TWI704063B - Decoration assembly - Google Patents

Abstract

A decoration assembly includes a circuit board, a light source, a light guiding plate and a decoration component. The circuit board includes a plate, a first printed circuit, a second printed circuit and two electrically conductive pads. A part of the first printed circuit and a part of the second printed circuit are located on a first surface of the plate, and the other part of the first printed circuit and the other part of the second printed circuit are respectively located in two through holes of the circuit board. The electrically conductive pads are disposed on a second surface of the circuit board and respectively and electrically connected to the first printed circuit and the second printed circuit in the two through holes. The light source is disposed on the first surface of the plate and electrically connected to the first printed circuit and the second printed circuit. The light guiding plate is disposed on the first surface of the plate, and the incident surface of the light guiding surface corresponds to a light-emitting surface of the light source. The decoration component is stacked on a side of the light guiding plate away from the circuit board. The decoration component has a pattern structure, and the pattern structure corresponds to an illuminating surface of the light guiding plate.

Description

Decoration components

The invention relates to a decorative component, particularly a decorative component with a pattern structure.

With the popularization of electronic devices (such as notebook computers, tablet computers, and smart phones), the general public is not only pursuing the enhancement of the performance and functions of the electronic devices, the appearance of the electronic devices is also one of the focuses of the public. Therefore, manufacturers often set patterns on the back covers of smart phones to attract consumers to purchase electronic devices. Generally speaking, the patterns provided on the back cover of the electronic device are divided into luminous optical patterns and non-luminous ink patterns.

Since luminous optical patterns are less dazzling in terms of visual effects than non-luminous ink patterns, manufacturers tend to use back covers with optical patterns when designing some electronic devices, such as high-end models.

However, in a back cover with an optical pattern, an outer conductive circuit and an inner conductive circuit for electrically connecting the light source and the internal power supply of the electronic device are provided on the outer and inner sides of the circuit board, and the outer conductive circuit and the inner conductive circuit pass through the circuit board. The upper plated through holes are connected. However, since the thickness of the circuit board must be kept above a certain thickness to maintain the plating quality of the plated through holes, the circuit board with plated through holes is generally limited by the process of plated through holes and is difficult to further thin. As a result, it will affect the degree of thinning of the electronic device.

The present invention is to provide a decorative component to solve the problem that the back cover with the luminous optical pattern in the prior art is not conducive to the thinning of the overall electronic device.

The decoration element disclosed in an embodiment of the present invention is suitable for electrically contacting two conductive elements. The decoration component includes a circuit board, a light emitting part, a light guide plate and a decoration part. The circuit board includes a board body, a first printed circuit, a second printed circuit, a first conductive pad and a second conductive pad. The board has a first surface, a second surface, at least one first through hole and at least one second through hole. The first through hole and the second through hole penetrate the first surface and the second surface of the board. The first printed circuit and the second printed circuit are printed on the plate body. A part of the first printed circuit is located on the first surface, and another part of the first printed circuit is located in the first through hole. A part of the second printed circuit is located on the first surface, and another part of the second printed circuit is located in the second through hole. The first conductive pad and the second conductive pad are both disposed on the second surface, and the first conductive pad and the second conductive pad are respectively electrically connected to the first printed circuit in the first through hole and the second in the second through hole Printed circuit. The light emitting element is arranged on the first surface of the board, and the light emitting element is electrically connected to the first printed circuit and the second printed circuit. The light emitting element has a light emitting surface. The light guide plate is stacked on the first surface of the board body, and the light guide plate has a light incident surface and a light exit surface. The light incident surface corresponds to the light emitting surface. The decoration piece is stacked on the side of the light guide plate away from the circuit board. The decoration has a pattern structure, and the pattern structure corresponds to the light-emitting surface of the light guide plate.

According to the decoration component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The board is beneficial to reduce the overall thickness of the decorative components. Therefore, when the decorative component is used as the back cover of the electronic device, it can ensure that the overall electronic device maintains the thinning effect.

In addition, through the arrangement of the light-emitting element and the light guide plate, the light emitted by the light-emitting element can be irradiated on the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component is used as the back cover of the electronic device, the illuminated pattern structure can increase the aesthetics of the overall electronic device.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figure 1 to Figure 3. FIG. 1 is a three-dimensional schematic diagram of a decoration component according to the first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Fig. 3 is a schematic cross-sectional view of the circuit board of Fig. 2 along the cut line 3-3.

The decoration component 1 of this embodiment is, for example, the back cover of a smart phone. The decoration component 1 includes a circuit board 10, a light emitting element 20, a light guide plate 30 and a decoration element 40.

The thickness T of the circuit board 10 is between 0.05 mm and 0.1 mm, and the circuit board 10 includes a board body 11, a first printed circuit 12, a second printed circuit 13, a first conductive pad 14 and a The second conductive pad 15.

The board body 11 of the circuit board 10 has a first surface 111, a second surface 112, a plurality of first through holes 113 and a plurality of second through holes 114. The diameter R1 of each first through hole 113 and the diameter R2 of each second through hole 114 are between 0.4 mm and 2 mm, and the first through holes 113 and the second through holes 114 penetrate the board The first surface 111 and the second surface 112 of the body.

The first printed circuit 12 is printed on the board 11, and a part of the first printed circuit 12 is located on the first surface 111 of the board 11, and another part of the first printed circuit 12 is located in the first through holes 113. The second printed circuit 13 is printed on the board 11, and a part of the second printed circuit 13 is located on the first surface 111 of the board 11, and another part of the second printed circuit 13 is located in the second through holes 114. In detail, the first printed circuit 12 located in the first through hole 113, for example, extends along the wall surface surrounding the first through hole 113 to the second surface 112 of the board 11, and is located in the first through hole 113. A printed circuit 12 covers a part of the wall surface surrounding the first through hole 113. The second printed circuit 13 located in the second through hole 114 is, for example, the second printed circuit 13 extending along the wall surrounding the second through hole 114 to the second surface 112 of the board 11 and located in the second through hole 114 The covering part surrounds the wall surface of the second through hole 114. The first conductive pad 14 is disposed on the second surface 112 of the board 11 and is electrically connected to the first printed circuit 12 located in the first through hole 113 and extending to the second surface 112. The second conductive pad 15 is disposed on the second surface 112 of the board 11 and is electrically connected to the second printed circuit 13 located in the second through hole 114 and extending to the second surface 112. The first conductive pad 14 and the second conductive pad 15 are, for example, used to electrically contact a pogo pin (not shown) of a power source or a conductive spring sheet.

In this embodiment, the arrangement of the first printed circuit 12 located in the first through hole 113 covering a portion of the wall surface of the first through hole 113 is not intended to limit the present invention. In other embodiments, the first printed circuit located in the first through hole may cover the entire wall surface surrounding the first through hole. Similarly, in other embodiments, the second printed circuit located in the second through hole may cover the entire wall surface surrounding the second through hole.

In addition, it can be seen from FIG. 3 that the first printed circuit 12 does not fill the entire first through hole 113, but it is not limited to this. In other embodiments, the first printed circuit may fill the entire first through hole. Similarly, in other embodiments, the second printed circuit can also fill the entire second through hole.

The light emitting element 20 is, for example, a white light LED lamp. The light emitting element 20 is disposed on the first surface 111 of the board 11, and the light emitting element 20 is electrically connected to the first printed circuit 12 and the second printed circuit 13. In this way, the light-emitting element 20 forms a loop with the power source through the first printed circuit 12, the second printed circuit 13, the first conductive pad 14 and the second conductive pad 15. Therefore, when the first conductive pad 14 and the second conductive pad 15 are electrically connected to the power source, the light emitting element 20 can emit light.

In this embodiment, the plurality of first through holes 113 can allow a plurality of electrical properties between the first printed circuit 12 on the first side 111 of the board 11 and the first conductive pad 14 on the second side 112. The connection point is used to improve the electrical connection quality between the first printed circuit 12 on the first surface 111 of the board body 11 and the first conductive pad 14. Similarly, the plurality of second through holes 114 can also improve the electrical connection quality between the second printed circuit 13 and the second conductive pad 15 on the first surface 111 of the board body 11. However, the number of the first through holes 113 and the second through holes 114 is not limited to multiple. In other embodiments, both the first through hole and the second through hole may be one.

In addition, the decoration device 1 of this embodiment further includes a chip resistor 50. The chip resistor 50 is disposed on the first surface 111 of the board body 11 and is electrically connected to the first printed circuit 12. The chip resistor 50 is used to adjust the current passing through the light-emitting element 20 to avoid overload of the light-emitting element 20.

Next, please refer to FIGS. 2 and 4 together. FIG. 4 is a partial cross-sectional view of the decoration assembly of FIG. 2.

The light emitting element 20 has a light emitting surface 21. The light guide plate 30 is stacked on the first surface 111 of the board 11, and the light guide plate 30 has a light incident surface 31, a light output surface 32 and a plurality of light guide structures 33. The light incident surface 31 of the light guide plate 30 corresponds to the light emitting surface 21 of the light emitting element 20. The shape of each light guide structure 33 is, for example, a dot shape, and these light guide structures 33 are printed on the light-emitting surface 32 of the light guide plate 30 through printing, for example.

In this embodiment, the number of the light guide structure 33 is multiple, and the shape of the light guide structure 33 is a dot-like arrangement, which is not intended to limit the present invention. In other embodiments, the number of the light guide structure may be only one, and the shape of the light guide structure may be a grid.

The decoration 40 includes a substrate layer 41, a shielding layer 42 and a light-transmitting layer 43. The base layer 41 is, for example, a transparent sheet, and the shielding layer 42 is provided on the base layer 41. The shielding layer 42 has a light shielding portion 421 and a light transmitting portion 422. The light-shielding part 421 is, for example, a part printed with black ink, and the light-shielding part 421 is not light-transmissive. The light-transmitting portion 422 is, for example, a portion not printed by ink, and the light-transmitting portion 422 is light-transmissive. The light shielding portion 421 and the light transmitting portion 422 jointly form a pattern structure 423, and the pattern structure 423 is exposed on the base layer 41. The light transmittance of the light-transmitting layer 43 is, for example, between 20% and 50%, and the light-transmitting layer 43 includes a coating portion 431 and a soft light portion 432. The color of the coating portion 431 is, for example, silver, and the coating portion 431 is disposed on a side of the shielding layer 42 away from the base layer 41. The color of the soft light portion 432 is, for example, white, and the soft light portion 432 is disposed on a side of the coating portion 431 away from the shielding layer 42. The soft light portion 432 is stacked on the light emitting surface 32 of the light guide plate 30, and the light transmission portion 422 of the shielding layer 42 corresponds to the light guide structures 33 of the light guide plate 30.

When the light emitting element 20 emits light, the light enters the light guide plate 30 from the light entrance surface 31 of the light guide plate 30, and then the light guide structures 33 on the light exit surface 32 guide the light to the soft light portion 432, so that the light enters the soft light portion 432. Then, the light will penetrate the soft light part 432, the coating part 431, the light transmitting part 422 of the shielding layer 42, and the base material layer 41 to be emitted, so that the pattern structure 423 of the decoration member 40 is irradiated by light. Therefore, when the decorative component 1 is used as the back cover of a smart phone, the pattern structure 423 irradiated by light can improve the appearance of the smart phone.

In this embodiment, the arrangement of the soft light portion 432 can shield the light guide structures 33 of the light guide plate 30, so as to prevent the light guide structures 33 from being exposed through the light-transmitting portion 422 of the shielding layer 42, and maintain the overall decoration assembly 1. The aesthetics.

In addition, the soft light portion 432 can soften the light emitted by the light emitting element 20, so that the visual comfort of the viewer can be improved.

The color of the soft light part 432 and the color of the light emitting element 20 are not limited to both being white. In other embodiments, the color of the soft light portion and the color of the light emitting element may be other colors, for example, both are blue. Furthermore, the arrangement that the color of the soft light portion 432 is the same as the color of the light emitting element 20 is not intended to limit the present invention. In other embodiments, the color of the soft light part and the color of the light-emitting element may be different.

Furthermore, the arrangement where the soft light portion 432 is superimposed on the coating portion 431 can provide the effect of isolating the coating portion 431 from the outside, so as to prevent the coating portion 431 from contacting the outside and oxidizing, and can effectively reduce the coating portion 431 from the shielding layer 42 Probability of peeling.

In addition, the arrangement of the coating portion 431 can ensure that the light guiding structure 33 is lifted down before the light guide structure 33 is shielded by the soft portion 432, and the brightness of the light passing through the coating portion 431 is maintained.

In this embodiment, the transparent layer 43 is provided with the coating portion 431 and the soft light portion 432 at the same time, which is not intended to limit the present invention. In other embodiments, the light-transmitting layer may only have a coating portion, or the light-transmitting layer may only have a soft light portion.

Since the first printed circuit 12 in the first through hole 113 and the second printed circuit 13 in the second through hole 114 are formed by printing, the board body 11 of the circuit board 10 can be a thinner plate. It is beneficial to reduce the overall thickness of the decoration element 1 to 1 mm. Therefore, when the decorative component 1 is used as the back cover of a smart phone, it can ensure that the overall smart phone maintains the thinning effect.

In the foregoing embodiment, the decoration member 40 is formed by sequentially stacking the base layer 41, the shielding layer 42, and the light-transmitting layer 43, but it is not limited to this. Please refer to FIG. 5. FIG. 5 is a schematic partial cross-sectional view of the decoration element of the decoration assembly according to the second embodiment of the present invention.

The decoration component 1a of this embodiment is similar to the decoration component 1 of FIG. 1, and only the differences will be described below.

The decoration 40a of this embodiment includes a base material layer 41a, a transfer layer 42a, a light-transmitting layer 43a, and a shielding layer 44a. The transfer layer 42a is disposed on the base material layer 41a by, for example, nano transfer technology, and the transfer layer 42a is cured by, for example, ultraviolet light. The light-transmitting layer 43a includes a coating portion 431a and a soft light portion 432a. The coating portion 431a is stacked on the side of the transfer layer 42a away from the base layer 41a, and the shielding layer 44a is stacked on the side of the coating portion 431a away from the transfer layer 42a. The soft light portion 432a is disposed on a side of the shielding layer 44a away from the coating portion 431a, and the soft light portion 432a is stacked on the light emitting surface 32a of the light guide plate 30a.

In this embodiment, the transfer layer 42a of the decorative element 40a can be printed with a hairline pattern or a card dream pattern through nano transfer printing and UV hardening technology printing. Therefore, when light penetrates the soft light portion 432a, the light-transmitting portion 442a of the shielding layer 44a, the coating portion 431a, the transfer layer 42a, and the base layer 41a, it will be observed from the area where the light passes through the decoration element 1a. The effect of texture and gloss enhances the aesthetics of the smartphone equipped with the decorative component 1a.

According to the decoration component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The board is beneficial to reduce the overall thickness of the decorative components. Therefore, when the decorative component is used as the back cover of a smart phone, it can ensure that the overall smart phone maintains the thinning effect.

In addition, through the arrangement of the light-emitting element and the light guide plate, the light emitted by the light-emitting element can be irradiated on the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component is used as the back cover of a smart phone, the illuminated pattern structure can increase the aesthetics of the smart phone.

Although the present invention is disclosed in the foregoing preferred embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

1. 1a: decorative component 10: circuit board 11: board body 111: first side 112: second side 113: first through hole 114: second through hole 12: first printed circuit 13: second printed circuit 14: The first conductive pad 15: the second conductive pad 20: the light emitting element 21: the light emitting surface 30, 30a: the light guide plate 31: the light incident surface 32, 32a: the light exit surface 33: the light guide structure 40, 40a: the decorative element 41, 41a: Base material layer 42, 44a: shielding layer 42a: transfer layer 421: light shielding part 422, 442a: light transmitting part 423: pattern structure 43, 43a: light transmitting layer 431, 431a: coating part 432, 432a: soft light part 50 : Chip resistance R1, R2: Diameter T: Thickness

FIG. 1 is a three-dimensional schematic diagram of a decoration component according to the first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Fig. 3 is a schematic cross-sectional view of the circuit board of Fig. 2 along the cut line 3-3. Fig. 4 is a schematic partial cross-sectional view of the decoration assembly of Fig. 2. FIG. 5 is a schematic partial cross-sectional view of a decorative element of a decorative component according to a second embodiment of the present invention.

10: circuit board

11: Board body

111: The first side

112: second side

113: first through hole

114: second through hole

12: The first printed circuit

13: The second printed circuit

20: luminous parts

30: Light guide plate

32: Glossy surface

33: Light guide structure

40: decorative pieces

421: Shading part

422: Translucent part

423: pattern structure

50: chip resistance

Claims (10)

A decorative component includes: a circuit board, including a board body, a first printed circuit, a second printed circuit, a first conductive pad, and a second conductive pad. The board has a first surface and a second conductive pad. Two sides, at least one first through hole and at least one second through hole, the at least one first through hole and the at least one second through hole penetrate the first and second sides of the board, the first A printed circuit and the second printed circuit are printed on the board, a part of the first printed circuit is located on the first surface, another part of the first printed circuit is located in the at least one first through hole, and the second printed circuit A part of the second printed circuit is located on the first surface, the other part of the second printed circuit is located in the at least one second through hole, the first conductive pad and the second conductive pad are both disposed on the second surface, and the first conductive The pad and the second conductive pad are respectively electrically connected to the first printed circuit in the at least one first through hole and the second printed circuit in the at least one second through hole; a light emitting element is disposed on the board The first surface of the body, and the light-emitting element is electrically connected to the first printed circuit and the second printed circuit, the light-emitting element has a light-emitting surface; a light guide plate stacked on the first surface of the board , And the light guide plate has a light-incident surface and a light-emitting surface, the light-incident surface corresponds to the light-emitting surface; and a decorative element stacked on a side of the light-guide plate away from the circuit board, the decorative element has a pattern Structure, the pattern structure corresponds to the light emitting surface of the light guide plate; wherein the diameters of the at least one first through hole and the at least one second through hole are both between 0.4 mm and 2 mm, the circuit board The thickness is between 0.05 mm and 0.1 mm. According to the decorative component described in claim 1, wherein the light guide plate further has at least one light guide structure, the at least one light guide structure is located on the light emitting surface of the light guide plate, and The pattern structure of the decorative piece corresponds to the at least one light guide structure. According to the decoration device described in item 2 of the scope of patent application, the number of the at least one light guide structure is multiple, and the shape of each light guide structure is dot-shaped. According to the decorative element described in claim 1, wherein the decorative element comprises a substrate layer, a shielding layer and a light-transmitting layer, the shielding layer is disposed on the substrate layer, and the shielding layer has a light-shielding portion and A light-transmitting part, the light-shielding part is not light-transmissive, the light-transmitting part is light-transmissive, the light-shielding part and the light-transmitting part jointly form the pattern structure, the pattern structure is exposed on the substrate layer, and the light-transmitting layer It comprises a soft light part, the soft light part is arranged on a side of the shielding layer away from the base material layer, and the soft light part is laminated on the light emitting surface of the light guide plate. According to the decoration device described in item 4 of the scope of patent application, the light transmittance of the light-transmitting layer is between 20% and 50%. According to the decoration component described in item 4 of the scope of patent application, the color of the soft light part is the same as the light-emitting color of the light-emitting element. According to the decoration device described in item 4 of the scope of patent application, the light-transmitting layer further includes a coating part, and the coating part is disposed between the soft light part and the shielding layer. The decoration device according to claim 4, wherein the decoration further includes a transfer layer, and the light-transmitting layer further includes a coating portion, the transfer layer is disposed on the substrate layer, and the coating portion is stacked Located on the side of the transfer layer away from the substrate layer, the shielding layer is stacked on the side of the coating part away from the transfer layer, and the soft part is stacked on the side of the shielding layer away from the coating part . According to the decorative device described in item 8 of the scope of patent application, the transfer layer is formed by ultraviolet curing transfer technology. Such as the decorative component described in item 1 of the scope of patent application, wherein the at least one The numbers of a through hole and the at least one second through hole are both multiple, the part of the first printed circuit is located in the first through holes, and the part of the second printed circuit is located in the second through holes.

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