TWI715411B - Electrical connection components - Google Patents

Abstract

An electrical connection assembly, which mainly includes a rigid insulator and a plurality of electrical connection units. The multiple electrical connection units are detachably installed in the insulator in a distributed manner. The two ends of the electrical connection unit are respectively exposed on opposite sides of the insulator. An electrical connection unit includes at least one conductive adhesive element. The conductive adhesive element includes a gel and a conductive body arranged in the gel. The conductive body can be electrically transferred from one end in the height direction to the other end. In the semiconductor object inspection operation, the electrical connection assembly not only provides the transition object of the electrical connection inspection system, and utilizes its high workable stroke ratio to easily achieve the coplanarity required for semiconductor object testing, and can establish extremely short The conduction path is tested to meet high-frequency test requirements. At the same time, each electrical connection unit can be replaced individually, reducing maintenance costs, and the position and quantity of the electrical connection unit can be adjusted according to the semiconductor object to be tested.

Description

Electrical connection components

The present invention relates to an electrical connection component, and particularly refers to a semiconductor object inspection field such as integrated circuit components, wafers or chips, as an adapter object for electrical connection between the semiconductor object and the inspection system.

At present, in the inspection field of semiconductor objects such as integrated circuit components, wafers or chips, in order to prevent the circuit carrier of the inspection system from being damaged by the continuous pressing of multiple semiconductor objects to be tested, or the circuit carrier and the circuit are switched The components are damaged by pressing and contacting for a long time. Generally speaking, replaceable electrical connection components are usually arranged on the circuit carrier of the detection system, and the electrical connection components are used as the connection between the circuit carrier and the semiconductor object under test. The electrical connection medium, or the use of the electrical connection member as the electrical connection medium between the circuit carrier board and the circuit conversion member.

Taking the detection of integrated circuit components as an example, the existing electrical connection components installed on the circuit carrier of the detection system are generally divided into two types: probe type electrical connection components and conductive film type electrical connection components. As shown in Figures 20 and 21, as far as the conductive film is concerned, its structure is a one-piece structure, where as shown in Figure 20, the whole piece of gold powder conductive film 50 has a large number of gold powder scattered in its colloid, or, As shown in FIG. 21, during the forming and manufacturing process of the whole piece of gold powder conductive film 50A, a large number of gold powders are dispersed in a plurality of specific parts of the gel by the control of a magnetic field to form a plurality of spaced columnar conductive gels 51A. .

As shown in Figures 20 and 21, the whole piece of gold powder conductive film 50, 50A is combined with a test base and mounted on the circuit carrier 60. After the integrated circuit component 40 to be tested is moved directly above the test base, Then drive the contact 41 of the integrated circuit component to be tested down to contact the upper surface of the gold powder conductive film 50, or the contact 41 of the integrated circuit component to be tested 40 to drop to the cylindrical guide contacting the upper surface of the gold powder conductive film 50A Electric colloid 51A, and continue to apply the following pressure to make the contact 41 of the integrated circuit component 40 to be tested press against the gold powder conductive film 50 or gold powder conductive film 50A columnar conductive gel 51A, gold powder conductive film 50 or gold powder conductive film The 50A columnar conductive gel 51A is deformed under pressure, so that the multiple contacts 41 of the integrated circuit component 40 to be tested are electrically connected to the circuit carrier 60 through the gold powder at the corresponding position in the gold powder conductive film 50, or the gold powder conductive film 50A The columnar conductive glue 51A is electrically connected to the circuit carrier 60, and the inspection system performs functional inspection operations on the integrated circuit component 40 to be tested through the circuit carrier 60 and the gold powder conductive films 50, 50A.

However, when the whole piece of gold powder conductive film is used as the electrical connection member, there are the following problems in the inspection of integrated circuit components:

1. The working stroke ratio is low: because the gold powder conductive gel sheet is a single piece of single component, when the whole gold powder conductive film is piezoelectrically connected by the contact of the integrated circuit element, it is conductive The colloids in the film are interlocked with each other and cannot move down completely freely, and the conductive film will be pushed around due to the pressure of multiple contacts of the integrated circuit component at the same time, making any adjacent gold powder conductive film The pressure points will be affected by the interference of each other, so that the gold powder conductive film has the problem of low working line ratio.

2. The coplanarity problem that is not conducive to the test of integrated circuit components: In the context of the above, the proportion of the working stroke of the gold powder conductive film when it is contacted by piezoelectricity is low. Therefore, the gold powder It is difficult for the conductive film to meet the requirement of co-planar pressure and electrical contact between the multiple contacts of the integrated circuit component, and it cannot ensure that each contact of the integrated circuit component presents a good electrical contact with the circuit carrier through the gold powder conductive adhesive Status, it is easy to affect the detection effect and accuracy of integrated circuit components.

3. It is not conducive to establishing a very short test conduction path, and it is difficult to meet the requirements of high-frequency testing: continuing from the above, due to the low working stroke ratio of the entire gold powder conductive film, in order to achieve better electrical transfer performance, It is necessary to increase the working stroke ratio of the whole gold powder conductive film, so the whole gold powder conductive film is The thickness needs to be relatively increased, resulting in a longer test conduction path, which is not conducive to establishing an extremely short test conduction path, and it is difficult to meet the requirements of high-frequency testing.

4. The whole piece of gold powder conductive film must be replaced, and the maintenance cost is high: the whole piece of gold powder conductive film is a single object formed in one piece. When it is used for a period of time in the inspection operation of integrated circuit components, the whole piece of gold powder conductive film When a certain part is damaged due to repeated pressures, the entire piece of gold powder conductive film needs to be completely replaced, which has the problem of high maintenance costs.

5. The production cost of the whole piece of gold powder conductive film is high: because the whole piece of gold powder conductive film is a single object formed in one piece, its area must be at least larger than the distribution range of most of the contact points of the integrated circuit component to be tested, so the whole piece of gold powder conductive film The model is too large, and a larger mold must be used to make it with a fixture, so the production cost is high.

Furthermore, in the current wafer inspection field, the probe card uses most of the probes in the probe head as a medium for the electrical connection of one or more chip units in the wafer, and another circuit The adapter board serves as an electrical connection component between the circuit carrier board of the probe card and the probe head. However, the aforementioned combination of the circuit transfer board and the probe head connected between the wafer to be tested and the circuit carrier board has a complex structure and high precision requirements for the probe head used. If you want to shorten the test conduction path, Higher production costs must be paid, and maintenance costs are relatively high.

The purpose of the present invention is to provide an electrical connection assembly, which solves the problem of coplanarity that needs to be overcome when the existing monolithic gold powder conductive film is used in the testing of integrated circuit components due to the low working stroke ratio, which is not conducive to the testing of integrated circuit components. It is not conducive to establishing an extremely short test conduction path and difficult to meet the requirements of high-frequency testing, requiring the replacement of the entire gold powder conductive film, high maintenance costs, and high manufacturing costs.

In order to achieve the foregoing objective, the electrical connection assembly proposed by the present invention includes: A rigid insulator having a plurality of installation holes penetrating along the height direction and arranged at intervals; and a plurality of electrical connection units respectively detachably installed in the plurality of installation holes of the insulator, The opposite ends of the height direction of the electrical connection unit are respectively exposed on two opposite sides of the insulator, each of the electrical connection units includes at least one conductive adhesive element, and the conductive adhesive element includes a colloid and a colloid arranged inside the colloid. The conductor, and the conductor of the conductive adhesive element can be electrically transferred from one end of the electrical connection unit in the height direction to the other end.

By using the aforementioned electrical connection components to construct the invention, when applied to the inspection of semiconductor objects such as integrated circuit components, it has at least the following effects:

1. Increase the ratio of workable stroke: The electrical connection assembly of the present invention uses a hard insulator to produce a partition-like isolation around each electrical connection unit. Any two electrical connection units are not linked to each other, so when each electrical connection unit is When the adhesive element receives the contact pressure from the integrated circuit element, the conductive adhesive element can directly produce downward deformation and be electrically conducted, so it has a relatively high work stroke ratio.

2. Comply with the coplanar plane required for testing of integrated circuit components: continuing from the above, the electrical connection assembly of the present invention has a relatively high workable stroke ratio. Therefore, during the testing process of the integrated circuit component, the electrical connection assembly can meet the requirements The multiple contacts of the integrated circuit component are coplanar against the demand for electrical contact, thereby ensuring that each contact of the integrated circuit component can exhibit good electrical contact with the circuit carrier through the corresponding electrical connection unit , To ensure the detection effect and accuracy of integrated circuit components.

3. A very short test conduction path can be established to meet the requirements of high-frequency testing: continuing from the above, the electrical connection assembly of the present invention has a higher ratio of workable stroke. Compared with the existing monolithic gold powder conductive film, the electrical connection assembly of the present invention The connecting component can meet the electrical connection purpose of the integrated circuit component testing with a small height size, so a very short test conduction path can be established to meet the high-frequency test requirements.

4. Each electrical connection unit can be replaced individually to reduce maintenance costs: as mentioned above, the electrical connection assembly of the present invention adopts a combination structure of a hard insulator and multiple electrical connection units, and uses electrical connection units As an interface for electrical contact of integrated circuit components, each electrical connection unit is independently and detachably installed in the insulator, and each electrical connection unit can be replaced individually, so the maintenance cost can be effectively reduced.

5. The miniaturized electrical connection unit has low manufacturing cost and is easy to control the quality: the electrical connection assembly of the present invention adopts a combination structure of a hard insulator and a plurality of electrical connection units, wherein each electrical connection unit is one or multiple in series The small conductive adhesive components can be manufactured with only a small mold, the production cost is low, and the quality of each conductive adhesive component can be easily achieved.

6. The electrical connection unit can be adjusted according to the position and quantity of the contact points of the circuit components to be integrated: as mentioned above, the electrical connection assembly of the present invention adopts a combination structure of a hard insulator and multiple electrical connection units, so it is a hard insulator The position of the multiple mounting holes can be designed to be suitable for the contacts of a plurality of different types of integrated circuit components, so that when the electrical connection assembly is used, it can be adjusted according to the position and number of the contacts of the circuit components to be integrated. The electrical connection unit is arranged in a position in the insulator.

The electrical connection assembly of the present invention may further include a circuit board with a circuit. The circuit has a plurality of first contacts arranged at intervals on the first surface of the circuit board, and a plurality of intervals on the second surface of the circuit board. Arranged second contacts, and each of the second contacts corresponds to the first contact in a one-to-one correspondence, the rigid insulation system is provided on the second surface of the circuit board, and each second The contacts are respectively located in the corresponding mounting holes of the hard insulator, and each second contact is in electrical contact with the corresponding electrical connection unit.

The distribution density of the plurality of the first contacts in the aforementioned circuit board is the same as the distribution density of the plurality of the second contacts, and each of the first contacts is in position with the corresponding second contact relatively. Alternatively, the plurality of first contacts are distributed in a low density, and the plurality of second contacts are distributed in a high density.

With the composition structure of the aforementioned electrical connection assembly, the electrical connection assembly of the present invention can be applied to wafer inspection operations as an electrical connection medium between the wafer and the circuit carrier of the inspection system. In this, the electrical connection component is installed on the bottom of the circuit carrier of the detection system, and the first contact of the circuit board of the electrical connection component is used to electrically connect the circuit on the circuit carrier, and the electrical connection component The multiple electrical connection units are used as the medium for electrical contact of the contacts on the wafer to be tested, so that the inspection system can perform inspection operations on the wafer to be tested through the electrical connection components, and use the structure of the electrical connection components to achieve High working stroke ratio, co-planarity required for multiple contacts during wafer testing, very short test conduction path can be established or impedance matching in the circuit to meet the requirements of wafer high frequency testing, each electrical connection unit can be individually Replacement to reduce maintenance costs, miniaturized electrical connection units have low manufacturing costs, and can adjust the electrical connection units according to the position and quantity of the wafers to be tested.

1, 1A, 1B: electrical connection components

10, 10A, 10B: insulator

101: first side

102: second side

11, 11A, 11B: mounting holes

111: recess

12: Guide slope

13: recess

14: colloid

20A, 20B, 20C, 20D, 20E, 20F, 20G, 20H: electrical connection unit

21A, 21B, 21C, 21D, 21E, 21F, 21G, 21H: conductive adhesive components

211D, 211E: first end

212D, 212E: second end

30A, 30B: circuit board

301: first board

302: second board

31A, 31B: the first contact

32A, 32B: second contact

40: Integrated circuit components

41: Contact

50, 50A: Gold powder conductive film

51A: Columnar conductive colloid

60, 60A: circuit carrier board

70: Wafer to be tested

71: Contact

FIG. 1 is a three-dimensional schematic diagram of a preferred embodiment of the electrical connection assembly of the present invention.

FIG. 2 is a partial three-dimensional exploded schematic view of a preferred embodiment of the electrical connection assembly shown in FIG. 1. FIG.

3 to 10 are respectively partial side sectional views of other preferred embodiments of the electrical connection unit in the electrical connection assembly of the present invention.

Fig. 11 is a schematic bottom plan view of a preferred embodiment of the electrical connection assembly of the present invention.

Figure 12 is a bottom perspective schematic view of a preferred embodiment of the electrical connection assembly of the present invention.

FIG. 13 is a schematic bottom plan view of a preferred embodiment of the electrical connection assembly shown in FIG. 12.

Fig. 14 is a reference diagram of the use state of the electrical connection assembly shown in Figs. 1 to 3 applied to the inspection of integrated circuit components.

FIG. 15 is a reference diagram of the use state of the electrical connection assembly shown in FIG. 6 applied to the inspection of integrated circuit components.

Fig. 16 is a schematic plan view of a preferred embodiment of an additional circuit board for the electrical connection assembly of the present invention.

FIG. 17 is a schematic plan view of another preferred embodiment of adding a circuit board to the electrical connection assembly of the present invention.

18 is a reference diagram of the use state of the preferred embodiment of the electrical connection assembly of the present invention shown in FIG. 16 applied to wafer inspection operations.

19 is a reference diagram of the use state of the preferred embodiment of the electrical connection assembly of the present invention shown in FIG. 17 applied to wafer inspection operations.

FIG. 20 is a reference diagram of the use state of the existing whole piece of gold powder conductive film applied to the inspection operation of integrated circuit components.

FIG. 21 is a reference diagram of another existing whole piece of gold powder conductive film applied to the use state of the inspection operation of integrated circuit components.

According to the technical means disclosed in the foregoing invention, the present invention proposes a variety of specific feasible and preferred embodiments for implementation. As shown in FIGS. 1 to 3, it discloses a preferred embodiment of the electrical connection assembly of the present invention. As can be seen from the drawing, the electrical connection assembly 1 includes a rigid insulator 10 and a plurality of electrical connection units 20A.

As shown in the preferred embodiment shown in FIGS. 1 to 3, the insulator 10 is a rigid board with a predetermined thickness made of insulating material. The thickness of the insulator 10 is set according to the use requirements of the product. The two opposite sides of the insulator 10 There are a first side surface 101 and a second side surface 102 respectively. The insulator 10 has a plurality of mounting holes 11, and the mounting holes 11 penetrate from the first side surface 101 of the insulator 10 to the second side surface 102.

As shown in Figures 1 to 3, in the aforementioned insulator 10, the positions of the multiple mounting holes 11 are based on the arrangement of the contacts (such as spherical contacts or pins, etc.) of the integrated circuit component to be tested And set. The distribution positions of the plurality of mounting holes 11 may be suitable for a single type of integrated circuit component, or the distribution positions of the plurality of mounting holes 11 may be suitable for a plurality of different types of integrated circuit components.

As shown in FIGS. 1 to 3, a plurality of the electrical connection units 20A are respectively set in a plurality of the installation holes 11 of the insulator 10, and each electrical connection unit 20A is installed in one installation hole 11. in. Wherein, the electrical connection unit 20A can be positioned on the insulator by means of tight fit or friction. In the mounting hole 11 of 10, or the electrical connection unit 20A can also be positioned in the mounting hole 11 of the insulator 10 by a positioning structure. The electrical connection unit 20A can be individually and detachably installed in the installation hole 11 of the insulator 10.

As shown in FIGS. 3 to 10, the electrical connection units 20A, 20B, 20C, 20D, 20E, 20F, 20G, and 20H include at least one conductive adhesive element 21A, 21B, 21C, 21D, 21E, 21F, 21G, 21H As shown in FIGS. 8 to 10, when the conductive adhesive elements 21F, 21G, 21H are plural, the electrical connection units 20F, 20G, 20H are the plurality of conductive adhesive elements 21F, 21G, 21H in series Become. Each of the conductive adhesive elements 21A, 21B, 21C, 21D, 21E, 21F, 21G, 21H includes a colloid and a conductor arranged inside the colloid, and the electrical connection units 20A, 20B, 20C, 20D, 20E, 20F, 20G, and 20H have the function of electrically transmitting from one end of the height direction to the other through the conductor, and the electrical connection unit 20A, 20B, 20C, 20D, 20E, 20F, 20G, 20H has the function of electrical transmission in the height direction The opposite ends are respectively exposed on the first side 101 and the second side 102 of the insulator 10, and can provide electrical connections. The conductor can be a combination of a plurality of conductive particles or at least one conductive wire. The conductive adhesive elements 21A, 21B, 21C, 21D, 21E, 21F, 21G, and 21H have the characteristics of electrical transmission, and can be compressed and recovered elasticity by the colloid.

As shown in FIGS. 1 to 3, the insulator 10 and the electrical connection unit 20A in the electrical connection assembly of the present invention can be implemented by at least the following various preferred embodiments, but it is not limited to the following preferred embodiments.

As shown in the preferred embodiment shown in FIGS. 3 to 4, the electrical connection units 20A, 20B, and 20C have a conductive adhesive element 21A, 21B, 21C, and the conductive adhesive elements 21A, 21B, 21C are respectively round spheres , Cylinders, squares, polygonal cylinders, etc., as shown in the preferred embodiment shown in FIG. 5, the conductive adhesive element 21C can also form a cone at one or both ends of the cylinder in the height direction, or the conductive adhesive The element 21C can also form an angle at one or both ends of the height direction of the square or polygonal cylinder cone. The mounting hole 11 of the insulator 10 may be a straight hole, and the edge of one or both ends of the mounting hole 11 may form a guide slope 12 to facilitate the conductive adhesive elements 21A, 21B of the electrical connection units 20A, 20B, 20C , 21C is installed in the installation hole 11.

As shown in the preferred embodiment in FIGS. 6 and 7, the electrical connection unit 20D, 20E has a conductive adhesive element 21D, 21E, and the conductive adhesive element 21D, 21E includes a first end 211D, 211E and A second end 212D, 212E at one end of the first end 211D, 211E in the height direction, the cross-sectional area of the first end 211D, 211E is larger than the cross-sectional area of the second end 212D, 212E, wherein the second end 212D, 212E can be a cylinder or a polygonal cylinder, etc., the first end portions 211D, 211E can be a semi-spherical block, a circular block, or a polygonal block, etc., and the mounting hole 11 of the insulator 10 has a larger aperture. The stepped perforation of the recess 111 can correspondingly accommodate the conductive adhesive elements 21D and 21E.

As shown in the preferred embodiment shown in Figures 8 to 10, the electrical connection units 20F, 20G, and 20H are a series combination of two conductive adhesive elements 21F, 21G, 21H, and the conductive adhesive elements 21F, 21G, 21H can It is a round sphere, a semi-circular sphere or a block, etc., and the two conductive adhesive elements 21F, 21G, 21H can be the same or different combinations. In the preferred embodiment shown in FIG. 9, the two semi-spherical conductive adhesive elements 21G are in contact with each other with their curved surfaces. In the preferred embodiment shown in FIG. 10, two block-shaped conductive adhesive elements 21H are in contact with each other with their end surfaces, and one end of the block-shaped conductive adhesive element 21H facing the other block-shaped conductive adhesive element 21H forms a convex portion 211H , And the end surface of the convex portion 211H as the contact surface.

As shown in FIGS. 3, 6 and 11 to 13, when the electrical connection unit 20A, 20D is positioned in the mounting hole 11 of the insulator 10 by a positioning structure, the positioning structure may be a gel 14 As shown in FIG. 11 and FIG. 13, the glue 14 can be bonded to the entire circumference or part of the circumference of one end of the electrical connection unit 20A.

As shown in Figures 3, 6 and 11, it is attached to one side or opposite sides of the insulator 10 to form a recess 111 at the end of the mounting hole 11, and the gel 14 constituting the positioning structure is filled in the recess. The conductive adhesive elements 21A, 21D are positioned in and adhered to the periphery.

As shown in Figs. 12 and 13, a concave portion 13 is formed between the adjacent mounting holes 11 on one side surface of the insulator 10, and the concave portion 13 communicates with the edge of the adjacent mounting hole 11, The glue 14 constituting the positioning structure is filled in the recess 13, and the glue 14 extends to the mounting hole 11 to adhere the conductive glue element 20A to be positioned.

Regarding the use of the electrical connection assembly of the present invention, it is installed on the circuit carrier of the inspection system to provide an electrical connection medium for the integrated circuit component to be tested electrically connected to the inspection system. In order to facilitate the detailed description of the use of the electrical connection assembly of the present invention, the preferred embodiment shown in FIG. 3 and FIG. 6 is used as the main body of the description below, and the usage of other preferred embodiments is deduced by analogy.

As shown in Figures 14 and 15, the electrical connection assembly 1 is directly or in combination with a test base (not shown) mounted on the circuit carrier 60 of the inspection system. The electrical connection units 20A and 20D respectively electrically contact corresponding contacts in the circuit of the circuit carrier 60. Secondly, move the integrated circuit component 40 to be tested above the electrical connection assembly 1, and apply a vertical downward pressure to the integrated circuit component 40 to be tested to make the integrated circuit component 40 to be tested Each contact 41 is pressed against the end of the corresponding electrical connection unit 20A, 20D in the electrical connection assembly 1, and the pressure of the gel in the conductive adhesive element 21A, 21D of each electrical connection unit 20A, 20D is Under the action of the deformation, and the circuit of the circuit carrier 60 is electrically connected through the conductors in the gel, the detection system can perform functional testing of the integrated circuit element 40 to be tested through the circuit carrier 60 and the electrical connection assembly 1 operation. Until the inspection operation is completed, the integrated circuit component 40 that has been inspected is removed, and the inspection operation of the next integrated circuit component 40 to be tested is performed.

From the foregoing description, as shown in FIGS. 3, 6, and 13 to 15, the electrical connection assembly 1 of the present invention utilizes a combination structure including a rigid insulator 10 and a plurality of electrical connection units 20A, 20D, and a plurality of The electrical connection units 20A, 20D are detachably installed in a plurality of spaced installation holes in the insulator 10. The two ends of the electrical connection units 20A, 20D are respectively exposed on opposite sides of the insulator 10, and each electrical connection The units 20A, 20D include at least one conductive adhesive element 21A, 21D, the conductive adhesive element The components 21A, 21D include a colloid and a conductor arranged in the colloid. The conductor can be electrically transferred from one end to the other end in the height direction. It can be applied to the inspection operation of integrated circuit element 40. The electrical connection assembly 1 can not only provide a transfer medium for the integrated circuit element 40 to be electrically connected to the circuit carrier 60 of the inspection system, but also use a hard insulator 10 An isolation effect like a partition wall is generated around each electrical connection unit 20A, 20D, so that when each conductive adhesive element 21A, 21D receives a downward pressure from the contact 41 of the integrated circuit element 40, the conductive adhesive element 21A, 21D can directly produce downward deformation and conduct electrical conduction. It has a high workable stroke ratio, which makes it easy to achieve the co-planarity required by multiple contacts when testing the integrated circuit element 40, and can establish a very short test conduction path It meets the high-frequency test requirements of integrated circuit components, and each electrical connection unit 20A, 20D can be replaced individually, reducing maintenance costs.

The electrical connection assembly of the present invention can also be applied to wafer inspection operations as an electrical connection medium between the circuit carrier board and the wafer to be tested in the wafer inspection system. As shown in FIGS. 16 and 17, the electrical connection assembly includes a circuit board 30A, 30B, a rigid insulator 10, and a plurality of electrical connection units 20A.

The circuit boards 30A, 30B are respectively a first board surface 301 and a second board surface 302 on opposite sides in the height direction, and the circuit boards 30A, 30B have a circuit on the circuit boards 30A, 30B. The first board surface 301 of 30B forms a plurality of spaced first contacts 31A, 31B, and the circuit forms a plurality of spaced second contacts 32A, 32B on the second board surface 302 of the circuit boards 30A, 30B Each of the second contacts 32A, 32B has a one-to-one correspondence with the first contacts 31A, 31B.

In the aforementioned circuit boards 30A, 30B, the number and position distribution of the plurality of first contacts 31A, 31B are set according to the number and position of the contacts of the circuit carrier in the wafer inspection system. The number and position distribution of the second contacts 32A and 32B are set according to the number and positions of the contacts of a chip unit or multiple chip units of the wafer to be tested. In the preferred embodiment shown in FIG. 16, the distribution density of the plurality of first contacts 31A may be the same as the distribution density of the plurality of second contacts 32A, that is, the first contacts The distance between 31A is equal to the second contact 32A The distance between each of the first contact and the corresponding second contact is relatively, so that the circuit in the circuit board 30A can establish a very short test conduction path to conform to the wafer or chip Unit high frequency test requirements. Alternatively, in the preferred embodiment shown in FIG. 17, the plurality of first contacts 31B are distributed in a low density, and the plurality of second contacts 32B are distributed in a high density, that is, a plurality of the The distribution density of the first contacts 31B in a unit area is smaller than the distribution density of the plurality of second contacts 32B in a unit area, and the spacing between the first contacts 31B is greater than that of the second contacts 32B The distance between the circuits enables the circuits in the circuit board 30B to provide the function of circuit redistribution, and impedance matching can be made in the circuits, so that the circuits can meet the high-frequency test requirements of wafers or chip units. In the preferred embodiment shown in FIG. 17, the impedance matching in the circuit board 30B is related to the prior art of circuit board manufacturing, and will not be repeated here.

The hard insulators 10A, 10B are provided on the second board surface 302 of the circuit boards 30A, 30B. In a preferred embodiment, the hard insulators 10A, 10B are second boards formed on the circuit boards 30A, 30B. The insulating layer of the surface 302, the rigid insulator 10A, 10B forms a mounting hole 11A, 11B on the second board surface 302 of the circuit board 30A, 30B relative to each second contact 32A, 32B, respectively. Each of the electrical connection units 20A is respectively assembled and positioned in the plurality of mounting holes 11A, 11B of the hard insulator 10A, 10B, and each electrical connection unit 20A is associated with the first in the corresponding position of the circuit board 30A, 30B. The two contacts 32A and 32B are in electrical contact.

Regarding the shape and structure of the electrical connection unit, the combination of the electrical connection unit 20A and the rigid insulators 10A, 10B, and the structure in which the electrical connection unit 20A is further positioned in the rigid insulator by using a positioning structure, are as before The contents disclosed in FIG. 1 to FIG. 14 are revealed, and will not be repeated here.

Regarding the use of the electrical connection assembly of the present invention applied to wafer inspection operations, the electrical connection assembly is used as an electrical connection medium between the wafer and the circuit carrier of the inspection system, as shown in Figures 18 and 19, which are Install the electrical connection components 1A, 1B on the bottom of the circuit carrier 60A of the detection system, The first contacts 31A, 31B of the circuit boards 30A, 30B of the electrical connection components 1A, 1B are used to electrically connect the circuits in the circuit carrier 60A, and the electrical connection units 1A, 1B are used to electrically connect the multiple electrical connection units. 20A is used as a medium for electrical contact with the contacts 71 on the wafer 70 to be tested.

As shown in FIGS. 18 and 19, when the wafer 70 to be tested is pushed to the bottom of the electrical connection components 1A, 1B, the multiple contacts 71 on the wafer 70 to be tested are connected to the electrical connection components 1A, 1B, respectively. The electrical connection unit 20A at the corresponding position in the middle is in electrical contact, so that the wafer inspection system can perform functional inspection operations on the wafer 70 to be tested via the circuit carrier 60A and the electrical connection components 1A, 1B. In addition, the electrical connection assembly 1A, 1B utilizes the conductive adhesive element 21A of the electrical connection unit 20A to be a combined structure that is detachably installed in the rigid insulators 10A, 10B, so that it can be connected to the wafer 70 to be tested. The position and number of points 71 adjust the distribution state of the electrical connection unit 20A.

When the electrical connection assembly of the present invention is applied to wafer inspection operations, as shown in FIG. 18 and FIG. 19, the electrical connection assembly 1A, 1B can be used as the electrical connection between the circuit carrier 60A of the inspection system and the wafer 70 to be tested. The connection medium uses the circuit boards 30A, 30B to electrically connect the circuit carrier 60A, and uses the conductive adhesive elements 21A of the plurality of electrical connection units 20A in the hard insulators 10A, 10B distributed on the bottom surfaces of the circuit boards 30A, 30B as the standby Test the electrical contact elements of the multiple contacts 71 of the wafer 70, and use the hard insulators 10A, 10B on the bottom surface of the circuit boards 30A, 30B to isolate each electrical connection unit 20A, so that each conductive adhesive element 21A When the force is applied from the contact 71 of the wafer 70 to be tested that is pushed up, each conductive adhesive element 21A can directly deform and be electrically conducted. With a higher ratio of workable stroke, the test is achieved. The multiple contacts 71 in the wafer 70 need to be coplanar during testing, and can establish a very short test conduction path or impedance matching design of the circuit board to meet the wafer high-frequency test requirements, and each electrical connection unit 20A can be replaced individually, reducing maintenance costs.

10: Insulator

101: first side

102: second side

11: Installation hole

12: Guide slope

20A: Electrical connection unit

Claims (14)

An electrical connection assembly, comprising: a hard insulator with a plurality of installation holes penetrating along the height direction and arranged at intervals; a plurality of electrical connection units are respectively detachably installed on the plurality of insulators Each of the mounting holes, each of the electrical connection units includes at least one conductive glue element, the conductive glue element includes a glue and a conductor arranged inside the glue, and the conductor of the conductive glue element can be free One end of the height direction of the electrical connection unit is electrically transmitted to the other end; and a circuit board with a circuit. The circuit board has a first board surface and a second board surface on opposite sides of the circuit board in the height direction. The circuit forms a plurality of spaced first contacts on the first surface of the circuit board, and the circuit forms a plurality of spaced second contacts on the second surface of the circuit board, each of the second The contacts and the first contacts are in a one-to-one correspondence; the hard insulator is provided on the second board surface of the circuit board, and the plurality of mounting holes of the hard insulator respectively correspond to the first The position of the two contacts, and each of the electrical connection units is in electrical contact with the second contact in the corresponding position on the circuit board. The electrical connection assembly according to claim 1, wherein each of the first contacts of the circuit board is opposite to the corresponding second contacts. The electrical connection assembly according to claim 1, wherein the plurality of first contacts of the circuit board are distributed in low density, and the plurality of second contacts are distributed in high density. The electrical connection assembly according to any one of claims 1 to 3, wherein the electrical connection unit is positioned in the installation hole of the insulator by tight fit or friction. The electrical connection assembly according to any one of claims 1 to 3, wherein the electrical connection unit is positioned in the installation hole of the insulator by a positioning structure. The electrical connection assembly according to claim 5, wherein the insulator forms a recess at the hole end of the mounting hole, and the positioning structure is filled with the adhesive in the recess and is positioned by adhering the conductive adhesive element. The electrical connection assembly according to claim 5, wherein the insulator forms a recessed portion between the adjacent mounting holes, and the recessed portion communicates with the edge of the adjacent mounting hole, and the positioning structure is The glue is filled in the concave portion, and the glue extends to the mounting hole to adhere the conductive glue element to be positioned. The electrical connection component according to any one of claims 1 to 3, wherein the conductor is a combination of a plurality of conductive particles or at least one conductive wire. The electrical connection assembly according to any one of claims 1 to 3, wherein the electrical connection unit has a conductive adhesive element, and the conductive adhesive element is a sphere, cylinder, cube, or polygonal cylinder. The electrical connection assembly according to any one of claims 1 to 3, wherein the conductive adhesive element is a cylinder, a square or a polygonal cylinder, and one or both ends of the height direction form a cone. The electrical connection assembly according to any one of claims 1 to 3, wherein the electrical connection unit has a conductive adhesive element, and the conductive adhesive element includes a first end and a height direction of the first end. A second end at one end, the cross-sectional area of the first end is larger than the cross-sectional area of the second end, the second end is a cylinder or a polygonal cylinder, and the first end is a semi-spherical block , A circular block or a polygonal block, the mounting hole is a stepped perforation that can correspondingly accommodate the conductive glue element. The electrical connection assembly according to any one of claims 1 to 3, wherein the electrical connection unit is a series combination of two conductive adhesive elements, and the conductive adhesive elements are spheres, semi-circular spheres or blocks, and two The conductive adhesive elements are the same or different. The electrical connection assembly according to claim 12, wherein the two conductive adhesive elements of the electrical connection unit are in the shape of a semicircle and are in contact with each other by their arc surfaces. The electrical connection assembly according to claim 13, wherein the two conductive adhesive elements of the electrical connection unit are block-shaped, and their end surfaces are in contact with each other, and one of the block-shaped conductive adhesive elements faces the other. A convex portion is formed at one end of the conductive adhesive element, and the end surface of the convex portion contacts the end surface of the other block-shaped conductive adhesive element.

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