TWI508121B - Elastic component substrate and preparation method thereof - Google Patents

Elastic component substrate and preparation method thereof Download PDF

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Publication number
TWI508121B
TWI508121B TW103126929A TW103126929A TWI508121B TW I508121 B TWI508121 B TW I508121B TW 103126929 A TW103126929 A TW 103126929A TW 103126929 A TW103126929 A TW 103126929A TW I508121 B TWI508121 B TW I508121B
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Taiwan
Prior art keywords
substrate
adhesive layer
elastic member
photo
elastic
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TW103126929A
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Chinese (zh)
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TW201537604A (en
Inventor
Szuwei Sun
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Ubrit Co Ltd
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Priority claimed from TW103111537A external-priority patent/TW201431449A/en
Application filed by Ubrit Co Ltd filed Critical Ubrit Co Ltd
Priority to TW103126929A priority Critical patent/TWI508121B/en
Priority to CN201410548292.2A priority patent/CN104952660A/en
Priority to US14/516,576 priority patent/US20150273798A1/en
Publication of TW201537604A publication Critical patent/TW201537604A/en
Application granted granted Critical
Publication of TWI508121B publication Critical patent/TWI508121B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/536—Hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2215/00—Tactile feedback
    • H01H2215/004—Collapsible dome or bubble
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H01H2229/058—Curing or vulcanising of rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Description

彈性元件基板與其製造方法Elastic element substrate and manufacturing method thereof

本發明是有關於一種彈性元件基板的結構與其製造方法。The present invention relates to a structure of a resilient element substrate and a method of fabricating the same.

鍵盤是經過系統安排操作機器或設備的一種裝置，主要的功能為輸入資料，並可應用於各種電子設備中，如家用電腦、筆記型電腦、個人行動裝置或其他類似電子設備。與傳統機械式鍵盤相比，薄膜式鍵盤由於按壓按鍵時產生的聲音較小、無機械式鍵盤的機械磨損、並且所需價格成本較低，故已為大眾廣泛地使用。A keyboard is a device that is arranged to operate a machine or device. The main function is to input data and can be applied to various electronic devices, such as home computers, notebook computers, personal mobile devices or other similar electronic devices. Compared with the conventional mechanical keyboard, the membrane keyboard has been widely used by the public because of the small sound generated when the button is pressed, the mechanical wear of the mechanical keyboard, and the low cost.

在薄膜式鍵盤的按鍵製造過程中，會於一彈性元件底面塗抹黏合膠並黏合至有一印刷電路的一基板上。在此黏合過程中，基板與彈性元件一同經過高溫烘烤處理，使彈性元件底面之黏合膠受熱固化於基板上，確保彈性元件與基板間的密合度。但由於基板有較佳的塑性，在經過高溫烘烤處理後容易因受熱而發生變形或彎曲，若此變形彎曲情形過大將嚴重影響彈性元件基板之尺寸準度。In the button manufacturing process of the membrane keyboard, an adhesive is applied to the bottom surface of an elastic member and bonded to a substrate having a printed circuit. During the bonding process, the substrate and the elastic component are subjected to high-temperature baking treatment, so that the adhesive on the bottom surface of the elastic component is thermally cured on the substrate to ensure the adhesion between the elastic component and the substrate. However, since the substrate has better plasticity, it is easily deformed or bent by heat after being subjected to high-temperature baking treatment. If the deformation is too large, the dimensionality of the elastic element substrate will be seriously affected.

因此本發明揭露一種彈性元件與基板間的黏合製程。用以解決傳統彈性元件基板製造方法之缺失，能有效減少基板變形彎曲之情形發生。Therefore, the present invention discloses an adhesive process between an elastic member and a substrate. The invention solves the defects of the conventional elastic element substrate manufacturing method, and can effectively reduce the occurrence of deformation and bending of the substrate.

本發明之一態樣在於提供了一種製造彈性元件基板的方法。首先提供一彈性元件，並對此彈性元件進行一熱處理程序。接著塗布一光硬化黏合膠層於彈性元件之一底面上，其中光硬化黏合膠層之肖式A級硬度值低於90，並放置此彈性元件之底面於一基板之一表面上。最後照射光於光硬化黏合膠層使此光硬化黏合膠層硬化，將彈性元件固著於基板之表面上。One aspect of the present invention is to provide a method of manufacturing a substrate of an elastic member. An elastic element is first provided and a heat treatment procedure is performed on the elastic element. Then, a photo-curable adhesive layer is coated on one of the bottom surfaces of the elastic member, wherein the photo-hardened adhesive layer has a Shore A hardness value of less than 90, and the bottom surface of the elastic member is placed on a surface of one of the substrates. Finally, the light is cured by the light-hardened adhesive layer to harden the light-hardened adhesive layer, and the elastic member is fixed on the surface of the substrate.

根據本發明之一實施方式，其中此彈性元件材質為矽膠。According to an embodiment of the invention, the elastic element is made of silicone.

根據本發明之一實施方式，其中此熱處理程序使用一火焰處理機。According to an embodiment of the invention, wherein the heat treatment procedure uses a flame processor.

根據本發明之一實施方式，其中此基板為一高分子薄膜。According to an embodiment of the invention, the substrate is a polymer film.

根據本發明之一實施方式，其中此高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。According to an embodiment of the invention, the polymer film is made of polyethylene terephthalate (PET) or polycarbonate (PC).

根據本發明之一實施方式，其中此基板為一空白基板或為包含一印刷電路之基板。According to an embodiment of the invention, the substrate is a blank substrate or a substrate comprising a printed circuit.

根據本發明之一實施方式，其中光為紫外光。According to an embodiment of the invention, the light is ultraviolet light.

本發明之另一態樣在於提供了一種彈性元件基 板，包含一基板、一光硬化黏合膠層與一彈性元件。其中光硬化黏合膠層之肖式A級硬度值低於90。彈性元件的一底面藉由光硬化黏合膠層黏合至基板之一表面上。其中此底面包含一底部貼面層，內部填滿一光硬化黏合膠並與光硬化黏合膠層接觸。Another aspect of the present invention provides a resilient member base The board comprises a substrate, a light-hardened adhesive layer and an elastic component. The Shore A hardness value of the photohardenable adhesive layer is less than 90. A bottom surface of the elastic member is bonded to one surface of the substrate by a photo-curable adhesive layer. The bottom surface comprises a bottom overlay layer filled with a photo-curable adhesive and in contact with the photo-curable adhesive layer.

根據本發明之一實施方式，其中此基板為一高分子薄膜。According to an embodiment of the invention, the substrate is a polymer film.

根據本發明之一實施方式，其中此高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。According to an embodiment of the invention, the polymer film is made of polyethylene terephthalate (PET) or polycarbonate (PC).

根據本發明之一實施方式，其中此基板為一空白基板或為包含一印刷電路之基板。According to an embodiment of the invention, the substrate is a blank substrate or a substrate comprising a printed circuit.

根據本發明之一實施方式，其中此彈性元件材質為矽膠。According to an embodiment of the invention, the elastic element is made of silicone.

根據本發明之一實施方式，其中此彈性元件包含一內部區，底部貼面層介於此內部區與光硬化黏合膠層之間。According to an embodiment of the invention, the elastic element comprises an inner region between the inner region and the photohardenable adhesive layer.

根據本發明之一實施方式，其中此光硬化黏合膠層為紫外光硬化黏合膠層。According to an embodiment of the invention, the photo-curable adhesive layer is an ultraviolet-curable adhesive layer.

100‧‧‧彈性元件基板100‧‧‧Flexible element substrate

120‧‧‧基板120‧‧‧Substrate

122‧‧‧印刷電路122‧‧‧Printed circuit

122A‧‧‧第一導電部分122A‧‧‧First conductive part

122B‧‧‧第二導電部分122B‧‧‧Second conductive part

140‧‧‧彈性元件140‧‧‧Flexible components

142‧‧‧內部區142‧‧‧Internal area

144‧‧‧底部貼面層144‧‧‧ bottom veneer

146‧‧‧接觸部分146‧‧‧Contact section

160‧‧‧光硬化黏合膠層160‧‧‧Light hardened adhesive layer

410‧‧‧步驟410‧‧‧Steps

420‧‧‧步驟420‧‧ steps

430‧‧‧步驟430‧‧ steps

440‧‧‧步驟440‧‧‧Steps

450‧‧‧步驟450‧‧‧Steps

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之詳細說明如下：The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

第1圖繪示根據本發明一實施方式之一種彈性元件基板之組裝分解透視圖。FIG. 1 is an exploded perspective view showing an assembly of an elastic element substrate according to an embodiment of the present invention.

第2圖繪示根據本發明一實施方式之一種彈性元件基板 之剖面圖。2 is a view showing an elastic element substrate according to an embodiment of the present invention Sectional view.

第3圖繪示根據本發明一實施方式之一種彈性元件基板接合處之剖面放大圖。3 is an enlarged cross-sectional view showing a joint portion of a substrate of an elastic member according to an embodiment of the present invention.

第4圖繪示根據本發明一實施方式之一種彈性元件基板之製造方法流程圖。4 is a flow chart showing a method of manufacturing an elastic element substrate according to an embodiment of the present invention.

以下將以圖式及詳細說明清楚說明本發明之精神，任何所屬技術領域中具有通常知識者在瞭解本發明之較佳實施例後，當可由本發明所教示之技術，加以改變及修飾，其並不脫離本發明之精神與範圍。並為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，熟悉本領域之技術人員應當瞭解到，在本發明部分實施方式中，這些實務上的細節並非必要的，因此不應用以限制本發明。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The spirit and scope of the present invention will be apparent from the following description of the preferred embodiments of the invention. The spirit and scope of the invention are not departed. For the sake of clarity, many of the practical details will be explained in the following description. However, it should be understood by those skilled in the art that the details of the invention are not essential to the details of the invention. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

請參閱第1圖，第1圖繪示本發明一實施例的一種彈性元件基板的組裝分解透視圖。如第1圖所示，彈性元件基板100包含一基板120、一彈性元件140與一光硬化黏合膠層160。更詳細的說，此彈性元件基板100具有基板120，此基板120之一表面上有一印刷電路122。此印刷電路122包含一第一導電部分122A以及一第二導電部分122B。由於第一導電部分122A與第二導電部分122B間為分離且無電性連接，故此時印刷電路122處於關閉狀態。在本發明之一實施例中，此基板120為一高分子薄膜。在本發明之另一實施例中，此高分子薄膜之材質為聚對苯 二甲酸乙二醇酯(polyethylene terephthalate,PET)或聚碳酸酯(polycarbonate,PC)。Please refer to FIG. 1. FIG. 1 is an exploded perspective view showing an assembly of an elastic element substrate according to an embodiment of the present invention. As shown in FIG. 1, the elastic element substrate 100 includes a substrate 120, an elastic member 140, and a photo-curable adhesive layer 160. In more detail, the elastic element substrate 100 has a substrate 120 having a printed circuit 122 on one surface thereof. The printed circuit 122 includes a first conductive portion 122A and a second conductive portion 122B. Since the first conductive portion 122A and the second conductive portion 122B are separated and electrically connected, the printed circuit 122 is in a closed state. In an embodiment of the invention, the substrate 120 is a polymer film. In another embodiment of the present invention, the polymer film is made of polyparaphenylene. Polyethylene terephthalate (PET) or polycarbonate (PC).

請繼續參閱第1圖，彈性元件140之一底面上有一光硬化黏合膠層160，其中光硬化黏合膠層160之肖式A級硬度值低於90。因光硬化黏合膠層160之硬度較傳統光硬化黏合膠柔軟甚多，當黏合彈性元件140以及基板120時，光硬化黏合膠層160能減少應力，並使彈性元件140在黏合後仍能符合規格。此大幅增加了彈性元件基板100之規格穩定性。藉由此光硬化黏合膠層160，彈性元件140能固著黏合於基板120表面印刷電路122之第一導電部分122A及第二導電部分122B上方。其中彈性元件140包含一內部區142與一底部貼面層144，此底部貼面層144內部填滿光硬化黏合膠，並位於內部區142與光硬化黏合膠層160之間。在本發明之一實施例中，此彈性元件140之材質為矽膠。在本發明之其他部分實施例中，基板120為一空白基板，其表面不具有印刷電路122。Referring to FIG. 1 , a light-hardened adhesive layer 160 is disposed on a bottom surface of one of the elastic members 140 , wherein the photo-hardened adhesive layer 160 has a Shore A hardness value of less than 90. Since the hardness of the photohardenable adhesive layer 160 is much softer than that of the conventional photohardenable adhesive, when the elastic member 140 and the substrate 120 are bonded, the photohardenable adhesive layer 160 can reduce stress and allow the elastic member 140 to conform after bonding. specification. This greatly increases the dimensional stability of the elastic element substrate 100. By elastically bonding the adhesive layer 160, the elastic member 140 can be fixedly adhered to the first conductive portion 122A and the second conductive portion 122B of the printed circuit 122 on the surface of the substrate 120. The elastic member 140 includes an inner region 142 and a bottom overlay layer 144. The bottom overlay layer 144 is filled with a photo-curable adhesive and is disposed between the inner region 142 and the photo-curable adhesive layer 160. In an embodiment of the invention, the elastic member 140 is made of silicone. In other portions of the invention, the substrate 120 is a blank substrate having a surface that does not have a printed circuit 122.

接著請參照第2圖，並可與第1圖一同對照以更清楚的了解本發明。第2圖為第1圖之彈性元件基板100之剖面圖。如第2圖所示，彈性元件140藉由底面上之光硬化黏合膠層160固著於基板120表面印刷電路122之第一導電部分122A及第二導電部分122B上方。其中此彈性元件140內部更具有一導電材質之接觸部分146，當受到一向下外力按壓時，彈性元件140將會變形，因彈性元件140位於第一導電部分122A及第二導電部分122B上方，此時彈性元件140中導電材質之接觸部分146會與印刷電路122之第一導電部分122A及第二導電部分122B接 觸，進而觸發印刷電路122。更詳細的說，隨著彈性元件140回應外力移動被垂直壓下，此時接觸部分146朝下移動並同時接觸印刷電路122之第一導電部分122A與第二導電部分122B並形成電性連接，使此印刷電路122接通產生作動。當外力消失時彈性元件140回復原狀，接觸部分146和第一導電部分122A與第二導電部分122B之間無接觸，此時此印刷電路122斷開。Next, please refer to Fig. 2, and the invention can be more clearly understood in conjunction with Fig. 1. Fig. 2 is a cross-sectional view showing the elastic element substrate 100 of Fig. 1. As shown in FIG. 2, the elastic member 140 is fixed on the first conductive portion 122A and the second conductive portion 122B of the printed circuit 122 on the surface of the substrate 120 by the photo-curable adhesive layer 160 on the bottom surface. The inner portion of the elastic member 140 further has a contact portion 146 of a conductive material. When pressed by a downward external force, the elastic member 140 is deformed because the elastic member 140 is located above the first conductive portion 122A and the second conductive portion 122B. The contact portion 146 of the conductive material in the elastic member 140 is connected to the first conductive portion 122A and the second conductive portion 122B of the printed circuit 122. Touching, in turn, triggers the printed circuit 122. In more detail, as the elastic member 140 is vertically pressed in response to the external force, the contact portion 146 is moved downward and simultaneously contacts the first conductive portion 122A of the printed circuit 122 and the second conductive portion 122B to form an electrical connection. Actuating the printed circuit 122 is activated. When the external force disappears, the elastic member 140 returns to its original shape, and the contact portion 146 and the first conductive portion 122A and the second conductive portion 122B are not in contact, and the printed circuit 122 is turned off.

請繼續參照第3圖，第3圖為第2圖中彈性元件140與基板120接合處之剖面放大圖。如第3圖所示，彈性元件140藉由底面之光硬化黏合膠層160黏合於基板120之表面上。部分光硬化黏合膠流入與此光硬化黏合膠層160接觸之彈性元件140之底部貼面層144中，並填滿此底部貼面層144中之空隙。而彈性元件140內部未被光硬化黏合膠填滿處則形成內部區142。Please refer to FIG. 3, which is an enlarged cross-sectional view of the joint between the elastic member 140 and the substrate 120 in FIG. As shown in FIG. 3, the elastic member 140 is adhered to the surface of the substrate 120 by a light-hardened adhesive layer 160 on the bottom surface. A portion of the photohardenable adhesive flows into the bottom overlay layer 144 of the elastic member 140 in contact with the photohardenable adhesive layer 160 and fills the voids in the bottom overlay layer 144. The inner region 142 is formed when the interior of the elastic member 140 is not filled with the photo-curable adhesive.

接著請參照第4圖，並且一併參閱第1-3圖，第4圖為第1圖中彈性元件基板100的製作方法流程圖。首先執行步驟410，提供一彈性元件140。此彈性元件140能經由外力按壓產生變形，當外力消失時彈性元件140將回復原狀。在本發明之一實施例中，此彈性元件140之材質為矽膠。Next, please refer to FIG. 4, and refer to FIG. 1-3 together. FIG. 4 is a flow chart showing a method of manufacturing the elastic element substrate 100 in FIG. First, step 410 is performed to provide a resilient member 140. The elastic member 140 can be deformed by pressing with an external force, and the elastic member 140 will return to the original state when the external force disappears. In an embodiment of the invention, the elastic member 140 is made of silicone.

接著執行步驟420，對彈性元件140之一底面進行一熱處理程序。於此熱處理程序下，彈性元件140底面之油脂被燃燒掉，於此底面暫時形成未含有油脂之一底部貼面層144。其中此熱處理程序之溫度為1000-1200℃，時間為2-3秒。在本發明之一實施例中，此熱處理程序使用一火焰處理機。其中火焰處理機是利用瓦斯與空氣混合燃燒在火焰噴嘴上產生火焰，瞬間產生高溫將彈性元件140底面之油脂快速燃燒掉。Next, in step 420, a heat treatment process is performed on one of the bottom surfaces of the elastic member 140. Under this heat treatment procedure, the grease on the bottom surface of the elastic member 140 is burned off, and a bottom overlay layer 144 which does not contain grease is temporarily formed on the bottom surface. The heat treatment procedure has a temperature of 1000-1200 ° C and a time of 2-3 seconds. In one embodiment of the invention, the heat treatment procedure uses a flame processor. The flame treatment machine uses a mixture of gas and air to generate a flame on the flame nozzle, and instantaneously generates a high temperature to quickly burn off the grease on the bottom surface of the elastic member 140.

繼續執行步驟430，塗布一光硬化黏合膠層160於彈性元件140之底面上，其中光硬化黏合膠層160之肖式A級硬度值低於90。在本發明之一實施例中，此光硬化黏合膠層160為紫外光硬化黏合膠層。由於彈性元件140之底面經熱處理後油脂將被燃燒，於彈性元件140底面暫時形成未含有油脂之底部貼面層144。塗布光硬化黏合膠層160於彈性元件140之底面上時，液態的光硬化黏合膠流入彈性元件140底面暫時未含有油脂之底部貼面層144中，形成內部填滿光硬化黏合膠之底部貼面層144。此底部貼面層144中之光硬化黏合膠與熱處理後之彈性元件140底面形成鍵價結合，光硬化黏合膠與彈性元件140間之黏接強度將達最高。Continuing to step 430, a photo-curable adhesive layer 160 is applied to the bottom surface of the elastic member 140, wherein the photo-hardened adhesive layer 160 has a Shore A hardness value of less than 90. In an embodiment of the invention, the photo-curable adhesive layer 160 is an ultraviolet-curable adhesive layer. Since the bottom surface of the elastic member 140 is subjected to heat treatment, the grease will be burned, and the bottom surface layer 144 containing no grease is temporarily formed on the bottom surface of the elastic member 140. When the photo-curable adhesive layer 160 is coated on the bottom surface of the elastic member 140, the liquid photo-curable adhesive flows into the bottom surface layer 144 of the bottom surface of the elastic member 140 which is temporarily free of grease, and forms a bottom paste which is filled with the light-hardened adhesive. Face layer 144. The photohardenable adhesive in the bottom overlay layer 144 is bonded to the bottom surface of the heat-treated elastic member 140, and the bonding strength between the photo-curable adhesive and the elastic member 140 is maximized.

然後執行步驟440，放置彈性元件140之底面於一基板120之一表面上。基板120之表面上包含一印刷電路122，將此彈性元件140置於基板120上之印刷電路122上方。此印刷電路122包含一第一導電部分122A以及一第二導電部分122B。彈性元件140內部更具有一導電材質之接觸部分146，在彈性元件140回應垂直外力按壓時，此接觸部分146向下移動並同時接觸第一導電部分122A與第二導電部分122B，使印刷電路122形成通路。在本發明之一實施例中，此基板120為一高分子薄膜。在本發明之另一實施例中，此高分子薄膜之材質為聚對苯二甲酸乙二醇酯(polyethylene terephthalate,PET)或聚碳酸酯(polycarbonate,PC)。在本發明之其他部分實施例中，基板120為一空白基板，其表面不具有印刷電路122。Then, step 440 is performed to place the bottom surface of the elastic member 140 on a surface of one of the substrates 120. The surface of the substrate 120 includes a printed circuit 122 that is placed over the printed circuit 122 on the substrate 120. The printed circuit 122 includes a first conductive portion 122A and a second conductive portion 122B. The inner portion of the elastic member 140 further has a contact portion 146 of a conductive material. When the elastic member 140 is pressed against the vertical external force, the contact portion 146 moves downward and simultaneously contacts the first conductive portion 122A and the second conductive portion 122B to cause the printed circuit 122 to be printed. Form a pathway. In an embodiment of the invention, the substrate 120 is a polymer film. In another embodiment of the present invention, the polymer film is made of polyethylene terephthalate (PET) or polycarbonate (PC). In other portions of the invention, the substrate 120 is a blank substrate having a surface that does not have a printed circuit 122.

最後執行步驟450，照射光於光硬化黏合膠層160使光 硬化黏合膠層160硬化，將彈性元件140固著於基板120之表面上。此黏合過程中透過照光使光硬化黏合膠層160硬化並增強彈性元件140與基板120間之黏接強度，不需經過高溫烘烤處理。本發明之特徵在於照光過程中，具有較佳塑性的基板120能避免於高溫處理中產生變形或彎曲，以確保彈性元件基板100之尺寸準度。透過照射光於光硬化黏合膠層160更能縮短彈性元件140固著至基板120所需時間，並達到較高之黏接強度。在本發明之一實施例中，使用的照射光為紫外光，照光時間10-30秒即可黏接完成。此外，因光硬化黏合膠層160之硬度較傳統光硬化黏合膠柔軟甚多，當黏合彈性元件140以及基板120時，光硬化黏合膠層160能減少應力，並使彈性元件140在黏合後仍能符合規格。此大幅增加了彈性元件基板100之規格穩定性。Finally, step 450 is performed to illuminate the light-hardened adhesive layer 160 to make the light The hardened adhesive layer 160 is hardened to fix the elastic member 140 to the surface of the substrate 120. During the bonding process, the photo-hardened adhesive layer 160 is hardened by illumination and the bonding strength between the elastic member 140 and the substrate 120 is enhanced without high-temperature baking treatment. The present invention is characterized in that the substrate 120 having better plasticity during the illumination process can be prevented from being deformed or bent in the high temperature process to ensure the dimensional accuracy of the elastic element substrate 100. By irradiating light to the photo-curable adhesive layer 160, the time required for the elastic member 140 to be fixed to the substrate 120 can be shortened, and a higher bonding strength can be achieved. In an embodiment of the invention, the illumination light used is ultraviolet light, and the bonding time is 10-30 seconds to complete the bonding. In addition, since the hardness of the photohardenable adhesive layer 160 is much softer than that of the conventional photohardenable adhesive, when the elastic member 140 and the substrate 120 are bonded, the photohardenable adhesive layer 160 can reduce the stress and the elastic member 140 remains after bonding. Can meet the specifications. This greatly increases the dimensional stability of the elastic element substrate 100.

由上述本發明實施例可知，本發明具有下列優點。在彈性元件基板100製造過程中，表面經熱處理程序後之彈性元件140能利用光硬化黏合膠之液態性，讓光硬化黏合膠流入彈性元件140底面暫時未含有油脂之底部貼面層144中，形成內部填滿光硬化黏合膠之底部貼面層144。此時光硬化黏合膠與彈性元件140之底面形成鍵價結合，進而增強兩者間黏接強度。且使用光硬化黏合膠層160作為彈性元件140與基板120間之黏合劑，透過照射紫外光即能使此光硬化黏合膠層160固化，不需經過高溫烘烤，能避免高溫下基板120發生收縮變形而影響彈性元件基板100原有之尺寸準度。光硬化黏合膠更具有固化速度快與黏接強度高之特性，且光硬化黏合膠層160之肖式A級硬度值 低於90，大幅增加了彈性元件基板100之規格穩定性，使用於彈性元件基板100之製程上更能增加產線效率。It will be apparent from the above-described embodiments of the present invention that the present invention has the following advantages. During the manufacturing process of the elastic component substrate 100, the elastic component 140 after the surface heat treatment process can utilize the liquidity of the photohardenable adhesive to allow the photohardenable adhesive to flow into the bottom overlay layer 144 of the bottom surface of the elastic component 140 which is temporarily free of grease. A bottom overlay layer 144 is formed which is internally filled with a photohardenable adhesive. At this time, the photo-curing adhesive forms a bond with the bottom surface of the elastic member 140, thereby enhancing the bonding strength between the two. Moreover, the photo-curing adhesive layer 160 is used as an adhesive between the elastic member 140 and the substrate 120, and the photo-hardened adhesive layer 160 can be cured by irradiating ultraviolet light, without high-temperature baking, and the substrate 120 can be prevented from occurring at a high temperature. The shrinkage deformation affects the original dimensional accuracy of the elastic element substrate 100. The light-hardened adhesive has the characteristics of fast curing speed and high bonding strength, and the Shore A hardness value of the light-hardened adhesive layer 160 Below 90, the dimensional stability of the elastic element substrate 100 is greatly increased, and the line efficiency can be further increased in the process of using the elastic element substrate 100.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧彈性元件基板100‧‧‧Flexible element substrate

120‧‧‧基板120‧‧‧Substrate

122‧‧‧印刷電路122‧‧‧Printed circuit

122A‧‧‧第一導電部分122A‧‧‧First conductive part

122B‧‧‧第二導電部分122B‧‧‧Second conductive part

140‧‧‧彈性元件140‧‧‧Flexible components

142‧‧‧內部區142‧‧‧Internal area

144‧‧‧底部貼面層144‧‧‧ bottom veneer

146‧‧‧接觸部分146‧‧‧Contact section

160‧‧‧光硬化黏合膠層160‧‧‧Light hardened adhesive layer

Claims (14)

一種製造彈性元件基板的方法，包含：提供一彈性元件；對該彈性元件進行一熱處理程序，以在該彈性元件之一底面形成一底部貼面層；塗布一光硬化黏合膠層於該彈性元件之該底面上，且部分的光硬化黏合膠流入該底部貼面層中，其中該光硬化黏合膠層之肖式A級硬度值低於90；放置該彈性元件之該底面於一基板之一表面上；以及照射光於該光硬化黏合膠層使該光硬化黏合膠層硬化，將該彈性元件固著於該基板之該表面上。 A method for manufacturing a substrate of an elastic member, comprising: providing an elastic member; performing a heat treatment process on the elastic member to form a bottom overlay layer on a bottom surface of the elastic member; and coating a photo-curable adhesive layer on the elastic member a portion of the light-hardened adhesive is flowed into the bottom overlay layer, wherein the photo-hardened adhesive layer has a Shore A hardness value of less than 90; and the bottom surface of the elastic member is placed on one of the substrates And illuminating the light-hardened adhesive layer to harden the light-hardened adhesive layer, and fixing the elastic member to the surface of the substrate. 如請求項1所述之方法，其中該彈性元件材質為矽膠。 The method of claim 1, wherein the elastic member is made of silicone. 如請求項1所述之方法，其中該熱處理程序使用一火焰處理機。 The method of claim 1 wherein the heat treatment procedure uses a flame processor. 如請求項1所述之方法，其中該基板為一高分子薄膜。 The method of claim 1, wherein the substrate is a polymer film. 如請求項4所述之方法，其中該高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。 The method of claim 4, wherein the polymer film is made of polyethylene terephthalate (PET) or polycarbonate (PC). 如請求項1所述之方法，其中該基板為一空白基板或為包含一印刷電路之基板。 The method of claim 1, wherein the substrate is a blank substrate or a substrate comprising a printed circuit. 如請求項1所述之方法，其中該光為紫外光。 The method of claim 1, wherein the light is ultraviolet light. 一種彈性元件基板，包含：一基板；一光硬化黏合膠層，其中該光硬化黏合膠層之肖式A級硬度值低於90；以及一彈性元件，該彈性元件的一底面藉由該光硬化黏合膠層黏合至該基板之一表面上，其中該底面包含：一底部貼面層，內部填滿一光硬化黏合膠並與該光硬化黏合膠層接觸。 An elastic component substrate comprising: a substrate; a photo-curable adhesive layer, wherein the photo-hardened adhesive layer has a Shore A hardness value of less than 90; and an elastic component, a bottom surface of the elastic component The hardened adhesive layer is adhered to a surface of the substrate, wherein the bottom surface comprises: a bottom overlay layer filled with a photo-curable adhesive and in contact with the photo-curable adhesive layer. 如請求項8所述之彈性元件基板，其中該基板為一高分子薄膜。 The elastic element substrate according to claim 8, wherein the substrate is a polymer film. 如請求項9所述之彈性元件基板，其中該高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。 The elastic element substrate according to claim 9, wherein the polymer film is made of polyethylene terephthalate (PET) or polycarbonate (PC). 如請求項8所述之彈性元件基板，其中該基板為一空白基板或為包含一印刷電路之基板。 The elastic element substrate according to claim 8, wherein the substrate is a blank substrate or a substrate including a printed circuit. 如請求項8所述之彈性元件基板，其中該彈性元 件材質為矽膠。 The elastic element substrate according to claim 8, wherein the elastic element The material is silicone. 如請求項8所述之彈性元件基板，其中該彈性元件包含一內部區，而該底部貼面層介於該內部區與該光硬化黏合膠層之間。 The elastic element substrate of claim 8, wherein the elastic element comprises an inner region, and the bottom overlay layer is interposed between the inner region and the photohardenable adhesive layer. 如請求項8所述之彈性元件基板，其中該光硬化黏合膠層為紫外光硬化黏合膠層。 The elastic element substrate of claim 8, wherein the photo-curable adhesive layer is an ultraviolet-curable adhesive layer.
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