TWI708529B - Welding point with switch - Google Patents

Abstract

A solder joint with a toggle switch. Its structure uses a special SMD solder joint design, and is combined with the SMD solder paste coating area to form a toggle switch to replace the switching resistance element. It uses a special structure under the consideration of commonality of existing electronic products. The design of SMD solder joints can greatly reduce the number of electronic components used, and reduce the PCB size, making the product thinner and thinner, and achieve the purpose of cost reduction. At the same time, due to the design of the special SMD solder joints, the signal routing distance can be greatly shortened , And can shorten the redundant fan-out wiring, avoid the antenna effect and noise interference formed by the fan-out wiring, and improve the signal quality.

Description

Welding point with switch

The present invention relates to a solder joint with a switch. By using this special solder joint design, the purpose of sharing signals can be achieved without adding a large number of switching resistance elements, and the noise interference between the shared signals can be completely disconnected.

Press, the LVDS (Low-Voltage Differential Signaling) transmitter contains a current mode driver, which can provide about 3.5mA for the differential combined transmission line, while the LVDS receiver is equipped with a 100Ω end-point resistor, which can correspond to The impedance of the transmission line connecting the LVDS receiver and the driver, and the data transmission speed of LVDS is limited to 655Mbit/s within the standard specification. It is suitable for pixel 2K (1920x1080) signals, and is shown in Figure 1A. ) And a timing controller (IC101) are provided with multiple resistance elements (R1~R10), and use the LVDS transmission interface (CN1) to transmit the 2K signal to the timing controller (IC101); VBO (V- by-One®HS) adopts 8B10B conversion method to realize the clock embedding method. It is also a transmission method that converts 8bit data into 10bit. The data transmission speed of VBO is 600~4Gbit/s, which is suitable for pixel 4K (3840× 2160) signal, and shown in Figure 1B, a VBO transmission interface (CN2) and a timing controller (IC101) are provided with a complex number of capacitive elements (C1 ~ C16), and use the VBO transmission interface (CN2) The 4K signal is transmitted to the timing controller (IC101). In addition, the timing controller (IC101) is referred to as TCON for short.

Press the second time, as shown in Figure 2, the LVDS transmission interface (CN1), the resistance element (R1~R10), the VBO transmission interface (CN2), the capacitance element (C1~C16) and the timing controller (IC101) The advantages of the circuit board can be shared, but it must be combined with a plurality of switching resistor elements (R11~R30), which also results in the need to use a large number of resistor jumpers, the circuit board area is large, and the signal will be interfered by noise. Therefore, in view of the above-mentioned problems, the inventor conceived a solder joint with a switch, which is the subject to be solved by the present invention.

The main purpose of the present invention is to provide a solder joint with a switch, which uses the design of a special SMD solder joint and is combined with the SMD solder paste coating area to form a switch to replace the switching resistance element to solve the problems of the prior art , And further has the effect of reducing resistance jumpers, reducing circuit board area and reducing signal interference by noise.

To achieve the above objective, the technical means adopted by the present invention include: a printed circuit board on which a first set of soldering points, a second set of soldering points and a third set of soldering points are provided; it is characterized in that: The first group of solder joints has a group of routing and layer-changing vias and a first group of soldered copper foil areas. The first group of soldered copper foil areas set a first group of solder coating areas; the second group of solder joints , There is a second set of welding copper foil area, the second set of welding copper foil area is set to a second set of solder coating area, and the position of the second set of solder coating area is corresponding to that of the first set of welding points The position of the first group of solder coating areas of the first group of soldering copper foil areas; and the third group of soldering points has a third group of soldering copper foil areas, and the third group of soldering copper foil areas is set to a third group The solder coating area, and the position of the third group of solder coating areas corresponds to the position of the second group of solder coating areas of the second group of soldering copper foil areas of the second group of solder points; thereby, the first group The soldering point, the second group of soldering points and the third group of soldering points form a switch. When the first group of soldering copper foil areas of the first group of soldering points are soldered with the second group of solder coating areas After the second set of solder coating areas of the second set of soldered copper foil areas are turned on, the switch can be switched to the on state.

Another technical means of the present invention includes: a printed circuit board on which a first set of soldering points, a second set of soldering points and a third set of soldering points are provided; it is characterized in that: the first set of soldering points , Has a set of routing and layer-changing vias and a first set of soldering copper foil area, the first set of soldering copper foil area sets a first set of solder coating areas; the second set of soldering points has a second Group welding copper foil area, the second group of welding copper foil area is set to a second group of solder coating area, and the position of the second group of solder coating area is corresponding to the first group of soldering copper of the first group of soldering points The position of the first group of solder coating areas in the foil area; and the third group of soldering points have a third group of soldering copper foil areas, and the third group of soldering copper foil areas is set to a third group of solder coating areas, And the position of the third set of solder coating areas corresponds to the position of the second set of solder coating areas of the second set of soldering copper foil areas of the second set of soldering points, and is matched with the second set of soldering points of the second set of soldering points A resistance element is welded between the second group of solder coating areas in the copper foil area; thereby, the first group of solder points, the second group of solder points, and the third group of solder points form a switch, when the The first group of solder coating areas of the first group of soldering copper foil areas of the first group of soldering points and the second group of solder coating areas of the second group of soldering copper foil areas of the second group of soldering points are connected to make the The switch can be switched to the on state.

Another technical means of the present invention includes: a printed circuit board, on which a first set of soldering points, a second set of soldering points, and a third set of soldering points are arranged; characterized in that: the first set of soldering points , Has a set of routing and layer-changing vias and a first set of soldering copper foil area, the first set of soldering copper foil area sets a first set of solder coating areas; the second set of soldering points has a second Group welding copper foil area, the second group of welding copper foil area is set to a second group of solder coating area, and the position of the second group of solder coating area is corresponding to the first group of soldering copper of the first group of soldering points The position of the first group of solder coating areas in the foil area; and the third group of soldering points have a third group of soldering copper foil areas, and the third group of soldering copper foil areas is set to a third group of solder coating areas, And the position of the third set of solder coating areas corresponds to the position of the second set of solder coating areas of the second set of soldering copper foil areas of the second set of soldering points, and is matched with the second set of soldering points of the second set of soldering points A first capacitor element and a second capacitor element are welded between the second group of solder coating areas of the soldering copper foil area and the third group of soldering copper foil areas of the third group of soldering points ; In this way, the first set of welding points, the second set of welding points and the third set of welding points form a switch, when the first set of welding points of the first set of welding copper foil area of the first set of solder coating After the cloth zone and the second set of solder coating zone of the second set of soldering copper foil zone of the second set of welding points are non-conducting, the switch can be switched to the non-conducting state.

According to the aforementioned features, the conduction distance between the first set of welding points and the second set of welding points is 3-6 mils.

With the help of lifting technology, the present invention is applied to printed circuit board (PCB) layout and surface mount component (SMD) manufacturing process, and the structure is designed with special SMD solder joints, and then combined with SMD solder paste coating area to form a switch to Instead of switching resistor components, and under the existing electronic products in the shared consideration framework (shared PCB, IC, CON), the use of special SMD solder joint design can greatly reduce the number of electronic components used, and reduce the PCB size, making the product lighter and thinner The advantages of the white brand TCON board can reduce the cost of 20 switching resistors. At the same time, due to the design of the special SMD solder joints, the signal routing distance can be greatly shortened, and the redundant fan-out routing can be shortened , And avoid the antenna effect and noise interference formed by fan-out wiring, and improve the signal quality.

First of all, please refer to Figures 3A~6. A preferred embodiment of the solder joints with switch of the present invention includes: a printed circuit board 30 on which a first set of solder joints 40 and a second Set of welding points 50 and a third set of welding points 60. In this embodiment, the conduction distance (d) between the first set of welding points 40 and the second set of welding points 50 is 3-6 mils, but it is not limited Here.

The present invention is shown in FIGS. 3A and 3B, which disclose the first embodiment; FIGS. 4A, 4B, and 4C, which disclose the second embodiment; and FIGS. 5A, 5B and 5C, which disclose the third embodiment For example, the common features of the three embodiments include: the first set of solder joints 40 has a set of routing-change layer vias 41 and a first set of soldered copper foil areas 42 that 42 sets a first set of solder coating area (A); the second set of solder joints 50 has a second set of soldered copper foil area 51, and the second set of soldered copper foil area 51 sets a second set of solder Coating area (B), and the position of the second group of solder coating area (B) corresponds to the first group of solder coating area (A) of the first group of soldering points 40 of the first group of soldering copper foil area 41 The position; and the third set of solder joints 60 has a third set of soldered copper foil area 61, the third set of soldered copper foil area 61 is set to a third set of solder coating area (C), and the third The position of the group solder coating area (C) corresponds to the position of the second group solder coating area (B) of the second group of soldering copper foil area 51 of the second group of soldering points 50. Therefore, those who are technically interrelated and belong to a broad concept of invention, conform to the principle of unity, and will not be repeated.

In the first embodiment, the first set of welding points 40, the second set of welding points 50 and the third set of welding points 60 form a switch (SW1~SW10), and the switch (SW1~SW10) is mainly The resistors are not mounted, and the capacitors are not mounted, as shown in Figures 3A and 3B. In addition to explaining the common features mentioned above, the first set of solder coating areas (A) and the second set of solder coating areas ( B) is to apply the solder paste 70 respectively, when the first group of solder coating area (A) of the first group of soldering copper foil area 41 of the first group of solder joints 40 and the second group of the second group of solder joints 50 After the second set of solder coating area (B) of the soldering copper foil area 51 is turned on by applying solder paste, the switch (SW1~SW10) can be switched to the on state, and an LVDS transmission interface (CN1) is used to switch A 2K signal (S1) is sent to a timing controller (IC101).

In the second embodiment, the first set of welding points 40, the second set of welding points 50 and the third set of welding points 60 form a switch (SW1~SW10), and the switch (SW1~SW10) is mainly The upper part of the resistor and the upper part of the capacitor, as shown in Fig. 4A, Fig. 4B and Fig. 4C, in addition to explaining the above-mentioned common features, and cooperate with the second group of the second group of welding points 50 of the second group of welding copper foil area 51 A resistance element (R1~R10) is welded between the group of solder coating areas (B), and the first group of solder coating areas (A) and the second group of solder coating areas (B) need to be coated separately Solder paste, and after using a first open-hole steel plate 80A, the resistance element (R1~R10) can be surface-bonded between the second set of soldering points 50, when the first set of soldering points 40 of the first set The first group of solder coating areas (A) of the soldering copper foil area 41 and the second group of soldering copper foil areas (B) of the second group of soldering points 50 are coated with solder paste 70 After being turned on, the switch (SW1~SW10) can be switched to the on state, and a 2K signal (S1) is transmitted to a timing controller (IC101) using an LVDS transmission interface (CN1).

In the third embodiment, the first set of welding points 40, the second set of welding points 50 and the third set of welding points 60 form a switch (SW1~SW10), and the switch (SW1~SW10) is mainly The upper part of the resistance and the upper part of the capacitor, as shown in Figure 5A, Figure 5B and Figure 5C, in addition to explaining the above common features, and cooperate with the second set of welding points 50 of the second set of welding copper foil zone 51 A first capacitor element (C1, C3, C1, C3, C3, C3, C1, C3, C3, C3, C1, C3, C3, C3, C1, C3, C1, C3, C1, C3, C1, C3, C3) C5, C7, C9, C11, C13, C15) and a second capacitive element (C2, C4, C6, C8, C10, C12, C14, C16), need to be in the second set of solder coating area (B) and The third group of solder coating areas (C) are respectively coated with solder paste 70, and after using a second open-hole steel plate 80B, the first capacitor element (C1, C3, C5, C7, C9, C11, C13 , C15) and the second capacitive element (C2, C4, C6, C8, C10, C12, C14, C16) can be surface-mounted between the second set of welding points 50 and the third set of welding points 60, when The first group of solder coating area (A) of the first group of soldering copper foil area 41 of the first group of solder joints 40 and the second group of solder coating area (A) of the second group of soldering copper foil area 51 of the second group of soldering points 50 After the cloth zone (B) is non-conductive, the switch (SW1~SW10) can be switched to the non-conductive state, and a 4K signal (S2) is transmitted to a timing controller (IC101) using a VBO transmission interface (CN2) ).

Based on such a configuration, as shown in FIG. 6, the present invention is applied to printed circuit board (PCB) layout and surface mount device (SMD) manufacturing processes, and the timing controller (IC101) and the switch are laid out on the printed circuit board 30 The relative positions of the switches (SW1~SW10), the LVDS transmission interface (CN1), and the VBO transmission interface (CN2). The structure uses a special SMD solder joint design, and then matches the SMD solder paste coating area to form the switch ( SW1~SW10) to replace the switching resistor elements, and under the existing electronic products in the shared consideration framework (shared PCB, IC, CON), the use of special SMD solder joint design can greatly reduce the number of electronic components used, and reduce the PCB size , Which makes the product lighter and thinner, and achieves the purpose of cost reduction, and the white brand TCON board can reduce 20 switching resistance elements. At the same time, due to the design of the special SMD solder joints, the signal routing distance can be greatly shortened and shortened The redundant fan-out wiring can avoid the antenna effect and noise caused by the fan-out wiring to interfere with the signal quality and improve the signal quality.

To sum up, the technical means disclosed in the present invention do have the requirements of invention patents such as "novelty", "progressiveness" and "available for industrial use". I pray that the Jun Bureau will grant patents to encourage innovation without any responsibility. Sense of virtue.

However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention. Anyone familiar with the art should still include modifications or equivalent changes made in accordance with the spirit of the case in the scope of the patent application in this case.

30: printed circuit board

40: The first set of welding points

41: Route change layer via hole

42: The first group of welding copper foil area

50: The second set of welding points

51: The second group of welding copper foil area

60: The third set of welding points

61: The third group of welding copper foil area

70: solder paste

80A: The first opening steel plate

80B: second opening steel plate

A: The first group of solder coating area

B: The second group of solder coating area

C: The third group of solder coating area

R1~R10: resistance element

C1, C3, C5, C7, C9, C11, C13, C15: the first capacitive element

C2, C4, C6, C8, C10, C12, C14, C16: second capacitive element

SW1~SW10: switch

S1: 2K signal

S2: 4K signal

CN1: LVDS transmission interface

CN2: VBO transmission interface

IC101: timing controller

d: Conduction distance

Figure 1A is a traditional architecture diagram of a conventional single board with an LVDS transmission interface. Figure 1B is a traditional architecture diagram of a conventional single board with a VBO transmission interface. Figure 2 is a traditional architecture diagram of the conventional shared board with LVDS transmission interface and VBO transmission interface. FIG. 3A is a schematic diagram of the switch of the first embodiment of the present invention. FIG. 3B is a schematic diagram of transmitting 2K signals according to the first embodiment of the present invention. FIG. 4A is a schematic diagram of the switch-on of the second embodiment of the present invention. Fig. 4B is a design drawing of the welding point of the second embodiment of the present invention. FIG. 4C is a schematic diagram of the second embodiment of the present invention for transmitting 2K signals. Fig. 5A is a schematic diagram of a non-conducting switch of the third embodiment of the present invention. Fig. 5B is a design drawing of the solder joint of the third embodiment of the present invention. FIG. 5C is a schematic diagram of 4K signal transmission according to the third embodiment of the present invention. Figure 6 is a layout diagram of the printed circuit board of the present invention.

30: printed circuit board

40: The first set of welding points

41: Route change layer via hole

42: The first group of welding copper foil area

50: The second set of welding points

51: The second group of welding copper foil area

60: The third set of welding points

61: The third group of welding copper foil area

70: solder paste

A: The first group of solder coating area

B: The second group of solder coating area

C: The third group of solder coating area

d: Conduction distance

SW1: toggle switch

Claims (4)

A welding point with a switch, comprising: a printed circuit board on which a first set of welding points, a second set of welding points and a third set of welding points are arranged; characterized in that: the first set of welding points , Has a set of routing and layer-changing vias and a first set of soldering copper foil area, the first set of soldering copper foil area sets a first set of solder coating areas; the second set of soldering points has a second Group welding copper foil area, the second group of welding copper foil area is set to a second group of solder coating area, and the position of the second group of solder coating area is corresponding to the first group of soldering copper of the first group of soldering points The position of the first group of solder coating areas in the foil area; and the third group of soldering points have a third group of soldering copper foil areas, and the third group of soldering copper foil areas is set to a third group of solder coating areas, And the position of the third set of solder coating areas corresponds to the position of the second set of solder coating areas of the second set of soldering copper foil areas of the second set of soldering points; thereby, the first set of soldering points, the The two sets of welding points and the third set of welding points form a switch, when the first set of solder coating areas of the first set of soldering copper foil areas of the first set of welding points and the second set of soldering points of the second set of welding points After the second set of solder coating areas in the copper foil area are connected through the solder paste, the switch can be switched to the on state. A welding point with a switch, comprising: a printed circuit board on which a first set of welding points, a second set of welding points and a third set of welding points are arranged; characterized in that: the first set of welding points , Has a set of routing and layer-changing vias and a first set of soldering copper foil area, the first set of soldering copper foil area sets a first set of solder coating areas; the second set of soldering points has a second Group welding copper foil area, the second group of welding copper foil area is set to a second group of solder coating area, and the position of the second group of solder coating area is corresponding to the first group of soldering copper of the first group of soldering points The location of the first set of solder coating area in the foil area; and The third group of soldering points has a third group of soldering copper foil area, the third group of soldering copper foil area is set to a third group of solder coating area, and the position of the third group of solder coating area is corresponding The position of the second group of solder coating area of the second group of soldering copper foil area of the second group of soldering points, and between the second group of solder coating areas of the second group of soldering copper foil area of the second group of soldering points A resistance element is welded; thereby, the first set of welding points, the second set of welding points, and the third set of welding points form a switch, when the first set of welding points of the first set of welding copper foil area After the first set of solder coating areas and the second set of soldering copper foil areas of the second set of soldering points are connected through the solder paste, the switch can be switched to the on state. A welding point with a switch, comprising: a printed circuit board on which a first set of welding points, a second set of welding points and a third set of welding points are arranged; characterized in that: the first set of welding points , Has a set of routing and layer-changing vias and a first set of soldering copper foil area, the first set of soldering copper foil area sets a first set of solder coating areas; the second set of soldering points has a second Group welding copper foil area, the second group of welding copper foil area is set to a second group of solder coating area, and the position of the second group of solder coating area is corresponding to the first group of soldering copper of the first group of soldering points The position of the first group of solder coating areas in the foil area; and the third group of soldering points have a third group of soldering copper foil areas, and the third group of soldering copper foil areas is set to a third group of solder coating areas, And the position of the third set of solder coating areas corresponds to the position of the second set of solder coating areas of the second set of soldering copper foil areas of the second set of soldering points, and is matched with the second set of soldering points of the second set of soldering points A first capacitor element and a second capacitor element are welded between the second group of solder coating areas of the soldering copper foil area and the third group of soldering copper foil areas of the third group of soldering points ; With this, the first set of welding points, the second set of welding points and the third set of welding points form everything Change the switch, when the first group of solder coating area of the first group of soldering copper foil area of the first group of soldering points and the second group of solder coating area of the second group of soldering copper foil area of the second group of soldering points pass After non-conduction, the switch can be switched to the non-conduction state. The welding point with a switch as described in any one of claims 1 to 3, wherein the conduction distance between the first set of welding points and the second set of welding points is 3-6 mils.

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