TWI382793B - Self-luminous circuit board structure - Google Patents

Self-luminous circuit board structure Download PDF

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TWI382793B
TWI382793B TW98102756A TW98102756A TWI382793B TW I382793 B TWI382793 B TW I382793B TW 98102756 A TW98102756 A TW 98102756A TW 98102756 A TW98102756 A TW 98102756A TW I382793 B TWI382793 B TW I382793B
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circuit board
light
circuit
self
substrates
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TW98102756A
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TW201029525A (en
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Chih Cherng Lin
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Chicony Electronics Co Ltd
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Description

可自發光之電路板結構Self-illuminating circuit board structure

本發明係提供一種可自發光之電路板結構,尤指可供產生亮光以向外部投射之電路板結構,藉由電路板內部側向設置有發光部,可供亮光側向集中投射於電路板內,提高電路板發光之效能。The invention provides a self-illuminating circuit board structure, in particular to a circuit board structure for generating bright light for external projection, wherein a light emitting portion is laterally disposed inside the circuit board, and the bright light is laterally projected onto the circuit board. Improve the performance of the board's illumination.

目前,在這科技進步的時代,電子產品帶給了人們一個便利的環境,然而,大多數的輸入性電子產品皆需要按鍵來進行文字、數字或指令的輸入,如滑鼠、鍵盤或是遊戲所適用的搖桿、光槍等,但隨著產品的日新月異,按鍵也需針對不同的需求來加以改變,例如從早期桌上型電腦的鍵盤所使用的按鍵到筆記型電腦所使用的按鍵,其差異就相當的大,因筆記型電腦強調的是輕、薄、短、小,所以其所使用的按鍵就無法像桌上型電腦的鍵盤,而必須符合上述筆記型電腦的特性來加以改變。At present, in this era of technological advancement, electronic products bring people a convenient environment. However, most input electronic products require buttons for inputting text, numbers or commands, such as mouse, keyboard or game. Applicable rocker, light gun, etc., but as the product changes with each passing day, the buttons need to be changed according to different needs, such as the keys used in the keyboard of the early desktop computer to the keys used in the notebook computer, The difference is quite large, because the notebook computer emphasizes that it is light, thin, short, and small, so the buttons used cannot be like the keyboard of a desktop computer, but must be changed according to the characteristics of the above notebook computer. .

再者,如行動電話的按鍵原本無法發光,但人們卻會在光線昏暗處使用行動電話,此時卻無法準確的按壓到所需的按鍵,是以便有廠商針對此一問題提出改良,使按鍵可發出光源以方便人們使用,請參閱第十三圖所示,該發光鍵盤為設有鍵盤部A、背光裝置B,其鍵盤部A為於底板A1上方設有電路板A2,且電路板A2上設有朝下發射光源之發光元件A21,並於電路板A2上方設有具彈性元件A31之塑膠薄膜A3,而底板A1又透過連結機構A4朝上連接有按鍵A5,再於鍵盤部A之底板A1下方設有背光裝置B之導光板B1,且導光板B1下方又設有反射板B2。In addition, if the button of the mobile phone is not able to emit light, but people will use the mobile phone in dimly lit places, but it is impossible to accurately press the required button, so that some manufacturers can improve the problem and make the button The light source can be emitted for convenient use by people. Please refer to the thirteenth figure. The illuminated keyboard is provided with a keyboard portion A and a backlight device B. The keyboard portion A is provided with a circuit board A2 above the bottom plate A1, and the circuit board A2 is provided. A light-emitting element A21 having a downward-emitting light source is disposed, and a plastic film A3 having an elastic member A31 is disposed above the circuit board A2, and the bottom plate A1 is further connected with a button A5 through the connecting mechanism A4, and then is connected to the keyboard portion A. A light guide plate B1 of the backlight device B is disposed under the bottom plate A1, and a reflection plate B2 is further disposed under the light guide plate B1.

該電路板A2之發光元件A21為朝下發射光源,光源穿過底板A1後照射於背光裝置B之導光板B1,且導光板B1為將光源投射至反射板B2,利用反射板B2反射光源後,再依序穿過導光板B1及鍵盤部A,使鍵盤部A頂部之按鍵A5具有亮光顯現,但因鍵盤部A及背光裝置B之組構元件多,則造成鍵盤部A與背光裝置B結合後的厚度增加,在實際使用時仍存在諸多缺失,如:The light-emitting element A21 of the circuit board A2 is a downward-emitting light source. The light source passes through the bottom plate A1 and is irradiated to the light guide plate B1 of the backlight device B. The light guide plate B1 projects the light source to the reflection plate B2, and the light source is reflected by the reflection plate B2. Then, the light guide plate B1 and the keyboard portion A are sequentially passed through, so that the button A5 at the top of the keyboard portion A has a bright light. However, since the keyboard component A and the backlight device B have many components, the keyboard portion A and the backlight device B are caused. After the combination of increased thickness, there are still many defects in actual use, such as:

(1)電路板A2之發光元件A21於向下發射光源之後,經過多次的反射、折射,最後才將亮光投射至按鍵A5處,然在光源經過多次的反射之後,將造成光的混雜、並減損光源的亮度、造成光的損耗,按鍵A5處的亮光顯現效果也較差。(1) After the light-emitting element A21 of the circuit board A2 emits the light source downward, it undergoes multiple reflections and refractions, and finally the light is projected onto the button A5, but after the light source is repeatedly reflected, the light is mixed. And to reduce the brightness of the light source, resulting in loss of light, the light at the button A5 shows a poor effect.

(2)鍵盤部A加上背光裝置B後之厚度增加,無法適用、符合在電子裝置輕、薄、短、小的設計訴求之中,將導致電子裝置的鍵盤厚度也會隨著元件的增多而加厚。(2) The thickness of the keyboard unit A plus the backlight device B increases, which is unsuitable and conforms to the design requirements of light, thin, short and small electronic devices, which will lead to an increase in the thickness of the keyboard of the electronic device. And thicker.

(3)鍵盤部A之底板A1上設置有複數軸座,且各軸座需穿過電路板A2才可供連結機構A4進行組裝,導致電路板A2上需透設有複數之穿孔,則可設置線路佈局之空間位置大量縮減,設計及製作上較為困難、耗時及費工。(3) The bottom plate A1 of the keyboard portion A is provided with a plurality of axle seats, and each axle seat needs to pass through the circuit board A2 to be assembled by the connecting mechanism A4, so that a plurality of perforations are required to be penetrated on the circuit board A2. The spatial position of the layout of the circuit is greatly reduced, and it is difficult, time-consuming and labor-intensive to design and manufacture.

(4)若於鍵盤部A之電路板A2上設有複數薄膜,並於薄膜之不同表面上分別設置供電電路、訊號傳輸電路,雖可用來解決空間不足之缺失,但因複數薄膜需進行多次加工來設置多種電路,導致生產製造成本大為上漲。(4) If a plurality of films are provided on the circuit board A2 of the keyboard portion A, and a power supply circuit and a signal transmission circuit are respectively disposed on different surfaces of the film, although it can be used to solve the lack of space shortage, the plurality of films need to be carried out. Sub-machining to set up a variety of circuits has led to a significant increase in manufacturing costs.

是以,上述習用於發光鍵盤所使用之電路板,因具有諸多問題與缺失,此即為本發明人與從事此行業者所亟欲改善之目標所在。Therefore, the above-mentioned circuit board used in the illuminated keyboard has many problems and lacks, which is the object of the inventor and the person in charge of the industry.

故,發明人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,經由不斷試作及修改,始設計出此種可透過側向投射光源於電路板內,以有效提升電路板亮光顯現作用之可自發光之電路板結構的發明專利誕生者。Therefore, in view of the above-mentioned shortcomings, the inventors collected relevant information, and through multi-party evaluation and consideration, through continuous trial and modification, the transparent projection light source was designed in the circuit board to effectively enhance the brightness of the circuit board. The birth of the invention patent for the self-illuminating circuit board structure.

本發明之主要目的乃在於該電路板係為可透光材質之二基板所製成,並在電路板上設有一個以上可均勻透射光線之導光部,以及直立設置有一個以上之發光部,為可供側向投射亮光於電路板內,再經由導光部向外投射,而發光部係於電路板間並電性導通於線路層之線路佈局,則線路層為固設於電路板內,達到電路板內由發光部側向發光,以集中亮光再由導光部向外投射之目的,減少光損耗現象,並可增益電路板發光之亮度。The main purpose of the present invention is that the circuit board is made of two substrates of light transmissive material, and one or more light guiding portions for uniformly transmitting light are disposed on the circuit board, and one or more light emitting portions are erected. The circuit layer is fixed on the circuit board for lateral projection of the light in the circuit board and then projecting outward through the light guiding portion, and the light emitting portion is disposed between the circuit boards and electrically connected to the circuit layer. Within the circuit board, the light-emitting portion is laterally illuminated to concentrate the light and then project outward from the light guiding portion, thereby reducing the optical loss phenomenon and gaining the brightness of the circuit board.

本發明之次要目的乃在於該電路板係為可透光材質且厚薄相異之二基板所相對設置組成,且上層基板厚度尺寸可較薄於下層基板(亦可使上層基板略厚於下層基板),並於下層較厚基板內設有一個以上可供光線均勻透射之導光部,且可直立設置有一個以上之發光部,而發光部係可為表面黏著型之發光二極體(LED),係採直立式設置於下層基板內。The secondary object of the present invention is that the circuit board is composed of two substrates having a light-transmissive material and different thicknesses, and the thickness of the upper substrate can be thinner than that of the lower substrate (the upper substrate can also be slightly thicker than the lower layer). a substrate), and one or more light guiding portions for uniformly transmitting light in the lower thick substrate, and one or more light emitting portions may be erected, and the light emitting portion may be a surface-adhesive light emitting diode ( The LED) is placed upright in the lower substrate.

為達成上述目的及功效,本發明所採用之技術手段及其構造,茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。In order to achieve the above objects and effects, the technical means and the configuration of the present invention will be described in detail with reference to the preferred embodiments of the present invention.

請參閱第一、二、三、四圖所示,係為本發明之立體分解圖、側視剖面分解圖、側視剖面圖、立體外觀圖,由圖中可以清楚看出,其可自發光之電路板結構係至少包括有電路板1、線路層2所組成;其中:該電路板1係具有二相對式層疊狀設置之基板11、12,且二基板11、12可為透明、半透明材質製成,而下層基板12內,設置有一個以上之發光部121,再於下層基板12上設有一個以上之導光部122,並在二相對式之基板11、12間設有絕緣隔離層101,即可在二基板11、12間形成有組合空間10。Please refer to the first, second, third and fourth figures, which are perspective exploded view, side exploded view, side cross-sectional view and stereoscopic view of the present invention. It can be clearly seen from the figure that it can be self-illuminating. The circuit board structure comprises at least a circuit board 1 and a circuit layer 2; wherein: the circuit board 1 has two oppositely arranged substrates 11 and 12, and the two substrates 11, 12 can be transparent and translucent. The material is formed, and one or more light-emitting portions 121 are disposed in the lower substrate 12, and one or more light-guiding portions 122 are disposed on the lower substrate 12, and insulation is provided between the two opposite substrates 11 and 12. In the layer 101, a combined space 10 can be formed between the two substrates 11 and 12.

該線路層2係可為軟性電路板,且內部為具有以銀漿層設置成預設的訊號、電源之線路,再予以組合成線路佈局,可有效減縮線路層2之厚度,使線路層2呈現較薄尺寸,並由線路佈局一側設有延伸至線路層2外側之連接部21。The circuit layer 2 can be a flexible circuit board, and the internal line is provided with a predetermined signal and power supply line with a silver paste layer, and then combined into a line layout, which can effectively reduce the thickness of the circuit layer 2, so that the circuit layer 2 The thinner dimensions are presented, and a connecting portion 21 extending to the outside of the wiring layer 2 is provided on one side of the line layout.

上述各構件於組裝時,為以電路板1之基板11、12間的組合空間10供收納線路層2並予以定位,並可利用絕緣隔離層101予以隔離,且以線路層2內部之線路佈局分別電性連接於二基板11、12及各發光部121,即組合成本發明可自發光之電路板1,為以線路層2之連接部21電性連接於外部預設之供電源,而由線路層2之線路佈局與電路板1之二基板11、12及發光部121電性導通,該發光部121之電源線路則可沿著線路層2之線路佈局,延伸至線路層2外側之連接部21(請同時參閱第九、十一、十二圖所示);而發光部121之電源線亦可單獨延伸出電路板1外側,位於線路層2之連接部21的側邊,直接與外部電源電性連接,則可透過線路層2供發光部121,在下層基板12內呈側向發光,而可將光源集中投射入基板12內之各導光部122處,並透過導光部122導引光源均勻向外投射,且發光部121為呈側向發光進入基板12內,可使光線較集中、且不易往周邊散射,則供光源由導光部122處,均勻的導引光線透過上層基板11向外投射,可以增益電路板1的發光效能,且具有良好的發光亮度,並組構成本發明電路板1之結構。When the above-mentioned components are assembled, the wiring layer 2 is accommodated and positioned in the combined space 10 between the substrates 11 and 12 of the circuit board 1, and can be isolated by the insulating isolation layer 101, and the wiring layout inside the wiring layer 2 is used. Electrically connected to the two substrates 11 and 12 and the respective light-emitting portions 121, that is, the circuit board 1 which can be self-illuminating according to the invention, is electrically connected to the external predetermined power supply by the connecting portion 21 of the circuit layer 2, The circuit layout of the circuit layer 2 is electrically connected to the two substrates 11 and 12 of the circuit board 1 and the light-emitting portion 121. The power supply line of the light-emitting portion 121 can be arranged along the line of the circuit layer 2 and extend to the outer side of the circuit layer 2. The portion 21 (please refer to the ninth, eleventh, and twelfth drawings at the same time); and the power line of the light-emitting portion 121 can also extend out of the outer side of the circuit board 1 at the side of the connecting portion 21 of the circuit layer 2, directly When the external power source is electrically connected, the light-emitting portion 121 can be transmitted through the circuit layer 2 to emit light laterally in the lower substrate 12, and the light source can be collectively projected into the light guiding portions 122 in the substrate 12 and transmitted through the light guiding portion. 122 guiding light source is uniformly projected outward, and the light emitting portion 121 is present When the light enters the substrate 12, the light is concentrated and is not easily scattered to the periphery. Then, the light source is guided by the light guiding portion 122, and the uniform guiding light is projected outward through the upper substrate 11, so that the luminous performance of the circuit board 1 can be gained. And having a good luminance of light, and constituting the structure of the circuit board 1 of the present invention.

而前述之電路板1的二相對式層疊之基板11、12,並可具有厚薄相異之厚度尺寸,以上層基板11厚度尺寸較薄於下層基板12之厚度尺寸(亦可使上層基板11厚度略厚於下層基板12之厚度),且基板11、12係可為聚碳酸酯(PC)、聚對苯二甲酸乙二醇酯(PET)、聚甲基丙烯酸甲酯(PMMA)或其他具導光之可撓性材質所製成;而二基板11、12間所設之隔離絕緣層101,係可為透明或半透明材質所製成,可供發光部121之亮光透射。The two oppositely stacked substrates 11 and 12 of the circuit board 1 may have thicknesses different in thickness, and the thickness of the upper substrate 11 is thinner than the thickness of the lower substrate 12 (the thickness of the upper substrate 11 may also be made). Slightly thicker than the thickness of the underlying substrate 12), and the substrates 11, 12 may be polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) or the like. The light-shielding flexible material is formed; and the isolation insulating layer 101 disposed between the two substrates 11 and 12 is made of a transparent or translucent material, and the light of the light-emitting portion 121 can be transmitted.

至於上述之線路層2,係可為軟性材質製成之軟性線路板,且軟性線路板可為二片不同線路佈局之線路板,利用導電膠予以黏接組合成線路層2;而軟性線路板亦可為單一線路板型式,二側設置不同之線路佈局,再將一側線路板翻折結合於另側線路板上,並利用導電膠予以黏接,亦可成型為線路層2。As for the above circuit layer 2, it may be a flexible circuit board made of soft material, and the flexible circuit board may be two circuit boards of different line layouts, which are bonded and assembled into a circuit layer 2 by using conductive glue; and the flexible circuit board It can also be a single circuit board type, with different circuit layouts on the two sides, and then one side circuit board is folded and joined to the other side circuit board, and is bonded by conductive glue, or can be formed into the circuit layer 2.

請參閱第一、二、五、六圖所示,係為本發明之立體分解圖、側視剖面分解圖、較佳實施例之立體分解圖、另一實施例之側視剖面圖,由圖中可以清楚看出,該電路板1下方可設有底板4及反射層42,且底板4外周緣利用朝上之側壁41,使內部形成有容置空間40,並於側壁41鄰近容置空間40一側設有定位部411,便可將電路板1、線路層2、定位板13及按壓元件15,分別裝設於底板4之容置空間40內而位於反射層42上方,且以底板4之定位部411將電路板1之定位板13固定,便可完成電路板1、按壓元件15及底板4之組裝,即可將基板12內之發光部121所產生之亮光,藉由反射層42向上反射至電路板1,可提升電路板1發光、亮顯之效用,亦可避免電路板1、線路層2及定位板13產生脫落、毀損,進而可方便成品進行存放、搬運。Please refer to the first, second, fifth and sixth figures, which are perspective exploded view, side exploded view, and exploded perspective view of a preferred embodiment, and a side cross-sectional view of another embodiment. It can be clearly seen that the bottom plate 4 and the reflective layer 42 can be disposed under the circuit board 1. The outer peripheral edge of the bottom plate 4 is formed with an upwardly facing side wall 41 to form an accommodating space 40 therein, and adjacent to the accommodating space of the side wall 41. The positioning portion 411 is disposed on one side of the 40, and the circuit board 1, the circuit layer 2, the positioning plate 13, and the pressing member 15 are respectively disposed in the accommodating space 40 of the bottom plate 4 and located above the reflective layer 42 with the bottom plate. The positioning portion 411 of the fixing portion 411 of the circuit board 1 fixes the positioning plate 13 of the circuit board 1 to complete the assembly of the circuit board 1, the pressing member 15, and the bottom plate 4, so that the light generated by the light-emitting portion 121 in the substrate 12 can be reflected by the reflective layer. 42 is reflected upward to the circuit board 1, which can improve the effect of the light-emitting and brightening of the circuit board 1, and can also prevent the circuit board 1, the circuit layer 2 and the positioning board 13 from falling off and being damaged, thereby facilitating storage and handling of the finished product.

該電路板1之基板11、12、線路層2因設置於底板13下方,使得電路板1、線路層2不需透設過多的貫穿槽孔,則因貫穿槽孔減少即使電路板1、線路層2之使用面積增加,可供電路板1與線路層2上具有較大面積以供線路佈局進行設置,便可避免因電路板1與線路層2空間有限,而線路佈局需佔用較多空間,使得線路佈局必須縝密進行計算之缺失,所導致耗時、耗工及製造難度提升,亦不需將線路佈局設置於二基板11、12之不同表面,且透過絕緣隔離層101予以隔離,進而可提昇電路板1、線路層2於設計、製作上之方便性,並增加導光亮顯之效果。The substrates 11 and 12 and the circuit layer 2 of the circuit board 1 are disposed under the bottom plate 13, so that the circuit board 1 and the circuit layer 2 do not need to have too many through-holes, and even the board 1 and the line are reduced by the through-holes. The use area of the layer 2 is increased, and the circuit board 1 and the circuit layer 2 have a large area for the circuit layout, so that the space of the circuit board 1 and the circuit layer 2 is limited, and the line layout needs to occupy more space. Therefore, the layout of the circuit must be carefully calculated, resulting in time-consuming, labor-intensive, and manufacturing difficulties. It is also unnecessary to arrange the circuit layout on different surfaces of the two substrates 11, 12, and is isolated by the insulating isolation layer 101. The circuit board 1 and the circuit layer 2 can be improved in design and manufacture, and the effect of guiding light is enhanced.

上述按壓元件15可為透明或半透明材質所製成,且按壓元件15可為鍵帽、薄板或其他型式,其按壓元件15可於上表面局部塗佈漆層,使未塗佈漆層處形成有可發亮之圖案、文字,或於按壓元件15上表面塗佈漆層後,再以鐳射雕刻方式形成可發亮之圖案、文字,其僅具使用者按壓在按壓元件15後,可透過彈性元件3觸壓電路板1組合空間10內位於絕緣隔離層101二側之線路層2,由線路層2發出相對應訊號,而可供內部光源照射至外部之功能即可,非因此即侷限本發明之專利範圍,如利用其他修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。The pressing member 15 can be made of a transparent or translucent material, and the pressing member 15 can be a key cap, a thin plate or other type, and the pressing member 15 can partially apply a lacquer layer on the upper surface to make the uncoated lacquer layer Forming a pattern or a brightened pattern, or applying a lacquer layer on the upper surface of the pressing member 15, and then forming a illuminable pattern and characters by laser engraving, which can only be pressed by the user after pressing the pressing member 15. The circuit layer 2 on the two sides of the insulating isolation layer 101 in the combination space 10 is touched by the elastic member 3, and the corresponding signal is emitted by the circuit layer 2, and the internal light source can be externally irradiated. That is, the scope of the patents of the present invention, such as the use of other modifications and equivalent structural changes, should be included in the scope of the patent of the present invention and incorporated in the specification.

請參閱第三、六、七、八圖所示,係為本發明之側視剖面圖、另一實施例之側視剖面圖、再一實施例之側視剖面圖、又一實施例之側視剖面圖,由圖中可以清楚看出本發明之電路板1,於下層基板12所設至少一個以上之導光部122,則可為複數凸點、波浪形連續曲面、連續V形凹槽、導光油墨或其他可以集中亮光之導光結構;而該電路板1係可於下層基板12的上表面(或下表面)設有一個以上之導光部122,且該導光部122亦可成型於上層基板11之上表面(或下表面),上層基板11之厚度尺寸,為略薄於下層基板12之厚度尺寸(亦可使上層基板11之厚度較厚於下層基板12之厚度),則藉由較厚(或較薄)之下層基板12內,設置有至少一個以上之發光部121,亦可於上層基版11內部有至少一個以上之發光部121,即可利用至少一個以上之發光部121以亮光投射至上層基板11、下層基板12,並由各導光部122予以反射至各按壓元件15下方。3, 6, 7, and 8 are side cross-sectional views of the present invention, side cross-sectional views of another embodiment, side cross-sectional views of still another embodiment, and side of still another embodiment. Referring to the cross-sectional view, it can be clearly seen from the figure that the circuit board 1 of the present invention has at least one or more light guiding portions 122 disposed on the lower substrate 12, and may be a plurality of bumps, a wave-shaped continuous curved surface, and a continuous V-shaped groove. a light guiding ink or other light guiding structure capable of concentrating bright light; and the circuit board 1 is provided with one or more light guiding portions 122 on the upper surface (or lower surface) of the lower substrate 12, and the light guiding portion 122 is also The upper substrate 11 may be formed on the upper surface (or lower surface) of the upper substrate 11. The thickness of the upper substrate 11 is slightly thinner than the thickness of the lower substrate 12 (the thickness of the upper substrate 11 may be thicker than the thickness of the lower substrate 12). At least one or more of the light-emitting portions 121 may be provided in the thicker (or thinner) lower substrate 12, or at least one or more of the light-emitting portions 121 may be provided inside the upper substrate 11, and at least one or more may be utilized. The light emitting portion 121 is projected onto the upper substrate 11 and the lower substrate 12 with bright light. And each of the light guide portion 122 to be reflected to the pressing member 15 downward.

再者,該電路板1於上層基板11上方設有定位板13,而於定位板13上分別設有中心孔130、複數對接部131,且各對接部131係分別樞設於連動裝置14之軸部141,並於各連動裝置14另側之軸部141,再分別樞設於複數按壓元件15底面之各對接部151,則電路板1上所設之複數按壓元件15,係可為鍵帽、金屬薄板或其他可供按壓、觸碰之按鍵;又,電路板1之上層基板11表面係可設置有彈性元件3,並於彈性元件3上方為對位於複數按壓元件15底部,以供各按壓元件15按壓後藉由各彈性元件3彈性恢復力頂撐即可自動復位,且複數按壓元件15底部分別所設之連動裝置14,則可頂撐按壓元件15在受外力按壓時不致傾倒、歪斜或卡制,以配合各彈性元件3供各按壓元件15按壓後可以快速復位。Further, the circuit board 1 is provided with a positioning plate 13 above the upper substrate 11, and a central hole 130 and a plurality of abutting portions 131 are respectively disposed on the positioning plate 13, and the abutting portions 131 are respectively pivotally connected to the linking device 14 The shaft portion 141 and the shaft portion 141 on the other side of each of the linking devices 14 are respectively pivotally disposed on the respective abutting portions 151 of the bottom surface of the plurality of pressing members 15. The plurality of pressing members 15 provided on the circuit board 1 can be keys. a cap, a metal plate or other buttons for pressing and touching; in addition, the surface of the upper substrate 11 of the circuit board 1 may be provided with an elastic member 3, and the upper portion of the elastic member 3 is located at the bottom of the plurality of pressing members 15 for After the pressing members 15 are pressed, the elastic members 3 are automatically restored by the elastic restoring force, and the interlocking devices 14 respectively disposed on the bottoms of the plurality of pressing members 15 can prevent the pressing members 15 from being dumped when pressed by an external force. It is skewed or snapped to match the elastic members 3 for each of the pressing members 15 to be quickly reset.

而電路板1上方所設之彈性元件3,為可分別頂持在複數按壓元件15下方,在複數按壓元件15分別受外力向下按壓時,即以各按壓元件15按壓各彈性元件3,使各彈性元件3觸壓導通底部相對應之線路層2之線路佈局,因線路層2係屬薄型,並不會在電路板1的二基板11、12間之組合空間10佔用太多位置,且可有效減少電路板1之尺寸厚度,則在線路層2受到按壓元件15抵壓彈性元件3之觸壓作用時,能使線路佈局得以確實通過隔離絕緣層101,而受到按壓形成觸碰導通,進而產生訊號向外部傳輸,且各按壓元件15上之外力解除後,即透過各彈性元件3彈性頂撐各按壓元件15快速復位,並於定位板13上設有複數遮蔽部132,而各遮蔽部132係分別相對於各按壓元件15相鄰的間隙位置底部,而可透過遮蔽部132確實遮擋位於上層基板11上方,以阻擋各發光部121之光源,避免使光源由相鄰按壓元件15之間所產生間隙向外投射,可防止各發光部121投射入電路板1內之光源外洩,並可集中投射至按壓元件15底部。The elastic members 3 disposed above the circuit board 1 are respectively held under the plurality of pressing members 15, and when the plurality of pressing members 15 are respectively pressed downward by an external force, the pressing members 15 press the elastic members 3, so that the elastic members 3 are pressed by the pressing members 15. Each of the elastic members 3 touches the circuit layout of the corresponding circuit layer 2 of the bottom, because the circuit layer 2 is thin, and does not occupy too much position in the combined space 10 between the two substrates 11 and 12 of the circuit board 1, and The thickness of the circuit board 1 can be effectively reduced, and when the circuit layer 2 is pressed by the pressing member 15 against the elastic member 3, the circuit layout can be surely passed through the insulating layer 101, and pressed to form a contact conduction. Further, the signal is transmitted to the outside, and after the external force is released from each of the pressing members 15, the pressing members 15 are elastically reset by the elastic members 3, and the plurality of shielding portions 132 are disposed on the positioning plate 13, and each shielding is provided. The portions 132 are respectively opposite to the bottom of the gap position adjacent to each of the pressing elements 15 , and the shielding portion 132 is surely blocked above the upper substrate 11 to block the light source of each of the light-emitting portions 121 to avoid O generated between the pressing member 15 is projected outwardly gap, the light source can be prevented within a light-emitting section 121 is projected into the circuit board leakage, and concentrated to the bottom of the pressing member 15 is projected.

請參閱第三、九、十、十一、十二圖所示,係為本發明之側視剖面圖、發光部之發光狀態俯視圖、發光部之局部放大圖、發光部另一種發光狀態俯視圖、發光部又一種發光狀態俯視圖,由圖中可以清楚看出,本發明之電路板1內之複數發光部121,為可採用表面黏著型(SMT)發光二極體(LED)以直立式,朝同方向或分別朝不同方向排列設置,使複數發光部121可以呈單向發光或雙向發光,而使電路板1內部具有充分、均勻的亮光;且複數發光部121亦可採交錯式並朝不同方向排列的方式,使複數發光部121可以朝相反方向投射亮光的方式,將亮光投入電路板1內,使電路板1可以充分的發光顯示。Referring to the third, ninth, tenth, eleventh, and twelfth drawings, the present invention is a side cross-sectional view of the present invention, a light-emitting state top view of the light-emitting portion, a partial enlarged view of the light-emitting portion, and another light-emitting state top view of the light-emitting portion. The light-emitting portion is further a top view of the light-emitting state. As is clear from the figure, the plurality of light-emitting portions 121 in the circuit board 1 of the present invention can be used in a vertical form by using a surface mount type (SMT) light-emitting diode (LED). Arranging in the same direction or separately in different directions, the plurality of light-emitting portions 121 can be unidirectionally illuminated or bi-directionally illuminated, so that the inside of the circuit board 1 has sufficient and uniform brightness; and the plurality of light-emitting portions 121 can also be staggered and different The directional arrangement is such that the plurality of light-emitting portions 121 can project bright light in the opposite direction, and the bright light is put into the circuit board 1, so that the circuit board 1 can be sufficiently illuminated.

上述本發明之可自發光之電路板結構於實際使用時,為具有下列各項優點,如:The above self-illuminating circuit board structure of the present invention has the following advantages in practical use, such as:

(一)電路板1之下層基板12內可直立式設置一個以上之發光部121,而以各發光部121分別側向發光投射入電路板1,使光源得以集中不致往周邊散射,並無需經過折射可避免光源亮度減損,以提升電路板1發光效率、亮光顯示的效果。(1) One or more light-emitting portions 121 may be vertically disposed in the lower substrate 12 of the circuit board 1, and each of the light-emitting portions 121 is laterally projected into the circuit board 1 so that the light source can be concentrated without scattering to the periphery, and does not need to pass through. Refraction can avoid the brightness loss of the light source, so as to improve the luminous efficiency of the circuit board 1 and the effect of bright light display.

(二)在既有的電路板1中以夾層方式設置線路層2,並以直立式設置發光部121,不致增加電路板1的厚度,而供電路板1可以符合電子產品輕、薄、短、小之設計理念,供配合使用。(2) The circuit layer 2 is disposed in an interlayer manner in the existing circuit board 1, and the light-emitting portion 121 is disposed in an upright manner so as not to increase the thickness of the circuit board 1, and the circuit board 1 can conform to the light, thin, and short electronic products. , small design concept, for use.

(三)電路板1內部設置有線路層2,可以有效設置電路板1所需之線路佈局,且電路板1上可減少設置貫穿槽孔,亦不致影響線路層2上的線路佈局限縮或減少,使電路板1仍可符合電子產品線路設計之需求。(3) The circuit board 1 is internally provided with the circuit layer 2, which can effectively set the circuit layout required for the circuit board 1, and the circuit board 1 can reduce the arrangement of the through holes, and does not affect the line layout limitation on the circuit layer 2 or Reduced, so that board 1 can still meet the needs of electronic product line design.

(四)電路板1與內部之線路層2,且僅利用一個以上直立式發光部121的設置,可以快速的加工組裝貼合,不需多次的重複加工作業,能減少製造的工時、人力,並增加電路板1亮光顯現之效果。(4) The circuit board 1 and the internal circuit layer 2, and using only one or more vertical light-emitting portions 121, can be quickly processed and assembled, without repeated processing operations, and can reduce manufacturing man-hours, Manpower, and increase the effect of the light on the board 1 light.

故,本發明為主要針對可自發光之電路板結構,而可於電路板1的二基板11、12間設置線路層2,並以線路層2電性連接位於基板12內之發光部121,該發光部121為至少一個以上採直立式設置於基板12內,而可使發光部121呈側向發光方式,將光源投射入電路板1內為主要保護重點,並可集中光源的投射方向,減少光源向周邊散射造成光減損的情況,惟,以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。Therefore, the present invention is mainly directed to a self-illuminating circuit board structure, and the circuit layer 2 can be disposed between the two substrates 11 and 12 of the circuit board 1, and the circuit layer 2 is electrically connected to the light-emitting portion 121 located in the substrate 12. The light-emitting portion 121 is disposed at least one of the vertical portions in the substrate 12, and the light-emitting portion 121 can be laterally illuminated. The light source is projected into the circuit board 1 as a main protection focus, and the projection direction of the light source can be concentrated. Reducing the light loss caused by the light source to the surrounding scattering, but the above is only the preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention, so that it is simple to use the specification and the content of the present invention. Modifications and equivalent structural changes are all included in the scope of the patent of the present invention and are combined with Chen Ming.

綜上所述,本發明上述之可自發光之電路板結構於實施、操作時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦研發,倘若 鈞局貴審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,至感德便。In summary, the above self-illuminating circuit board structure of the present invention can achieve its efficacy and purpose during implementation and operation, so the invention is an invention with excellent practicability, and is an application for conforming to the invention patent.爰Proposing an application in accordance with the law, I hope that the trial committee will grant this case as soon as possible to protect the hard work of the inventor. If there is any doubt in the audit committee, please do not hesitate to give instructions, the inventor will try his best to cooperate with him.

1...電路板1. . . Circuit board

10...組合空間10. . . Combined space

101...隔離絕緣層101. . . Isolation insulation

11...基板11. . . Substrate

12...基板12. . . Substrate

121...發光部121. . . Light department

122...導光部122. . . Light guide

13...定位板13. . . Positioning plate

130...中心孔130. . . Center hole

131...對接部131. . . Docking

132...遮蔽部132. . . Shading section

14...連動裝置14. . . Linkage device

141...軸部141. . . Shaft

15...按壓元件15. . . Pressing element

151...對接部151. . . Docking

2...線路層2. . . Circuit layer

21...連接部twenty one. . . Connection

3...彈性元件3. . . Elastic component

4...底板4. . . Bottom plate

40...容置空間40. . . Housing space

41...側壁41. . . Side wall

411...定位部411. . . Positioning department

42...反射層42. . . Reflective layer

A...鍵盤部A. . . Keyboard department

A1...底板A1. . . Bottom plate

A2...電路板A2. . . Circuit board

A21...發光元件A21. . . Light-emitting element

A3...塑膠薄膜A3. . . Plastic film

A31...彈性元件A31. . . Elastic component

A4...連結機構A4. . . Linkage mechanism

A5...按鍵A5. . . button

B...背光裝置B. . . Backlight device

B1...導光板B1. . . Light guide

B2...反射板B2. . . Reflective plate

第一圖 係為本發明之立體分解圖。The first figure is a perspective exploded view of the present invention.

第二圖 係為本發明之側視剖面分解圖。The second figure is an exploded view of a side view of the present invention.

第三圖 係為本發明之側視剖面圖。The third figure is a side cross-sectional view of the present invention.

第四圖 係為本發明之立體外觀圖。The fourth figure is a three-dimensional appearance of the present invention.

第五圖 係為本發明較佳實施例之立體分解圖。Figure 5 is a perspective exploded view of a preferred embodiment of the present invention.

第六圖 係為本發明另一實施例之側視剖面圖。Figure 6 is a side cross-sectional view showing another embodiment of the present invention.

第七圖 係為本發明再一實施例之側視剖面圖。Figure 7 is a side cross-sectional view showing still another embodiment of the present invention.

第八圖 係為本發明又一實施例之側視剖面圖。Figure 8 is a side cross-sectional view showing still another embodiment of the present invention.

第九圖 係為本發明發光部之發光狀態俯視圖。Fig. 9 is a plan view showing the light-emitting state of the light-emitting portion of the present invention.

第十圖 係為本發明發光部之局部放大圖。The tenth figure is a partial enlarged view of the light-emitting portion of the present invention.

第十一圖 係為本發明之發光部另一種發光狀態俯視圖。Fig. 11 is a plan view showing another light-emitting state of the light-emitting portion of the present invention.

第十二圖 係為本發明之發光部又一種發光狀態俯視圖。Fig. 12 is a plan view showing still another state of illumination of the light-emitting portion of the present invention.

第十三圖 係為習用發光鍵盤之鍵盤部與背光裝置之立體分解圖。The thirteenth diagram is an exploded perspective view of the keyboard portion and the backlight device of the conventional illuminated keyboard.

1...電路板1. . . Circuit board

10...組合空間10. . . Combined space

101...絕緣隔離層101. . . Insulation barrier

11...基板11. . . Substrate

12...基板12. . . Substrate

121...發光部121. . . Light department

122...導光部122. . . Light guide

13...定位板13. . . Positioning plate

130...中心孔130. . . Center hole

131...對接部131. . . Docking

14...連動裝置14. . . Linkage device

141...軸部141. . . Shaft

15...按壓元件15. . . Pressing element

151...對接部151. . . Docking

2...線路層2. . . Circuit layer

21...連接部twenty one. . . Connection

3...彈性元件3. . . Elastic component

Claims (8)

一種可自發光之電路板結構,尤指可供產生亮光以向外部投射之電路板結構,係至少包括電路板、線路層所組成,其中:該電路板上為設有一個以上可導引光線均勻透射之導光部,且於該電路板內可直立設置有一個以上呈側向投射亮光之發光部;該線路層係固設於該電路板內,為設有可使該電路板呈電性導通之線路佈局;該電路板係設有二層疊式厚薄相異之基板,並於二基板的相鄰面間設有該線路層之線路佈局,而該下層較厚之基板表面係可設有一個以上之導光部、內部則可設有發光部。 A self-illuminating circuit board structure, in particular, a circuit board structure for generating bright light for external projection, comprising at least a circuit board and a circuit layer, wherein: the circuit board is provided with more than one guide light a light-transmitting portion that is evenly transmitted, and one or more light-emitting portions that project laterally bright light are erected in the circuit board; the circuit layer is fixed in the circuit board, and the circuit board is electrically connected The circuit layout of the conductive connection; the circuit board is provided with two stacked thick and different substrates, and the circuit layout of the circuit layer is disposed between adjacent faces of the two substrates, and the thicker substrate surface of the lower layer can be set There may be one or more light guiding portions and a light emitting portion may be provided inside. 如申請專利範圍第1項所述可自發光之電路板結構,其中該發光部為可於電路板的二基板內,設有一個以上電性連接於線路佈局之發光元件,且發光元件係可為表面黏型發光二極體,並採直立式設於下層基板內而可呈側向發光。 The self-illuminating circuit board structure according to the first aspect of the invention, wherein the light emitting part is in the two substrates of the circuit board, and one or more light emitting elements electrically connected to the line layout are provided, and the light emitting element is It is a surface-adhesive light-emitting diode and is placed in an upright substrate to be laterally illuminated. 如申請專利範圍第1項所述可自發光之電路板結構,其中該電路板之二基板係為利用聚碳酸酯(PC)、聚對苯二甲酸乙二醇酯(PET)、聚甲基丙烯酸甲酯(PMMA)或其他具導光之可撓性材質所製成。 The self-illuminating circuit board structure as described in claim 1, wherein the two substrates of the circuit board are made of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl Made of methyl acrylate (PMMA) or other flexible material with light guide. 如申請專利範圍第1項所述可自發光之電路板結構,其中該導光部可為複數凸點、波浪形連續曲面、連續之V形凹 槽、導光油墨或其他導光結構。 The self-illuminating circuit board structure according to claim 1, wherein the light guiding portion can be a plurality of bumps, a wavy continuous curved surface, and a continuous V-shaped concave portion. Slot, light guide ink or other light guiding structure. 一種可自發光之電路板結構,尤指可供產生亮光以向外部投射之電路板結構,其係至少包括電路板、線路層所組成,其中:該電路板上為設有一個以上可導引光線均勻透射之導光部,並相對於各導光部上方分別設有可供按壓後復位之按壓元件,且於該電路板內可直立設有呈側向投射亮光之發光部;該線路層係固設於該電路板內,為設有可供按壓元件按壓後使該電路板呈電性導通之線路佈局;該電路板係設有二層疊式厚薄相異之基板,並於二基板的相鄰面間設有該線路層之線路佈局,而該下層較厚之基板表面係可設有一個以上之導光部、內部則可設有發光部。 A self-illuminating circuit board structure, in particular, a circuit board structure for generating bright light for external projection, which comprises at least a circuit board and a circuit layer, wherein: the circuit board is provided with more than one guide a light guiding portion that is evenly transmitted through the light, and a pressing member that is pressed and reset after being disposed above each of the light guiding portions, and a light emitting portion that laterally projects bright light is erected in the circuit board; the circuit layer The device is fixed in the circuit board, and has a circuit layout for electrically pressing the circuit board after pressing the pressing component; the circuit board is provided with two stacked thick and different substrates, and is disposed on the two substrates. The circuit layout of the circuit layer is disposed between adjacent surfaces, and the lower substrate surface may be provided with more than one light guiding portion, and the inner portion may be provided with a light emitting portion. 如申請專利範圍第5項所述可自發光之電路板結構,其中該發光部為可於電路板的二基板內,設有一個以上電性連接於線路佈局之發光元件,且發光元件係可為表面黏著型發光二極體,並採直立式設於下層基板內而可呈側向發光。 The self-illuminating circuit board structure according to claim 5, wherein the light emitting portion is disposed in the two substrates of the circuit board, and one or more light emitting elements electrically connected to the circuit layout are disposed, and the light emitting element is It is a surface-adhesive light-emitting diode and is placed in an upright substrate to be laterally illuminated. 如申請專利範圍第5項所述可自發光之電路板結構,其中該電路板之二基板係為利用聚碳酸酯(PC)、聚對苯二甲酸乙二醇酯(PET)、聚甲基丙烯酸甲酯(PMMA)或其他具導光之可撓性材質所製成。 The self-illuminating circuit board structure according to claim 5, wherein the two substrates of the circuit board are made of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl Made of methyl acrylate (PMMA) or other flexible material with light guide. 如申請專利範圍第5項所述可自發光之電路板結構,其中該導光部可為複數凸點、波浪形連續曲面、V形凹槽、導光油墨或其他導光結構。 The self-illuminating circuit board structure according to claim 5, wherein the light guiding portion may be a plurality of bumps, a wave-shaped continuous curved surface, a V-shaped groove, a light guiding ink or other light guiding structure.
TW98102756A 2009-01-23 2009-01-23 Self-luminous circuit board structure TWI382793B (en)

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TWI501275B (en) * 2013-06-17 2015-09-21 Primax Electronics Ltd Luminous keyboard device
TWI508121B (en) * 2014-03-27 2015-11-11 Ubrit Co Ltd Elastic component substrate and preparation method thereof

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TWI553682B (en) * 2012-11-21 2016-10-11 致伸科技股份有限公司 Luminous keyboard
TWI489500B (en) * 2012-11-21 2015-06-21 Primax Electronics Ltd Illuminating keyboard
TWI489499B (en) * 2012-11-21 2015-06-21 致伸科技股份有限公司 Luminous keyboard
CN103839715B (en) * 2012-11-23 2016-12-21 致伸科技股份有限公司 Illuminated keyboard

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TWM313281U (en) * 2006-11-16 2007-06-01 Ichia Tech Inc Transparent keyboard structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501275B (en) * 2013-06-17 2015-09-21 Primax Electronics Ltd Luminous keyboard device
TWI508121B (en) * 2014-03-27 2015-11-11 Ubrit Co Ltd Elastic component substrate and preparation method thereof

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