TWI707616B - Bending apparatus for chip-on-film and method for bending chip-on-film - Google Patents

Abstract

A bending apparatus for chip-on-film has a stage, a rotary servo, a first bracket, a driver, multiple telescopic cylinders, and multiple hooks. The stage has a reference edge. The reference edge has multiple corresponding portions. The rotary servo has a rotating axis position outside the reference edge. The first bracket is fixed with the rotating axis. The telescopic cylinders are disposed on the first bracket. The hooks are connected with the ends of the telescopic cylinders near to the stage respectively. The hooks are respectively disposed between two of the corresponding portions those are adjacent to each other. The driver is connected with the ends of the telescopic cylinders distal away from the hooks respectively. The cost on labors and time for bending chip-on-film is saved and the damage on chip-on-film caused by bending chip-on-film is avoided by the bending apparatus.

Description

Chip on film bending equipment and chip on film bending method

The invention relates to a bending device and a bending method, in particular to a flip chip film bending device and a chip flip film bending method.

The prior art display adopts a chip-on-film solution, that is, a chip is packaged on a flexible circuit board (FPC) to form a chip-on-film, and then the chip-on-film is connected between the liquid crystal panel and the rigid circuit board , And bend it to the back of the liquid crystal panel, so that the rigid circuit board is configured on the back of the liquid crystal panel to reduce the width of the display frame. Among them, the rigid circuit board is electrically connected to the liquid crystal panel via a chip on film. In the existing process, after bending the chip-on-chip film, the joints of the liquid crystal panel and the chip-on-chip film are applied again.

However, in the prior art, the chip-on-chip film is manually bent to perform glue application. As a result, it not only consumes considerable time and labor costs, but also easily causes damage to liquid crystal panels, flip-chip films, and rigid circuit boards, thereby increasing production costs.

This "prior art" paragraph is only used to help understand the content of the present invention. Therefore, the contents disclosed in the "prior art" may include some conventional technologies that do not constitute those of ordinary knowledge in the technical field. In addition, the content disclosed in the "prior art" does not represent the content or the problem to be solved by one or more embodiments of the present invention, nor does it represent that the present invention has been used by a person with ordinary knowledge in the technical field before the application. Know or recognize.

The invention provides a chip-on-chip film bending equipment, which can reduce the labor and time cost of bending the chip-on-chip film and avoid damage to the chip-on-chip film during bending.

The present invention also provides a method for bending the flip chip film, which can reduce the labor and time cost of bending the flip chip film and reduce the damage rate of the flip chip film during bending.

The flip-chip film bending equipment provided by the present invention includes a bearing table, a rotating servo, a first bracket, a driver, a plurality of stretching cylinders, and a plurality of hooks. The bearing platform has a reference end edge, and the reference end edge has a plurality of corresponding parts spaced apart from each other. The rotation servo has a rotation axis located next to the reference edge. The first bracket is fixed to the rotating shaft. The stretching cylinders are arranged on the first bracket and spaced apart from each other, and each stretching cylinder has an axial direction toward the bearing platform. The hooks are respectively connected to one end of the stretching cylinder adjacent to the carrying platform, and are located between two adjacent corresponding parts. The drive is adjacent to the rotating servo. The driver is adapted to drive the stretching cylinder and the hook to move away from the reference end edge, and the rotation axis of the rotation servo is suitable for driving the first bracket to rotate, so that the stretching cylinder and the hook rotate with the first bracket.

In an embodiment of the present invention, the above-mentioned flip-chip film bending equipment further includes a position adjustment rail, the position adjustment rail is arranged on the first bracket, and the stretching cylinder is sequentially arranged on the position adjustment rail and is adapted to be adjusted along the position Rail move.

In an embodiment of the present invention, the above-mentioned flip-chip film bending equipment further includes a second support, the second support is disposed between the first support and the carrying table, and the second support is pivotally connected to the first support by a rotating shaft, The rotation servo is arranged on the second bracket, the driver is connected to the second bracket, and the driver is adapted to drive the second bracket to move relative to the reference end edge, so that the rotation servo, the first bracket, the stretching cylinder and the hook move away from the reference end Move in the direction of the edge.

In an embodiment of the present invention, the above-mentioned flip-chip film bending equipment further includes a second support, the second support is disposed between the first support and the carrying table, and the second support is pivotally connected to the first support by a rotating shaft, The rotating servo is arranged on the second bracket at the reference end edge. The driver is connected between the first bracket and the stretching cylinder. When the rotating shaft of the rotating servo drives the first bracket to rotate, the driver, stretching cylinder and hook As the first bracket rotates.

In an embodiment of the present invention, the above-mentioned flip-chip film bending device further includes a plurality of linear guides. The linear guides are arranged on the first bracket and are spaced apart from each other. Each linear guide includes a fixing seat and a linear guide. The guide rail, the fixing seat is arranged on the first bracket, the linear guide rail is arranged on the fixing seat, each stretching cylinder is fixed on the fixing seat of each linear guide, and the axial direction of each stretching cylinder is parallel to the axis of each linear guide Linear guides, and each hook is arranged on the linear guide of each linear guide, and is suitable for moving along the fixed seat corresponding to the linear guide of each linear guide.

In an embodiment of the present invention, each of the above-mentioned stretching cylinders has a cylinder body and a piston rod, the piston rod shaft is arranged on the cylinder body, and each hook is connected to the piston rod of each stretching cylinder.

In an embodiment of the present invention, the aforementioned carrying platform further includes an adsorption device.

In an embodiment of the present invention, the above-mentioned chip-on-chip bending device is suitable for bending the chip-on-chip film. The chip-on-chip film is connected between the panel and the circuit board. The chip-on-chip film has a plurality of bridge portions spaced apart from each other. The part is connected between the panel and the circuit board; the carrying platform is suitable for carrying the panel, the circuit board and the bridge part are located outside the reference end edge, and each bridge part is adjacent to each corresponding part, and each hook is suitable for disposing two adjacent bridges Between the parts, when the stretching cylinder and the hook rotate with the first bracket, the bridging part is bent along the reference end edge and faces the corresponding parts.

The chip on film bending equipment of the present invention, through the cooperation of the carrying table, the rotating server, the first bracket, the driver, the stretching cylinder, and the hook, can not only reduce the labor and time cost of bending the chip on film, but also The flip chip film can be uniformly stressed during the bending process to avoid damage.

The flip chip film bending method provided by the present invention is suitable for bending the flip chip film, the flip chip film is connected between the panel and the circuit board, the flip chip film has a plurality of bridge portions spaced apart from each other, and the bridge portions are connected to the panel and the circuit Between the boards. The bending method of the chip-on-chip film of the present invention includes: loading the panel on a bearing platform, and the circuit board and the bridge portion are located outside the reference end edge of the bearing platform; and multiple hooks are respectively arranged between two adjacent bridge portions , The hooks are respectively connected to one end of the plurality of stretching cylinders adjacent to the carrying platform. The stretching cylinders are arranged on the first bracket and spaced apart from each other. Each stretching cylinder has an axial direction toward the carrying platform; The hook moves away from the reference edge to stretch the bridge portion; and the rotation axis of the rotating servo drives the first bracket to rotate, so that the stretching cylinder and the hook rotate with the first bracket to bridge the bridge The part is bent.

In an embodiment of the present invention, the above-mentioned step of causing the driver to drive the stretching cylinder and the hook to move away from the reference edge to stretch the bridge portion includes: making the driver drive the stretching cylinder and the hook to move away The direction of the reference edge is moved by a first distance so that the hook is hooked on the circuit board, wherein the stretching cylinder applies a first pulling force to the circuit board via the hook; and the driver drives the cylinder of the stretching cylinder to pull relatively The piston rod of the extension cylinder moves a second distance in a direction away from the reference end edge, so that the extension cylinder applies a second pulling force to the circuit board via the hook to stretch the bridge portion. Wherein, the piston rod is connected between the hook and the cylinder, and the second pulling force is greater than the first pulling force.

The bending method of the chip-on-chip film of the present invention bridges the hooks by arranging the hooks between two adjacent bridge portions, and allowing the driver to apply a first pulling force away from the bearing platform to the hooks via a stretching cylinder. It can reduce the labor and time cost of bending the chip-on-chip film and reduce the cost of bending the chip on film, and the coordination of the steps of making the rotation axis of the rotating server drive the first bracket to rotate and the stretching cylinder and the hook to rotate with the first bracket Advantages of the damage rate of the flip chip film during the bending process.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

FIG. 1 is a schematic diagram of a chip-on-film bending device in a first use state according to an embodiment of the present invention. Figure 2 is a partial enlarged view of Figure 1. Fig. 3 is a partial enlarged view of Fig. 1 from another perspective. 4 is another schematic diagram of the chip-on-film bending device according to an embodiment of the present invention in the first use state. FIG. 5 is a schematic diagram of a chip-on-film bending device according to an embodiment of the present invention in a second use state. Fig. 6 is a schematic side view of Fig. 1. Fig. 7 is a schematic side view of Fig. 5. Please refer to FIGS. 1 to 7, the flip chip bending device 100 of this embodiment includes a carrier 110, a rotating server 120, a first support 130, a plurality of stretching cylinders 140, a plurality of hooks 150 and a driver 160. The carrier 110 has a reference end edge 111, and the reference end edge 111 has a plurality of corresponding portions 112 spaced apart from each other. The corresponding portions 112 refer to the reference end edge 111 that is intended to be opposite to the chip on film 200 after being bent on the chip on film 200. The location where the chip-on-chip film 200 is shielded. The rotation server 120 may be adjacent to the carrier 110, and the rotation server 120 has a rotation axis 121, and the rotation axis 121 is located beside the reference edge 111. The first bracket 130 is fixed to the rotating shaft 121. The stretching cylinders 140 are arranged on the first bracket 130 and are spaced apart from each other, and each stretching cylinder 140 has an axial direction toward the bearing platform 110. The hooks 150 are respectively connected to one end of the stretching cylinder 140 adjacent to the carrying platform 110, and the hooks 150 are respectively located between two adjacent corresponding portions 112. The driver 160 is adjacent to the rotation servo 120. The driver 160 is adapted to drive the stretching cylinder 140 and the hook 150 to move away from the reference edge 111, and the rotating shaft 121 of the rotation server 120 is adapted to drive the first bracket 130 to rotate, so that the stretching cylinder 140 and the hook 150 As the first bracket 130 rotates. Wherein, the driver 160 can also drive the stretching cylinder 140 and the hook 150 to move in a direction close to the reference edge 111. In addition, the carrying table 110 may have a suction device (not shown in the figure), that is, the carrying table 110 may be a suction carrying table 110 suitable for adsorbing and fixing objects such as panels. In addition, the number of stretching cylinders 140 and the number of hooks 150 can be adjusted according to actual needs. The present invention does not limit the number of stretching cylinders 140 and the number of hooks 150.

The above-mentioned chip on film bending device 100 may further include a position adjustment rail 170. As shown in FIG. 3, the position adjustment rail 170 is arranged on the first bracket 130, and the stretching cylinder 140 is arranged on the position adjustment rail 170 in sequence. It is suitable for moving along the position adjustment rail 170.

The above-mentioned chip on film bending device 100 may further include a second bracket 135, the second bracket 135 is disposed between the first bracket 130 and the carrying platform 110, and the second bracket 135 is pivotally connected to the first bracket 130 by a rotating shaft 121, The rotation servo 120 is disposed on the second bracket 135, and the driver 160 is connected to the second bracket 135. The driver 160 is adapted to drive the second bracket 135 to move relative to the reference edge 111, so that the rotation servo shaft 120 and the first bracket 130 , The stretching cylinder 140 and the hook 150 move away from or close to the reference edge 111.

The above-mentioned chip on film bending device 100 may further include a plurality of linear guides 190, the linear guides 190 are disposed on the first support 130 and are spaced apart from each other, and each linear guide 190 includes a fixing seat 191 and a linear guide 192 , The fixing seat 191 is arranged on the first bracket 130, the linear guide rail 192 is arranged on the fixing seat 191, each stretching cylinder 140 is fixed on the fixing seat 191 of each linear guide 190, and the axial direction of each stretching cylinder 140 is parallel On the linear guide 192 of each linear guide 190, and each hook 150 is arranged on the linear guide 192 of each linear guide 190, and is suitable for a fixed seat corresponding to the linear guide 192 of each linear guide 190 191 moves. In this embodiment, the linear guide 190 is disposed on the position adjustment rail 170 on the first bracket 130. The linear guide 190 can move along the position adjustment rail 170. The stretching cylinder 140 and the hook 150 follow the linear guide. The guide 190 moves along the position adjustment rail 170.

Each stretching cylinder 140 described above has a cylinder 141 and a piston rod 142, the piston rod 142 is axially arranged on the cylinder 141, and each hook 150 is connected to the piston rod 142 of each stretching cylinder 140. In this embodiment, each hook 150 is connected to the piston rod 142 of each stretching cylinder 140 via each linear guide 190.

The chip on film bending device 100 of this embodiment can be used for bending the chip on film 200. The chip on film 200 can be connected to the panel 300 between the circuit boards 400. The panel 300 can be, for example, a liquid crystal panel, and the chip on film 200 can have A plurality of bridge portions 210 are spaced apart from each other, and the bridge portions 210 are connected between the panel 300 and the circuit board 400. The panel 300 can be placed on the carrier 110 in a mechanical or manual manner; for example, a vacuum suction cup can be used in a mechanical manner to move the panel 300 after being sucked and placed on the carrier 110. After the panel 300 is placed on the carrying platform 110, the suction device of the carrying platform 110 can suck and fix the panel 300, so that the relative position of the panel 300 and the carrying platform 110 is fixed. When the panel 300 is placed on the carrier 110, the circuit board 400 and the bridge portion 210 are located outside the reference edge 111, the bridge portions 210 are respectively adjacent to the corresponding portions 112, and the hook 150 is respectively disposed between two adjacent bridge portions 210.

In addition, in this embodiment, the linear guide 190 can slide along the position adjustment rail 170 to change the position of the linear guide 190 on the first bracket 130, and also change the positions of the stretching cylinder 140 and the hook 150; That is to say, in this embodiment, the position of the stretching cylinder 140 and the hook 150 can be easily adjusted by the position adjustment rail 170 and the linear guide 190, so that each hook 150 is located between two adjacent bridges.部210 Between.

When the chip-on-chip bending device 100 of this embodiment is bending the chip-on-film 200, the driver 160 can drive the second bracket 135 to move away from the reference edge 111, so that the rotation server 120 and the first bracket 130 can be rotated. The stretching cylinder 140 and the hook 150 move with the second bracket 135 in a direction away from the reference end edge 111, so that the hook 150 is hooked to the circuit board 400 through the gap between two adjacent bridge portions 210, and The bridge 210 is further stretched. Then, the rotation shaft 121 of the rotation server 120 drives the first bracket 130 to rotate, so that the stretching cylinder 140 and the hook 150 rotate with the first bracket 130, and the driver 160 drives the second bracket 135 to rotate the servo 120 , The first bracket 130, the stretching cylinder 140 and the hook 150 move with the second bracket 135 toward the reference end edge 111, so that the bridge portion 210 is flatly bent and opposed to the corresponding portion 112. After the bridging portion 210 is flatly bent and facing the corresponding portion 112, the bridging portion 210 or the junction between the bridging portion 210 and the panel 300 can be glued mechanically or manually to complete the glue on chip 200. After the gluing operation is completed, the rotary servo 120 and the driver 160 can be operated in reverse to move the stretching cylinder 140 and the hook 150 back to the original position, and the bridge 210 can be restored to the state before bending.

In this embodiment, in order to make the gluing operation not limited to the rotating servo 120, that is, to make the gluing operation easy to proceed without being blocked by the rotating servo 120, the driver 160 is connected to the second bracket 135, When bending the chip on film 200, cooperate with the driver 160 to move the second bracket 135, the rotating servo 120, the first bracket 130, the stretching cylinder 140 and the hook 150 to the inner side of the reference edge 111 of the carrier 110 (please refer to the figure). 5). However, in other embodiments, the gluing operation can also be performed under the condition that the rotation servo 120 is limited; furthermore, in one embodiment, the rotation servo 120 is disposed at the reference edge 111, and the driver 160 can Connected between the first support 130 and the stretching cylinder 140, that is, the stretching cylinder 140 is connected to the first support 130 via the driver 160. When the rotation servo 120 drives the first support 130 to rotate with the rotation shaft 111, the driver 160. The stretching cylinder 140 and the hook 150 rotate together with the first bracket 130, so that the bridge portion 210 is flatly bent and opposed to the corresponding portion 112, and the junction between the bridge portion 210 and the panel 300 is exposed, and proceed Glue operation.

In the flip-chip film bending equipment 100 of this embodiment, through the cooperation of the carrying table 110, the rotating server 120, the first bracket 130, the driver 160, the stretching cylinder 140, and the hook 150, the The bridge portion 210 is stretched and flatly bent and opposed to the corresponding portion 112, that is, the chip on film 200 is bent mechanically and efficiently, thereby reducing the labor and time cost of bending the chip on film 200. At the same time, by using a plurality of stretching cylinders 140, the chip on film 200 can be uniformly stressed during the bending process, thereby avoiding damage to the chip on film 200.

FIG. 8 is a flowchart of a method for bending a flip chip film according to an embodiment of the present invention. Please refer to FIGS. 1, 2, 4, 5 and 8, the method for bending a chip on film of this embodiment can be used to bend the above-mentioned chip on film 200; the method for bending a chip on film of this embodiment includes: Step S100: carrying The panel 300 is on the carrying platform 110; Step S200: Dispose the hook 150 between two adjacent bridge portions 210; Step S300: Make the driver 160 drive the stretching cylinder 140 and the hook 150 to move away from the reference edge 111 And step S400: the rotation shaft 121 of the rotation server 120 drives the first bracket 130 to rotate, so that the bridge portion 210 is bent along the reference edge 111.

In step S100, the panel 300 is carried on the carrying platform 110, and the circuit board 400 and the bridge portion 210 are located outside the reference edge 111 of the carrying platform 110. In step S200, the hook 150 is respectively arranged between two adjacent bridge portions 210, and the hook 150 is respectively connected to an end of the stretching cylinder 140 adjacent to the carrying platform 110, and the stretching cylinder 140 is disposed on the first bracket 130 And are spaced apart from each other, and each stretching cylinder 140 has an axial direction toward the carrying platform 110. In step S300, the driver 160 drives the stretching cylinder 140 and the hook 150 to move away from the reference end edge 111, so as to stretch the bridge 210. In step S400, the rotating shaft 121 of the rotating server 120 drives the first bracket 130 to rotate, so that the stretching cylinder 140 and the hook 150 rotate with the first bracket 130, so that the bridge 210 is bent.

In the method for bending the chip on film of this embodiment, after the bridge portion 210 is bent along the reference edge 111, the bridge portion 210 or the junction between the bridge portion 210 and the panel 300 can be glued mechanically or manually, thereby The glue coating operation of the chip on film 200 is completed. After the gluing operation is completed, steps S400 and S300 can be reversed to move the stretching cylinder 140 and the hook 150 back to their original positions, so that the bridge portion 210 can return to the state before bending.

Fig. 9 is a detailed flowchart of step S300 in Fig. 8. FIG. 10 is a schematic diagram of step S310 in FIG. 9. Please refer to Figures 2, 4, 9 and 10, step S300 further includes: Step S310: the driver 160 drives the stretching cylinder 140 and the hook 150 to move a first distance away from the reference edge 111, so that the hook 150 is hooked On the circuit board 400; and step S320: let the driver 160 drive the cylinder 141 of the stretching cylinder 140 to move a second distance away from the reference edge 111 to stretch the bridge 210.

In step S310, the driver 160 drives the second bracket 135 to move relative to the reference edge 111, so that the rotation servo 120, the first bracket 130, the stretching cylinder 140 and the hook 150 move away from the reference edge 111 together. The first distance, where the stretching cylinder 140 applies a first pulling force on the circuit board 400 via the hook 150. Next, in step S320, the driver 160 further drives the second bracket 135 to move relative to the reference edge 111, so that the cylinder 141 of the stretching cylinder 140 moves a second distance away from the reference edge 111 relative to the piston rod 142 (The piston rod 142 is pulled out of the cylinder 141, please refer to FIG. 4), and the stretching cylinder 140 applies a second pulling force to the circuit board 400 via the hook 150 to stretch the bridge 210; The second pulling force is greater than the first pulling force. In step 310 and step 320, all the hooks 150 are hooked on the circuit board 400 first, and then the bridge portion 210 is stretched when all the hooks 150 are hooked on the circuit board 400. In this way, it can be ensured that the chip-on-chip film 200 is uniformly stressed and avoid damage during the stretching process.

Furthermore, in this embodiment, when the tensile strength of the chip-on-chip film 200 is weak, the number of stretching cylinders 140 and the number of hooks 150 can be appropriately increased, so that each stretching cylinder 140 has a smaller tensile force. The bridge portion 210 is simultaneously stretched, so that the overall force of the chip on film 200 is more uniform, and the probability of damage to the chip on film 200 during the stretching process is greatly reduced.

In addition, the pulling force of the stretching cylinder 140 is controlled by the gas pressure inside the stretching cylinder 140. FIG. 11 is a block diagram of a gas pressure adjustment system inside a stretching cylinder according to an embodiment of the present invention. Please refer to FIG. 11, the gas pressure inside the stretching cylinder 140 can be adjusted by the electronically controlled proportional valve 510. The stretching cylinder 140 can be connected to the first gas conveying pipe 520, and the electronically controlled proportional valve 510 is arranged between the first gas conveying pipe 520 and the second gas conveying pipe 530. The first gas G1 is inputted by the second gas conveying pipe 530. Control proportional valve 510. The electronic control proportional valve 510 can adjust the gas pressure of the first gas G1 and output the second gas G2 (the first gas G1 whose gas pressure has been adjusted), and the second gas G2 is input from the first gas delivery pipe 520 The stretching cylinder 140 is used to regulate the gas pressure inside the stretching cylinder 140. Wherein, the electronically controlled proportional valve 510 can be controlled by the controller 540 to adjust the gas pressure of the output second gas G2. The controller 540 is electrically connected to the electronically controlled proportional valve 510. The controller 540 can be, for example, programmable logic. Controller (Programmable Logic Controller, PLC) or computer that controls Digital-Analog Converter (Digital-Analog Converter).

In the bending method of the flip chip film 200 of this embodiment, after the panel 300 is loaded on the carrier 110, the hook 150 is arranged between two adjacent bridge portions 210, and the driver 160 is driven The stretching cylinder 140 and the hook 150 move in a direction away from the reference edge 111 to stretch the bridge portion 210, and the rotation shaft 121 of the rotation server 120 drives the first bracket 130 to rotate, so that the stretching cylinder 140 and the hook 150 With the cooperation of steps such as the rotation of the first support 130, the bridge portion 210 of the chip on film 200 can be bent efficiently, thereby reducing the labor and time cost of bending the chip on film 200. In addition, by using a plurality of stretching cylinders 140 and a plurality of hooks 150 to stretch the bridge portion 210 to bend the chip on film 200, the pulling force can be evenly distributed on the chip on film 200, thereby effectively reducing the The rate of damage during bending.

In summary, the flip-chip film bending equipment and the flip-chip film bending method of the present invention can reduce the labor and time cost of bending the flip-chip film, and avoid damaging the flip-chip film when bending the flip-chip film. Features.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

100: Flip-on film bending equipment 110: Bearing table 111: Reference edge 112: Corresponding part 120: Rotating servo 121: Rotating shaft 130: First bracket 135: Second bracket 140: Stretching cylinder 141: Cylinder body 142 : Piston rod 150: Hook 160: Driver 170: Position adjustment rail 190: Linear guide 191: Fixed seat 192: Linear slide 200: Flip film 210: Bridge 300: Panel 400: Circuit board 510: Electronic control Proportional valve 520: first gas delivery pipe 530: second gas delivery pipe 540: controller S100, S200, S300, S310, S320, S400: step G1: first gas G2: second gas

Fig. 1 is a schematic diagram of a flip chip bending device according to an embodiment of the present invention in a first use state; Fig. 2 is a partial enlarged view of Fig. 1; Fig. 3 is a partial enlarged view of Fig. 1 from another perspective; 4 is another schematic diagram of the chip-on-film bending device according to an embodiment of the present invention in the first use state; FIG. 5 is a schematic diagram of the chip-on-chip bending device according to an embodiment of the present invention in the second use state; Fig. 6 is a schematic side view of Fig. 1; Fig. 7 is a schematic side view of Fig. 5; Fig. 8 is a flowchart of a method for bending a flip chip film according to an embodiment of the present invention; Fig. 9 is a detailed process of step S300 in Fig. 8 10 is a schematic diagram of step S310 in FIG. 9; and FIG. 11 is a block diagram of a system for adjusting the internal gas pressure of a stretching cylinder according to an embodiment of the present invention.

110: Carrier

111: Reference edge

120: Rotating Servo

121: Rotation axis

130: The first bracket

135: second bracket

140: Stretching cylinder

141: Cylinder

142: Piston Rod

150: hook

160: drive

170: Position adjustment rail

190: Linear guide

200: flip chip film

210: Bridge

300: Panel

400: circuit board

Claims (10)

A chip-on-film bending device includes: a bearing platform with a reference end edge, the reference end edge having a plurality of corresponding parts spaced from each other; a rotation servo, with a rotation axis located beside the reference end edge; A first bracket fixedly connected to the rotating shaft; a plurality of stretching cylinders arranged on the first bracket and spaced apart from each other, each of the stretching cylinders has an axial direction which faces the bearing platform; The hooks are respectively connected to one end of the stretching cylinders adjacent to the bearing platform, and the hooks are respectively located between two adjacent corresponding parts; and a driver adjacent to the rotation server; wherein, The driver is adapted to drive the stretching cylinders and the hooks to move away from the reference end edge, and the rotation axis of the rotation servo is adapted to drive the first bracket to rotate, so that the stretching cylinders and the hooks The hooks rotate with the first bracket. The flip-chip film bending device according to claim 1, which further includes a position adjustment rail, the position adjustment rail is arranged on the first bracket, and the stretching cylinders are sequentially arranged on the position adjustment rail and are suitable Move along the adjustment rail at that position. The chip-on-film bending device according to claim 1, which further includes a second support, the second support is disposed between the first support and the bearing platform, and the second support is connected between the rotation shaft and the second support A bracket is pivotally connected, the rotation servo is disposed on the second bracket, the driver is connected to the second bracket, and the driver is adapted to drive the second bracket to move relative to the reference edge, so that the rotation servo, the The first bracket, the stretching cylinders and the hooks move in the direction away from the reference end edge. The chip-on-film bending device according to claim 1, which further includes a second support, the second support is disposed between the first support and the bearing platform, and the second support is connected between the rotation shaft and the second support A bracket is pivotally connected, the rotation servo is disposed on the second bracket and located at the reference end edge, the driver is connected between the first bracket and the stretching cylinders, and the rotation axis of the rotation servo drives When the first bracket rotates, the driver, the stretching cylinders, and the hooks rotate with the first bracket. The chip-on-film bending device according to claim 1, which further includes a plurality of linear guides, the linear guides are arranged on the first support and are spaced apart from each other, and each of the linear guides includes a A fixing seat and a linear guide, the fixing seat is arranged on the first bracket, the linear guide is arranged on the fixing seat, each of the stretching cylinders is fixed on the fixing seat of each of the linear guides, each The axial directions of the stretching cylinders are parallel to the linear guide rails of the linear guides, and the hooks are arranged on the linear guide rails of the linear guides so as to be suitable for moving along the linear guides. The linear guide rail of the guide moves corresponding to the fixed seat. The flip chip bending device according to claim 1, wherein each of the stretching cylinders has a cylinder body and a piston rod, the piston rod is inserted into the cylinder body, and each of the hooks is connected to each of the Some stretch the piston rod of the cylinder. The chip-on-film bending equipment according to claim 1, wherein the carrying table includes a suction device. The flip chip bending device according to claim 1, wherein the flip chip bending device is adapted to bend a flip chip film connected between a panel and a circuit board, the flip chip film There are a plurality of bridging portions spaced apart from each other, the bridging portions are connected between the panel and the circuit board; the carrying platform is suitable for carrying the panel, the circuit board and the bridging portions are located outside the reference end edge, and each The bridge portions are adjacent to the corresponding portions, and each of the hooks is adapted to be arranged between two adjacent bridge portions. When the stretching cylinders and the hooks rotate with the first bracket At this time, the bridge portions are bent along the reference end edge and are opposed to the corresponding portions. A method for bending a chip on film, suitable for bending a chip on film; the chip on film is connected between a panel and a circuit board, the chip on film has a plurality of bridge portions spaced apart from each other, and the bridge portions are connected Between the panel and the circuit board; the flip chip film bending method includes: carrying the panel on a carrying platform, wherein the circuit board and the bridge portions are located outside a reference edge of the carrying platform; A plurality of hooks are respectively arranged between two adjacent bridge portions, wherein the hooks are respectively connected to one end of the plurality of stretching cylinders adjacent to the carrying platform, and the stretching cylinders are arranged on a first On a bracket and spaced apart from each other, each of the stretching cylinders has an axial direction that faces the bearing platform; a driver is made to drive the stretching cylinders and the hooks to move in a direction away from the reference edge, To stretch the bridge portions; and to make a rotating shaft of a rotating server drive the first bracket to rotate, so that the stretching cylinders and the hooks rotate with the first bracket to cause the The bridge is bent. The method for bending a chip on film according to claim 9, wherein the drive is made to drive the stretching cylinders and the hooks to move in the direction away from the reference end edge to stretch the bridge portions The steps include: making the driver drive the stretching cylinders and the hooks to move a first distance in the direction away from the reference edge, so that the hooks are hooked on the circuit board, wherein the pulling The extension cylinder applies a first pulling force to the circuit board via the hooks; and the driver drives the cylinders of the extension cylinders to move away from the reference end edge relative to the piston rods of the extension cylinders Moves a second distance in the direction of, so that the stretching cylinders exert a second pulling force on the circuit board via the hooks to stretch the bridge portions, wherein the piston rods are connected to the Between the hook and the cylinders, the second pulling force is greater than the first pulling force.

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