TWI710607B - 含有電洞載子化合物和聚合物酸的組成物，以及其用途 - Google Patents

含有電洞載子化合物和聚合物酸的組成物，以及其用途 Download PDF

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TWI710607B
TWI710607B TW105121705A TW105121705A TWI710607B TW I710607 B TWI710607 B TW I710607B TW 105121705 A TW105121705 A TW 105121705A TW 105121705 A TW105121705 A TW 105121705A TW I710607 B TWI710607 B TW I710607B
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弗洛安 迪凱伯
米歇爾 莎莎拉
埃琳娜 希娜
羅伯特 斯威爾
王菁
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日商日產化學工業股份有限公司
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TW105121705A 2015-07-17 2016-07-07 含有電洞載子化合物和聚合物酸的組成物，以及其用途 TWI710607B (zh)

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TWI710607B true TWI710607B (zh) 2020-11-21

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TW105121705A TWI710607B (zh) 2015-07-17 2016-07-07 含有電洞載子化合物和聚合物酸的組成物，以及其用途
TW105121870A TWI710608B (zh) 2015-07-17 2016-07-07 適合於在有機電子中使用的非水性組成物
TW105121710A TWI702261B (zh) 2015-07-17 2016-07-07 適用於有機電子產品之含有類金屬奈米粒子的非水性油墨組成物

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TW105121710A TWI702261B (zh) 2015-07-17 2016-07-07 適用於有機電子產品之含有類金屬奈米粒子的非水性油墨組成物

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US (1) US20180201800A1 (OSRAM)
EP (1) EP3325563A4 (OSRAM)
JP (2) JP6642694B2 (OSRAM)
KR (1) KR102648007B1 (OSRAM)
CN (1) CN107849377A (OSRAM)
TW (3) TWI710607B (OSRAM)
WO (1) WO2017014946A1 (OSRAM)

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JP6648762B2 (ja) * 2015-03-03 2020-02-14 日産化学株式会社 正孔輸送化合物とポリマー酸とを含有する組成物及びその使用
KR102850636B1 (ko) * 2015-12-28 2025-08-27 닛산 가가쿠 가부시키가이샤 유기 전자장치에 사용하기 위한 나노입자-전도성 중합체 복합체
JP7082984B2 (ja) * 2017-02-20 2022-06-09 ノヴァレッド ゲーエムベーハー 電子半導体デバイスおよびその電子半導体デバイスの製造方法および化合物
EP3364476B1 (en) * 2017-02-20 2024-06-05 Novaled GmbH Active oled display, method for preparing an active oled display and compound
WO2018235783A1 (ja) 2017-06-20 2018-12-27 日産化学株式会社 非水系インク組成物
JP6935699B2 (ja) * 2017-08-22 2021-09-15 富士通株式会社 半導体材料、ガスセンサ、ガス測定装置、半導体材料の製造方法および硫化水素濃度測定方法
KR20200132914A (ko) * 2018-03-15 2020-11-25 닛산 가가쿠 가부시키가이샤 전하수송성 조성물
KR102683952B1 (ko) * 2018-07-04 2024-07-12 닛산 가가쿠 가부시키가이샤 전하수송성 조성물
WO2020022211A1 (ja) * 2018-07-24 2020-01-30 日産化学株式会社 電荷輸送性組成物
JP7447793B2 (ja) 2018-09-25 2024-03-12 日産化学株式会社 インク組成物
US11851572B2 (en) * 2019-03-07 2023-12-26 Liquid X Printed Metals, Inc. Thermal cure dielectric ink
US11903304B2 (en) 2020-12-11 2024-02-13 Raynergy Tek Incorporation Photodiode comprising fluropolymer compound
EP4012793A1 (en) * 2020-12-14 2022-06-15 Raynergy Tek Incorporation Photodiode

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050124784A1 (en) * 2003-10-01 2005-06-09 Sotzing Gregory A. Substituted thieno[3,4-B]thiophene polymers, method of making, and use thereof
WO2009111339A1 (en) * 2008-02-29 2009-09-11 Plextronics, Inc. Planarizing agents and devices
TW201100480A (en) * 2009-03-12 2011-01-01 Du Pont Electrically conductive polymer compositions for coating applications
US8017241B2 (en) * 2006-07-21 2011-09-13 Plextronics, Inc. Sulfonation of conducting polymers and OLED, photovoltaic, and ESD devices
TW201329196A (zh) * 2011-10-04 2013-07-16 Plextronics Inc 用於電洞注射及傳送層之改良摻雜之方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10239715A (ja) * 1997-02-25 1998-09-11 Showa Denko Kk エレクトロクロミック素子
US7317047B2 (en) * 2002-09-24 2008-01-08 E.I. Du Pont De Nemours And Company Electrically conducting organic polymer/nanoparticle composites and methods for use thereof
JP5299017B2 (ja) * 2002-10-24 2013-09-25 住友化学株式会社 高分子化合物およびそれを用いた高分子発光素子
US6999222B2 (en) * 2003-08-13 2006-02-14 The Regents Of The University Of California Plasmon assisted enhancement of organic optoelectronic devices
US7455793B2 (en) * 2004-03-31 2008-11-25 E.I. Du Pont De Nemours And Company Non-aqueous dispersions comprising electrically doped conductive polymers and colloid-forming polymeric acids
EP2276788B1 (en) * 2008-04-11 2014-08-27 Plextronics, Inc. Doped conjugated polymers, devices, and methods of making devices
WO2009141903A1 (ja) * 2008-05-21 2009-11-26 パイオニア株式会社 有機発光素子
JP2010049210A (ja) * 2008-08-25 2010-03-04 Fujifilm Corp 塗布組成物、該塗布組成物の製造方法、透光性光散乱性膜、有機エレクトロルミネッセンス表示素子及び面状光源体
WO2010118370A1 (en) * 2009-04-10 2010-10-14 Plextronics, Inc. Dehalogenation
US20120097898A1 (en) * 2009-05-01 2012-04-26 Plextronices, Inc. Replacing aqueous with non-aqueous solvent
WO2012003485A2 (en) * 2010-07-02 2012-01-05 Plextronics, Inc. Hole transport compositions and related devices and methods (i)
JP2012252821A (ja) * 2011-06-01 2012-12-20 Konica Minolta Holdings Inc 透明電極および有機エレクトロルミネッセンス素子
WO2014073683A1 (ja) * 2012-11-12 2014-05-15 三菱化学株式会社 有機電界発光素子およびその製造方法
CN103531713B (zh) * 2013-07-05 2016-06-08 深圳清华大学研究院 无机纳米晶/共轭聚合物杂化太阳能电池的制备方法
WO2017014945A1 (en) * 2015-07-17 2017-01-26 Solvay Usa Inc. Non-aqueous ink compositions containing metallic nanoparticles suitable for use in organic electronics

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050124784A1 (en) * 2003-10-01 2005-06-09 Sotzing Gregory A. Substituted thieno[3,4-B]thiophene polymers, method of making, and use thereof
US8017241B2 (en) * 2006-07-21 2011-09-13 Plextronics, Inc. Sulfonation of conducting polymers and OLED, photovoltaic, and ESD devices
WO2009111339A1 (en) * 2008-02-29 2009-09-11 Plextronics, Inc. Planarizing agents and devices
TW201100480A (en) * 2009-03-12 2011-01-01 Du Pont Electrically conductive polymer compositions for coating applications
TW201329196A (zh) * 2011-10-04 2013-07-16 Plextronics Inc 用於電洞注射及傳送層之改良摻雜之方法

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