TWI706831B - Base seat used in polishing pad conditioning apparatus - Google Patents

Abstract

The invention discloses a base seat used in a polishing pad conditioning apparatus including a flat annular conditioning device. The base seat includes a main disk, a secondary disk and an annular peripheral device. The main disk is formed of a first ceramic. The secondary disk is formed of a second ceramic. The annular peripheral device is formed of a polymer, and molded on a first circumferential edge of the main disk by an injection overmolding process. A first portion of the secondary disk is fitted and bonded inside a circular recess of the main disk. A second circumferential edge of the secondary disk, an inner wall of the annular peripheral device, and an upper surface of the main disk constitute an annular groove. A second portion of the flat annular conditioning device is capable of being fitted and bonded inside the annular groove.

Description

Base for polishing pad dressing device

The present invention relates to a base for a polishing pad dressing device. The flat ring-shaped dressing element of the polishing pad dressing device can be sleeved and joined in the annular groove of the base, and particularly relates to a polishing pad dressing device The base of the device and the base where no metal is eluted during the chemical mechanical polishing process of the polishing pad reconditioning device.

Please refer to FIGS. 1 and 2, which schematically depict the base 1 used in the prior art polishing pad dressing device. Fig. 1 is a top view of a base 1 of the prior art. Fig. 2 is a cross-sectional view of the base 1 of the prior art in Fig. 1 along the line A-A. The polishing pad dressing device includes a flat ring-shaped dressing element (not shown in FIGS. 1 and 2).

As shown in Figs. 1 and 2, the base 1 of the prior art has an upper surface 10, a lower surface 11, and an annular groove 12 formed on the upper surface. The annular groove 12 divides the upper half of the base 1 into a central disk portion 13 and an annular circumferential portion 14. The annular groove 12 has a bottom surface 120.

The lower half of the flat ring-shaped dressing element of the polishing pad dressing device can fit into the annular groove 12 of the base 1 of the prior art, and is engaged with the bottom surface 120 of the annular groove 12. The function of the annular circumferential portion 14 is to protect the edge of the flat annular trimming element and avoid collision.

The base 1 of the prior art has at least one screw hole 15 formed on the lower surface 11 and at least one blind hole formed on the lower surface 11 16. For positioning and locking the base 1 of the prior art on the grinding machine table.

Documents have proved that the flatness of the bottom surface 120 of the annular groove 12 in contact with the flat annular dressing element affects the polishing pad removal rate provided by the polishing pad dressing device. Therefore, the flatness convexity of the bottom surface 120 of the annular groove 12 must be equal to or less than 10 μm. That is, only the bottom surface 120 of the annular groove 12 is allowed to protrude upward by equal to or less than 10 μm.

For the above reasons, the base 1 of the prior art is all made of stainless steel block. Obviously, the amount of processing required to process the stainless steel block into the base 1 of the prior art is quite large.

However, using the prior art polishing pad reconditioning device for the base 1 made of stainless steel blocks, during the chemical mechanical polishing process, the base 1 will have metal dissolved in the polishing liquid, especially nickel. The base material of the current flat ring-shaped trimming element is formed of ceramic material, for example, silicon carbide. Therefore, in the chemical mechanical polishing process, the flat ring-shaped trimming element will not have metal eluted.

In the past, the line width of the semiconductor device manufacturing process was still wide, and the metal concentration eluted from the base 1 of the prior art still did not pollute the semiconductor device and would not affect the semiconductor device. However, as the line width of the semiconductor device manufacturing process enters the era of several nanometers, the concentration of the metal eluted from the base 1 of the prior art has already caused contamination of the semiconductor device and will affect the semiconductor device.

In view of how to overcome the problem of metal elution in the base 1 processed with stainless steel blocks in the prior art, existing solutions have proposed to replace the stainless steel blocks with ceramic blocks, and then process the ceramic blocks into the base shown in Figs. 1 and 2 1. However, this solution has the problems of difficulty in processing the ceramic block and low yield, resulting in a very high cost of the base 1 processed from the ceramic block and difficult to introduce and apply.

Another proposal proposes to use engineering plastic injection molding to form the base 1 as shown in FIGS. 1 and 2. However, the strength of the base 1 formed by this solution is worrying, and it is difficult to introduce it into application.

Therefore, one of the technical problems to be solved by the present invention is to provide a base for a polishing pad dressing device. In particular, in the chemical mechanical polishing process of the polishing pad conditioning device, the base according to the present invention will not have metal eluted. Moreover, the base according to the present invention is easy to manufacture, low in cost, and high in strength. The flatness of the surface where the base and the flat ring-shaped dressing element of the polishing pad dressing device according to the present invention are joined also meets the requirements.

The base according to a preferred embodiment of the present invention is used in a polishing pad dressing device. The polishing pad dressing device includes a flat ring-shaped dressing element. The base according to the present invention includes a main disc, a sub disc, and ring-shaped surrounding elements. The main disc is formed of the first ceramic material. The main disc has a first upper surface, a first lower surface, a circular groove formed on the first upper surface, a first circumferential edge, and at least one first groove formed on the first circumferential edge. The circular groove of the main disc has a bottom surface. The sub-disc is formed of the second ceramic material. The sub-disc has a second upper surface, a second lower surface, and a second circumferential edge. The first part of the sub-disc is sleeved in the circular groove of the main disc. The second lower surface of the sub-disc is joined to the bottom surface of the circular groove of the main disc, and the second upper surface of the sub-disc is higher than the first upper surface of the main disc. The ring-shaped surrounding elements are formed of polymer materials. The ring-shaped surrounding element is formed on the first circumferential edge of the main disc by an over-injection molding process, and is engaged with at least one first groove on the first circumferential edge. The annular surrounding element has a third upper surface, a third lower surface and an inner wall. The third upper surface of the ring-shaped surrounding element is higher than the first upper surface of the main disc. The second circumferential edge of the sub-disc, the inner wall of the sub-disc, and the first upper surface of the main disc located between the second circumferential edge and the inner wall form an annular second groove. The second part of the flat ring-shaped trimming element can be sleeved and joined in the ring-shaped second groove.

In a specific embodiment, the convexity of the flatness of the first upper surface of the main disk ranges from 0 to 10 μm.

In a specific embodiment, the annular surrounding element has at least one screw hole formed on the third lower surface and at least one blind hole formed on the third lower surface.

In a specific embodiment, the first ceramic material forming the main disc and the second ceramic material forming the sub-disc may be alumina, zirconia, aluminum nitride, silicon carbide, silicon oxide, mullite, and violet, respectively. Bluestone, glass, etc., and not limited to the above-mentioned ceramic materials.

In a specific embodiment, the polymer material for forming the ring-shaped surrounding element can be acrylonitrile-butadiene-styrene copolymer (ABS), epoxy resin (EPOXY), polyamide (PA), polyamide Amine (PI), polyamide imine (PAI), polyacrylic acid (PAA), polybutene (PB) polycarbonate (PC), polyethylene (PE), polyether ether ketone (PEEK) poly-p-phenylene Ethylene Dicarboxylate (PET), Phenolic Resin (PF), Polyisobutylene (PIB), Polylactic Acid (PLA), Polymethyl Methacrylate (PMMA), Polyacetal (POM), Polypropylene (PP), Polystyrene (PS), plastic starch material (PSM), poly (PSU.PSF), polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), polyurethane (PU), polyvinyl alcohol (PVA), Polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polybenzoxazole (PBO), polybenzothiazole (PBT) or polybenzimidazole (PB1), etc., and do not use the above polymer materials as limit.

Further, in a specific embodiment, the polymer material can be added with reinforcing fibers. The reinforcing fiber can be glass fiber, carbon fiber, boron fiber or ceramic fiber.

Different from the prior art, the base according to the present invention is formed or molded by ceramic materials and polymer materials. Therefore, in the chemical mechanical polishing process of the polishing pad dressing device, the base according to the present invention will not have metal eluted. Moreover, the base according to the present invention is easy to manufacture, low in cost, and high in strength. The flatness of the surface where the base and the flat ring-shaped dressing element of the polishing pad dressing device according to the present invention are joined also meets the requirements.

The advantages and spirit of the present invention can be achieved by the following invention The detailed description and the accompanying drawings are further understood.

1: base

10: upper surface

11: lower surface

12: Ring groove

120: bottom surface

13: Center disc part

14: Annular circumference part

15: Screw hole

16: blind hole

2: Pedestal

20: main disc

200: first upper surface

202: first lower surface

204: circular groove

2042: bottom surface

206: first circumferential edge

208: First Groove

209: Ring-shaped second groove

22: Sub-disc

220: second upper surface

222: second lower surface

224: second circumferential edge

24: Ring surrounding elements

240: third upper surface

242: third lower surface

244: Inner Wall

246: screw hole

248: Blind Hole

Figure 1 is a top view of a prior art base.

Fig. 2 is a cross-sectional view of the base of the prior art in Fig. 1 along the line A-A.

Figure 3 is a top view of a base according to a preferred embodiment of the present invention.

Fig. 4 is a cross-sectional view of the base according to the present invention in Fig. 3 along the line B-B.

Please refer to FIGS. 3 and 4, which schematically depict a base 2 for a polishing pad dressing device according to a preferred embodiment of the present invention. Fig. 3 is a top view of the base 2 according to a preferred embodiment of the present invention. 4 is a cross-sectional view of the base 2 according to the preferred embodiment of the present invention in FIG. 3 along the line B-B. The polishing pad dressing device includes a flat ring-shaped dressing element (not shown in FIGS. 3 and 4). The base material of the flat ring-shaped trimming element is formed of ceramic material, for example, silicon carbide.

As shown in FIGS. 3 and 4, the base 2 according to the preferred embodiment of the present invention includes a main disk 20, a sub disk 22 and a ring-shaped surrounding element 24.

The main disc 20 is formed of a first ceramic material. The main disc 20 has a first upper surface 200, a first lower surface 202, a circular groove 204 formed on the first upper surface 200, a first circumferential edge 206, and at least one first circumferential edge 206 formed on the first circumferential edge 206 A groove 208. The first upper surface 200 is the opposite surface of the first lower surface 202. In FIG. 4, only one first groove 208 is shown as a representative. At least one first groove 208 extends along the first circumferential edge 206. The circular groove 204 of the main disc 20 has a bottom surface 2042.

In a specific embodiment, the at least one first groove 208 may be formed before the main disc 20 undergoes the sintering process.

In a specific embodiment, the first ceramic material forming the main disc 20 may be alumina, zirconia, aluminum nitride, silicon carbide, silicon oxide, mullite, cordierite or glass, etc. Ceramic materials are limited.

The sub-disc 22 is formed of a second ceramic material. The sub-disc 22 has a second upper surface 220, a second lower surface 222 and a second circumferential edge 224. The second upper surface 220 is the opposite surface of the second lower surface 222. The first part of the sub-disk 22 is nested in the circular groove 204 of the main disk 20. The sub-disk 22 is joined to the bottom surface 2042 of the circular groove 204 of the main disk 20 with its second lower surface 222, and the second upper surface 220 of the sub-disk 22 is higher than the first surface of the main disk 20.上面200。 200 on the surface.

In a specific embodiment, the second lower surface 222 of the sub-disk 22 and the bottom surface 2042 of the circular groove 204 of the main disk 20 may be joined together by glass glue, but it is not limited to this.

In a specific embodiment, the second ceramic material forming the sub-disc 22 may be alumina, zirconia, aluminum nitride, silicon carbide, silicon oxide, mullite, cordierite or glass, etc. Ceramic materials are limited.

The ring-shaped peripheral element 24 is formed of a polymer material. The ring-shaped surrounding element 24 is formed on the first circumferential edge 206 of the main disc 20 by an over-injection molding process, and is engaged with at least one first groove 208 on the first circumferential edge 206. The ring-shaped surrounding element 24 has a third upper surface 240, a third lower surface 242 and an inner wall 244. The third upper surface 240 is the opposite surface of the third lower surface 242. The third upper surface 240 of the ring-shaped surrounding element 24 is on the same side as the first upper surface 200 of the main disc 20 and is higher than the first upper surface 200 of the main disc 20. The third lower surface 242 of the annular peripheral element 24 is on the same side as the first lower surface 202 of the main disk 20.

In a specific embodiment, the polymer material for forming the ring-shaped peripheral element 24 may be acrylonitrile-butadiene-styrene copolymer (ABS), epoxy resin (EPOXY), polyamide (PA), polyamide Imine (PI), polyamide imine (PAI), Polyacrylic acid (PAA), polybutene (PB) polycarbonate (PC), polyethylene (PE), polyether ether ketone (PEEK) polyethylene terephthalate (PET), phenolic resin (PF), Polyisobutylene (PIB), polylactic acid (PLA), polymethyl methacrylate (PMMA), polyacetal (POM), polypropylene (PP), polystyrene (PS), plastic starch material (PSM), poly PSU (PSU.PSF), polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), polyurethane (PU), polyvinyl alcohol (PVA), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), Polybenzoxazole (PBO), polybenzothiazole (PBT) or polybenzimidazole (PB1), etc., and not limited to the above-mentioned polymer materials.

Further, in order to improve the strength of the annular peripheral element 24, in a specific embodiment, the polymer material forming the annular peripheral element 24 may be added with reinforcing fibers. The reinforcing fiber can be glass fiber, carbon fiber, boron fiber or ceramic fiber.

In particular, the second circumferential edge 224 of the sub-disc 22, the inner wall 244 of the sub-disc 22, and the first upper surface 200 of the main disc 20 between the second circumferential edge 224 and the inner wall 244 constitute a ring-shaped first Two grooves 209. The second part of the flat ring-shaped trimming element can be nested and engaged in the ring-shaped second groove 209.

In a specific embodiment, in order to provide an ideal polishing pad removal rate, the flatness convexity of the first upper surface 200 of the main disk 20 of the present invention ranges from 0 to 10 μm. In other words, the first upper surface 200 of the main disk 20 has an upward convex range of 0 to 10 μm. In practical applications, the flatness and convexity of the first upper surface 200 of the main disc 20 can be measured by measuring at least 16 points on the first upper surface 200 of the main disc 20 to obtain a flatness. A measure of convexity.

Obviously, compared with the prior art processing the ceramic block into the base 1 as shown in FIGS. 1 and 2, the first upper surface 200 of the main disc 20 and the first lower surface 202 of the main disc 20 of the present invention , The bottom surface 2042 of the circular groove 204, the second upper surface 220 of the sub-disc 22, the second lower surface 222 of the sub-disc 22 The processing, especially grinding, is relatively easy. Therefore, the base 2 according to the present invention is easy to process, has a high yield, and the cost can be greatly reduced.

In a specific embodiment, as shown in FIG. 4, the ring-shaped peripheral element 24 has at least one screw hole 246 formed on the third lower surface 242 and at least one blind hole 248 formed on the third lower surface 242 to It is used for positioning and locking the base 2 on the grinding machine table according to the present invention. The at least one screw hole 246 and the at least one blind hole 248 can be integrally formed with the annular surrounding element 24 during the over-injection molding process, without additional processing.

From the above detailed description of the present invention, it can be clearly understood that the base according to the present invention is formed or molded by ceramic materials and polymer materials. Therefore, in the chemical mechanical polishing process of the polishing pad dressing device, the base according to the present invention will not have metal eluted. Moreover, the base according to the present invention is easy to manufacture, low in cost, and high in strength. According to the present invention, the flatness of the surface where the base and the flat ring-shaped dressing element of the polishing pad dressing device meet the requirements.

Based on the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, rather than limiting the aspect of the present invention by the preferred embodiments disclosed above. On the contrary, its purpose is to cover various changes and equivalent arrangements within the scope of the patent for which the present invention is intended. Therefore, the aspect of the patent scope applied for by the present invention should be interpreted in the broadest way based on the above description, so as to cover all possible changes and equivalent arrangements.

2: Pedestal

20: main disc

200: first upper surface

202: first lower surface

204: circular groove

2042: bottom surface

206: first circumferential edge

208: First Groove

209: Ring-shaped second groove

22: Sub-disc

220: second upper surface

222: second lower surface

224: second circumferential edge

24: Ring surrounding elements

240: third upper surface

242: third lower surface

244: Inner Wall

246: screw hole

248: Blind Hole

Claims (6)

A base is used in a polishing pad dressing device, the polishing pad dressing device includes a flat ring-shaped dressing element, and the base includes: A main disc is formed of a first ceramic material. The main disc has a first upper surface, a first lower surface, a circular groove formed on the first upper surface, and a first A circumferential edge and at least one first groove formed on the first circumferential edge, the circular groove having a bottom surface; A sub-disc is formed of a second ceramic material. The sub-disc has a second upper surface, a second lower surface and a second circumferential edge. A first part of the sub-disc is nested in In the circular groove, the sub-disc is joined to the bottom surface of the circular groove with the second lower surface, and the second upper surface is higher than the first upper surface; and A ring-shaped peripheral element is formed of a polymer material. The ring-shaped peripheral element is formed on the first circumferential edge by an over-injection molding process and is engaged with the at least one first groove. The ring-shaped surrounding element has a third upper surface, a third lower surface, and an inner wall, the third upper surface is higher than the first upper surface, and the second circumferential edge, the inner wall, and the second circumferential edge The first upper surface between the edge and the inner wall forms an annular second groove; Wherein, a second part of the flat ring-shaped trimming element can be sleeved and joined in the ring-shaped second groove. The susceptor according to claim 1, wherein the convexity of a flatness of the first upper surface ranges from 0 to 10 μm. The base according to claim 1, wherein the annular surrounding element has at least one screw hole formed on the third lower surface and at least one blind hole formed on the third lower surface. The base according to claim 1, wherein the first ceramic material and the second ceramic material are selected from alumina, zirconia, aluminum nitride, silicon carbide, silicon oxide, mullite, cordierite, and glass, respectively One of the groups formed. The base according to claim 1, wherein the polymer material is selected from the group consisting of acrylonitrile-butadiene-styrene copolymer (ABS), epoxy resin (EPOXY), polyamide (PA), and polyamide Amine (PI), polyamide imine (PAI), polyacrylic acid (PAA), polybutene (PB) polycarbonate (PC), polyethylene (PE), polyether ether ketone (PEEK) poly-p-phenylene Ethylene Dicarboxylate (PET), Phenolic Resin (PF), Polyisobutylene (PIB), Polylactic Acid (PLA), Polymethyl Methacrylate (PMMA), Polyacetal (POM), Polypropylene (PP), Polystyrene (PS), plastic starch material (PSM), poly (PSU.PSF), polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), polyurethane (PU), polyvinyl alcohol (PVA), One of the group consisting of polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polybenzoxazole (PBO), polybenzothiazole (PBT), and polybenzimidazole (PB1). The base according to claim 5, wherein a reinforcing fiber is added to the polymer material, and the reinforcing fiber is selected from one of the group consisting of glass fiber, carbon fiber, boron fiber and ceramic fiber.

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