TWI714148B - Soft and hard board bonding structure and manufacturing method thereof - Google Patents

Abstract

A soft and hard board bonding structure includes a protective layer, a component layer, an etching retention layer and a glass layer. The component layer is disposed on the protective layer. The etch-retaining layer is disposed on the element layer, and the top surface of the etch-retaining layer has a stepped structure. The glass layer is disposed on the etch-retaining layer adjacent to the stepped structure. The invention also provides a manufacturing method of the above soft and hard board bonding structure.

Description

Flexible and hard board combined structure and manufacturing method thereof

The invention relates to a flexible-hard board combination structure and manufacturing method, particularly a flexible-hard board combination structure and a manufacturing method with a broken step inside the rigid-flex board combination.

With the development of science and technology, the application of electronic products has gradually diversified, and the demand for the structure of the combination of soft and hard boards has gradually increased. For example, smart moving devices have recently launched flexible structures.

Traditionally, the following situations may occur when cutting hard boards set on soft boards. If cutting with physical force, besides breaking itself due to stress concentration, the transmission of shearing force also causes the soft boards. Cracking. However, if the part of the hard board is removed by etching, it may happen that the etching rate is slow, which is not conducive to production, and secondly, there may be residual hard boards remaining on the soft board, which is also unfavorable to production and affects production. Yield rate.

Therefore, to provide a structure of a rigid and flexible board and a manufacturing method thereof, which can solve the above-mentioned problems, is a subject that the relevant industry in this field needs to study.

In view of this, an embodiment of the present invention provides a method for fabricating a rigid-flex board combination structure, which includes the following steps: providing a glass layer, the glass layer including a processing surface and an opposite stacking surface; and arranging an etching acceleration layer on one of the stacking surfaces On the part; set the etching retention layer, covering the glass layer and the etching acceleration layer, the peeling strength between the etching retention layer and the stacking surface is greater than the peeling strength of the etching acceleration layer and the stacking surface; setting the component layer on the etching retention layer; setting The protective layer is on the component layer; a part of the processing surface defines the pre-etching processing area. The pre-etching processing area is located in the projection area of the etching acceleration layer projected on the processing surface in the vertical direction, and the surface treatment step is performed on the pre-etching processing area And the etching step, etching from the processing surface, in which a part of the etching acceleration layer is removed, so that a stepped structure is formed between the etching acceleration layer and the etching retention layer, and the residual glass layer located above the etching acceleration layer is separated from the etching Acceleration layer.

In the method for manufacturing the flexible and rigid board combination structure as described above, in one embodiment, in the etching step, all of the etching acceleration layer is also removed, and the stepped structure is formed on the etching reserve layer.

In the manufacturing method of the flexible and rigid board bonding structure as described above, in one embodiment, the surface treatment step includes attaching a glue film to the part outside the pre-etching treatment area, destroying the pre-etching treatment area by laser, and using a knife At least one of the pre-etched processing areas is destroyed by the way of marks.

In the manufacturing method of the flexible and rigid board combination structure as described above, in one embodiment, during the etching step, the etched part of the glass layer on the etching reserve layer forms a curved structure.

The manufacturing method of the flexible and rigid board combination structure as described above, in one embodiment, further includes a removing step of removing the etching acceleration layer and the part of the etching reserve layer with the stepped structure, so that the remaining etching reserve layer is located on the glass The layer is projected in the vertical direction within the projected area on the top surface of the element layer.

In the manufacturing method of the flexible and rigid board combination structure as described above, in one embodiment, the thickness of the etching acceleration layer ranges from 100 to 2000 Å (Angstrum); the thickness of the etching retention layer ranges from 100 to 10000 Å (Angstrum). between.

Flex plate manufacturing method described above, the structure of the binding, in one embodiment, a peel angle of 180 ^o, the peeling strength between the retaining layer and etching the stack bearing surface is greater than 600gf / inch; acceleration layer etched surface provided with hydrazoic The peel strength is less than 100gf/inch.

In the manufacturing method of the flexible and rigid board combination structure as described above, in one embodiment, the etching step is wet etching or vapor etching.

The present invention also provides a flexible and rigid board combination structure, which includes a protective layer, a component layer, an etching retention layer and a glass layer. The component layer is arranged on the protective layer; the etching reserve layer is arranged on the component layer, and the top surface of the etching reserve layer has a stepped structure; the glass layer is arranged on the etching reserve layer and is adjacent to the stepped structure.

In the above-mentioned flexible and rigid board combination structure, in one embodiment, the thickness of the etching retention layer ranges from 100 to 10000 Å (Angstrum).

In the above-mentioned flexible and rigid board combination structure, in one embodiment, the side of the glass layer adjacent to the stepped structure has a curved structure.

The above-mentioned rigid-flex board combination structure, in one embodiment, further includes an etching acceleration layer located on the stepped structure. The length of the etching acceleration layer in the horizontal direction is equal to the length of the stepped structure, and the thickness of the etching acceleration layer is less than the stepped structure. The thickness of the structure.

In the above-mentioned flexible and rigid board combination structure, in one embodiment, the thickness of the etching acceleration layer ranges from 100 to 2000 Å (Angstrum).

The above-mentioned flexible and rigid board bonding structure, in one embodiment, further includes another glass layer, wherein the stepped structure is located in the center of the etching reserve layer, and the glass layer is adjacent to both sides of the stepped structure.

Through one or more of the above embodiments, the manufacturing method of the flexible and rigid board bonding structure of the present invention does not directly cut the glass layer, and performs surface treatment on the processing surface of the glass layer to form different etching rates, while thinning and cutting The glass layer. In addition, an etching retention layer and an etching acceleration layer are provided to generate different etching rates through different peel strengths between them and the glass layer to completely eliminate the glass layer remaining due to etching. In this way, the problems encountered by the prior art can be solved.

Please refer to FIG. 1 to FIG. 2H. FIG. 1 is a flowchart of an embodiment of a manufacturing method of the rigid-flex board structure 100. FIG. 2A is a schematic diagram of step S1 in the embodiment shown in FIG. 1. FIG. 2B is a schematic diagram of step S2 of the embodiment shown in FIG. 1. FIG. 2C is a schematic diagram of step S3 of the embodiment shown in FIG. 1. FIG. 2D is a schematic diagram of step S4 of the embodiment shown in FIG. 1. FIG. 2E is a schematic diagram of step S5 of the embodiment shown in FIG. 1. FIG. 2F is a schematic diagram of step S6 in the embodiment shown in FIG. 1. FIG. 2G is a schematic diagram of step S7 of the embodiment shown in FIG. 1. FIG. 2H is a schematic diagram of step S7 of an embodiment of the manufacturing method of the rigid-flex board structure 100.

An embodiment of the present invention provides a method for manufacturing a rigid-flex board combination structure 100. The rigid-flex board combined structure 100 includes at least a rigid board portion and a flexible board portion adjacent to the rigid board portion. The rigid board portion is, for example, the glass layer 11 described below, and the soft board portion has flexibility to facilitate bending to fit the internal space configuration of the electronic device, such as the component layer 14 described below. The manufacturing method includes the following steps:

Step S1: A glass layer 11 is provided. The glass layer 11 includes a processing surface 11a and an opposite overlapping surface 11b, as shown in FIG. 2A.

Step S2: setting the etching acceleration layer 12 on a part of the stacking surface 11b, as shown in FIG. 2B.

Step S3: setting an etching retention layer 13 to cover the glass layer 11 and the etching acceleration layer 12, as shown in FIG. 2C. The peeling strength between the etching retention layer 13 and the stacking surface 11b is greater than the peeling strength between the etching acceleration layer 12 and the stacking surface 11b.

Step S4: Disposing the device layer 14 on the etching reserve layer 13. The device layer 14 includes one or more stacked layers. As shown in FIG. 2D, the device layer 14 includes a buffer layer 141 (or barrier layer ( Barrier), thin film transistor array 142, light emitting diode packaging layer 143.

Step S5: Disposing a protective layer 15 on the device layer 14. The protective layer 15 protects the outer surface of the device layer 14 from being damaged or etched, as shown in FIG. 2E.

Step S6: Define a pre-etching processing area in a part of the processing surface 11a, the pre-etching processing area is located in the projection area A'of the etching acceleration layer 12 projected on the processing surface 11a in the vertical direction, and perform surface treatment in the pre-etching processing area Step, the surface treatment step can be to attach a glue film (not shown in the figure) to the area outside the pre-etching area, or to destroy the pre-etching area by laser, or to make a knife mark Ways to destroy the area treated before etching. As shown in FIG. 2F, in this embodiment, the pre-etching treatment area is destroyed by a knife mark.

The purpose of the above step S6 is to etch the glass layer 11 from the processed surface 11a at a different rate when the subsequent etching step is performed. For example, in the glass layer 11, because the glue film is attached to a place other than the area before the etching, the etching The pre-treatment area (that is, the part where the adhesive film is not attached) has a faster etching rate, and the pre-treatment area that is damaged by the scribe mark (increase the etching area) has a faster downward etching rate than other undamaged areas and is lasered The part of the damaged part of the structure changes and has a faster etching rate. In this way, the effect of accelerating the etching of a specific area (flexible and hard board combination structure 100) can be achieved, in particular, the etching acceleration layer 12 can be etched as quickly as possible.

Please refer to FIG. 2G to perform the etching step of step S7. The etching step may be isotropic etching, such as wet etching or vapor etching, which is not limited in the present invention. It should be noted that only one element layer 14 is used here, and the glass layer 11 is taken as the first layer. The etching is performed from the processing surface 11a, wherein a part of the etching acceleration layer 12 is removed, so that a stepped structure 131 is formed between the etching acceleration layer 12 and the etching retention layer 13, and a residual glass layer located above the etching acceleration layer 12 11' is separated from the etching acceleration layer 12, so that the remaining glass layer 11' on the manufacturing process can be completely removed.

Please refer to FIG. 2H, which is also illustrated by a component layer 14. The difference from the above embodiment is that the etching acceleration layer 12 is arranged in the center of the glass layer 11. After etching, the central residual glass layer 11' will fall off due to the etching of a part of the etching acceleration layer 12, leaving the glass on both sides Layer 11.

In some embodiments, according to the needs of the user, in the etching step, all of the etching acceleration layer 12 is further removed, so that the stepped structure 131 is formed on the etching reserve layer 13. In other words, the user can choose to keep a part of the accelerated etching layer or remove all of the accelerated etching layer, depending on the applicable field of the rigid-flex board combination structure 100.

The above-mentioned accelerated etching layer, in some embodiments, is a compound of oxygen, and in one embodiment, is SiOX. In another embodiment, it is MoOX. To accelerate the selection of the material of the etching layer, in addition to the lower peel strength, the characteristic of faster etching rate (faster than the etching rate of the glass layer 11) may also be included.

Please refer to Figure 2G and Figure 2H again. As shown in these figures, during the etching step, due to isotropic etching, the etched part of the glass layer 11 on the etching reserve layer 13 forms a curved structure 111. The curved structure 111 may be convex. Round or concave arc (please refer to Figure 4), that is, side etching will occur in the glass layer 11 to form the convex or concave curved structure 111, depending on the user's choice of etching method and etching The setting of the speed and the required combination of rigid and flexible board structure 100 are determined.

Please refer to Figure 3 to Figure 5. 3 and 4 are schematic diagrams of step S7 in an embodiment of the manufacturing method of the rigid-flex board structure 100 according to the present invention. The difference is that part or all of the etching acceleration layer 12 is removed by etching. In the embodiment of FIG. 3, the length of the etching acceleration layer 12 in the horizontal direction is equal to the length of the step structure 131, and the thickness of the etching acceleration layer 12 is less than the thickness of the step structure 131.

FIG. 5 is a schematic diagram of step S8 in an embodiment of the manufacturing method of the rigid-flex board structure 100 of the present invention. As in the embodiment shown in FIG. 3 or FIG. 4, step S8 is further performed. Step S8 is to remove the etching acceleration layer 12 and the part of the etching reserve layer 13 having the stepped structure 131, so that the remaining etching reserve layer 13 is located The glass layer 11 is projected on the projection area A of the top surface of the element layer 14 in the vertical direction.

That is to say, whether to remove the etching acceleration layer 12 and the part of the etching reserve layer 13 with the stepped structure 131 is still based on the needs of the industry, using different etching methods and performing step S8.

In some embodiments, the thickness of the etching acceleration layer 12 can be controlled within the range of 100 to 2000 Å (Angstrum); the thickness of the etching retention layer 13 can be controlled within the range of 100 to 10000 Å (Angstrum).

In addition, in some embodiments, in order to distinguish the etching speed to achieve the purpose of removing the residual glass layer 11, under the condition of a peeling angle of 180°, the peeling strength between the etching remaining layer 13 and the laminated surface 11b is greater than 600gf/inch The peeling strength of the etching acceleration layer 12 and the overlapping surface 11b is less than 100gf/inch. In a preferred embodiment, the peel strength between the etching acceleration layer 12 and the overlapping surface 11b is less than 20 gf/inch.

In other words, the present invention achieves the purpose of different etching speeds of the etching retention layer 13 and the etching acceleration layer 12 through the above-mentioned difference in peel strength, so that the glass that may traditionally remain on the accelerated etching layer can be completely removed.

Please refer to FIG. 6 and FIG. 7, which are schematic diagrams of an embodiment of the rigid-flex board combination structure 100 of the present invention. As mentioned above, the side of the glass layer 11 adjacent to the stepped structure 131 has a curved structure 111. The curved structure 111 may be a convex circle or a concave arc. Under the condition that the curved structure 111 is convex, the part of the laminated layer under the glass layer 11 that protrudes laterally from the curved structure 111 can be bent in the first direction D1, as shown in FIG. 6. Under the condition that the curved structure 111 is a concave arc, the part of the laminated layer under the glass layer 11 that protrudes laterally from the curved structure 111 can be bent in the second direction D2. Different curved structures 111 are used depending on the needs of users, as shown in FIG. 7.

In addition, in the embodiment shown in FIG. 6, assuming that the thickness of the glass layer 11 is T and there is a side line L on the side of the glass layer 11, the distance W1 of the etching acceleration layer 12 beyond the side line L in the lateral direction is 0 -2T. In a preferred embodiment, W1=0.5T.

In the embodiment shown in FIG. 7, the distance W2 of the etching acceleration layer 12 from the edge line L is in the range of 0-1T. In a preferred embodiment, W2=0T.

For the thickness range of the etching acceleration layer 12 and the etching retention layer 13, please refer to the description in the relevant paragraphs above, and will not be repeated here.

Please refer to FIG. 2H again. The rigid-flex board bonding structure 100 produced in this embodiment also includes another glass layer 11, the stepped structure 131 is located in the center of the etching reserve layer 13, and the glass layer 11 (not including the etching The residual glass layer 11 ′) is adjacent to both sides of the stepped structure 131 respectively. With this flexible and rigid board combination structure 100, the two glass layers 11 can be bent in a manner facing each other.

Through one or more of the above embodiments, the manufacturing method of the flexible and rigid board bonding structure of the present invention does not directly cut the glass layer, and performs surface treatment on the processing surface of the glass layer to form different etching rates, while thinning and cutting The glass layer prevents the shear stress from directly causing the glass layer and component layer to split.

In addition, an etching retention layer and an etching acceleration layer are provided to generate different etching rates through different peel strengths between them and the glass layer to completely eliminate the glass layer remaining due to etching. In this way, the problems encountered by the prior art can be solved.

In addition, in some embodiments, with the etching acceleration layer, the glass layer undergoes lateral etching to form a curved structure, and the industry can select the soft board part (the bending direction of the etching acceleration layer, the etching retention layer, the component layer, and the protection layer). In addition, the combination of rigid and flexible boards has the advantages of improving heat resistance and reducing deformation in back-end applications.

100: Flexible and hard board combined structure 11: Glass layer 11’: Residual glass layer 11a: processed surface 11b: Overlay surface 111: Curved structure 12: Etching acceleration layer 13: Etching retention layer 131: Stepped Structure 14: component layer 141: buffer layer 142: Thin Film Transistor Array 143: LED encapsulation layer 15: protective layer A: Projected area A’: Projected area D1: First direction D2: second direction L: Sideline T: thickness of glass layer W1: distance W2: distance S1: Provide glass layer S2: Set the etching acceleration layer on a part of the laminated surface of the glass layer S3: Set the etching retention layer, covering the glass layer and the etching acceleration layer S4: Set the component layer on the etching reserve layer S5: Set a protective layer on the component layer S6: Define the pre-etching treatment area in a part of the processed surface of the glass layer, and perform surface treatment on the pre-etching treatment area S7: Perform the etching step S8: Perform the removal step.

[Fig. 1] is a flowchart of an embodiment of the manufacturing method of the rigid-flex board structure of the present invention. [Fig. 2A] is a schematic diagram of step S1 in the embodiment shown in Fig. 1. [Fig. 2B] is a schematic diagram of step S2 in the embodiment shown in Fig. 1. [Fig. [Fig. 2C] is a schematic diagram of step S3 in the embodiment shown in Fig. 1. [Fig. 2D] is a schematic diagram of step S4 in the embodiment shown in Fig. 1. [Fig. 2E] is a schematic diagram of step S5 in the embodiment shown in Fig. 1. [Fig. 2F] is a schematic diagram of step S6 in the embodiment shown in Fig. 1. [Fig. 2G] is a schematic diagram of step S7 in the embodiment shown in Fig. 1. [Fig. 2H] is a schematic diagram of step S7 in an embodiment of the manufacturing method of the rigid-flex board combination structure of the present invention. [Fig. 3] is a schematic diagram of step S7 in an embodiment of the manufacturing method of the rigid-flex board combination structure of the present invention. [Fig. 4] is a schematic diagram of step S7 in an embodiment of the manufacturing method of the rigid-flex board combination structure of the present invention. [Fig. 5] is a schematic diagram of step S8 in an embodiment of the manufacturing method of the rigid-flex board combination structure of the present invention. [Figure 6] is a schematic diagram of an embodiment of the rigid-flex board combination structure of the present invention. [Figure 7] is a schematic diagram of an embodiment of the rigid-flex board combination structure of the present invention.

100: Flexible and hard board combined structure

11: Glass layer

111: Curved structure

12: Etching acceleration layer

13: Etching retention layer

131: Stepped Structure

14: component layer

15: protective layer

D1: First direction

L: Sideline

T: thickness of glass layer

W1: distance

Claims (14)

A method for manufacturing a rigid-flex board combination structure: providing a glass layer, the glass layer including a processing surface and an opposite stacking surface; arranging an etching acceleration layer on a part of the stacking surface; arranging an etching retention layer Covering the glass layer and the etching acceleration layer, the peeling strength between the etching retention layer and the stacking surface is greater than the peeling strength of the etching acceleration layer and the stacking surface; disposing a component layer on the etching retention layer; Disposing a protective layer on the element layer; defining a pre-etching processing area in a part of the processing surface, the pre-etching processing area being located in the projection area of the etching acceleration layer projected on the processing surface in a vertical direction, Perform a surface treatment step in the etching pretreatment area; and an etching step, etching from the processing surface, wherein a part of the etching acceleration layer is removed, so that the etching acceleration layer and the etching retention layer are formed between A stepped structure, and the residual glass layer located above the etching acceleration layer is separated from the etching acceleration layer. The manufacturing method of the rigid-flex board combination structure according to claim 1, wherein in the etching step, all of the etching acceleration layer is also removed, and the stepped structure is formed on the etching retention layer. The method for manufacturing a rigid-flex board combination structure according to claim 1, wherein the surface treatment step includes attaching an adhesive film to a part other than the etching pre-treatment area, destroying the etching pre-treatment area by laser, and At least one of the pre-etching processing areas is destroyed by the method of scoring. The manufacturing method of the rigid-flex board combination structure according to claim 1, wherein in the etching step, the etched part of the glass layer on the etching reserve layer forms a curved structure. The manufacturing method of the rigid-flex board combination structure according to claim 4, further comprising a removing step of removing the etching acceleration layer and the part of the etching reserve layer having the stepped structure, so that the remaining etching reserve layer Located in the projection area of the glass layer on a top surface of the element layer in the vertical direction. The manufacturing method of the rigid-flex board combination structure according to claim 1, wherein the thickness of the etching acceleration layer ranges from 100 to 2000 Å (Angstrum); the thickness of the etching retention layer ranges from 100 to 10000 Å (Angstrum). between. The soft and hard plate according to item 1 binding request structure manufacturing method, wherein a peel angle of 180 ^o, the retaining layer and etching the peeling strength between the surface of the stack is provided greater than 600gf / inch; accelerate the etching layer and the stack The peel strength of the surface is less than 100gf/inch. The manufacturing method of the flexible and rigid board bonding structure according to claim 1, wherein the etching step is wet etching or vapor etching. A rigid-flex board combination structure comprising: a protective layer; an element layer arranged on the protective layer; an etching reserve layer arranged on the element layer, and a top surface of the etching reserve layer has a stepped structure; And a glass layer arranged on the etching reserve layer and adjacent to the stepped structure. The rigid-flex board combination structure according to claim 9, wherein the thickness of the etching retention layer ranges from 100 to 10000 Å (Angstrum). The rigid-flex board combination structure according to claim 9, wherein the side of the glass layer adjacent to the stepped structure has a curved structure. The rigid-flex board combination structure according to claim 11, further comprising an etching acceleration layer located on the stepped structure, the length of the etching acceleration layer in a horizontal direction is equal to the length of the stepped structure, and the etching acceleration layer The thickness is smaller than the thickness of the stepped structure. The rigid-flex board combination structure according to claim 12, wherein the thickness of the etching acceleration layer ranges from 100 to 2000 Å (Angstrum). The rigid-flex board combination structure according to claim 9 or 12, further comprising another glass layer, wherein the stepped structure is located in the center of the etching reserve layer, and the glass layers are respectively adjacent to both sides of the stepped structure .

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