶圓固定於平台上。In an embodiment of the present invention, the step of placing the Tai drum wafer on the platform includes the following steps: using vacuum suction to fix the Tai drum wafer on the platform.
在本發明之一實施例中,上述利用真空吸附使太鼓晶圓固定於平台上的步驟之前,包括以下步驟:定位太鼓晶圓在平台之位置。In an embodiment of the present invention, before the step of fixing the Tai drum wafer on the platform by vacuum suction, it includes the following steps: positioning the Tai drum wafer on the platform.
在本發明之一實施例中,上述定位太鼓晶圓在平台之位置的步驟中,包括以下步驟:置放多個定位部在平台之上,使定位部抵靠於太鼓晶圓之太鼓環。In an embodiment of the present invention, the step of positioning the Taiko wafer on the platform includes the following steps: placing a plurality of positioning parts on the platform, and making the positioning parts abut against the Taiko ring of the Taiko wafer.
在本發明之一實施例中,上述利用雷射光束對太鼓晶圓進行環形切割的步驟中,包括以下步驟:雷射光束以太鼓晶圓為中心旋轉,以切割太鼓晶圓之邊緣部分;以及取下太鼓晶圓之邊緣部分與太鼓環。In an embodiment of the present invention, the above-mentioned step of using a laser beam to perform circular cutting of the Tai drum wafer includes the following steps: the laser beam rotates around the Tai drum wafer to cut the edge portion of the Tai drum wafer; and Remove the edge of the Taiko wafer and the Taiko ring.
在本發明之一實施例中,上述黏貼太鼓晶圓的晶圓部分於框架上的步驟中,包括以下步驟:置放框架於晶圓部分上;黏貼一膠帶於晶圓部分與框架之上。In an embodiment of the present invention, the step of pasting the wafer portion of the Taiko wafer on the frame includes the following steps: placing the frame on the wafer portion; and pasting an adhesive tape on the wafer portion and the frame.
基於上述,在本發明之太鼓晶圓環形切割製程方法中,使用雷射切割方式取代傳統刀片切割,並藉由調整雷射光束來改善切割後邊緣微缺角(Micro-chip)及提升太鼓環切良率。Based on the above, in the Taiko wafer ring cutting process method of the present invention, the laser cutting method is used to replace the traditional blade cutting, and the laser beam is adjusted to improve the micro-chip after cutting and enhance the Taiko Ring cutting yield.
再者,為了改善太鼓環取下時連動膠帶拉扯造成晶邊裂痕的異常現象,本發明在製造流程上變更為先進行雷射環切(Laser Ring Cutting)作業來切斷太鼓環,再進行框架貼裝製程(frame mount process),而不會有前述拉扯膠帶造成晶邊裂痕的異常現象。Moreover, in order to improve the abnormal phenomenon of crystal edge cracks caused by the pulling of the belt when the Taiko ring is removed, the present invention changes the manufacturing process to first perform the Laser Ring Cutting operation to cut the Taiko ring, and then perform the frame During the frame mount process, there will be no abnormal phenomenon of crystal edge cracks caused by pulling the tape.
為讓本發明能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the present invention more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.
以下結合附圖和實施例,對本發明的具體實施方式作進一步描述。以下實施例僅用於更加清楚地說明本發明的技術方案,而不能以此限制本發明的保護範圍。The specific implementation of the present invention will be further described below with reference to the drawings and embodiments. The following embodiments are only used to explain the technical solutions of the present invention more clearly, and cannot be used to limit the protection scope of the present invention.
需說明的是,在各個實施例的說明中,當一元件被描述是在另一元件之「上方/上」或「下方/下」,係指直接地或間接地在該另一元件之上或之下的情況,其可能包含設置於其間的其他元件;所謂的「直接地」係指其間並未設置其他中介元件。「上方/上」、「下方/下」等的描述係以圖式為基準進行說明,但亦包含其他可能的方向轉變。此外,為了說明上的便利和明確,圖式中各元件的厚度或尺寸,係以誇張或省略或概略的方式表示,且各元件的尺寸並未完全為其實際的尺寸。It should be noted that, in the description of each embodiment, when an element is described as being "above/upper" or "below/under" another element, it means that it is directly or indirectly on the other element In the case of or below, it may include other elements arranged in between; the so-called "directly" means that no other intermediate elements are arranged in between. The descriptions of "above/up", "below/down", etc. are based on diagrams, but also include other possible direction changes. In addition, for convenience and clarity of description, the thickness or size of each element in the drawings is expressed in an exaggerated or omitted or schematic manner, and the size of each element is not entirely its actual size.
圖1為本發明之太鼓研磨製程一實施例的示意圖。請參閱圖1,在本實施例中,太鼓晶圓環形切割製程方法係可用於晶圓薄化的背面研磨製程(Backside Grinding,BG)所形成的太鼓晶圓W。如圖1所示,利用研磨輪40,對置放平台30上的晶圓的研磨區D進行研磨,晶圓的研磨區D位於晶圓的中間位置,如圖1所示,舉例來說,為經研磨輪40研磨後的太鼓晶圓W,研磨區D是被研磨/蝕刻過後被去除的部分,其中太鼓晶圓W包括一晶圓部分WD、一邊緣部分WE以及一太鼓環TR,邊緣部分WE位於晶圓部分WD之外側邊緣處,太鼓環TR連接於邊緣部分WE,即邊緣部分WE連接於晶圓部分WD與太鼓環TR之間,太鼓環TR能將太鼓晶圓W之邊緣部分WE支撐住,可大幅度降低太鼓晶圓W在極薄時所產生的翹曲。以下藉由圖2至圖5介紹本發明之太鼓晶圓環形切割製程方法。Figure 1 is a schematic diagram of an embodiment of the Taiko polishing process of the present invention. Please refer to FIG. 1, in this embodiment, the Taiko wafer ring cutting process method can be used for the Taiko wafer W formed by the backside grinding (BG) process of wafer thinning. As shown in FIG. 1, the
圖2為本發明之置放太鼓晶圓於平台上一實施例的示意圖。圖3A為本發明之雷射光束對太鼓晶圓進行環形切割的示意圖。圖3B為圖3A中太鼓晶圓的示意圖。圖3C為圖3A中對太鼓晶圓進行環形切割之局部示意圖。圖3D為圖3A之太鼓晶圓經切割後的晶圓部分的示意圖。圖4A為本發明之太鼓晶圓之晶圓部分黏貼於框架上的示意圖。圖4B為圖4A之太鼓晶圓之晶圓部分黏貼於框架上的俯視示意圖。圖5為本發明之太鼓晶圓環形切割製程方法的流程圖。本發明之太鼓晶圓環形切割製程方法S100包括以下步驟S110至步驟S130,首先,如圖2所示,進行步驟S110,置放一太鼓晶圓W於一平台50上,其中太鼓晶圓W包括一晶圓部分WD、一邊緣部分WE以及一太鼓環TR。詳細而言,上述置放太鼓晶圓W於平台50上的步驟中,包括以下步驟:定位太鼓晶圓W在平台50之位置,以圖2為例,置放多個定位部52在平台50之上,使定位部52抵靠於太鼓晶圓W之太鼓環TR,藉此定位與固定太鼓晶圓W的位置。本實施例不對如何固定太鼓晶圓W的手段加以限制,舉例而言,平台50可為一真空吸附平台,換言之,本發明可利用真空吸附使太鼓晶圓W固定於平台50上。FIG. 2 is a schematic diagram of an embodiment of placing Tai drum wafers on a platform according to the present invention. 3A is a schematic diagram of circular cutting of Tai drum wafers by laser beams of the present invention. 3B is a schematic diagram of the Tai drum wafer in FIG. 3A. 3C is a partial schematic diagram of circular cutting of the Tai drum wafer in FIG. 3A. FIG. 3D is a schematic diagram of the wafer portion of the Tai drum wafer of FIG. 3A after being cut. FIG. 4A is a schematic diagram of the wafer portion of the Taiko wafer of the present invention attached to the frame. FIG. 4B is a schematic top view of the wafer portion of the Taiko wafer of FIG. 4A attached to the frame. FIG. 5 is a flow chart of the ring-cutting process method for Tai drum wafers of the present invention. The ring-cutting process method S100 of Tai drum wafers of the present invention includes the following steps S110 to S130. First, as shown in FIG. 2, step S110 is performed, and a Tai drum wafer W is placed on a
接著,進行步驟S120,利用一雷射光束L對太鼓晶圓W進行環形切割,如圖3A所示,本發明可提供一雷射模組60,雷射模組60設置於平台50之上,且雷射模組60用以發射出雷射光束L。在本實施例中,設定太鼓晶圓W之中心至太鼓晶圓W之邊緣部分WE的距離為旋轉半徑,並可藉由雷射模組60內的偏光鏡,使雷射光束L可以依機台設定圖形去打,使得雷射光束L以太鼓晶圓W為中心旋轉,以切割太鼓晶圓W之邊緣部分WE(如圖3A或圖3C),由於太鼓晶圓W之邊緣部分WE被雷射光束切斷,使得與太鼓晶圓W之邊緣部分WE連接之太鼓環TR亦被切割,使得太鼓晶圓W之邊緣部分WE與太鼓環TR能夠分離於太鼓晶圓W之晶圓部分WD。接著,取下太鼓晶圓W之邊緣部分WE與太鼓環TR,剩下太鼓晶圓W之晶圓部分WD(如圖3D所示)。Next, proceed to step S120, using a laser beam L to perform circular cutting on the Tai drum wafer W. As shown in FIG. 3A, the present invention can provide a
接著,進行步驟S130,如圖4A與圖4B所示,將太鼓晶圓W之晶圓部分WD黏貼於一框架70上,框架70例如為一金屬框架。需說明的是,圖4A為了便於說明膠帶80與晶圓部分WD與框架70之位置,故圖式將框架70放在晶圓部分WD之下,膠帶80黏貼於晶圓部分WD與框架70之上,實際上是框架70與膠帶80分別位於晶圓部分WD之上、下兩側,框架70置放在晶圓部分WD之上,膠帶80黏貼於晶圓部分WD與框架70之下。詳細而言,將太鼓晶圓W之晶圓部分WD黏貼於框架70上的步驟中,包括以下步驟:取下太鼓晶圓W之邊緣部分WE與太鼓環TR之後,置放框架70於晶圓部分WD上。接著,黏貼一膠帶80於晶圓部分WD與框架70之上,以將晶圓部分WD固定在框架70上。換言之,本步驟即進行框架貼裝製程(frame mount process),採用單面具有黏著劑的膠帶80,膠帶80為一切割膠帶(dicing tape),以將晶圓部分WD黏貼在切割用之框架70上。Next, proceed to step S130. As shown in FIGS. 4A and 4B, the wafer portion WD of the Tai drum wafer W is pasted on a
綜上所述,在本發明之太鼓晶圓環形切割製程方法中,使用雷射切割方式取代傳統刀片切割,並藉由調整雷射光束來改善切割後邊緣微缺角(Micro-chip)及提升太鼓環切良率。To sum up, in the Taiko wafer ring-cutting process method of the present invention, the laser cutting method is used to replace the traditional blade cutting, and the laser beam is adjusted to improve the micro-chip and micro-chip after cutting. Improve the yield rate of Taiko ring cutting.
再者,為了改善太鼓環取下時連動膠帶拉扯造成晶邊裂痕的異常現象,本發明在製造流程上變更為先進行雷射環切(Laser Ring Cutting)作業來切斷太鼓環,再進行框架貼裝製程(frame mount process),而不會有前述拉扯膠帶造成晶邊裂痕的異常現象。Moreover, in order to improve the abnormal phenomenon of crystal edge cracks caused by the pulling of the belt when the Taiko ring is removed, the present invention changes the manufacturing process to first perform the Laser Ring Cutting operation to cut the Taiko ring, and then perform the frame During the frame mount process, there will be no abnormal phenomenon of crystal edge cracks caused by pulling the tape.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make slight changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.
圖1為本發明之太鼓研磨製程一實施例的示意圖。 圖2為本發明之置放太鼓晶圓於平台上一實施例的示意圖。 圖3A為本發明之雷射光束對太鼓晶圓進行環形切割的示意圖。 圖3B為圖3A中太鼓晶圓的示意圖。 圖3C為圖3A中對太鼓晶圓進行環形切割之局部示意圖。 圖3D為圖3A之太鼓晶圓經切割後的晶圓部分的示意圖。 圖4A為本發明之太鼓晶圓之晶圓部分黏貼於框架上的示意圖。 圖4B為圖4A之將太鼓晶圓之晶圓部分黏貼於框架上的俯視示意圖。 圖5為本發明之太鼓晶圓環形切割製程方法的流程圖。 Figure 1 is a schematic diagram of an embodiment of the Taiko polishing process of the present invention. FIG. 2 is a schematic diagram of an embodiment of placing Tai drum wafers on a platform according to the present invention. 3A is a schematic diagram of circular cutting of Tai drum wafers by laser beams of the present invention. 3B is a schematic diagram of the Tai drum wafer in FIG. 3A. 3C is a partial schematic diagram of circular cutting of the Tai drum wafer in FIG. 3A. FIG. 3D is a schematic diagram of the wafer portion of the Tai drum wafer of FIG. 3A after being cut. FIG. 4A is a schematic diagram of the wafer portion of the Taiko wafer of the present invention attached to the frame. FIG. 4B is a schematic top view of the wafer portion of the Taiko wafer in FIG. 4A being pasted on the frame. FIG. 5 is a flow chart of the ring-cutting process method for Tai drum wafers of the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108124214A TWI716931B (en) | 2019-07-10 | 2019-07-10 | Taiko wafer ring cut process method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108124214A TWI716931B (en) | 2019-07-10 | 2019-07-10 | Taiko wafer ring cut process method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202103227A TW202103227A (en) | 2021-01-16 |
TWI716931B true TWI716931B (en) | 2021-01-21 |
Family
ID=75234776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108124214A TWI716931B (en) | 2019-07-10 | 2019-07-10 | Taiko wafer ring cut process method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI716931B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113172778A (en) * | 2021-04-28 | 2021-07-27 | 华虹半导体(无锡)有限公司 | Taizhou ring removing method and positioning device for Taizhou ring removing |
CN114582713B (en) * | 2022-03-11 | 2023-01-24 | 江苏京创先进电子科技有限公司 | Wafer processing method and wafer processing apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160155656A1 (en) * | 2013-10-15 | 2016-06-02 | Mitsubishi Electric Corporation | Semiconductor-element manufacturing method and wafer mounting device |
US20170301571A1 (en) * | 2016-04-18 | 2017-10-19 | Disco Corporation | Wafer processing method |
-
2019
- 2019-07-10 TW TW108124214A patent/TWI716931B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160155656A1 (en) * | 2013-10-15 | 2016-06-02 | Mitsubishi Electric Corporation | Semiconductor-element manufacturing method and wafer mounting device |
US20170301571A1 (en) * | 2016-04-18 | 2017-10-19 | Disco Corporation | Wafer processing method |
Also Published As
Publication number | Publication date |
---|---|
TW202103227A (en) | 2021-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3368876B2 (en) | Semiconductor chip manufacturing method | |
TWI609418B (en) | Method for manufacturing semiconductor device and wafer mounting apparatus | |
TWI455215B (en) | Semiconductor package and manufacturing method thereof | |
TWI524404B (en) | Packaging substrate processing methods | |
US9123795B2 (en) | Method of manufacturing semiconductor wafers | |
TWI716931B (en) | Taiko wafer ring cut process method | |
EP2827362A1 (en) | Vacuum suction stage, semiconductor wafer dicing method, and semiconductor wafer annealing method | |
US20090142991A1 (en) | Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method | |
JP2012069747A (en) | Semiconductor device and method of manufacturing the same | |
JP2009141276A (en) | Semiconductor device and its manufacturing method | |
JP5197037B2 (en) | Wafer processing method for processing a wafer on which bumps are formed | |
TW201903870A (en) | Wafer cutting method eliminating cracks generated during grinding and stress of the wafer, ensuring that the wafer does not crack due to the stress and guaranteeing the quality of the wafer, and increasing the yield of the chips | |
US7498236B2 (en) | Silicon wafer thinning end point method | |
US11551923B2 (en) | Taiko wafer ring cut process method | |
JP3514712B2 (en) | Semiconductor wafer backside grinding machine | |
TWI644774B (en) | a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate | |
JP2002043254A (en) | Dicing apparatus and dicing method | |
TW201308411A (en) | Wafer dicing method to avoid thinned wafer breaking | |
TWI234234B (en) | Method of segmenting a wafer | |
JP2007251098A (en) | Manufacturing method of semiconductor chip | |
JP2007019478A (en) | Method of dicing wafer, dicing apparatus, and semiconductor device | |
TWI603393B (en) | Manufacturing method of semiconductor device | |
TWM615029U (en) | Wafer with hierarchical edge | |
JP2010093005A (en) | Processing method of wafer | |
JP3798760B2 (en) | Method for forming semiconductor wafer |